WO2012020661A1 - Epoxy resin composition and hardener - Google Patents

Abstract

The present invention provides an epoxy resin composition blended with a small amount of reactive diluent to obtain a low viscosity solution, the thermal resistance and mechanical properties of the epoxy resin composition containing this reactive diluent being improved compared to epoxy resin compositions that do not contain the reactive diluent. A low viscosity liquid epoxy resin composition having excellent workability is provided by an epoxy resin composition containing epoxy resin and polyepoxy ethylcyclohexane in which the added amount of polyepoxy ethylcyclohexane is 1 to 90 parts by weight relative to 100 parts by weight of the epoxy resin. An epoxy resin hardened material having excellent thermal resistance and mechanical properties is obtained by blending, then hardening, a hardener with the epoxy resin.

Description

Epoxy resin composition and cured product

The present invention relates to an epoxy resin composition having a low viscosity and excellent workability, and an epoxy resin cured product having excellent heat resistance and mechanical properties obtained by curing the epoxy resin composition.

Epoxy resins are generally cured with various curing agents, resulting in cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc., adhesives, paints, laminates, moldings It is used in a wide range of fields such as materials and casting materials. Conventionally, bisphenol A type epoxy resin or bisphenol F type epoxy resin is mainly used as an epoxy resin in a liquid epoxy resin composition, but a reactive diluent may be added because the viscosity of the resin is relatively high. There were many. As reactive diluents, butyl glycidyl ether, allyl glycidyl ether, and phenyl glycidyl ether have been representatively used.

場合 When conventional diluents such as butyl glycidyl ether, allyl glycidyl ether, and phenyl glycidyl ether are added, there are problems such as a decrease in heat resistance and mechanical strength of the cured product when the amount added is large. For this reason, as described in Patent Documents 1 and 2, a reactive diluent having a bifunctional or higher functional epoxy has been proposed. However, the reaction diluent described in Patent Document 1 has a low viscosity but has an alicyclic epoxy group. For this reason, it is a well-known fact that it is poor in reactivity as compared with conventional epichlorohydrin type epoxy compounds and can only be cured with an acid anhydride, and its application is limited. Further, Patent Document 2 proposes compounds having a cyclohexyl group, but the viscosity of these compounds is 240 cps to 3200 cps, which is higher than that of a conventional reactive diluent, and the function as a diluent is sufficient. Not.

In order to solve these problems, the inventors have previously found that polyepoxybenzenes are used as a reactive diluent. These are reactive diluents that can lower the viscosity of the entire composition, have the same reactivity as epichlorohydrin type epoxy, and do not lower the heat resistance and mechanical properties of the cured product. However, since it is an aromatic compound, there is a problem that transparency and light resistance are slightly inferior to those of alicyclic compounds.

JP 7-97431 A Japanese Patent No. 3415047

Therefore, as a reactive diluent, the reactive diluent can reduce the viscosity of the entire composition, has the same reactivity as epichlorohydrin type epoxy, and does not reduce the heat resistance and mechanical properties of the cured product. The appearance of is desired. Epoxy resins having a low chlorine concentration are desired for use in electrical and electronic parts, and the emergence of reactive diluents having a low chlorine content is awaited. Further, in the optical component field, transparency and light resistance are also required.

In view of this situation, the present inventors have intensively studied for a reactive diluent having a sufficiently low viscosity and not lowering the heat resistance and mechanical properties of the cured product and having a low chlorine content. It was found that the epoxy compound represented by) satisfies these requirements, and the present invention was completed.

 
（式中、Ｅはエポキシ基であり、Ｒは水素、ビニル基又はアルキル基であり、ｎは２～３の整数を表す） That is, the present invention includes an epoxy resin having a viscosity at 25 ° C. of 1000 mPa · s or more and polyepoxyethylcyclohexane represented by the following formula (1), and the content of the polyepoxyethylcyclohexane is the epoxy resin: The present invention relates to an epoxy resin composition characterized by being 1 part by weight or more and 90 parts by weight or less with respect to 100 parts by weight.

(In the formula, E is an epoxy group, R is hydrogen, a vinyl group or an alkyl group, and n represents an integer of 2 to 3)

本 Further, the present invention relates to a cured epoxy resin product obtained by blending and curing a curing agent in the above epoxy resin composition.

The present invention also relates to an epoxy resin composition characterized in that the polyepoxyethylcyclohexane is 1,2,4-triepoxyethylcyclohexane.

