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WO2012126776A1 - Composant électrique multicouche - Google Patents

Composant électrique multicouche Download PDF

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Publication number
WO2012126776A1
WO2012126776A1 PCT/EP2012/054393 EP2012054393W WO2012126776A1 WO 2012126776 A1 WO2012126776 A1 WO 2012126776A1 EP 2012054393 W EP2012054393 W EP 2012054393W WO 2012126776 A1 WO2012126776 A1 WO 2012126776A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
internal electrode
stacking direction
stack
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/054393
Other languages
German (de)
English (en)
Inventor
Johann Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of WO2012126776A1 publication Critical patent/WO2012126776A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/146—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the resistive element surrounding the terminal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • An electrical multilayer component with a stack of functional layers and internal electrodes arranged between them is specified.
  • external contacts may be attached to the side surfaces of the stack.
  • Such an electrical multilayer component can be designed, for example, as a multilayer resistance component, as a multilayer varistor or as a multilayer capacitor.
  • Multi-layer component in particular an interior and
  • Multi-layer component to specify, which has improved properties compared to known multilayer devices.
  • the electrical properties of multilayer components are, in addition to several other factors in particular also dependent on the geometric arrangement of the internal electrodes.
  • the thickness of the functional layers of a multilayer component such as the thickness of the dielectric
  • the variations in thickness of the functional layers affect the electrical values of the multilayer component, such as the capacitance of a multilayer capacitor or the resistance of a multilayer resistor component, such as a PTC or NTC device.
  • the electrical values of multilayer components by the production-related thickness variations of the functional layers do not deviate too much from a predetermined setpoint, that is, to avoid correspondingly wide tolerance bands, for example, films that later the functional layers of the make finished component, preselected.
  • a subsequent manufacturing processes a subsequent
  • the electrical values of a component can also be subsequently adjusted by a so-called adjustment, for example by removing parts of the multilayer component by path grinding or trimming.
  • a combination of the abovementioned possibilities of eliminating or at least reducing the disadvantages associated with the production-related thickness fluctuations of the functional layers is also customary for known production methods.
  • the inventors have found that the electrical values of a multilayer component, such as the resistance and / or the capacity of a Dahlbauele ⁇ ments, by a described herein inner electrode arrangement largely independent of thickness variations of the
  • the multilayer electrical component has a stack with functional layers and at least one first and one second inner electrode.
  • the functional layers can be dielectric
  • Capacitor designed as a varistor or as a thermistor. By their respective characteristics determine the
  • layer planes of the multilayer component are determined along the
  • Stacking direction of the functional layers are arranged one above the other.
  • the internal electrodes are in such
  • the first one is
  • Inner electrode having a first outer contact, which is arranged on a side surface of the stack, directly electrically conductively connected.
  • the second inner electrode is directly electrically conductive with a second outer contact, which is also arranged on a side surface of the stack
  • Contacting the internal electrodes serve, arranged on side surfaces of the stack.
  • the internal electrodes serve, arranged on side surfaces of the stack.
  • External contact arranged on a side surface of the stack, so extends an electrically connected directly to the external contact inner electrode up to this side surface.
  • the first and second inner electrodes have the same electrode length E.
  • electrode length E denotes the lateral extent of the first or the second inner electrode perpendicular to the layer stacking direction of the stack in the direction from the first to the second inner electrode.
  • Inner electrode in the layer stacking direction on a distance H may mean, in particular, that the first and the second inner electrodes are arranged in two different layer planes perpendicular to the layer stacking direction of the stack, wherein the two layer planes are at a distance H from each other
  • Total thickness H have. Furthermore, the first and second inner electrodes are directly adjacent to each other. In other words, the functional layer or the plurality of functional layers disposed between the first and second inner electrodes and directly adjacent to the first and second inner electrodes is free of others
  • the stack has a stack length B in the direction from the first to the second inner electrode perpendicular to the layer stacking direction.
