[go: up one dir, main page]

WO2012060342A1 - Procédé de production de lentille mince - Google Patents

Procédé de production de lentille mince Download PDF

Info

Publication number
WO2012060342A1
WO2012060342A1 PCT/JP2011/075111 JP2011075111W WO2012060342A1 WO 2012060342 A1 WO2012060342 A1 WO 2012060342A1 JP 2011075111 W JP2011075111 W JP 2011075111W WO 2012060342 A1 WO2012060342 A1 WO 2012060342A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
mold
sub
photopolymerization initiator
photocurable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/075111
Other languages
English (en)
Japanese (ja)
Inventor
原明子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Publication of WO2012060342A1 publication Critical patent/WO2012060342A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers

Definitions

  • the present invention relates to a method for manufacturing a wafer lens, and more particularly to a method for manufacturing a wafer lens for use in an imaging lens or the like.
  • a curable resin composition is injected between a glass flat plate and a mold to mold a lens portion (for example, see Patent Document 1).
  • a resin-made sub master mold is formed from the master mold, and the lens portion is molded using the sub master mold.
  • a resin sub-sub master mold is formed using the sub master mold as a mold, and the lens portion is molded from the sub-sub master mold.
  • a resin transfer mold such as a sub-submaster mold
  • a resin that transmits light in a wavelength region necessary for curing the resin composition for forming the lens section it is necessary to configure a resin transfer mold such as a sub-submaster mold with a resin that transmits light in a wavelength region necessary for curing the resin composition for forming the lens section.
  • the resin transfer mold may absorb light necessary for curing the lens portion, and the light intensity may vary depending on the thickness of the resin transfer mold. . That is, for example, when a convex lens part is molded using a sub-submaster mold, the optical part corresponding to the thin part is ahead of the flange part corresponding to the thick part of the sub-submaster mold in the lens part. Curing starts.
  • the present invention provides a method for producing a wafer lens that can accurately mold a lens portion from a resin transfer mold even if a photo-curable resin is used to form a resin transfer mold such as a sub-submaster mold or a lens portion.
  • the purpose is to do.
  • a first wafer lens manufacturing method includes a substrate and a resin layer having a molding surface formed on one substrate surface of the substrate and including an optical surface.
  • the method includes the step of forming a resin layer having a molding surface using a resin transfer mold having an optical transfer surface having a shape obtained by inverting the optical surface, and the resin layer is formed of a first photocurable resin.
  • the first photocurable resin is obtained by curing the first photocurable resin composition containing the first photopolymerization initiator, and the absorbance of the first photopolymerization initiator is changed to the first photocurable resin.
  • the thickness light transmittance is 7% as a resin transfer mold.
  • the first photopolymerization curing agent has an absorbance of 1.0 or more
  • a resin transfer mold having a thickness light transmittance of 1% or more and less than 7% is used.
  • the first photopolymerization initiator of the first photocurable resin forming the resin layer has low sensitivity, specifically, the absorbance is less than 0.25
  • molding is performed.
  • the thick light transmittance of the thickest part of the resin transfer mold for transferring the surface is made relatively high at 60% or more.
  • the first photopolymerization initiator of the first photocurable resin has a medium sensitivity, specifically, when the absorbance is 0.25 or more and less than 1.0, the resin-transfer-type thick light transmittance is 7 % Or more and less than 60%.
  • the resin light transfer type wall thickness light transmittance is compared with 1% or more and less than 7%. Lower.
  • the optimal quantity of light can be permeate
  • the optical surface can be transferred with high accuracy.
  • the first photocurable resin is not irradiated with light more than necessary, adverse effects on durability such as yellowing of the resin and environmental tests can be prevented.
  • a second wafer lens manufacturing method includes a substrate and a resin layer having a molding surface formed on one substrate surface of the substrate and having a molding surface including an optical surface.
  • the method includes the step of forming a resin layer having a molding surface using a resin transfer mold having an optical transfer surface having a shape obtained by inverting the optical surface, and the resin layer is formed of a first photocurable resin.
  • the resin transfer mold is formed of the second photocurable resin, and the first photocurable resin is obtained by curing the first photocurable resin composition containing the first photopolymerization initiator.
  • the resin layer of the resin transfer mold for transferring the molding surface satisfies the conditional expression (1), so that the resin layer can be cured with respect to the photocurable resin. Effective light can be delivered more efficiently. Thereby, an optical surface can be accurately transferred.
  • the first photocurable resin is not irradiated with light more than necessary, adverse effects on durability such as yellowing of the resin and environmental tests can be prevented.
  • a third wafer lens manufacturing method includes a substrate and a resin layer having a molding surface molded on one substrate surface of the substrate and including an optical surface.
  • the method includes the step of forming a resin layer having a molding surface using a resin transfer mold having an optical transfer surface having a shape obtained by inverting the optical surface, and the resin layer is formed of a first photocurable resin.
  • the resin transfer mold is formed of the second photocurable resin, and the first photocurable resin is obtained by curing the first photocurable resin composition containing the first photopolymerization initiator.
  • the resin transfer mold At the longest wavelength at which the absorbance of the first photopolymerization initiator measured in a state where the first photopolymerization initiator is dissolved in acetonitrile at a concentration of 0.01% by mass is 0.3 or more, the resin transfer mold The light transmittance of the thickest part is 30%. Those of 10% is used as the resin transfer mold.
  • the thickness light transmittance of the resin transfer mold for transferring the molding surface is the longest wavelength at which the absorbance of the first photopolymerization initiator is 0.3 or more. By making it into the range, light effective for curing can be more efficiently delivered to the photocurable resin of the resin layer. Thereby, an optical surface can be accurately transferred.
  • the first photocurable resin is not irradiated with light more than necessary, adverse effects on durability such as yellowing of the resin and environmental tests can be prevented.
