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WO2012019040A3 - Spectrographic monitoring using index tracking after detection of layer clearing - Google Patents

Spectrographic monitoring using index tracking after detection of layer clearing Download PDF

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Publication number
WO2012019040A3
WO2012019040A3 PCT/US2011/046642 US2011046642W WO2012019040A3 WO 2012019040 A3 WO2012019040 A3 WO 2012019040A3 US 2011046642 W US2011046642 W US 2011046642W WO 2012019040 A3 WO2012019040 A3 WO 2012019040A3
Authority
WO
WIPO (PCT)
Prior art keywords
sequence
spectra
layer
polishing
best matching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/046642
Other languages
French (fr)
Other versions
WO2012019040A2 (en
Inventor
Jimin Zhang
Zhihong Wang
Harry Q. Lee
Wen-Chiang Tu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2012019040A2 publication Critical patent/WO2012019040A2/en
Publication of WO2012019040A3 publication Critical patent/WO2012019040A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A method of controlling polishing includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, polishing a substrate having a second layer overlying a first layer, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, detecting exposure of the first layer, fitting a function to a portion of the sequence of index values corresponding to spectra measured after detection of exposure of the first layer, and determining a polishing endpoint or an adjustment for a polishing rate based on the function.
PCT/US2011/046642 2010-08-05 2011-08-04 Spectrographic monitoring using index tracking after detection of layer clearing Ceased WO2012019040A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/851,467 2010-08-05
US12/851,467 US20120034844A1 (en) 2010-08-05 2010-08-05 Spectrographic monitoring using index tracking after detection of layer clearing

Publications (2)

Publication Number Publication Date
WO2012019040A2 WO2012019040A2 (en) 2012-02-09
WO2012019040A3 true WO2012019040A3 (en) 2012-05-10

Family

ID=45556482

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/046642 Ceased WO2012019040A2 (en) 2010-08-05 2011-08-04 Spectrographic monitoring using index tracking after detection of layer clearing

Country Status (3)

Country Link
US (1) US20120034844A1 (en)
TW (1) TW201213050A (en)
WO (1) WO2012019040A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
US20140242880A1 (en) * 2013-02-26 2014-08-28 Applied Materials, Inc. Optical model with polarization direction effects for comparison to measured spectrum
KR101699197B1 (en) 2013-03-15 2017-01-23 어플라이드 머티어리얼스, 인코포레이티드 Dynamic residue clearing control with in-situ profile control(ispc)
TWI743176B (en) * 2016-08-26 2021-10-21 美商應用材料股份有限公司 Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product
US11079459B2 (en) * 2017-01-13 2021-08-03 Applied Materials, Inc. Resistivity-based calibration of in-situ electromagnetic inductive monitoring
CN109724938B (en) * 2017-10-30 2021-06-11 中国石油化工股份有限公司 Method for predicting properties of lubricating oil base oil by near infrared spectrum
CN109724937B (en) * 2017-10-30 2021-05-14 中国石油化工股份有限公司 Method for predicting vacuum distillate oil property by near infrared spectrum
CN109724939B (en) * 2017-10-30 2021-06-11 中国石油化工股份有限公司 Method for predicting hydrogenated tail oil property by near infrared spectrum
US12340992B2 (en) * 2019-11-21 2025-06-24 Lam Research Corporation Detection and location of anomalous plasma events in fabrication chambers
CN112247740B (en) * 2020-09-25 2025-12-09 富联裕展科技(深圳)有限公司 Polishing device, polishing method, polishing auxiliary device, polishing auxiliary system and polishing auxiliary method
KR102820308B1 (en) * 2021-03-03 2025-06-13 어플라이드 머티어리얼스, 인코포레이티드 In-situ monitoring to label training spectra for machine learning systems for spectral monitoring
KR20230148849A (en) 2021-03-04 2023-10-25 어플라이드 머티어리얼스, 인코포레이티드 Pixel and region classification of film irregularities based on processing of substrate images
CN116604464A (en) * 2023-07-19 2023-08-18 合肥晶合集成电路股份有限公司 Wafer grinding control method and device, computer equipment and storage medium
CN120489986B (en) * 2025-07-16 2025-09-19 辽宁嘉顺科技有限公司 A method and system for monitoring the grinding of magnesium oxide

