WO2013004292A1

WO2013004292A1 - Security casing

Info

Publication number: WO2013004292A1
Application number: PCT/EP2011/061232
Authority: WO
Inventors: Nouhad Bachnak; Dirk DUHM; Waldemar HONSTEIN; Nebahate HORUNI; Reto LEIST
Original assignee: Cicor Management AG
Current assignee: Cicor Management AG
Priority date: 2011-07-04
Filing date: 2011-07-04
Publication date: 2013-01-10
Anticipated expiration: 2014-01-04
Also published as: TW201319859A

Abstract

A security casing (10) for use as a shield over an electronic circuitry (50), the security casing (10) having an outer surface (11) and an inner surface (13) defining an inner cavity (12) facing said electronic circuitry (50), the security casing (10) being provided with a conductive path (15) having predefined electrical characteristics measurable between a first connection point (16) and a second connection point (17). The security casing (10) is a three- dimensional structure wherein the conductive path (15) is an integral part of said security casing (10) extending continuously from the outer surface (11) onto the inner surface (13) of the security casing (10).

Description

Cicor Management AG

Security casing

FIELD OF THE INVENTION

[0001] The present invention relates to a security casing for use as a shield over an electronic circuitry, having an outer and an inner surface defining an inner cavity facing said electronic circuitry, the security casing being provided with a conductive path having predefined electrical characteristics. The security casing is intended to be used as a security measure to protect sensible components from being compromised/ manipulated. [0002] The present invention further relates to a system comprising such a security casing arranged over an electronic circuitry. An embodiment of the present invention relates to a personal identification number entry device.

BACKGROUND OF THE INVENTION

[0003] In several applications, electronic circuitry is deployed where tampering with such circuitry is a threat to security and poses the risk of breach of sensitive information. [0004] One particular field is the field of bank cards. Bank customers using electronic forms of payment or cash withdrawal relying on so-called PIN (personal identification code) entry devices (PED) in stores and bank branches to protect account details. In order to increase security, smart cards are replacing magnetic strip cards for point-of-sale and ATM payments in many countries. Customers authorize a transaction by inserting a bank smart card and entering a PIN into a PIN entry device (PED); the smart card verifies this PIN, and then a public-key certificate authenticates it to the PED. The card issuer might further authenticate transactions online. The move from magnetic strip to chip has reduced the use of counterfeit cards; however the system still has several inadequacies. One of the weaknesses of the system are the PEDs and their reduced ability to resist tampering and protect cardholders. For backward compatibility, cards still have both a chip and magnetic strip; the strip is used in ATMs without chip readers or when the chip is unreadable. Thus, a criminal who learns both the magnetic strip's contents and a cardholder's PIN can make a magnetic-strip copy and withdraw cash by causing an ATM to fall back to the older system, or by using the copy in a country that hasn't adopted smart card chips. The chip stores a copy of the magnetic strip in its public-key certificate, which is sent to terminals with every transaction. So, PEDs' anti-tampering mechanisms must protect not only PINs that cardholders enter but also card details.

[0005] Merchants and corrupt employees have free access to PEDs, and customers sometimes have access long enough to tamper with them. One must thus assume that the PED operates in an uncontrolled environment and must thus protect card details and PINs. However studies have shown that even though current PEDs protect bank and merchant secrets well, yet they leave customer card details and PINs inadequately protected.

[0006] A security threat is the fact that even though the secure storage for cryptographic keys appears fairly well protected, one can tap the data line of the PED to smart-card interface. The data exchanged on this line isn't encrypted; which yields the information one needs to create a fake magnetic- strip card and the PIN to use with it. [0007] A countermeasure to tampering electronic circuitry is shielding the electronic circuitry by a security casing . A known security casing is made from a plastic shell, wherein the inner surface of the shell is provided with a dense conductive path in the form of a meander-like pattern, having predefined electrical characteristics measurable by a supervisory circuit, intended to detect drilling through by monitoring these electrical

characteristics.

[0008] When such a security casing is drilled through, the conductive path is interrupted or at least its electrical characteristics are changed. Thus attempts to "tap" data lines of the electronic circuitry are detected by the supervisory circuit.

