WO2012005454A2 - Glass substrate cutting system using laser - Google Patents

Abstract

The present invention relates to a glass substrate cutting system using a laser. In detail, the glass substrate cutting system using a laser may correct a cutting line radiated with a laser beam on a transferred glass substrate seated on a process table in real-time to precisely process the glass substrate. Also, a process for cutting both side portions of the glass substrate, a process for rotating the glass substrate at an angle of about 90 degrees, and a process for cutting both of the other side portions of the glass substrate may be performed on a continuous line to significantly reduce a takt time. In addition, the outermost fixing rod part and conveyer part of a plurality of fixing rod parts and conveyer parts may be perpendicularly folded and expanded with respect to a length direction to compatibly cut the glass substrate seated on a top surface of the process table in size.

Description

Glass substrate cutting processing system using laser

The present invention relates to a glass substrate cutting processing system using a laser, the glass substrate can be precisely processed by real-time correction of the cutting schedule line for irradiating the laser beam to the glass substrate that is seated on the process table in detail, Tak time can be significantly reduced by dividing the process of cutting both sides of the glass substrate, rotating the process by 90 °, and cutting the other side of the glass substrate on a continuous line. The fixed rod part and the conveyor part disposed at the outermost part of the plurality of fixed rod parts and the plurality of conveyor parts provided on the table are installed to be folded and extended at right angles to their respective longitudinal directions and are seated on the upper surface of the process table. Glass substrate cutting process sheath using laser which can be cut to compatible specifications of glass substrate Relate to.

Generally, a glass substrate for a display means glass used for display apparatuses, such as a liquid crystal display, a plasma display, an organic electroluminescent display.

One of the conventional methods for cutting a glass substrate for display has been a scribe wheel method. The scribe wheel method is a method of forming a scribe line having a predetermined depth on the surface of the glass substrate by installing a fine diamond on the circumferential surface of the disc having a predetermined diameter, and contacting the cutting schedule line to be cut while rotating it at high speed. The scribing wheel method is a method in which a crack is propagated and cut along the scribe line by applying a physical impact to the glass substrate on which the scribe line is formed.

However, the scribe wheel method requires a cutting edge of a predetermined area or more, particles are generated during cutting and require a separate cleaning process and a drying process to remove them, the cutting surface is not smooth, and the cost of consumables increases. There was a downside.

In order to overcome this disadvantage, a glass substrate cutting apparatus using a laser was introduced. In the conventional glass substrate cutting device using a laser, a method of moving the processing table in which the glass substrate is located in the cutting direction while maintaining the laser cutting head in a fixed state is used.

This is because when the laser cutting head is moved because the weight of the laser oscillation part is heavy, it is difficult to precisely control the cutting head due to the load of the laser cutting head. The laser oscillation part has a load of about 250 kg to 300 kg. When this load is moved, the structure supporting the laser cutting head is sag and the path position of the laser beam is distorted, thereby reducing the cutting accuracy and stability. Is generated.

In addition, since the machining table must be moved, the area occupied by the layout for installing the machining table increases, and the cycle time increases due to the tack time, which is the unit time for cutting a single glass substrate, and the time required for returning to the original position of the machining table. Therefore, there was a problem that the productivity is reduced accordingly.

In addition, in the process of cutting and processing seventh generation glass substrates (1950 × 2200mm) and eighth generation glass substrates (2260 × 2500mm), which are relatively heavy in weight, the structure in which the processing table itself is transported has many problems. have.

Meanwhile, a cutting head having a gantry stage structure and a laser oscillator connected integrally with the cutting head move forward and backward along the direction in which the glass substrate moves to solve the above problems. Inevitably, the entire gantry stage is inevitably driven for the operation of the cutting head, which leads to unnecessary management and operation.In the case where the glass substrate to be transported to the upper surface of the processing table is minutely distorted at a certain angle, it is necessary to correct such distortion. Another problem arises in that there is no means to cut and finely cut glass substrates.

The present invention has been proposed in view of the above, and an object of the present invention is to provide a glass substrate cutting processing system using a laser that can cut the glass substrate more precisely and reduce the tack time as compared to the conventional one. There is.

Glass substrate cutting processing system according to the present invention, the centering portion for correcting a certain direction before moving in a state in which the rectangular glass substrate is seated; One side or both sides of the glass substrate, which has been uniformly transferred straight from the centering part, are cut along the transfer direction of the glass substrate by dividing the cutting schedule line, and a rectangular glass substrate with respect to the transfer direction of the glass substrate. A first cutting unit capable of irradiating a laser by correcting a cutting schedule line in real time to correspond to the distorted angle; A first breaking part for physically cutting and leaving one side or both side edge portions of the glass substrate sequentially moved straight after being irradiated by the laser from the first cutting part; A rotating part rotated by 90 ° to cut the other side of the glass substrate sequentially transferred straight through the first breaking part; One side or both sides of the glass substrate rotated by 90 ° from the rotating part and sequentially go straight along the conveying direction of the glass substrate to irradiate the laser to divide the cutting schedule line, and the glass substrate is twisted with respect to the conveying direction of the glass substrate. A second cutting unit capable of irradiating a laser by correcting a cutting schedule line in real time correspondingly; And a second breaking part for physically cutting one or both edge portions of the glass substrate sequentially transferred straight after being irradiated by the laser from the second cutting part.

