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WO2012150782A1 - Dispositif d'essai visuel utilisant une plaque polarisante et un motif multi-réseau - Google Patents

Dispositif d'essai visuel utilisant une plaque polarisante et un motif multi-réseau Download PDF

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Publication number
WO2012150782A1
WO2012150782A1 PCT/KR2012/003293 KR2012003293W WO2012150782A1 WO 2012150782 A1 WO2012150782 A1 WO 2012150782A1 KR 2012003293 W KR2012003293 W KR 2012003293W WO 2012150782 A1 WO2012150782 A1 WO 2012150782A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
grid pattern
polarizing plate
camera unit
vision inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/003293
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English (en)
Korean (ko)
Inventor
박찬화
김성현
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MER SKILFUL FEAT CO Ltd
Original Assignee
MER SKILFUL FEAT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MER SKILFUL FEAT CO Ltd filed Critical MER SKILFUL FEAT CO Ltd
Publication of WO2012150782A1 publication Critical patent/WO2012150782A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8848—Polarisation of light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

Definitions

  • the present invention relates to a vision inspection apparatus, and more particularly, to adjust the intensity of light used for vision inspection, and to perform a vision inspection by performing a vision inspection using a wider grid pattern and a narrower grid pattern, faster vision inspection
  • the present invention relates to a vision inspection apparatus using a multi-grid pattern that can be performed accurately.
  • SMT Surface Mounting Technology
  • PCB printed circuit board
  • SMD surface-mounting components
  • Surface mount lines consist of equipment such as surface mounters and vision inspection equipment.
  • the surface mounter is a device for mounting surface-mounted parts on a printed circuit board.
  • the surface mounter receives various surface-mounted parts supplied in the form of tape, stick, and tray from a feeder and places them on the mounting position on the printed circuit board. Perform.
  • the vision inspection apparatus inspects the mounting state of the surface mount component before or after the soldering process of the surface mount component is completed and transfers the printed circuit board to the next process according to the inspection result.
  • a conventional vision inspection apparatus includes an illumination unit 110 to which light is irradiated using a lamp and the like, and image information of various components mounted on an inspection object installed on the illumination unit 110. And a half mirror 130 for reflecting the light from the illumination unit 110 to photograph and reflecting the light from the illumination unit 110 to transmit the shape of the inspection object to the camera unit.
  • the lighting unit 110 is arranged in the housing 140 by arranging a plurality of lamps, and, when irradiating the light to the inspection object to supply power to the plurality of lamps to irradiate light.
  • the initial position is adjusted by the position adjusting device, and after the adjustment is completed, when irradiated with light through the grid on the LED part or the printed circuit board, the irradiated
  • the three-dimensional height is measured.
  • All of the above inspection methods measure the two-dimensional shadow shape and calculate the three-dimensional height by using a trigonometric function.
  • the reflected light becomes too bright due to scattering of light in the metal part such as the lead part or the solder part.
  • the height of the test object is relatively higher than the interval between the grid patterns. It is not possible to distinguish which of (1, 2, 3) and the bottom lattice 1-1, 2-1, 3-1 are the same lattice in the first place.
  • a half mirror provided for capturing an image while reflecting light is disposed in front of the center camera unit, thereby preventing a clearer image.
  • an object of the present invention is to provide a vision inspection apparatus that can effectively reduce the intensity of light generated from the metal surface of the component to perform a more accurate inspection .
  • Another object of the present invention is to provide a vision inspection apparatus capable of measuring the height of an inspection object quickly and accurately.
  • Still another object of the present invention is to provide a vision inspection apparatus capable of improving the uniformity of light irradiated onto a surface of an inspection object.
  • Still another object of the present invention is to provide a vision inspection apparatus capable of capturing a clearer image by removing a half mirror disposed in front of a central camera unit.
  • a vision inspection apparatus for determining good or bad of an inspection object comprising: a stage unit for fixing or transferring the inspection object to an inspection position, an illumination unit positioned at an upper portion of the stage unit, and providing illumination to the inspection object; A central camera unit positioned at the center of an illumination unit to obtain a two-dimensional shape of an inspection object, a side camera unit disposed in a plurality of sides of the central camera unit, and between the camera of the side camera unit and the camera at the side of the central camera unit; A plurality of grid pattern irradiation unit disposed in the, and taken by the central camera unit And a control unit for controlling the stage unit, the lattice pattern irradiation unit, and the camera unit by reading an image to determine whether the inspection object is good or bad, and the grid pattern i
  • the grid pattern irradiation unit may include any one of a liquid crystal panel or a micromirror module.
  • the grid pattern irradiation unit is composed of a plurality, it is configured to irradiate the grid pattern of a larger period and the grid pattern of a smaller period at the same time or sequentially.
  • a light diffusing unit may be disposed in front of the lighting unit.
  • the lighting unit may include a horizontal lighting unit for irradiating light in the vertical downward direction and an inclined lighting unit for irradiating light in the oblique direction.
  • the plurality of grid pattern irradiation units are disposed to face each other with respect to the central camera unit.
  • the side camera parts may be disposed to face each other with respect to the center camera part.
  • the light diffusing unit may be disposed in front of both the horizontal lighting unit and the inclined lighting unit.
