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WO2012165274A1 - Dispositif d'aide à l'inspection d'opérations sur des cartes de circuits imprimés - Google Patents

Dispositif d'aide à l'inspection d'opérations sur des cartes de circuits imprimés Download PDF

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Publication number
WO2012165274A1
WO2012165274A1 PCT/JP2012/063276 JP2012063276W WO2012165274A1 WO 2012165274 A1 WO2012165274 A1 WO 2012165274A1 JP 2012063276 W JP2012063276 W JP 2012063276W WO 2012165274 A1 WO2012165274 A1 WO 2012165274A1
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WO
WIPO (PCT)
Prior art keywords
inspection
work
mounting
board
result
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/063276
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English (en)
Japanese (ja)
Inventor
中山　大輔
蔦　宏
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Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
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Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of WO2012165274A1 publication Critical patent/WO2012165274A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops

Definitions

  • the present invention relates to a support device for supporting an inspection device for inspecting the results of a substrate operation such as an operation of mounting an electrical component on a circuit board and an operation of printing cream solder on the circuit substrate.
  • an inspection apparatus for performing such inspection is arranged in an electric circuit manufacturing line together with an anti-substrate work machine such as an electric component mounting machine, a solder printer, etc. Each time an operation is performed, the result of the operation is inspected. Therefore, when there are a lot of inspection target parts, a long time inspection is performed on one circuit board, which is a cause of lowering the throughput of the electric circuit manufacturing line, that is, the manufacturing capability.
  • an inspection target based on the work information of the substrate work and to perform an efficient inspection.
  • the substrate-to-board work inspection support apparatus of the present invention certifies a work site to be inspected based on at least one of inspection result information received from the inspection apparatus and an event in which work conditions fluctuate. And it is comprised so that the site
  • the inspection target part can be determined based on the fact that the work has become defective or the prediction that the work will be defective. It is possible to construct a highly productive electric circuit manufacturing line while maintaining it. In that respect, the counterboard work inspection support device of the present invention is a highly practical device.
  • the items (1) to (3) are items in which the invention-specific matters that are the premise of the claimable invention are described, and the items (12) and (16) are selectively selected in the item (1).
  • the combination corresponds to claim 1
  • the items (12) to (15) correspond to claims 2 to 5
  • the items (17) to (24) correspond to claims 6 to 13, respectively. .
  • a substrate work inspection support device that supports an inspection device that inspects a result of a substrate operation performed on a circuit board, An inspection target part determination unit for determining an inspection target part which is a work part which is a target in the inspection of the inspection apparatus;
  • a substrate work inspection support apparatus comprising: a notification unit that notifies the inspection apparatus of information related to the inspection target region determined by the inspection target region determination unit.
  • the inspection device supported by the above-mentioned substrate-to-board work inspection support device may be any inspection device that inspects the results of the substrate-to-board operation for manufacturing an electric circuit,
  • support device may be any inspection device that inspects the results of the substrate-to-board operation for manufacturing an electric circuit
  • the “to-board work” includes a wide range of work performed on a circuit board (hereinafter sometimes simply referred to as “board”).
  • the “inspection of the results of the work on the board” means, for example, when the work on the board is a component mounting work, the displacement of the mounting position of the electrical component (hereinafter sometimes simply referred to as “component”), the component standing,
  • component the electrical component
  • the work for the board is a solder printing work
  • solder land also referred to as a “solder pad”.
  • the shift of the mounting position and the shift of the printing position include a shift of the position in the rotation direction, that is, a shift of the orientation.
  • the “information about the examination target part” notified by the notification unit includes various information related to the determined examination target part.
  • it may be the inspection target part itself, or conversely, it may be a work part that has not been determined as the inspection target part.
  • the “notification unit” may be configured to notify the work site where the inspection is not performed (the inspection is skipped).
  • the “inspection site determination unit” is not limited to the one having the function of directly determining the inspection site, but includes the one having the function of determining indirectly. Specifically, it is configured to indirectly determine the inspection target part by determining the work part that does not need to be inspected (the work part where the inspection may be skipped). There may be.
  • the support device may be one that constitutes an inspection machine integrally with the inspection device, that is, one that constitutes a part of the inspection device. It may be installed outside the circuit manufacturing line.
  • the substrate-to-board work inspection support apparatus includes a required inspection part recognition unit that recognizes an inspection required part that is a work part to be inspected, The on-board work inspection support apparatus according to any one of (1) to (3), wherein the inspection target part determination unit is configured to determine at least the inspection target part as the inspection target part. .
  • the inspection target part always includes a part where it is desirable to perform the inspection, so that the quality of the electric circuit can be maintained high.
  • the substrate work inspection support apparatus further includes an information acquisition unit that receives inspection result information from the inspection apparatus, The substrate inspection inspection support apparatus according to (11), wherein the inspection required part recognition unit includes an inspection result dependence authentication part that authenticates the inspection required part based on the received inspection result information.
  • the site to be inspected is certified based on the inspection result by the supporting inspection device, the inspection according to the actual situation of the on-board work being performed is performed, It is possible to perform efficient inspection while maintaining high circuit quality.
  • the inspection result-based certification department The on-board work inspection support device according to item (12), which is configured to certify the inspection required part based on the stability of the work result for each work part obtained based on the inspection result information. .
  • “Stability of work result” is a parameter suitable for predicting the high possibility that the work part becomes a defective part.
  • the stability in this section is used in the field of quality control, such as the average deviation from the reference value of the actual value for the inspection item, the relationship with the control limit value of the deviation, the variation range of deviation, the process capability index, etc. It is possible to adopt various statistical indicators.
  • a degree of stability at which it can be considered that the occurrence of poor work hardly occurs is adopted as a setting degree, that is, a threshold value, and a working part with a stability lower than that degree. It is possible to effectively prevent or suppress the occurrence of defects by certifying as a site requiring inspection.
  • the support device itself performs processing such as statistical calculation based on the inspection result information to confirm the occurrence of the defective part
  • the support apparatus confirms the occurrence information of the defect by confirming the defect occurrence information
  • the condition fluctuation event in this section includes, for example, replacement of a component holding device such as a suction nozzle, replacement of a component supply device such as a component feeder, This includes events such as changing parts and board lots, changing or correcting programs related to mounting positions, etc.
  • a component holding device such as a suction nozzle
  • a component supply device such as a component feeder
  • variable event dependency recognition unit is configured to recognize a work part whose work result is affected by the event as the inspection required part (16)
  • the location where the work result is affected varies.
  • the work result of a specific work site related to the event varies.
  • the support device according to the aspect of this section takes this into consideration, and according to the support device according to the aspect of this section, the work site affected by the variable event is managed intensively, and the quality at that site is degraded. Can be effectively suppressed.
  • the work results of almost all work parts are affected by fluctuation events, such as when the board-to-board work is a solder printing work, almost all of the work parts are certified as inspection required parts. Become.
  • the inspection target part determination unit includes an inspection target part addition unit that adds a work part other than the inspection target part as the inspection target part based on a set rule.
  • inspection assistance apparatus in any one of claim
  • the support device can be a target for inspection other than the site requiring inspection, it is possible to meet those demands by appropriately setting the above rules.
  • an inspection apparatus that inspects a plurality of work parts in one field of view, such as in the case of an inspection using an imaging device described later, other than the part to be inspected and the part to be inspected in one field
  • Such a rule that the work part is added to the inspection target part can be adopted as the set rule.
  • the inspection target part adding unit is configured to add a part of the inspection target part as the inspection target part in order so that the inspection of the work parts other than the inspection target part is performed uniformly.
  • the inspection target part adding unit may include a part of the work part other than the inspection target part in a range in which a time required for the inspection of the inspection target part by the inspection device does not exceed a work tact for the substrate work.
  • the counter-to-board work inspection support apparatus includes an inspection procedure determination unit that determines an inspection procedure when the inspection apparatus inspects the inspection target part, The counter substrate according to any one of (1) to (20), wherein the notification unit is configured to notify the inspection apparatus of the inspection procedure determined by the inspection procedure determination unit.
  • Work inspection support device includes an inspection procedure determination unit that determines an inspection procedure when the inspection apparatus inspects the inspection target part, The counter substrate according to any one of (1) to (20), wherein the notification unit is configured to notify the inspection apparatus of the inspection procedure determined by the inspection procedure determination unit.
  • the support apparatus In the support apparatus according to the aspect of this section, not only the inspection target part is determined, but also the procedure of the inspection of the inspection target part is determined. Therefore, the support apparatus according to the aspect of this section is a highly convenient apparatus. It becomes.
  • the “inspection procedure” is a concept including not only the order of the parts to be inspected but also how to inspect those parts. For example, as will be described later, in the case of an inspection apparatus capable of inspecting two or more parts at once, which part is inspected together is also included in the inspection procedure.
  • a process for performing an inspection (a kind of process for optimization) is performed in as short a time as possible.
  • the inspection apparatus includes an imaging device capable of capturing a plurality of work parts in one field of view, and images one or more work parts in a state where the imaging apparatus is stopped at an arbitrary stop position; The inspection is executed based on the imaging data obtained by the imaging, The substrate inspection inspection support device according to (21) or (22), wherein the inspection procedure determination unit is configured to determine the stop position of the imaging device based on the inspection target part.
  • the inspection of the work results of the substrate work is often performed on the basis of imaging data obtained by imaging with an imaging device such as a camera.
  • an imaging device such as a camera
  • a plurality of work sites are identified. It is desirable to have them in the field of view and inspect them together.
  • the work part to be inspected together according to the position of the part to be inspected, the work part to be inspected together, that is, the position of the imaging apparatus for inspecting those parts together is determined to be an appropriate position. By doing so, an efficient inspection becomes possible.
