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WO2012050096A1 - Procédé de réglage du parallélisme et appareil de réglage du parallélisme pour un appareil de montage - Google Patents

Procédé de réglage du parallélisme et appareil de réglage du parallélisme pour un appareil de montage Download PDF

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Publication number
WO2012050096A1
WO2012050096A1 PCT/JP2011/073359 JP2011073359W WO2012050096A1 WO 2012050096 A1 WO2012050096 A1 WO 2012050096A1 JP 2011073359 W JP2011073359 W JP 2011073359W WO 2012050096 A1 WO2012050096 A1 WO 2012050096A1
Authority
WO
WIPO (PCT)
Prior art keywords
bonding tool
parallelism
substrate stage
parallelism adjustment
inclination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2011/073359
Other languages
English (en)
Japanese (ja)
Inventor
井野信行
寺田勝美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to KR1020137006397A priority Critical patent/KR20130129359A/ko
Publication of WO2012050096A1 publication Critical patent/WO2012050096A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H10W72/071—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H10W72/07173—
    • H10W72/07178—
    • H10W72/07183—
    • H10W90/724—

Definitions

  • the present invention relates to a parallelism adjustment method and a parallelism adjustment device between a bonding tool that holds a chip component and a substrate stage that holds the circuit board when the chip component is mounted on a circuit board.
  • a mounting method is known in which a substrate stage is provided on an arcuate rotation bearing, the substrate is sucked and held, and a chip component held by a bonding tool is mounted on the substrate from above the substrate stage (for example, Patent Document 1). FIG. 5).
  • a process of pressing the bonding tool against the substrate stage with a predetermined pressure and copying the rotational bearing is performed in advance. After the copying, the substrate stage keeps its inclination held by air suction or spring force. By following the rotation bearing, the parallelism between the bonding tool and the substrate stage is ensured.
  • the parallelism is adjusted by adjusting the rotating mechanism while measuring it with an instrument that measures displacement, such as a pick gauge. There is a problem that it takes.
  • an object of the present invention is to provide a parallelism adjustment method for a mounting apparatus capable of adjusting the parallelism of a substrate stage and a bonding tool in a short time with high accuracy even when mounting a chip component with a low pressure force.
  • a parallelism adjusting device is provided.
  • the invention according to claim 2 is the invention according to claim 1,
  • the parallelism adjusting unit is a method for adjusting the parallelism of a mounting apparatus, comprising a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
  • the invention according to claim 3 is the invention according to claim 2, A parallelism adjustment method for a mounting apparatus, wherein the parallelism adjustment unit is provided on the substrate stage side.
  • a parallelism adjusting device for a mounting device that mounts a chip component sucked and held on a bonding tool using a bonding tool positioned above the substrate stage on a substrate sucked and held on a substrate stage, A parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive means for driving the parallelism adjusting unit, A height detection means for detecting the height position of the bonding tool; While the bonding tool is pressed against the substrate stage at a predetermined pressure, the inclination of the parallelism adjustment unit is changed by the drive means, and the parallelism adjustment that is the lowest point position of the bonding tool is determined from the information on the height detection means of the bonding tool
  • a parallelism adjusting device for a mounting apparatus comprising: a control means for holding the inclined position of the part.
  • the parallelism adjusting unit is a parallelism adjusting device for a mounting device, which includes a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
  • the invention according to claim 6 is the invention according to claim 5,
  • the parallelism adjusting device is a parallelism adjusting device for a mounting apparatus provided on the substrate stage side.
  • the substrate stage is pressed with the bonding tool.
  • the mounting apparatus of the present invention includes a parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive unit that drives the parallelism adjusting unit. For this reason, since the driving means changes the inclination of the parallelism adjusting unit, the pressing force of the bonding tool may be low. It is not necessary to adjust the parallelism of the bonding tool surface and the substrate stage surface by following the substrate stage with the pressure of the bonding tool. Therefore, the parallelism between the substrate stage and the bonding tool can be adjusted with high accuracy in a short time even when mounting chip components with low pressure.
  • the parallelism adjusting unit is provided on the substrate stage side, the holding mechanism for the spherical bearing is simplified, and the apparatus can be configured with good maintainability.
  • FIG. 2 is a schematic plan view seen from the AA direction of FIG. It is a schematic side view explaining the relationship between a bonding tool and a spherical bearing.
  • FIG. 1 is a schematic side view of a mounting apparatus 1 used in the present invention.
  • the left-right direction toward the mounting apparatus 1 is defined as the X axis
  • the front direction is defined as the Y axis
  • the axis orthogonal to the XY plane constituted by the X axis and the Y axis is defined as the Z axis.
