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WO2012019853A1 - Module à diodes électroluminescentes et lampe - Google Patents

Module à diodes électroluminescentes et lampe Download PDF

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Publication number
WO2012019853A1
WO2012019853A1 PCT/EP2011/061885 EP2011061885W WO2012019853A1 WO 2012019853 A1 WO2012019853 A1 WO 2012019853A1 EP 2011061885 W EP2011061885 W EP 2011061885W WO 2012019853 A1 WO2012019853 A1 WO 2012019853A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting diode
carrier
light
light sources
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/061885
Other languages
German (de)
English (en)
Inventor
Martin Moeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of WO2012019853A1 publication Critical patent/WO2012019853A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30Elongate light sources, e.g. fluorescent tubes curved
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • F21Y2113/10Combination of light sources of different colours
    • F21Y2113/13Combination of light sources of different colours comprising an assembly of point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • Light-emitting diode module and luminaire A light-emitting diode module is specified.
  • a luminaire is specified with such a light-emitting diode module.
  • An object to be solved is to specify a light-emitting diode module and a luminaire with such a module, wherein the light-emitting diode module has an impact shadow-reduced
  • this has at least one carrier with one
  • the carrier is preferably a printed circuit board, in particular a printed one
  • the carrier may have areas that are set up for heat dissipation. Such regions may be formed by metallizations that completely penetrate the carrier.
  • the carrier has a center line on the carrier top, which in particular is an imaginary, fictitious line.
  • Carrier top seen along a longitudinal direction equidistant from two opposite edges of the carrier.
  • the centerline is an auxiliary line which extends longitudinally over the entire carrier top.
  • the center line is preferably oriented in sections parallel to a main extension direction of the carrier. Is the
  • Carrier formed by a flat, rectangular plate, so the center line is congruent with a longest major axis, seen in plan view.
  • a plurality of contacts are provided on the carrier top side
  • the semiconductor light sources are preferably light emitting diodes. It can be attached to the top of the carrier various semiconductor light sources that emit in different spectral ranges.
  • individual semiconductor light sources emit blue light and / or red light and / or yellow light and / or green light and / or white light.
  • Semiconductor light sources may be chopped or unfocused semiconductor chips.
  • the light emitting diode module comprises at least five, at least 15, or
  • At least one covering layer is arranged downstream of the semiconductor light sources, in a direction away from the carrier top side.
  • the cover layer covers all
  • the covering layer is a scattering layer and / or a conversion agent layer.
  • Conversion means means that part or all of the radiation emitted by at least one of the semiconductor light sources is absorbed by the conversion means and converted into radiation of another, in particular larger, wavelength.
  • the cover layer may have textures on the main sides, for example for light extraction and / or for light coupling. According to at least one embodiment of the light-emitting diode module, this has an extension along the center line. The extent is in particular the length of the imaginary
  • the carrier has a width, which is seen in plan view of the carrier top and to be determined in a direction perpendicular to the center line.
  • the centerline bisects the beam so that the centerline, based on the respective local width of the beam, lies in the middle of the beam top.
  • the extent along the center line exceeds the width of the carrier by at least a factor 2, preferably by at least a factor 5 or by at least a factor 10, particularly preferably by at least a factor 20 or by at least a factor 50
  • the carrier is then shaped like a strip or a thread.
  • a quotient of a minimum and a maximum luminance of the radiation generated during operation of the light-emitting diode module along the center line is at least 0.4, preferably at least 0.5 or at least 0.6.
  • the luminance can be specified in the unit cd / m ⁇ 2. In other words, along the midline, in a direction away from the
  • the intensity of the emitted radiation is not subject to major fluctuations.
  • the luminance is approximately constant. That is, the light emitting diode module is then a line light source. This can mean that a course of a maximum
  • Intensity of the radiation emitted by the light-emitting diode module in projection on a surface parallel to the carrier top, approximately line-shaped and following the center line.
  • this comprises at least one carrier with one
  • Carrier top On the carrier top is a plurality of semiconductor light sources, in particular light-emitting diodes,
  • the semiconductor light sources are followed by at least one covering layer in a direction away from the carrier top side, the covering layer comprising or consisting of a scattering layer and / or a conversion agent layer.
  • An extension of the carrier along the center line exceeds a width of the carrier, in particular in a direction perpendicular to the center line and seen in plan view of the carrier top, by at least a factor 2.