  • the on-board work inspection support device can support a plurality of inspection devices each serving as the inspection device, When the time required for the inspection of the inspection target part by one inspection apparatus exceeds the work tact for the substrate work, the inspection target part determination unit distributes a part of the inspection target part to another inspection apparatus.
  • the substrate inspection inspection support device according to any one of items (1) to (23), which includes an inspection target part distribution unit.
  • some component mounting devices function as inspection devices by exchanging work heads.
  • the support device of the aspect of this section it is possible to support a device that functions as such an inspection device.
  • By providing such support even when there are many parts to be inspected, it is possible to inspect with a plurality of inspection devices, and as much as possible to the productivity of substrate work, that is, the productivity of the electric circuit manufacturing line Therefore, it can be prevented from being lowered.
  • the number of inspection target parts will increase at the initial stage of manufacturing due to the determination of working conditions.
  • some sort of substrate working device is made to function as an inspection device, and inspection is performed using a plurality of inspection devices, and when the quality has started to stabilize, it was made to function as an inspection device. It is desirable to return the apparatus for working the substrate to the apparatus that performs the original work for the substrate.
  • the support device according to the aspect of this section is a suitable device in such a case.
  • an on-board work inspection support apparatus 10 (hereinafter, simply referred to as “support apparatus 10”) according to the embodiment supports an inspection apparatus arranged in an electric circuit manufacturing line 20.
  • support apparatus 10 supports an inspection apparatus arranged in an electric circuit manufacturing line 20.
  • an electric circuit manufacturing line will be described first, and then an overview of support processing by the support device 10, the flow of actual support processing, and the functional configuration of the support device will be described.
  • the electric circuit manufacturing line 20 includes, in order from the upstream side, a substrate loading device 22, a solder printer 24, a printing work result inspection device 26, and a first transport path switching.
  • the device 28, the component mounting machine 30, the second transport path switching unit 32, the mounting work result inspection machine 34, and the reflow furnace 36 are arranged side by side, and may be referred to as a plurality of circuit boards (hereinafter simply referred to as “boards”). ) Pass through these devices sequentially, and the electrical circuit is manufactured.
  • Each of the printing work result inspection machine 26 and the mounting work result inspection machine 34 functions as an inspection apparatus, and the support apparatus 10 supports each of the inspection machines 26 and 34.
  • the substrate feeder 22 stacks and stores a plurality of substrates, and sequentially puts the substrates one by one into the line 20, more specifically, a solder printer. 24.
  • the solder printer 24 performs an operation (solder printing operation) of screen-printing cream solder on the surface of the substrate that has been input.
  • the printing work result inspection machine 26 inspects the result of the solder printing work by the solder printing machine 24.
  • the component mounting machine 30 can perform work in two lanes, and the first transport path switching unit 28 mounts the board unloaded from the printing work result inspection machine 26 on the component mounting. It has a function to distribute to the two lanes of the machine 30.
  • the component mounting machine 30 is a base 40, six mounting modules 42 that are arranged side by side on the base 40 and each function as a component mounting device, and an overall control device that controls these mounting modules 42 in an integrated manner.
  • the module integrated controller 44 and the solder printed board are sequentially transferred through the six mounting modules 42 and conveyed by the mounting modules 42 as electrical components (hereinafter simply referred to as “components”).
  • the component mounting operation to the board is completed by performing a mounting operation (component mounting operation).
  • the second transport path switching unit 32 has a function of collecting the transport paths of the boards transported in two lanes in the component mounting machine 30 into one path.
  • the mounting operation result inspection machine 34 inspects the result of the component mounting operation by the component mounting machine 30.
  • the reflow furnace 36 melts the cream solder by heating the substrate on which the component is mounted, and then solidifies the solder by cooling to fix the component to the substrate.
  • the main equipment will be described in detail below individually.
  • the solder printer 24 has a base frame 50 mainly composed of square pipes, and is a substrate conveyor device that is supported and arranged on the base frame 50. 52, a substrate holding / lifting device 54 (only a part of the device is hidden behind the screen 56 in the figure), a screen holding device 58, a squeegee device 60, a cleaning device 62, and the like.
  • the substrate conveyor device 52 has a function of transporting the substrate from the upstream side to the downstream side and stopping the substrate at a predetermined work position below the screen 56.
  • the substrate holding / lifting device 54 holds and lifts / lowers the substrate stopped at the work position.
  • the screen holding device 58 includes a holding frame 64 that holds the screen 56 and four holding frame position adjustment mechanisms 66 that adjust the position of the holding frame 64 in order to adjust the position of the screen 56.
  • the squeegee device 60 includes a squeegee unit 72 having a pair of squeegees 68 and a squeegee raising / lowering mechanism 70 for moving the pair of squeegees 68 up and down, and moving the pair of squeegee units forward and backward. And a unit moving mechanism 74 to be moved.
  • the substrate carried in from the upstream side by the substrate conveyor device 52 is stopped at the above-mentioned working position, and the stopped substrate is held by the substrate holding / lifting device 54 and then raised, and the lower surface of the screen 56 Pressed against.
  • the screen 56 is provided with openings (through holes) for forming solder lands (also referred to as “solder pads”), and cream solder is supplied to the upper surface of the screen 56.
  • solder pads also referred to as “solder pads”
  • the cream solder is applied to the upper surface of the pressed substrate through the opening of the screen 56. Thereby, solder lands are formed on the upper surface of the substrate with a specific land pattern defined by the openings. In this way, solder printing on the substrate surface is completed. After the printing is completed, the substrate is lowered by the substrate holding / elevating device 54, then the holding is released, and the substrate is conveyed to the downstream side by the substrate conveyor device 52. In the solder printer 24, the solder printing operation for one substrate is performed in this way.
  • the solder printer 24 moves between the screen 56 and the substrate in a state before being raised, and can image both the lower surface of the screen 56 and the upper surface of the substrate.
  • the substrate reference mark attached to the surface of the substrate and the screen reference mark attached to the lower surface of the screen 56 are imaged.
  • the substrate and the screen The amount of relative positional deviation is grasped. Based on the grasped relative positional deviation amount, the position of the screen 56 is adjusted by the holding frame position adjusting mechanism 66, and then the board is raised by the board holding / lifting device 54, and solder printing is performed.
  • the cleaning device 62 is a device that cleans the lower surface of the screen 56 when the area / volume is excessive or excessive, such as solder land rubbing or protrusion.
  • the cleaning device 62 has a cleaning unit 80 having a non-woven fabric 76 wound around a pair of rollers and passed between them, and a nozzle 78 for soaking the non-woven fabric 76 with alcohol as a cleaning liquid.
  • the cleaning unit 80 is configured to be moved back and forth by a unit moving mechanism hidden in the drawing. The cleaning unit 80 is moved by the unit moving mechanism in a state where the non-woven fabric 76 soaked with alcohol is in contact with the lower surface of the screen 56, so that the lower surface of the screen 56 is wiped by the non-woven fabric 76. In this way it is cleaned.
  • the solder printer 24 includes a controller 82 that is a control device mainly composed of a computer, and the operation of each of the above-described devices and mechanisms constituting the solder printer 24 is performed by the controller 82.
  • the solder printer 24 also includes an air conditioner 84 that adjusts the temperature inside the solder printer 24 for adjusting the viscosity of the cream solder supplied to the upper surface of the screen 56.
  • the printing work result inspection machine 26 is configured to include a substrate conveyor device, an inspection head, and a head moving device that moves the inspection head, although illustration of the internal structure is omitted.
  • the board conveyor device has a function of carrying in a board on which solder is printed from the upstream side and carrying it out to the downstream side, and placing it at a predetermined inspection position.
  • the inspection head is a work head for obtaining information on the surface of the substrate placed at the inspection position.
  • the head moving device is a so-called XY type moving device, and an X direction moving mechanism for moving the inspection head in a direction parallel to the substrate transport direction (X direction) and a direction perpendicular to the X direction (Y direction). The Y-direction moving mechanism is moved to move the inspection head along a plane parallel to the surface of the substrate above the substrate.
  • the inspection head is a printing result inspection head 90 for inspecting the result of the solder printing operation, and this printing result inspection head 90 is the surface of the substrate.
  • a light source that irradiates slit light obliquely from four directions so that a grating is formed on the substrate, and a camera as an imaging device that images the grating of light formed on the surface of the substrate obliquely from two directions. Yes.
  • a light line 92 constituting a lattice formed by the irradiated slit light is a solder land 94 on the substrate, that is, a portion formed at a place where the solder is printed is on the substrate itself on which the solder land 94 is not formed. It will shift from the part formed in the surface. The amount of this shift varies depending on the thickness (height) of the solder land.
  • the printing work result inspection machine 26 can detect the positional deviation amount of the solder land 94 in the X and Y directions and the positional deviation amount in the rotational direction. (Amount of deviation in rotation angle or direction), area, and volume are acquired.
  • the deviation amount, the area fluctuation amount that is the fluctuation amount from the normal area of the area, and the volume fluctuation amount that is the fluctuation amount of the volume from the normal volume are defined for the solder land 94.
  • the limit value defect determination limit value
  • the solder land 94 is recognized as a defective part, and the operator receives the defective work part via the display on the operation panel.
  • Print defect information such as the content of the defect is notified. Based on the notified information, the operator includes changes in the conditions of solder printing work by the solder printer 24 (program change, temperature change, additional supply of solder, cleaning of the screen 56 by the cleaning device 62, etc. )I do.
  • the fact that the acquired solder land 94 has been identified as a positional deviation amount, an area fluctuation amount, a volume fluctuation amount, and a defective portion of the solder land 94 is based on the substrate inspection inspection support device 10. Sent to.
