WO2013046882A1 - Fe-Pt-C系スパッタリングターゲット - Google Patents
Fe-Pt-C系スパッタリングターゲット Download PDFInfo
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- WO2013046882A1 WO2013046882A1 PCT/JP2012/068411 JP2012068411W WO2013046882A1 WO 2013046882 A1 WO2013046882 A1 WO 2013046882A1 JP 2012068411 W JP2012068411 W JP 2012068411W WO 2013046882 A1 WO2013046882 A1 WO 2013046882A1
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- sputtering target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C33/00—Making ferrous alloys
- C22C33/02—Making ferrous alloys by powder metallurgy
- C22C33/0257—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements
- C22C33/0278—Making ferrous alloys by powder metallurgy characterised by the range of the alloying elements with at least one alloying element having a minimum content above 5%
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/851—Coating a support with a magnetic layer by sputtering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Definitions
- the present invention relates to a sputtering target used for forming a granular magnetic thin film on a magnetic recording medium, and relates to an Fe—Pt sputtering target in which C particles are dispersed in a base alloy.
- a material based on Co, Fe, or Ni which is a ferromagnetic metal, is used as a material for a magnetic thin film in a magnetic recording medium.
- a Co—Cr—Pt-based ferromagnetic alloy containing Co as a main component has been used for a magnetic thin film of a hard disk employing the in-plane magnetic recording method.
- a composite material composed of a Co—Cr—Pt ferromagnetic alloy containing Co as a main component and a nonmagnetic material is often used for a magnetic thin film of a hard disk employing a perpendicular magnetic recording method that has been put into practical use in recent years. ing.
- the above-mentioned magnetic thin film is often produced by sputtering a sputtering target containing the above material as a component with a DC magnetron sputtering apparatus because of its high productivity.
- the recording density of hard disks is increasing rapidly year by year, and is expected to exceed 1 Tbit / in 2 in the future.
- the size of the recording bit becomes less than 10 nm.
- super paramagnetization due to thermal fluctuation becomes a problem, and the material of the magnetic recording medium currently used, For example, it is expected that a material in which Pt is added to a Co—Cr base alloy to increase the magnetocrystalline anisotropy is not sufficient. This is because magnetic particles that behave stably as ferromagnetism with a size of 10 nm or less need to have higher crystal magnetic anisotropy.
- FePt ordered alloy having an L1 0 structure is attracting attention as a material for an ultra-high density recording medium.
- FePt having an L1 0 structure with a high magnetocrystalline anisotropy, corrosion resistance and excellent oxidation resistance it is expected that materials suitable for application as a magnetic recording medium.
- L1 0 structure granular structure magnetic thin film of FePt magnetic particles magnetically to isolate a non-magnetic material such oxides or carbon having the magnetic recording medium of the next generation hard disk employing a thermally assisted magnetic recording method It has been proposed for use. Specifically, this granular structure magnetic thin film has a structure in which the grain boundaries of magnetic particles are filled with a nonmagnetic substance. Magnetic recording media having a magnetic thin film with a granular structure and related technologies have been proposed (Patent Documents 1 to 5).
- the granular structure magnetic thin film having a FePt having an L1 0 structure, a magnetic thin film C as a non-magnetic material containing 10-50% by volume ratio have received particular attention because of their high magnetic properties. It is known that such a granular structure magnetic thin film is produced by simultaneously sputtering an Fe target, a Pt target, and a C target, or by simultaneously sputtering an Fe—Pt alloy target and a C target. However, in order to simultaneously sputter these sputtering targets, an expensive simultaneous sputtering apparatus is required.
- a sputtering target in which a nonmagnetic material is dispersed in a base alloy is generally produced by a powder sintering method.
- the driving force for sintering largely depends on the specific surface area of the metal powder before sintering. In other words, if a metal powder having a smaller particle diameter is used, a sintered body with a higher density can be obtained.
- the amount of oxygen in the powder increases due to the surface oxidation of the metal powder.
- the amount of oxygen in the sintered body also tends to increase.
- a granular structure magnetic film is produced by sputtering a Fe—Pt—C based sputtering target having a high oxygen content, there is a concern that the corrosion resistance is lowered. This is because oxygen may be taken into the FePt magnetic particles and an oxide of Fe may be formed. Further, if Fe oxide is present in the sputtered film, there is a concern that it is difficult to order when the Fe—Pt phase is ordered by annealing.
- Patent Document 6 describes an Fe—Pt—C target having an oxygen content of 500 wtppm or less, but does not describe a specific measure for reducing the oxygen content.
- the size of the powder for sintering needs to be at least micron order or less.
- the oxygen content in the sputtering target can be reduced to 500 wtppm or less, but it is difficult to further reduce it to approximately 300 wtppm or less.
- Patent Document 7 proposes a method of obtaining an alloy film such as an Fe—Pt alloy in which the amount of residual gas components is reduced by reducing the amount of gas components of a target used in sputtering film formation.
- an alloy film such as an Fe—Pt alloy
- the amount of residual gas components is reduced by reducing the amount of gas components of a target used in sputtering film formation.
- C is not preferable because the ordering temperature of the magnetic alloy film rises and the magnetic properties are deteriorated.
- An object of the present invention allows the creation of good granular structure magnetic thin film in corrosion resistance, furthermore, can be easily ordered an L1 0 structure, C particles are finely dispersed, and a low oxygen content Fe-Pt It is an object of the present invention to provide a sputtering target.
- the present inventors have conducted intensive research. As a result, the metal powder is heat-treated with the C powder to suppress the oxidation of the sintering powder. It has been found that the Fe—Pt—C-based sputtering target produced using this method can reduce the oxygen content to 300 wtppm or less.
