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WO2012067361A2 - Dissipateur thermique pour lampe à diode électroluminescente - Google Patents

Dissipateur thermique pour lampe à diode électroluminescente Download PDF

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Publication number
WO2012067361A2
WO2012067361A2 PCT/KR2011/008274 KR2011008274W WO2012067361A2 WO 2012067361 A2 WO2012067361 A2 WO 2012067361A2 KR 2011008274 W KR2011008274 W KR 2011008274W WO 2012067361 A2 WO2012067361 A2 WO 2012067361A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat sink
dissipating
dissipating fin
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/008274
Other languages
English (en)
Other versions
WO2012067361A3 (fr
Inventor
Byung Il Kwon
Dong Hyun Kim
Kwang Jae Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100113705A external-priority patent/KR20120052508A/ko
Priority claimed from KR1020100113704A external-priority patent/KR20120052507A/ko
Priority claimed from KR1020100113706A external-priority patent/KR101789815B1/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of WO2012067361A2 publication Critical patent/WO2012067361A2/fr
Publication of WO2012067361A3 publication Critical patent/WO2012067361A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
    • F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a heat sink for an LED lamp, and more particularly, to a heat sink for an LED lamp where separate heat-dissipating fins can be coupled to a body of the heat sink to widen heat transfer area while being firmly supported, with the heat sink maintaining a light weight.
  • LED lamps are used for light sources where LED chips are combined, and recently LED packages where LED chips of high light efficiency are combined have been widely used to obtain desired light emitting effects.
  • LED packages have been used in various fields such as indoor/outdoor lighting devices, headlights for vehicles, and backlight units for liquid crystal displays (LCDs). Accordingly, the LED packages require high efficiencies and high heat dissipating characteristics together.
  • an LED lamp is used indoors and outdoors for a long time, in which case if heat generated in LED chips fails to be effectively dissipated through the entire package, temperatures of the LED chips increase, deteriorating the LED chips and reducing lives of the LED chips.
  • a heat dissipating structure is an important factor for flowing a large capacity of currents through an LED lamp.
  • FIG. 1 is a perspective view illustrating a conventional LED lamp.
  • a screw-coupled socket 30 is disposed at a lower end of the LED lamp, and an LED chip arrangement 10 is disposed an upper end portion thereof.
  • a heat sink 20 is disposed in a body of the LED lamp between the upper and lower ends of the LED lamp.
  • the heat sink 20 is formed on an outer peripheral surface of the body to have a wing-like shape, and serves to form passages for air and discharge heat.
  • the arrows in the right drawing denote passages for discharging heat. That is, the heat sink 20 serves to discharge the heat generated in the upper end portion thereof to the lower side andin a circumferential direction.
  • FIG. 2 is a perspective view illustrating the heat sink 20.
  • the heat sink 20 has a plurality of wings 22 protruding long in a lengthwise and the substantially cylindrical body 21.
  • the heat sink 20 is made of aluminum through die casting to dissipate the heat of the LED lamp.
  • LED chips disposed on a printed circuit board (PCB) are a heat source, and heat generated by the heat source is transferred through the heat sink 20.
  • the wings 22 are configured to widen a contact area of the heat sink 20 with air.
  • the heat sink 20 where the body 21 is integrally formed with the wings 22 is manufactured through die casting with a thick material, its weight is heavy and there is a limit in widening a contact area with air.
  • An aspect of the present invention is directed to a heat sink for an LED lamp which has a separate heat-dissipating fin coupling structure, contributing to light weight, increased heat transfer area, and high heat dissipation efficiency.
  • Another aspect of the present invention is directed to a heat sink for an LED lamp which maintains an interval between heat-dissipating fins, contributing to excellent coupling force and easy assembling process.
  • a heat sink for an LED lamp comprising: a heat sink body; and a plurality of heat-dissipating fins arranged on an outer peripheral surface of the heat sink body so that inner edges thereof contact the outer peripheral surface of the heat sink.
  • the heat sink body includes: a cylindrical heat sink base; and a cap-shaped heat sink top coupled to an upper side of the heat sink base.