A plurality of cameras are disposed at predetermined positions on the upper portion of the centering portion in order to measure positional data on the standard and constant orientation of the glass substrate seated on the centering portion.

A plurality of cameras are disposed at an upper predetermined position of the second breaking portion to measure the angle and parallelism of each edge and each side of the glass substrate seated with the edges of the four sides cut in the second breaking portion. Based on the position data measured by the camera, each cutting schedule line by laser irradiation of the first and second cutting units is configured to be corrected in real time.

Each of the first cutting portion and the second cutting portion includes: a base plate seated on the bottom surface; A process table disposed on an upper surface of the base plate to move the glass substrate straight in a predetermined direction; A pair of guide tables installed side by side on an upper surface of both ends of the base plate; A pair of laser oscillators for oscillating the laser to process the glass substrate located on the upper surface of the process table while moving in a forward and backward direction along the pair of guide tables; And a pair of laser irradiation units which are conveyed along a pair of guide tables integrally with the laser oscillation unit and irradiate the glass substrate with the laser oscillated from the laser oscillation unit.

The pair of laser irradiation units are installed to be moved along the pair of guide tables in the forward and rear directions, and at the same time independently moveable in a left and right direction perpendicular to the longitudinal direction of the guide table. It is connected to each other cantilever (cantilever) structure from each laser oscillation portion is moved independently.

In addition, the laser irradiation unit, the initial cracker for providing an initial crack to the glass substrate; A reflector for guiding the laser beam oscillated from the laser oscillator; A shopping lens unit for condensing the laser beam transmitted from the reflecting means; A quenching nozzle unit for injecting cooling mist along the laser beam irradiated from the shopping lens; And an air suction unit for sucking dust generated from the cooling mist sprayed from the quenching nozzle unit and the initial crack of the glass substrate.

The laser oscillation unit is installed on the upper part of the pair of guide tables so as to be movable in the front and rear directions along the longitudinal direction of the guide table, and includes a laser source unit for oscillating the laser and a power supply unit for driving the laser source unit. It is composed.

Each of the process tables provided in the first and second cutting parts may include: a plurality of fixed rod parts disposed on an upper surface of the base plate side by side in the longitudinal direction of the guide table; And a plurality of conveyor parts disposed in parallel with each of the fixed rod parts alternately with the plurality of fixed rod parts, the height of the fixed rod being adjustable up and down with respect to the height of the fixed rod parts.

The centering portion, the base plate seated on the bottom surface; And a process table disposed on an upper surface of the base plate to move the glass substrate straight to the first cutting portion, wherein the process table includes a plurality of fixed rods disposed on the upper surface of the base plate along a conveying direction of the glass substrate. And a plurality of conveyor parts disposed alternately with each of the plurality of fixed rod parts and arranged in parallel with each of the fixed rod parts, the height of which being adjustable up and down with respect to the height of the fixed rod parts.

The process table provided in the centering part includes: a plurality of stoppers disposed at the front end of the fixed rod part to temporarily stop the front end of the glass substrate seated on the fixed rod part; A plurality of side alignment parts disposed on the side of each of the fixed rod parts positioned at the outermost side of the plurality of fixed rod parts to correct centering and orientation of the glass substrate; And a plurality of rear alignment parts disposed at the rear end of the fixed rod part and interlocked with the stopper and the side alignment to correct the centering and the orientation of the glass substrate.

The process table provided in each of the centering part, the first cutting part, and the second cutting part is disposed at the outermost part of the plurality of fixed rod parts and the plurality of conveyor parts so as to be compatible with the specifications of the glass substrate seated on the upper surface of each process table. Arranged fixed rod portion and the conveyor portion is installed to be able to fold and expand at right angles to each longitudinal direction.

The glass substrate cutting system of the present invention provides the following advantages.

First, it is possible to process the glass substrate more precisely than the existing one by correcting the cutting schedule line irradiating the laser beam to the glass substrate that is seated on the process table in real time.

Second, the process of cutting both sides of the glass substrate through the first cutting portion and the first breaking portion, the process of rotating 90 ° through the rotating portion, and the other side of the glass substrate is cut through the second cutting portion and the second breaking portion It is possible to remarkably reduce the tack time by dividing each process into a continuous line.