  • the printing work result inspection machine 26 inspects the solder lands 94 formed on the surface of the substrate with the print inspection head 90 positioned at an arbitrary stop position. At this time, it is possible to inspect a plurality of solder lands 94, that is, a plurality of work parts, at one stop position. In other words, one or more work parts existing within a predetermined imaging range, that is, one visual field are imaged, and the inspection of the one or more work parts can be performed based on the imaging data obtained by the imaging. It is. Therefore, in this printing work result inspection machine 26, the print inspection head 90 is sequentially positioned by the head moving device at each of several stop positions determined by the position of the solder land 94 as the inspection object part, Inspection is performed.
  • stop positions and the order of stopping to those stop positions affects the time required for the inspection work, so it should be appropriately determined to minimize the time. Is desirable. The appropriateness of the stop position and stop order will be described later.
  • the component mounting machine 30 is a working machine for mounting components on a board, and includes a base 40, six mounting modules 42, and a module overall controller 44 as described above. It is configured.
  • FIG. 4 shows the mounting module 42 with the exterior panel removed. With reference to this figure, the mounting module 42 includes a module base 100, a beam 102 overlaid on the module base 100, and a module.
  • a substrate conveyor device 104 disposed on the base 100, a plurality of component feeders 106 that are replaceably attached to the module base 100 on the front side of the module 42, and each function as a component supply device; a substrate conveyor device 104; A base-fixed component camera 108 fixed to the module base 100 between the plurality of component feeders 106 and a component supplied from any of the plurality of component feeders 106 are held and the component is mounted on the substrate S.
  • Mounting head 110 to be removed for the purpose of And a is) is configured to include a head moving device 112 for moving the mounting head 110 is disposed in the beam 102.
  • the substrate conveyor device 104 has two tracks (lanes) for transporting the substrate, and the substrate is loaded into each track from the upstream side and unloaded from each track to the downstream side.
  • the substrate conveyor device 104 has a support table that can be moved up and down at the lower part of each track, and the substrate S carried to a predetermined position is supported by the raised support table and fixed at that position. That is, the board conveyor device 104 functions as a board fixing device that fixes the board S to a predetermined work position in the component mounting work. Since the board conveyor device 104 is disposed in each mounting module 42, the component mounting machine 30 can perform component mounting work in two lanes.
  • the substrate transport direction which is the substrate transport direction by the substrate conveyor device 104, is the X direction shown in the figure (shown with arrows together with the Y direction and Z direction).
  • the head moving device 112 is a so-called XY type moving device, and is supported by the beam 102, a head mounting body 114 to which the mounting head 110 is detachably mounted, an X direction moving mechanism for moving the head mounting body 114 in the X direction, and the beam 102.
  • the X-direction moving mechanism includes a Y-direction moving mechanism that moves the mounting head 110 to move over the component feeder 106 and the substrate S.
  • a substrate camera 116 for capturing an image of the surface of the substrate S is fixed to the lower portion of the head attachment body 114.
  • the mounting head 110 is a so-called index type mounting head. As shown in FIG. 5 (a), each functions as a component holding device and sucks and holds the component at the lower end by supplying a negative pressure (meaning that “the pressure is reduced below atmospheric pressure”). Eight suction nozzles 118 are provided and are held by the revolver 120. The revolver 120 rotates intermittently, and one suction nozzle 118 located at a specific position can be moved up and down by the nozzle lifting mechanism, that is, can be moved in the vertical direction (Z direction). When the suction nozzle 118 located at a specific position is lowered, negative pressure is supplied to hold the component, and when the negative pressure is cut off, the suction holding component is removed.
  • a negative pressure meaning that “the pressure is reduced below atmospheric pressure”.
  • Eight suction nozzles 118 are provided and are held by the revolver 120.
  • the revolver 120 rotates intermittently, and one suction nozzle 118 located at a specific position can be moved up and down by the nozzle lifting mechanism, that
  • each of the eight suction nozzles 118 can be rotated around its own axis (hereinafter sometimes referred to as “nozzle axis”) by the nozzle rotation mechanism, that is, around the nozzle axis.
  • the mounting head 110 can change / adjust the rotational positions (also referred to as “rotational posture” and “azimuth”) of the components held by the respective suction nozzles 118.
  • Each of the plurality of component feeders 106 is set with a reel on which a component holding tape (a plurality of components are held on the tape, also called “component taping”) is wound.
  • Each of the feeders 106 supplies parts one by one sequentially at a predetermined part supply site by intermittently sending out the part holding tape.
  • the replenishment of the parts may be performed by splicing the part taping while exchanging the reels (splicing), or may be performed by exchanging the reels together with the part feeder 106.
  • the mounting module 42 can also be attached with a so-called tray-type component supply device in place of the plurality of component feeders 106.
  • the board S to be used for the work is carried in from the upstream side by the board conveyor device 104 and fixed at a predetermined work position.
  • the substrate camera 116 is moved by the head moving device 112, and the reference mark attached to the upper surface of the substrate S is imaged. Based on the imaging data obtained by the imaging, a coordinate system serving as a reference for the mounting position is determined.
  • the mounting head 110 is positioned above the plurality of component feeders 106 by the head moving device 112, and the components are sequentially held in each of the eight suction nozzles 118.
  • the mounting head 110 While the mounting head 110 is moved above the substrate S, the components passing through the component camera 108 and held by each of the suction nozzles 118 are imaged by the component camera 108. Based on the imaging data, a positional deviation amount (a concept including a rotational positional deviation) of each component with respect to the nozzle axis is grasped. Subsequently, the mounting head 42 is moved above the substrate S, and each component is sequentially mounted at a set position determined by the mounting program while performing correction based on the positional deviation amount. The mounting head 42 is reciprocated between the component feeder 106 and the substrate S a number of times determined by the mounting program, and the holding and mounting of the components by the mounting head 42 are repeated as described above, and one mounting module 42 Parts installation work is completed. When one board S passes through the six mounting modules 42, the above-described component mounting work by each mounting module 42 on one board S is sequentially performed, and the mounting work on one board by the component mounting machine 30 is completed. .
  • a positional deviation amount
  • the mounting module 42 can be mounted with another working head instead of the mounting head 110.
  • the mounting head 122 shown in FIG. 5B can be attached.
  • the mounting head 122 is a so-called single nozzle type mounting head.
  • This mounting head 122 is provided with only one suction nozzle 124 as a component holding device. Although only one part can be sucked and held at a time, relatively large parts can be sucked and held.
  • the mounting head 122 also includes a nozzle lifting / lowering mechanism and a nozzle rotating mechanism, and the suction nozzle 124 is lifted / lowered when holding / removing the component, and the nozzle axis line is used for changing / adjusting the rotational position of the component. Rotated around.
  • the eight suction nozzles 118 included in the mounting head 110 and the suction nozzles 124 included in the mounting head 122 are automatically replaceable, and the replacement suction nozzles 118 and 124 are connected to the substrate conveyor device 104 and a plurality of suction nozzles. It is accommodated in a nozzle stocker 126 arranged between the component feeder 106.
  • the mounting module 42 can further be attached with, for example, an inspection head 128 shown in FIG. 5C instead of the mounting head 110.
  • the inspection head 128 includes a substrate camera 130 as an imaging device capable of imaging the surface of the substrate S.
  • the substrate camera 130 has a relatively large field of view, can capture a plurality of components mounted on the substrate S in one field of view, and has a relatively high resolution. Therefore, the board camera 130 is a camera suitable for inspection relating to the displacement of the mounting position of the mounted component (in this sense, it may be hereinafter referred to as “inspection camera 130”).
  • a mounting work result inspection machine 34 is arranged on the downstream side of the component mounting machine 30.
  • the mounting result is only obtained by this inspection machine 34. It will take too much time for the inspection work.
  • the module to which the inspection head 128 is attached functions as an inspection module (hereinafter, the module may be referred to as “inspection module 42”).
  • the working heads 110, 122, and 130 can be exchanged with one touch by lever operation.
  • the substrate conveyor device, the inspection head, and the head movement for moving the inspection head are the same as the printing work result inspection machine 26.
  • the board conveyor device has a function of carrying in a board on which components are mounted from the upstream side and carrying it out to the downstream side and placing the board at a predetermined inspection position.
  • the substrate conveyor device and the head moving device have the same configuration as that of the printing work result inspection machine 26, but the inspection head has a configuration different from that of the printing work result inspection machine 26.
  • the inspection head provided in the mounting inspection result inspection machine 34 that is, the mounting inspection head is configured with a substrate camera as an imaging device that images the substrate surface and the upper surface of a component mounted on the substrate from above as a main component.
  • the two-dimensional imaging data is acquired by the substrate camera.
  • the mounting work result inspection machine 34 based on the imaging data acquired by the substrate camera of the mounting inspection head, the amount of positional displacement of the component in the X and Y directions and the amount of positional displacement (rotation angle or direction). The amount of misalignment) is obtained and the occurrence of missing parts or standing parts (so-called “chip standing”) is confirmed. When it is confirmed that a part is missing or standing, it is recognized that the work site is defective due to the fact of the occurrence, that is, the work site is recognized as a defective part.
  • the displacement of the mounting position if the amount of deviation of a part exceeds the limit value (defect determination limit value) specified for that part, that part, that is, its work site is defective. It is recognized as a part.
  • the operator is notified of the installation failure information such as the defective part and the content of the operation defect via the display of the operation panel. Based on the notified information, the operator changes the condition of the component mounting operation by the component mounting machine 30 (changes in the program related to the misalignment correction amount, etc.), replaces the suction nozzle, and the supplied component.
  • the mounting work result inspection machine 34 which will be described in detail later, shows the deviation amount and the fact that a defect has occurred with respect to the obtained mounting position of the component. 10 to send.