  • the resin portion constituting the optical transfer surface of the resin transfer mold includes a second photopolymerization initiator. It is formed with the 2nd photocurable resin which hardened 2 photocurable resin compositions.
  • the transfer surface can be accurately formed by configuring the resin transfer mold with a photocurable resin.
  • the first photocurable resin is an acrylic resin, an allyl ester resin, a vinyl resin, or an epoxy resin.
  • the first photocurable resin is an ultraviolet curable resin.
  • the resin transfer mold is a sub-sub-master mold formed by transferring twice from a master mold having a transfer surface corresponding to the molding surface.
  • a master mold having a concave optical transfer surface may be manufactured, and the master mold can be easily manufactured.
  • the resin transfer mold is a sub-master mold formed by a single transfer from a master mold having a transfer surface corresponding to the molding surface.
  • a master mold having a concave optical transfer surface may be manufactured, and the master mold can be easily manufactured.
  • the substrate is made of glass. In this case, the strength of the substrate can be maintained even when the substrate is relatively thin.
  • the resin transfer mold includes a light-transmitting substrate and a resin portion having a mold surface formed on one substrate surface of the substrate and including a plurality of optical transfer surfaces.
  • the resin transfer mold has a two-layer structure of the substrate and the resin portion, and the resin transfer mold can be made more stable in strength.
  • the first photocurable resin and the second photocurable resin are cured at different wavelengths.
  • the resin layer is cured, absorption of the curing wavelength by the resin transfer mold can be suppressed.
  • the photocurable resin composition for obtaining the first photocurable resin has a longer wavelength side than the photocurable resin composition for obtaining the second photocurable resin. Easy to cure. In this case, by setting the curing wavelength of the photocurable resin forming the resin layer to the long wavelength side, the conditions for the thickness light transmittance of the resin transfer mold are changed, so that the photocurable resin of the resin layer is changed. Thus, light that is effective for curing can be delivered more efficiently.
  • (A) is a plan view of the wafer lens
  • (B) is a cross-sectional view taken along the line AA of the wafer lens shown in (A)
  • (C) is a perspective view of the wafer lens shown in (A).
  • (A) to (E) are diagrams for explaining the absorbance
  • (F) is a diagram for explaining the light transmittance. It is sectional drawing of the imaging lens cut out by laminating
  • (A) is a perspective view explaining the master type
  • (B) is a perspective view of a submaster type
  • (C) is a subsubmaster type
  • FIG. It is a figure for demonstrating the relationship between a light absorbency and thickness light transmittance.
  • (A) to (F) are diagrams for explaining a manufacturing process of a wafer lens.
  • the wafer lens 100 has a disk shape and includes a substrate 101, a first resin layer 102, and a second resin layer 103.
  • the substrate 101 of the wafer lens 100 is a circular flat plate and is made of glass.
  • the outer diameter of the substrate 101 is substantially the same as the outer diameter of the first and second resin layers 102 and 103.
  • the thickness of the substrate 101 is basically determined by optical specifications, but is such a thickness that the wafer lens 100 is not damaged when the wafer lens 100 is released.
  • the first resin layer 102 is made of resin, and is formed on one surface 101 a of the substrate 101.
  • the first resin layer 102 has a circular outer shape in plan view.
  • a large number of first lens elements 11 each having the first lens body 11a and the first flange portion 11b as a set are two-dimensionally arranged in the XY plane. These first lens elements 11 are integrally formed through a flat connecting portion 11c.
  • the combined surface of each first lens element 11 and connecting portion 11c is a first molding surface 102a that is collectively molded by transfer.
  • the first lens body 11a is, for example, a convex aspherical lens part, and has a first optical surface 11d.
  • the surrounding first flange portion 11b has a flat first flange surface 11g extending around the first optical surface 11d, and the outer periphery of the first flange portion 11b is also a connecting portion 11c.
  • the first flange surface 11g is disposed in parallel to the XY plane perpendicular to the optical axis OA.
  • the first resin layer 102 is formed of a photocurable resin (first photocurable resin).
  • a photopolymerization initiator for initiating polymerization of the photocurable resin composition.
  • Photopolymerization initiator As the photocurable resin, an acrylic resin, an allyl ester resin, an epoxy resin, a vinyl resin, or the like can be used.
  • a radical photopolymerization initiator is included in the resin composition, and the resin composition can be cured by radical polymerization of the photopolymerization initiator.
  • a cationic photopolymerization initiator may be included in the resin composition, and the resin composition may be reacted and cured by cationic polymerization of the photopolymerization initiator.
  • the second resin layer 103 is made of resin, like the first resin layer 102, and is formed on the other surface 101b of the substrate 101.
  • the second resin layer 103 has a circular outer shape in plan view.
  • a large number of second lens elements 12 each including the second lens body 12a and the second flange portion 12b are arranged two-dimensionally in the XY plane. These second lens elements 12 are integrally molded through a flat connecting portion 12c.
  • the combined surface of each second lens element 12 and connecting portion 12c is a second molding surface 103a that is collectively molded by transfer.
  • the second lens body 12a is, for example, a concave aspherical lens part, and has a second optical surface 12d.
  • the surrounding second flange portion 12b has a flat second flange surface 12g extending around the second optical surface 12d, and the outer periphery of the second flange portion 12b is also a connecting portion 12c.
  • the second flange surface 12g is disposed in parallel to the XY plane perpendicular to the optical axis OA.
  • the photocurable resin used for the second resin layer 103 is the same as the photocurable resin of the first resin layer 102. However, both the resin layers 102 and 103 do not need to be formed of the same photocurable resin, and can be formed of different photocurable resins.
  • a diaphragm may be provided between the substrate 101 and the first or second resin layer 102, 103. Further, a resin layer may be provided only on one surface 101a or the other surface 101b of the substrate 101.
  • the photocurable resin is obtained by irradiating and curing a photocurable resin composition containing at least a substrate such as monomers and a photopolymerization initiator.
  • the resin composition before curing may be referred to as a photocurable resin.