Third, the fixed rod portion and the conveyor portion disposed at the outermost of the plurality of fixed rod portion and the plurality of the conveyor portion provided on the process table are installed to be folded and extended at right angles to the respective longitudinal directions of the process table. There is an advantage that can be cut cutting compatible with the specifications of the glass substrate seated on the upper surface.

Fourth, the pair of laser irradiation unit, the process of moving forward and backward along the pair of guide table and the process of moving a predetermined distance in the left and right directions perpendicular to the front and rear directions of the longitudinal direction of the guide table The cantilever structure is independently connected to each laser oscillation unit so as to be able to operate independently, so that the pair of laser irradiation units are mounted on the process table of the first and second cutting units in association with the interpolated control signals of the external interpolation controller. One side or both sides of the glass substrate has the advantage that can be precisely cut processing in the micro unit by the desired width.

1 and 2 is a schematic diagram showing the overall configuration of a glass substrate cutting processing system using a laser according to the present invention,

Figure 3 is a schematic diagram showing a process of centering the glass substrate in the centering portion in accordance with the specifications of the glass substrate processed by the present invention,

4 and 5 are schematic diagrams showing a process of cutting the cutting schedule line through the interpolation control in the first cutting unit and the second cutting unit based on the position data measured from the camera provided in the second braking unit of the present invention,

6 is a perspective view showing an extract of a part of the present invention,

7 is another perspective view showing a part of the configuration of the present invention,

8 is a perspective view showing an extract of the process table disposed in the centering portion of the present invention;

9 is a flowchart illustrating a process of operating a glass substrate cutting processing system using a laser according to the present invention;

10 is a flowchart illustrating a process of operating a process table by position data measured by a camera of a centering unit according to the present invention;

11 is a flowchart illustrating a process of operating each laser irradiation unit based on the position data measured by the camera of the second breaking unit according to the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 and 2 is a schematic diagram showing the overall configuration of a glass substrate cutting processing system using a laser according to the present invention. The part shown in FIG. 1 and the part shown in FIG. 2 are connected to constitute an entire glass substrate cutting processing system.

The system of the present invention, the rectangular glass substrate (G) is a centering portion (100) for correcting the constant direction before moving in the seated state; One side or both sides of the glass substrate (G), which has a constant direction from the centering unit 100, and is sequentially straight forward, irradiates the laser along the conveying direction of the glass substrate (G) to divide the cutting schedule line, and the glass substrate A first cutting part 200 capable of irradiating a laser by correcting a cutting schedule line in real time so as to correspond to an angle at which the rectangular glass substrate G is twisted with respect to the feeding direction of (G); A first breaking part 300 which physically cuts and detaches one side portion or both side edge portions of the glass substrate G sequentially moved straight after being irradiated by the laser from the first cutting portion 200; A rotating part 400 which is rotated by 90 ° to cut the other side of the glass substrate G sequentially straight transferred through the first breaking part 300; One side or both sides of the glass substrate G, which is rotated 90 ° from the rotating part 400 and sequentially straight, are irradiated with a laser along the conveying direction of the glass substrate G to partition a cutting schedule line, and the glass substrate G A second cutting part 200 ′ capable of irradiating a laser by correcting a cutting schedule line in real time so as to correspond to an angle at which the glass substrate G is twisted with respect to a conveying direction of the back side; And a second breaking part 300 'that physically cuts an edge portion of one side or both side portions of the glass substrate G, which is sequentially transferred straight after being irradiated by the laser from the second cutting unit 200'. .

Reference numeral G3 of Figs. 1 and 2 denotes a cut piece in which a predetermined portion of both side edges of the glass substrate is cut from the first and second breaking parts.

Figure 3 is a schematic diagram showing the process of centering the glass substrate in the centering portion in accordance with the specifications of the glass substrate processed by the present invention, the position of the standard and constant orientation of the glass substrate (G) seated on the centering portion 100 In order to measure data, a plurality of cameras 500 are disposed at a predetermined position on the upper portion of the centering unit 100.

The plurality of cameras 500 disposed in the centering unit 100 are fixedly positioned at a predetermined position, and photograph each side and each corner of a relatively large glass substrate G1 and a relatively small glass substrate G2 interchangeably. It is divided into being arranged to move a certain distance so that it can be measured.

The camera 500 is also provided at both ends of the center reference line L, which is commonly used as a reference to the glass substrate G located in the centering part 100, so that the position data of the glass substrate G, that is, the X and Y coordinate axes Provide a reference value.

The measured position data of the glass substrate G, that is, the X and Y coordinate values are transmitted to an external interpolation control device in real time.

4 and 5 are schematic diagrams illustrating a process of cutting a cutting schedule line through interpolation control in the first and second cutting units based on position data measured from a camera provided in the second breaking unit of the present invention. . Four edges of the second breaking portion 300 'with the edges of the glass substrate (G) seated in a state in which cutting is cut, the angle and the parallelism of each side of the second braking portion 300' A plurality of cameras 500 'are arranged at an upper predetermined position, and the laser beams of the first and second cutting parts 200 and 200' are radiated based on the position data measured by the cameras 500 '. Each cut schedule line is configured to be corrected in real time.

