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WO2013015481A1 - Support de tranches - Google Patents

Support de tranches Download PDF

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Publication number
WO2013015481A1
WO2013015481A1 PCT/KR2011/006282 KR2011006282W WO2013015481A1 WO 2013015481 A1 WO2013015481 A1 WO 2013015481A1 KR 2011006282 W KR2011006282 W KR 2011006282W WO 2013015481 A1 WO2013015481 A1 WO 2013015481A1
Authority
WO
WIPO (PCT)
Prior art keywords
gas
gas discharge
wafer carrier
wafers
distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/006282
Other languages
English (en)
Korean (ko)
Inventor
박종익
박정우
김문기
장재영
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3S Korea Co Ltd
Original Assignee
3S Korea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3S Korea Co Ltd filed Critical 3S Korea Co Ltd
Publication of WO2013015481A1 publication Critical patent/WO2013015481A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H10P72/1926—
    • H10P72/10—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus

Definitions

  • the present invention relates to a wafer carrier, and more particularly, an object to be supplied between wafers accommodated in a process of replacing internal air by injecting a replacement target gas (hereinafter referred to as a target gas) into a body in which a wafer is stored.
  • a target gas a replacement target gas
  • the present invention relates to a wafer carrier capable of inducing a gas flow to increase an air displacement rate in a body.
  • a wafer carrier refers to a container for transferring and conveying wafers, in which silicon wafers used in a semiconductor device manufacturing process are transported and conveyed through each semiconductor manufacturing process.
  • Wafer carriers are Front Opening Shipping Boxes (FOSBs) used for transport and storage, and Front Open Integrated Pods used for processing as well as transport and storage. Front Open Unified Pods (hereinafter referred to as FOUPs) are commonly used.
  • FOSBs Front Opening Shipping Boxes
  • FOUPs Front Open Unified Pods
  • the FOUP includes a body having an inner accommodating space for accommodating the wafers, and a cover for opening and closing the front opening of the body.
  • retainers are provided in the FOUP to guide the plurality of wafers while keeping a predetermined interval therein and to fix the storage state.
  • the configuration for the air replacement process includes a gas inlet for injecting a target gas into one side of the bottom surface of the body in which the wafers are accommodated, and a gas for discharging air and the target gas used to fill the inside of the body. It consists of outlet only.
  • An object of the present invention for solving the above problems is to distribute and induce the flow of the target gas supplied between the wafers accommodated in the process of replacing the air in the body by injecting the target gas into the body containing the wafer It is to provide a wafer carrier to increase the air replacement rate in the body.
  • Wafer carrier of the present invention for achieving the above object is the front portion is open and the receiving space is formed so that the wafer is accommodated therein, the body is formed through the gas inlet and gas outlet through the front side of the bottom; And a front opening of the body is closed and closed, and a gas distribution flow path is formed along a height direction at one side of an inner surface corresponding to the gas injection hole, and a lower end of the gas distribution flow path adjacent to the gas injection hole is opened.
  • a plurality of gas discharge holes are formed to cover the gas distribution channel so as to form an inlet of the distribution channel, and to distribute the replacement target gas supplied through the gas distribution channel between the respective wafers stored in the body. And a cover provided with a flow path cover plate.
  • the gas discharge hole is preferably formed between the respective wafers accommodated in the body or formed to correspond to the side surfaces of the wafers accommodated in the body.
  • the gas supply connecting pipe for connecting the gas inlet and the distribution flow path inlet of the gas distribution flow path of the cover may further comprise a.
  • the gas supply pipe is preferably formed lower than the storage height of the wafer accommodated at the lowermost end in the body.
  • the gas distribution passage may be formed to have a smaller or larger cross-sectional area from the lower end adjacent to the gas injection hole toward the upper end.
  • the gas discharge hole of the distribution channel cover plate is formed through the same inner diameter and the outer diameter, or the inner diameter is gradually reduced in the thickness direction larger than the outer diameter and formed through the nozzle form, or the inner diameter is the outer It may be gradually enlarged in the thickness direction smaller than the diameter and penetrated in the form of a diffuser.