- composition in atomic ratio is represented by the formula: (Fe 100-X -Pt X ) 100-A C A (where A is a number satisfying 20 ⁇ A ⁇ 50 and X is 35 ⁇ X ⁇ 55)
- a sintered sputtering target having C particles finely dispersed in a base alloy and having an oxygen content of 300 wtppm or less
- the composition in the atomic ratio is represented by the formula: (Fe 100-XY -Pt X -M Y ) 100-A C A (where M is Fe, a metal element other than Pt, A is 20 ⁇ A ⁇ 50, X is a number satisfying 35 ⁇ X ⁇ 55 and Y is a number satisfying 0.5 ⁇ Y ⁇ 15), and has C particles finely dispersed in the base alloy, and contains oxygen.
- a method of manufacturing a sputtering target characterized by: 5) After the heat-treated powder is filled in the mold, it is uniaxially pressed at a pressure of 20 to 50 MPa for molding / sintering, and then isotropically hot pressed at a pressure of 100 to 200 MPa for molding / sintering.
- C particles are finely dispersed and, Fe-Pt-based sputtering target of low oxygen content, enables the creation of good granular structure magnetic thin film in corrosion resistance, furthermore, the ordering of the L1 0 structure It has an excellent effect that it can be made easy.
- the composition in the atomic ratio is represented by the formula: (Fe 100-X 2 -Pt X ) 100-A C A (where A is 20 ⁇ A ⁇ 50, X is 35 ⁇ X ⁇ 55), the C particles are uniformly finely dispersed in the base alloy, and the oxygen content is 300 wtppm or less.
- the content of C particles is preferably 20 to 50 atomic ratio in the sputtering target composition.
- the content of C particles in the target composition is less than 20 atomic ratio, a granular structure magnetic thin film with good characteristics may not be obtained.
- the content exceeds 50 atomic ratio the C particles aggregate, Particle generation may increase.
- the Pt content in the Fe—Pt alloy composition is preferably not less than 35 atom ratio and not more than 55 atom ratio. Content in Fe-Pt alloy of Pt is less than 35 atomic ratio, a composition range where Fe-Pt can not express the L1 0 structure having a high crystal magnetic anisotropy greater than 55 atomic ratio also, similarly, because Fe-Pt of L1 0 structure is composition range which does not express.
- the composition in the atomic ratio is represented by the formula: (Fe 100-XY- Pt X -M Y ) 100-A C A (where M is Fe, a metal element other than Pt, A is 20 ⁇ A ⁇ 50, X is a number satisfying 35 ⁇ X ⁇ 55 and Y is a number satisfying 0.5 ⁇ Y ⁇ 15), having C particles finely dispersed in the base alloy, and having an oxygen content of It can be set as a sputtering target of 300 wtppm or less.
- the granular structure magnetic thin film formed can reduce the heat treatment temperature at which the L1 0 structure and the magnetic recording medium saturation magnetization and the coercive force of the magnetic thin film This is effective because it can be adjusted to an optimum value.
- the Pt content in the Fe—Pt—M alloy composition is preferably not less than 35 atom ratio and not more than 55 atom ratio. To do. Content in Fe-Pt-M alloy of Pt, less than 35 atomic ratio, if it is 55 atomic ratio greater because Fe-Pt of L1 0 structure is composition range which does not express.
- the content of the metal element M is preferably 0.5 atomic ratio or more and 15 atomic ratio or less in the Fe—Pt—M alloy composition.
- the content of the additive metal element in the Fe-Pt-M alloy is less than 0.5 atomic ratio, the above effect is not observed, and if it is more than 15 atomic ratio, sufficient magnetocrystalline anisotropy This is because sex may not be obtained.
- Cu and Ag are particularly effective as the metal element to be added. These elements, because an effect of particular can be lowered to a heat treatment temperature when the granular structure magnetic thin film formed L1 0 structure.
- the sputtering target of the present invention preferably contains at least one of boride, carbide, nitride, and carbonitride, which are nonmagnetic materials. These nonmagnetic materials, like C (carbon), precipitate at the grain boundaries of the Fe—Pt magnetic particles and can magnetically shield the magnetic particles, so that good magnetic properties can be obtained.
- the sputtering target of the present invention heat-treats a mixed powder of metal powder and C powder in an inert gas atmosphere or a vacuum atmosphere at a temperature of 750 ° C. or higher and 1100 ° C. or lower. It is manufactured by using it for the part and sintering.
- the temperature of the heat treatment is important.
- a mixed powder of metal powder and C powder is heat-treated at a temperature of 750 ° C. or higher, a certain amount of C is dissolved in the metal, and C which cannot be completely dissolved in the metal during the cooling process covers the surface of the metal powder. It can be expected that the surface oxidation of the metal powder is suppressed.
- a temperature of 750 ° C. or lower is not preferable because the reaction between the metal powder and the C powder does not proceed sufficiently. Further, at a temperature of 1100 ° C. or higher, the metal powder may grow.
- the heat-treated powder is filled in a graphite mold, uniaxially pressed at a pressure of 20 to 50 MPa, molded and sintered, and then hot at a pressure of 100 to 200 MPa.
- a sintered body can be produced by pressing and molding and sintering. In order to suppress dust generation from the target that occurs when the target is sputtered, it is important to improve the density of the target.
- a denser sintered body can be produced by subjecting a sintered body molded and sintered by a uniaxial pressure sintering apparatus to hot isostatic pressing. In order to increase the density of the target, it is desirable that the applied pressure be as high as possible within the settable pressure range of the apparatus.
- the sputtering target of the present invention is produced by a powder sintering method.