  • the mounting work result inspection machine 34 inspects the parts mounted on the board with the mounting inspection head positioned at an arbitrary stop position. At this time, it is possible to inspect a plurality of parts, that is, a plurality of work parts, at one stop position. In other words, one or more work parts existing within a predetermined imaging range, that is, one visual field are imaged, and the inspection of the one or more work parts can be performed based on the imaging data obtained by the imaging. It is. Therefore, in the mounting work result inspection machine 34, the mounting inspection head is sequentially positioned at each of several stop positions determined by the position of the part to be inspected by the head moving device, and the inspection is performed. Is called.
  • the stop position and the order of stopping to the stop position affects the time required for the inspection work. It is desirable to determine appropriately in order to make it the shortest.
  • one or more work parts existing in one field of view can be imaged in the case of the inspection module 42 as described above, that is, by attaching the inspection head 128 to the mounting module 42 to function as an inspection apparatus. In this case, it is desirable to make the stop position and stop order of the inspection head 128 appropriate.
  • the support device 10 is realized by a general-purpose computer that is operated by an application installed therein. As shown in FIG. 1, the support device 10 is connected to the printing work result inspection machine 26 and the mounting work result inspection machine 34 via the LAN 140 and supports them. Further, in order to obtain various information for the support, etc., it is connected to the solder printer 24 and the component mounting machine 30 (specifically, its module integrated controller 44) via the LAN 140. As described above, when some of the mounting modules 42 of the component mounting machine 30 are set as the inspection modules 42, the same support as that of the mounting work result inspection machine 34 is performed.
  • the support by the support device 10 is performed by the printing work result inspection machine 26, the mounting work result inspection machine 34, and the inspection module 42 (hereinafter, sometimes collectively referred to as “mounting work result inspection machine 34, etc.”).
  • the purpose is to allow each to perform inspection efficiently.
  • the support apparatus 10 determines the inspection target parts that are the inspection target parts of the printing work result inspection machine 26, the mounting work result inspection machine 34, and the like, and inspects these inspection target parts.
  • the inspection procedure at the time of performing is determined, and the determined inspection object part and the inspection procedure are notified to the printing work result inspection machine 26, the mounting work result inspection machine 34, and the like.
  • the support is divided into a process for supporting the mounting work result inspection machine 34 (mounting inspection support process) and a process for supporting the printing work result inspection machine 26 (print inspection support process). Will be explained.
  • [A] Mounting inspection support processing The determination of the inspection target part such as the mounting work result inspection machine 34 is performed based on the following three rules set. ⁇ First Rule> At least an inspection is performed on a required inspection site, which is a work site to be inspected by the mounting work result inspection machine 34 or the like (hereinafter sometimes simply referred to as “inspection machine 34 or the like”). ⁇ Second Rule> The inspection time when the inspection target site is inspected only by the mounting operation result inspection machine 34 is the work tact time of the component mounting machine 30 (the substrate on which the component is mounted is unloaded from the mounting module 42 on the most downstream side).
  • the most downstream mounting module 42 is used as the inspection module 42, and a part of the inspection of the inspection target part is distributed to that module.
  • the first rule since it takes a lot of inspection time to inspect all work parts, that is, all the mounted parts, in view of the productivity of the electric circuit manufacturing line 20, a minimum inspection is required in the inspection work.
  • the purpose is to omit the inspection of work parts other than the necessary work parts. In other words, the aim is to reduce the time required for inspection by avoiding so-called 100% inspection as much as possible.
  • the second rule is to cope with the support when the inspection module 42 supports the mounting work result inspection machine 34 in order to keep the time required for the inspection within the work tact of the component mounting machine 30. It is said.
  • the said 3rd rule aims at making it test
  • the mounting inspection support process will be described focusing on the process of determining the inspection target part and determining the inspection procedure based on the above rules.
  • the stability of the result of the mounting work is grasped based on the amount of displacement of each component with respect to the normal mounting position. More specifically, the X-direction misalignment amount ⁇ x, Y-direction misalignment amount ⁇ y, and rotational direction misalignment amount ⁇ (hereinafter may be collectively referred to as mounting position misalignment amounts ( ⁇ x, ⁇ y, ⁇ )) for the mounting positions of the components.
  • the support device 10 Each time the part is inspected as inspection result information, it is sent to the support device 10 from the inspection machine 34 or the like that performed the inspection, and the support device 10 receives the obtained mounting position deviation amount ( ⁇ x, ⁇ y, Based on [Delta] [theta]), grasp the stability of the work result of the part at the present time.
  • this process capability index C pK is defined by an equation as shown in FIG. 6, and this support apparatus 10 is stored in its own data storage unit (for example, constructed by a RAM or a hard disk).
  • the current process capability index C pK (generally for the mounting position shift amount ( ⁇ x, ⁇ y, ⁇ )) (generally speaking, the X-direction shift process capacity index C pKx , Y
  • the direction deviation process capability index C pKy and the rotation direction deviation process capability index C pK ⁇ are stored.
  • the process capability index C pK is updated every time information on the amount of displacement ( ⁇ x, ⁇ y, ⁇ ) is newly obtained.
  • Each process capability index C pK for the mounting position shift amount ( ⁇ x, ⁇ y, ⁇ ) of a certain part is a set threshold C pK0 (generic term, strictly speaking, an X-direction shift setting threshold C pKx0 , a Y-direction shift setting threshold).
  • C pKy0 rotational direction deviation setting threshold C pK ⁇ 0 (for example, set to 1.67 etc.)
  • the stability of the mounting operation of the component exceeds the set level. If any of the process capability indexes C pK is determined to be equal to or less than the set threshold value C pK0, it is determined that the stability of the part is equal to or less than the set level.
  • the part is determined to be an unstable part and is certified as a part requiring inspection.
  • the standard upper limit L U and the standard lower limit L L shown in FIG. 6 are set to be considerably smaller than the above-described limit values (defect determination limit values) defined for defect determination in the inspection machine 34 or the like. ing.
  • the process capability index C pK needs to be calculated based on data of a certain number of samples or more. Therefore, in the support device 10 has a test number counter Cn for counting the number of times (number of substrate) of inspecting the part, the counter value Cn is, when it is required for setting the number of check Cn 0 or more, A determination is made regarding the stability based on the process capability index C pK , and parts whose number of inspections is less than the set required inspection number Cn 0 (for example, about 30) are always determined to be instable parts. That is, in order to be determined as part of high set about more stability (stable site) is set at least necessary number Cn 0 or more inspection is necessary.
  • Another stability index is the mounting position shift amount ( ⁇ x, ⁇ y, ⁇ ) itself, and any of the mounting position shift amounts ( ⁇ x, ⁇ y, ⁇ ) obtained for a certain part is set for each of them.
  • the limit values ( ⁇ x L , ⁇ y L , ⁇ L ) are exceeded, the part is determined to be an instable part and is identified as a part requiring inspection.
  • the above limit values ( ⁇ x L , ⁇ y L , ⁇ L ) are considerably larger than the limit values for defect determination described above, that is, the limit values for determining that the work is defective by the inspection machine 34 or the like. Is set to a small value.
  • the support apparatus 10 that has received the information determines that the part for which the information has been obtained is a defective part, and recognizes the part as a part requiring inspection.
  • condition change event which is an event that changes the work condition
  • the work result may be affected by the change.
  • the mounting program related to the mounting position is changed to correct the mounting position of a part
  • the part, the part feeder 106 or its reel is replaced, that is, the lot of parts to be supplied is changed.
  • the parts mounted in this case and the parts mounted by replacing the suction nozzles 118 and 124 can also vary as a result of the mounting work. Therefore, in the support device 10, the change of the mounting program, the change of the parts lot, and the replacement of the suction nozzle are set as specific condition change events, and when those condition change events occur, the parts related to them are required. It is recognized as the examination site.
  • the fluctuation event occurrence information includes the board ID of the board that is being mounted when the condition fluctuation event occurs, and the affected part number, and the condition fluctuation event has occurred. It is sent every time.
  • This information is temporarily stored in the data storage unit of the support apparatus 10, and when the process of determining the inspection target part for the substrate is performed based on the stored information, the part to be inspected is recognized. Is called. Incidentally, after the authorization is performed, the stored information is deleted from the data storage unit.
  • the process capability index C pK for the parts related to the condition change event is reset together with the inspection number counter Cn because it is necessary to newly calculate the process capability index C pK .
  • the process capability index C pK is the set threshold value. Even when C pK0 or less, the process capability index C pK and the inspection number counter Cn are reset. In other words, the process capability index C pK and the inspection number counter Cn for a certain part are reset when the part is recognized as a part requiring inspection, and the part is treated as an unstable part. By the way, even if the part is once recognized as an unstable part, it returns to the stable part when the process capability index C pK exceeds the set threshold C pK0 after the inspection of the set necessary inspection number Cn 0 or more. Will do.
  • the inspection procedure when the inspection machine 34 or the like inspects the inspection target part is optimized.
  • the inspection machine 34 or the like images the mounted component with the board camera, acquires the mounting position shift amount ( ⁇ x, ⁇ y, ⁇ ), etc. based on the imaging data obtained by the imaging, and performs the inspection.
  • the board camera can capture a plurality of parts in one field of view, and can inspect the parts in one field of view at a time. Therefore, when inspecting some parts that are inspection target parts, the inspection head is stopped at several stop positions and images are taken for inspection. While the support device 10 stores the position (x, y) of each component in the data storage unit, the support device 10 grasps the field of view of the board camera.
  • the stop positions and the inspection order are determined so that the inspection heads have the smallest stop position and the movement path of the inspection head that moves around each stop position is the shortest. Specifically, for example, it is determined as shown in FIG. Since this optimization method is a purely mathematical method, description of the method is omitted.