  • the cover may further include a gas discharge passage so as to be grooved along the height direction on the inner side tile side corresponding to the gas outlet, and discharge the outlet passage so that the lower end of the gas discharge passage adjacent to the gas outlet is opened.
  • a discharge flow path cover plate covering the gas discharge flow path and a plurality of gas discharge holes are formed to discharge the air replaced with each of the wafers stored in the body and the replacement target gases through the gas discharge flow path. It may further include:
  • the apparatus may further include a gas discharge connection pipe installed to communicate with the gas discharge port of the body to connect the gas discharge port and the discharge flow path outlet of the gas discharge flow path.
  • the gas exhaust connection pipe is preferably formed lower than the height of the wafer accommodated at the lowermost end in the body.
  • Another wafer carrier of the present invention is the front portion is opened and the receiving space is formed to accommodate the wafers therein, the body is formed through the gas inlet and the gas outlet through the front side of the bottom; A cover for closing and closing the front opening of the body; And a plurality of gases extending in a height direction along one side of the cover to correspond to the gas injection hole inside the body and distributing and supplying the replacement target gas supplied through the gas injection hole between the wafers. It may include a; gas distribution pipe is formed discharge outlets.
  • the gas discharge hole may be located between the respective wafers accommodated in the body or may be formed to correspond to the side surfaces of the wafers accommodated in the body.
  • cover inner surface is formed in the distribution pipe receiving groove so that the gas supply pipe is accommodated and installed, is installed in communication with the gas inlet of the body, the gas supply connecting pipe connecting the gas inlet and the lower end of the gas supply pipe It can be configured to include more.
  • the gas distribution pipe may be formed to have a smaller or larger cross-sectional area gradually from the lower end adjacent to the gas inlet toward the upper end.
  • the gas discharge hole of the gas distribution pipe is formed through the inner diameter and the outer diameter is constant, or the inner diameter is gradually reduced in the thickness direction larger than the outer diameter and formed through the nozzle form or the inner diameter is larger than the outer diameter It may be formed to penetrate gradually in the thickness direction to be smaller.
  • the gas discharge tube may be installed to extend in a height direction along one side of the cover to correspond to the gas discharge hole inside the body, and a plurality of gas suction holes may be formed to correspond between the accommodated wafers. have.
  • the cover inner surface is formed with a discharge pipe receiving groove so that the gas discharge pipe is accommodated and installed, is installed in communication with the gas discharge port of the body, the gas discharge connection pipe for connecting the gas discharge port and the gas supply pipe in communication; It may further include.
  • the gas supply connection pipe and the gas discharge connection pipe is preferably formed lower than the height of the wafer accommodated at the lowermost end in the body.
  • a gas discharge hole is formed on the cover of the wafer carrier and a gas discharge hole is formed correspondingly between the wafers housed on the distribution channel cover plate covering the gas distribution channel. Injecting the target gas into the interior of the body is housed in the process of replacing the internal air has the effect of inducing the flow of the target gas supplied between the accommodated wafer to increase the air replacement rate in the body.
  • the target gas supplied through the gas inlet can be more effectively distributed and supplied through the gas distribution flow path of the cover Has an effect.
  • the gas distribution flow path formed in the cover is formed to have a smaller or larger cross-sectional area from the lower end adjacent to the gas inlet to the upper end, so that the same through the respective gas discharge holes formed in the distribution flow path cover plate. It has the effect of allowing gas to be supplied.
  • the gas discharge hole is applied by deforming such that the inner diameter and the outer diameter are equal to each other, the inner diameter is larger than the outer diameter, or the inner diameter is smaller than the outer diameter in the thickness direction of the distribution channel cover plate.