- each raw material powder Fe powder, Pt powder, C powder, and optionally added metal element powder
- These powders desirably have a particle size of 0.1 ⁇ m or more and 10 ⁇ m or less. If the particle size of the raw material powder is too small, the powder aggregates and it is difficult to uniformly mix the raw material powders. On the other hand, when the particle size of the raw material powder is large, it is difficult to finely disperse the C particles in the alloy. Further, an alloy powder may be used as the raw material powder. Also when using alloy powder, it is desirable to use one having a particle size of 0.5 ⁇ m or more and 10 ⁇ m or less.
- the above powder is weighed to have a desired composition, and pulverized and mixed using a known method such as a ball mill.
- a known method such as a ball mill.
- the powder mixed by the ball mill is heat-treated in an inert gas atmosphere or a vacuum atmosphere.
- the heat treatment condition is desirably maintained at a temperature of 750 ° C. to 1100 ° C. for 2 hours or more. Thereby, the amount of oxygen in the raw material powder can be extremely reduced.
- the heat-treated powder is pulverized using a known method such as a ball mill to complete a mixed powder for sintering. At this time, you may mix the powder which is not heat-processed. For example, C powder that has not been heat-treated can be further added to the heat-treated (partly) mixed powder of Fe powder, Pt powder, and C powder. Then, the obtained powder is filled into a carbon mold and molded and sintered by hot pressing. In addition to hot pressing, a plasma discharge sintering method can also be used.
- the holding temperature at the time of sintering depends on the composition of the sputtering target, but in most cases, it is in the temperature range of 850 to 1400 ° C.
- the pressing force is set to 20 MPa or more, preferably 20 to 50 MPa.
- Hot isostatic pressing is performed on the sintered body taken out from the hot press.
- Hot isostatic pressing is effective in improving the density of the sintered body.
- the holding temperature in hot isostatic pressing depends on the composition of the sintered body, but in many cases is in the temperature range of 850 to 1400 ° C.
- the applied pressure is set to 100 MPa or more, preferably 100 to 200 MPa.
- an Fe—Pt—C based sputtering target in which C particles are uniformly finely dispersed in the base material alloy and the oxygen content of the sputtering target is 300 wtppm or less can be produced.
- Example 1 Fe powder having an average particle diameter of 3 ⁇ m, Pt powder having an average particle diameter of 3 ⁇ m, and C powder having an average particle diameter of 1 ⁇ m were prepared as raw material powders. Commercially available amorphous carbon was used as C powder. These powders were weighed in the following atomic ratio so that the total weight would be 2600 g. Atomic ratio: (Fe 50 -Pt 50 ) 60 -C 40
- the weighed powder was enclosed in a ball mill pot having a capacity of 10 liters together with zirconia balls as a grinding medium, and mixed and pulverized by rotating for 4 hours.
- the mixed powder taken out from the ball mill was heat treated.
- the heat treatment conditions were an Ar atmosphere (atmospheric pressure), a heating rate of 300 ° C./hour, a holding temperature of 900 ° C., and a holding time of 2 hours.
- the powder was taken out of the heat treatment furnace, enclosed in a ball mill pot with a capacity of 10 liters together with zirconia balls as a grinding medium, and pulverized by rotating for 4 hours.
- the pulverized powder was filled in a carbon mold and hot pressed.
- the hot pressing conditions were a vacuum atmosphere, a temperature rising rate of 300 ° C./hour, a holding temperature of 1200 ° C., and a holding time of 2 hours, and pressurization was performed at 30 MPa from the start of temperature rising to the end of holding. After completion of the holding, it was naturally cooled in the chamber.
- hot isostatic pressing was performed on the sintered body taken out from the hot press mold.
- the conditions for hot isostatic pressing were a heating rate of 300 ° C./hour, a holding temperature of 1350 ° C., a holding time of 2 hours, and gradually increasing the Ar gas pressure from the start of heating to 1350 ° During C holding, the pressure was increased to 150 MPa. After completion of the holding, it was naturally cooled in the furnace.
- the sintered body thus produced was cut using a lathe to obtain a sputtering target.
- a sample for oxygen analysis was cut out from the sintered body, and the oxygen content was measured and found to be 190 wtppm.
- the sintered body was polished, and the structure was observed with an optical microscope. As shown in FIG. 1, in the Fe—Pt alloy (white portion of the structure image), a structure in which C particles (black portion of the structure image) were finely dispersed was observed.
- the weighed powder was enclosed in a ball mill pot with a capacity of 10 liters together with zirconia balls as a grinding medium, and mixed and pulverized by rotating for 4 hours.
- the mixed powder taken out from the ball mill was filled in a carbon mold and hot-pressed.
- the conditions for hot pressing were a vacuum atmosphere, a heating rate of 300 ° C./hour, a holding temperature of 1200 ° C., and a holding time of 2 hours, and pressurization was performed at 30 MPa from the start of heating to the end of holding. After completion of the holding, it was naturally cooled in the chamber.
- hot isostatic pressing was performed on the sintered body taken out from the hot press mold.
- the conditions for hot isostatic pressing were a heating rate of 300 ° C./hour, a holding temperature of 1350 ° C., a holding time of 2 hours, and gradually increasing the Ar gas pressure from the start of heating to 1350 ° During C holding, the pressure was increased to 150 MPa. After completion of the holding, it was naturally cooled in the furnace.
- the sintered body thus produced was cut using a lathe to obtain a sputtering target.
- a sample for oxygen analysis was cut out from the sintered body, and the oxygen content was measured and found to be 560 wtppm. Further, when the sintered body was polished and its cross section was observed, a structure in which C particles were finely dispersed in the Fe—Pt alloy was observed.