  • This photocurable resin can also be used for a submaster type and a subsubmaster type described later.
  • Acrylic resin There is no restriction
  • (meth) acrylate having an alicyclic structure is preferable, and an alicyclic structure containing an oxygen atom or a nitrogen atom may be used.
  • 2-alkyl-2-adamantyl (meth) acrylate see Japanese Patent Laid-Open No. 2002-193883
  • adamantyl di (meth) acrylate Japanese Patent Laid-Open No. 57-5000785
  • diallyl adamantyl dicarboxylate Japanese Patent Laid-Open No.
  • (meth) acrylate for example, methyl acrylate, methyl methacrylate, n-butyl acrylate, n-butyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate Tert-butyl methacrylate, phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate and the like.
  • polyfunctional (meth) acrylate examples include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) ) Acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol septa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripenta Erythritol penta (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripent
  • Allyl ester resin An allyl ester resin is a resin having an allyl group and cured by radical polymerization. Examples thereof include the following, but are not particularly limited to the following.
  • Epoxy resin is not particularly limited as long as it has an epoxy group and is polymerized and cured by light or light and heat, and an acid anhydride, a cation generator or the like is used as a curing initiator. Can do. Epoxy resins are preferred in that they can be made into lenses with excellent molding accuracy because of their low cure shrinkage.
  • Examples of the epoxy resin include novolak phenol type epoxy resin, biphenyl type epoxy resin, and dicyclopentadiene type epoxy resin.
  • Examples include bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, 2,2′-bis (4-glycidyloxycyclohexyl) propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinyl Cyclohexene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2 -A polymer obtained by polymerizing bisglycidyl ester of cyclopropanedicarboxylic acid.
  • the vinyl-based resin is not particularly limited as long as it is a material that forms a transparent resin by being cured, and a vinyl-based resin manufactured by a general manufacturing method can be used.
  • Any vinyl-based resin may be used as long as the vinyl group (CH 2 ⁇ CH—) contributes to the crosslinking reaction.
  • the monomer of the polyvinyl resin is represented by the general formula CH 2 ⁇ CH—R.
  • the polyvinyl resin include polyvinyl chloride, polystyrene and the like, and an aromatic vinyl resin containing an aromatic in R is particularly preferable.
  • a divinyl resin having two or more vinyl groups in one molecule is more preferable.
  • These vinyl resins can be used alone or in combination of two or more by using two or more monomers.
  • photoinitiators details of the photopolymerization initiator is described for use in the photocurable resin composition for forming the first and second resin layers 102 and 103.
  • the photopolymerization initiator is basically selected in combination with a photocurable resin. Furthermore, in selecting the photopolymerization initiator, consideration is given so as not to lower the transmittance of the wafer lens 100 in the use wavelength region, and consideration is given so that the absorbance to the curing light becomes appropriate. More specifically, a photopolymerization initiator that is activated by irradiation with ultraviolet rays (UV) is used. As the photopolymerization initiator, a photopolymerization initiator that is sensitive to the wavelength of UV light irradiated from a light source and generates active species such as radicals by irradiation with UV light having the wavelength is used.
  • UV ultraviolet rays
  • a photopolymerization initiator having sensitivity at least in the wavelength range of 250 nm to 340 nm can be used.
  • radical photopolymerization initiators include ⁇ -hydroxyalkylphenone (manufactured by Ciba Japan, DAROCUR1173, IRGACURE184, etc.).
  • the addition amount of the photopolymerization initiator is 0.001 to 5% by mass, preferably 0.01 to 3% by mass, and more preferably 0.05 to 1% by mass with respect to the photocurable resin.
  • produces a cation is used as a photoinitiator which has the same optical characteristic as the above, for example.
  • the cationic photopolymerization initiator include iodonium-based cationic polymerization initiators (manufactured by Ciba Japan, IRGACURE250, etc.).
  • FIG. 2A is a diagram showing the absorbance of DAROCUR 1173
  • FIG. 2B is a diagram showing the absorbance of IRGACURE184
  • FIG. 2C is a diagram showing the absorbance characteristics of IRUGACURE250.
  • the absorbance of the photopolymerization initiator is measured in a state where it is dissolved in a 0.01% by mass acetonitrile solution.
  • the imaging lens 200 shown in FIG. 3 includes a first compound lens 10 and a second compound lens 20.
  • the first compound lens 10 includes the first lens element 11, the second lens element 12, and the flat plate portion 13 sandwiched between them.
  • the flat plate portion 13 is a portion obtained by cutting out the substrate 101.
  • the shapes of the first and second lens elements 11, 12 may be the same or different.
  • the second compound lens 20 includes a first lens element 21, a second lens element 22, and a flat plate portion 23 sandwiched therebetween.
  • the imaging lens 200 shown in FIG. 3 In order to produce the imaging lens 200 shown in FIG. 3, two wafer lenses 100 are used. The two wafer lenses 100 are fixed with an adhesive or the like in a stacked state. The two stacked wafer lenses 100 are finally cut out by dicing to form the imaging lens 200 shown in FIG.
  • the imaging lens 200 is a member having a rectangular outline when viewed from the optical axis OA direction.
  • the imaging lens 200 is housed in, for example, a separately prepared holder, and is bonded to the imaging circuit board as an imaging lens.
  • Molding Mold An example of a molding mold for manufacturing the wafer lens 100 shown in FIG. 1 (A) will be described below with reference to FIGS. 4 (A) to 4 (C).
  • a master mold 30, a sub master mold 40, and a sub sub master mold 50 are used as molds.
  • the master mold 30 has a first transfer surface 31 for forming a second transfer surface 43 of a sub-master mold 40 to be described later on its end surface 30a.
  • the first transfer surface 31 corresponds to the first molding surface 102a of the first resin layer 102 of the wafer lens 100 finally obtained.
  • the first transfer surface 31 includes a first optical transfer surface 31a for forming the first optical surface 11d of the first molding surface 102a and a first flange transfer surface 31b for forming the first flange surface 11g.
  • a plurality of first optical transfer surfaces 31a are arranged in an array and are formed in a substantially hemispherical concave shape.
  • the master mold 30 is generally formed of a metal material.
  • the metal material include iron-based materials, iron-based alloys, and non-ferrous alloys.
  • iron-based materials include hot dies, cold dies, plastic dies, high-speed tool steel, general structural rolled steel, carbon steel for mechanical structures, chrome / molybdenum steel, and stainless steel.