  • the target gas supplied between the wafers through the discharge hole may be constantly supplied, the flow rate may be supplied faster, or the flow rate may be supplied in a more diffused form.
  • a gas discharge flow path may be formed in the cover to have a groove along the height direction on the inner side of the tile side corresponding to the gas discharge port, and cover the gas discharge flow path to form a discharge flow path outlet so that the lower end of the gas discharge flow path adjacent to the gas discharge port is opened.
  • a discharge flow path cover plate having a plurality of gas discharge holes formed to discharge gases supplied between the respective wafers stored in the body through the gas discharge flow paths, and the discharge flow path outlets of the gas discharge holes and the gas discharge flow paths. It is configured to further include a gas discharge connecting pipe connecting to have an effect to more effectively discharge the air and the target gas inside the body through the gas outlet.
  • the gas supply connection pipe and the gas discharge connection pipe are formed lower than the storage height of the wafer accommodated at the lowermost end in the inside, and has an effect of avoiding interference with the wafer during wafer in and out.
  • the body is installed to extend in the height direction along one side of the cover to correspond to the gas injection hole inside the body, and the gas supplied through the gas injection hole is supplied to be supplied between the received wafers.
  • a gas distribution pipe accommodating groove for accommodating the gas distribution pipe is formed on the inner surface of the cover, and the gas injection port is connected to the gas distribution pipe lower distribution inlet by using a gas supply connection pipe, and is supplied through the gas injection hole.
  • the target gas has an effect of more effectively distributing through the gas distribution flow path of the lid so that it can be well supplied between the wafers received.
  • the gas distribution flow path formed in the gas distribution pipe is formed to have a smaller or larger cross-sectional area from the lower end adjacent to the gas inlet to the upper end, so that the same target gas is formed through each gas discharge hole formed in the gas distribution pipe. Has the effect of being able to be supplied.
  • the gas discharge hole is formed by forming the gas discharge hole so that the inner diameter and the outer diameter are equal to each other, the inner diameter is larger than the outer diameter, or the inner diameter is smaller than the outer diameter in the thickness direction of the gas distribution pipe.
  • the inner side of the body is installed in the height direction along the side of the cover to correspond to the gas discharge hole, the gas discharge pipe and the gas discharge port and the plurality of gas suction holes are formed correspondingly between the accommodated wafers It is configured to further include a gas discharge connection pipe for connecting the gas supply pipe in communication with the gas outlet has the effect of making the discharge of the air and the target gas inside the body more effectively.
  • FIG. 1 is a perspective view showing a wafer carrier according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the wafer carrier of FIG. 1.
  • FIG. 3 is an exploded perspective view of the distribution channel cover plate of the cover illustrated in FIG. 2.
  • FIG. 4 is a cross-sectional side view of the wafer carrier taken along the line IV-IV of FIG. 1.
  • FIG. 5 is an enlarged side cross-sectional view of the gas supply connector connection of part V of FIG. 4.
  • FIG. 6 is an enlarged side cross-sectional view of the gas discharge hole of part VI of FIG. 4.
  • FIG. 7 is a plan sectional view of the distribution channel cover plate taken along the line VII-VII of FIG. 3.
  • FIG 8 and 9 are plan views showing modifications to the gas outlet holes of the distribution pipe of the distribution channel cover plate.
  • FIG. 10 is a side cross-sectional view of a wafer carrier according to a second embodiment of the present invention.
  • FIG. 11 is an enlarged side cross-sectional view of the gas discharge hole of the XI part of FIG. 10.
  • FIG. 12 is a rear view showing a lid of the wafer carrier according to the third embodiment of the present invention.
  • FIG. 13 is a side cross-sectional view taken along line XIII-XIII of the wafer carrier to which the lid of FIG. 12 is applied.
  • FIG. 14 is an exploded perspective view of the wafer carrier according to the fourth embodiment of the present invention.
  • FIG. 15 is an exploded perspective view of a gas distribution pipe of the lid shown in FIG. 14.
  • FIG. 16 is a perspective view of the gas distribution pipe of FIG. 15 separated.
  • 17 is a plan sectional view of the gas distribution pipe taken along the line VII-VII of FIG. 16.
