WO2013099431A1 - シリカガラスルツボ - Google Patents
シリカガラスルツボ Download PDFInfo
- Publication number
- WO2013099431A1 WO2013099431A1 PCT/JP2012/078257 JP2012078257W WO2013099431A1 WO 2013099431 A1 WO2013099431 A1 WO 2013099431A1 JP 2012078257 W JP2012078257 W JP 2012078257W WO 2013099431 A1 WO2013099431 A1 WO 2013099431A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silica glass
- glass crucible
- side wall
- round
- crucible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
- C03B19/095—Other methods of shaping glass by fusing powdered glass in a shaping mould by centrifuging, e.g. arc discharge in rotating mould
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B20/00—Processes specially adapted for the production of quartz or fused silica articles, not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/002—Crucibles or containers
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/002—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
Definitions
- the present invention relates to a silica glass crucible.
- Patent Document 1 describes a quartz glass crucible for pulling a silicon single crystal provided with a circumferential groove on the outer periphery of the side wall portion and above the initial melt line. This groove is provided at a position below the upper end of the carbon susceptor.
- Patent Document 2 describes a design method of pulling conditions for a single crystal when a single crystal is grown from a crucible containing a raw material melt by the Czochralski method.
- the temperature difference ⁇ T (K) in the melt from the outer peripheral surface of the single crystal to be grown to the inner wall of the crucible obtained by the comprehensive heat transfer analysis is used to calculate the temperature difference from the outer peripheral surface of the single crystal to be grown to the inner wall of the crucible.
- An average melt temperature gradient G (K / cm) divided by a horizontal distance L (cm) on the liquid surface is obtained, and the average melt temperature gradient G and the growth of the single crystal during single crystal pulling are determined.
- a design method of pulling conditions for a single crystal that sets pulling conditions from the relationship with the rate of occurrence of solidification occurring outside the growth interface is described.
- the user independently prepares a susceptor for holding the silica glass crucible, or the user uniquely determines the amount of polycrystalline silicon to be put into the silica glass crucible.
- the circumferential groove may not be provided in advance at a position above the initial melt line and below the upper end of the carbon susceptor.
- the pulling conditions are set based on the relationship between the average temperature gradient G in the melt and the rate of solidification occurring outside the growth interface of the grown single crystal during pulling of the single crystal. Even if it does, it is difficult to suppress effectively the crucible buckling or the side wall portion falling into the crucible.
- the softening point of silica glass is about 1200 to 1300 ° C.
- the silicon melt is heated to a high temperature of 1450 to 1500 ° C. for a long period of two weeks or more.
- 900 kg or more of silicon melt at about 1500 ° C. is stored in the crucible.
- the heating temperature of the heater installed outside the silica glass crucible must be increased, and the silica glass crucible is softened by heating and buckled or collapsed. The problem that becomes easy to infiltrate becomes obvious.
- the purity of the silicon single crystal to be pulled is required to be 99.99999999999% or higher, it is required that silica fragments or the like are not mixed from the silica glass crucible used for pulling. Therefore, if the silica glass crucible is softened by heating to cause buckling or collapse, the silica fragments may fall and cause a big problem.
- This invention is made
- a silica glass crucible used for pulling up single crystal silicon, a cylindrical side wall portion having an edge opened on the upper surface, a mortar-shaped bottom portion made of a curve, its side wall portion and A silica glass crucible provided with a round part connecting the bottom part, wherein the thermal resistance per unit area in the thickness direction of the side wall part is larger than the thermal resistance per unit area in the thickness direction of the round part Is done.
- the thermal resistance per unit area in the thickness direction of the side wall portion is larger than the thermal resistance per unit area in the thickness direction of the round portion, when the single crystal silicon is pulled up, When the melt surface reaches the round part, the heating strength of the silica glass crucible can be relaxed.
- the buckling of the silica glass crucible or the collapse of the side wall into the crucible can be suppressed.
- FIG. It is sectional drawing for demonstrating the structure of the silica glass crucible of Embodiment 1.