  • examples of the plastic mold include pre-hardened steel, quenched and tempered steel, and aging treated steel.
  • Examples of the pre-hardened steel include SC, SCM, and SUS.
  • An example of the SC system is PXZ.
  • Examples of the SCM system include HPM2, HPM7, PX5, and IMPAX.
  • Examples of the SUS system include HPM38, HPM77, S-STAR, G-STAR, STAVAX, RAMAX-S, and PSL.
  • Examples of the iron-based alloy include alloys disclosed in JP-A-2005-113161 and JP-A-2005-206913.
  • As the non-ferrous alloys copper alloys, aluminum alloys, and zinc alloys are well known, and examples include alloys disclosed in JP-A-10-219373 and JP-A-2000-176970.
  • the master mold 30 may be made of metal glass or amorphous alloy.
  • Examples of the metallic glass include PdCuSi and PdCuSiNi.
  • Metallic glass has high machinability in diamond cutting and less tool wear.
  • amorphous alloy examples include electroless or electrolytic nickel phosphorous plating, and have good machinability in diamond cutting. These highly machinable materials may constitute the entire master mold 30 or may cover only the surface of the optical transfer surface, in particular, by a method such as plating or sputtering.
  • the sub-master mold 40 has a sub-master molding part 41 that is a resin part and a light-transmissive sub-master substrate 42.
  • the sub master molding part 41 and the sub master substrate 42 have a laminated structure.
  • the sub master molding part 41 has a second transfer surface 43 that forms a third transfer surface 53 of a sub sub master mold 50 to be described later on its end surface 41a.
  • the second transfer surface 43 corresponds to the positive mold of the first molding surface 102a of the first resin layer 102 of the wafer lens 100 finally obtained, and forms the first optical surface 11d of the first molding surface 102a.
  • the second optical transfer surface 43a is transferred by the first optical transfer surface 31a, and a plurality of second optical transfer surfaces 43a are arranged in an array, and are formed in a substantially hemispherical convex shape.
  • the sub master molding part 41 is made of resin. Any resin can be used as the resin, such as a photo-curing resin, a thermosetting resin, and a thermoplastic resin, as long as it can mold the first lens element 11 and the sub-sub master mold 50 described later. However, a photocurable resin (second photocurable resin) is particularly preferable. As the photocurable resin, the same acrylic resin, allyl ester resin, epoxy resin, vinyl resin, or the like as the first resin layer 102 of the wafer lens 100 can be used. Moreover, as said resin, resin with favorable mold release property, especially transparent resin are preferable, and resin which can be released without applying a mold release agent is good.
  • a photocurable resin second photocurable resin
  • the photocurable resin the same acrylic resin, allyl ester resin, epoxy resin, vinyl resin, or the like as the first resin layer 102 of the wafer lens 100 can be used.
  • resin with favorable mold release property, especially transparent resin are preferable, and resin which can be released without applying a mold release agent
  • the sub-master substrate 42 is formed of a smooth material such as quartz, glass, silicon wafer, metal, or resin. In consideration of transparency or light transmission (the point that light can be irradiated from above or from below), the sub master substrate 42 is preferably made of quartz, glass, or the like.
  • the sub-sub master mold 50 includes a sub-sub master molding portion 51 that is a resin portion and a light-transmitting sub-sub master substrate 52.
  • the sub-sub master molding part 51 and the sub-sub master substrate 52 have a laminated structure.
  • the sub-sub master molding unit 51 has a third transfer surface 53 that forms the first molding surface 102a of the wafer lens 100 on the end surface 51a.
  • the third transfer surface 53 corresponds to the first molding surface 102a of the first resin layer 102 of the wafer lens 100, and the third optical transfer surface 53a for forming the first optical surface 11d of the first molding surface 102a.
  • a third flange transfer surface 53b for forming the first flange surface 11g.
  • the sub-submaster mold 50 functions as a resin transfer mold for forming the first molding surface 102 a of the first resin layer 102.
  • the third optical transfer surface 53a is transferred by the second optical transfer surface 43a as described above, and a plurality of the third optical transfer surfaces 53a are arranged in an array, and are formed in a substantially hemispherical concave shape.
  • the sub-sub master molding part 51 is made of resin.
  • the same resin as the first resin layer 102 can be used, and the resin may be formed of the same material as the first resin layer 102 of the wafer lens 100.
  • the sub-submaster substrate 52 is formed of the same material as the sub-master substrate 42. Note that the sub master molding part 41 and the sub sub master molding part 51 are not necessarily formed of the same material. Further, the sub-master substrate 42 and the sub-sub-master substrate 52 are not necessarily formed of the same material, and may be formed of different materials.
  • the thick light transmittance which is the light transmittance of the thickest part, is 60% or more at a wavelength of 340 nm.
  • the thickness light transmittance of the resin transfer mold is represented by a value at 340 nm in order to cure the photocurable resin composition for forming the first resin layer 102 in the vicinity of and around 340 nm.
  • the photopolymerization initiator contained in the photocurable resin composition for forming the first resin layer 102 has a predetermined light transmission at the longest wavelength at which the photopolymerization initiator exhibits a predetermined absorbance or more.
  • a wavelength in the vicinity of rising on the longest wavelength side for example, the absorbance is A resin transfer mold having a thick light transmittance of about 30% at the longest wavelength when 0.3 is used.
  • the thick light transmittance is preferably 30% ⁇ 10%.
  • the absorption maximum of the photopolymerization initiator of the photocurable resin that forms the sub-submaster molding part 51 has a short wavelength (specifically, a wavelength of 250 nm or less). It is preferable to use it. For example, if the reaction wavelength of the photopolymerization initiator of the sub-submaster molding part 51 is shorter than the reaction wavelength of the photopolymerization initiator of the first and second resin layers 102 and 103, the meat of the sub-submaster molding part 51 This is advantageous for increasing the light transmittance.
  • the sub-master molding portion 51 has a desired thickness light transmittance with respect to the absorbance at the wavelength of the irradiation light for curing the photocurable resin of the first resin layer 102. As such, it is adjusted by changing the type of the photopolymerization initiator or changing the thickness of the resin transfer mold. Further, the sub-sub master molding portion 51 may be made thin as long as there is no hindrance to molding or mold release. In the case of the present embodiment, the absorbance of the photocurable resin of the first resin layer 102 at a wavelength of 340 nm of irradiation light is less than 0.25, so that the curing of the photocurable resin of the first resin layer 102 is optimized. In addition, a photopolymerization initiator is used such that the thickness light transmittance of the sub-submaster molding part 51 is 60% in order not to absorb much irradiation light.