The present invention also relates to a reactive diluent for epoxy resin, characterized by comprising the above polyepoxyethylcyclohexane.

Hereinafter, the present invention will be described in detail.
The epoxy resin composition of this invention contains the epoxy resin whose viscosity in 25 degreeC is 1000 mPa * s or more, and the polyepoxyethyl cyclohexane (henceforth an epoxy compound) represented by the said Formula (1).

As the epoxy compound represented by the formula (1), one obtained by epoxidizing a corresponding vinyl compound with a peroxide can be used. An epoxy compound in which a part of R is a vinyl group can be obtained by not epoxidizing all vinyl groups and reacting a part thereof when epoxidizing polyvinylcyclohexanes. The epoxy compound obtained by this method has a feature that the chlorine content is low because epichlorohydrin is not used in the synthesis. As a peroxide used for epoxidation, a normal peracid or an organic peroxide can be used.

As described above, this epoxy compound can be advantageously obtained by epoxidation by oxidation of polyvinylcyclohexanes (hereinafter also referred to as vinyl compounds). At this time, when the polyvinylcyclohexane is a stereoisomer mixture, this epoxy compound also becomes a stereoisomer mixture, but there is no problem.

The polyepoxyethylcyclohexane represented by the formula (1) has n epoxy groups, that is, 2 or 3, but when the purpose is high heat resistance and high strength, the crosslink density when cured is improved. Triepoxycyclohexanes are preferred. Also, a mixture of n = 2 and n = 3 may be used. R in the formula (1) is hydrogen, a vinyl group or an alkyl group. As the alkyl group, an alkyl group having 1 to 6 carbon atoms is preferable because of its low viscosity and particularly high effect as a diluent. Further, 6-n Rs may be the same or different. In order to reduce the viscosity, it is preferable that all Rs are hydrogen, or 1 to 3 Rs are hydrogen, and the rest are vinyl groups or alkyl groups, particularly preferably derived from vinyl groups or alkyl groups. The total number of carbon atoms to be performed is preferably 4 or less.

エ ポ キ シ The epoxy resin having a viscosity at 25 ° C. of 1000 mPa · s or higher used in the epoxy resin composition of the present invention is not particularly limited as long as it satisfies the above viscosity. For example, bisphenol A type, bisphenol F type, bisphenol AD type, bromo-containing bisphenol A type, phenol novolak type, cresol novolak type, polyphenol type, linear aliphatic type, butadiene type, urethane type glycidyl ether type epoxy resin; Hexahydrophthalic acid glycidyl ester, dimer acid glycidyl ester, aromatic, cycloaliphatic, aliphatic glycidyl ester type epoxy resin; bisphenol, ester, high molecular weight ether ester, ether ester, bromine, novolak Type, methyl-substituted epoxy resin; heterocyclic epoxy resin; glycidyl amine type epoxy resin such as triglycidyl isocyanurate or tetraglycidyl diaminodiphenylmethane; epoxidized polybutadiene Or a linear aliphatic epoxy resin such as epoxy soybean oil; a viscosity of 1000 mPa · at 25 ° C. among epoxy resins such as cycloaliphatic epoxy resin, naphthalene novolac epoxy resin, diglycidyloxynaphthalene epoxy resin Among them, bisphenol A type, bisphenol F type, bisphenol AD type, cresol novolac type glycidyl ether type epoxy resins and the like are particularly preferable in view of performance and economy. Specific examples of these epoxy resins include bisphenol A-epichlorohydrin condensate epoxy resins such as EPICLON 850 (epoxy equivalent 188 g / eq) and EPICLON 1050 (epoxy equivalent 475 g / eq) manufactured by Dainippon Ink and Chemicals, Inc. , Noplac resin-epichlorohydrin such as EPICLON ３０ N-670 (epoxy equivalent 210 g / eq), EPICLON N-670 (epoxy equivalent 210 g / eq), bisphenol F-epichlorohydrin condensate epoxy resin Condensate epoxy resin, Tetrabromobisphenol A-epichlorohydrin condensate epoxy resin such as EPICLON 152 (epoxy equivalent 360g / eq), EPICLON 430 (Epo Shi is equivalent 120 g / eq) aromatic glycidyl ether type epoxy resins such as glycidyl amine-type epoxy resins and the like. Regarding the epoxy resin having a viscosity at 25 ° C. of less than 1000 mPa · s, the effect of reducing the viscosity by the epoxy compound of the formula (1) is low.

