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WO2012101080A3 - Optical arrangement for an euv projection exposure apparatus and method for cooling an optical component - Google Patents

Optical arrangement for an euv projection exposure apparatus and method for cooling an optical component Download PDF

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Publication number
WO2012101080A3
WO2012101080A3 PCT/EP2012/050946 EP2012050946W WO2012101080A3 WO 2012101080 A3 WO2012101080 A3 WO 2012101080A3 EP 2012050946 W EP2012050946 W EP 2012050946W WO 2012101080 A3 WO2012101080 A3 WO 2012101080A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
exposure apparatus
optical
projection exposure
optical component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/050946
Other languages
French (fr)
Other versions
WO2012101080A2 (en
Inventor
Willi Anderl
Holger Kierey
Markus Bauer
Severin Waldis
András G. MAJOR
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss Laser Optics GmbH
Original Assignee
Carl Zeiss Laser Optics GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Laser Optics GmbH filed Critical Carl Zeiss Laser Optics GmbH
Publication of WO2012101080A2 publication Critical patent/WO2012101080A2/en
Publication of WO2012101080A3 publication Critical patent/WO2012101080A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0808—Mirrors having a single reflecting layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0891—Ultraviolet [UV] mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/10—Mirrors with curved faces
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
    • G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
    • G21K1/062—Devices having a multilayer structure
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
    • G21K2201/00—Arrangements for handling radiation or particles
    • G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
    • G21K2201/065—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements provided with cooling means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

An optical arrangement (80) for an EUV projection exposure apparatus comprises an optical component (82), which has a substrate (84) and a surface (86) on a side of the substrate (84) which surface is optically operative in the EUV spectral range, and a cooling device (90) for the optical component (82), said cooling device having a cooling medium (94). The substrate (84) comprises a material having at a temperature Ts << 0°C a thermal conductivity of > 50 W-1K-1 and a coefficient of thermal expansion of < 3 * 10-6 K-1, and the cooling medium (94) has a temperature of << 0°C in order to cool the substrate (84) to the temperature Ts.
PCT/EP2012/050946 2011-01-28 2012-01-23 Optical arrangement for an euv projection exposure apparatus and method for cooling an optical component Ceased WO2012101080A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161437044P 2011-01-28 2011-01-28
US61/437,044 2011-01-28
DE201110010462 DE102011010462A1 (en) 2011-01-28 2011-01-28 Optical arrangement for an EUV projection exposure apparatus and method for cooling an optical component
DE102011010462.3 2011-01-28

Publications (2)

Publication Number Publication Date
WO2012101080A2 WO2012101080A2 (en) 2012-08-02
WO2012101080A3 true WO2012101080A3 (en) 2012-11-01

Family

ID=46511461

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/050946 Ceased WO2012101080A2 (en) 2011-01-28 2012-01-23 Optical arrangement for an euv projection exposure apparatus and method for cooling an optical component

Country Status (2)

Country Link
DE (1) DE102011010462A1 (en)
WO (1) WO2012101080A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012213671A1 (en) 2012-08-02 2014-02-06 Carl Zeiss Smt Gmbh Mirror arrangement for an EUV lithography system and method for producing the same
DE102012219543A1 (en) * 2012-10-25 2013-11-07 Carl Zeiss Smt Gmbh Arrangement structure for extreme UV (EUV) projection exposure system, has gas flow supply unit that is provided to supply flow of gas through optic element, such that heat exchange takes place between optic element and flow of gas
DE102013205214B4 (en) * 2013-03-25 2016-02-11 Carl Zeiss Smt Gmbh Micromechanical or microelectromechanical device for a projection exposure apparatus and method for operating such a device
DE102014203144A1 (en) * 2014-02-21 2015-08-27 Carl Zeiss Smt Gmbh Assembly of an optical system, in particular in a microlithographic projection exposure apparatus
DE102014203461A1 (en) * 2014-02-26 2015-03-05 Carl Zeiss Smt Gmbh COOLABLE MIRROR ARRANGEMENT
DE102014206587A1 (en) * 2014-04-04 2015-04-30 Carl Zeiss Smt Gmbh OPTICAL ELEMENT, PROJECTION ARRANGEMENT, AND METHOD FOR PRODUCING AN OPTICAL ELEMENT
DE102015212859A1 (en) * 2015-07-09 2016-07-07 Carl Zeiss Smt Gmbh Lithography plant and method
DE102016206202A1 (en) * 2016-04-13 2017-05-18 Carl Zeiss Smt Gmbh Optical assembly with a rinsing device and optical arrangement with it
CN111940911A (en) * 2020-08-31 2020-11-17 苏州麦尔科唯激光机器人有限公司 Optical head device for universal deburring