- FIG. It is sectional drawing for demonstrating the temperature gradient of the side wall part of the silica glass crucible which concerns on Embodiment 1.
- FIG. It is sectional drawing for demonstrating the temperature gradient of the round part of the silica glass crucible which concerns on Embodiment 1.
- FIG. It is sectional drawing for demonstrating the temperature gradient of the side wall part of the silica glass crucible which concerns on Embodiment 2.
- FIG. It is sectional drawing for demonstrating the temperature gradient of the round part of the silica glass crucible which concerns on Embodiment 2.
- FIG. 1 is a cross-sectional view for explaining the outline of the configuration of the silica glass crucible.
- the silica glass crucible 12 of this embodiment has a transparent silica glass layer 11 on the inner surface side and a silica glass layer 14 containing bubbles on the outer surface side.
- the silica glass crucible 12 is placed on a susceptor (not shown) so that the opening faces upward when used for pulling up single crystal silicon by the Czochralski method (CZ method) or the like.
- CZ method Czochralski method
- the silica glass crucible 12 has a round portion (also called a corner portion) 17 having a relatively large curvature, a cylindrical side wall portion 15 having an edge opened on the upper surface, and a straight line or a relatively small curvature. It has a mortar-shaped bottom 16 made of a curve.
- the round part 17 is a part that connects the side wall part 15 and the bottom part 16, and the common tangent line with the bottom part 16 from the point that the tangent line of the round part 17 overlaps the side wall part 15 of the silica glass crucible 12. It means a part up to a point having.
- the side wall 15 of the crucible is a cylindrical portion parallel to the central axis (Z axis) of the crucible, and extends substantially directly below the opening of the crucible.
- the side wall portion 15 does not have to be completely parallel to the Z axis, and may be inclined so as to gradually spread toward the opening. Further, the side wall 15 may be straight or may be gently curved.
- the bottom portion 16 of the crucible is a substantially disc-shaped portion including an intersection with the Z axis of the crucible, and a round portion 17 is formed between the bottom portion 16 and the side wall portion 15.
- the shape of the crucible bottom 16 may be a so-called round bottom or a flat bottom.
- the curvature and angle of the round part 17 can also be set arbitrarily.
- the bottom part 16 also has an appropriate curvature, so the difference in curvature between the bottom part 16 and the round part 17 is very small compared to the flat bottom.
- the point at which the side wall 15 of the silica glass crucible 12 starts to be bent may be the boundary between the side wall 15 and the round part 17.
- the portion where the curvature of the bottom of the crucible is constant is the bottom portion 16, and the point where the curvature starts to change when the distance from the center of the bottom of the crucible increases may be the boundary between the bottom portion 16 and the round portion 17.
- the bottom 16 when the crucible bottom 16 is a flat bottom, the bottom 16 has a flat or extremely gentle curved surface, and the curvature of the round portion 17 is very large.
- the bottom 16 is defined as a region where the tangential inclination angle of the crucible wall surface with respect to the XY plane orthogonal to the Z axis is 5 degrees or less, 10 degrees or less, 15 degrees or less, 20 degrees or less, 25 degrees or less, or 30 degrees or less. May be.
- the side wall portion 15 is changed from the side wall portion 15 to the round portion 17 by its own weight 18. A large force is applied, and the force by which the side wall portion 15 falls inward is also applied.
- the silicon glass crucible 12 is filled with the silicon melt up to the upper side of the side wall portion 15, so that the side wall portion 15, the round portion 17, and the bottom portion from A large pressure is applied to 16, and buckling 19 at the round portion 17 or collapse of the side wall portion 15 to the inside is suppressed.
- FIG. 2 is a cross-sectional view for explaining the temperature gradient of the side wall portion of the silica glass crucible according to the first embodiment.
- FIG. 3 is sectional drawing for demonstrating the temperature gradient of the round part of the silica glass crucible which concerns on Embodiment 1.
- the thermal resistance per unit area in the thickness direction of the side wall portion 15 is larger than the thermal resistance per unit area in the thickness direction of the round portion 17. Further, the thermal resistance per unit area in the thickness direction of the round part 17 is larger than the thermal resistance per unit area in the thickness direction of the bottom part 16.