  • the heat-dissipating fins can be easily and firmly coupled.
  • the heat sink base includes: a cylindrical body configured to contact outer peripheral surfaces of the heat-dissipating fins; a shaft protruding to the upper side of the body; and a lower support protruding from an upper end of the body in an outer peripheral direction.
  • the heat-dissipating fins can be firmly supported and heat transfer area can be widened.
  • the heat sink top is coupled to an upper end of the shaft and upper ends of the heat-dissipating fins are inserted into and fixed to the heat sink top, and the heat sink top includes a lower recess which is formed at a lower portion thereof to serve as a ring-shaped space into which upper ends of the heat-dissipating fins are inserted and fixed. Accordingly, upper sides of the heat-dissipating fins can be inserted to be coupled, thus being supported circumferentially and increasing heat transfer area.
  • the shaft has a cylindrical shape having a diameter smaller than that of the body.
  • a ring-shaped space is formed at an outer periphery of the shaft, and the heat-dissipating fins are inserted into the ring-shaped space to be coupled to the body.
  • the heat-dissipating fins can be coupled more firmly and heat transfer area can be widened.
  • a ring-shaped support groove for supporting lower ends of the heat-dissipating fins is formed in the lower support. Accordingly, the lower ends of the heat-dissipating fins can be supported more firmly.
  • the heat sink base further includes a step for catching and fixing the heat-dissipating fins protruding from an outer periphery of an upper end of the body upward.
  • the lower sides of the heat-dissipating fins can be supported more firmly.
  • each heat-dissipating fin includes: a plate-shaped fin portion an inner edge of which contacts an outer peripheral surface of the body; a lower insert portion supported by the lower support; and an upper insert portion inserted into a lower portion of the heat sink top.
  • the heat-dissipating fins can form a coupling portion to the heat sink body and the heat-dissipating fins can be arranged accurately, increasing coupling reliability.
  • the heat-dissipating fin further includes a contact portion formed by bending an inner edge of the pin portion circumferentially and contacting an outer peripheral surface of the body.
  • the heat-dissipating fins can be disposed circumferentially with reliability and heat transfer area can be widened.
  • each heat-dissipating fin further includes a catching recess formed at a portion where an inner periphery of the fin portion meets a lower periphery of the upper insert portion.
  • each heat-dissipating fin further includes an upper folding portion bent from an upper end of the heat-dissipating fin vertically and contacting a lower surface of an upper side of the heat sink body.
  • the heat-dissipating fins can be disposed circumferentially and radially with reliability and heat transfer area can be widened.
  • each heat-dissipating fin further includes an upper hook bent from an upper end of the heat-dissipating fin to the lower side, and the upper hook is bent downward from an end of the upper folding portion.
  • each heat-dissipating fin further includes an upper hole formed at an upper end of the heat-dissipating fin on a side opposite to the upper hook, and the heat-dissipating fins are coupled to each other in a manner where the upper hook is inserted into an upper hole of an adjacent heat-dissipating fin.
  • a width of the upper folding portion is determined depending on the number of the heat-dissipating fins disposed along an outer peripheral surface of the heat sink body. Accordingly, an interval between the heat-dissipating fins can be maintained and assembling reliability can be enhanced.
  • each heat-dissipating fin further includes a lower folding portion bent from an upper end of the heat-dissipating fin and contacting an upper surface of a lower side of the heat sink body.
  • the heat-dissipating fins can be disposed circumferentially and radially and heat transfer area can be widened.
  • each heat-dissipating fin further includes a lower hook bent upward from a lower end of the heat-dissipating fin, and the lower hook is bent upward from one end of the lower folding portion.
  • each heat-dissipating fin further includes a lower hole formed at a lower end of the heat-dissipating fin on a side opposite to the lower hook, and the heat-dissipating fin is coupled to each other in a manner where the lower hook is inserted into a lower hole of an adjacent heat-dissipating fin.
  • a width of the lower folding portion is determined depending on the number of the heat-dissipating fins disposed along an outer peripheral surface of the heat sink body. Accordingly, an interval can be maintained between the heat-dissipating fins and assembling reliability can be enhanced.