[0009] However, it appears that even though serious efforts have been made to reduce the pitch (down to 100-200 pm) to prevent drilling through, studies have shown that existing security cases are still vulnerable. For example a laser beam may be used for drilling a hole of reduced diameter (less than 150pm) between consecutive conductive segments of the pattern. Through such a hole one may insert a very thin conductor and tap the data lines and sensible data may be obtained by "eavesdropping".

[0010] A further method of manipulation of the known security casing is to machine the thermoplastic coating of the casing up to the point where direct access is gained to the meander-like conductive path. By "short circuiting" the conductive path at a distance from its turning radius such that the electrical characteristics (for example resistance) are not changed ( for example at 700pm from the bend radius for a conductive path with a width of 150pm and a pitch of 300pm), a relatively large surface is susceptible to drill- through, since the bending portion is short circuited and can thus be removed without detectable effects on the electrical characteristics - therefore the tampering being undetectable to the supervisory circuit.

[0011] One must note that further decreasing the of the conductive path (which at the current technology used for such shields is either impossible or very expensive) only makes tampering more difficult but fails to effectively make it impossible. TECHNICAL PROBLEM TO BE SOLVED

[0012] The objective of the present invention is thus to provide a security casing for effectively protecting electronic circuitry against

manipulation . The security casing must be able to prevent manipulation on every possible area of the casing from all possible angles.

SUMMARY OF THE INVENTION

[0013] The above-identified objective is solved by a security casing, the security casing having an outer surface and an inner surface defining an inner cavity facing the electronic circuitry to be protected, the security casing being provided with a conductive path having predefined electrical characteristics measurable between a first connection point and a second connection point. The security casing according to the present invention is a three-dimensional structure, the conductive path being an integral part of said security casing and extending continuously from the outer surface onto the inner surface of the security casing. The security casing - in conjunction with a corresponding supervisory circuit for monitoring the electrical characteristics of the conductive path - thus provides an active shield against manipulations.

[0014] By providing a continuous conductive path from the outer surface to the inner surface of the case, it is ensured that manipulations result in a change of the electrical characteristics of the conductive path regardless of the area of the casing . Since the conductive path is continuous, manipulations from the top or any side, perpendicular or oblique to the surface of the security casing all result in a change of the electrical characteristics of the conductive path. [0015] Furthermore, by providing the conductive path both on the inner and outer surfaces of the security casing, it is impossible to machine the thermoplastic coating of the casing up to the point where direct access is gained to the meander-like conductive path, since the inner surface is still inaccessible. However, one must recognize that this does not mean that providing the conductive path only on the inner surface would provide sufficient protection since there are other methods of intrusion and mapping of the layout of the conductive path (such as X-ray-ing) which do not require direct access to the conductive path .

[0016] In a particularly advantageous embodiment of the present invention - wherein the conductive path is arranged on said outer surface with an offset with respect to the conductive path on the inner surface - a conductive path is achieved which results in a virtually gap-free projection of the conductive path of any area of the security casing . In other words, by superimposing the conductive path on the inner and outer surfaces, an essentially continuous surface results. Therefore - regardless of the use of drills, laser beams and line tapping needles with reduced thickness -it is practically impossible to manipulate the conductive path without interrupting it or at least affecting its electrical characteristics.

ADVANTAGEOUS EFFECTS

[0017] In view of the above-identified objectives and summary of the present invention, the most advantageous effect of the security casing is that it provides an effective but simple synergistic combined protection against manipulations of different kinds, such as drilling-through or short circuiting, either with direct or only indirect access to the conductive path.

INDUSTRIAL APPLICABILTY [0018] It shall be recognized that while the security casing of the present invention is particularly advantageous for protecting the electronic circuitry of PEDs, the security casing is suitable as active protection of any electronic circuitry.