  • the mounting apparatus 1 is roughly divided into a base 2, a substrate stage 3 having a spherical bearing provided on the base 2, a tool lifting / lowering means 4 for lifting and lowering a bonding tool provided on the base 2, and a mounting apparatus. 1 comprises a control unit 5 for controlling the whole.
  • the spherical bearing corresponds to the parallelism adjusting unit of the present invention
  • the control unit 5 corresponds to the control means of the present invention.
  • the substrate stage surface is the XY plane
  • the inclination directions are the X ⁇ and Y ⁇ directions
  • the change in the inclination of the parallelism adjusting unit means the movement in the X ⁇ and Y ⁇ directions.
  • the substrate stage 3 is composed of a frame body 11 fixed to the base 2 and driving means 18 arranged at a position surrounding the frame body 11.
  • a concave hemispherical member 13 is supported by the support portion 12 inside the frame body 11.
  • the upper surface side (upper side in the Z direction) of the frame 11 is open.
  • a convex hemispherical member 14 is provided along the concave surface 13 a of the concave hemispherical member 13.
  • the concave hemispherical member 13 and the convex hemispherical member 14 are in contact with each other via an air bearing 15.
  • a compressed air suction port 16 is provided in the lower part of the concave hemispherical member 13, and a compressed air pump and a suction pump (not shown) are connected thereto.
  • a substrate holding stage 17 for attracting and holding the substrate 6 is provided on the flat surface 14 b of the convex hemispherical member 14.
  • the claw 20 is in contact with the flat surface 14b.
  • the claw 20 is located at the tip of the L-shaped arm 19.
  • the arm 19 is driven in the vertical direction by the driving means 18.
  • the claw 20 can push the convex hemispherical member 14 downward in the Z direction based on the movement amount of the arm 19 of the driving means 18 via the arm 19.
  • the driving unit 18 may be a driving unit using an air cylinder, a driving unit using a ball screw and a servo motor, a driving unit using a piezo element, or the like.
  • the driving unit 18 controls the position of the arm 19 based on a signal from the control unit 5.
  • FIG. 2 shows four sets of pressing composed of a convex hemispherical member 14, a driving means 18, an arm 19, and a claw 20 (shown by a dotted line in FIG. 2) when referred to in the AA direction of FIG. 1.
  • the positional relationship of means is shown.
  • the claw 20 can press the four locations on the outer periphery of the convex hemispherical member 14. Thereby, the flat surface 14b of the convex hemispherical member 14 can be made into arbitrary inclination.
  • the air bearing 15 is configured such that an air bearing 15 using the gas as a lubricant is formed when gas or air is supplied from the compressed air pump through the compressed air suction port 16.
  • the convex hemispherical member 14 is rotatable in any direction with respect to the concave hemispherical member 13.
  • the rotation is used when moving along the convex surface 14a or the concave surface 13a.
  • the axis center at the time of movement is the center of the flat surface 14b of the convex hemispherical member 14.
  • the tool lifting / lowering means 4 includes a Z-axis feed mechanism 30 and an air cylinder 35 attached to the Z-axis feed mechanism 30 via a bracket 34.
  • the Z-axis feed mechanism 30 is a mechanism that moves the bracket 34 up and down in the Z direction by driving the ball screw 33 by the lifting servo motor 32.
  • the bracket 34 moves up and down along the slider 31 provided in the Z-axis feed mechanism 30.
  • An air cylinder 35 is attached to the bracket 34, and the piston 36 can move up and down in the Z direction inside the air cylinder 35.
  • a position detector 37 for detecting the position of the upper surface 36 a of the piston 36 is provided on the upper portion of the air cylinder 35.
  • the position detector 37 corresponds to the height detection means of the present invention.
  • a supply hole 38a for supplying balancing air is provided in the upper part of the air cylinder 35, and a supply hole 38b for supplying holding air is provided in the lower side.
  • Balance air and holding air for controlling the position of the piston 36 are supplied from a pressure air source (not shown), and a predetermined pressure is applied to the piston 36.
  • the chip component 7 is held by suction on the piston rod 36 b of the piston 36.
  • the portion where the chip component 7 is sucked and held at the tip of the piston rod 36b is hereinafter referred to as a bonding tool 39.
  • the suction surface of the chip component 7 of the bonding tool 39 is denoted
  • the tool lifting / lowering means 4 operates the Z-axis feed mechanism 30 until the chip component 7 sucked and held by the bonding tool 39 contacts the substrate 6 sucked and held by the substrate holding stage 17 based on a signal from the control unit 5. . Thereafter, the chip component 7 sucked and held by the bonding tool 39 with a predetermined pressure applied to the piston 36 is pressed against the substrate 6 sucked and held by the substrate holding stage 17.
  • the parallelism adjustment between the chip suction surface 39 a of the bonding tool 39 and the flat surface 14 b of the convex hemispherical member 14 is performed in advance.
  • General parallelism adjustment is performed in the following procedure. First, air is supplied to the air bearing 15 from the compressed air suction port 16 to float the convex hemispherical member 14. Next, the suction surface 39a of the bonding tool 39 presses the flat surface 14b of the convex hemispherical member 14 by maintaining the piston 36 of the air cylinder 35 at a predetermined pressure. Then, the convex hemispherical member 14 moves in the X ⁇ and Y ⁇ directions according to the pressed force.