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153116A (en) * 1998-08-18 2000-11-28 United Microelectronics Corp. Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation
US20040165177A1 (en) * 2002-03-29 2004-08-26 Lam Research System and method of broad band optical end point detection for film change indication
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5599423A (en) * 1995-06-30 1997-02-04 Applied Materials, Inc. Apparatus and method for simulating and optimizing a chemical mechanical polishing system
US5643050A (en) * 1996-05-23 1997-07-01 Industrial Technology Research Institute Chemical/mechanical polish (CMP) thickness monitor
JP3932836B2 (en) * 2001-07-27 2007-06-20 株式会社日立製作所 Thin film thickness measuring method and apparatus, and device manufacturing method using the same
WO2003066282A2 (en) * 2002-02-04 2003-08-14 Kla-Tencor Technologies Corp. Systems and methods for characterizing a polishing process
US8260446B2 (en) * 2005-08-22 2012-09-04 Applied Materials, Inc. Spectrographic monitoring of a substrate during processing using index values
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
US7406394B2 (en) * 2005-08-22 2008-07-29 Applied Materials, Inc. Spectra based endpointing for chemical mechanical polishing
US8392012B2 (en) * 2008-10-27 2013-03-05 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
US7444198B2 (en) * 2006-12-15 2008-10-28 Applied Materials, Inc. Determining physical property of substrate
WO2010028180A2 (en) * 2008-09-04 2010-03-11 Applied Materials, Inc. Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
US8129279B2 (en) * 2008-10-13 2012-03-06 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polish process control for improvement in within-wafer thickness uniformity
US20100103422A1 (en) * 2008-10-27 2010-04-29 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
US20100114532A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Weighted spectrographic monitoring of a substrate during processing
US20100120331A1 (en) * 2008-11-07 2010-05-13 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
US8989890B2 (en) * 2008-11-07 2015-03-24 Applied Materials, Inc. GST film thickness monitoring
US8295967B2 (en) * 2008-11-07 2012-10-23 Applied Materials, Inc. Endpoint control of multiple-wafer chemical mechanical polishing
US8751033B2 (en) * 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
WO2010062910A2 (en) * 2008-11-26 2010-06-03 Applied Materials, Inc. Using optical metrology for feed back and feed forward process control
JP2012510161A (en) * 2008-11-26 2012-04-26 アプライド マテリアルズ インコーポレイテッド Two-line mixing of chemical and abrasive particles with end point control for chemical mechanical polishing
JP5968783B2 (en) * 2009-11-03 2016-08-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ End point method using the relationship between peak position and time in spectral contour plots
US9579767B2 (en) * 2010-04-28 2017-02-28 Applied Materials, Inc. Automatic generation of reference spectra for optical monitoring of substrates
US8202738B2 (en) * 2010-05-05 2012-06-19 Applied Materials, Inc. Endpoint method using peak location of modified spectra
US20110282477A1 (en) * 2010-05-17 2011-11-17 Applied Materials, Inc. Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
US8954186B2 (en) * 2010-07-30 2015-02-10 Applied Materials, Inc. Selecting reference libraries for monitoring of multiple zones on a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6153116A (en) * 1998-08-18 2000-11-28 United Microelectronics Corp. Method of detecting end point and monitoring uniformity in chemical-mechanical polishing operation
US20040165177A1 (en) * 2002-03-29 2004-08-26 Lam Research System and method of broad band optical end point detection for film change indication
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra

Also Published As

Publication number Publication date
US20120034844A1 (en) 2012-02-09
WO2012019040A2 (en) 2012-02-09
TW201213050A (en) 2012-04-01

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