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0469744A1 (en) * 1990-07-30 1992-02-05 Canon Kabushiki Kaisha Wafer cooling device
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JPH0854499A (en) * 1994-08-10 1996-02-27 Nkk Corp X-ray optical element cooling device
US6359678B1 (en) * 1997-11-14 2002-03-19 Nikon Corporation Exposure apparatus, method for producing the same, and exposure method
US6377655B1 (en) * 1998-05-08 2002-04-23 Nikon Corporation Reflective mirror for soft x-ray exposure apparatus
US20040051984A1 (en) * 2002-06-25 2004-03-18 Nikon Corporation Devices and methods for cooling optical elements in optical systems, including optical systems used in vacuum environments
JP2005064391A (en) * 2003-08-19 2005-03-10 Canon Inc Optical member cooling method, cooling apparatus, exposure apparatus, and device manufacturing method
WO2010015511A1 (en) * 2008-08-08 2010-02-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2010037476A2 (en) * 2008-09-30 2010-04-08 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus
US20110075118A1 (en) * 2009-09-28 2011-03-31 Asml Netherlands B.V. Heat pipe, lithographic apparatus and device manufacturing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2802311B1 (en) * 1999-12-08 2002-01-18 Commissariat Energie Atomique LITHOGRAPHY DEVICE USING A RADIATION SOURCE IN THE EXTREME ULTRAVIOLET AREA AND MULTI-LAYER SPECTRAL BAND MIRRORS IN THIS AREA
US20050099611A1 (en) 2002-06-20 2005-05-12 Nikon Corporation Minimizing thermal distortion effects on EUV mirror
US6822251B1 (en) 2003-11-10 2004-11-23 University Of Central Florida Research Foundation Monolithic silicon EUV collector
JP2005175187A (en) 2003-12-11 2005-06-30 Canon Inc Optical member, cooling method, cooling apparatus, exposure apparatus, device manufacturing method, and device
US7483223B2 (en) 2004-05-06 2009-01-27 Carl Zeiss Smt Ag Optical component having an improved transient thermal behavior and method for improving the transient thermal behavior of an optical component
DE102005017262B3 (en) 2005-04-12 2006-10-12 Xtreme Technologies Gmbh Collector mirror for plasma-based short-wave radiation sources
US7470916B2 (en) 2005-10-19 2008-12-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and radiation collector
DE102005053415A1 (en) 2005-11-04 2007-05-10 Carl Zeiss Laser Optics Gmbh Optical component with improved thermal behavior
DE102008017888A1 (en) * 2007-06-27 2009-01-02 Carl Zeiss Smt Ag Optical arrangement for extreme UV lithography device, has reflective optical elements including particular operating temperature, where optical characteristics of arrangement are optimized for operation

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0469744A1 (en) * 1990-07-30 1992-02-05 Canon Kabushiki Kaisha Wafer cooling device
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JPH0854499A (en) * 1994-08-10 1996-02-27 Nkk Corp X-ray optical element cooling device
US6359678B1 (en) * 1997-11-14 2002-03-19 Nikon Corporation Exposure apparatus, method for producing the same, and exposure method
US6377655B1 (en) * 1998-05-08 2002-04-23 Nikon Corporation Reflective mirror for soft x-ray exposure apparatus
US20040051984A1 (en) * 2002-06-25 2004-03-18 Nikon Corporation Devices and methods for cooling optical elements in optical systems, including optical systems used in vacuum environments
JP2005064391A (en) * 2003-08-19 2005-03-10 Canon Inc Optical member cooling method, cooling apparatus, exposure apparatus, and device manufacturing method
WO2010015511A1 (en) * 2008-08-08 2010-02-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2010037476A2 (en) * 2008-09-30 2010-04-08 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus
US20110075118A1 (en) * 2009-09-28 2011-03-31 Asml Netherlands B.V. Heat pipe, lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
DE102011010462A1 (en) 2012-08-02
WO2012101080A2 (en) 2012-08-02

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