  • the present invention proposes a structure of a heat sink having a plurality of separate heat-dissipating fins which can be firmly coupled to the heat sink, contributing to remarkable heat dissipation efficiency.
  • the heat sink can remarkably reduce weight and increase heat dissipation efficiency as well, contributing to a large size and a large capacity of an LED lamp.
  • the heat sink according to the present invention includes a coupling structure where an interval between the heat-dissipating fins can be maintained, making it possible to maintain gaps through which heat can be dissipated and improve coupling reliability between the heat-dissipating fins.
  • FIG. 1 is a perspective view illustrating a conventional LED lamp
  • FIG. 2 is a perspective view illustrating a heat sink for the LED lamp of FIG. 1;
  • FIG. 3 is a perspective view illustrating a heat-dissipating fin of a heat sink according to the present invention
  • FIG. 4 is a perspective view illustrating a body of the heat sink according to the present invention, the body of the heat sink having a top and a base;
  • FIG. 5 is a perspective view illustrating a state where heat-dissipating fins are coupled to the heat sink according to the present invention
  • FIG. 6 is a side sectional view illustrating the body of the heat sink according to the present invention.
  • FIG. 7 is a side sectional view illustrating a heat-dissipating fin of the heat sink according to the present invention.
  • FIG. 8 is a perspective view illustrating an upper portion of a heat-dissipating fin of the heat sink according to the present invention.
  • FIG. 9 is a perspective view illustrating a lower portion of a heat-dissipating fin of the heat sink according to the present invention.
  • FIG. 10 is a perspective view illustrating a coupling state of heat-dissipating fins according to the present invention.
  • FIG. 11 is a plan view illustrating heat-dissipating fins of the heat sink according to the present invention when viewed from the top;
  • FIG. 12 is a perspective view illustrating heat-dissipating fins of the heat sink according to the present invention when viewed from the top;
  • FIG. 13 is a perspective view illustrating the heat sink according to the present invention.
  • FIG. 3 is a perspective view illustrating a heat-dissipating fin 100 according to the present invention.
  • a portion where LED chips are disposed is defined as an upper portion or an upper side and a portion opposite to the upper portion or the upper side is defined as a lower portion or a lower side with an axis passing by the center of the cross-section being a central axis.
  • the upper and lower sides may be reversed.
  • An outer peripheral direction is defined as an outer side and an inner peripheral direction is defined as an inner side when heat-dissipating fins are disposed in the heat sink.
  • one side where the heat-dissipating fins are disposed along an outer peripheral surface is defined as one side and an opposite direction is defined as an opposite side while the heat-dissipating fins are disposed along an outer peripheral surface of the heat sink.
  • a cross-section of the heat sink may have a polygonal shape.
  • the shape of the heat sink may not be symmetrical rightward and leftward or upward or downward, and it is sufficient if the heat sink has a hollow cylindrical shape.
  • the heat sink of the present invention includes heat-dissipating fins 100 as separate part unlike in a conventional technology where heat-dissipating fins are integrally formed.
  • a heat-dissipating fin 100 is formed of a thermally conductive metal plate, and in particular, a plurality of heat-dissipating fins 100 are coupled to a heat sink body (401 of FIG. 4) to form a heat sink.
  • the heat-dissipating fins 100 according to the present invention may be formed of a metal through pressing or die casting, but are not limited thereto.
  • each heat-dissipating fin includes a fin portion 110 forming a body of the heat-dissipating fin 100 serving as a wing in appearance on an outer peripheral surface of the heat sink body, a lower insert portion 120 formed at a lower side of the fin portion 110, and an upper insert portion 130 formed at an upper side of the fin portion 110.
  • the lower insert portion 120 and the upper insert portion 130 are coupled to the heat sink body (401 of FIG. 4).
  • the heat-dissipating fin 100 is formed by cutting and bending a single metal plate, and the lower insert portion 120 extending to the lower side of the fin portion 110 is formed long lengthwise and a radial width of the lower insert portion 120 is smaller than that of the fin portion 110.
  • a line where an outer edge of the fin portion 110 meets an edge of the lower insert portion 120 is preferably inclined, and is more preferably curved, considering a shape of a portion where a socket is inserted.