  • a positioning camera unit for checking the position of the inspection object may be disposed at one side of the central camera unit.
  • the positioning lighting unit and the half mirror may be disposed in front of the positioning camera unit.
  • the angle between the central camera portion and the grid pattern irradiation portion on the side view is 25 degrees to 45 degrees.
  • the grid pattern irradiator and the polarizing plate disposed in the central camera unit is configured to be rotatable.
  • one of the grid pattern irradiation unit irradiates the grid pattern of a large period with one predetermined color
  • the other grid pattern irradiation unit to irradiate the grid pattern of a small period with another predetermined color. It is composed.
  • the intensity of light generated on the metal surface of the part can be effectively lowered, so that more accurate inspection can be performed.
  • the height of the inspection object can be calculated quickly and accurately.
  • the uniformity of the light irradiated on the surface of the inspection object can be improved.
  • FIG. 1 is a side cross-sectional view of a conventional vision inspection apparatus.
  • Fig. 2A is a perspective view showing a state in which a lattice pattern is irradiated to the part.
  • Fig. 2B is a plan view showing a state in which a lattice pattern is irradiated to the part.
  • FIG. 3 is a schematic side view of a vision inspection apparatus according to the present invention.
  • FIG. 4 is a schematic plan view of a vision inspection apparatus according to the present invention.
  • 5 is a conceptual diagram showing the relationship between the period of the lattice pattern and the height of the parts.
  • FIG 3 is a schematic side view of a vision inspection apparatus according to the present invention
  • Figure 4 is a schematic plan view of the vision inspection apparatus according to the present invention.
  • a vision inspection apparatus for determining the good or bad of the inspection object (5) compared with the target image comprising: a stage portion (10) for fixing or conveying the inspection object (5) at an inspection position, and the stage portion (10) Located in the upper portion of the illumination unit 20 for providing illumination to the inspection object 5, the central camera unit 30 and positioned in the center of the illumination unit 20 to obtain a two-dimensional shape of the inspection object and And side camera parts 40-2, 40-4, 40-6, and 40-8 arranged on the side of the central camera part, and the side camera part 40-at the side of the central camera part 30.
  • Vision inspection apparatus of the present invention is installed to perform the vision inspection before moving to the next process through the conveyor of the preceding equipment, when inspecting the surface-mounted parts of the printed circuit board after the surface mounting work in the surface mounting line .
  • Such vision inspection apparatus can be installed in a manner that is arranged in the space formed between the conveyor of the line, trailing equipment and the conveyor, can also be used in the form of a single table without being connected to the line, trailing equipment.
  • the stage unit 10 is a component that provides a space in which the inspected object 5 to be inspected is seated, and a position adjusting unit (not shown) and a high position for adjusting and fixing the position of the inspected object 5. It may be configured to include a government (not shown).
  • the lighting unit 20 is installed on the upper portion of the stage unit 10 continuously or intermittently along the circumferential direction around the central camera unit 30.
  • the lighting unit 20 is a component that provides illumination to the inspection object 5 in order to secure accurate image information of the inspection object 5, by placing a plurality of lamps or LED bulbs to the inspection object (5) ) Can be arranged to illuminate from side to side.
  • the lighting unit 20 includes a horizontal lighting unit 22 and the inclined lighting unit 23.
  • the horizontal lighting unit 22 is installed on the upper portion of the stage 10 serves to provide the light incident to the inspection object (5) perpendicularly.
  • the inclined light unit 23 is disposed at the side of the horizontal light unit 22 to provide light in the oblique direction.
  • the central camera unit 30 is a component for photographing the inspection object 5 in a plan view, and preferably, may be provided as a charge coupled device (CCD) camera.
  • CCD charge coupled device
  • the degree of deformation of the pattern can be measured the height of the inspection object.
  • a half mirror is disposed in front of the center camera unit, and reflects the light from the lighting unit, and is configured to capture an image through the camera.
  • the center camera unit 30 No half mirror is placed in front.
  • a plurality of side camera units 40-2, 40-4, 40-6, and 40-8 are arranged symmetrically with respect to the center camera unit 30 on the side of the central camera unit 30, thereby providing an image. Eliminate blind spots and take pictures quickly.
  • the four side camera parts 40-2, 40-4, 40-6, and 40-8 are symmetrically arranged with respect to the center camera part 30, such as a substrate. Examine the lifting and uninsertion of the parts placed on the inspection object.
  • the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) is a configuration for measuring the height by irradiating the grid pattern on the inspection object 5, a liquid crystal panel or a digital micromirror display ( DMD: Digital Micromirror Display and light source.
  • DMD Digital Micromirror Display and light source.
  • the grid-shaped pattern is irradiated onto the inspection object 5 by the control of the control unit 70, and the degree of deformation of the grid-shaped pattern is photographed through the central camera unit 30, We can calculate the height of.
  • the central camera unit 30 and the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 are polarizing plates 33, 53-2, 53-4, 53-6, 53-8 Are installed respectively.
  • the grid pattern irradiated from the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 is the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8)
  • the light is irradiated through the polarizing plates 53-2, 53-4, 53-6, and 53-8 disposed in the light emitting plate, and photographed by passing through the polarizing plate 33 disposed in the central camera unit 30.
  • the intensity of the light can be adjusted by removing the reflected light having the original polarization direction and using only the light of the remaining constant polarization direction for imaging.