エ ポ キ シ The epoxy compound represented by the formula (1) used in the epoxy resin composition of the present invention has a function of reducing the viscosity of the epoxy resin composition. In particular, if the viscosity range of the epoxy compound is 10 to 500 mPa · s, it is preferable because of its excellent function of reducing the viscosity. On the other hand, an epoxy resin having a viscosity at 25 ° C. of 1000 mPa · s or higher is a relatively general epoxy resin and has performance specific to the epoxy resin, but has a high viscosity. Hereinafter, an epoxy resin having a viscosity at 25 ° C. of 1000 mPa · s or more is also referred to as a high viscosity epoxy resin.

The addition amount of the epoxy compound represented by the formula (1) needs to be in the range of 1 to 90 parts by weight with respect to 100 parts by weight of the high viscosity epoxy resin. The amount is preferably 5 to 80 parts by weight, more preferably 10 to 60 parts by weight. When the addition amount is less than 1 part by weight, the effect of reducing the viscosity is not sufficient, and when it exceeds 90 parts by weight, the physical properties of the original epoxy resin are reduced.

The epoxy compound represented by the formula (1) is excellent as an epoxy resin diluent. The conventional epoxy resin diluent greatly reduces the Tg and strength of the cured product obtained by curing the epoxy resin composition, whereas the epoxy compound represented by the formula (1) used in the present invention has a low viscosity. In spite of the high dilution effect, when cured, it has high Tg and high strength. Moreover, since this epoxy compound has an alicyclic structure, there exists an effect that transparency is high.

In addition, the epoxy resin composition may be added with a flexible agent, a coupling agent, a flame retardant, a flame retardant aid, a colorant, a filler, etc. that are generally blended in the application field as necessary. An agent may be added within a range not impairing the performance of the present invention.

エ ポ キ シ A hardened epoxy resin is obtained by adding a curing agent to the epoxy resin composition of the present invention and curing it.

The curing agent used in the epoxy resin composition of the present invention may be a known curing agent as a general epoxy resin curing agent, for example, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine. Primary amines such as diethylaminopropylamine, metaphenylenediamine, p, p'-diaminodiphenylmethane, diaminodiphenylsulfone; secondary amines such as diethanolamine, N-methylethanolamine, bishydroxyethyldiethylenetriamine; triethylamine, piperidine, Tertiary amines such as benzyldimethylamine 2- (dimethylaminomethyl) phenol; phthalic anhydride, hexahydrophthalic anhydride, dodecenyl succinic anhydride, trimelli anhydride DOO acid, pyromellitic acid anhydride, include acid anhydrides such as HET acid, or these one or are formulated.

The mixing ratio of the epoxy resin and the curing agent is preferably in the range of 0.8 to 1.5 in terms of the equivalent ratio of the epoxy group and the functional group in the curing agent. Outside this range, unreacted epoxy groups or functional groups in the curing agent remain even after curing, and the physical properties of the cured product deteriorate. Here, the epoxy compound represented by Formula (1) is calculated as an epoxy resin.

Applications of the epoxy resin composition of the present invention include paints, injection materials, cast products, composite materials such as CFRP, molded products, laminates and insulating materials such as printed boards, sealing materials for electrical and electronic parts, adhesion Agents, laminates, optical materials, FRP molded products, repair materials, flooring materials, road paving materials for civil engineering and the like.

Next, in order to further clarify the features of the present invention, examples will be described in detail. All parts and% in the text indicate weight standards.

Synthesis example 1
1,2,4-trivinylcyclohexane 80g (0.49mol), acetonitrile 323g (7.87mol), methanol 560g (17.5mol) and potassium carbonate 175g (1.27mol), thermometer, cooling tube, nitrogen inlet tube, stirring blade Into a 2 L five-necked separable flask. After purging with nitrogen, the internal temperature was adjusted to 20 to 25 ° C., and 630 g (5.55 mol) of 30% hydrogen peroxide was added dropwise over 2 hours. After completion of the dropwise addition, the reaction was carried out for 5 hours while keeping the internal temperature between 25-45 ° C. After completion of the reaction, the remaining peroxide in the reaction solution was decomposed using 186.6 g (0.15 mol) of a 10% aqueous sodium sulfite solution. 600 g (6.51 mol) of toluene was added, and the aqueous layer and the organic layer were separated. After separation, the organic layer was washed with water three times and dried using sodium sulfate. After evaporation of the organic layer (toluene layer) using an evaporator, the mixture was purified and separated by distillation under reduced pressure using an epoxy mixture (including monoepoxy, diepoxy, and triepoxy). 8.74 g (0.049 mol, yield 10%) of monoepoxy compound, 27.22 g (0.140 mol, 29%) of diepoxy compound, and 29.87 g (0.142 mol, yield) of 1,2,4-triepoxyethyl hexane (TEpCH) 29%). The epoxy equivalent of 1,2,4-triepoxyethyl chlorohexane (TEpCH) was 93 g / eq, and the viscosity was 115 mPa · s.