  • the upper insert portion 130 extends to the upper and inner sides of the fin portion 110. As will be described below, since the upper insert portion 130 is inserted into an upper portion of the heat sink body to be coupled to the heat sink body, it protrudes inward as compared with the fin portion 110 and the lower insert portion 120.
  • a line where an inner edge of the fin portion 110 meets an inner edge of the lower insert portion 120 is formed smooth, and contacts an outer surface of the heat sink body.
  • a contact portion 112 bent vertically, i.e. circumferentially is formed at the inner edges of the fin portion 110 and the lower insert portion 120.
  • the contact portion 112 is formed to have a predetermined widthwise area and serves to position the fin portion 110 so that the fin portion 110 can accurately face an outer peripheral direction as it contacts an outer peripheral surface of the heat sink body. Then, since it widens a contact area with the heat sink body, heat transfer efficiency is enhanced.
  • a lower folding portion 121 bent vertically, i.e. circumferentially is formed at an end of the lower end portion 120.
  • the lower folding portion 121 contacts a lower portion of the heat sink body, enhancing heat transfer efficiency and allowing the heat-dissipating fin 100 to be accurately positioned.
  • the upper insert portion 130 preferably has an upper folding portion 131.
  • the upper folding portion 131 contacts an upper portion of the heat sink body, allowing the heat-dissipating fins 100 to be accurately positioned and enhancing heat transfer efficiency.
  • a lower hook 122 is preferably formed at an end of the lower folding portion 121 of the lower insert portion 120 to be bent upward again.
  • the lower hook 122 is coupled to a predetermined portion of the lower folding portion 121 of an adjacent heat-dissipating fin 100 so that a plurality of heat-dissipating fins 100 can be connected to each other.
  • the lower folding portion 121 preferably has a hole at a corresponding position so that a lower hook 122 of the heat-dissipating fin 100 can be inserted through and fixed to the hole.
  • an upper hook 132 is formed in the upper folding portion 131 of the upper insert portion 130 to be bent downward again.
  • the upper hook is coupled to a predetermined portion of the upper folding portion 131 of an adjacent heat-dissipating fin 100 so that a plurality of heat-dissipating fins 100 are connected to each other, and the upper folding portion 131 preferably has a hole at a corresponding position so that a upper hook 132 of the heat-dissipating fin 100 can be inserted through and fixed to the hole.
  • the line of an inner edge of the heat-dissipating fin 100 is substantially L-shaped, and a catching recess 111 is preferably formed at an L-shaped inner corner portion, i.e. a portion where an inner edge of the fin portion 110 meets a lower edge of the upper insert portion 130.
  • a substantially L-like shape is formed on an outer surface of the heat sink body to correspond to a shape of an inner periphery of the heat-dissipating fin 100, in which case the heat-dissipating fin 100 can be more firmly coupled to the body due to a mechanical coupling force between the catching recess 111 of the heat-dissipating fin 111 and a step (312 of FIG. 4) of the body as compared with a case where their positions are maintained by contact and frictional forces only.
  • the upper insert portion 130 has a shape protruding from the fin portion 110 as described above, and an outer edge of the fin portion 110 and an outer edge of the upper insert portion 130 are preferably stepped as in FIG. 3. Meanwhile, the lower insert portion 120 protrudes to the lower side of the fin portion 110, in which case a lower portion of an outer edge of the fin portion 110 and an outer edge of the lower insert portion 120 are also stepped. This structure will be described later.
  • an end of the upper insert portion 130 is inserted into a predetermined portion of the heat sink body, more firmly supporting the heat-dissipating fin 100.
  • FIG. 4 is a perspective view illustrating a body of the heat sink according to the present invention, the body of the heat sink having a heat sink top defining an upper portion of the heat sink body and a heat sink base defining a lower portion of the heat sink body.
  • the heat sink body 401 of the present invention has a substantially hollow cylindrical shape, and includes a heat sink top 200 having a cap-like shape at an upper portion thereof and a heat sink base 300 at a lower portion thereof.