  • Stapling length B is here the spatial extent of the stack perpendicular to the stacking direction of the stack and in
  • the staple length B is preferably limited by two opposite side surfaces of the stack.
  • Electrode length ß ' the aspect ratio a of a minimum aspect ratio and a maximum
  • Multilayer component can be achieved.
  • the first one is
  • the first inner electrode thus has no subregion, which in a mental Projection in layer stacking direction covers a portion of the second inner electrode.
  • the first inner electrode partially overlaps with the second inner electrode.
  • the first inner electrode has at least one partial region, which can be brought into coincidence with at least one partial region of the second inner electrode in the case of a mental projection in the layer stacking direction.
  • Multi-layer component at least one further first and / or second inner electrode.
  • the at least one further first and / or second inner electrode has the electrode length E in this case. With electrode length E, the spatial extent of an inner electrode in the direction from the first to the second inner electrode is again perpendicular to
  • first and second internal electrodes of the device are in
  • Inner electrode has a distance H in each case to an inner electrode closest to the layer stacking direction
  • each first inner electrode has to each its directly adjacent second
  • Inner electrode as well as every other inner electrode to each their directly adjacent first inner electrode, a distance H in the layer stacking direction.
  • all internal electrodes of the component are in different functional
  • all internal electrodes of the multilayer component have the same
  • Electrode width on.
  • Electrode length E designated. According to another
  • all internal electrodes have the same electrode surface.
  • the multilayer component has a stack with functional layers and at least two free internal electrodes as well as a first and a second external contact.
  • the free internal electrodes are not directly electrically conductively connected to either the first or the second external contact, which are arranged on side surfaces of the stack.
  • the free internal electrodes thus do not extend as far as the external contacts, but are arranged along their plane of extent adjacent to the external contacts in the interior of the stack.
  • Each free inner electrode of the multilayer component has a same electrode length 2E.
  • each one is free
  • each free inner electrode has one
  • each free inner electrode could be mentally divided into two equal parts of equal area and length E by means of a line, this line passing through the center of the free inner electrode.
  • the distance is a first distance
  • the distance H, the distance B 'and the electrode length E define a
  • the multilayer electrical component has at least one further inner electrode, which is directly electrically conductively connected to the first or the second external contact.
  • the further inner electrode preferably has a distance H in the layer stacking direction for each free inner electrode closest to the layer stacking direction.
  • the electrical circuit is configured to: According to one disclosed embodiment, the electrical circuit is configured to:
  • Multilayer device on two further internal electrodes, wherein one of the two further internal electrodes with the first
  • External contact is electrically connected directly and the another of the two further internal electrodes is directly electrically conductively connected to the second external contact.
  • each furthermore
  • Inner electrode has a length F in the direction of the electrode length E perpendicular to the layer stacking direction.
  • F the length of the electrode length E perpendicular to the layer stacking direction.
  • the multilayer electrical component has a stack with functional layers and a first inner electrode connected to a first
  • first inner electrode and the second inner electrode each have an electrode length E.
  • the free inner electrode has a
  • Electrode length 2E on According to a further disclosed embodiment, the free
  • first and the second inner electrodes can be applied to the same functional layer of the stack and thus be arranged in the same plane or layer plane.
  • first and the second inner electrode can also be arranged in different planes, each one to the free inner electrode Have distance H in the layer stacking direction.
  • Inner electrode may be arranged centrally in the stack, that is, it has in each case an equal distance to opposite side surfaces of the stack.
  • the free inner electrode has a center, wherein the distance of the center of the free
  • the electrical multilayer component has a resistor and / or a
  • the electrical multilayer component is constructed axially symmetrical.
  • the multilayer component For example, the multilayer component
  • the electrical multilayer component is constructed point-symmetrical.
  • the device is point symmetrical with respect to a center of the device, each to
  • the electrical multilayer component is designed as a thermistor device.
  • a thermistor device This may be, for example, an NTC thermistor or a PTC thermistor.
