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WO2013029893A3 - Lithographic system, method of controlling a lithographic apparatus and device manufacturing method - Google Patents

Lithographic system, method of controlling a lithographic apparatus and device manufacturing method Download PDF

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Publication number
WO2013029893A3
WO2013029893A3 PCT/EP2012/064755 EP2012064755W WO2013029893A3 WO 2013029893 A3 WO2013029893 A3 WO 2013029893A3 EP 2012064755 W EP2012064755 W EP 2012064755W WO 2013029893 A3 WO2013029893 A3 WO 2013029893A3
Authority
WO
WIPO (PCT)
Prior art keywords
lithographic
lithographic apparatus
controlling
device manufacturing
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/064755
Other languages
French (fr)
Other versions
WO2013029893A2 (en
Inventor
Pieter De Jager
Arno Bleeker
Arie Den Boef
Erik Loopstra
Nitesh PANDEY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Priority to JP2014527555A priority Critical patent/JP5793248B2/en
Priority to KR1020147003958A priority patent/KR101558445B1/en
Publication of WO2013029893A2 publication Critical patent/WO2013029893A2/en
Publication of WO2013029893A3 publication Critical patent/WO2013029893A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70675—Latent image, i.e. measuring the image of the exposed resist prior to development

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A lithographic system has a lithographic apparatus, an inspection system and a controller. The lithographic apparatus includes a projection system configured to project a radiation beam onto a layer of material on or above a substrate. The inspection system is configured to inspect a pattern formed on the substrate. The pattern is formed on the substrate by application of the radiation beam. The controller is configured to control the lithographic apparatus to form a pattern based on data from an inspection by the inspection system of a previously exposed pattern.
PCT/EP2012/064755 2011-08-30 2012-07-27 Lithographic system, method of controlling a lithographic apparatus and device manufacturing method Ceased WO2013029893A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014527555A JP5793248B2 (en) 2011-08-30 2012-07-27 Lithography system
KR1020147003958A KR101558445B1 (en) 2011-08-30 2012-07-27 Lithographic system, method of controlling a lithographic apparatus and device manufacturing method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201161529064P 2011-08-30 2011-08-30
US61/529,064 2011-08-30
US201161546801P 2011-10-13 2011-10-13
US61/546,801 2011-10-13
US201261651449P 2012-05-24 2012-05-24
US61/651,449 2012-05-24

Publications (2)

Publication Number Publication Date
WO2013029893A2 WO2013029893A2 (en) 2013-03-07
WO2013029893A3 true WO2013029893A3 (en) 2013-06-20

Family

ID=46582705

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/064755 Ceased WO2013029893A2 (en) 2011-08-30 2012-07-27 Lithographic system, method of controlling a lithographic apparatus and device manufacturing method

Country Status (5)

Country Link
JP (1) JP5793248B2 (en)
KR (1) KR101558445B1 (en)
NL (1) NL2009239A (en)
TW (1) TWI490665B (en)
WO (1) WO2013029893A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465565B2 (en) 2014-05-19 2019-02-06 キヤノン株式会社 Exposure apparatus, alignment method, and device manufacturing method
US9484188B2 (en) * 2015-03-11 2016-11-01 Mapper Lithography Ip B.V. Individual beam pattern placement verification in multiple beam lithography
CN108369390B (en) * 2015-12-15 2021-05-18 Asml荷兰有限公司 Lithographic apparatus and device manufacturing method
US12124174B2 (en) 2019-03-20 2024-10-22 Asml Netherlands B.V. Metrology method and apparatus, computer program and lithographic system
EP3731020A1 (en) * 2019-04-25 2020-10-28 ASML Netherlands B.V. Metrology method and apparatus, computer program and lithographic system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
US20080052925A1 (en) * 2006-09-01 2008-03-06 Fujifilm Corporation Drawings device and drawing method
US20110188016A1 (en) * 2008-09-22 2011-08-04 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000021741A (en) * 1998-06-30 2000-01-21 Canon Inc Exposure apparatus, device manufacturing method, and foreign matter inspection apparatus
EP1482373A1 (en) 2003-05-30 2004-12-01 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4861893B2 (en) * 2006-07-28 2012-01-25 東京エレクトロン株式会社 Substrate processing method, program, computer storage medium, and substrate processing system
JP5534552B2 (en) 2009-05-20 2014-07-02 株式会社ニコン Pattern forming apparatus, pattern forming method, device manufacturing apparatus, and device manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5124927A (en) * 1990-03-02 1992-06-23 International Business Machines Corp. Latent-image control of lithography tools
US20080052925A1 (en) * 2006-09-01 2008-03-06 Fujifilm Corporation Drawings device and drawing method
US20110188016A1 (en) * 2008-09-22 2011-08-04 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
AUYEUNG R C Y ET AL: "Laser forward transfer based on a spatial light modulator", APPLIED PHYSICS A; MATERIALS SCIENCE & PROCESSING, SPRINGER, BERLIN, DE, vol. 102, no. 1, 3 October 2010 (2010-10-03), pages 21 - 26, XP019872341, ISSN: 1432-0630, DOI: 10.1007/S00339-010-6054-9 *

Also Published As

Publication number Publication date
WO2013029893A2 (en) 2013-03-07
KR20140041847A (en) 2014-04-04
JP5793248B2 (en) 2015-10-14
JP2014527724A (en) 2014-10-16
KR101558445B1 (en) 2015-10-07
TW201316131A (en) 2013-04-16
TWI490665B (en) 2015-07-01
NL2009239A (en) 2013-03-04

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