- the thermal resistance is a coefficient representing the difficulty of heat flow in heat transfer that occurs when heat is applied to an object, as shown by the following equation, and the unit is (K / W) or (° C / W).
- Thermal resistance (° C / W) Temperature difference (° C) ⁇ Heat source heat (W)
- the thermal resistance per unit area in the thickness direction is measured under conditions close to the actual pulling conditions of the silicon single crystal.
- the ambient temperature outside the silica glass crucible is 1000 ° C, 1050 ° C, 1100 ° C, 1200 ° C, 1300 ° C, 1400 ° C, 1500 ° C, 1600 ° C, 1700 ° C, 1800 ° C, 1900 ° C, 2000 ° C.
- a value measured under any one of the conditions is preferable.
- the ambient temperature inside the silica glass crucible is 1 ° C., 2 ° C., 3 ° C., 4 ° C., 5 ° C., 6 ° C., 7 ° C., 8 ° C., 9 ° C., 10 ° C., 20 ° C. It is preferably a value measured under a condition as low as any one of ° C, 30 ° C, 40 ° C, 50 ° C, 60 ° C, 70 ° C, 80 ° C, 90 ° C, and 100 ° C.
- the temperature of the liquid surface 24 needs to be maintained within a predetermined temperature range in order to pull up the single crystal silicon well from the liquid surface 24 of the silicon melt filled in the silica glass crucible 12.
- the thermal resistance per unit area in the thickness direction of the side wall portion 15 of the silica glass crucible 12 is large, so that as shown in FIG. Temperature difference (temperature gradient 28) increases. Therefore, in order to maintain the temperature of the liquid surface 24 within a predetermined temperature range, a large amount of heat 22 is applied to the silica glass crucible 12 from the carbon heater 20 provided on the outer periphery of a mold (not shown) that supports the silica glass crucible 12. It is necessary to supply.
- the side wall 15 heated to a high temperature is easily softened, but since a large pressure is applied to the side wall 15, the round part 17, and the bottom 16 from the silicon melt, buckling at the round part 17. 19 or the inward collapse of the side wall portion 15 is suppressed.
- the round part 17 is not excessively heated. Further, since the side wall 15 is no longer in contact with the silicon melt, the heat escape space is reduced, and the side wall 15 is in a so-called empty state, but a small amount of heat is generated from the carbon heater 20. It is possible to avoid the silica glass from being softened to such an extent that it is difficult to support its own weight 18 because it only flows in. Therefore, it is possible to suppress the occurrence of buckling 19 in the round portion 17 or the inward collapse of the side wall portion 15.
- the silica glass crucible 12 that satisfies such conditions is not particularly limited because various structures can be assumed.
- the silica glass crucible 12 has a structure of two or more layers including a silica glass layer 14 containing bubbles and a transparent silica glass layer 11, and contains bubbles in the side wall 15.
- the thickness of the silica glass layer 14 is larger than the thickness of the silica glass layer 14 containing the bubbles in the round portion 17, and the thickness of the silica glass layer 14 containing the bubbles in the round portion 17 contains the bubbles in the bottom portion 16.
- a structure larger than the thickness of the silica glass layer 14 is mentioned.
- the temperature difference (temperature gradient 32) between the outside and inside of the silica glass layer 14 containing bubbles is large.
- the transparent silica glass layer 11 has a smaller thermal resistance per unit area than the silica glass layer 14 containing bubbles, the temperature difference between the outside and the inside of the transparent silica glass layer 11 (temperature gradient 30). ) Is small. Therefore, as shown in FIG. 2, when the thickness of the silica glass layer 14 containing bubbles in the side wall 15 is large, the temperature difference (temperature gradient 28) between the outside and the inside of the entire side wall 15 is large. growing.
- the thickness of the silica glass layer 14 containing the bubbles in the side wall portion 15 is larger than the thickness of the silica glass layer 14 containing the bubbles in the round portion 17, and the thickness of the silica glass layer 14 containing the bubbles in the round portion 17. If the structure is larger than the thickness of the silica glass layer 14 containing the bubbles in the bottom portion 16, the silica glass crucible 12 satisfying the above conditions can be obtained.