- Example 2 Fe powder having an average particle diameter of 3 ⁇ m, Pt powder having an average particle diameter of 3 ⁇ m, Cu powder having an average particle diameter of 3 ⁇ m, and C powder having an average particle diameter of 1 ⁇ m were prepared as raw material powders. Commercially available amorphous carbon was used as C powder. These powders were weighed in the following atomic ratio so that the total weight would be 2380 g. Atomic ratio: (Fe 40 -Pt 45 -Cu 15 ) 55 -C 45
- the weighed powder was enclosed in a ball mill pot having a capacity of 10 liters together with zirconia balls as a grinding medium, and mixed and pulverized by rotating for 4 hours.
- the mixed powder taken out from the ball mill was heat treated.
- the heat treatment conditions were an Ar atmosphere (atmospheric pressure), a heating rate of 300 ° C./hour, a holding temperature of 800 ° C., and a holding time of 2 hours.
- the powder was taken out of the heat treatment furnace, enclosed in a ball mill pot with a capacity of 10 liters together with zirconia balls as a grinding medium, and pulverized by rotating for 4 hours.
- the pulverized powder was filled into a carbon mold and hot pressed.
- the hot pressing conditions were a vacuum atmosphere, a temperature rising rate of 300 ° C./hour, a holding temperature of 1200 ° C., and a holding time of 2 hours, and pressurization was performed at 30 MPa from the start of temperature rising to the end of holding. After completion of the holding, it was naturally cooled in the chamber.
- hot isostatic pressing was performed on the sintered body taken out from the hot press mold.
- the conditions for hot isostatic pressing were a heating rate of 300 ° C./hour, a holding temperature of 1350 ° C., a holding time of 2 hours, and gradually increasing the Ar gas pressure from the start of heating to 1350 ° During C holding, the pressure was increased to 150 MPa. After completion of the holding, it was naturally cooled in the furnace.
- the sintered body thus produced was cut using a lathe to obtain a sputtering target.
- a sample for oxygen analysis was cut out from the sintered body and the oxygen content was measured and found to be 210 wtppm. Further, when the sintered body was polished and its cross section was observed, a structure in which C particles were finely dispersed in the Fe—Pt—Cu alloy was observed.
- the weighed powder was enclosed in a ball mill pot with a capacity of 10 liters together with zirconia balls as a grinding medium, and mixed and pulverized by rotating for 4 hours.
- the mixed powder taken out from the ball mill was filled in a carbon mold and hot-pressed.
- the hot pressing conditions were a vacuum atmosphere, a temperature rising rate of 300 ° C./hour, a holding temperature of 1200 ° C., and a holding time of 2 hours, and pressurization was performed at 30 MPa from the start of temperature rising to the end of holding. After completion of the holding, it was naturally cooled in the chamber.
- hot isostatic pressing was performed on the sintered body taken out from the hot press mold.
- the conditions for hot isostatic pressing were a heating rate of 300 ° C./hour, a holding temperature of 1350 ° C., a holding time of 2 hours, and gradually increasing the Ar gas pressure from the start of heating to 1350 ° During C holding, the pressure was increased to 150 MPa. After completion of the holding, it was naturally cooled in the furnace.
- the sintered body thus produced was cut using a lathe to obtain a sputtering target.
- a sample for oxygen analysis was cut out from the sintered body, and the oxygen content was measured and found to be 540 wtppm. Further, when the sintered body was polished and its cross section was observed, a structure in which C particles were finely dispersed in the Fe—Pt—Cu alloy was observed.
- Example 3 Fe powder having an average particle diameter of 3 ⁇ m, Pt powder having an average particle diameter of 3 ⁇ m, Ag powder having an average particle diameter of 1 ⁇ m, and C powder having an average particle diameter of 1 ⁇ m were prepared as raw material powders. Commercially available amorphous carbon was used as C powder. These powders were weighed in the following atomic ratio so that the total weight was 2200 g. Atomic ratio: (Fe 42.5 -Pt 42.5 -Ag 15 ) 60 -C 40
- the weighed powder was enclosed in a ball mill pot having a capacity of 10 liters together with zirconia balls as a grinding medium, and mixed and pulverized by rotating for 4 hours.
- the mixed powder taken out from the ball mill was heat treated.
- the heat treatment conditions were an Ar atmosphere (atmospheric pressure), a temperature rising rate of 300 ° C./hour, a holding temperature of 850 ° C., and a holding time of 2 hours.
- the powder was taken out of the heat treatment furnace, enclosed in a ball mill pot with a capacity of 10 liters together with zirconia balls as a grinding medium, and pulverized by rotating for 4 hours.
- the pulverized powder was filled into a carbon mold and hot pressed.
- the hot press conditions were a vacuum atmosphere, a heating rate of 300 ° C./hour, a holding temperature of 900 ° C., and a holding time of 2 hours, and pressurization was performed at 30 MPa from the start of heating to the end of holding. After completion of the holding, it was naturally cooled in the chamber.
- hot isostatic pressing was performed on the sintered body taken out from the hot press mold.
- the conditions for hot isostatic pressing were a heating rate of 300 ° C./hour, a holding temperature of 900 ° C., a holding time of 2 hours, and gradually increasing the Ar gas pressure from the start of the heating to 900 ° C. During C holding, the pressure was increased to 150 MPa. After the holding, it was naturally cooled in the furnace.
- the sintered body thus produced was cut using a lathe to obtain a sputtering target.
- a sample for oxygen analysis was cut out from the sintered body, and the oxygen content was measured and found to be 270 wtppm. Further, when the sintered body was polished and its cross section was observed, a structure in which C particles were finely dispersed in a two-phase alloy of Fe—Pt and Ag was observed.
- the weighed powder was enclosed in a ball mill pot with a capacity of 10 liters together with zirconia balls as a grinding medium, and mixed and pulverized by rotating for 4 hours.