  • the polarizing plates are disposed in the central camera unit 30 and the grid pattern irradiation units 50-2, 50-4, 50-6, and 50-8, respectively, and the polarizing plates are disposed to be rotated 90 degrees from each other.
  • light whose polarization direction is not rotated among the light scattered on the metal surface is filtered out, and only the remaining lights can be used for imaging.
  • the polarizing plates 33, 53-2, 53-4, 53-6, and 53-8 are rotatable to adjust the intensity of the reflected light.
  • the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 also has four grid pattern irradiation units 50-2, 50-4, 50-6, centered on the central camera unit 30. 50-8) are arranged symmetrically and configured to irradiate the object 5 with the grid.
  • the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 is configured to irradiate the grid pattern of various colors, such as red, blue.
  • one of the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) of the grid pattern irradiation unit irradiates the grid pattern of a larger gap as one color, the other grid pattern irradiation unit By simultaneously irradiating smaller grids with different colors, more accurate height measurements can be made while reducing the time required for component height measurements.
  • one of the grid pattern irradiation unit (50-2, 50-4, 50-6, 50-8) of the grid pattern irradiation unit irradiates the grid pattern of a larger gap in red
  • the other grid pattern The irradiation unit may irradiate the grids of smaller intervals in blue, and may irradiate the grids of larger intervals and the grids of smaller intervals.
  • the arrangement angle a between the grid pattern irradiation unit 50-2, 50-4, 50-6, 50-8 and the central camera unit 30 is arranged in an angle range of 25 degrees to 45 degrees. .
  • the angle (a) When the angle (a) is smaller than 25 degrees, the degree of deformation of the grid pattern according to the height of the component is small, which may cause an error in the height calculation.
  • the angle (a) is larger than 45 degrees, the grid pattern irradiation unit ( 50-2, 50-4, 50-6, 50-8), the difference in the width of the grid pattern irradiated on the near and far sides is too large, which may cause errors in the height calculation.
  • the vision processing unit 60 calculates the image information of the inspection object 5 obtained from the camera unit through a mathematical process such as Fourier transform (Fourier Transform), and compares with the reference value input in advance The good or bad of the object 5 is determined.
  • a mathematical process such as Fourier transform (Fourier Transform)
  • control unit 70 is a component including a motion controller for controlling the driving and operation of the stage unit 10 and the camera unit, and may be provided to control driving of the entire vision inspection apparatus according to the present invention.
  • the controller 70 is responsible for physical control such as photographing position control of the vision inspection apparatus, processing of photographed images, and lighting unit control according to a system control program, as well as performing inspection task and data calculation task.
  • control unit 70 is in charge of the overall control of the vision inspection device, such as output device control for outputting the work contents and inspection results to the monitor and input device control for the operator to set and input various items.
  • the light diffusion unit 25 such as a light diffusion plate is disposed in front of the illumination unit 20, so that the light from the illumination unit 20 is evenly irradiated to the entire area of the inspection object.
  • the light diffusion unit 25 is configured to be bent in a side cross-section so that the light diffusion unit 25 can be disposed in front of both the horizontal light unit 22 and the inclined light unit 23.
  • a positioning camera unit 80 for checking the position of the inspection object.
  • the positioning lighting unit 84 and the half mirror 82 is disposed in front of the positioning camera unit 80.
  • the configuration for positioning is accommodated in the housing of the separate positioning camera unit 80, thereby reducing the housing diameter of the central camera unit 30 It can be reduced and management is easy even in case of accessory failure.
  • 5 is a conceptual diagram showing the relationship between the period (interval) of the lattice pattern and the height of the part.
  • the straight lines connecting the points a, b, c and d conceptually show the height that can be measured by the lattice pattern having a large period.
  • a large periodic grid has a resolution of 500 micrometers, so all heights from 0 to 500 micrometers are recognized as the same height, and another height from 500 to 1000 micrometers.
  • the approximate height of the component is measured using a large-gap grid pattern of red color, for example, irradiated by one of the grid pattern irradiation units 50-2, 50-4, 50-6, and 50-8. Done.
  • the height of the hexahedral shaped part illustrated in FIG. 5 is 1680 micrometers, the height of the part is primarily measured in the range of 1500 and 2000 micrometers through the lattice of a large period.
  • the total height of the part is 1500 + 180, measured 1680 micrometers.
  • the lattice pattern corresponding to the first lattice pattern on the left side of FIG. 1 Plaid, 2-1 Plaid, 3-1 Plaid that is, whether the plaid on the top of the part and the plaid on the bottom coincide after several cycles (lattice spacing) Cannot be judged.
  • the large period plaid and the small period plaid are photographed by irradiating the large interval plaid and the small period plaid once, or irradiating the large interval plaid once according to the requirements of the height inspection device.
  • Photographed by a small interval the grid pattern may be configured to enable a more accurate height measurement by photographing while moving between the large interval grid pattern.
  • the larger plaid spacing is preferably comprised three to six times larger than the smaller plaid spacing.
  • the lattice spacing of a large period is less than three times, the difference in measurement resolution due to the difference of the period size is not large, which is not desirable for more accurate height measurement. If the lattice spacing of a large period exceeds six times, The difference between the spacing and the small spacing becomes so large that it has an undesirable effect on the sharpness of the grid shape finally reflected on the inspection object.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Operations Research (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