4 is an analysis result parallelism, i.e., glass substrate, based on the position data of the glass substrate G measured from the plurality of cameras 500 'provided in the second braking unit 300'. G) does not occur in the traveling direction, so that the pair of laser irradiation units 250 and 250 'provided in the first and second cutting units 200 and 200' are respectively integrated with the laser oscillation unit by the preset original control signal. It moves along the pair of guide tables 230, 230 ′, and does not move in a direction perpendicular to the traveling direction of the laser oscillator.

FIG. 5 is an analysis result parallelism, ie, a glass substrate, based on the position data of the glass substrate G measured from the plurality of cameras 500 'provided in the second braking unit 300'. G) A pair of laser irradiation units 250 and 250 'provided in the first and second cutting units 200 and 200' are respectively integrated with the laser oscillating unit by the interpolation of the control signal. While moving along the tables 230 and 230 ′, they are gradually moved in a direction perpendicular to the direction of travel of the laser oscillator and obliquely at an angle with respect to the center reference line L.

That is, the post-correction cutting schedule line L2 formed while moving in conjunction with the interpolated control signal for the pre-calibration cutting schedule line L1 formed while moving in conjunction with the original control signal parallel to the center reference line L in the center is It is corrected by a certain tilt angle.

Thus, the glass substrate G can be cut and processed more precisely than before by the movement of the laser irradiation units 250 and 250 ′ which are calibrated in real time.

FIG. 6 is a perspective view showing some components of the present invention, and FIG. 7 shows another perspective view showing some components of the present invention.

6 and 7, each of the first cutting part 200 and the second cutting part 200 ′ may include: base plates 210 and 210 ′ mounted on a bottom surface thereof; Process tables 220 and 220 'disposed on the upper surfaces of the base plates 210 and 210' to move the glass substrate G straight in a predetermined direction; A pair of guide tables 230 and 230 'installed side by side on an upper surface of both ends of the base plates 210 and 210'; A pair of laser oscillators 240 and 240 'for oscillating the laser to process the glass substrate G located on the upper surface of the process table 220 and 220' while moving forward and backward along the pair of guide tables 230 and 230 '. ); A pair of laser irradiators 250 and 250 'which are conveyed along the pair of guide tables 230 and 230' integrally with the laser oscillators 240 and 240 'and irradiate the glass substrate G with the laser oscillated from the laser oscillators 240 and 240'. It is configured to include.

The rotating unit 400 serves to rotate 90 ° in order to cut the other side of the glass substrate G which is sequentially straight forwarded through the first breaking part 300.

In this case, the rotating unit 400 includes a base plate, a turntable 410 installed on the base plate, and a flat plate grid 420 seated on the turntable 410 and rotated by 90 °, and the turntable 410. The glass substrate G is seated on the upper portion of the plate grid 420 rotated by the rotation of and rotates integrally.

As shown in FIGS. 4 to 6, the pair of laser irradiation units 250 and 250 ′ move forward and backward along the pair of guide tables 230 and 230 ′ and simultaneously independently of the guide tables 230 and 230 ′. It is installed to be movable a certain distance in the left and right directions perpendicular to the front and rear directions in the longitudinal direction.

The pair of laser irradiation units 250 and 250 ′ moves forward and backward along the pair of guide tables 230 and 230 ′ and is perpendicular to the front and rear directions of the guide tables 230 and 230 ′. The process of moving a predetermined distance in the left and right directions is connected to the cantilever structure independently from each of the laser oscillators 240 and 240 'so as to operate independently.

As a result, the pair of laser irradiation units 250 and 250 ′ is mounted on the process tables 220 and 220 ′ of the first and second cutting units 200 and 200 ′ in association with the interpolated control signals of the external interpolation control apparatus. One side or both sides of G) can be precisely cut in micro units by the desired width.

The laser irradiation units 250 and 250 'move along the guide table integrally with the laser oscillating units 240 and 240' and move at right angles to the traveling direction of the laser oscillating units 240 and 240 'while irradiating laser beams to both sides of the glass substrate. Form the cut line.

In addition, the pair of laser irradiation units 250 and 250 'independently moves to the laser oscillating units 240 and 240' at right angles to the traveling direction of the laser oscillating units 240 and 240 '. As a result, the widths of the edge cut pieces of both sides cut from the glass substrate G may be different from each other.

The laser irradiator 250 or 250 ′ includes an initial cracker for providing an initial crack to the glass substrate G; A reflector for guiding the laser beam oscillated from the laser oscillators 240 and 240 '; A shopping lens unit for condensing the laser beam transmitted from the reflecting means; A quenching nozzle unit for injecting cooling mist along a laser beam irradiated from the shopping lens; And an air suction unit for sucking dust generated from the cooling mist sprayed from the quenching nozzle unit and the initial crack of the glass substrate (G).