  • FIG. 5 shows a photopolymerization initiator (first photocurable resin composition) for forming the first resin layer 102 in the present embodiment and each embodiment to be described later.
  • the resin composition used for the first resin layer 102 and the sub-submaster mold 50 is variously changed to obtain good characteristics for the absorbance of the first photopolymerization initiator) and the thick light transmittance of the sub-submaster mold 50. A combination of the two is selected, and the relationship between the two calculated experimentally based on them is shown.
  • the thickness light transmittance of the sub-submaster mold 50 at a wavelength of 340 nm is T%
  • the photopolymerization initiator contained in the photocurable resin composition for forming the first resin layer 102 is 0.01.
  • FIG. 2 (F) is a diagram showing the light transmittance of the sub-sub master molding part 51.
  • L3 is the photocurable resin of this embodiment.
  • the absorbance at a wavelength of 340 nm is, for example, less than 0.25 in a 0.01% by mass solution of acetonitrile.
  • the master mold 30, the sub master mold 40, and the sub sub master mold 50 used for molding the first resin layer 102 of the wafer lens 100 have been described above. The same applies to the molding of the second resin layer 103.
  • Use a mold In this case, for example, a master die 30 having a concave first transfer surface 31 is used, and a sub master die 40 having a convex second transfer surface 43 is used.
  • the sub master mold 40 corresponds to a resin transfer mold and has the same light transmittance as the sub sub master mold 50 described above.
  • the second molding surface 103 a of the second resin layer 103 is formed by the sub master mold 40.
  • the second resin layer 103 may be formed by the sub-submaster mold 50.
  • the master mold 30 corresponding to the final shape of the first resin layer 102 is produced by grinding or the like.
  • the resin composition 41 b is disposed on the master mold 30, and ultraviolet rays are irradiated from a UV generator (not shown) while pressing the sub-master substrate 42 from above the master mold 30.
  • the resin composition 41b sandwiched therebetween is cured.
  • the first transfer surface 31 of the master mold 30 is transferred to the cured resin and has a second transfer surface 43 (second optical transfer surface 43a and second flange transfer surface 43b shown in FIG. 4B).
  • a sub master molding part 41 is formed.
  • Examples of the light source used in the UV generator include xenon arc lamps, high-pressure mercury lamps, metal halide lamps, UV lasers, xenon flash lamps, LEDs, G-lamps, black lights, and the like that generate light in the ultraviolet region. .
  • xenon flash lamp having a wide emission wavelength region in an ultraviolet region including 365 nm and 340 nm.
  • the sub-master mold 40 is fabricated by releasing the sub-master molding part 41 and the sub-master substrate 42 as a single unit from the master mold 30.
  • the resin composition 51b is arranged on the sub master mold 40, and a UV generator (not shown) is used while pressing the sub sub master substrate 52 from above the sub master mold 40.
  • the resin composition 51b sandwiched therebetween is cured by irradiating with ultraviolet rays.
  • the second transfer surface 43 of the sub-master mold 40 is transferred to the cured resin, and the third transfer surface 53 (the third optical transfer surface 53a and the third flange transfer surface 53b shown in FIG. 4C) is transferred.
  • the sub-sub-master molding part 51 is formed.
  • the exposure apparatus equipped with the UV generator the same exposure apparatus as that used when forming the sub-master mold 40 can be used.
  • the sub-sub master mold part 51 and the sub-sub master substrate 52 are integrally released from the sub-master mold 40, and the sub-sub master mold 50 is completed.
  • a resin composition 102b (a photocurable resin composition for forming the first resin layer 102) is disposed on the sub-submaster mold 50, and a substrate is formed from above the sub-submaster mold 50. While pressing 101, ultraviolet rays are irradiated by a UV generator (not shown) to cure the resin composition 102b sandwiched therebetween. At this time, the third transfer surface 53 of the sub-submaster mold 50 is transferred to the cured resin, and the first molding surface 102a (the first optical surface 11d and the first flange surface 11g shown in FIG. 1B) is provided. One resin layer 102 is formed.
  • the second resin layer 103 may be formed on the other surface 101b of the substrate 101 in the same process as described above.
  • the same exposure apparatus used when forming the sub master mold 40 and the sub sub master mold 50 can be used.
  • the lens elements 11 and 12 of the resin layers 102 and 103 can exhibit the intended optical performance. Therefore, it is preferable to set the exposure conditions appropriately so as not to cause yellowing of the resin and deterioration of durability after molding. Moreover, after exposure or in parallel with exposure, heating may be performed to promote curing.
  • the first resin layer 102 and the substrate 101 are integrally released from the sub-submaster mold 50.
  • the wafer lens 100 is completed.
  • the second resin layer 103 is formed by performing the same process, and the wafer lens 100 is completed by releasing the sub-sub master mold 50.
  • the wafer lens 100 manufactured by the above method is laminated and cut out by dicing so that the outer shape becomes a square shape with the first lens body 11a and the like as the center, thereby forming the compound lens 10 shown in FIG.
  • a diaphragm may be provided between the wafer lenses 100.
  • the aperture of the stop is arranged in alignment with each first lens body 11a and the like.
  • the photopolymerization initiator of the photocurable resin forming the first and second resin layers 102 and 103 has low sensitivity, the first and second molding surfaces 102a,
  • the light transmittance of the photocurable resin in the thickest part of the sub-submaster mold 50, which is a resin transfer mold for transferring 103a, is relatively high, and the photocurable resin for forming the first and second resin layers 102 and 103 is used.
  • the photopolymerization initiator has high sensitivity, the light transmittance of the photocurable resin in the thickest portion of the sub-submaster mold 50 that transfers the first and second molding surfaces 102a and 103a is relatively low, so that the first In addition, an optimal amount of light can be transmitted to cure the photocurable resin of the second resin layers 102 and 103. Thereby, light efficiently reaches the photocurable resins of the first and second resin layers 102 and 103, and the first and second optical surfaces 11d and 12d can be accurately transferred. In addition, since unnecessary light is not irradiated, adverse effects such as yellowing of the resin and environmental tests can be prevented.