- the mixed powder taken out from the ball mill was filled in a carbon mold and hot-pressed.
- the hot press conditions were a vacuum atmosphere, a heating rate of 300 ° C./hour, a holding temperature of 900 ° C., and a holding time of 2 hours, and pressurization was performed at 30 MPa from the start of heating to the end of holding. After completion of the holding, it was naturally cooled in the chamber.
- hot isostatic pressing was performed on the sintered body taken out from the hot press mold.
- the conditions for hot isostatic pressing were a heating rate of 300 ° C./hour, a holding temperature of 900 ° C., a holding time of 2 hours, and gradually increasing the Ar gas pressure from the start of the heating to 900 ° C. During C holding, the pressure was increased to 150 MPa. After completion of the holding, it was naturally cooled in the furnace.
- the sintered body thus produced was cut using a lathe to obtain a sputtering target.
- a sample for oxygen analysis was cut out from the sintered body and the oxygen content was measured and found to be 810 wtppm. Further, when the sintered body was polished and its cross section was observed, a structure in which C particles were finely dispersed in a two-phase alloy of Fe—Pt and Ag was observed.
- the examples of the sputtering target of the present invention have a result that the oxygen content is 300 wtppm or less and the C particles have a finely dispersed structure.
- the present invention can be formed a granular magnetic structure magnetic film having a high corrosion resistance, furthermore, L1 0 structure to facilitate ordering of, C particles are finely dispersed, the oxygen content is 300wtppm or less of Fe It has an excellent effect of providing a —Pt—C based sputtering target. Therefore, the present invention is useful for manufacturing a magnetic recording medium having a granular structure magnetic film.
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Abstract
Description
FePtを超高密度記録媒体用材料として使用する場合には、L10構造のFePt磁性粒子を磁気的に孤立させた状態で、C軸を基板垂直方向にそろえて、出来るだけ高密度に分散させるという技術の開発が求められている。
母材合金中に非磁性材料が分散したスパッタリングターゲットは、一般に粉末焼結法により作製される。この場合、焼結の駆動力は焼結前の金属粉末の比表面積に大きく依存する。言い換えれば、粒径のより小さな金属粉末を用いれば、より高密度な焼結体が得られる。また、非磁性材料を母材合金中に微細に分散させるためには、粒径の小さな金属粉末中に同程度の粒径の非磁性材料粉末を高分散させた焼結用粉末を用意する必要がある。
1)原子数比における組成が式:(Fe100-X-PtX)100-ACA(但し、Aは20≦A≦50、Xは35≦X≦55を満たす数)で表される焼結体スパッタリングターゲットであって、母材合金中に微細分散したC粒子を有し、酸素含有量が300wtppm以下であることを特徴とするスパッタリングターゲット、
2)原子数比における組成が式:(Fe100-X-Y-PtX-MY)100-ACA(但し、MはFe、Pt以外の金属元素、Aは20≦A≦50、Xは35≦X≦55、Yは0.5≦Y≦15を満たす数)で表される焼結体スパッタリングターゲットであって、母材合金中に微細分散したC粒子を有し、酸素含有量が300wtppm以下であることを特徴とするスパッタリングターゲット、
3)金属元素Mは、Cu、Agのいずれかであることを特徴とする上記2)に記載のスパッタリングターゲット、
4)金属粉末とC粉末とを混合し、この混合粉末を不活性ガス雰囲気下又は真空雰囲気下で750℃以上1100℃以下の温度で熱処理し、得られた粉末を原料粉末の一部として焼結することを特徴とするスパッタリングターゲットの製造方法、
5)熱処理後の粉末を型に充填した後、20~50MPaの圧力で一軸加圧して成型・焼結し、その後、100~200MPaの圧力で熱間等方加圧して成型・焼結することを特徴とする上記4)記載のスパッタリングターゲットの製造方法、を提供する。
FeとPt以外の金属元素を添加することによって、成膜したグラニュラー構造磁性薄膜をL10構造にするときの熱処理温度を下げることができ、また、磁性薄膜の飽和磁化や保磁力を磁気記録媒体として最適な値に調整可能なため有効である。
また金属元素Mの含有量は、Fe-Pt-M合金組成中、好ましくは0.5原子数比以上15原子数比以下である。添加金属元素のFe-Pt-M合金中における含有量が、0.5原子数比未満であると、上述の効果が認められず、15原子数比超であると、十分な結晶磁気異方性が得られない場合があるからである。