  • 18 and 19 are plan cross-sectional views illustrating modified examples of gas supply holes of the gas supply pipe of FIG. 17.
  • FIG. 20 is a side cross-sectional view of the wafer carrier of FIG. 14.
  • 21 is a side sectional view of a wafer carrier according to a fifth embodiment of the present invention.
  • FIG. 1 is a perspective view illustrating a wafer carrier according to a first embodiment of the present invention
  • FIG. 2 is an exploded perspective view of the wafer carrier of FIG. 1
  • FIG. 3 is an exploded perspective view of a distribution channel cover plate of the cover illustrated in FIG. 2. .
  • the wafer carrier 1 in this embodiment illustrates that it is a FOUP, and the FOUP is a body 10 and a front opening of the body 10.
  • the cover 20 is closed and closed.
  • the body 10 has an open front surface and is formed with an inner accommodating space for accommodating wafers (not shown), and the inner wall has a plurality of wafers stored therein so as to be layered with each other in a height direction at a predetermined interval.
  • Retainers 13 are provided to hold and fix the guide box and to keep the housed state.
  • a gas inlet 11 for supplying the target gas and a gas outlet 12 for discharging the replaced air and the target gas pass through the bottom surface of the body 10 to replace the air filled therein with the target gas. Is formed.
  • the cover 20 is formed to close and close the front opening of the body 10 so that wafers mounted in the body 10 can be safely transported and stored.
  • the cover 20 of the present embodiment is grooved along the height direction on one side of the inner surface corresponding to the gas injection hole 11, the gas distribution passage 21 is formed.
  • the gas distribution flow passage 22 covers the gas distribution flow passage 22 so that the lower end of the gas distribution flow passage 21 adjacent to the gas injection port 11 forms the distribution flow passage inlet 21. It is configured to include a distribution channel cover plate 25 is formed with a plurality of gas discharge holes 26 so as to distribute the supplied gas between the respective wafers accommodated in the body (10).
  • the distribution channel cover plate 25 is fixed to the projection receiving groove 23 is formed to be recessed on both side wall surfaces of the gas distribution channel 22, the fixing projections 24 protruding on both sides are formed to be fixed. .
  • FIG. 4 is a side cross-sectional view of the wafer carrier taken along the line IV-IV of FIG. 1, and FIG. 5 is an enlarged side cross-sectional view of the gas supply connector connection portion V of FIG. 4, and FIG. 6 is a cross-sectional view of FIG. This is a side sectional view showing an enlarged part of the gas discharge hole of the part VI.
  • the wafer carrier 1 of the present embodiment forms a gas distribution flow passage 22 in the cover 20 and also covers a distribution flow passage cover plate 25 covering the gas distribution flow passage 22.
  • the gas discharge holes 26 are formed in correspondence between the wafers stored in the body 1, and supplied between the wafers 50 stored in the process of replacing the air filled in the body 10. By inducing the flow of the target gas is to increase the air substitution rate inside the body.
  • the body 10 is further provided with a gas supply connecting pipe 15 for connecting the gas inlet 11 and the distribution flow path inlet formed at the lower end of the gas distribution flow path 21 of the cover 20.
  • the target gas supplied through the gas inlet 11 is covered by connecting the gas inlet 11 and the inlet of the distribution channel of the gas distribution channel 21 of the cover 20 by using the gas supply connection pipe 15.
  • the gas distribution passage 21 and the gas discharge hole 26 of the distribution passage cover plate 25 can be more effectively distributed and supplied.
  • the gas supply pipe 15 is installed detachably from the gas inlet 11 of the body 10, it can be separated in the washing process of the FOUP using the cleaning mechanism to avoid interference with the cleaning mechanisms.
  • the gas distribution passage 22 formed in the cover 20 has a smaller cross-sectional area from the lower end adjacent to the gas inlet 11 of the body 10 toward the upper end. More preferably.
  • the cross-sectional area of the gas distribution flow passage 21 is reduced from the lower end portion to the upper end portion so that each gas discharge hole 26 formed in the distribution flow passage cover plate 25 has a predetermined gas flow rate and gas pressure. Allow the target gas to be supplied.
  • the present invention is not limited thereto, and the gas substitution rate may be increased by changing the supply flow rate and supply pressure of the target gas supplied through the gas discharge holes 26 formed in the distribution channel cover plate 25. For this reason, it is natural that the gas distribution flow passage 22 may be deformed and gradually applied to the upper end from the lower end to the upper end.