  • the electrical multilayer component is designed as a varistor.
  • the electrical multilayer component is designed as a capacitor.
  • FIGS. 1 to 5 cross sections of various embodiments of multilayer components described here;
  • Figure 6 is a diagram illustrating the resistor described herein
  • FIG. 7 is a graph showing the aspect ratio a in FIG.
  • FIG. 8 shows a diagram which shows the resistance or the capacitance of a multilayer component in FIG. 8
  • Figure 1 shows a cross section of an electrical
  • Multilayer device 1 which has a stack 8 with functional layers 2, which are arranged one above the other in a stacking direction S. Furthermore, the multilayer component 1 has a first one
  • Internal electrodes 5 and a second inner electrode 6, which are arranged in layer planes of the multilayer component 1 are, wherein the layer planes are determined by the interfaces of adjacent functional layers 2.
  • sintering for example, a monolithic body as shown in FIG. 1 is formed in which the
  • the side surfaces 91, 92 are, as shown in Figure 1, opposite side surfaces.
  • the side surfaces may, for example, be adjoining side surfaces of the stack 8.
  • the outer contacts 3, 4 cover in the embodiment shown in each case an entire side surface 91, 92 of the stack eighth
  • Cover portions of the side surfaces of the stack 8 or be designed as a cap-shaped outer contacts, which are arranged across edges on several side surfaces of the stack 8.
  • Such cap-shaped external contacts are, for example, by immersing the stack 8 in a
  • the multilayer component 1 has a first internal electrode 5, which is directly electrically conductively connected to the first external contact 3, and a second internal electrode 5
  • Inner electrode 6, which is directly electrically conductively connected to the second external contact 4, on.
  • the first and second inner electrodes 5, 6 both have a same electrode length E. Furthermore, the first inner electrode 5 to the second inner electrode 6 in the layer stacking direction at a distance H. The first inner electrode 5 and the second inner electrode 6 are directly adjacent to each other. This means in particular that the functional layer 2 or alternatively also the plurality of functional layers 2, which is arranged between the first and second inner electrode 5, 6, and in direct contact with the first and second
  • Inner electrode 5, 6 is free of further internal electrodes.
  • the stack 8 has a stack length B in the direction from the first to the second inner electrode perpendicular to the layer stacking direction.
  • FIG. 8 shows a diagram which qualitatively shows the electrical conductance 1 / R or the capacitance C of such a multilayer component as a function of the layer thickness d of the functional layers.
  • the curve A corresponds to the typical conductance relationship or capacitance profile in known multilayer components whose internal electrodes are arranged in the so-called gap design 501, that is to say their internal electrodes
  • Gap design forms an electric field or a current flow in
  • Curve B shows the typical conductance or capacitance profile of known multilayer components whose internal electrodes are arranged in a so-called "overlap design" 502 or "T-design” 503.
  • overlap design alternating inner electrodes alternately overlap in the layer stacking direction.
  • An electric field or current flow is formed in the overlapping design substantially in the stacking direction, that is, perpendicular to the internal electrodes.
  • the T design essentially represents a series connection of two overlap designs. The capacitance or the conductance of such components decreases approximately indirectly proportionally with increasing layer thickness.
  • Thickness variations of the functional layers is what especially with respect to the above-mentioned range for the aspect ratio a.
  • FIG. 6 shows a diagram in which the resistance R of a component for different relative electrode lengths / depending on the aspect ratio a is shown.
  • the various resistance curves each have a more or less wide flat area. In this area, the device is relatively insensitive to
  • Thickness variations of the functional layers that is, in this area, the resistance of the device changes only slightly with varying thickness of the functional layers.
  • Electrode length 1 is shown. Mathematically, the
  • the multilayer component 1 shown in FIG. 1 shows the multilayer component described here in its simplest form, so to speak as a type of basic element. All other components shown below build on this simplest form and are formed by an array of basic elements.
  • FIG. 2 shows a cross-section of a multilayer component 1 according to a further exemplary embodiment, in which
  • first and second internal electrodes 5, 6 are present.
  • the multilayer component 1 thus has a plurality of first internal electrodes 5 and a plurality of second internal electrodes 6.
  • the first and second Internal electrodes 5, 6 all have a same electrode length E. All first internal electrodes are arranged congruently one above the other in the layer stacking direction, ie they have no offset to one another in the layer plane. Likewise, all second internal electrodes are arranged congruently one above the other.