  • Luminance of the radiation generated during operation of the light-emitting diode module along the center line, in a direction away from the carrier top, does not fall below a value of 0.4.
  • Shadows can affect the form perception of the illuminated object and disturb a viewer. Although such shadows can be reduced by a simple collapse of the light sources, which are arranged in particular in an array, this leads to local increases in brightness
  • the semiconductor light sources are arranged in one or more rows.
  • the rows of semiconductor light sources preferably run along the center line.
  • the rows of semiconductor light sources may intersect the center line and / or run directly on the imaginary centerline and / or be disposed on either side of the centerline such that, for example, the centerline separates adjacent rows of semiconductor light sources.
  • the individual semiconductor light sources of a row can have a constant or varying distances to
  • the light-emitting diode module has two or more than two rows of semiconductor light sources.
  • the rows can be physically or electrically combined units.
  • a distance is at least two adjacent ones
  • Semiconductor light sources or all of the neighboring Semiconductor light sources at least 1.5 mm or at least 3 mm or at least 5 mm. By means of such a minimum distance, overheating of individual semiconductor light sources can be avoided.
  • a spacing of adjacent semiconductor light sources is at most 12 mm, in particular at most 9 mm or at most 6 mm.
  • a quotient of the distance is adjacent
  • Cover layer at least 3 or at least 5 or at least 10. In other words, a distance is adjacent
  • Semiconductor light sources of the same order of magnitude as the thickness of the cover layer are same order of magnitude as the thickness of the cover layer.
  • the quotient of the distance is adjacent
  • Coating layer at most 25, preferably at most 20 or at most 15.
  • the width of the carrier is at most 10 mm or at most 8 mm or at most 6 mm.
  • the width is at least 2 mm or at least 3.5 mm.
  • the carrier is so comparatively narrow.
  • the carrier is self-supporting and gives the same
  • Light-emitting diode module mechanical stability. That is, a shape of the light emitting diode module may be predetermined by the carrier. Alternatively, it is also possible that the
  • PCB PCB
  • one or more side walls are attached to the carrier top along the center line. If there are a plurality of side walls, for example two side walls, the semiconductor light sources are preferably located between the two
  • the side walls can go along the
  • the side walls comprise a metal or a metal alloy and consist of a weight proportion of at least 50 of one or more metals.
  • the side walls comprise or consist of aluminum or an aluminum alloy.
  • about such side walls is a
  • a height of the side walls is smaller than a width of the carrier.
  • Such side walls can be used to determine a radiation characteristic of the
  • Light emitting diode module especially in directions transverse to the
  • a main emission direction of the semiconductor light sources with a tolerance of at most 15 °, perpendicular to a main surface facing the semiconductor light sources
  • Semiconductor light sources then not along the cover from, but in particular directly on the cover and the main emission is oriented approximately perpendicular to the carrier top.
  • a part of the semiconductor light sources or all semiconductor light sources are in places in direct contact with the cover layer. It then touch the
  • Semiconductor light sources can be ensured to the cover layer.
  • the imaginary center line of the carrier is curved
  • the imaginary center line is straight. It represents the
  • the center line has a three-dimensional profile.
  • the carrier then has the form of a helix.
  • the midline is thus not within a single plane.
  • the center line lies partially or completely within a plane.
  • the carrier top is flat and planar.
  • the imaginary center line is a closed line, for example a circular line or an ellipse.
  • the carrier is in a partial region of a plane
  • the carrier is then narrowly encompassable within the plane by an envelope.
  • the carrier has the shape of a spiral and the envelope is an ellipse or a circle.
  • Top view of this plane is an area ratio of the carrier, based on the area enclosed by the envelope, at most 70% or at most 60% or at most 50%.
  • the area fraction of the carrier within the envelope is at least 10% or at least 20% or at least 30%.
  • the light-emitting diode module can thus be formed in the plane so that from the
  • Line light source is a surface light is formed.
  • a heat dissipation of the light-emitting diode module is facilitated in particular by those areas of the plane that are uncovered by the carrier.
  • the latter has a first subset and one thereof
  • the cover layer provides a first radiation emitted by the semiconductor light sources of the first subset during operation
  • the cover layer is only one
  • the second radiation is thus only diffusely diffused by the cover layer and not or substantially not changed in a spectral composition.