  • the support apparatus 10 assumes that both the mounting work result inspection machine 34 and the inspection module 42 inspect the result of the mounting work, and both of them. Can be supported. Then, when both the mounting work result inspection machine 34 and the inspection module 42 perform the inspection, the support device 10 allows the “distribution allowable mode” that allows the distribution of the inspection target parts to those, and the mounting operation result. In the case where only the inspection machine 34 performs the inspection, the processing is executed in two modes of “distribution prohibition mode” for prohibiting the distribution of the inspection target part. It is performed only when the mode is set to the distribution allowable mode.
  • the inspection target part is determined as the inspection target part, and about the inspection target part, A suitable inspection procedure is determined. Based on this inspection procedure, the inspection time by the mounting work result inspection machine 34 when only the mounting work result inspection machine 34 inspects the inspection object part is calculated as the minimum required time t 0 .
  • the distribution allowable mode is set and the calculated minimum required time t 0 is larger than the work tact t T by the component mounting machine 30, a part of the inspection target part is given to the inspection module 42. Is distributed. Specifically, as shown in FIG.
  • the mounting program related to the mounting position is corrected until the mounting operation at each work site is stabilized. Therefore, at the initial stage, there are a lot of inspection target parts, and it is desirable that the mounting module 42 functions as the inspection module 42 and the inspection module 42 supports the inspection. However, after the initial stage, it is considered that many work parts are stable and the examination target parts are considerably reduced.
  • the distribution allowable mode is set at the start of substrate manufacture, and once the minimum required time t 0 becomes less than the work tact t T , the mounting module is thereafter used. Assuming that the inspection by 42 is not performed, the distribution mode is changed from the distribution allowable mode to the distribution prohibition mode, and thereafter, the distribution allowable mode is not changed again.
  • each part is managed with a serial part number.
  • the support apparatus 10 has a non-inspection number counter Cm for counting the number of substrates that have not been inspected continuously for each component, that is, the number of uninspection times, and is determined to be a stable part.
  • the number of uninspected parts is known.
  • the addition of the inspection target part is performed by using this non-inspection number counter Cm. More specifically, an additional priority is determined by using a component having a large counter value Cm of the uninspection counter Cm as a first key and a component No as a second key, and the components are added according to the additional priority.
  • the counter value Cm is added in the order of the part number among the parts having the larger counter value Cm and can still be added, the counter value Cm is added in the order of the part number in the next largest part, and further addition is possible. In this case, the counter value Cm is added in the order of the part number among the parts having the next largest value.
  • the uninspected number counter Cm is reset when a part for which the uninspected number is counted is set as an inspection target part.
  • the inspection time for inspecting only the inspection target portion allocated to the inspection module 42 by the inspection module 42 is set to the module minimum required time t M0 (generally, the work tact t T is subtracted from the minimum required time t 0. If the minimum required time t M0 of the module is equal to or shorter than the work tact t T , a part that is a part other than the inspection required part is added as the inspection target part of the mounting module 42. According to the priority order, the inspection time t M by the mounting module 42 is added within a range not exceeding the work tact t T.
  • one part according to the addition priority order is added to the inspection target region, and the added inspection target region is subjected to processing for optimizing the above-described inspection procedure, and the inspection module 42 calculating a test time t M, the inspection time t M is when: the working tact t T additionally adding 1 part in accordance with the additional priority examination target region. Then, each time an addition is made, the examination procedure is optimized. In this way, as many parts as possible are added to the inspection target region within a range where the inspection time t M does not exceed the work tact t T, and the inspection target region and the inspection procedure of the inspection by the mounting module 42 are determined. Is done.
  • the distribution prohibit mode when the minimum required time t 0 is equal to or shorter than the work tact t T , the parts other than the parts requiring inspection are inspected for the mounting work result.
  • the inspection time t S by the mounting work result inspection machine 34 exceeds the work tact t T according to the above-described additional priority by the same process as the process in the case where the distribution permission mode is set as the inspection target part of the machine 34. Added in no range.
  • as many parts as possible are added to the inspection target region within a range in which the inspection time t S does not exceed the work tact t T , and the inspection target region and inspection of the inspection by the mounting work result inspection machine 34 Procedure is determined.
  • the inspection target part and the inspection procedure determined as described above are notified to the mounting module 42, which is the mounting work result inspection 34 and the inspection module, and the component mounting work is performed according to the notified inspection target part and the inspection procedure. Inspect the results.
  • [B] Print Inspection Support Process The inspection target part of the print work result inspection machine 26 is determined based on the following two rules set. ⁇ First Rule> At least an inspection is performed on a portion requiring inspection which is an operation portion to be inspected by the printing work result inspection machine 26. ⁇ Second Rule> Within the work tact of the solder printer, work parts other than those requiring inspection are inspected evenly and as many times as possible.
  • the inspection work is performed on the production of the electric circuit manufacturing line 20.
  • the purpose is to omit the inspection of the work parts other than the work parts requiring the minimum inspection.
  • the second rule is intended to cause the inspection to be performed as frequently as possible even if it is a work part other than the inspection-required part, as long as the productivity is not hindered. It is.
  • a rule corresponding to the second rule in the mounting inspection support process is not set.
  • the print inspection support process will be described focusing on the determination of the inspection target part and the determination of the inspection procedure based on the above rules.
  • the stability of the printing operation is the amount of variation ⁇ s that is the amount of variation from the regular area of each solder land, and the amount of variation from the regular volume of each solder land. It is grasped based on the volume fluctuation amount ⁇ v.
  • the area variation ⁇ s and the volume variation ⁇ v of each solder land are sent as inspection result information from the printing work result inspection machine 26 to the support device 10 every time the inspection is performed. Based on the area fluctuation amount ⁇ s and the volume fluctuation amount ⁇ v, the stability of the printing operation of the solder land at the present time is grasped.
  • This support apparatus 10 stores the current process capability index C pK (generic name for each of the area fluctuation amount ⁇ s and the volume fluctuation amount ⁇ v for each solder land for all solder lands in the data storage unit. Strictly speaking, an area variation process capability index C pKs and a volume variation process capability index C pKv ) are stored. The process capability index C pK is updated every time information on the area variation ⁇ s and the volume variation ⁇ v is newly obtained.
  • each process capability index C pK for each of the area variation ⁇ s and the volume variation ⁇ v of a certain solder land is set threshold C pK0 (generic term, strictly speaking, Area fluctuation setting threshold C pKs0 and volume fluctuation setting threshold C pKv0 (for example, set to 1.67 etc.), the stability of the printing operation of the solder land exceeds the set level.
  • the process capability indexes C pK is equal to or less than the set threshold C pK0, it is determined that the stability of the solder land is equal to or less than the set level. That is, the solder land is determined as an unstable part and is certified as a part requiring inspection.
  • the standard upper limit L U the standard lower limit L L , the inspection number counter Cn regarding the number of samples, and the set required inspection number Cn 0 shown in FIG. 6 are set in the same manner as the support for the mounting work result inspection machine 34 and the like.
  • Another stability index is the area fluctuation amount ⁇ s and the volume fluctuation amount ⁇ v itself, and any one of the area fluctuation amount ⁇ s and the volume fluctuation amount ⁇ v obtained for a certain solder land is set for each area fluctuation.
  • the limit value ⁇ s L and the volume fluctuation limit value ⁇ v L are exceeded, the solder land is determined as an instable part and is identified as a part requiring inspection.
  • the area variation limit value ⁇ s L and the volume variation limit value ⁇ v L are set to values that are considerably smaller than the defect determination limit value described above, as in the case of the mounting inspection support process.
  • the printing work result inspection machine 26 also sends information indicating that a work defect has occurred on the solder land subjected to the inspection as inspection result information. .
  • the support apparatus 10 that has received the information determines that the solder land from which the information is obtained is a defective part, and recognizes the solder land as a part requiring inspection.
  • condition change event which is an event in which the working condition changes, such as a program change in the solder printer 24, a temperature change, additional supply of solder, and cleaning of the screen 56 by the cleaning device 62 occurs.
  • program change, temperature change, additional supply of solder, and cleaning of the screen 56 are defined as specific condition change events, and when the condition change event occurs, all solder lands are required. It is recognized as the examination site.
  • condition change event has occurred is sent from the solder printer 24 as the change event occurrence information together with the board ID of the board on which the solder printing operation is performed when the condition change event occurs, and the support for obtaining that information Based on the information, the device 10 recognizes a site requiring examination.
  • the area variation amount ⁇ s and the volume variation amount ⁇ v L exceed the area variation limit value ⁇ s L and the volume variation limit value ⁇ v L.
  • the resetting of the capability index C pK and the inspection number counter Cn is the same as in the attachment inspection support process.
  • a solder land that has been recognized as an unstable part returns to a stable part when the process capability index C pK exceeds the set threshold value C pK0 after the inspection with the required number of inspections Cn 0 or more. It will be.
  • the inspection procedure when the print work result inspection machine 26 inspects the inspection target part is optimized.
  • the printing work result inspection machine 26 uses a camera of the inspection head to pick up an image of the light line irradiated on the printed solder land, and based on the image data obtained by the image pickup, the area variation amount of each solder land ⁇ s and volume fluctuation amount ⁇ v L are acquired and inspected.
  • the camera can image a plurality of solder lands in one field of view, and the printing work result inspection machine 26 can inspect the solder lands in the field of view at a time.
  • the inspection head is stopped at several stop positions and imaged and inspected as in the inspection by the mounting work result inspection machine 34 or the like.
  • the support device 10 stores the position (x, y) of each solder land in the data storage unit and grasps the field of view of the camera, and grasps the same as in the mounting inspection support process. Based on the field of view, the stop positions and the inspection order are determined so that the inspection heads have the smallest stop position and the movement path of the inspection head that moves around each stop position is the shortest.