[0019] Further fields of application comprise (but not limited to) shielding secure wireless and wired communication devices, cryptographic security processors, banking systems, various computing systems, access control systems, various handheld devices and electronic voting machines. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Further characteristics and advantages of the invention will in the following be described in detail by means of the description and by making reference to the drawings:

Shows a perspective view of a system comprising a security casing without the cover according to the present invention arranged over an electronic circuitry with a portion of the conductive path shown magnified;

Shows a perspective view of a system comprising a security casing without the cover according to the present invention arranged over an electronic circuitry with a portion of the conductive path shown magnified, with a corner of the security casing and electronic circuitry being removed so as to reveal the inner cavity defined by the inner surface of the casing and the electrical components of the circuitry shielded by the casing;

Shows a magnified view of the conductive path in the area of an edge or bend of the outer surface of the casing, area illustratively marked on Fig . IB with a circle A;

Shows a magnified view of the conductive path in the area of transition between the inner surface of the casing and the electronic circuitry showing a first connection point and a second connection point of the conductive path for measuring its electrical characteristics, area illustratively marked on Fig . IB with a circle B;

Shows a magnified view of the conductive path in a transition area (edge or bend) from the outer surface to the inner surface of the casing, area illustratively marked on Fig . IB with a circle

Fig . 2C Shows an alternative magnified view of the conductive path in a transition area (edge or bend) from the outer surface to the inner surface of the casing, area illustratively marked on Fig . IB with a circle C; wherein the conductive path on the inner surface (hidden in Fig . 2C) is shown with dashed lines;

Shows a magnified view of the conductive path in a transition area (edge or bend) from the outer surface to the inner surface of the casing, area illustratively marked on Fig . IB with a circle C according to a further embodiment of the present invention, wherein the conductive path is arranged on said outer surface with an offset with respect to the conductive path on the inner surface;

Shows a magnified view of a projection of the conductive path of the further embodiment of the present invention as also shown on Figure 2C" in an area illustratively marked on Fig . IB with a circle D, the conductive path on the inner surface with said offset (hidden in Fig . 2D) being depicted with dashed lines;

Shows a magnified detailed perspective view of the conductive path in the area of an edge or bend of the outer surface of the casing, area illustratively marked on Fig. IB with a circle A;

Shows a perpendicular cross section along the line X-X' of figure 1A of a system comprising a security casing according to the present invention arranged over an electronic circuitry;

Shows a bottom view of a security casing according to the present invention, wherein the casing being provided with a cover for protecting the conductive path;

Shows a perpendicular cross section along the line X-X' of figure 1A of a system comprising a security casing arranged over an electronic circuitry, the casing being provided with a cover for protecting the conductive path and the casing comprising a supervisory circuit for monitoring electrical characteristics of the conductive path. Note : The figures are not drawn to scale, are provided as illustration only and serve only for better understanding but not for defining the scope of the invention. No limitations of any features of the invention should be implied form these figures. DESCRIPTION OF PREFERRED EMBODIMENTS

[0021] Certain terms will be used in this patent application, the formulation of which should not be interpreted to be limited by the specific term chosen, but as to relate to the general concept behind the specific term.

[0022] The term three-dimensional structure is used in the context of the present invention as meaning a structure which extends beyond a single plane. Please note here, that even though a single flat planar board having a certain thickness is - strictly geometrically - a three dimensional shape, it shall not be considered a three-dimensional structure in interpreting the present invention. [0023] The term inner cavity shall be interpreted as volume of space convexly enclosed at least partially by the security casing and the electric circuitry. Therefore the inner cavity is the volume of space protected by the security casing, where sensitive electronics is located on the electronic circuitry. Electronic circuitry shall cover all types of circuitry, including but not limited to : printed circuit boards, molded interconnect devices and single electrical components such as a microprocessor or smart card interface.

[0024] Conductive path shall mean in the current context, any sort of conductive connection between two points. The conductive path is however preferably a conductive pathway in the form of conductive lines on a non- conductive substrate. When defining that the conductive path is integral part of the casing, it shall mean that after manufacture, the conductive path can no longer be separated from the base substrate of the security casing without damage to one or both.

[0025] The term continuously - when referring to the conductive path extending continuously - shall be interpreted as an electrically continuous/ electrically interruption-free connection. Therefore this definition comprises electrically continuous, but structurally discontinuous connections such as for example connections of the conductive path of varying physical structures without electric interruption.