  • each inner electrode in each case to an in
  • the first inner electrodes 5 are arranged without overlapping of the second inner electrodes 6.
  • the first internal electrodes may also be connected to the second internal electrodes
  • the first and second internal electrodes 5, 6 are all arranged in different layers 2 of the stack 8.
  • all first and all second internal electrodes 5, 6 have a same electrode width.
  • all internal electrodes have an equal area.
  • the multilayer component shown in FIG. 2 is replaced by a multiple arrangement or repetition of the component from FIG. 1 in the vertical direction, that is to say in FIG. 2
  • Figure 3 shows a cross section of an electrical
  • Multilayer component 1 with a first inner electrode 5, which is connected directly electrically conductively connected to a first outer contact 3 and with a second inner electrode 6, which is directly electrically conductively connected to a second outer contact 4. Furthermore, the electrical multilayer ⁇ component 1 has a free inner electrode 7, which neither with the first external contact 3 nor with the second external contact. 4 is electrically connected directly.
  • the free inner electrode 7 has a length 2E.
  • the first and second inner electrodes 5, 6 each have one
  • the first inner electrode 5 and the second inner electrode 6 are arranged in a same layer of the stack 8.
  • the free inner electrode 7 has both the first
  • Inner electrode 5 and the second inner electrode 6 in the layer stacking direction S a distance H.
  • the distance of the midpoint M of the free inner electrode 7 to the side surface 91 of the stack 8, at which the first outer contact 3 directly contacts the first inner electrode 5, and to the side surface 92 of the stack 8, where the second outer contact 4 directly contacts the second inner electrode 6, is each B ".
  • the multilayer component 1 shown in FIG. 3 is replaced by a double repetition or series connection of the internal electrode arrangement of the component from FIG. 1 in the horizontal direction, that is to say perpendicular to FIG
  • Inner electrode to the second inner electrode formed.
  • FIG. 4 shows an electrical multilayer component 1 according to a further exemplary embodiment, which has a first internal electrode 5 which is directly electrically conductively connected to a first external contact 3 Inner electrode 6, which is directly electrically conductively connected to a second external contact 4, and two free
  • the two free inner electrodes 7 each have a same electrode length 2E and a center M, wherein the distance between the respective centers M of the two adjacent in the layer stacking direction free
  • the two free inner electrodes 7 furthermore have a distance H from one another in the direction of the stacking direction S.
  • the first and the second inner electrode 5, 6 each have a distance H in the layer stacking direction S relative to the free inner electrode lying closest in the layer stacking direction S.
  • the first inner electrode 5 and the second inner electrode 6 also each have a length F in the direction of
  • Electrode length E perpendicular to the layer stacking direction S on which is greater than or equal to E.
  • the component 1 shown in FIG. 4 can theoretically be replaced by a multiple horizontal arrangement or
  • FIG. 5 shows an electrical multilayer component 1 according to a further exemplary embodiment, which has a multiplicity of free internal electrodes 7.
  • the multilayer component 1 has a plurality of free ones
  • Internal electrodes have an equal electrode length 2E.
  • the free internal electrodes 7, which are arranged one above the other in the layer stacking direction S, are arranged congruently one above the other, i. they have no offset to each other in the direction of the layer planes.
  • the multilayer electrical component 1 has a plurality of first internal electrodes 5, which are connected to a first
  • External contact are electrically connected directly, and a plurality of second internal electrodes 6, which are connected to a second
  • External contact 4 are electrically connected directly on.
  • Each free inner electrode 7 has a center M, wherein the respective centers M of two directly in
  • Each free inner electrode 7 has a distance H in the layer stacking direction S for each free inner electrode 7 closest to the layer stacking direction S.
  • each first and every second inner electrode 5, 6 has a distance H in the layer stacking direction S for each free inner electrode 7 closest to the layer stacking direction S.
  • Aspect ratio a is between a minimum aspect ratio a min and d a maximum aspect ratio, ie
  • the multi-layer component 1 shown in FIG. 5 can be thought of by a repeated arrangement of basic elements from FIG. 1 in horizontal as well as vertical
  • the length F of the first and second internal electrodes which is greater than or equal to E, that is to say in particular does not have to be equal to E, plays a role
  • the invention is not limited to this by the description with reference to the embodiments, but includes each new feature and any combination of features. This includes in particular any combination of features in the claims, even if this feature or these