  • the heat sink base 300 has a cylindrical shape, and the heat sink top 200 has a cap-like shape coupled to an upper side of the heat sink base 300.
  • the heat sink base 300 and the heat sink top 200 are coupled to each other to form the heat sink body 401.
  • the heat-dissipating fins 100 are coupled to an outer peripheral surface of the heat sink body 401 so that heat generated in LED chips can be discharged to the outside through the heat-dissipating fins 100.
  • the heat sink base 300 occupies almost all of the height of the heat sink and an inner edge of the heat-dissipating fin 100 contacts the outer peripheral surface of the heat sink base 300.
  • a contact portion 112 of the heat-dissipating fin 100 which has been described with reference to FIG. 3 contacts an outer peripheral surface of the body 310 of the heat sink base 300.
  • the heat sink base 300 includes a lower support 320, a body 310, and a shaft 330 sequentially from the bottom.
  • the body 310 is preferably formed to correspond to a length of the contact portion 112 of the heat-dissipating fin 100 and has a perfect cylindrical shape at an outer peripheral surface thereof. Meanwhile, the shape of the body 310 may be modified by the shape of an inner edge of the heat-dissipating fin 100. An interior of the body 310 is hollow.
  • the lower support 320 has a ring-like shape protruding further to the outer peripheral direction than the body 310, and supports an end of the lower insert portion 120 of the heat-dissipating fin 100.
  • the lower support 320 is stepped to prevent separated of the lower insert portion 120 of the heat-dissipating fin 100 in an outer circumferential direction.
  • a support groove 321 is formed along an upper surface and an inner peripheral surface of the lower support 320, and an outer peripheral surface of the body 310.
  • the support groove 321 has a width corresponding to that of the lower insert portion 120 of the heat-dissipating fin 100, and an upper surface of the support groove 321 contacts a lower surface of the lower folding portion 121. As the lower folding portion 121 contacts a bottom surface of the support groove 321 as mentioned above, a contact portion between the heat-dissipating fin 100 and the heat sink base 300 becomes wider, resulting in accurate support and wider heat transfer area.
  • a edge of the lower end portion of the lower insert portion 120 is stepped as described above, in which case a width of the support groove 321 preferably corresponds to a width of a lower end portion of the lower insert portion 120 where a step is formed.
  • a shaft 330 protrudes upward from an upper end of the heat sink base 300.
  • the shaft 330 preferably has a cylindrical shape whose diameter is smaller than that of the body 310, and the heat sink top 200 is coupled to an upper end of the shaft 330.
  • a space is defined between a lower surface of the heat sink top 200, an outer peripheral surface of the shaft 330, and an upper surface of the body 310, and the upper insert portion 130 of the heat-dissipating fin 100 is inserted into and fixed to the space.
  • a ring-shaped step 312 preferably protrudes upward from an outer periphery of an upper surface of the body 310.
  • the step 312 has a shape corresponding to the catching recess 111 of the heat-dissipating fin 100. Accordingly, the catching recess 111 of the heat-dissipating fin 100 is inserted into and fixed to the step 312, mechanically preventing the heat-dissipating fin 100 from being separated outward.
  • a recess is preferably formed on a lower surface of the heat sink top 200. That is, a recess may be formed to have a corresponding shape so that a periphery of an upper end of the upper insert portion 130 of the heat-dissipating fin 100 can be inserted thereinto.
  • the upper folding portion 131 of the upper insert portion 130 contacts a bottom surface of the heat sink top 200, making it possible to accurately support the heat-dissipating fin 100 and widen a contact area for heat transfer as mentioned above.
  • FIG. 5 is a side sectional view illustrating an internal structure of the heat sink body 401 including the heat sink top 200 and the heat sink base 300 according to the present invention.
  • the heat sink top 200 has a disk-like shape or a cap-like shape to be coupled to an upper side of the heat sink base 300, i.e. the shaft 330, and a positioning portion 210 is formed on an upper surface of the heat sink top 200 so that a substrate where LED chips are arranged can be disposed thereon.
  • a ring-shaped lower groove 201 is formed on a lower surface of the heat sink top 200 so that the upper insert portion 130 can be inserted thereinto.