  • Example 1 An ultraviolet curable resin composition is arranged on an 8-inch diameter glass substrate, and a spherical recess having a diameter of 3 mm and a depth of 0.5 mm corresponding to the first lens element 11 shown in FIG. 1 is an 8 ⁇ 8 matrix.
  • the procedure of releasing the mold after pressing with a metal master mold arranged in a shape and irradiating ultraviolet rays with a xenon flash lamp through the glass substrate to cure the resin composition is repeated while changing the position on the glass substrate.
  • a submaster mold having transfer portions corresponding to about 1000 first lens elements 11 on a glass substrate was produced.
  • An ultraviolet curable resin composition obtained by adding 0.5% by mass of a photopolymerization initiator to an acrylic resin monomer as a resin composition for a sub-submaster molded part was disposed on the submaster mold thus obtained. Then, the resin composition was pressed with a glass substrate, irradiated with ultraviolet rays with a xenon flash lamp to cure the resin composition, and then released to form a sub-submaster molding part made of resin and having a transfer surface. In this way, a sub-submaster type was produced.
  • the sub-sub master type three types satisfying the following conditions (i) to (iii) were produced for comparison. Conditions (i) to (iii) correspond to L1, L2, and L3 of the photocurable resin shown in FIG. 2 (F), respectively.
  • the thick light transmittance of the sub-submaster molded part was changed mainly by changing the type of photopolymerization initiator added to the resin composition. Specifically, IRGACURE907 was used in (i), IRGACURE2959 was used in (ii), and IRGACURE184 was used in (iii) (both manufactured by Ciba Japan).
  • I At a wavelength of 340 nm, the thickest part has a thick light transmittance of 6%.
  • the thickest part has a thick light transmittance of 40%.
  • the light transmittance of the thickest part is 70% at a wavelength of 340 nm.
  • a resin composition for forming the first resin layer 102 shown in FIG. 1 was disposed on the thus obtained sub-submaster mold.
  • the cationic photoinitiator IRGACURE250 (made by Ciba Japan) was used for hydrogenated bisphenol A type epoxy resin as a photoinitiator.
  • This cationic photopolymerization initiator has an absorbance at a wavelength of 340 nm of about 0.05 when dissolved in an acetonitrile solution so as to be 0.01% by mass.
  • a glass substrate was pressed against the resin composition on the sub-submaster mold, and the resin composition was cured by irradiating ultraviolet rays with a xenon flash lamp so that the integrated exposure amount at 365 nm was 6000 mJ / cm 2 .
  • the second resin layer 103 has substantially the same procedure, and a resin composition similar to L1 to L3 is arranged on an 8-inch diameter glass substrate, and the diameter corresponds to the second lens element 12 shown in FIG. 3mm and 0.5mm deep spherical concave parts are pressed with a metal master mold arranged in an 8x8 matrix, and the resin composition is cured by irradiating ultraviolet rays with a xenon flash lamp through a glass substrate. Then, by repeating the mold release procedure, three types of sub-master molds having transfer portions corresponding to about 1000 lens elements on a glass substrate were produced.
  • a resin composition similar to the resin composition for forming the first resin layer is disposed on each of the submaster molds thus obtained, and the back surface of the glass substrate on which the first resin layer 102 is formed is opposed to the submaster mold.
  • Table 1 shows the performance test results of the wafer lens 100 under the above conditions.
  • the item of optical surface shape indicates the measurement result of the surface shape of the first and second lens elements 11 and 12 of the wafer lens 100.
  • the surface shape was measured using a contact-type ultra-high precision three-dimensional measuring machine.
  • the accuracy of the surface shape was evaluated by the difference (hereinafter referred to as the PV value) between the portion having the largest shape error (Peak) and the portion having the smallest shape (Valley) from the lens design value of the first optical transfer surface 31a.
  • the coloring item indicates the measurement result of the total light transmittance with respect to the incident light amount of the visible light of the first and second lens elements 11 and 12 of the wafer lens 100.
  • the total light transmittance was measured using a spectrophotometer. When the absolute value of the total light transmittance was 88% or more, it was rated as ⁇ , when it was 80% or more and less than 88%, it was marked as ⁇ , and when it was less than 80%, it was marked as x.
  • the item of the environmental test indicates a durability test result of the imaging lens 200 obtained by dicing the wafer lens 100 into pieces.
  • the environmental test was performed by subjecting the imaging lens 200 to reflow treatment three times and then applying a thermal shock. Specifically, after 30 minutes in an environment of ⁇ 40 ° C., 30 minutes in an environment of 85 ° C. was defined as one cycle, and this was performed for 50 cycles.
  • the environmental test was performed on 100 imaging lenses 200. In the imaging lens 200, the number of peeled from the glass / resin interface was 0 when it was 0, ⁇ when it was 1 or more and less than 10, and x when it was 10 or more.
  • the photocurable resin composition for forming the first and second resin layers was uncured.
  • the photocurable resin for forming the first and second resin layers was partially uncured.
  • Example 2 As the resin composition for forming the first resin layer 102, except that 2-alkyl-2-adamantyl- (meth) acrylate was added with a radical photopolymerization initiator IRGACURE184 as a photopolymerization initiator.
  • a wafer lens was produced in the same procedure as in Example 1.
  • the radical photopolymerization initiator used in this example has an absorbance at a wavelength of 340 nm of about 0.05 when dissolved in an acetonitrile solution so as to be 0.01% by mass.
  • the resin composition for forming the sub-sub master mold 50 for forming the first resin layer and the resin composition for forming the sub-master mold for forming the second resin layer are the same as those in Example 1. Same as conditions (i) to (iii). Conditions (i) and (ii) are comparative examples. In this Example 2, the result of the performance test was the same as that of Example 1.
  • the wafer lens manufacturing method according to the second embodiment is a modification of the wafer lens manufacturing method according to the first embodiment, and parts not specifically described are the same as those in the first embodiment.
  • the photopolymerization initiator contained in the photocurable resin composition for forming the first and second resin layers 102 and 103 has an absorbance of 0.25 or more in a 0.01 mass% acetonitrile solution at a wavelength of 340 nm. Use less than 1.0.