  • FIG. 7 is a plan sectional view of the distribution channel cover plate cut along the line VII-VII of FIG. 3, and FIGS. 8 and 9 are plan cross sectional views showing modifications to the gas outlet holes of the distribution tube of the distribution channel cover plate. .
  • the gas discharge hole 26 formed in the distribution channel cover plate 25 is formed to have the same inner diameter l and outer diameter L therethrough. It illustrates that the target gas can be supplied constantly between the two.
  • the present invention is not necessarily limited thereto, and as in the modifications shown in FIGS. 7 and 8, the inner diameter l of the distribution channel cover plate 25 is the outer diameter of the gas outlet holes 27 and 28.
  • the gas discharge hole (27, 28) through the gas discharge hole (27, 28) by forming a through-shaped nozzle shape to be larger than (L) or through a diffuser shape so that the inner diameter (l) is smaller than the outer diameter (L)
  • the flow rate may be supplied faster between the wafers contained in the wafer, or the flow rate may be reduced and spread more widely.
  • the gas discharge holes 26, 27, 29 illustrate that the through-circle is formed in a circular shape, the inner diameter (l) and the outer diameter (L) described above when the gas discharge hole 26 is not made in a circular shape May be described as the maximum width of the inner and outer sides of the gas discharge hole, respectively.
  • FIG. 10 is a side cross-sectional view of the wafer carrier according to the second exemplary embodiment of the present invention
  • FIG. 11 is an enlarged side cross-sectional view of the gas discharge hole of the region XI of FIG. 10.
  • a plurality of wafer carriers 100 of the present embodiment are formed on the distribution channel cover plate 125 of the lid 120 in comparison with the wafer carriers of the first embodiment described above.
  • the gas discharge hole 126 has a difference in configuration formed to correspond to the side of each of the wafers 50 accommodated in the body 10, respectively.
  • the FOUPs for storing the 25 wafers 50 are based on a FOUP.
  • An example of forming about 13 gas discharge holes is illustrated.
  • the target gas discharged through the gas discharge holes 126 may face the side surfaces of the wafers 50, and the upper and lower sides thereof. It is possible to increase the air displacement rate inside the body by being distributed and supplied to the interspace.
  • FIG. 12 is a rear view of the lid of the wafer carrier according to the third embodiment of the present invention
  • FIG. 13 is a side cross-sectional view taken along the line III-III of the wafer carrier to which the lid of FIG. 12 is applied.
  • the wafer carrier 200 of the present embodiment has a lid 220 at the gas outlet 12 of the body 10, as compared with the wafer carrier of the first embodiment described above.
  • the gas discharge flow path 32 is further formed to be grooved along the height direction on the corresponding inner side tile side.
  • the cover 220 covers the gas discharge passage 32 to form a discharge passage outlet 31 such that a lower end of the gas discharge passage 32 adjacent to the gas outlet 12 is opened, and the body ( 10) a discharge in which a plurality of gas suction holes 36 are formed so that air replaced by target gases supplied between respective wafers 50 accommodated therein is discharged through the gas discharge flow path 32.
  • the flow path cover plate 35 is further provided.
  • the gas outlet 12 of the body 10 is installed in communication with, the gas outlet 12 and the gas outlet connecting pipe 16 for connecting the outlet of the discharge passage of the gas discharge passage 32 is further provided. do.
  • the wafer carrier of the present embodiment is a part of air remaining inside the body 10 through the gas suction hole 36 and the gas discharge passage 32 and the gas discharge connector 16 of the discharge passage cover plate 35.
  • the gas discharge connection pipe 16 is formed to be lower than the storage height of the wafer accommodated at the lowermost end inside the body 10, like the gas supply connection pipe 15, thereby preventing interference during wafer in and out Do it.
  • FIG. 14 is an exploded perspective view of the wafer carrier according to the fourth embodiment of the present invention
  • FIG. 15 is an exploded perspective view of the gas distribution pipe of the lid shown in FIG.
  • the wafer carrier 300 of the present embodiment has a lid (corresponding to the gas injection hole 11 inside the body 10 as compared with the first embodiment described above). 120 is installed to extend in a height direction along one side, and a plurality of gas discharge holes 335 are formed to be supplied between the wafers 50 in which the gas supplied through the gas injection hole 11 is accommodated. There is a difference in configuration to include the gas distribution pipe 330.