  • the covering layer extends in unvaried, medium composition over all semiconductor light sources.
  • the covering layer has particles of a conversion agent embedded in a matrix material and / or
  • the particles are then, in a plan view of the carrier top, uniformly and not selectively varied over the entire cover layer distributed.
  • the cover layer is not specially designed for individual or groups of semiconductor light sources.
  • Light emitting diode module as described in connection with the above embodiments, indicated.
  • Features for the light emitting diode module are therefore also for the light
  • the luminaire comprises a plurality of light-emitting diode modules. Part or all of them
  • Light emitting diode modules are arranged so that the center lines of these light emitting diode modules connect to each other.
  • a continuous line is formed by the center lines of these light-emitting diode modules, wherein it may be an imaginary line in the line as well as in the center lines.
  • Such light-emitting diode modules and luminaires can have a high luminance as well as a high color rendering index, in short CRI, for example of more than 80 or more than 90, and also an adjustable correlated color temperature.
  • Such light emitting diode modules and lights are used in boutiques, offices, restaurants or museums in the form of light bars. It is also possible that said light emitting diode modules and / or lights such
  • Fluorescent lamps, compact fluorescent lamps, incandescent or energy-saving lamps are formed and used instead of such lamps.
  • a light-emitting diode module described here and a luminaire described here will be explained in more detail with reference to the drawings with reference to embodiments.
  • the same reference numerals indicate the same elements in the individual figures. However, they are not
  • FIGS 1 to 4 are schematic representations of
  • FIGS. 5 and 6 are schematic representations of
  • FIG. 1 An embodiment of a light-emitting diode module 1 is shown in Figure 1 in a perspective view.
  • a carrier top 20 of a carrier 2 is a plurality of semiconductor light sources, in particular in the form of
  • Light emitting diodes 3a, 3b, 3r applied in two rows 6. An electrical contacting of the LEDs 3a, 3b, 3r via the carrier 2, which is preferably a circuit board. As dash-dot line is on the top carrier 20 a
  • Center line M of the carrier 2 drawn.
  • the center line M extends along a longitudinal extent L of the carrier 2 and lies with respect to a width B in a center of the carrier 2.
  • the rows 5a, 5b of the light emitting diodes 3a, 3b, 3r are located on one side of the center line M and intersect the center line M not. Each of the rows 5a, 5b is
  • the rows 5a, 5b may have light-emitting diodes 3a, 3b, 3r emitting in different spectral ranges.
  • row 5a represents an alternating sequence of in blue
  • the row 5b is an alternating sequence of blue 3b and red emitting light emitting diodes 3r.
  • a distance A of adjacent light-emitting diodes 3a, 3b, 3r is preferably between 3 mm and 6 mm inclusive.
  • the light-emitting diode module 1 comprises a covering layer 4.
  • the covering layer 4 has a conversion means which converts blue light emitted by the light-emitting diodes 3b partly into light of a different color, in particular into green light.
  • the covering layer 4 acts as a diffusion plate.
  • the cover layer 4 is placed on the LEDs 3a, 3b, 3r and on the carrier top 20, indicated in Figure 1 by an arrow.
  • the cover layer 4 forms the lid of a box, which is slipped over the LEDs 3a, 3b, 3r.
  • side walls 6 may be attached, which extend parallel to the center line M along the entire longitudinal side L.
  • end walls 60 may be attached. Through the side walls 6 and through the end walls 60, a reflector for radiation emitted by the LEDs radiation may be formed.
  • the end walls 60 and the side walls 6 may be designed to be diffuse or specularly reflective and differing from the illustration according to FIG. 1 others
  • the longitudinal extent L of the carrier 2 is, for example, at least 10 mm, in particular at least 50 mm or at least 100 mm.
  • the width B is in particular between 4 mm and 6 mm inclusive.
  • a height H of the side walls 6 and the end walls above the carrier top 20 is for example between 2 mm and 6 mm inclusive.
  • a thickness of the side walls 6, parallel to the width B of the carrier 2 is for example between 0.5 mm and 4 mm inclusive or between 1.0 mm and 3 mm inclusive.
  • the light-emitting diodes 3 a, 3 b, 3 r emitting in the different colors are preferably combined electrically into groups of the same color. These groups are in particular electrically separately controllable for setting about a color and / or a color temperature of the emitted light. Likewise, the rows 5a, 5b may be electrical units.