Synthesis example 2
A 3 L reactor was charged with 300 g of divinylbenzene (DVB-960, divinylbenzene content 97%, m-isomer / p-isomer = 62: 38, manufactured by Nippon Steel Chemical Co., Ltd.) and 1200 g of ethyl acetate and stirred. Next, 1640 g of an ethyl acetate solution containing 30% peracetic acid was added dropwise over 3 hours. During the dropping, the reaction temperature was controlled to 30 ° C. After dropping, the mixture was further stirred at 30 ° C. for 3 hours. After cooling the reaction solution to room temperature, 1208 g of 20% NaOH aqueous solution was added and stirred for 1 hour, and then the aqueous layer was separated, and unreacted peracetic acid and generated acetic acid were removed. After evaporating ethyl acetate under reduced pressure using an evaporator, purification distillation (distillation temperature; 10 torr, 150 ° C.) was performed to obtain 151.6 g of diepoxyethylbenzene (DEpEB). The epoxy equivalent of the resulting diepoxyethylbenzene was 81 g / eq, the viscosity at 25 ° C. was 18 mPa · s, the purity was 97.1% (gas chromatography area%), m-isomer / p-isomer = 64: 36 (1H -NMR integration ratio).

Examples 1 to 3
10 parts by weight and 25 parts by weight of 1,2,4-triepoxyethylcyclohexane (TEpCH) obtained in Synthesis Example 1 with respect to 100 parts by weight of bisphenol A type epoxy resin (YD-128; manufactured by Tohto Kasei Co., Ltd.) Or 50 parts by weight were added and mixed to obtain an epoxy resin composition. The viscosity of the resin composition at 25 ° C. was measured with a B-type viscometer. Ricacid MH-700 (manufactured by Shin Nippon Chemical Co., Ltd.) was added to the epoxy resin composition so that the equivalent ratio was 0.9 and mixed uniformly, then poured into a mold, 120 ° C., 1 hour, and then 150 C. for 3 hours, and a test piece for bending test having a length of 125 mm.times.width of 13 mm.times.thickness of 3 mm and a glass transition point test piece having a diameter of 5 mm.times.3 mm of thickness were prepared.

Using the prepared test specimen for bending test, the bending test specified in JIS K7171 was performed at 25 ° C., and the bending strength was determined from the maximum strength. Also, the flexural modulus was determined from the initial slope of the strain-stress curve. In addition, using the produced glass transition point test piece, a glass with a thermomechanical analyzer (TMA / SS) manufactured by SII Nano Technology Co., Ltd. under a nitrogen atmosphere under a temperature rising rate of 7 ° C./min. The transition point (Tg) was determined. The results are shown in Table 1.

Comparative Examples 1 to 3
Epoxy resin composition by adding 10 parts by weight, 25 parts by weight or 50 parts by weight of phenylglycidyl ether (PGE; manufactured by Tokyo Chemical Industry Co., Ltd.) to 100 parts by weight of bisphenol A type epoxy resin (YD-128). I got a thing. To this epoxy resin composition, Ricacid MH-700 was added so as to have an equivalent ratio of 0.9 and mixed uniformly, and then the test piece for bending test and glass transition point measurement were carried out in the same manner as in Examples 1 to 3. Test pieces were prepared and bending strength, flexural modulus and glass transition point were determined.

Comparative Examples 4-6
10 parts by weight, 25 parts by weight or 50 parts by weight of butyl glycidyl ether (BGE; manufactured by Tokyo Chemical Industry Co., Ltd.) is added to 100 parts by weight of the bisphenol A type epoxy resin (YD-128), and mixed to form an epoxy resin composition. I got a thing. To this epoxy resin composition, Ricacid MH-700 was added so as to have an equivalent ratio of 0.9 and mixed uniformly, and then the test piece for bending test and glass transition point measurement were performed in the same manner as in Examples 1 to 3. Test pieces were prepared and bending strength, flexural modulus and glass transition point were determined.