本発明において熱処理の温度は重要である。金属粉末とC粉末との混合粉を750℃以上の温度で熱処理すると、一定量のCが金属に固溶し、冷却過程で金属に固溶しきれなくなったCが金属粉の表面を覆うように析出し、金属粉末の表面酸化が抑制されることが期待できる。一方、750℃以下の温度では、金属粉末とC粉末の反応が十分に進まないため好ましくない。また、1100℃以上の温度では、金属粉末が粒成長してしまう恐れがある。
ターゲットをスパッタしたときに発生するターゲットからの発塵を抑えるためにはターゲットの密度を向上させておくことが重要である。本発明においては、一軸加圧焼結装置で成型・焼結した焼結体に、さらに熱間等方加圧加工を施すことによって、より緻密な焼結体を作製することができる。ターゲットの密度を上げるためには、加圧力は装置の設定可能な圧力範囲内でできるだけ高くすることが望ましい。
さらに原料粉末として、合金粉末を用いてもよい。合金粉末を用いる場合も、粒径が0.5μm以上、10μm以下のものを用いることが望ましい。
そして得られた粉末をカーボン製の型に充填して、ホットプレスで成型・焼結する。ホットプレス以外にも、プラズマ放電焼結法を使用することもできる。焼結時の保持温度は、スパッタリングターゲットの組成にもよるが、多くの場合、850~1400°Cの温度範囲とする。また加圧力は20MPa以上、好ましくは20~50MPaに設定する。
このようにして得られた焼結体を旋盤で所望の形状に加工することにより、本発明のスパッタリングターゲットは作製できる。
原料粉末として平均粒径3μmのFe粉末、平均粒径3μmのPt粉末、平均粒径1μmのC粉末を用意した。C粉末は市販の無定形炭素を用いた。
これらの粉末を以下の原子数比で、合計重量が2600gとなるように秤量した。
原子数比:(Fe50-Pt50)60-C40
熱処理条件は、Ar雰囲気(大気圧)、昇温速度300°C/時間、保持温度900°C、保持時間2時間とした。自然冷却後に粉末を熱処理炉から取り出し、粉砕媒体のジルコニアボールと共に容量10リットルのボールミルポットに封入し、4時間回転させて解砕した。
そして、解砕された粉末をカーボン製の型に充填しホットプレスした。
次にホットプレスの型から取り出した焼結体に熱間等方加圧加工を施した。熱間等方加圧加工の条件は、昇温速度300°C/時間、保持温度1350°C、保持時間2時間とし、昇温開始時からArガスのガス圧を徐々に高めて、1350°C保持中は150MPaで加圧した。保持終了後は炉内でそのまま自然冷却させた。
原料粉末として平均粒径3μmのFe粉末、平均粒径3μmのPt粉末、平均粒径1μmのC粉末を用意した。C粉末は市販の無定形炭素を用いた。
これらの粉末を以下の原子数比で、合計重量が2600gとなるように秤量した。
原子数比:(Fe50-Pt50)60-C40
原料粉末として平均粒径3μmのFe粉末、平均粒径3μmのPt粉末、平均粒径3μmのCu粉末、平均粒径1μmのC粉末を用意した。C粉末は市販の無定形炭素を用いた。
これらの粉末を以下の原子数比で、合計重量が2380gとなるように秤量した。
原子数比:(Fe40-Pt45-Cu15)55-C45
熱処理条件は、Ar雰囲気(大気圧)、昇温速度300°C/時間、保持温度800°C、保持時間2時間とした。自然冷却後に粉末を熱処理炉から取り出し、粉砕媒体のジルコニアボールと共に容量10リットルのボールミルポットに封入し、4時間回転させて解砕した。
そして解砕された粉末をカーボン製の型に充填しホットプレスした。
次にホットプレスの型から取り出した焼結体に熱間等方加圧加工を施した。熱間等方加圧加工の条件は、昇温速度300°C/時間、保持温度1350°C、保持時間2時間とし、昇温開始時からArガスのガス圧を徐々に高めて、1350°C保持中は150MPaで加圧した。保持終了後は炉内でそのまま自然冷却させた。
原料粉末として平均粒径3μmのFe粉末、平均粒径3μmのPt粉末、平均粒径3μmのCu粉末、平均粒径1μmのC粉末を用意した。C粉末は市販の無定形炭素を用いた。
これらの粉末を以下の原子数比で、合計重量が2380gとなるように秤量した。
原子数比:(Fe40-Pt45-Cu15)55-C45
次にホットプレスの型から取り出した焼結体に熱間等方加圧加工を施した。熱間等方加圧加工の条件は、昇温速度300°C/時間、保持温度1350°C、保持時間2時間とし、昇温開始時からArガスのガス圧を徐々に高めて、1350°C保持中は150MPaで加圧した。保持終了後は炉内でそのまま自然冷却させた。
原料粉末として平均粒径3μmのFe粉末、平均粒径3μmのPt粉末、平均粒径1μmのAg粉末、平均粒径1μmのC粉末を用意した。C粉末は市販の無定形炭素を用いた。
これらの粉末を以下の原子数比で、合計重量が2200gとなるように秤量した。
原子数比:(Fe42.5-Pt42.5-Ag15)60-C40
熱処理条件は、Ar雰囲気(大気圧)、昇温速度300°C/時間、保持温度850°C、保持時間2時間とした。自然冷却後に粉末を熱処理炉から取り出し、粉砕媒体のジルコニアボールと共に容量10リットルのボールミルポットに封入し、4時間回転させて解砕した。
そして解砕された粉末をカーボン製の型に充填しホットプレスした。
次にホットプレスの型から取り出した焼結体に熱間等方加圧加工を施した。熱間等方加圧加工の条件は、昇温速度300°C/時間、保持温度900°C、保持時間2時間とし、昇温開始時からArガスのガス圧を徐々に高めて、900°C保持中は150MPaで加圧した。保持終了後は炉内でそのまま自然冷却させた。
原料粉末として平均粒径3μmのFe粉末、平均粒径3μmのPt粉末、平均粒径1μmのAg粉末、平均粒径1μmのC粉末を用意した。C粉末は市販の無定形炭素を用いた。
これらの粉末を以下の原子数比で、合計重量が2200gとなるように秤量した。
原子数比:(Fe42.5-Pt42.5-Ag15)60-C40
次にホットプレスの型から取り出した焼結体に熱間等方加圧加工を施した。熱間等方加圧加工の条件は、昇温速度300°C/時間、保持温度900°C、保持時間2時間とし、昇温開始時からArガスのガス圧を徐々に高めて、900°C保持中は150MPaで加圧した。保持終了後は炉内でそのまま自然冷却させた。
Claims (5)
- 原子数比における組成が式:(Fe100-X-PtX)100-ACA(但し、Aは20≦A≦50、Xは35≦X≦55を満たす数)で表される焼結体スパッタリングターゲットであって、母材合金中に微細分散したC粒子を有し、酸素含有量が300wtppm以下であることを特徴とするスパッタリングターゲット。
- 原子数比における組成が式:(Fe100-X-Y-PtX-MY)100-ACA(但し、MはFe、Pt以外の金属元素、Aは20≦A≦50、Xは35≦X≦55、Yは0.5≦Y≦15を満たす数)で表される焼結体スパッタリングターゲットであって、母材合金中に微細分散したC粒子を有し、酸素含有量が300wtppm以下であることを特徴とするスパッタリングターゲット。
- 金属元素Mは、Cu、Agのいずれかであることを特徴とする請求項2に記載のスパッタリングターゲット。