  • a luminous flux of the radiation emitted by the light-emitting diode modules 1 is, for example, between 10 Im and 100 Im or between 20 Im and 65 Im per centimeter length of the center line M, as well as in all other embodiments.
  • FIG. 2 A further exemplary embodiment of the light-emitting diode module 1 is illustrated in FIG. 2 in a schematic plan view. To simplify the illustration, in FIG. 2
  • the longitudinal extent L of the elongate light-emitting diode module 1 is, for example, at least 20 cm or at least 50 cm.
  • the width B is about 4 mm.
  • the light-emitting diodes 3 a, 3 b, 3 r are arranged in two rows parallel to the center line M
  • FIG. 3 shows further exemplary embodiments of the light-emitting diode module 1, in each case in cross-sectional views transversely to the center line M. According to Figure 3A is the
  • the intermediate space 8 may be filled with a gas or with a medium for adjusting the refractive index between the light-emitting diodes 3 and the covering layer 4.
  • a main emission direction R of the light-emitting diodes 3 is oriented perpendicular to the carrier side 20 as well as to a main side of the cover layer 4 facing the light-emitting diodes 3.
  • a thickness T of the covering layer 4 is, for example, between 100 ⁇ and 600 ⁇ , in particular between 200 ⁇ and 500 ⁇ ⁇ , as well as in all other embodiments.
  • the covering layer 4 containing a conversion agent and optionally a scattering agent is therefore also
  • the covering layer 4 is located completely between the side walls 6, as seen in a lateral direction, as well as
  • the cover layer 4 is in places in direct contact with the LEDs 3.
  • a cavity 8 is formed in each case.
  • the covering layer 4 it is possible for the covering layer 4 to be designed on a main side remote from the light-emitting diodes 3 in the form of a converging lens.
  • the cover layer 4 terminates flush with the sidewalls 6 in a direction away from the carrier top 20.
  • the covering layer 4 also surrounds the light emitting diodes 3 in the lateral direction and is in contact with end faces as well as on a main radiation side of the light emitting diodes 3
  • a protective layer 7 which is impermeable and / or scratch-resistant, for example, moisture applied.
  • the carrier 2 is planar and shaped like a ring.
  • the LEDs 3 are mounted in two rows on the carrier top 20.
  • the imaginary center line M is a closed line.
  • Center line M is, for example, between 5 mm and 100 mm inclusive, in particular between 10 mm and 30 mm inclusive. It is possible that a plurality of annular supports 2 are arranged concentrically with different diameters.
  • the luminaire 100 can also comprise one or more of the light-emitting diode modules 1 according to FIGS. 1 to 4. Unlike illustrated, the lamp 100 may each have a different number of light emitting diode modules 1 from the number drawn. To simplify the illustration, the individual light-emitting diodes and the cover layer are not shown in FIG.
  • the luminaire according to FIG. 5A has two identically shaped light-emitting diode modules 1, which in a transition region 9 butt together.
  • the width B of the light-emitting diode modules 1 is along the entire center line M in the context of
  • drawn light-emitting diode modules 1 of the lamp 100 connect to each other in such a way that the center line M is continuously and smoothly continued by one of the modules 1 to the other of the modules 1.
  • the luminaire 100 has two different types of light-emitting diode modules 1a, 1b.
  • the light emitting diode modules la are shaped like half rings and the light emitting diode modules lb are rectangular. Unlike shown in Figure 5B, it is not necessary that the light emitting diode modules la, lb
  • the luminaire 100 has several of the
  • Light-emitting diode modules 1 are illustrated in FIG. The
  • Light emitting diode modules 1 are in each case only highly schematized, in particular with reference to a profile of the center line M. According to FIG. 6A, the center line M forms a closed line lying in an xy plane. This may be a single light-emitting diode module 1 or a light 100 with a plurality of composite light-emitting diode modules 1.
  • a spiral is formed through the center line M, which lies in the x-y plane.
  • the light emitting diode module 1 or the light 100 is in the x-y plane in a
  • Area fraction of the non-subscribed carrier 2 within the envelope E is for example about 50%.
  • Center line M illustrated which may be circular, elliptical or spiral in plan view of the x-y plane.