Specifically, the process of forming the cutting schedule line by the laser irradiation units 250 and 250 'will be described. The quenching nozzles in the laser irradiation units 250 and 250' may be formed along the upper surface of both sides of the glass substrate rapidly heated by the laser beam. Spray a cooling mist with a temperature significantly lower than the heating temperature.

Then, while the glass substrate is rapidly cooled, cracks having a predetermined depth are generated on the surface thereof, and a cut line is formed.

The laser oscillators 240 and 240 'are installed on the upper portion of the pair of guide tables 230 and 230' so as to be movable forward and backward along the longitudinal direction of the guide tables 230 and 230 ', and the laser source unit which oscillates the laser. And a power supply unit for driving the laser source unit.

As shown in FIG. 6 and FIG. 7, each of the process tables 220 and 220 ′ disposed in the first cutting unit 200 and the second cutting unit 200 ′ has a length direction of the guide tables 230 and 230 ′. A plurality of fixed rod parts 221 and 221 'disposed on an upper surface of the base plates 210 and 210' side by side; A plurality of conveyors are arranged in parallel with each of the fixed rods 221, 221 'alternately with the plurality of fixed rods 221, 221', and are installed to be capable of height adjustment up and down with respect to the height of the fixed rods 221,221 '. It comprises a portion (222,222 ').

8 is a perspective view showing an extract of the process table disposed in the centering portion of the present invention, the centering portion 100, the base plate seated on the bottom surface; And a process table 120 disposed on an upper surface of the base plate to move the glass substrate G straight to the first cutting part 200. The process table 120 includes a glass substrate G. A plurality of fixing rods 121 and the plurality of fixing rods 121 disposed on the upper surface of the base plate along the conveying direction of the alternating arrangement is arranged in parallel to each of the fixing rods 121 and fixed rod portion 121 Consists of a plurality of conveyor portion 122 is installed so that the height can be adjusted up and down with respect to the height.

Referring to FIG. 8, the process table 120 disposed in the centering part 100 may be disposed at the front end of the fixed rod part 121 and disposed at the front end of the glass substrate G seated on the fixed rod part 121. A plurality of stoppers 123 for pausing; A plurality of side alignment parts 124 disposed on the side of each of the fixed rod parts 121 positioned at the outermost part of the plurality of fixed rod parts 121 to correct the centering and the orientation of the glass substrate G; A plurality of rear alignment parts 125 disposed at the rear end of the fixed rod part 121 and interlocking with the stopper 123 and the side alignment part 124 to correct the centering and the orientation of the glass substrate G; It is composed.

In FIG. 8, reference numeral 126 denotes a guide rod 126 that guides when the fixed rod 121 and the conveyor 122 disposed at the outermost portion of the process table 120 are folded or extended.

As shown in FIGS. 6 to 8, the process tables 120, 220, and 220 ′ provided in the centering unit 100, the first cutting unit 200, and the second cutting unit 200 ′ are each of the process tables 120, 220, and 220 ′. Fixed at the outermost of each of the fixed rod parts 121, 221, 221 'disposed in plural and the conveyor parts 122, 222, 222' arranged in plural to be compatible with the specifications of the glass substrate G seated on the upper surface of The rod parts 121, 221, 221 ′ and the conveyor parts 121, 222, 222 ′ are installed to be able to be folded and extended at right angles to the respective longitudinal directions.

9 is a flowchart illustrating a process of operating a glass substrate cutting processing system using a laser according to the present invention. The process of cutting a glass substrate in detail is as follows.

First, the glass substrate before processing is input to the process table of the centering portion and seated. A plurality of cameras disposed at an upper predetermined position of the centering unit measures position data such as parallelism with respect to each side of the glass substrate, right angle with each corner, and straightness with respect to the transfer direction with respect to a predetermined center reference line (S110). ).

An interworking process with an external interpolation control apparatus based on the position data measured in step S110 will be described later.

The glass substrate sequentially moved straight through the centering part continues to move straight through the process table of the first cutting part. In this case, the glass substrate is seated on the process table of the first cutting unit, and the laser irradiating unit provided in the first cutting unit continuously has a predetermined depth at a predetermined position at both edges of the glass substrate along the conveying direction of the glass substrate. The cutting schedule line which is a crack is formed (S120).

The glass substrate sequentially moved straight through the first cutting part continues to move straight through the process table of the first breaking part. In this case, the cutting device provided on both sides of the first breaking part is pressed and cut on both sides of the glass substrate based on the cutting schedule line generated by the laser irradiation part in the process of being seated on the process table of the first breaking part. Physically separated from the glass substrate body (S130).