- 金属粉末とC粉末とを混合し、この混合粉末を不活性ガス雰囲気下又は真空雰囲気下で750℃以上1100℃以下の温度で熱処理し、得られた粉末を原料粉末の一部として焼結することを特徴とするスパッタリングターゲットの製造方法。
- 熱処理後の粉末を型に充填した後、20~50MPaの圧力で一軸加圧して成型・焼結し、その後、100~200MPaの圧力で熱間等方加圧して成型・焼結することを特徴とする請求項4記載のスパッタリングターゲットの製造方法。
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013175884A1 (ja) * | 2012-05-22 | 2013-11-28 | Jx日鉱日石金属株式会社 | C粒子が分散したFe-Pt-Ag-C系スパッタリングターゲット及びその製造方法 |
| WO2014171161A1 (ja) * | 2013-04-15 | 2014-10-23 | Jx日鉱日石金属株式会社 | スパッタリングターゲット |
| WO2014185266A1 (ja) * | 2013-05-13 | 2014-11-20 | Jx日鉱日石金属株式会社 | 磁性薄膜形成用スパッタリングターゲット |
| WO2015076190A1 (ja) * | 2013-11-22 | 2015-05-28 | Jx日鉱日石金属株式会社 | 磁気記録膜形成用スパッタリングターゲット及びその製造方法 |
| JP2023013901A (ja) * | 2021-07-15 | 2023-01-26 | 光洋應用材料科技股▲分▼有限公司 | Fe-Pt-Ag系ターゲット及びその製造方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103081009B (zh) | 2010-08-31 | 2016-05-18 | 吉坤日矿日石金属株式会社 | Fe-Pt型强磁性材料溅射靶 |
| CN103270554B (zh) | 2010-12-20 | 2016-09-28 | 吉坤日矿日石金属株式会社 | 分散有C粒子的Fe-Pt型溅射靶 |
| MY154754A (en) | 2011-03-30 | 2015-07-15 | Jx Nippon Mining & Metals Corp | Sputtering target for magnetic recording film |
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| MY169260A (en) | 2012-09-21 | 2019-03-20 | Jx Nippon Mining & Metals Corp | Fe-pt-based magnetic materials sintered compact |
| WO2014188916A1 (ja) * | 2013-05-20 | 2014-11-27 | Jx日鉱日石金属株式会社 | 磁性記録媒体用スパッタリングターゲット |
| JP6285043B2 (ja) | 2014-09-22 | 2018-03-07 | Jx金属株式会社 | 磁気記録膜形成用スパッタリングターゲット及びその製造方法 |
| JP6553755B2 (ja) | 2016-02-19 | 2019-07-31 | Jx金属株式会社 | 磁気記録媒体用スパッタリングターゲット及び磁性薄膜 |
| CN112349667B (zh) * | 2019-08-09 | 2024-11-08 | 昆山微电子技术研究院 | 一种石墨烯/铜复合金属互连线的制备方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63214342A (ja) * | 1987-03-02 | 1988-09-07 | Natl Res Inst For Metals | 化合物の製造方法 |
| JPH0610122A (ja) * | 1991-04-15 | 1994-01-18 | Hitachi Metals Ltd | 磁性薄膜用ターゲット材とその製造方法、Fe−M−C軟磁性膜とその製造方法、およびこれを用いた磁気ヘッドならびに磁気記録再生装置 |
| JP2003313659A (ja) * | 2002-04-22 | 2003-11-06 | Toshiba Corp | 記録媒体用スパッタリングターゲットと磁気記録媒体 |
| JP2004152471A (ja) * | 2002-10-29 | 2004-05-27 | Korea Advanced Inst Of Sci Technol | FePtC薄膜を利用した高密度磁気記録媒体及びその製造方法 |
| JP2005060789A (ja) * | 2003-08-18 | 2005-03-10 | Toshiba Corp | 酸化膜形成用スパッタリングターゲットとそれを用いた酸化膜の製造方法 |
| JP2006161082A (ja) * | 2004-12-03 | 2006-06-22 | Ishifuku Metal Ind Co Ltd | スパッタリングターゲットの製造方法 |
| JP2006169547A (ja) * | 2004-12-13 | 2006-06-29 | Hitachi Metals Ltd | 加圧焼結用のMo合金粉末の製造方法およびスパッタリング用ターゲット材の製造方法 |
| WO2012086335A1 (ja) * | 2010-12-20 | 2012-06-28 | Jx日鉱日石金属株式会社 | C粒子が分散したFe-Pt系スパッタリングターゲット |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3943351B2 (ja) * | 2001-07-18 | 2007-07-11 | 日鉱金属株式会社 | 高純度Co−Fe合金スパッタリングターゲット及び同スパッタリングターゲットを用いて形成した磁性薄膜並びに高純度Co−Fe合金スパッタリングターゲットの製造方法 |
| US6759005B2 (en) * | 2002-07-23 | 2004-07-06 | Heraeus, Inc. | Fabrication of B/C/N/O/Si doped sputtering targets |
| JP5112431B2 (ja) * | 2007-06-11 | 2013-01-09 | パナソニック株式会社 | 情報記録媒体とその製造方法、およびターゲット |
| CN102652184B (zh) * | 2009-12-11 | 2014-08-06 | 吉坤日矿日石金属株式会社 | 磁性材料溅射靶 |
| CN101717922A (zh) * | 2009-12-23 | 2010-06-02 | 天津大学 | 掺氮细化薄膜中有序化面心四方结构铁铂颗粒尺寸的方法 |
-
2012
- 2012-07-20 US US14/118,792 patent/US20140083847A1/en not_active Abandoned
- 2012-07-20 JP JP2013515619A patent/JP5301751B1/ja active Active
