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WO2012061050A3 - Methods for improving pool boiling and apparatuses thereof - Google Patents

Methods for improving pool boiling and apparatuses thereof Download PDF

Info

Publication number
WO2012061050A3
WO2012061050A3 PCT/US2011/057413 US2011057413W WO2012061050A3 WO 2012061050 A3 WO2012061050 A3 WO 2012061050A3 US 2011057413 W US2011057413 W US 2011057413W WO 2012061050 A3 WO2012061050 A3 WO 2012061050A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
pool boiling
apparatuses
methods
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/057413
Other languages
French (fr)
Other versions
WO2012061050A2 (en
Inventor
Satish G. Kandlikar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rochester Institute of Technology
University of Rochester
Original Assignee
Rochester Institute of Technology
University of Rochester
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rochester Institute of Technology, University of Rochester filed Critical Rochester Institute of Technology
Publication of WO2012061050A2 publication Critical patent/WO2012061050A2/en
Publication of WO2012061050A3 publication Critical patent/WO2012061050A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A method and apparatus for pool boiling includes introducing a fluid into a chamber of a housing which has one or more protruding features. One or more diverters extend at least partially across the one or more protruding features in the chamber. One or more bubbles are formed in the fluid in the chamber as a result of bubble nucleation. At least one of growth and motion of the one or more of the bubbles are diverted with the one or more diverters to generate additional localized motion of the fluid along at least one of the one or more protruding features and other surfaces in the chamber of the housi ng to at least one of transfer additional heat to the liquid and increase the critical heat flux limit.
PCT/US2011/057413 2010-10-25 2011-10-23 Methods for improving pool boiling and apparatuses thereof Ceased WO2012061050A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/925,584 2010-10-25
US12/925,584 US20120097373A1 (en) 2010-10-25 2010-10-25 Methods for improving pool boiling and apparatuses thereof

Publications (2)

Publication Number Publication Date
WO2012061050A2 WO2012061050A2 (en) 2012-05-10
WO2012061050A3 true WO2012061050A3 (en) 2012-08-16

Family

ID=45971976

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/057413 Ceased WO2012061050A2 (en) 2010-10-25 2011-10-23 Methods for improving pool boiling and apparatuses thereof

Country Status (2)

Country Link
US (1) US20120097373A1 (en)
WO (1) WO2012061050A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2950133B1 (en) * 2009-09-14 2011-12-09 Commissariat Energie Atomique THERMAL EXCHANGE DEVICE WITH IMPROVED EFFICIENCY
US11073340B2 (en) * 2010-10-25 2021-07-27 Rochester Institute Of Technology Passive two phase heat transfer systems
WO2014152354A1 (en) * 2013-03-14 2014-09-25 Rochester Institute Of Technology Heat transfer system and method incorporating tapered flow field
WO2015175147A2 (en) * 2014-04-18 2015-11-19 Kandlikar Satish G Enhanced boiling with selective placement of nucleation sites
JP6283410B2 (en) * 2014-05-12 2018-02-21 国立大学法人横浜国立大学 COOLER, COOLING DEVICE USING SAME, AND METHOD OF COOLING HEAT GENERATOR
US10306802B1 (en) * 2015-08-28 2019-05-28 Lockheed Martin Corporation Micro jet impingement heat sink
US10473410B2 (en) * 2015-11-17 2019-11-12 Rochester Institute Of Technology Pool boiling enhancement with feeder channels supplying liquid to nucleating regions
CN107148201B (en) * 2017-07-14 2020-03-31 四川大学 Cooling device utilizing micro boiling high-efficiency heat exchange technology
US11723173B1 (en) 2022-03-23 2023-08-08 Rolls-Royce Corporation Stacked cold plate with flow guiding vanes and method of manufacturing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6719040B2 (en) * 2001-09-14 2004-04-13 Denso Corporation Cooling apparatus boiling and condensing refrigerant with improved tunnel structure
US7261144B2 (en) * 2004-06-18 2007-08-28 Ecole polytechnique fédérale de Lausanne (EPFL) Bubble generator
US7265979B2 (en) * 2004-06-24 2007-09-04 Intel Corporation Cooling integrated circuits using a cold plate with two phase thin film evaporation
JP2009281646A (en) * 2008-05-21 2009-12-03 Toyota Industries Corp Plate heat exchanger for evaporation cooling
WO2010050129A1 (en) * 2008-10-29 2010-05-06 日本電気株式会社 Cooling structure, electronic device, and cooling method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4653163A (en) * 1984-09-14 1987-03-31 Hitachi, Ltd. Method for producing a heat transfer wall for vaporizing liquids
JP3451737B2 (en) * 1994-09-06 2003-09-29 株式会社デンソー Boiling cooling device
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6719040B2 (en) * 2001-09-14 2004-04-13 Denso Corporation Cooling apparatus boiling and condensing refrigerant with improved tunnel structure
US7261144B2 (en) * 2004-06-18 2007-08-28 Ecole polytechnique fédérale de Lausanne (EPFL) Bubble generator
US7265979B2 (en) * 2004-06-24 2007-09-04 Intel Corporation Cooling integrated circuits using a cold plate with two phase thin film evaporation
JP2009281646A (en) * 2008-05-21 2009-12-03 Toyota Industries Corp Plate heat exchanger for evaporation cooling
WO2010050129A1 (en) * 2008-10-29 2010-05-06 日本電気株式会社 Cooling structure, electronic device, and cooling method

Also Published As

Publication number Publication date
US20120097373A1 (en) 2012-04-26
WO2012061050A2 (en) 2012-05-10

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