  • This photopolymerization initiator is a UV polymerization initiator that has a sensitivity on the short wavelength side, for example, a wavelength of 300 nm to 380 nm and generates radicals at a short wavelength. Specific examples include ⁇ -aminoalkylphenone (manufactured by Ciba Japan, IRGACURE907, etc.).
  • FIG. 2D is a graph showing the absorbance of IRGACURE907.
  • the light absorbency of a photoinitiator is measured in the state melt
  • the thick light transmittance which is the light transmittance of the thickest part, is 7% or more and less than 60% at a wavelength of 340 nm.
  • the absorption maximum of the photopolymerization initiator of the photocurable resin forming the sub-submaster molded part 51 has a short wavelength (specifically, a wavelength of 300 nm or less). Use one. That is, the reaction wavelength of the photopolymerization initiator of the sub-submaster molding part 51 is shorter than the reaction wavelength of the photopolymerization initiator of the first and second resin layers 102 and 103.
  • L2 is the photocurable resin of this embodiment.
  • the absorbance of the photocurable resin of the first resin layer 102 at a wavelength of 340 nm of irradiation light for curing the photocurable resin composition for forming the first resin layer 102 is 0.25.
  • the sub-master molding portion 51 has a thick light transmittance of 7%.
  • An appropriate photopolymerization initiator is selected so as to be less than 60% and the thickness of the sub-submaster molding part 51 is adjusted.
  • the thickness light transmittance of the sub-submaster molding part 51 is the absorbance of the photopolymerization initiator contained in the photocurable resin composition for forming the first resin layer 102.
  • the longest wavelength when the absorbance is 0.3, which is 30% ⁇ 10%.
  • Example 3 As in Example 1, except that a radical polymerization initiator IRGACURE907 (manufactured by Ciba Japan) was used as a photopolymerization initiator used in the resin composition for forming the first resin layer 102 and the second resin layer 103.
  • a wafer lens was prepared according to the procedure described above. This polymerization initiator has an absorbance at a wavelength of 340 nm of about 0.25 when dissolved in an acetonitrile solution so as to be 0.01% by mass.
  • the resin composition for forming the sub-master mold for forming the first resin layer and the resin composition for forming the sub-master mold for forming the second resin layer are the same as those in Example 1. Same as (i) to (iii). Conditions (i) and (iii) are comparative examples.
  • the photocurable resin composition for forming the first and second resin layers was uncured.
  • the resin for forming the sub-submaster is in the condition (iii)
  • the photocurable resin for forming the first and second resin layers is cured, coloring occurs, and the durability in the environmental test is also adversely affected. Occurred.
  • the wafer lens manufacturing method according to the third embodiment is a modification of the wafer lens manufacturing method according to the first embodiment, and parts not specifically described are the same as those in the first embodiment.
  • the photopolymerization initiator contained in the photocurable resin composition for forming the first and second resin layers 102 and 103 has an absorbance of 1.0 or more in a 0.01 mass% acetonitrile solution at a wavelength of 340 nm. Use one.
  • This photopolymerization initiator is a UV polymerization initiator that has a sensitivity on the short wavelength side, for example, a wavelength of 320 nm to 430 nm, and generates radicals at a short wavelength.
  • ⁇ -aminoalkylphenone manufactured by Ciba Japan, IRGACURE 369, etc.
  • FIG. 2 (E) is a graph showing the absorbance of IRGACURE369.
  • the light absorbency of a photoinitiator is measured in the state melt
  • the thick light transmittance which is the light transmittance of the thickest part, is less than 7% at a wavelength of 340 nm.
  • the absorption maximum of the photopolymerization initiator of the photocurable resin forming the sub-submaster molded portion 51 is a short wavelength (specifically, a wavelength of 320 nm or less).
  • the reaction wavelength of the photopolymerization initiator of the sub-submaster molding part 51 is shorter than the reaction wavelength of the photopolymerization initiator of the first and second resin layers 102 and 103.
  • the thick light transmittance can be reduced to less than 7% by making the sub-submaster molding portion 51 relatively thick.
  • L1 is the photocurable resin of the present embodiment.
  • the absorbance of the photocurable resin of the first resin layer 102 at a wavelength of 340 nm of the irradiation light for curing the photocurable resin of the first resin layer 102 is 1.0 or more, and the first
  • the thickness light transmittance of the sub-submaster molding part 51 is the absorbance of the photopolymerization initiator contained in the photocurable resin composition for forming the first resin layer 102.
  • the longest wavelength when the absorbance is 0.3, which is 30% ⁇ 10%.
  • Example 4 Example 1 except that a radical photopolymerization initiator IRGACURE369 (manufactured by Ciba Japan) was used as the photopolymerization initiator used in the resin composition for forming the first resin layer 102 and the second resin layer 103. A wafer lens was produced in the same procedure. This polymerization initiator has an absorbance at a wavelength of 340 nm of about 2.5 when dissolved in an acetonitrile solution so as to be 0.01% by mass.
  • a radical photopolymerization initiator IRGACURE369 manufactured by Ciba Japan
  • the resin composition for forming the sub-master mold for forming the first resin layer and the resin composition for forming the sub-master mold for forming the second resin layer are the same as those in Example 1. Same as (i) to (iii). Conditions (ii) and (iii) are comparative examples.
  • the wafer lens manufacturing method according to the present embodiment has been described above, but the wafer lens manufacturing method according to the present invention is not limited to the above.
  • the shapes and sizes of the first and second optical surfaces 11d and 12d can be changed as appropriate according to the application and function.
  • the wafer lens 100 does not have to be disk-shaped and can have various contours such as an ellipse.
  • the dicing process can be simplified by forming the wafer lens 100 into a square plate shape from the beginning.
  • the number of the first and second lens elements 11 and 12 formed in the wafer lens 100 is not limited to four as illustrated, and may be two or more.
  • the arrangement of the first and second lens elements 11 and 12 is preferably on a lattice point for convenience of dicing.
  • the interval between the adjacent lens elements 11 and 12 is not limited to the illustrated one, and can be set as appropriate in consideration of workability and the like.
  • the resin is disposed on the sub-submaster mold 50 third transfer surface 53, but the resin may be disposed on one surface 101a and the other surface 101b of the substrate 101.
  • a coupling agent may be applied in advance to the one surface 101a and the other surface 101b of the substrate 101. Further, a release agent may be applied in advance to each transfer surface 31, 43, 53 of each mold 30, 40, 50.