  • Such a method of adjusting the parallelism is effective when the pressing force of the suction surface 39a of the bonding tool 39 is a pressing force capable of moving the convex hemispherical member 14.
  • the pressing force of the suction surface 39a does not become a sufficient pressing force, so that the convex hemispherical member 14 cannot be moved (followed). Therefore, in the present invention, the parallelism of the flat surface 14 b and the suction surface 39 a of the bonding tool 39 is adjusted using the claw 20 that contacts the flat surface 14 b of the convex hemispherical member 14.
  • the parallelism adjusting method will be described with reference to FIG.
  • FIG. 3 is a schematic side view for explaining the positional relationship between the convex hemispherical member 14 and the bonding tool 39.
  • FIG. 3A shows a state in which a part of the suction surface 39 a of the bonding tool 39 is in contact with the flat surface 14 b of the convex hemispherical member 14. In this state, as shown in FIG. 3A, an angle ⁇ is generated between the suction surface 39a and the flat surface 14b, and the parallelism is not maintained. Further, the convex hemispherical member 14 does not move with the applied pressure applied to the bonding tool 39. At this time, the position of the bonding tool 39 is detected by the position detector 37 and stored in the height position h0 and the control unit 5.
  • the driving means 18 is driven and the claw 20 is pressed downward in the Z direction.
  • the control unit 5 can press and release the flat end portion 14b with respect to the four driving means 18 so that the flat end portion 14b has a predetermined angle (the pressing force is free, and the control unit 5 can move upward in the Z direction). Control).
  • a predetermined pressure is applied to the piston 36 to the bonding tool 39, the position in the Z direction (Z-axis height position) of the bonding tool 39 changes following the change in the angle of the flat surface 14b.
  • FIG. 3B shows a state in which the attitude of the convex hemispherical member 14 is varied around the Y axis using the claw 20 and the suction surface 39a of the bonding tool 39 is in close contact with the flat surface 14b.
  • the position of the piston 36 is the lowest point in the Z direction (the lowest position).
  • the position detected by the position detector 37 is stored in the control unit 5 as h1.
  • FIG. 3C shows a state in which the attitude of the convex hemispherical member 14 is changed around the Y axis by using the claws 20 from the state of FIG. 3B.
  • the height position of the piston 36 in the Z direction is an elevated position as compared with FIG.
  • the position detected by the position detector 37 is stored in the control unit 5 as h2.
  • the position serving as the lowest point in the Z-axis direction is obtained from the height data of the bonding tool 39 stored in the control unit 5 according to the change in the angle of the flat portion 14b.
  • h1 is the lowest point in the Z-axis direction.
  • the position that becomes the lowest point in the Z-axis direction of the bonding tool 39 can be obtained about the X-axis.
  • the position of the upper surface 36a of the piston 36 connected to the bonding tool 39 is measured by the position detector 37 while changing the posture of the convex hemispherical member 14 with the claw 20, so that it is flat with the suction surface 39a.
  • the spherical bearing composed of the concave hemispherical member 13 and the convex hemispherical member 15 is used as the parallelism adjusting unit.
  • the goniostage that can tilt in the X ⁇ and Y ⁇ directions may be configured as a rotary bearing that can be tilted by forming a cross.
  • the parallelism adjustment unit may be configured by a mechanism that varies the inclination of the substrate stage surface by supporting the periphery of the substrate stage with a plurality of support members and varying the stroke of each support member.
  • the parallelism adjustment function may be configured in at least one of them.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne un procédé de réglage du parallélisme et un appareil de réglage du parallélisme pour un appareil de montage, le parallélisme entre un étage de substrat et un outil pour connexion pouvant être réglé avec une haute précision, et en une courte période de temps, même quand on monte un composant de puce avec une faible force de pressurisation. Elle concerne un procédé de réglage du parallélisme et appareil de réglage du parallélisme pour un appareil de montage qui comporte : une unité de réglage du parallélisme servant à modifier l'inclinaison de la face d'un outil pour connexion ou d'un étage de substrat ; un moyen d'entraînement servant à entraîner l'unité de réglage du parallélisme ; un moyen de détection de hauteur servant à détecter la position de hauteur de l'outil pour connexion. Le procédé de réglage du parallélisme comprend : un processus servant à presser l'outil pour connexion sur l'étage de substrat avec une pression prédéfinie ; un processus dans lequel le moyen d'entraînement modifie l'inclinaison de l'unité de réglage du parallélisme ; un processus servant à obtenir la position du point le plus bas de l'outil pour connexion, à partir des informations concernant l'outil pour connexion provenant du moyen de détection de hauteur tandis que l'inclinaison de l'unité de réglage de parallélisme est modifiée ; et un processus servant à maintenir une position d'inclinaison de l'unité de réglage du parallélisme acquise lorsque l'outil pour connexion était à son point le plus bas.
PCT/JP2011/073359 2010-10-13 2011-10-12 Procédé de réglage du parallélisme et appareil de réglage du parallélisme pour un appareil de montage Ceased WO2012050096A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020137006397A KR20130129359A (ko) 2010-10-13 2011-10-12 실장장치의 평행도 조정방법 및 평행도 조정장치