  • the midline M is not in a plane.
  • the luminaire 100 has at least two light-emitting diode modules 1 a, 1 b, which have a
  • the luminaire 100 may comprise differently shaped or differently shaped light-emitting diode modules 1a, 1b.
  • a luminaire 100 is a side view
  • Light emitting diode modules 1 are formed on a conical surface of an optional existing core body 10.
  • An opening angle of the conical core body 10 is, for example, between 2 ° and 15 ° inclusive, in particular about 5 °.
  • a height D1 is, for example, between 30 mm and 60 mm, in particular 45 mm.
  • the diameter D2 is for example between 10 mm and 30 mm inclusive, in particular around 20 mm.
  • the dimension D3 results from the dimensions D4 to D8.
  • the dimension D4 is
  • a width of the at least one light emitting diode module 1 monotonically decreases in a direction away from a base surface of the core body 10.
  • the core body 10 may also be spherically or ellipsoidally shaped.
  • the luminaires 100 according to FIGS. 6C to 6E can be shaped like incandescent lamps, fluorescent tubes or so-called energy-saving lamps.
  • the lights 100 are then preferably so-called retrofits.
  • the invention encompasses any novel feature as well as any combination of features, which in particular includes any combination of features in the patent claims, even if this feature or combination itself is not explicitly stated in the exemplary embodiments or in the patent claims.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un module à diodes électroluminescentes (1) qui, dans au moins un mode de réalisation, comprend au moins un support (2) doté, sur sa face supérieure (20),d'une ligne médiane (M) fictive. Une pluralité de sources lumineuses à semi-conducteur (3) est montée sur la face supérieure (20) du support. Une couche de recouvrement (4) est appliquée en aval des sources lumineuses à semi-conducteur (3) dans une direction partant de la face supérieure (20) du support, ladite couche de recouvrement (4) comportant une couche diffusante ou une couche centrale de conversion. Une dilatation (L) du support (2) le long de la ligne médiane (M) dépasse une largeur (B) du support (2) d'au moins un facteur 2. Un quotient luminance minimale/luminance maximale du faisceau produit le long de la ligne médiane (M) lorsque le module à diodes électroluminescentes (1) est en mode de fonctionnement, ne passe en deçà une valeur 0,4 dans une direction partant de la face supérieure (20).
PCT/EP2011/061885 2010-07-19 2011-07-12 Module à diodes électroluminescentes et lampe Ceased WO2012019853A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010027579.4 2010-07-19
DE201010027579 DE102010027579A1 (de) 2010-07-19 2010-07-19 Leuchtdiodenmodul und Leuchte

Publications (1)

Publication Number Publication Date
WO2012019853A1 true WO2012019853A1 (fr) 2012-02-16

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WO (1) WO2012019853A1 (fr)

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DE102010027579A1 (de) 2010-07-19 2012-01-19 Osram Opto Semiconductors Gmbh Leuchtdiodenmodul und Leuchte
DE102018205302A1 (de) * 2018-04-09 2019-10-10 Glp German Light Products Gmbh Beleuchtungs-Baukastensystem
EP4652406A1 (fr) * 2023-01-16 2025-11-26 Signify Holding B.V. Dispositif d'éclairage doté d'une chambre de mélange de lumière

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US20040037079A1 (en) * 2002-08-26 2004-02-26 Luk John F. Flexible LED lighting strip
US20040217364A1 (en) * 2003-05-01 2004-11-04 Cree Lighting Company, Inc. Multiple component solid state white light
US20070121343A1 (en) * 2005-11-01 2007-05-31 Tandberg Telecom As Illumination device
WO2009035203A1 (fr) * 2007-09-14 2009-03-19 Smcreation Limited Eclairage à diodes électroluminescentes (del) pour tube fluorescent avec ballast
US20090140271A1 (en) * 2007-11-30 2009-06-04 Wen-Jyh Sah Light emitting unit
US20090295264A1 (en) * 2008-05-28 2009-12-03 Rohm Co., Ltd. Led lamp provided with blower
US20100110678A1 (en) * 2008-10-31 2010-05-06 Ledtech Electronics Light-emitting diode tube structure
DE102010027579A1 (de) 2010-07-19 2012-01-19 Osram Opto Semiconductors Gmbh Leuchtdiodenmodul und Leuchte

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