  • a cross-section of the lower groove 201 coincides with a shape of an upper end of the upper insert portion 130.
  • a width of the lower groove 201 coincides with a width of an upper end of the upper insert 130, and preferably coincides with a width from a step on the outer side of the upper insert portion 130 and an inner periphery thereof.
  • a cylindrical protrusion is formed at a central portion of the heat sink top 200 to correspond to a shape of the shaft 330 of the heat sink base 300, and the shaft and the protrusion are hollow so that wires can be inserted into the hollow portions to be connected to the LED chips later.
  • An interior of the heat sink base 300 is hollow.
  • an outer side of the lower recess 201 of the heat sink top 200 protrudes along an outer periphery of the heat sink top 200 to have a ring shape to form the upper support 220, and a lower surface of the upper support 220 supports a step formed at an outer side of an upper end of the upper insert portion 130.
  • the heat-dissipating fins 100 are disposed more firmly and their contact areas become wider, resulting in a reliable assembled state and an excellent heat-dissipating efficiency.
  • the upper insert portion 130 of the heat-dissipating fin 100 is inserted and fixed to a space defined by the lower recess 201 of the heat sink top 200, the space formed at an outer periphery of the shaft 330, the upper recess 311 of the heat sink base 300, and an inner edge of the body of the heat-dissipating fin 100 contacts an outer peripheral surface of the body 310, and the lower insert portion 120 of the heat-dissipating fin 100 is inserted into and coupled to the support groove 321.
  • the upper support 220 and the lower support 320 catch the steps formed at the upper and lower sides of the heat-dissipating fin 100 to perfectly support the heat-dissipating fin 100 vertically and circumferentially, and the step 312 formed at an upper end of the body 310 is inserted into the catching recess 111 of the heat-dissipating fin 100, resulting in more firm coupling of the heat-dissipating fin 100.
  • FIG. 6 is a perspective view illustrating a state where the heat-dissipating fins of the heat sink according to the present invention are assembled.
  • the heat-dissipating fins 100 are coupled to the body 310 in a manner where they are inserted into an outer peripheral surface of the body from the upper side to the lower side. Then, the lower insert portion 120 is inserted into the support groove 321 and a step 312 is inserted into the catching recess 111.
  • an inner edge of the upper insert portion 130 contacts an outer peripheral surface of the shaft 330, a lower edge of the upper insert portion 130 contacts an upper surface of the body 310, and the contact portion 112 contacts on an outer peripheral surface of the body 310 and the lower insert portion 120 or the lower folding portion 121 contacts an upper surface of the lower support portion 320, i.e. a bottom surface of the support groove 321.
  • the heat sink top 200 is coupled from the top.
  • a recess is formed at a lower portion of the heat sink top 200 so that an upper end of the upper insert portion 130 of the heat-dissipating fin can be inserted thereinto, and an upper end of the upper insert portion 130 or the upper folding portion 131 contacts a lower surface of the heat sink top 200.
  • a portion where the heat-dissipating fin 100 contacts the heat sink body 401 is remarkably widened, whereby a heat transfer area is widened and heat-dissipating effect is maximized.
  • FIG. 7 is a side view illustrating a structure of the heat-dissipating fin according to the present invention in more detail.
  • the upper insert portion 130 is formed at an inner upper side of the fin portion 110, and the lower insert portion 120 is formed at a lower side thereof.
  • the lower folding portion 121, the upper folding portion 131, the lower hook 122, the upper hook 132, and the contact portion 112 contacts a bottom surface of the support groove 321 of the heat sink base 300, an upper surface of the lower groove 201 of the heat sink top 200, and an outer peripheral surface of the body 310 respectively, more firmly supporting the heat-dissipating fins 100 and widening heat-transfer area.
  • the lower folding portion 121, the upper folding portion 132, and the contact portion 112 are preferably in the same direction, i.e. the clockwise direction or counterclockwise direction of the body 401, but may be formed in different directions, considering production/assembling efficiency.