  • the above-mentioned inspection required part is a work part for performing a so-called “total inspection”, and a work part other than the inspection target part as a work part for performing a so-called “sampling inspection”.
  • total inspection a work part for performing a so-called “total inspection”
  • total inspection a work part other than the inspection target part as a work part for performing a so-called “sampling inspection”.
  • each solder land is managed with a serial solder land No. attached thereto. As long as each solder land is determined to be a stable part, it is not recognized as a part requiring inspection, and the number of uninspected times is counted by an uninspected number counter Cm.
  • an additional priority order is determined for these stable parts, and they are added to the inspection target part according to the additional priority order. Specifically, in the same manner as described above, one solder land according to the additional priority order is added to the inspection target part, and the added inspection target part is used to optimize the above-described inspection procedure.
  • the inspection time t by the printing work result inspection machine 24 is calculated, and when the inspection time t is equal to or shorter than the above-described work tact t T , one solder land according to the additional priority order is further inspected. Add to the target area. Then, each time an addition is made, the examination procedure is optimized. In this way, as many solder lands as possible are added to the inspection target region within a range where the inspection time t does not exceed the work tact t T , and the inspection target region and inspection of the inspection by the printing work result inspection machine 24 are performed. Procedure is determined.
  • the inspection part and inspection procedure determined as described above are notified to the printing work result inspection machine 26, and the printing work result inspection machine 26 outputs the result of the solder printing work according to the notified inspection object part and inspection procedure. inspect. It should be noted that the process for supporting the printing work result inspection machine 26 does not assume the support of the printing work result inspection machine 26 by another device, and therefore is performed in the process for supporting the mounting work result inspection machine 34 and the like. The processing related to the distribution of the inspection target parts is not performed.
  • each of the processes is largely based on the inspection result-based inspection part qualification process for qualifying the inspection required part based on the inspection result information, and the inspection target part / inspection procedure determination mainly determining the inspection target part and the inspection procedure. Since these are divided into processes, these two processes will be described separately.
  • the data of the part information master table includes each part No. of all parts specified by serial numbers, and the position (so-called coordinate position (x, y) of the part on the board associated with the part No. on the board.
  • the required number of inspections Cn 0 that is a necessary number of inspections and an uninspection number counter Cm for counting the number of times that inspections are not continuously performed are configured.
  • the coordinate position (x, y), the set threshold value (C pKx0 , C pKy0 , C pK ⁇ 0 ), the limit value ( ⁇ x L , ⁇ y L , ⁇ L ) and the set required inspection number Cn 0 are the parts
  • the preset value is stored according to the above, and the others are changed / updated as the support process progresses.
  • the inspection required flag is a flag that indicates that the part is an inspection required part when the value is “1”, and that the part is not an inspection required part when the value is “0”.
  • the initial value is “1”.
  • the substrate ID storage cell stores the substrate ID of the substrate to be inspected (the substrate currently being inspected) in each of the mounting module 42 and the mounting operation result inspection machine 34, which are inspection modules.
  • the work tact storage cell stores the work tact t T of the component mounting machine 30.
  • a distribution mode flag Fm is stored in the distribution mode memory cell. This flag Fm is “1” when it is a mode (distribution allowable mode) that permits the allocation of the inspection target parts to both when the mounting operation result inspection machine 34 and the mounting module 42 perform the inspection.
  • the mode is set to “0” when the mode is a mode for prohibiting the allocation of the inspection target part to the mounting module 42 (the distribution prohibiting mode).
  • the inspection result information obtained by the inspection is stored in the inspection result information buffer.
  • the inspection result information includes the part number of the inspected part, the mounting position shift amount ( ⁇ x, ⁇ y, ⁇ ) obtained by the inspection of the part, and whether or not a work defect has occurred in the part. (Indicated by “1” when a work defect has occurred in the part and indicated by “0” when no work defect has occurred).
  • the variable event occurrence information is sent from the mounting work machine 30 every time a specific condition change event occurs, and the variable event occurrence information buffer stores the variable event occurrence information every time it is sent. .
  • the fluctuation event occurrence information includes the board ID of the board on which the component mounting operation is performed at the time when the condition fluctuation event occurs or immediately after that, and the part number of the part that affects the work result on the board.
  • the data storage unit has an additional priority buffer, in which the part number of a part that is not a part to be inspected is added to the part that is a part to be inspected for inspection. They are arranged according to priority. Furthermore, the data storage unit has an inspection target part buffer, and the part numbers of the parts to be the inspection target parts are written in the buffer so as to be arranged according to the inspection order of the parts. In addition, a stop position (x, y) in the substrate coordinate system of the inspection head when inspecting each component is written in the buffer.
  • the inspection result dependent inspection part qualification process which is part of the mounting inspection support process, is performed each time the mounting work result inspection machine 34 and the inspection module 42 have completed inspection of one substrate. Process. This process is performed when the test result-dependent test site certification program shown in the flowchart of FIG. 9 is executed using a test end signal transmitted from the tester 34 or the like as a trigger. The process will be described below with reference to the flowchart.
  • step 1 the same applies to other steps
  • the above-described inspection result information is obtained, and the information is stored in data.
  • the inspection result information buffer Stored in the inspection result information buffer.
  • the component counter Cp is used as a counter indicating which component is currently undergoing a process for certification.
  • this component counter Cp is counted up.
  • S3 whether the component indicated by the counter Cp (hereinafter sometimes referred to as “processing target component”) has been inspected this time. It is determined whether or not. This determination is made based on whether or not there is data on the processing target component in the inspection result information.
  • an uninspected number counter Cm for that component in the component information master table is counted up.
  • the steps after S5 are executed. In that case, first, in S5, the inspection number counter Cn is incremented and the uninspection number counter Cm is reset. In subsequent S6, based on the inspection result information, it is determined whether or not the processing target component is a defective part.
  • parts information master table of the target component process capability index for (C pKx, C pKy, C pK ⁇ ) are included in the test result information It is updated based on the mounting position shift amount ( ⁇ x, ⁇ y, ⁇ ) for the processing target component.
  • the process capability index (C pKx , C pKy , C pK ⁇ ) is not less than the set threshold value (C pKx0 , C pKy0 , C pK ⁇ 0 ), and the mounting position deviation amount ( ⁇ x, ⁇ y, ⁇ ) is the limit value ( If it is determined that ⁇ x L , ⁇ y L , ⁇ L ) has not been exceeded, the process is performed in S10 on condition that the test number counter Cn is determined to be greater than or equal to the set required test number Cn 0 in S9. It is determined that the target part is a stable part, and the inspection required flag Fs is set to “0”.
  • the process capability index in S8 (C pKx, C pKy, C pK ⁇ ) is preset threshold (C pKx0, C pKy0, C pK ⁇ 0) or less Or when the mounting position shift amount ( ⁇ x, ⁇ y, ⁇ ) exceeds the limit values ( ⁇ x L , ⁇ y L , ⁇ L ), that is, the processing target component is an unstable part.
  • the inspection flag Fs for the processing target part in the part information master table is set to “1”, and the process capability index ( C pKx , C pKy , C pK ⁇ ) and the inspection number counter Cn are reset.
  • the processing It is determined whether the target part is the final part. If it is determined that the part is not the final part, the processes after S2 are repeated. If it is determined that the part is the final part, the part counter Cp is reset in S13, the inspection result information stored in the inspection result information buffer is cleared, and the inspection result-dependent inspection part recognition process is performed. finish.
  • Inspection target part / inspection procedure determination process which is a part of the mounting inspection support process, is performed when the mounting work result inspection machine 34 and the inspection module 42 start inspection of one substrate. This is a process to be performed. This processing is performed by executing the inspection target part / inspection procedure determination program shown in the flowchart of FIG. 10 with a test start preparation completion signal transmitted from the inspection machine 34 or the like as a trigger.
  • the inspection target part / inspection procedure for the substrate on which the inspection is started is determined.
  • the inspection target portion in the inspection by the inspection module 42 for the substrate on which the inspection is started Both the inspection procedure and the inspection target part / inspection rank in the inspection by the inspection machine 34 performed subsequent to the inspection are determined.
  • a variable event-dependent inspection part certification process is performed.
  • the board ID of the board to be inspected from now on is stored in the data storage unit, and based on this board ID, the fluctuation event occurrence information stored in the fluctuation event occurrence buffer is stored.
  • the part No. stored in relation to the board ID that matches the board ID is searched, and if there is a corresponding part, the result of the mounting operation of the corresponding part is a condition change event. Therefore, the inspection flag Fs of the relevant part in the part information master table is set to “1”.
  • the process capability index (C pKx , C pKy , C pK ⁇ ) and the inspection number counter Cn of the part are reset.
  • the data about the corresponding part in the change event occurrence information buffer is deleted.
  • an additional prioritization process is performed.
  • the part numbers of parts whose inspection flag Fs is “0” are listed in descending order from the part information master table, with the counter value of the uninspection frequency counter Cm of those parts being the first key.
  • the No value is written into the additional priority buffer in ascending order (ascending order) (the contents of the buffer are rewritten). This written order is a priority order for inspection of parts that are not inspection required parts.
  • the site to be examined is determined as the site to be examined. Specifically, after the inspection target part buffer is cleared, the part numbers of parts whose inspection flag Fs is “1” in the part information master table are written in the buffer in ascending order of the No value. .
  • examination procedure optimization processing is performed. As described above with reference to FIG. 7, this processing is performed so that the inspection heads have the least stop positions and the inspection head movement path around each stop position is the shortest. The stop position (x, y) of the inspection head when inspecting each component is determined. Based on the result of this determination, the part numbers written in the inspection target part buffer are rearranged, and the stop position for each part is written corresponding to each part.