La présente invention concerne un dispositif d'essai visuel utilisant une plaque polarisante et un motif multi-réseau, lequel dispositif permet de différencier des objets d'essai selon qu'ils sont satisfaisants ou pas en photographiant au moyen d'un appareil photo un objet d'essai assemblé au cours d'un processus d'assemblage de composants ou mis en œuvre à cette occasion et en comparant l'image photographiée avec une image cible précédemment entrée dans le système. Ledit dispositif comprend une unité de type platine permettant de disposer ou de déplacer l'objet d'essai jusqu'à un emplacement d'essai ; une unité d'éclairage située sur la partie supérieure de l'unité de type platine et permettant d'éclairer l'objet d'essai ; une unité de type appareil photo central située au centre de l'unité d'éclairage et qui permet d'obtenir une forme en deux dimensions de l'objet d'essai ; des unités de type appareils photos latéraux situées sur les côtés de l'appareil photo central ; plusieurs unités d'exposition à un motif multi-réseau placées sur les côtés de l'unité de type appareil photo central, entre l'appareil photo de l'unité de type appareil photo latéral et l'appareil photo central ; une unité de traitement visuel servant à lire l'image photographiée par l'appareil photo central et à différentier les objets d'essai satisfaisants de ceux qui ne le sont pas ; et une unité de commande servant à commander l'unité de type platine, les unités d'exposition à un motif multi-réseau et l'unité de type appareil photo, lesdites unités d'exposition à un motif multi-réseau et l'unité de type appareil photo central étant équipées d'une plaque polarisante et les unités d'exposition à un motif multi-réseau étant conçues de façon à assurer une exposition à des motifs de type réseau dont les cycles sont caractérisés par des intervalles différents.
PCT/KR2012/003293 2011-05-02 2012-04-27 Dispositif d'essai visuel utilisant une plaque polarisante et un motif multi-réseau Ceased WO2012150782A1 (fr)