The glass substrate sequentially transferred straight through the first breaking part is seated on the process table of the rotating part. In this case, the glass substrate is seated on the plate grid provided on the upper surface of the rotating unit, and rotates by 90 ° using a turntable installed at the bottom of the plate grid in a state where the glass plate is seated on the plate grid (S140).

The glass substrate rotated by 90 ° by the rotation part is sequentially moved straight and is then placed on the process table of the second cutting part and continues to be transferred straight. In this case, the second substrate is cut while the glass substrate is seated and transferred to the process table of the second cutting part. The laser irradiation part provided in the portion is formed along the transfer direction of the glass substrate, the cutting scheduled line, which is a crack of a predetermined depth, is continuously formed at a predetermined position at both edges of the glass substrate (S150).

The glass substrate sequentially moved straight through the second cutting part continues to move straight through the process table of the second breaking part. In this case, the cutting device provided on both sides of the second breaking part is pressed and cut on both sides of the glass substrate based on the cutting schedule line generated by the laser irradiation part in the process of being seated on the process table of the second breaking part. Physically separate from the glass substrate body (S160).

The parallelism of each side of the glass substrate with respect to the predetermined center reference line of a plurality of cameras disposed at a predetermined position above the second breaking portion with respect to the glass substrate cut into four predetermined widths through each step, the right angle to each corner Also, position data such as straightness in the conveying direction is measured (S160).

An interworking process with an external interpolation control apparatus based on the position data measured in step S160 will be described later.

The glass substrate after the cutting process is output to the outside through the buffer means buffer (S170).

FIG. 10 is a flowchart illustrating a process of operating a process table by position data measured by a camera of a centering unit according to the present invention, and interworking with an external interpolation control apparatus based on position data of a glass substrate measured by a centering unit. The process is described in detail as follows.

First, in the state where the glass substrate before processing is input and seated on the process table of the centering portion, the parallelism of each side of the glass substrate, the perpendicularity to each corner, Measure position data such as straightness in the feed direction. The position data of the glass substrate thus measured is transmitted to an external interpolation control device (S210).

The measured position data of the glass substrate is analyzed by the interpolation controller, and the interpolation controller analyzes the values thus analyzed, that is, the X and Y coordinate values, so that the slope of each side of the glass substrate with respect to the predetermined center reference line, A linear equation corresponding to an error such as an angle is derived.

The interpolated control signal is generated with respect to the predetermined original control signal through the linear equation derived as described above (S220).

Each process table disposed in the centering unit, the first and second cutting units, and the first and second braking units performs a corrected operation in conjunction with the interpolated control signals through the control signals generated by the interpolation control apparatus (S230). ).

Specifically, according to the positional data on the X, Y coordinates of the glass substrate seated on the process table of the centering portion, in particular, the planar dimensions of the glass substrate accordingly, the centering portion, the first and second cutting portions, and the first and second braking portions are arranged. Each process table executes a corrected operation in conjunction with the interpolated control signals of the interpolation control apparatus.

That is, the fixed rod part and the conveyor part disposed at the outermost sides of the plurality of fixed rod parts and the plurality of conveyor parts arranged on each process table execute folding or expanding in a direction perpendicular to the longitudinal direction (S240).

In this case, when the glass substrate before processing placed on the centering part is relatively large, the fixed rod part and the conveyor part extend in a direction perpendicular to the longitudinal direction. On the contrary, when the glass substrate before processing placed on the centering part is relatively small. The fixed rod portion and the conveyor portion is to perform folding in a direction perpendicular to the longitudinal direction.

For this reason, when physically cutting a certain portion of the edge of the glass substrate due to the pressurization of the cutting device provided in the first and second braking portions, the edge of the glass substrate is supported by the support shaft with the fixed rod part and the conveyor part disposed at the outermost part. It can be pressurized.

The plurality of fixed rod parts disposed on each process table disposed in the centering part, the first and second cutting parts, the first and second braking parts, and the fixed rod parts and the conveyor parts disposed at the outermost sides of the plurality of conveyor parts in the longitudinal direction. After the folding or extending in the perpendicular direction, the stopper, the side alignment unit, and the rear alignment unit provided in the process table of the centering unit operate in cooperation with each other according to the interpolated control signal of the interpolation controller (S250).

In detail, the stopper provided at the front end of the process table of the centering part and in close contact with the front end of the glass substrate seated on the process table temporarily stops the progress of the glass substrate.

Next, a pair of side alignment parts provided at both ends of the process table and adhered to both ends of the glass substrate and a pair of rear alignment parts provided at the rear end of the process table and adhered to the lower surface of the rear end of the glass substrate seated at the process table In addition, the glass substrate is centered according to the interpolated control signal of the interpolation controller.

11 is a flowchart illustrating a process of operating each laser irradiator based on position data measured by a camera of a second braking unit according to the present invention, and an external interpolation control apparatus based on position data measured by the second braking unit. The following describes the interworking process with.