  • the mounting operation result inspecting machine 34 according to test procedure determined, test time in the case of performing the inspection of the inspection target portion are determined, i.e., the minimum required time t 0 is calculated.
  • next S25 it is determined whether or not the calculated minimum required time t 0 is longer than the work tact t T stored in the work tact storage cell. If it is determined that the minimum required time t 0 is longer than the work tact t T , the distribution mode is confirmed in S26. If it is confirmed in S26 that the distribution mode is the distribution prohibition mode, the inspection target region and the inspection procedure determined at the present time, that is, the data stored in the inspection target region buffer are determined in S27. The mounting work result inspection machine 34 is notified, and the inspection target part / inspection procedure determination process is completed. On the other hand, when it is confirmed in S26 that the distribution mode is the distribution allowable mode, in S28, an inspection target part distribution process described later is executed.
  • the mounting module 42 which is the inspection module thereafter, performs the component mounting operation.
  • the distribution mode flag Fm is set to “0”, the distribution mode is set to the distribution prohibition mode, and then in S30, the inspection time by the mounting work result inspection machine 34 is notified. Processing for imitating t M as the inspection time t is performed, and the inspection target part addition processing in S31 is performed.
  • the examination target part addition processing in S31 is performed by executing the examination target part addition subroutine shown in the flowchart in FIG. If described with reference to the flowchart, in the examination target part addition process, first, in S41, one work part is added to the examination target part according to the addition priority determined in S22. Specifically, the part No. of the part that is the one work part is added to the inspection target part buffer. In S42, the inspection procedure optimization process described in S24 is performed, and the inspection time t is calculated. Next, in S43, whether long or not than the inspection time t work tact t T.
  • the processing of S41 and S42, that is, the addition of one work part to the inspection target part, the inspection procedure optimization process, the inspection time t The calculation is repeated. If it is determined in S43 that the inspection time t is longer than the work tact t T , the last added work part is excluded in S44, that is, the part No. of the part that is the work part is inspected. In step S45, the examination procedure optimization process is performed again, and the examination target part addition process ends. After completion of the inspection target part addition process, in S27, the inspection target part and the inspection procedure determined at that time are notified to the mounting work result inspection machine 34, and the inspection target part / inspection procedure determination process ends.
  • the inspection target part distribution process performed in S28 is performed by executing the inspection target part distribution subroutine shown in the flowchart of FIG. Is called.
  • the inspection object part distribution process first, in S51, the inspection object part that can be inspected by the mounting work result inspection machine 34 within the work tact t T is defined as the inspection machine inspection execution part. A part to be inspected that cannot be inspected unless the work tact t T is exceeded is certified as a module inspection execution part.
  • parts that can be inspected within the working tact t T are recognized as inspection part inspection execution parts, and the parts after that are recognized as modules. It is recognized as an examination execution site.
  • the inspection machine inspection execution parts and the inspection procedure determined at the present time for these parts that is, the data stored in the inspection target part buffer for the inspection machine inspection execution part are the mounting work result inspection machine. 34, and the data is deleted from the examination target part buffer.
  • a module minimum required time t M0 that is an inspection time when the inspection module 42 inspects a module inspection execution part is calculated. Specifically, for example, it is possible to easily calculate by subtracting the work tact t T from the minimum required time t 0 calculated in S24.
  • S54 it is determined whether or not the calculated minimum module required time t M0 is longer than the work tact t T. If it is determined that the minimum module required time t M0 is within the working tact t T , the minimum module required time t M is assumed to be the inspection time t in S55, and the module inspection execution part is assumed to be the inspection target part. Processing is performed, and then, in S56, the inspection target part addition processing described above is executed.
  • the inspection machine 34 or the like inspects the inspection target portion determined and notified as described above according to the inspection procedure determined and notified as described above.
  • the inspection is an efficient inspection as described above.
  • Print inspection support processing i) Data used in the print inspection support processing Data used in the print inspection support processing is stored in the data storage unit of the support apparatus 10 as in the case of the mounting inspection support processing. .
  • the stored data is as shown in FIG.
  • the data of the solder land information master table is similar to the data of the previous component information master table, and the solder lands No. of all the solder lands defined by the serial numbers and the solder lands associated with the solder lands No.
  • the substrate ID storage cell stores the substrate ID of the substrate to be inspected (the substrate currently being inspected) in the printing work result inspection machine 26.
  • the work tact storage cell stores the work tact t T of the solder printer 24.
  • the inspection result information buffer includes, as inspection result information, the solder land No. of the inspected solder land, the area variation amount ⁇ s, and the volume variation of the solder land. An amount ⁇ v and a parameter indicating whether a work failure has occurred are written.
  • the variable event occurrence information buffer stores variable event occurrence information sent from the solder printer 24 each time a specific condition change event occurs (a solder printing operation is performed at or immediately after the occurrence of the condition change event.
  • the substrate ID) of the substrate is written.
  • the additional priority buffer and the inspection target part buffer are the same as those in the mounting inspection support process, and the component No. is simply replaced with the solder land No.
  • the inspection target part is not distributed, and the concept of the distribution mode does not exist.
  • Inspection Result Dependent Inspection Part Qualification Process The inspection result dependent inspection part qualification process in the print inspection support process is performed each time the printing work result inspection machine 26 completes inspection of one substrate, as in the case of the mounting inspection support process. This is a process to be performed. This process is performed by executing the inspection result reliance inspection program shown in the flowchart of FIG. 13 as a trigger by the inspection end signal transmitted from the printing work result inspection machine 26.
  • This examination result-dependent examination site certification process is substantially the same as the process in the case of the mounting examination support process.
  • test result-dependent test site certification process first, in S61, the test result information described above is obtained, and the information is stored in the test result information buffer of the data storage unit.
  • a solder counter Cp similar to the component counter Cp is employed.
  • the counter Cp is counted up, and in S63, the solder land (hereinafter referred to as “processing”) indicated by the counter Cp. In this case, it is determined whether or not the inspection is performed this time.
  • the uninspected number counter Cm is incremented in S64.
  • the steps after S65 are executed. In that case, first, in S65, the inspection number counter Cn is incremented and the uninspection number counter Cm is reset. In subsequent S66, it is determined whether or not the processing target land is a defective part based on the inspection result information.
  • the process capability index (C pKs , C pKv ) for the processing target land in the solder land information master table is included in the inspection result information. It is updated based on the area fluctuation amount ⁇ s and the volume fluctuation amount ⁇ v for the land. Subsequently, in S68, whether or not the process capability index (C pKs , C pKv ) of the updated processing target land is equal to or less than the set threshold value (C pKs0 , C pKv0 ), and the current land of the processing target land.
  • the process capability index (C pKs , C pKv ) is not less than the set threshold value (C pKs0 , C pKv0 ), and the area variation ⁇ s and volume variation ⁇ v do not exceed the limit values ( ⁇ s L , ⁇ v L ). If it is determined, as a condition that is determined to be the test number counter Cn must test number Cn 0 or more set in S69, in S70, the processing target land is determined to be stable sites, need for testing The flag Fs is set to “0”.
  • the process capability index (C pKs , C pKv ) is equal to or less than the set threshold value (C pKs0 , C pKv0 ) or the amount of area variation ⁇ s, volume in S68. If it is determined that the fluctuation amount ⁇ v exceeds the limit values ( ⁇ s L , ⁇ v L ), that is, if it is determined that the land to be processed is an instable part, in S71 this is indicated to the operator.
  • the inspection required flag Fs for the land to be processed in the solder land information master table is set to “1”, and the process capability index (C pKs , C pKv ) and the inspection number counter Cn for the solder land are set. Reset.
  • Inspection target part / inspection procedure determination process in the print inspection support process is a process performed when the printing work result inspection machine 26 starts inspection of one substrate. This process is performed when the inspection target part / inspection procedure determination program shown in the flowchart of FIG. 14 is executed by using, as a trigger, an inspection start preparation completion signal transmitted from the printing work result inspection machine 26.
  • the process will be described with reference to a flowchart.
  • a variable event-dependent inspection part certification process is performed.
  • the inspection flag Fs for all the solder lands in the solder land information master table is set to “1”.
  • the process capability index (C pKs , C pKv ) and inspection number counter Cn of the solder land are reset.
  • solder land Nos Of the solder lands whose inspection flag Fs is “0” from the solder land information master table are countered using the uninspection count counter Cm of those solder lands as the first key.
  • the values are written in the additional priority buffer in the order of increasing value (descending order) and the solder land No. itself as the second key in ascending order of the No value (ascending order) (the contents of the buffer are rewritten). This written order is a priority for the inspection of the solder lands that are not the inspection required site.
  • the site to be inspected is determined as the site to be inspected. Specifically, after the inspection target part buffer is cleared, the solder land No. of the solder land whose inspection flag Fs is “1” in the solder land information master table is small in the buffer. Written in order.
  • examination procedure optimization processing is performed. This process is the same as that in the case of the mounting inspection support process described above. As described above with reference to FIG. 7, the inspection head has the smallest stop position and goes through each stop position. The inspection order of the solder lands and the inspection head stop position (x, y) at the time of inspection of each solder land are determined so that the movement path of the inspection head is the shortest.
  • the solder lands No. written in the inspection target part buffer are rearranged, and the stop position for each solder land is written corresponding to each solder land.
  • the printing operation result inspecting machine 26 according to test procedure determined, test time in the case of performing the inspection of the inspection target portion are determined, i.e., the minimum required time t 0 is calculated.
  • next S85 it is determined whether or not the calculated minimum required time t 0 is longer than the work tact t T stored in the work tact storage cell. If it is determined that the minimum required time t 0 is within the work tact t T , the processes of S86 to S90 are performed.