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KR10-2011-0041573 2011-05-02
KR1020110041573A KR101268549B1 (ko) 2011-05-02 2011-05-02 편광판과 다중 격자 무늬를 이용한 비전검사장치

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CN110068582A (zh) * 2019-04-12 2019-07-30 广德今腾电子科技有限公司 一种aoi印制板检测系统

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US9810641B2 (en) 2013-09-03 2017-11-07 Kulicke & Soffa Industries, Inc. Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
KR101973482B1 (ko) * 2017-06-20 2019-04-29 김덕후 동축 조명 장치
KR102168001B1 (ko) * 2019-01-08 2020-10-20 임로빈 투명 제품 검사용 lcd 디스플레이 조명 및 이를 구비한 투명 제품 검사 장치

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JP2007333591A (ja) * 2006-06-15 2007-12-27 Daiichi Jitsugyo Viswill Co Ltd 検査用照明装置
KR101000047B1 (ko) * 2008-04-18 2010-12-09 주식회사 미르기술 비전 검사 시스템

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Publication number Priority date Publication date Assignee Title
KR100378490B1 (ko) * 2001-04-06 2003-03-29 삼성테크윈 주식회사 씨씨디 카메라의 조명장치
KR100406843B1 (ko) * 2001-04-06 2003-11-21 (주) 인텍플러스 색정보를 이용한 실시간 3차원 표면형상 측정방법 및 장치
JP2007333591A (ja) * 2006-06-15 2007-12-27 Daiichi Jitsugyo Viswill Co Ltd 検査用照明装置
KR101000047B1 (ko) * 2008-04-18 2010-12-09 주식회사 미르기술 비전 검사 시스템

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110068582A (zh) * 2019-04-12 2019-07-30 广德今腾电子科技有限公司 一种aoi印制板检测系统
CN110068582B (zh) * 2019-04-12 2021-08-20 广德今腾电子科技有限公司 一种aoi印制板检测系统

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KR101268549B1 (ko) 2013-05-28

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