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

L'invention concerne un composant électrique multicouche (1) qui comprend un empilement (8) de longueur B de couches fonctionnelles (2) et au moins une première et une deuxième électrode interne (5,6). La première et la deuxième électrode interne (5,6) sont chacune reliées de manière électroconductrice directement avec un contact externe sur une face latérale (91,92) de l'empilement (8) et elles présentent une même longueur d'électrode E dans la direction allant de la première à la deuxième électrode interne, perpendiculairement à la direction d'empilement des couches (S). La première électrode interne (5) présente un espacement H par rapport à la deuxième électrode interne (6) dans la direction d'empilement des couches. En outre, la première et la deuxième électrode interne (5,6) sont en voisinage mutuel direct. L'espacement H, la longueur d'empilement B et la longueur d'électrode E définissent un facteur de forme a = H/B et une longueur d'électrode relative I = E/B, amin≤a≤a max sachant que amin = 20.e -11.I et amax = 150.e -9.I
PCT/EP2012/054393 2011-03-24 2012-03-13 Composant électrique multicouche Ceased WO2012126776A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201110014967 DE102011014967B4 (de) 2011-03-24 2011-03-24 Elektrisches Vielschichtbauelement
DE102011014967.8 2011-03-24

Publications (1)

Publication Number Publication Date
WO2012126776A1 true WO2012126776A1 (fr) 2012-09-27

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PCT/EP2012/054393 Ceased WO2012126776A1 (fr) 2011-03-24 2012-03-13 Composant électrique multicouche

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DE (1) DE102011014967B4 (fr)
TW (1) TWI562174B (fr)
WO (1) WO2012126776A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014107450A1 (de) 2014-05-27 2015-12-03 Epcos Ag Elektronisches Bauelement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346871B1 (en) * 1998-01-09 2002-02-12 Tdk Corporation Laminate type varistor
US20080084651A1 (en) * 2005-06-03 2008-04-10 Murata Manufacturing Co., Ltd. Laminated ceramic capacitor
WO2012031963A2 (fr) * 2010-09-09 2012-03-15 Epcos Ag Composant résistance et procédé de fabrication d'un composant résistance

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2976046B2 (ja) * 1991-06-27 1999-11-10 株式会社村田製作所 チップバリスタ
JP3060966B2 (ja) * 1996-10-09 2000-07-10 株式会社村田製作所 チップ型サーミスタおよびその製造方法
JPH10335114A (ja) * 1997-04-04 1998-12-18 Murata Mfg Co Ltd サーミスタ素子
JP3233090B2 (ja) * 1998-02-06 2001-11-26 株式会社村田製作所 高圧用積層コンデンサ
JP3498211B2 (ja) * 1999-12-10 2004-02-16 株式会社村田製作所 積層型半導体セラミック電子部品
JP2008311362A (ja) * 2007-06-13 2008-12-25 Tdk Corp セラミック電子部品
KR101053329B1 (ko) * 2009-07-09 2011-08-01 삼성전기주식회사 세라믹 전자부품

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346871B1 (en) * 1998-01-09 2002-02-12 Tdk Corporation Laminate type varistor
US20080084651A1 (en) * 2005-06-03 2008-04-10 Murata Manufacturing Co., Ltd. Laminated ceramic capacitor
WO2012031963A2 (fr) * 2010-09-09 2012-03-15 Epcos Ag Composant résistance et procédé de fabrication d'un composant résistance

Also Published As

Publication number Publication date
TW201250723A (en) 2012-12-16
TWI562174B (en) 2016-12-11
DE102011014967B4 (de) 2015-04-16
DE102011014967A1 (de) 2012-09-27

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