  • a step may be formed at a line where an outer side of the upper insert portion 130 meets an outer edge of the fin portion 110 to be supported by the upper support 220, and a line where a lower portion of an outer edge of the fin portion 110 meets an outer periphery of the lower insert portion 121 are curved, considering a shape of an insert portion of the socket or the housing.
  • a step is formed at a lower end of the outer line of the lower insert portion 120 to be supported by the lower support 320.
  • FIG. 8 is an enlarged perspective view illustrating an upper hook portion formed at an upper side of the heat-dissipating fin according to the present invention
  • FIG. 9 is an enlarged perspective view illustrating a lower hook portion formed at a lower side of the heat-dissipating fin according to the present invention.
  • the upper insert portion 130 is formed at an upper inner side of the fin portion 110, and the upper folding portion 131 is formed vertically at the upper insert portion 130.
  • an upper hook 132 is bent downward from an end of the upper folding portion 131.
  • the upper hole 133 is formed at a portion of the upper folding portion 131 facing the upper hook 132.
  • the upper hole 133 is formed at a corner where the upper folding portion 131 is bent from the upper insert portion 130 and has a shape corresponding to that of the upper hook 132.
  • a lower hook 122 is bent upward from one end of the lower folding portion 121, and a lower hole 123 is formed at a portion of the lower folding portion 121 facing the lower hook 122.
  • the lower hole 123 is formed at a corner where the lower folding portion 121 is bent from the lower insert portion 120, and has a shape corresponding to that of the lower hook 122.
  • FIG. 10 is a perspective view illustrating a state where the heat-dissipating fins according to the present invention are coupled to each other.
  • FIG. 11 is a plan view illustrating upper portions where the heat-dissipating fins are coupled to each other.
  • FIG. 12 is a perspective view illustrating lower portions where the heat-dissipating fins are coupled to each other.
  • the heat-dissipating fins 100 are disposed along an outer periphery of the heat sink body 401, and the coupling structures of the heat sink body 410 and the heat-dissipating fins 100 are configured to support the heat-dissipating fins lengthwise and radially.
  • the heat-dissipating fins 100 includes the structures of the hooks 122 and 132 and the holes 123 and 133.
  • the upper folding portions 131 serve as a type of stopper for maintaining an interval between the heat-dissipating fins 100.
  • a width of the upper folding portions 131 may be determined depending on the number of heat-dissipating fins disposed along an outer peripheral surface of the heat sink body 401.
  • the upper hooks 132 maintain the couplings of the heat-dissipating fins 100 in a manner where they are inserted into the upper holes 133 formed in the heat-dissipating fins 100, and when the heat-dissipating fins 100 are completely disposed, the heat-dissipating fins are arranged in a ring-like shape.
  • the lower folding portions 121 may serve as a type of stopper for maintaining an interval between the heat-dissipating fins 100, and a width of the lower folding portions 131 may be determined depending on the number of the heat-dissipating fins 100 disposed along an outer peripheral surface of the heat sink body 401.
  • the lower hooks 122 maintain the couplings of the heat-dissipating fins 100 in a manner where they are inserted into the lower holes 123 formed in the heat-dissipating fins 100.
  • only one of the upper hook 132 and the upper hole 133, and the lower hook 122 and the lower hole 123 may be disposed in each heat-dissipating fin 100, and they may be disposed at the upper and lower sides of the heat-dissipating fin 100.
  • FIG. 13 is a perspective view illustrating a state of the heat sink where the heat-dissipating fins according to the present invention are coupled and disposed.
  • the lower folding portion 121, the upper folding portion 132, and the contact portion 112 contacts a bottom surface of the support groove 321 of the heat sink base 300, an upper surface of the lower recess 201 of the top 200, and an outer peripheral surface of the body 310 respectively, more firmly supporting the heat-dissipating fins 100 and widening heat transfer area.
  • the lower folding portion 121, the upper folding portion 132, and the contact portion 112 are preferably in the same direction, i.e. the clockwise direction or counterclockwise direction of the body 401, but may be formed in different directions, considering production/assembling efficiency.