[0026] Figure 1A depicts a perspective view of a system 1 comprising a security casing 10 according to the present invention arranged over an electronic circuitry 50 with a portion of the conductive path 15 shown magnified . As the figure shows, the security casing 10 is arranged as a protective shield over the electronic circuitry 50 for protecting sensitive electronics. [0027] The security casing 1 is a three-dimensional structure. In the preferred embodiment of the present invention depicted on the figures, the security casing has the shape of a hollow frustum open on one of its two parallel planes, preferably the larger of the two parallel planes of the frustum.

[0028] However, the security casing 10 may have different shapes according to the requirements of the specific application, such as a truncated cone or a hemisphere, each convexly defining an inner cavity for protection of sensitive electronics.

[0029] Figure IB shows a perspective view with a segment of the security casing 10 and electronic circuitry 50 being removed so as to reveal portions invisible on figure 1A. The security casing 10 has an outer surface 11 and an inner surface 13 defining an inner cavity 12. This inner cavity 12, facing the electronic circuitry 50, is the volume protected by the security casing against manipulations and is dimensioned such as to cover sensitive electronic components of the electronic circuitry 50. [0030] The security casing 10 itself is made of a non-conductive material . The security casing 10 is provided with a conductive path 15 having predefined electrical characteristics, the conductive path 15 being an integral part of the security casing 10. In order to make this conductive path 15 visible, the security casing 10 is shown on figures 1A and IB without any cover on its outer surface. [0031] According to the present invention, the conductive path 15 extends continuously from the outer surface 11 onto the inner surface 13 of the security casing 10, the conductive path 15 comprising an inner section 15.3 extending on the inner surface 13 from a first connection point 16 continuously to an outer section 15.1 on the outer surface 11 of the security casing 10.

[0032] Magnified portions of figures 1A and IB show a particularly advantageous conductive path 15 with a meander-like pattern. This meanderlike pattern has the advantage that it allows that both the width B of the conductive pattern 15 and also distance ΔΧ between consecutive conductive segments of the pattern to be kept essentially constant. This feature shall be discussed in more detail with reference to figure 3.

[0033] Figure 2A depicts a magnified view of the conductive path 15 in the area of an edge or bend of the outer surface of the security casing 10, area illustratively marked on Figure IB with a circle A. The figure shows how the conductive path 15 extends continuously over edges/ bends of the security casing 10 ensuring that the conditions on pitch ΔΧ and thickness B of the conductive path are complied with even around the edges/ bends.

[0034] Figure 2B shows a magnified view of the conductive path 15 in the area of transition between the inner surface 13 of the casing and the electronic circuitry 50 showing a first connection point 15 and a second connection point 16 of the conductive path 15 for measuring its electrical characteristics, area illustratively marked on figure IB with a circle B. The connections points 15, 16 are provided for connecting a supervisory circuit 18 for monitoring the electrical characteristics of the conductive path 15 to detect attempts of manipulation. In the depicted preferred embodiment both connection points 15 and 16 are situated on the inner surface 13 of the casing 10 within the inner cavity 12. However, only at least one of the connections points 15, 16 must be within the inner section 15.3 of the conductive path 15 within the inner cavity 12. Furthermore, even though preferred, the

connection points 15, 16 must not necessarily be endpoints of the conductive path 15. Intermediate connection points can also be provided . [0035] Figure 2C shows a magnified view of the conductive path 15 in a transition area (edge or bend) from the outer surface 11 to the inner surface 11 of the casing 10, area illustratively marked on Figure IB with a circle C. The figure shows how the conductive path 15 extends continuously from the outer section 15.1 over a lateral section on a lateral surface on the edges/ bends of the security casing 10 from the outer surface 11 to the inner surface 11 ensuring that the conditions on pitch ΔΧ and thickness B of the conductive path are complied with even around the edges/ bends and on all surfaces.

[0036] Figure 2C shows an alternative magnified view of the conductive path 15 in the transition area (edge or bend) from the outer surface 11 to the inner surface 11 of the casing 10, area illustratively marked on Figure IB with a circle C; wherein the inner section 15.3 of the conductive path 15 on the inner surface 13 (hidden in Figure 2C) is shown with dashed lines. The continuity of the conductive path 15 throughout the casing 10 is well illustrated here. The pitch ΔΧ is kept essentially constant.