First, a plurality of cameras disposed on the second breaking part with respect to the glass substrate that has been cut in the second breaking part has a parallelism with respect to each side of the glass substrate, a right angle with respect to each corner, and a transfer with respect to a predetermined center reference line. Measure position data such as straightness in the direction. The position data of the glass substrate thus measured is transmitted to an external interpolation control device (S310).

The measured position data of the glass substrate is analyzed through the interpolation control device, and the interpolation control device analyzes the values thus analyzed, that is, the X and Y coordinate values, and the slope and angle of each side of the glass substrate with respect to the predetermined center reference line. The linear equation corresponding to the error of the angle, etc. is derived.

The interpolated control signal is generated with respect to the predetermined original control signal through the linear equation derived as described above (S320).

The interpolation control apparatus commands the laser irradiation units of the first and second cutting units to perform a corrected operation in accordance with the interpolated control signals through the control signals generated by the interpolation control apparatus (S330).

In detail, each laser irradiation part disposed in the first and second cutting parts and connected in a cantilever structure to the laser oscillation part moves in the same direction as the traveling direction of the glass substrate integrally with the laser oscillation part and is perpendicular to the moving direction of the laser oscillation part. It moves (S340).

In particular, the pair of the laser irradiation unit, the process of moving in the front and rear directions along the pair of guide table and the process of moving a predetermined distance in the left and right directions perpendicular to the front and rear directions in the longitudinal direction of the guide table It is connected to the cantilever structure independently from each laser oscillation portion so as to be operable independently.

As a result, the pair of laser irradiation units are precisely measured in micro units by the desired width of one side or both sides of the glass substrate which is mounted and moved to the process table of the first and second cutting units in association with the interpolated control signals of the external interpolation controller. It can be cut and processed.

More specifically, the movement of the pair of laser irradiation units interlocked with the interpolated control signals from the interpolation control device may be performed even when an error in the movement distance is generated even though the laser irradiation units are minutely moved in the same direction as the laser oscillation unit. The error is precisely corrected by the interpolated control signal of the external interpolation controller.

That is, the pair of laser irradiators connected in a cantilever structure to the laser oscillator independently corrects the width of the distance moving at right angles to the moving direction of the laser oscillator in real time by interpolated control signals of the external interpolation controller. As a result, the laser beam is irradiated from each laser irradiator so as to correspond to more precise parallelism, perpendicularity, and straightness of the glass substrate.

A pair of laser irradiation units are disposed on both sides of the process table of each of the first and second cutting units, and the pair of laser irradiation units are independently connected to each of the laser oscillating units and move. The distance moving at right angles to the moving direction of the laser oscillator may vary depending on the interpolated control signal of the interpolation control apparatus.

This phenomenon is more pronounced when the squareness corresponding to each edge of the glass substrate is not symmetric with each other before being processed.

Claims (9)