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

La présente invention concerne un procédé qui vise à produire une lentille mince et qui permet de former avec précision un bloc lentille à partir d'un moule de transfert de résine, même si une résine photodurcissable est utilisée pour former le bloc lentille ou si le moule de transfert de résine est un sous-sous-moule maître ou analogue. Si le photo-initiateur de la résine photodurcissable de première et seconde couches de résine (102, 103) présente une faible sensibilité, la transmittance de lumière de l'épaisseur du sous-sous-moule maître (50) est relativement élevée et, si le photo-initiateur de la résine photodurcissable des première et seconde couches de résine (102, 103) présente une forte sensibilité, la transmittance de lumière de l'épaisseur du sous-sous-moule maître (50) est relativement inférieure et, par conséquent, la quantité de lumière appropriée est transmise pour durcir la résine photodurcissable des première et seconde couches de résine (102, 103). Il en résulte que des première et seconde surfaces optiques (11d, 12d) sont transférées avec précision. En outre, puisqu'il n'est pas émis plus de lumière que nécessaire, il est possible d'éviter un jaunissement de la résine et un effet néfaste sur la durabilité dans des essais d'environnement et similaires.
PCT/JP2011/075111 2010-11-02 2011-10-31 Procédé de production de lentille mince Ceased WO2012060342A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-246699 2010-11-02
JP2010246699 2010-11-02

Publications (1)

Publication Number Publication Date
WO2012060342A1 true WO2012060342A1 (fr) 2012-05-10

Family

ID=46024456

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/075111 Ceased WO2012060342A1 (fr) 2010-11-02 2011-10-31 Procédé de production de lentille mince

Country Status (1)

Country Link
WO (1) WO2012060342A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01163027A (ja) * 1987-12-21 1989-06-27 Matsushita Electric Ind Co Ltd 光学素子の成形方法およびその装置
JP2001194521A (ja) * 2000-01-12 2001-07-19 Hitachi Ltd カラーフィルタの製造方法、およびこのカラーフィルタを用いた液晶表示装置
JP2010105357A (ja) * 2008-10-31 2010-05-13 Konica Minolta Opto Inc 成形装置、成形型部材、ウエハレンズ及びウエハレンズ用成形型の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01163027A (ja) * 1987-12-21 1989-06-27 Matsushita Electric Ind Co Ltd 光学素子の成形方法およびその装置
JP2001194521A (ja) * 2000-01-12 2001-07-19 Hitachi Ltd カラーフィルタの製造方法、およびこのカラーフィルタを用いた液晶表示装置
JP2010105357A (ja) * 2008-10-31 2010-05-13 Konica Minolta Opto Inc 成形装置、成形型部材、ウエハレンズ及びウエハレンズ用成形型の製造方法

Similar Documents

Publication Publication Date Title
JP2013001091A (ja) 光学素子の製造方法
JP5678958B2 (ja) ウェハレンズの製造方法
KR102119026B1 (ko) 투명 안과 렌즈를 위한 적층 가공
CN104204865B (zh) 透镜阵列、透镜阵列的制造方法及光学元件的制造方法
US9238313B2 (en) Apparatus, mold and method for producing shaped articles from a UV-curable composition
CN118251626A (zh) 眼科镜片和用于形成眼科镜片的方法
JP7549091B2 (ja) 光源ユニット、光学ユニット、及び光源ユニットの製造方法
JP2013125059A (ja) レンズユニット、その製造方法、レンズユニット複合体およびその製造方法
JP5247117B2 (ja) 成形体及びその製造方法
JP2013003542A (ja) 光学素子集合体、光学素子、光学素子集合体の製造方法、及び、光学素子の製造方法
CN101523245B (zh) 成形体及其制造方法
JP2012252113A (ja) ウェハレンズの製造方法
JP2010105357A (ja) 成形装置、成形型部材、ウエハレンズ及びウエハレンズ用成形型の製造方法
WO2012060342A1 (fr) Procédé de production de lentille mince
WO2009122934A1 (fr) Ensemble élément optique et procédé de production d'une unité optique
TWI876373B (zh) 樹脂積層光學體的製造方法
KR20060058123A (ko) 표면 미세 구조를 갖는 메타크릴계 수지 캐스트판 및 그의제조 방법
MX2010012582A (es) Fabricacion de herramientas a microescala.
JP5371194B2 (ja) 成形体およびその製造方法
JP2007030373A (ja) 成形体の製造方法
JP2013003541A (ja) 複合レンズの製造方法
WO2012160769A1 (fr) Procédé de fabrication d'un article moulé en résine
JP3545796B2 (ja) 光学デバイスおよび光学デバイス製造方法
JP2011240651A (ja) ウェハレンズ用成形型及びウェハレンズ用成形型の製造方法
JPWO2009122935A1 (ja) 光学素子の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11837992

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11837992

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP