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WO2012140964A1 - Substrat multicouche flexible avec composants électroniques incorporés - Google Patents

Substrat multicouche flexible avec composants électroniques incorporés Download PDF

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Publication number
WO2012140964A1
WO2012140964A1 PCT/JP2012/054932 JP2012054932W WO2012140964A1 WO 2012140964 A1 WO2012140964 A1 WO 2012140964A1 JP 2012054932 W JP2012054932 W JP 2012054932W WO 2012140964 A1 WO2012140964 A1 WO 2012140964A1
Authority
WO
WIPO (PCT)
Prior art keywords
multilayer substrate
flexible multilayer
electronic component
built
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2012/054932
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English (en)
Japanese (ja)
Inventor
喜人 大坪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2012140964A1 publication Critical patent/WO2012140964A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding

Definitions

  • the present invention relates to an electronic component built-in flexible multilayer substrate, and more particularly to an electronic component built-in flexible multilayer substrate excellent in a function of radiating heat generated from the built-in electronic component.
  • a flexible multilayer substrate is flexible and can be greatly deformed, and a limited space in the case of the device can be effectively used. Since it is possible to realize a complicated electronic circuit, it is widely used.
  • This flexible multilayer substrate is formed by laminating a plurality of resin films made of polyimide or the like, in which conductive vias are formed at predetermined positions and wiring conductors made of copper foil or the like are formed on the surface, and heated and pressurized, It is formed by integrating.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-158545 discloses a metal having high thermal conductivity such as Al, Cu, and Mo on the main surface of a flexible multilayer substrate directly above a built-in electronic component (semiconductor element).
  • An electronic component built-in flexible multi-layer substrate provided with a heat sink composed of the above is disclosed.
  • a via conductor (however, not electrically connected between the two) may be provided as a heat radiating path.
  • the conventional flexible multilayer board with built-in electronic components described above has a problem that the heat sink prevents the height reduction and the size reduction.
  • the heat sink even if the heat sink itself has a large heat absorption effect, there is a problem that if it is used continuously, heat will be trapped in the heat sink, and the built-in electronic components will break and become inoperable or malfunction. .
  • the present invention has been made to solve the problems of the above-described conventional flexible multilayer board with built-in electronic components.
  • the flexible multilayer substrate with built-in electronic components of the present invention includes a plurality of laminated resin films, via conductors formed at predetermined positions of the resin film, and wiring conductors formed between predetermined layers of the resin film.
  • An electronic component is embedded in a flexible multilayer substrate having the structure, and at least a part of the surface of the embedded electronic component is exposed from the flexible multilayer substrate.
  • At least a part of the upper surface of the built-in electronic component may be exposed from the flexible multilayer substrate.
  • the side surface of the built-in electronic component may be exposed from the flexible multilayer substrate.
  • the terminal electrodes of the built-in electronic component may be exposed from the flexible multilayer substrate.
  • the heat generated from the built-in electronic component can be efficiently dissipated to the outside.
  • At least one electronic component may be built in one main surface side of the flexible multilayer substrate, and at least one other electronic component may be built in the other main surface side of the flexible multilayer substrate.
  • heat generated from the built-in electronic component can be efficiently dissipated from both main surfaces of the flexible multilayer substrate.
  • the electronic component built in one main surface side of the flexible multilayer substrate and the electronic component built in the other main surface side of the flexible multilayer substrate are When seen through, at least a part of them may overlap.
  • the strength of the rigid region of the flexible multilayer substrate in which the electronic component is incorporated can be improved.
  • the electronic component built-in flexible multilayer substrate of the present invention having the above-described configuration efficiently dissipates heat generated from the embedded electronic component to the outside from the surface of the electronic component exposed from the flexible multilayer substrate. Can do. In addition, since a separate heat sink is not provided, a reduction in height and a reduction in size are not hindered.
  • FIG. 1 is a cross-sectional view showing an electronic component built-in flexible multilayer substrate 100 according to a first embodiment of the present invention.
  • FIGS. 2A to 2F are cross-sectional views showing respective steps applied in an example of a method for manufacturing the electronic component built-in flexible multilayer substrate 100.
  • 3G and 3H are continued from FIG.
  • It is sectional drawing which shows the electronic component built-in flexible multilayer substrate 200 concerning 2nd Embodiment of this invention.
  • It is sectional drawing which shows the electronic component built-in flexible multilayer substrate 300 concerning 3rd Embodiment of this invention.
  • FIG. 1 shows a flexible multilayer substrate 100 with a built-in electronic component according to a first embodiment of the present invention.
  • the electronic component 2 is embedded in the flexible multilayer substrate 1.
  • the flexible multilayer substrate 1 includes a plurality of laminated resin films 3.
  • a resin film 3 for example, a thermoplastic resin such as polyimide or polyester is used.
  • the thickness of the resin film 3 is, for example, about 10 ⁇ m to 100 ⁇ m.
  • via conductors 4 are formed at predetermined positions so as to penetrate between both main surfaces of the resin film 3.
  • the via conductor 4 is formed by filling the through hole with a conductive paste whose main component is a metal such as Cu, Ag, or Sn.
  • a wiring conductor 5 having a desired shape is formed on one main surface of the resin film 3.
  • a copper foil is used for the wiring conductor 5.
  • the thickness of the wiring conductor 5 is, for example, about 5 ⁇ m to 50 ⁇ m.
  • the wiring conductor 5 may be attached to the resin film 3 with an adhesive, or may be attached by heating and pressing without an adhesive.
  • the flexible multilayer substrate 1 includes a rigid region R having a large number of layers of the resin film 3 to be laminated and a low flexibility and a flexible region F having a small number of layers of the resin film 3 to be laminated and a large flexibility. .
  • the flexible multilayer substrate 1 is housed in a compact manner, for example, in the case of the device by mainly deforming the flexible region F.
  • the electronic component 2 is built in the rigid region R of the flexible multilayer substrate 1.
  • the four electronic components 2 are seen through in the laminating direction of the resin film 3 on the one main surface side and the other main surface side of the flexible multilayer substrate 1 two by two in the rigid region R. Built-in to overlap.
  • the rigid region R of the flexible multilayer substrate 1 has improved strength because the two electronic components 2 are built in the stacking direction.
  • the heat generated in the electronic component 2 is from both main surface sides of the flexible multilayer substrate 1. Efficiently dissipates.
  • the electronic component 2 includes a pair of terminal electrodes 2a at both ends.
  • the terminal electrode 2a is connected to the via conductor 4 by a bonding material (not shown) such as a conductive paste or solder.
  • a conductive paste filled in the via conductor 4 may be used as the conductive paste of the bonding material.
  • the terminal electrode 2 a of the electronic component 2 may be connected to the wiring conductor 5 instead of being connected to the via conductor 4.
  • the type of electronic component 2 does not matter.
  • a capacitor is shown as the electronic component 2, but other types of electronic components such as a semiconductor, a resistor, and a coil may be used instead of the capacitor. Alternatively, a plurality of types of electronic components may be incorporated.
  • the entire upper surface and a part of the side surface are exposed from the flexible multilayer substrate 1.
  • the upper surface of the electronic component 2 means a surface opposite to the mounting surface.
  • the side surface of the electronic component 2 refers to the remaining four surfaces obtained by removing the mounting surface and the upper surface from the six surfaces.
  • a part of the terminal electrode 2 a of the electronic component 2 is exposed from the flexible multilayer substrate 1. Since the terminal electrode 2a of the electronic component 2 that easily absorbs heat and easily accumulates heat is exposed, the heat generated from the built-in electronic component 2 is efficiently dissipated to the outside.
  • the electronic component built-in flexible multilayer substrate 100 according to the first embodiment of the present invention having the above-described structure can be manufactured by, for example, each process shown in FIGS. 2 (A) to 3 (H).
  • a resin film 3 is prepared, and a metal foil 15 made of copper foil or the like is attached to the entire surface of one main surface of the resin film 3 as required, as shown in FIG.
  • the metal foil 15 may be attached with an adhesive, or may be attached by heating and pressing without an adhesive. Note that this step is omitted for the resin film 3 that does not require the metal foil 15.
  • through holes 14 for forming the conductive vias 4 are formed in the resin film 3 as necessary.
  • the through hole 14 can be formed by irradiating laser such as YAG laser or excimer laser. Note that this step is omitted for the resin film 3 that does not require the conductive via 4.
  • an etching resist 16 having a desired shape is formed on the metal foil 15 attached to the resin film 3 by, for example, screen printing.
  • the metal foil 15 in the portion where the etching resist 16 is not formed is etched with an etching solution to form the wiring conductor 5 having a desired shape on the resin film 3. To do.
  • the conductive holes 4 are formed by filling the through holes 14 formed in the resin film 3 with a conductive paste.
  • a plurality of resin films 3 are laminated, heated and pressurized, and integrated to form a flexible multilayer substrate 1.
  • the plurality of resin films 3 are formed with wiring conductors 5 formed on the main surface, those not formed, those with via conductors 4 penetrating between both main surfaces, or formed. Those not present are selected as necessary, and are laminated in the desired order.
  • the terminal electrode 2a of the electronic component 2 is connected to the via conductor 4 with a bonding material made of conductive paste or solder, and the electronic component 2 is built in the flexible multilayer substrate 1.
  • the electronic component built-in flexible multilayer substrate 100 according to the first embodiment is completed.
  • the electronic component 2 may be embedded in the flexible multilayer substrate 1 when the plurality of resin films 3 are stacked and integrated to form the flexible multilayer substrate 1 at the same time.
  • the material, shape, thickness, number of layers and the like of the resin film 3 are arbitrary and are not limited to the above-described contents.
  • a thermosetting resin can be used instead of the thermoplastic resin.
  • the shape and formation position of the conductive via 4 and the wiring conductor 5 and the type and number of the built-in electronic component 2 are arbitrary, and are not limited to the above-described contents.
  • the configuration of the electronic circuit constituted by the electronic component 2, the conductive via 4, and the wiring conductor 5 is also arbitrary, and is not limited to the above-described content.
  • the wiring conductor is formed by etching a metal foil.
  • the wiring conductor may be formed by printing with a solder resist or photolithography on the main surface of the outermost layer of the flexible multilayer substrate with built-in electronic components. .
  • FIG. 4 shows an electronic component built-in flexible multilayer substrate 200 according to the second embodiment of the present invention.
  • the resin film 13 is further laminated on the upper surface of the electronic component 12.
  • the electronic component built-in flexible multilayer substrate 200 if a wiring conductor (not shown) is formed on the surface of the resin film 13, another electronic component can be mounted thereon. That is, according to the electronic component built-in flexible multilayer substrate 200 according to the present embodiment, it is possible to mount electronic components at a higher density.
  • FIG. 5 shows an electronic component built-in flexible multilayer substrate 300 according to a third embodiment of the present invention.
  • heat generated from the electronic component 22 can be efficiently dissipated from both main surfaces of the flexible multilayer substrate 1. Moreover, since the side surface of the electronic component 22 is covered with the resin films 3 and 23, the electronic component 22 is securely held in the flexible multilayer substrate 1.
  • FIG. 6 shows an electronic component built-in flexible multilayer substrate 400 according to a fourth embodiment of the present invention.
  • another resin film 33 is formed on the resin film 23 on one main surface (the upper main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1. Laminated. Another resin film is not laminated on the resin film 23 on the other main surface (lower main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1, and the upper surface of the electronic component 22 extends from the resin film 23. It was exposed.
  • the flexible multilayer substrate 400 with built-in electronic components has a wiring conductor (not shown) on one main surface (the upper main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1.
  • another electronic component can be mounted. From the other main surface (the lower main surface in FIG. 6) of the rigid region R of the flexible multilayer substrate 1, the upper surface of the electronic component 22 is By exposing, the heat generated from the electronic component 22 was efficiently dissipated. That is, in the present embodiment, both high-density mounting of electronic components and heat dissipation from the electronic components are achieved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention porte sur un substrat multicouche flexible comportant des composants électroniques incorporés, ayant une excellente capacité de dissipation de chaleur générée par des composants électroniques incorporés. Ce substrat multicouche flexible doté de composants électroniques incorporés (100) comporte des composants électroniques (2) qui sont incorporés dans un substrat multicouche flexible (1), qui comporte une pluralité de films de résine laminés (3), des conducteurs de trou d'interconnexion (4) formés dans des emplacements prescrits dans les films de résine (3), et des conducteurs de câblage (5) formés entre des couches prescrites des films de résine (3), les composants électroniques incorporés (2) étant configurés de telle sorte qu'au moins une partie de la surface est exposée à partir du substrat multicouche flexible (1).
PCT/JP2012/054932 2011-04-14 2012-02-28 Substrat multicouche flexible avec composants électroniques incorporés Ceased WO2012140964A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011090063 2011-04-14
JP2011-090063 2011-04-14

Publications (1)

Publication Number Publication Date
WO2012140964A1 true WO2012140964A1 (fr) 2012-10-18

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PCT/JP2012/054932 Ceased WO2012140964A1 (fr) 2011-04-14 2012-02-28 Substrat multicouche flexible avec composants électroniques incorporés

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WO (1) WO2012140964A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103141A (ja) * 2012-11-16 2014-06-05 Murata Mfg Co Ltd 樹脂多層基板
CN103879308A (zh) * 2012-12-20 2014-06-25 安萨尔多信号和交通系统有限公司 自绝缘模块化电力供应线路
WO2015166588A1 (fr) * 2014-05-02 2015-11-05 株式会社メイコー Substrat rigide-souple à élément incorporé

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210696A (ja) * 1984-11-14 1986-09-18 インタ−ナシヨナル・スタンダ−ド・エレクトリツク・コ−ポレイシヨン 基板の製造方法および電子部品支持用基板
JPH01175296A (ja) * 1987-12-28 1989-07-11 Toshiba Corp 多層印刷配線板装置
JP2006073984A (ja) * 2004-09-01 2006-03-16 Samsung Electro Mech Co Ltd 抵抗内蔵型プリント基板およびその製造方法
JP2007273654A (ja) * 2006-03-31 2007-10-18 Sumitomo Bakelite Co Ltd フレキシブル回路基板、フレキシブル回路基板の製造方法および電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61210696A (ja) * 1984-11-14 1986-09-18 インタ−ナシヨナル・スタンダ−ド・エレクトリツク・コ−ポレイシヨン 基板の製造方法および電子部品支持用基板
JPH01175296A (ja) * 1987-12-28 1989-07-11 Toshiba Corp 多層印刷配線板装置
JP2006073984A (ja) * 2004-09-01 2006-03-16 Samsung Electro Mech Co Ltd 抵抗内蔵型プリント基板およびその製造方法
JP2007273654A (ja) * 2006-03-31 2007-10-18 Sumitomo Bakelite Co Ltd フレキシブル回路基板、フレキシブル回路基板の製造方法および電子機器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103141A (ja) * 2012-11-16 2014-06-05 Murata Mfg Co Ltd 樹脂多層基板
CN103879308A (zh) * 2012-12-20 2014-06-25 安萨尔多信号和交通系统有限公司 自绝缘模块化电力供应线路
CN103879308B (zh) * 2012-12-20 2017-04-26 安萨尔多信号和交通系统有限公司 自绝缘模块化电力供应线路
WO2015166588A1 (fr) * 2014-05-02 2015-11-05 株式会社メイコー Substrat rigide-souple à élément incorporé

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