- FIG. 4 is a cross-sectional view for explaining the temperature gradient of the side wall portion of the silica glass crucible according to the second embodiment.
- FIG. 5 is a cross-sectional view for explaining the temperature gradient of the round part of the silica glass crucible according to the second embodiment.
- the silica glass crucible 12 has a structure of two or more layers including different materials having different thermal conductivities as shown in FIGS.
- the outer layer 44 contains aluminum as an impurity, and thus has a high thermal resistance per unit area.
- the outer layer 44 containing aluminum as an impurity is obtained by arc melting a material in which natural quartz powder and alumina powder are mixed inside a mold used when the silica glass crucible 12 is manufactured.
- the inner layer 46 of these two or more layers has a low thermal resistance per unit area because it contains nitrogen as an impurity.
- the inner layer 46 containing nitrogen as an impurity is obtained by arc melting synthetic silica powder in a nitrogen gas or ammonia gas atmosphere.
- the silica glass crucible 12 has a structure of two or more layers containing different materials having different thermal conductivities, and the thickness of the outer layer 44 of the side wall portion 15. Is larger than the thickness of the outer layer 44 of the round portion 17, and the thickness of the outer layer 44 of the round portion 17 is larger than the thickness of the outer layer 44 of the bottom portion 16. In this case, since the outer layer 44 has a large thermal resistance per unit area, the temperature difference (temperature gradient 32) between the outside and the inside of the outside layer 44 is large.
- the inner layer 46 has a smaller thermal resistance per unit area than the outer layer 44, the temperature difference (temperature gradient 30) between the outer side and the inner side of the inner layer 46 is large. Therefore, as shown in FIG. 4, when the thickness of the outer layer 44 of the side wall 15 is large, the temperature difference (temperature gradient 28) between the outside and the inside of the entire side wall 15 increases.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Glass Melting And Manufacturing (AREA)
Description
図1は、シリカガラスルツボの構成の概要について説明するための断面図である。本実施形態のシリカガラスルツボ12は、内表面側に透明なシリカガラス層11と、外表面側に気泡を含有するシリカガラス層14を有するものである。このシリカガラスルツボ12は、チョクラルスキー法(CZ法)などによって単結晶シリコンの引上げに用いられる際には、開口部が上向きになるようにサセプター(不図示)上に載置されている。
図2は、実施形態1に係るシリカガラスルツボの側壁部の温度勾配について説明するための断面図である。また、図3は、実施形態1に係るシリカガラスルツボのラウンド部の温度勾配について説明するための断面図である。
熱抵抗(℃/W)=温度差(℃)÷熱源の熱量(W)
図4は、実施形態2に係るシリカガラスルツボの側壁部の温度勾配について説明するための断面図である。また、図5は、実施形態2に係るシリカガラスルツボのラウンド部の温度勾配について説明するための断面図である。
12 シリカガラスルツボ
14 気泡を含有するシリカガラス層
15 側壁部
16 底部
17 ラウンド部
18 自重
19 座屈
20 カーボンヒータ
22 熱量
24 液面
28 温度勾配
30 温度勾配
32 温度勾配
44 外側層
46 内側層
Claims (7)
- 単結晶シリコンの引き上げに用いられるシリカガラスルツボであって、
上面に開口した縁部を有する円筒状の側壁部と、
曲線からなるすり鉢状の底部と、
前記側壁部および前記底部を連接するラウンド部と、