  • the processing in these steps is the same processing as the inspection target part addition processing described above regarding the mounting inspection support processing. More specifically, first, in S86, one work part is added to the examination target part in accordance with the additional priority determined in S82. Specifically, the solder land No. of the solder land that is the one work site is added to the inspection target site buffer. In S87, the inspection procedure optimization process described in S84 is performed, and the inspection time t is calculated.
  • step S88 whether long or not than the inspection time t work tact t T.
  • the processing of S86 and S87 that is, the addition of one work portion to the inspection target portion, the inspection procedure optimization processing, the inspection time t The calculation is repeated. If it is determined in S88 that the inspection time t is longer than the work tact t T , the last added work site is excluded in S89, that is, the solder land No. of the solder land that is the work site is determined.
  • step S90 the examination procedure optimization process is performed again.
  • the printing work result inspection machine 26 inspects the inspection target portion determined and notified as described above according to the inspection procedure determined and notified as described above.
  • the inspection is an efficient inspection as described above.
  • the board-to-board inspection support apparatus 10 performs the mounting inspection support process and the print inspection support process as described above, and thus can be considered to have a functional configuration as shown in FIG.
  • the support apparatus 10 has a plurality of functional units that are connected to each other by a virtual internal bus 150, an information acquisition unit 152, a test result dependence certification unit 154, and a variable event dependence certification unit 156. It has an inspection target region determination unit 164, an inspection procedure determination unit 166, a notification unit 168, and a data storage unit 170, which include a region recognition unit 158, an inspection target region addition unit 160, and an inspection target region distribution unit 162.
  • the support apparatus 10 is connected to the inspection module 42 and the mounting work result inspection machine 34 in the printing work result inspection machine 26 and the component mounting machine 30, which are inspection apparatuses, via the LAN 140, respectively. It is connected to a solder printer 24 and a component mounting machine 30 which are board working machines.
  • the information obtaining unit 152 has a function of receiving inspection result information from the inspection device.
  • the inspection required part recognition unit 158 is a functional part that recognizes the inspection required part that is a work part to be inspected
  • the inspection result dependence recognition part 154 is an inspection of the printing work result inspection machine 26 and the component mounting machine 30. Based on the inspection result information received from the module 42 and the mounting operation result inspection machine 34, it has a function of certifying the inspection required part
  • the variation event dependence recognition unit 156 is based on a condition variation event that is an event in which the work condition varies. , It has a function to certify the inspection site.
  • the inspection target part determination unit 164 is a functional part that determines the inspection target part that is a work part that is a target in the inspection
  • the inspection target part addition unit 160 is a part other than the inspection target part based on the set rules.
  • the inspection part distribution unit 162 includes a plurality of inspection apparatuses, specifically, the inspection module 42 and the mounting work result inspection machine 34 to determine the inspection target part. When performing the inspection, it has a function of assigning the inspection target parts to them. In other words, when the time required for the inspection of the inspection target part by one inspection apparatus exceeds the work tact for the substrate work, the inspection target part distribution unit 162 separates a part of the inspection target part from another inspection. It has a function to distribute to devices.
  • the inspection procedure determination unit 166 has a function of determining an inspection procedure when the inspection apparatus inspects the inspection target region, and the notification unit 168 includes the inspection target region determined by the inspection target region determination unit 164, And it has the function to notify the inspection procedure determined by the inspection procedure determination unit 166 to the inspection apparatus.
  • the data storage unit 170 has a function of storing the various data used in the mounting inspection support process and the print inspection support process.
  • the information acquisition part 152 is a function part which performs the process of S1.
  • the examination site certification unit 158 is a functional unit that performs the processes of S2 to S13 and S21. Among them, the test result dependence certification unit 154 performs the processes of S2 to S13, and the variable event dependence certification unit 156 performs the processes of S21. Process.
  • the inspection target part determination unit 164 is a functional part that performs central processing in the processes of S23 to S31. During the processing, the inspection target part addition unit 160 is related to the process of S22 and the inspection target part addition subroutine.
  • the inspection target part distribution unit 162 performs processing related to the inspection target part distribution subroutine including S51.
  • the inspection procedure determination unit 166 performs inspection procedure optimization processing in S24, S42, and S45, and the notification unit 168 performs processing of S27 and S57.
  • the information acquisition unit 152 is a functional unit that performs the process of S61.
  • the examination site certification unit 152 is a functional unit that performs the processes of S62 to S73 and S81.
  • the examination result dependence certification unit 154 performs the processes of S62 to S73, and the variable event dependence certification unit 156 performs the process of S81.
  • the examination target site determination unit 164 is a functional unit that performs central processing in the processing of S82 to S91.
  • the examination target site addition unit 160 performs the processing of S82, S86, and S89.
  • the inspection procedure determination unit 166 performs inspection procedure optimization processing in S84, S87, and S90, and the notification unit 168 performs processing of S91. Note that the inspection target part distribution unit 162 does not function in the print inspection support process.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention porte sur un dispositif, hautement pratique, d'aide à l'inspection d'opérations sur des cartes de circuits imprimés. Un dispositif (10) d'aide à l'inspection d'opérations sur des cartes de circuits imprimés est configuré de telle sorte que des sections de travail qu'un dispositif d'inspection doit inspecter sont identifiées sur la base d'au moins l'une parmi des informations de résultats d'inspection reçues en provenance de dispositifs d'inspection (26, 34, 42) ou d'un événement dans lequel une condition d'opération change (154, 156, 158), et au moins ces sections sont déterminées comme étant des sections à inspecter (164). En outre, des sections autres que les sections d'opération qui doivent être inspectées peuvent être ajoutées lors de la détermination des sections à inspecter (160), et lorsque deux dispositifs d'inspection (34, 42) sont aidés, les sections à inspecter peuvent être attribuées entre ces deux dispositifs d'inspection. Selon le dispositif d'aide à l'inspection d'opérations sur des cartes de circuits imprimés configuré comme décrit ci-dessus, étant donné que les sections à inspecter sont déterminées sur la base du fait qu'un défaut d'opération s'est produit et de la prédiction qu'un défaut d'opération se produira, il est possible d'établir une ligne de production de circuits électriques hautement productive tout en conservant une qualité élevée des circuits électriques.
PCT/JP2012/063276 2011-05-31 2012-05-24 Dispositif d'aide à l'inspection d'opérations sur des cartes de circuits imprimés Ceased WO2012165274A1 (fr)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015004733A1 (fr) * 2013-07-09 2015-01-15 富士機械製造株式会社 Dispositif de commande d'inspection, système de montage et procédé de commande d'inspection
JPWO2014091546A1 (ja) * 2012-12-10 2017-01-05 富士機械製造株式会社 はんだ印刷機
JPWO2015075776A1 (ja) * 2013-11-19 2017-03-16 富士機械製造株式会社 検査装置

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Publication number Priority date Publication date Assignee Title
CN105990178B (zh) * 2015-02-25 2019-01-08 中芯国际集成电路制造(上海)有限公司 异常机台的检测方法和检测设备
CN109997426B (zh) * 2016-11-17 2020-11-24 株式会社富士 作业机
EP3547815B1 (fr) * 2016-11-22 2022-11-30 Fuji Corporation Machine de montage
WO2020016991A1 (fr) * 2018-07-19 2020-01-23 株式会社Ｆｕｊｉ Dispositif et procédé de définition de test
JP7195914B2 (ja) * 2018-12-20 2022-12-26 ヤマハ発動機株式会社 部品実装システム
JP7601589B2 (ja) * 2020-09-24 2024-12-17 株式会社Fuji 検査支援装置および検査支援方法
WO2022269679A1 (fr) * 2021-06-21 2022-12-29 株式会社Fuji Procédé de contrôle pour système de montage de composant et système de montage de composant

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0862275A (ja) * 1994-08-24 1996-03-08 Matsushita Electric Ind Co Ltd 実装検査データ作成方法
JP2003124699A (ja) * 2001-10-11 2003-04-25 Fuji Mach Mfg Co Ltd 対基板作業結果検査装置、対基板作業結果検査方法、電気回路製造システムおよび電気回路製造方法
JP2004235582A (ja) * 2003-01-31 2004-08-19 Omron Corp 実装間違い検査方法およびこの方法を用いた基板検査装置
JP2004260034A (ja) * 2003-02-27 2004-09-16 Omron Corp 基板検査方法およびこの方法を用いた基板検査装置
JP2006317266A (ja) * 2005-05-12 2006-11-24 Omron Corp 検査基準設定装置及び方法、並びに、工程検査装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0862275A (ja) * 1994-08-24 1996-03-08 Matsushita Electric Ind Co Ltd 実装検査データ作成方法
JP2003124699A (ja) * 2001-10-11 2003-04-25 Fuji Mach Mfg Co Ltd 対基板作業結果検査装置、対基板作業結果検査方法、電気回路製造システムおよび電気回路製造方法
JP2004235582A (ja) * 2003-01-31 2004-08-19 Omron Corp 実装間違い検査方法およびこの方法を用いた基板検査装置
JP2004260034A (ja) * 2003-02-27 2004-09-16 Omron Corp 基板検査方法およびこの方法を用いた基板検査装置
JP2006317266A (ja) * 2005-05-12 2006-11-24 Omron Corp 検査基準設定装置及び方法、並びに、工程検査装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014091546A1 (ja) * 2012-12-10 2017-01-05 富士機械製造株式会社 はんだ印刷機
WO2015004733A1 (fr) * 2013-07-09 2015-01-15 富士機械製造株式会社 Dispositif de commande d'inspection, système de montage et procédé de commande d'inspection
JPWO2015075776A1 (ja) * 2013-11-19 2017-03-16 富士機械製造株式会社 検査装置

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