Example 4
50 parts by weight of 1,2,4-triepoxyethylcyclohexane (TEpCH) obtained in Synthesis Example 1 is added to 100 parts by weight of bisphenol F type epoxy resin (YD-170; manufactured by Tohto Kasei Co., Ltd.) and mixed. An epoxy resin composition was obtained. The viscosity of the resin composition at 25 ° C. was measured with a B-type viscometer. After adding Ricacid MH-700 to the epoxy resin composition so that the equivalent ratio becomes 0.9 and mixing it uniformly, in the same manner as in Examples 1 to 3, a test piece for bending test and a glass transition point measurement A test piece was prepared, and bending strength, flexural modulus and glass transition point were determined.

Example 5
50 parts by weight of 1,2,4-triepoxyethylcyclohexane (TEpCH) obtained in Synthesis Example 1 is added to and mixed with 100 parts by weight of phenol novolac type epoxy resin (YDPN-638; manufactured by Toto Kasei Co., Ltd.). An epoxy resin composition was obtained. To this epoxy resin composition, Ricacid MH-700 was added so as to have an equivalent ratio of 0.9 and mixed uniformly, and then the test piece for bending test and glass transition point measurement were performed in the same manner as in Examples 1 to 3. Test pieces were prepared and bending strength, flexural modulus and glass transition point were determined.

Table 1 shows the composition and viscosity of the resin compositions of Examples 1 to 5 and Comparative Examples 1 to 6, and the measured physical properties of the cured products. The compound addition amount is a compounding amount of the epoxy compound with respect to 100 parts by weight of the epoxy resin. The viscosity was measured at 25 ° C. In addition, a viscosity is a viscosity of the epoxy resin composition before mix | blending a hardening | curing agent.

 

 

Comparative Example 7
After adding Ricacid MH-700 to bisphenol A type epoxy resin (YD-128) so that the equivalent ratio becomes 0.9 and mixing it uniformly, a test piece for bending test is carried out in the same manner as in Examples 1 to 3. And the test piece for glass transition point measurement was produced, and bending strength, a bending elastic modulus, and the glass transition point were calculated | required.

Comparative Example 8
After adding Ricacid MH-700 to bisphenol F type epoxy resin (YD-170) so that the equivalent ratio becomes 0.9 and mixing it uniformly, a test piece for bending test was carried out in the same manner as in Examples 1 to 3. And the test piece for glass transition point measurement was produced, and bending strength, a bending elastic modulus, and the glass transition point were calculated | required.

Comparative Example 9
After adding Rikacid MH-700 to a phenol novolac type epoxy resin (YDPN-638) so that the equivalent ratio becomes 0.9 and mixing it uniformly, a test piece for bending test was carried out in the same manner as in Examples 1 to 3. And the test piece for glass transition point measurement was produced, and bending strength, a bending elastic modulus, and the glass transition point were calculated | required.

Table 2 shows the viscosity at 25 ° C. of the epoxy resins used in Comparative Examples 7 to 9 and the measured physical properties of the cured products. The compound addition amount is zero.

 

 

Reference Example The hydrolyzable chlorine concentrations of phenyl glycidyl ether (PGE), butyl glycidyl ether (BGE) and TEpCH were measured as follows.
TEpCH: Not detected PGE: 53ppm
BGE: 16ppm

The hydrolyzable chlorine content was analyzed by the following method. That is, about 1 g of a sample is put in a 100 mL Erlenmeyer flask and accurately weighed to a unit of 1 mg. 30 mL of dioxane was added and dissolved completely using an ultrasonic cleaner. After correctly adding 5 mL of 1N potassium hydroxide / ethanol solution and shaking well, boiling stones were added and a condenser tube was attached. The mixture was heated to about 180 ° C. and refluxed. The reflux time was correctly set to 30 minutes after boiling started. After cooling to room temperature, the cooling tube was washed with 5 mL of methanol, and the washing solution was added to the sample solution. The Erlenmeyer flask was removed from the condenser, and the sample solution was transferred to a 200 mL beaker. The flask was washed three times with 50 mL of 80% acetone water, and the washing solution was added to the sample solution. 5 mL of N / 400 sodium chloride solution was added correctly and a rotator was added. After adding 3 mL of acetic acid and stirring for 2 minutes, potentiometric titration was performed using the N / 100 silver nitrate solution under the following conditions. A blank test was performed by the same operation as above.
The hydrolyzable chlorine concentration was determined by the following formula.
Hydrolyzable chlorine (%) = F × (V−B) × 0.0355 / S
F; Factor of N / 100 silver nitrate solution V; Amount of N / 100 silver nitrate solution required for titration of sample B; Amount of N / 100 silver nitrate solution required for titration of blank test S; Amount of sample (g)