[0037] Figure 2C" shows a further magnified view of the conductive path 15 in a transition area (edge or bend) from the outer surface 13 to the inner surface 11 of the casing, area illustratively marked on Figure IB with a circle C. This figure shows a particularly preferred embodiment of the present invention, wherein in the outer section 15.1 the conductive path 15 is arranged on the outer 13 surface with an offset with respect to the inner section 15.3 of the conductive path 15 on the inner surface 13. This offset ensures that even if one would be able to drill a miniature hole between the meanders of the outer section 15.1, drilling this hole would inherently penetrate the inner section 15.3 of the path 15 on the inner surface 13 thus interrupting or at least altering the electrical properties of the conductive path 15.

[0038] Figure 2D shows a magnified view of the projection of the conductive path 15 in an area illustratively marked on Figure IB with a circle D, wherein the inner section 15.3 of the conductive path 15 on the inner surface 13 (hidden in Figure 2D) being depicted with dashed lines. One can well see that the distance between adjacent sections of the conductive path 15 on a projection of the inner 15.3 and outer section 15.1 of the conductive path 15 on both the inner surface 13 and the outer surface 11 is thus greatly reduced . Depending on the thickness of the path 15, this distance between adjacent sections of the conductive path 15 on the projection may be reduced to essentially 0. This aspect shall be discussed in detail with reference to figure 3.

[0039] Figure 3 depicts a particularly advantageous embodiment of the present invention. This figure shows a more detailed and magnified

perspective view of the conductive path 15 in the area of an edge or bend of the outer surface 11 of the casing 10, area illustratively marked on Figure IB with a circle A. In this particularly advantageous embodiment, the pitch ΔΧ of the conductive path 15 is essentially equal to double its thickness B; while the offset of the conductive path 15 on the outer surface 11 with respect to the conductive path 15 on the inner surface essentially equals the thickness B of the conductive path 15. Thus a conductive path 15 is achieved which results in a virtually gap-free projection on any surface of the security casing 10. In other words, by superimposing the inner 15.3 and outer section 15.1 of the conductive path 15, an essentially gap-free continuous surface results. That is, the projection of the conductive path 15 completely covers all surfaces of the casing 10, leaving no gap for a potential manipulation. Therefore - regardless of the use of drills, laser beams and line tapping needles with reduced thickness - it is practically impossible to manipulate the conductive path 15 without interrupting it or at least affecting its electrical

characteristics. [0040] In addition, in further embodiments, the security casing 10 may be covered by not only one but by several conductive paths covering different areas, each with corresponding connection points for monitoring their respective electrical characteristics (which must not be the same for each conductive path). [0041] In order to provide effective protection against manipulation, the maximum distance between consecutive conductive segments of the meander-like pattern of the conductive path 15 on the entire inner surface 13 and outer surface 11 of the security casing 10 does not exceed a predefined pitch ΔΧ, the conductive path 15 having an essentially constant thickness B.

[0042] Figure 4 shows a perpendicular cross section along the line X-X' of figure 1A of a system 1 comprising a security casing 10 according to the present invention arranged over an electronic circuitry 50.

[0043] Figure 5 shows a bottom view of a security casing 10 depicting the continuous meander-like pattern of the conductive path 15, the casing 10 being provided with a cover 20 for protecting the conductive path 15.

[0044] Figure 6 shows a perpendicular cross section along the line X-X' of figure 1A of a system 1 comprising a security casing 10 arranged over an electronic circuitry 50, the casing 10 being provided with a cover 20 for protecting the conductive path 15. According to the requirements of the specific application, the cover 20 may be provided in the form of a thick opaque coating; in the form of a thermoplastic cap mounted on top of the security casing 10 such that its removal would cause an interruption of the conductive path 15; or by spraying a thermoplastic material over the security casing 10.

[0045] As depicted on figure 6, a supervisory circuit 18 may be provided in the inner cavity 12 on the inner surface 13; the supervisory circuit 18 being electrically connected to said first connection point 16 and second connection point 17. The supervisory circuit 18 is configured for monitoring the electrical characteristics of the conductive path 15 and thereby detect manipulation of the security casing 10. The monitored electrical characteristics comprise but are not limited to : electrical resistance; capacitance; inductance or

impedance.

[0046] Optionally, as shown on figure 6, the cover 20 may be provided at its base with a rim for facilitating the fixation to the electric circuitry, by for example or by gluing, soldering, etc.

[0047] In a preferred embodiment of the present invention, the security casing 10 is a three dimensional molded interconnect device (3D-MID) with the conductive pattern 15 being integrated into the security casing 10 on its outermost surfaces by a laser direct structuring (LDS) method. For this reason, the security casing 10 itself is made from a thermoplastic material comprising metallic particles preferably copper particles (doped with a metal complex). Suitable materials comprise but are not limited to Liquid Crystal Polymer (LCP), Polyethylene terephthalate + Polybutylene terephthalate (PET+PBT), Polybutylene terephthalate, partially aromatic hightemperature polyamide (PA6/6T) or PC/ABS. Material choice is done according to

application requirements (e.g. Temperature, SMT capability etc.)

The laser direct structuring method comprises the steps of: I. Injection molding : Thermoplastic parts acting as substrates are

manufactured by single shot injection mould of plastic material doped with a metal-complex.

II. Laser activation : After the injection molding, the structuring of the layout of the conductive path 15 on the security casing 10 takes place by laser. A laser ray activates on the one hand the doped metal complex in the plastic material and on the other hand ensures a keying of the plastic materials on the structured areas. The roughness of the structured layout fosters the anchoring of the metal layer created by the plating process. III. Plating : A chemical cooper layer can grow on the lasered structures.

Optionally a nickel layer can be build up on top of the cooper layer and a flash gold layer on top of the nickel layer.

[0048] In a preferred manufacturing process of the security casing 10, the above steps are followed by an electro-optical inspection (EOI). After plating, the casing 10 is subject to 100% electro optical inspection

comprising :

Electrical test: product specific test devices. Mostly only resistance measurement to detect short circuits and/or missing plating in certain areas; Optical inspection : manual process by trained staff and according to product specific failure catalog.

[0049] For manufacturing a protection system comprising a security casing 10 and a supervisory circuit 18 according to the present invention, the further step of electronic assembly is carried out for example by: Surface Mount Technology (SMT), Wire-Boding or by Non Conductive Adhesive Flip- Chip, wherein the security casing 10 is mounted on top of sensible parts of the electronic circuitry 50, and the measurement points 15, 16 are connected to the supervisory circuit 18. [0050] Manufacturing the security casing 10 of the present invention as a three dimensional molded interconnect device (3D-MID) with the conductive pattern 15 being integrated into the security casing 10 on its outermost surfaces has the great advantage that the case may be manufactured in a cost efficient manner by providing the conductive path on the outer surfaces of a three dimensional molded interconnect device (3D-MID) by the laser direct structuring method. Using this method, the outer surfaces can be laser activated, metalized and checked each in a single pass.

[0051] As a less preferred alternative, the security casing may be manufactured as a multi-layer three dimensional molded interconnect device (3D-MID), wherein the conductive path 15 of the security casing 15 is arranged on successive layers of the molded interconnect device. In other words, the inner surface 11 and outer surface 13 are in this case not the outermost external surfaces of the molded interconnect device. To achieve this, a so called multi-layer laser direct structuring method is employed, wherein the steps I, II and II above are repeated for each layer, with a spraying of the plated substrate inbetween.

[0052] It will be understood that many variations could be adopted based on the specific structure hereinbefore described without departing from the scope of the invention as defined in the following claims. REFERENCE LIST: system 1 security casina 10 outer surface 11 inner cavity 12 inner surface 13 conductive path 15 outer section 15.1 inner section 15.3 first connection point 16 second connection point 17 supervisory circuit 18 cover 20 electronic circuitry 50 pitch (of conductive path) ΔΧ thickness (of conductive path) B personal identification code entry devices PED

Claims

CLAIMS :

A security casing (10) for use as a shield over an electronic circuitry (50), the security casing (10) having an outer surface (11) and an inner surface (13) defining an inner cavity (12) facing said electronic circuitry (50), the security casing (10) being provided with a conductive path (15) having predefined electrical characteristics measurable between a first connection point (16) and a second connection point (17), said security casing (10) being a three-dimensional structure where the conductive path (15) is an integral part of said security casing (10); and said conductive path (15) extending continuously from the outer surface (11) onto the inner surface (13) of the security casing (10).

A security casing (10) according to claim 1,

characterized in that:

at least said first connection point (16) is provided within said inner cavity (12) of the security casing (10);

the conductive path ( 15) comprises at least an inner section (15.3) extending on the inner surface (13) from the first connection point (16) continuously to an outer section (15.1) on the outer surface (11) of the security casing (10).

3. A security casing (10) according to claim 1 or 2,

characterized in that said security casing (10) is a molded interconnect device (3D-MID).

4. A security casing (10) according to one of the claims 1 to 3,

characterized in that:

the security casing (10) is manufactured from a thermoplastic material comprising metallic particles, preferably copper particles; and

- said conductive path (15) is integrated into the security casing (10) by a laser direct structuring method. A security casing (10) according to claim 4,

characterized in that the security casing 10 is injection molded into said three-dimensional structure which is then laser activated, wherein a layout of said conductive path (15) is structured by a laser beam by activating said metallic particles of the security casing (10) and wherein said conductive path (15) is grown on said structured layout.

A security casing (10) according to one of the claims 2 to 5,

characterized in that said conductive path (15) extends from said inner section (15.3) onto said outer section (15.1) through a lateral section on a lateral surface of the security casing (10) situated between said outer surface (11) and inner surface (13).

A security casing (10) according to one of the claims 1 to 6,

characterized in that said conductive path (15) comprises a meanderlike pattern, wherein the maximum distance between consecutive conductive segments of the pattern on the entire inner surface (13) and outer surface (11) of the security casing (10) does not exceed a

predefined pitch (ΔΧ), the conductive path (15) having an essentially constant thickness (B).

A security casing (10) according to one of the claims 1 to 7,

characterized in that said conductive path (15) is arranged on said outer surface (11) with an offset with respect to the conductive path (15) on the inner surface (13).

A security casing (10) claims 7 and 8,

characterized in that:

the pitch (ΔΧ) of the conductive path (15) is essentially equal to twice the thickness (B); and

said offset essentially equals thickness (B) of the conductive path (15);

resulting in a virtually gap-free projection of the conductive path (15) parallel to any surface of the security casing (10).

10. A security casing (10) according to one of the claims 1 to 9,

characterized in that the security casing (10) has the shape of a hollow frustum open on one of its two parallel planes, preferably the larger of the two parallel planes of the frustum.

11. A security casing (10) according to one of the claims 1 to 10,

characterized in that at least the outer surface (11) is provided with a cover (20) for protecting the conductive path (15).

12. A security casing (10) according to claim 11,

characterized in that said cover (20) is provided in the form of a thick opaque coating. 13. A security casing (10) according to claim 11,

characterized in that said cover (20) is provided in the form of a thermoplastic cap mounted on top of the security casing (10) such that its removal would cause an interruption of the conductive path (15). 14. A security casing (10) according to claim 11,

characterized in that said cover (20) is provided by spraying a thermoplastic material over the security casing (10).

15. A security casing (10) according to one of the claims 1 to 14,

characterized in that a supervisory circuit (18) is provided in the inner cavity (12) on the inner surface (13), the supervisory circuit (18) being electrically connected to said first connection point (16) and second connection point (17) for monitoring said predefined electrical

characteristics of the conductive path (15).

16. A system (1) comprising a security casing (10) according to one of the claims 1 to 15 arranged over an electronic circuitry (50), the system comprising a supervisory circuit (18) in the inner cavity (12) of the security casing (10) being electrically connected to said first connection point (16) and second connection point (17) for monitoring said

predefined electrical characteristics of the conductive path (15).

17. A system (1) according to claim 16,

characterized in that the security casing (10) is arranged over said electronic circuitry (50) in such a way that exposure of the electronic circuitry (50) by full or even partial removal and/or compromise of the security casing (10) resulting in said predefined electrical characteristics of the conductive path (15) being altered, this being detectable by said supervisory circuit (18).

18. A system (1) according to claim 15 or 16,

characterized in that the system (1) is a personal identification number entry device (PED).