を備え、
前記側壁部の厚さ方向の単位面積あたりの熱抵抗が、前記ラウンド部の厚さ方向の単位面積あたりの熱抵抗よりも大きい、
シリカガラスルツボ。 - 請求項1に記載のシリカガラスルツボにおいて、
前記ラウンド部の厚さ方向の単位面積あたりの熱抵抗が、前記底部の厚さ方向の単位面積あたりの熱抵抗よりも大きい、
シリカガラスルツボ。 - 請求項1に記載のシリカガラスルツボにおいて、
前記シリカガラスルツボが、気泡を含有するシリカガラス層および透明なシリカガラス層を含む2層以上の構造を有し、
前記側壁部の気泡を含有するシリカガラス層の厚みが、前記ラウンド部の気泡を含有するシリカガラス層の厚みよりも大きい、
シリカガラスルツボ。 - 請求項3に記載のシリカガラスルツボにおいて、
前記ラウンド部の気泡を含有するシリカガラス層の厚みが、前記底部の気泡を含有するシリカガラス層の厚みよりも大きい、
シリカガラスルツボ。 - 請求項1に記載のシリカガラスルツボにおいて、
前記シリカガラスルツボが、互いに熱伝導率の異なる異種材料を含む2層以上の構造を有する、
シリカガラスルツボ。 - 請求項5に記載のシリカガラスルツボにおいて、
前記2層以上のうち外側層が、不純物としてアルミニウムを含有する、
シリカガラスルツボ。 - 請求項5に記載のシリカガラスルツボにおいて、
前記2層以上のうち内側層が、不純物として窒素を含有する、
シリカガラスルツボ。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/369,151 US9758900B2 (en) | 2011-12-30 | 2012-10-31 | Silica glass crucible |
| CN201280065351.XA CN104114754B (zh) | 2011-12-30 | 2012-10-31 | 氧化硅玻璃坩埚 |
| EP12861985.5A EP2799597B1 (en) | 2011-12-30 | 2012-10-31 | Silica glass crucible |
| KR1020147020101A KR101638586B1 (ko) | 2011-12-30 | 2012-10-31 | 실리카 유리 도가니 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011290478A JP5762945B2 (ja) | 2011-12-30 | 2011-12-30 | シリカガラスルツボ |
| JP2011-290478 | 2011-12-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2013099431A1 true WO2013099431A1 (ja) | 2013-07-04 |
Family
ID=48696931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2012/078257 Ceased WO2013099431A1 (ja) | 2011-12-30 | 2012-10-31 | シリカガラスルツボ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9758900B2 (ja) |
| EP (1) | EP2799597B1 (ja) |
| JP (1) | JP5762945B2 (ja) |
| KR (1) | KR101638586B1 (ja) |
| CN (1) | CN104114754B (ja) |
| TW (1) | TWI507574B (ja) |
| WO (1) | WO2013099431A1 (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109689250B (zh) | 2016-08-31 | 2022-07-08 | 同和电子科技有限公司 | 银被覆合金粉末、导电性糊剂、电子部件及电气装置 |
| JP6699741B2 (ja) * | 2016-09-13 | 2020-05-27 | 株式会社Sumco | 石英ガラスルツボ及びその製造方法 |
| JP7761376B2 (ja) * | 2020-07-30 | 2025-10-28 | 信越石英株式会社 | 石英ガラスるつぼ |
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| DE102009048741A1 (de) * | 2009-03-20 | 2010-09-30 | Access E.V. | Tiegel zum Schmelzen und Kristallisieren eines Metalls, eines Halbleiters oder einer Metalllegierung, Bauteil für einen Tiegelgrundkörper eines Tiegels und Verfahren zum Herstellen eines Bauteils |
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| CN102127806B (zh) * | 2010-10-28 | 2012-09-05 | 杭州先进石英材料有限公司 | 一种石英玻璃坩埚及其制备方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101638586B1 (ko) | 2016-07-11 |
| JP2013139359A (ja) | 2013-07-18 |
| US9758900B2 (en) | 2017-09-12 |
| TW201331431A (zh) | 2013-08-01 |
| CN104114754A (zh) | 2014-10-22 |
| TWI507574B (zh) | 2015-11-11 |
| US20150027364A1 (en) | 2015-01-29 |
| KR20140107513A (ko) | 2014-09-04 |
| EP2799597A1 (en) | 2014-11-05 |
| CN104114754B (zh) | 2016-10-12 |
| EP2799597B1 (en) | 2019-09-25 |
| JP5762945B2 (ja) | 2015-08-12 |
| EP2799597A4 (en) | 2015-08-19 |
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