Example 6
Hydrogenated bisphenol A glycidyl ether type epoxy resin (Licar Resin HBE-100; manufactured by Shin Nippon Chemical Co., Ltd.) 100 parts by weight of viscosity (1950 cps 25 ° C.) 1,2,4-triepoxyethylcyclohexane obtained in Synthesis Example 1 ( 50 parts by weight of TEpCH) was added and mixed to obtain an epoxy resin composition, which was then mixed uniformly with an equivalent ratio of 0.9 to an equivalent ratio of 0.9, followed by vacuum. Degassing and curing in a mold at 100 ° C. for 4 hours and further at 140 ° C. for 12 hours to produce resin plates having a thickness of 1 mm and 4 mm. Measurements of UV resistance and initial heat resistance were made, and bending test specimens and glass transition point measurement specimens were prepared in the same manner as in Examples 1 to 3, and bending strength and flexural modulus were measured. And the glass transition point .

Comparative Example 10
50 parts by weight of diepoxyethylbenzene (DEpEB) obtained in Synthesis Example 2 is added to 100 parts by weight of hydrogenated bisphenol A glycidyl ether type epoxy resin (Licar Resin HBE-100; manufactured by Shin Nippon Chemical Co., Ltd. at 1950 cps 25 ° C). The mixture was mixed to obtain an epoxy resin composition, which was then mixed uniformly with an equivalent ratio of 0.9 to 0.9, and then vacuum degassed to remove the inside of the mold. Thus, a resin plate having a thickness of 1 mm and 4 mm was prepared by curing at 100 ° C. for 4 hours and further at 140 ° C. Using this test piece, the initial transmittance and UV resistance of the cured product were measured. The heat resistance was measured, and a bending test specimen and a glass transition point measurement specimen were prepared in the same manner as in Examples 1 to 3, and the bending strength, flexural modulus, and glass transition point were determined. .

In Example 6 and Comparative Example 10, the initial transmittance, UV resistance, and initial heat resistance of the cured product were measured by the following methods.

Initial transmittance The transmittance of a cured product having a thickness of 400 nm was measured on a resin plate having a thickness of 1 mm using a Hitachi spectrophotometer U-3410.

UV Resistance A 400 nm transmittance after a UV irradiation of a resin plate having a thickness of 4 mm for 600 hours using a Q panel weather resistance tester QUV was measured in the same manner as the initial transmittance. A UVA of 340 nm was used for the QUV lamp, and the black panel temperature was 55 ° C.

Initial heat resistance After the resin plate having a thickness of 1 mm was exposed to an environment of 150 ° C. for 72 hours, the transmittance at 400 nm was measured in the same manner as the initial transmittance.

Table 3 shows the blending composition, viscosity, physical properties of the cured product, initial transmittance of the cured product, UV resistance, and initial heat resistance of Example 6 and Comparative Example 10. The compound addition amount is a compounding amount of the epoxy compound with respect to 100 parts by weight of the epoxy resin.

 

 

As shown in Table 3, the cured product containing TEpCH is excellent in initial transmittance, UV resistance, and initial heat resistance. That is, it is excellent in transparency and light resistance and is useful as an optical resin.

Industrial applicability

エ ポ キ シ The epoxy resin composition of the present invention has low viscosity and excellent workability, and the cured epoxy resin obtained by curing it has excellent heat resistance, mechanical properties, transparency, and light resistance.

Claims (4)

An epoxy resin having a viscosity at 25 ° C. of 1000 mPa · s or more and polyepoxyethylcyclohexane represented by the following formula (1) are contained, and the content of polyepoxyethylcyclohexane is 1 weight with respect to 100 parts by weight of the epoxy resin. An epoxy resin composition characterized by being no less than 90 parts by weight and no more than 90 parts by weight.

In the formula, E represents an epoxy group, R represents hydrogen, a vinyl group or an alkyl group, and n represents an integer of 2 to 3. The epoxy resin composition according to claim 1, wherein the polyepoxyethylcyclohexane is 1,2,4-triepoxyethylcyclohexane. A cured epoxy resin obtained by blending and curing a curing agent in the epoxy resin composition according to claim 1. Reactive diluent for epoxy resin characterized by comprising polyepoxyethylcyclohexane.