  • the target gas introduced into the body 10 through the gas injection hole 11 may be supplied between the wafers 50 accommodated through the gas discharge holes 335 of the gas distribution pipe 330 separately installed. To be able.
  • the gas supply pipe 330 is accommodated and installed in the inner surface of the cover 320 so that the gas distribution pipe 330 is installed. Is formed.
  • the gas supply connecting pipe is installed in communication with the gas inlet 11 of the body 10, and connects the gas inlet 11 and the distribution flow path inlet 331 formed at the lower end of the gas supply pipe 330 ( 315 is formed.
  • the gas discharge hole 335 formed in the gas distribution pipe 330, as shown in Figures 5 and 11, between the respective wafers 50 accommodated in the body 10 It may be formed to be positioned or to correspond to the side surfaces of the wafers 50 accommodated in the body 10.
  • FIG. 16 is a perspective view of the gas distribution pipe of FIG. 15 separated from each other
  • FIG. 17 is a cross-sectional view of the gas distribution pipe taken along the line VII-VII of FIG. 16.
  • 18 and 19 are plan cross-sectional views illustrating modified examples of gas supply holes of the gas supply pipe of FIG. 17.
  • the gas distribution pipe 330 of the present embodiment has a lower end adjacent to the gas inlet 11 similarly to the gas distribution channel 22 of the first embodiment described above. It can be formed such that the cross-sectional area becomes smaller or larger toward the upper end from. Therefore, the target gas may be supplied at a predetermined gas flow rate and gas pressure through the respective gas discharge holes 335 formed in the gas distribution pipe 330.
  • the gas discharge holes 335, 336, and 337 of the gas distribution pipe 330 have an inner diameter 1 as in the gas discharge hole 26 of the distribution channel cover plate 25 of the first embodiment.
  • the outer diameter (L) is formed through the constant, or the inner diameter (l) is reduced in the thickness direction larger than the outer diameter (L) and formed through the nozzle form, or the inner diameter (l) is the outer diameter (L) It may extend in the thickness direction smaller than) and be penetrated in the form of a diffuser.
  • the target gas supplied between the wafers 50 accommodated in the body 10 through the gas discharge holes 335, 336, and 337 is constantly supplied, the flow rate is faster, or the flow rate is increased. It can be reduced, spread more and be supplied.
  • FIG. 20 is a side cross-sectional view of the wafer carrier of FIG. 14.
  • the wafer carrier 300 is installed to extend in the height direction along one side of the cover to correspond to the gas injection hole 11 inside the body 10, and the gas injection hole 11 is formed.
  • the target gas is supplied into the body in which the wafers 50 are accommodated through the gas distribution pipe 330 in which a plurality of gas discharge holes 335 are formed to be supplied between the wafers 50 containing the target gases supplied therethrough. Injecting the target gas supplied between the wafers 50 accommodated in the process of replacing the internal air by injection may increase the air substitution rate inside the body.
  • 21 is a side sectional view of a wafer carrier according to a fifth embodiment of the present invention.
  • the wafer carrier 400 of the present embodiment has a lid (corresponding to the gas discharge hole 12 inside the body 10 as compared with the wafer carrier of the fourth embodiment described above).
  • 420 may further include a gas discharge pipe 430 extending in a height direction along one side and having a plurality of gas suction holes 435 formed to correspond between the accommodated wafers. (See Figures 12 and 13)
  • a discharge pipe accommodating groove 421 is formed on the inner surface of the cover 420 so as to accommodate and install the gas discharge pipe 430.
  • the cover 420 is installed to communicate with the gas discharge port 12 of the body 10.
  • a gas discharge connection pipe 416 connecting the gas discharge pipe 430 to communicate with each other.
  • air and a target gas remaining between the received wafers 50 are introduced into the gas discharge pipe 430 through the gas suction hole 435, and then the gas is discharged.
  • the gas outlet 12 through the connecting pipe 416 By discharging through the gas outlet 12 through the connecting pipe 416, the air and the target gas in the body 10 is discharged more effectively to replace the air in the body 10 in which the wafers 50 are accommodated. Make this more effective.
  • wafer carrier 10 body
  • gas distribution pipe 421 discharge pipe receiving groove