- 2012-07-20 CN CN201280021182.XA patent/CN103717781B/zh active Active
- 2012-07-20 WO PCT/JP2012/068411 patent/WO2013046882A1/ja not_active Ceased
- 2012-07-20 MY MYPI2013004640A patent/MY161774A/en unknown
- 2012-07-24 TW TW101126600A patent/TWI550114B/zh active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63214342A (ja) * | 1987-03-02 | 1988-09-07 | Natl Res Inst For Metals | 化合物の製造方法 |
| JPH0610122A (ja) * | 1991-04-15 | 1994-01-18 | Hitachi Metals Ltd | 磁性薄膜用ターゲット材とその製造方法、Fe−M−C軟磁性膜とその製造方法、およびこれを用いた磁気ヘッドならびに磁気記録再生装置 |
| JP2003313659A (ja) * | 2002-04-22 | 2003-11-06 | Toshiba Corp | 記録媒体用スパッタリングターゲットと磁気記録媒体 |
| JP2004152471A (ja) * | 2002-10-29 | 2004-05-27 | Korea Advanced Inst Of Sci Technol | FePtC薄膜を利用した高密度磁気記録媒体及びその製造方法 |
| JP2005060789A (ja) * | 2003-08-18 | 2005-03-10 | Toshiba Corp | 酸化膜形成用スパッタリングターゲットとそれを用いた酸化膜の製造方法 |
| JP2006161082A (ja) * | 2004-12-03 | 2006-06-22 | Ishifuku Metal Ind Co Ltd | スパッタリングターゲットの製造方法 |
| JP2006169547A (ja) * | 2004-12-13 | 2006-06-29 | Hitachi Metals Ltd | 加圧焼結用のMo合金粉末の製造方法およびスパッタリング用ターゲット材の製造方法 |
| WO2012086335A1 (ja) * | 2010-12-20 | 2012-06-28 | Jx日鉱日石金属株式会社 | C粒子が分散したFe-Pt系スパッタリングターゲット |
Non-Patent Citations (2)
| Title |
|---|
| LI ZHANG ET AL.: "L10-ordered high coercivity (FePt)Ag-C granular thin films for perpendicular recording", JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, vol. 322, 2010, pages 2658 - 2664, XP027068619, DOI: doi:10.1016/j.jmmm.2010.04.003 * |
| W.B. MI ET AL.: "Characterization of Cu additive FePt-C granular films", APPLIED SURFACE SCIENCE, vol. 252, 2006, pages 8688 - 8694, XP024893811, DOI: doi:10.1016/j.apsusc.2005.12.006 * |
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| WO2013175884A1 (ja) * | 2012-05-22 | 2013-11-28 | Jx日鉱日石金属株式会社 | C粒子が分散したFe-Pt-Ag-C系スパッタリングターゲット及びその製造方法 |
| WO2014171161A1 (ja) * | 2013-04-15 | 2014-10-23 | Jx日鉱日石金属株式会社 | スパッタリングターゲット |
| JP5944580B2 (ja) * | 2013-04-15 | 2016-07-05 | Jx金属株式会社 | スパッタリングターゲット |
| WO2014185266A1 (ja) * | 2013-05-13 | 2014-11-20 | Jx日鉱日石金属株式会社 | 磁性薄膜形成用スパッタリングターゲット |
| JP5969120B2 (ja) * | 2013-05-13 | 2016-08-17 | Jx金属株式会社 | 磁性薄膜形成用スパッタリングターゲット |
| WO2015076190A1 (ja) * | 2013-11-22 | 2015-05-28 | Jx日鉱日石金属株式会社 | 磁気記録膜形成用スパッタリングターゲット及びその製造方法 |
| JPWO2015076190A1 (ja) * | 2013-11-22 | 2017-03-16 | Jx金属株式会社 | 磁気記録膜形成用スパッタリングターゲット及びその製造方法 |
| JP2017197840A (ja) * | 2013-11-22 | 2017-11-02 | Jx金属株式会社 | 磁気記録膜形成用スパッタリングターゲット及びその製造方法 |
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| CN109943814A (zh) * | 2013-11-22 | 2019-06-28 | 捷客斯金属株式会社 | 磁记录膜形成用溅射靶及其制造方法 |
| JP2023013901A (ja) * | 2021-07-15 | 2023-01-26 | 光洋應用材料科技股▲分▼有限公司 | Fe-Pt-Ag系ターゲット及びその製造方法 |
| JP7245303B2 (ja) | 2021-07-15 | 2023-03-23 | 光洋應用材料科技股▲分▼有限公司 | Fe-Pt-Ag系ターゲット及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103717781B (zh) | 2016-02-24 |
| US20140083847A1 (en) | 2014-03-27 |
| JP5301751B1 (ja) | 2013-09-25 |
| JPWO2013046882A1 (ja) | 2015-03-26 |
| TW201313934A (zh) | 2013-04-01 |
| TWI550114B (zh) | 2016-09-21 |
| CN103717781A (zh) | 2014-04-09 |
| MY161774A (en) | 2017-05-15 |
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