A cutting system for processing rectangular glass substrates using a laser, The rectangular glass substrate (G) is corrected in a fixed direction before moving in the state of seating, the base plate seated on the bottom surface, and disposed on the upper surface of the base plate to move the glass substrate (G) in a straight direction A centering part 100 including a process table 120 to be used; A cutting line is divided by irradiating a laser along the conveying direction of the glass substrate G to one side or both sides of the glass substrate G which is sequentially and straightly transferred from the centering part 100 in order. A first cutting part 200 capable of irradiating a laser by correcting the cutting schedule line in real time so as to correspond to an angle at which the rectangular glass substrate G is twisted with respect to the conveying direction of the glass substrate G; A first breaking part 300 which physically cuts and detaches one side portion or both side edge portions of the glass substrate G sequentially moved straight after being irradiated by the laser from the first cutting portion 200; A rotating part 400 which is rotated by 90 ° to cut the other side of the glass substrate G sequentially straight forwarded through the first breaking part 300; One side or both sides of the glass substrate (G) rotated 90 ° from the rotary unit 400 sequentially straight to the laser beam along the transport direction of the glass substrate (G) to divide the cutting schedule line and the A second cutting part 200 ′ capable of irradiating a laser by correcting the cutting schedule line in real time so as to correspond to an angle at which the glass substrate G is twisted with respect to the conveying direction of the glass substrate G; A second breaking part 300 'that physically cuts an edge portion of one side or both side portions of the glass substrate G which is sequentially moved straight after being irradiated by the laser from the second cutting part 200'; Measuring the squareness and parallelism of each corner and each side of the glass substrate (G) seated in the state in which the edges of the four sides cut to the second braking portion 300 'and based on the measured position data A plurality of arranged in the upper predetermined position of the second braking portion 300 'to correct in real time the respective cutting schedule line by the laser irradiation of the first cutting portion 200 and the second cutting portion 200'. Two cameras 500 '; The process table 120 alternates with the plurality of fixing rods 121 and the plurality of fixing rods 121 disposed on the upper surface of the base plate along the conveying direction of the glass substrate G. A plurality of conveyors 122 arranged side by side on the rod portion 121 so that the height can be adjusted up and down with respect to the height of the fixed rod portion 121 and the front end of the fixed rod portion 121 A plurality of stoppers 123 disposed at the outer side of the glass substrate G to be temporarily seated on the fixing rod 121 and positioned at an outermost portion of the plurality of fixing rods 121. A plurality of side alignment parts 124 disposed on the side of the fixed rod part 121 and correcting the centering and orientation of the glass substrate G, and a stopper 123 disposed on the rear end of the fixed rod part 121. ) And the side alignment 124 A glass substrate cutting system using a laser, characterized in that configured to include a plurality of rear-alignment unit 125 for correcting the centering and direction of the glass substrate (G). The method according to claim 1, A plurality of cameras 500 are disposed in a predetermined position on the upper portion of the centering portion 100 in order to measure the position data of the standard and the predetermined direction of the glass substrate (G) seated on the centering portion 100. Glass substrate cutting processing system using a laser. The method according to claim 1, Each of the first cutting part 200 and the second cutting part 200 ′, Base plates 210 and 210 'are mounted on the bottom surface; Process tables (220, 220 ') disposed on the upper surfaces of the base plates (210, 210') to move the glass substrate (G) straight in a predetermined direction; A pair of guide tables 230 and 230 'installed side by side on the upper surfaces of both side ends of the base plates 210 and 210'; A pair of laser oscillators for oscillating the laser to process the glass substrate (G) located on the upper surface of the process table (220,220 ') while moving in a forward and backward direction along the pair of guide tables (230, 230') ( 240,240 '); A pair of lasers which are transported along the pair of guide tables 230 and 230 'integrally with the laser oscillator 240 and 240' and irradiate the glass substrate G with the laser oscillated from the laser oscillator 240 and 240 '. Irradiation units 250 and 250 '; Glass substrate cutting processing system using a laser, characterized in that comprises a. The method according to claim 3, The pair of laser irradiation unit 250, 250 ', While moving forward and backward along the pair of guide tables 230 and 230 ', they are independently moved at a predetermined distance in the left and right directions perpendicular to the longitudinal directions of the guide tables 230 and 230', respectively. Glass substrate cutting processing system using a laser, characterized in that possible installation. The method according to claim 4, The pair of laser irradiation unit 250, 250 ', A process of moving forward and backward along a pair of the guide tables 230 and 230 'and a process of moving a predetermined distance in a left and right direction perpendicular to the front and rear directions that are longitudinal directions of the guide tables 230 and 230'. Glass substrate cutting processing system using a laser, characterized in that connected to the cantilever structure independently from each of the laser oscillation portion (240,240 ') to be able to operate independently. The method according to claim 5, The laser irradiation unit 250, 250 ', An initial cracker providing an initial crack to the glass substrate (G); A reflector for guiding the laser beam oscillated from the laser oscillator (240,240 '); A shopping lens unit for condensing the laser beam transmitted from the reflecting means; A quenching nozzle unit for spraying cooling mist along the laser beam irradiated from the shopping lens; An air suction unit for sucking dust generated from the cooling mist sprayed from the quenching nozzle unit and the initial crack of the glass substrate (G); Glass substrate cutting processing system using a laser, characterized in that comprises a. The method according to claim 6, The laser oscillators 240 and 240 'are installed on the upper portion of the pair of guide tables 230 and 230' so as to be movable in the front and rear directions along the longitudinal direction of the guide tables 230 and 230 ', respectively. And a power supply unit for driving the laser source unit. The method according to claim 3, The process table 220, 220 ', A plurality of fixed rod parts 221 and 221 'disposed on an upper surface of the base plates 210 and 210' side by side in the longitudinal direction of the guide tables 230 and 230 '; A plurality of fixing rods 221 and 221 'are alternately arranged in parallel with each of the fixing rods 221 and 221', and a plurality of heights of the fixing rods 221 and 221 'are installed to be able to be adjusted up and down with respect to the height of the fixing rods 221 and 221'. Two conveyor sections 222, 222 '; Glass substrate cutting processing system using a laser, characterized in that configured to include. The method according to claim 1 or 8, The process tables 120, 220, and 220 ′ provided in the centering unit 100, the first cutting unit 200, and the second cutting unit 200 ′ are mounted on upper surfaces of the process tables 120, 220, and 220 ′, respectively. Fixed rod parts disposed at the outermost portion of each of the fixed rod parts 121, 221, 221 ′ arranged in a plurality and compatible with the conveyor parts 122, 222, 222 ′ arranged in a plurality so as to be compatible with the standard of the glass substrate G ( 121, 221, 221 ') and the conveyor unit (121, 222, 222') is a glass substrate cutting processing system using a laser, characterized in that installed so as to be able to fold and expand at right angles to each longitudinal direction.

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