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention porte sur un support de tranches. Un passage de distribution de gaz est formé dans un couvercle du support de tranches, et des trous de décharge de gaz sont formés dans une plaque de couvercle de passage de distribution couvrant le passage de distribution de gaz de façon à être positionnés parmi des espaces entre des tranches reçues dans un corps. Un gaz cible est injecté dans le corps dans lequel sont reçues les tranches, et l'écoulement du gaz cible fourni entre les espaces entre les tranches reçues est induit pendant l'échange d'air interne, de façon à accroître ainsi le débit d'échange d'air interne à l'intérieur du corps.
PCT/KR2011/006282 2011-07-22 2011-08-25 Support de tranches Ceased WO2013015481A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110073009A KR101368706B1 (ko) 2011-07-22 2011-07-22 웨이퍼 캐리어
KR10-2011-0073009 2011-07-22

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Publication Number Publication Date
WO2013015481A1 true WO2013015481A1 (fr) 2013-01-31

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PCT/KR2011/006282 Ceased WO2013015481A1 (fr) 2011-07-22 2011-08-25 Support de tranches

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WO (1) WO2013015481A1 (fr)

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EP3018530A4 (fr) * 2013-07-03 2017-01-25 Murata Machinery, Ltd. Récipient de stockage
US20170213752A1 (en) * 2014-07-25 2017-07-27 Shin-Etsu Polymer Co., Ltd. Substrate storage container

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KR102249316B1 (ko) 2014-08-18 2021-05-07 삼성전자주식회사 웨이퍼 캐리어
WO2019194326A1 (fr) 2018-04-02 2019-10-10 우범제 Récipient de stockage de plaquettes
US20230207077A1 (en) * 2020-05-28 2023-06-29 Nec Corporation Cooperation server, system, immune certificate generation method, and non-transitory computer-readable medium
CN114628292B (zh) * 2022-05-16 2022-07-29 上海果纳半导体技术有限公司武汉分公司 晶圆传输盒

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US6202318B1 (en) * 1996-12-13 2001-03-20 Texas Instruments Incorporated System for processing wafers and cleaning wafer-handling implements
KR20030007014A (ko) * 2001-07-13 2003-01-23 가부시끼가이샤 한도따이 센단 테크놀로지스 기판 수납 용기, 기판 반송 시스템, 보관 장치 및 가스치환 방법
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US6202318B1 (en) * 1996-12-13 2001-03-20 Texas Instruments Incorporated System for processing wafers and cleaning wafer-handling implements
JPH11251422A (ja) * 1998-03-03 1999-09-17 Shinko Electric Co Ltd ウェーハ収納容器
KR20030007014A (ko) * 2001-07-13 2003-01-23 가부시끼가이샤 한도따이 센단 테크놀로지스 기판 수납 용기, 기판 반송 시스템, 보관 장치 및 가스치환 방법
JP2006114761A (ja) * 2004-10-15 2006-04-27 Renesas Technology Corp ウェーハ収納容器

Cited By (4)

* Cited by examiner, † Cited by third party
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EP3018530A4 (fr) * 2013-07-03 2017-01-25 Murata Machinery, Ltd. Récipient de stockage
US9841671B2 (en) 2013-07-03 2017-12-12 Murata Machinery, Ltd. Storage container
US20170213752A1 (en) * 2014-07-25 2017-07-27 Shin-Etsu Polymer Co., Ltd. Substrate storage container
US10312122B2 (en) * 2014-07-25 2019-06-04 Shin-Etsu Polymer Co., Ltd. Substrate storage container

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KR20130011684A (ko) 2013-01-30

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