  • the heat-dissipating fins 100 are coupled along an outer periphery of the heat sink body 401, in which case the lower folding portions 121 and the upper folding portions 131 of the heat-dissipating fins 100 are formed clockwise or counter clockwise, and the lower hook 122 or the upper hook 132 are coupled along an outer periphery of the body 310 in a manner where they are caught by the lower hole 123 or the upper hole 133.
  • the circumferential widths of the lower folding portion 121 and the upper folding portion 131 are determined depending on the number of the heat-dissipating fins 100 coupled to an outer periphery of the body 310.
  • the heat sink portion is approximately 66.9 degrees Celsius in the conventional heat sink illustrated in the left drawing and the heat sink according to the present invention is 51.9 degrees Celsius as illustrated in the right drawing.
  • the heat sink to which the heat-dissipating fins according to the present invention represents a temperature lower by approximately 15 degrees Celsius experimentally, remarkably enhancing heat-dissipating efficiency.
  • the weight of a heat sink can be decreased as well as heat dissipating efficiency. Accordingly, an LED lamp can be made large-sized and can have large capacity.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

Cette invention concerne un dissipateur thermique pour lampe à diode électroluminescente, qui admet l'accouplement d'ailettes de dissipation thermique distinctes sur un corps dudit dissipateur de façon à élargir la surface de transfert de chaleur. Ledit dissipateur assure un maintien ferme des ailettes tout en restant léger. Le dissipateur thermique pour lampe à diode électroluminescente comprend : un corps de dissipateur thermique ; et une pluralité d'ailettes de dissipation thermique agencées sur une surface périphérique extérieure du corps de dissipateur thermique de telle manière que des bords intérieurs desdites ailettes soient en contact avec la surface périphérique extérieure du dissipateur thermique. Le fait que le corps de dissipateur thermique et les ailettes de dissipation thermique sont produits séparément et accouplés les uns aux autres, permet de réduire le poids total du dissipateur thermique et d'améliorer sa capacité de dissipation thermique.
PCT/KR2011/008274 2010-11-16 2011-11-02 Dissipateur thermique pour lampe à diode électroluminescente Ceased WO2012067361A2 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2010-0113706 2010-11-16
KR1020100113705A KR20120052508A (ko) 2010-11-16 2010-11-16 Ｌｅｄ 조명의 히트싱크
KR10-2010-0113704 2010-11-16
KR10-2010-0113705 2010-11-16
KR1020100113704A KR20120052507A (ko) 2010-11-16 2010-11-16 Ｌｅｄ 조명의 히트싱크
KR1020100113706A KR101789815B1 (ko) 2010-11-16 2010-11-16 히트싱크의 방열핀

Publications (2)

Publication Number Publication Date
WO2012067361A2 true WO2012067361A2 (fr) 2012-05-24
WO2012067361A3 WO2012067361A3 (fr) 2012-07-12

Family

ID=46084466

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/008274 Ceased WO2012067361A2 (fr) 2010-11-16 2011-11-02 Dissipateur thermique pour lampe à diode électroluminescente

Country Status (2)

Country Link
TW (1) TWI481797B (fr)
WO (1) WO2012067361A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014312A (ja) * 2016-05-10 2018-01-25 三菱電機株式会社 照明装置及び照明装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4980152B2 (ja) * 2007-06-19 2012-07-18 シャープ株式会社 照明装置
TWM334910U (en) * 2007-10-23 2008-06-21 Ching-Pin Liao Lamp structure
US7637635B2 (en) * 2007-11-21 2009-12-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat sink
TWM336390U (en) * 2008-01-28 2008-07-11 Neng Tyi Prec Ind Co Ltd LED lamp
KR100932192B1 (ko) * 2009-05-26 2009-12-16 김용철 개선된 방열기능을 갖는 ｌｅｄ 조명기구
KR100939231B1 (ko) * 2009-09-23 2010-01-29 제이에스제이텍(주) 엘이디 조명램프

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014312A (ja) * 2016-05-10 2018-01-25 三菱電機株式会社 照明装置及び照明装置の製造方法

Also Published As

Publication number Publication date
TW201224352A (en) 2012-06-16
TWI481797B (zh) 2015-04-21
WO2012067361A3 (fr) 2012-07-12

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