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WO2012013543A3 - Isoliersysteme mit verbesserter teilentladungsbeständigkeit - Google Patents

Isoliersysteme mit verbesserter teilentladungsbeständigkeit Download PDF

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Publication number
WO2012013543A3
WO2012013543A3 PCT/EP2011/062353 EP2011062353W WO2012013543A3 WO 2012013543 A3 WO2012013543 A3 WO 2012013543A3 EP 2011062353 W EP2011062353 W EP 2011062353W WO 2012013543 A3 WO2012013543 A3 WO 2012013543A3
Authority
WO
WIPO (PCT)
Prior art keywords
insulation system
partial discharge
insulating tape
improved partial
discharge strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2011/062353
Other languages
English (en)
French (fr)
Other versions
WO2012013543A2 (de
Inventor
Peter GRÖPPEL
André GRÜBEL
Vicky GRÜBEL
Igor Ritberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2012013543A2 publication Critical patent/WO2012013543A2/de
Publication of WO2012013543A3 publication Critical patent/WO2012013543A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H01B19/04—Treating the surfaces, e.g. applying coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/30—Windings characterised by the insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/32—Windings characterised by the shape, form or construction of the insulation
    • H02K3/40—Windings characterised by the shape, form or construction of the insulation for high voltage, e.g. affording protection against corona discharges

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Insulating Bodies (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

Vorgestellt wird ein Isoliersystem (20 mit verbesserter Teilentladungsbeständigkeit), sowie Isolierband (10) und Verfahren zur Herstellung eines solchen Isoliersystems (20). Das Isolierband (10) umfasst ein Glimmerpapier (5) und einen Trägerwerkstoff (6), die mittels eines Klebers (8) miteinander verklebt sind. Der Kleber (8) umfasst mindestens einen nanopartikulären Füllstoff (7). Ein elektrischer Leiter (13) wird mit dem Isolierband umwickelt. Das um den Leiter (13) gewickelte Isolierbandes (10) wird mit Kunstharz imprägniert.
PCT/EP2011/062353 2010-07-30 2011-07-19 Isoliersysteme mit verbesserter teilentladungsbeständigkeit Ceased WO2012013543A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201010032949 DE102010032949A1 (de) 2010-07-30 2010-07-30 Isoliersysteme mit verbesserter Teilentladungsbeständigkeit
DE102010032949.5 2010-07-30

Publications (2)

Publication Number Publication Date
WO2012013543A2 WO2012013543A2 (de) 2012-02-02
WO2012013543A3 true WO2012013543A3 (de) 2012-03-22

Family

ID=44510921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/062353 Ceased WO2012013543A2 (de) 2010-07-30 2011-07-19 Isoliersysteme mit verbesserter teilentladungsbeständigkeit

Country Status (2)

Country Link
DE (1) DE102010032949A1 (de)
WO (1) WO2012013543A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010054179A1 (de) * 2010-12-10 2012-06-14 Voith Patent Gmbh Isolationssystem für einen Leiter einer Hochspannungsmaschine
DE102010054181A1 (de) * 2010-12-10 2012-06-14 Voith Patent Gmbh Isolationssystem für einen Leiter einer Hochspannungsmaschine
DE102011079489A1 (de) * 2011-07-20 2013-01-24 Siemens Aktiengesellschaft Verfahren zum Herstellen eines Bandes für ein elektrisches Isolationssystem
DE102014203744A1 (de) 2014-02-28 2015-09-03 Siemens Aktiengesellschaft Leitfähiges Glimmschutzpapier, insbesondere für den Außenglimmschutz
DE102014203740A1 (de) 2014-02-28 2015-09-03 Siemens Aktiengesellschaft Glimmschutzsystem, insbesondere Außenglimmschutzsystem für eine elektrische Maschine
EP3151248A1 (de) * 2015-09-30 2017-04-05 Siemens Aktiengesellschaft Isolierungssystem für eine elektrische maschine
CN105761855B (zh) * 2016-01-29 2017-12-08 重庆市木越机械制造有限公司 一种高导热超薄云母带及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0790623A1 (de) * 1994-08-15 1997-08-20 GENERAL ELECTRIC CANADA, Inc. Sandwich-Isolierung für verbesserten Korona-Schutz
US6190775B1 (en) * 2000-02-24 2001-02-20 Siemens Westinghouse Power Corporation Enhanced dielectric strength mica tapes
WO2008129032A1 (en) * 2007-04-20 2008-10-30 Abb Research Ltd An impregnation medium
DE102007024096A1 (de) * 2007-05-22 2008-11-27 Evonik Degussa Gmbh Klebstoffe

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10227227A1 (de) * 2002-06-18 2004-01-22 Siemens Ag Glimmschutz
DE102004034550A1 (de) * 2004-07-16 2006-02-09 Siemens Ag Glimmschutzband
DE102009039456A1 (de) * 2009-08-31 2011-03-03 Siemens Aktiengesellschaft Leitereinrichtung sowie elektrische Maschine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0790623A1 (de) * 1994-08-15 1997-08-20 GENERAL ELECTRIC CANADA, Inc. Sandwich-Isolierung für verbesserten Korona-Schutz
US6190775B1 (en) * 2000-02-24 2001-02-20 Siemens Westinghouse Power Corporation Enhanced dielectric strength mica tapes
WO2008129032A1 (en) * 2007-04-20 2008-10-30 Abb Research Ltd An impregnation medium
DE102007024096A1 (de) * 2007-05-22 2008-11-27 Evonik Degussa Gmbh Klebstoffe

Also Published As

Publication number Publication date
WO2012013543A2 (de) 2012-02-02
DE102010032949A1 (de) 2012-02-02

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