Applications Claiming Priority (2)

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JP2010-230772 2010-10-13
JP2010230772A JP5580163B2 (ja) 2010-10-13 2010-10-13 実装装置の平行度調整方法および平行度調整装置

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KR (1) KR20130129359A (fr)
WO (1) WO2012050096A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013224848A (ja) * 2012-04-20 2013-10-31 Oiles Ind Co Ltd 調心機構、スラスト回転試験機、およびトルク測定装置
KR20170026292A (ko) * 2015-08-31 2017-03-08 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 반도체 요소를 본딩하기 위한 본딩 기계, 본딩 기계의 작동 방법, 및 이러한 본딩 기계의 uph를 개선하기 위한 기술
EP3499551A4 (fr) * 2016-08-12 2019-11-27 Osaka University Dispositif de liaison
CN117302918A (zh) * 2023-11-03 2023-12-29 苏州天准科技股份有限公司 一种多自由度调整机构及物料输送装置

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CH708932B1 (en) * 2013-12-09 2017-04-13 Besi Switzerland Ag Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components.
CN111180349B (zh) * 2019-12-31 2021-12-10 芯思杰技术(深圳)股份有限公司 芯片焊接的控制方法和控制系统
KR102720895B1 (ko) * 2020-05-08 2024-10-22 가부시키가이샤 신가와 반도체 장치의 제조 장치 및 제조 방법
WO2021235269A1 (fr) * 2020-05-19 2021-11-25 株式会社新川 Dispositif de liaison et procédé de réglage de tête de liaison
US20220319891A1 (en) * 2020-05-26 2022-10-06 Shinkawa Ltd. Manufacturing apparatus and manufacturing method of semiconductor device
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법

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WO2009084536A1 (fr) * 2007-12-28 2009-07-09 Nikon Corporation Appareil de liaison de substrats semi-conducteurs et procédé de liaison de substrats semi-conducteurs
WO2009119096A1 (fr) * 2008-03-27 2009-10-01 株式会社ニコン Dispositif de raccordement et procédé de raccordement
JP2010147048A (ja) * 2008-12-16 2010-07-01 Adwelds:Kk 傾き調整方法および傾き調整装置並びにその傾き調整方法において調整されるデバイス

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013224848A (ja) * 2012-04-20 2013-10-31 Oiles Ind Co Ltd 調心機構、スラスト回転試験機、およびトルク測定装置
KR20170026292A (ko) * 2015-08-31 2017-03-08 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 반도체 요소를 본딩하기 위한 본딩 기계, 본딩 기계의 작동 방법, 및 이러한 본딩 기계의 uph를 개선하기 위한 기술
US9929121B2 (en) * 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
US10468373B2 (en) 2015-08-31 2019-11-05 Kulicke and Sofia Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
TWI695449B (zh) * 2015-08-31 2020-06-01 美商庫利克和索夫工業公司 接合半導體元件的接合機、其操作方法和改進其每小時的產量的方法
KR102806111B1 (ko) 2015-08-31 2025-05-12 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 반도체 요소를 본딩하기 위한 본딩 기계, 본딩 기계의 작동 방법, 및 이러한 본딩 기계의 uph를 개선하기 위한 기술
EP3499551A4 (fr) * 2016-08-12 2019-11-27 Osaka University Dispositif de liaison
US11049840B2 (en) 2016-08-12 2021-06-29 Osaka University Bonding device
CN117302918A (zh) * 2023-11-03 2023-12-29 苏州天准科技股份有限公司 一种多自由度调整机构及物料输送装置

Also Published As

Publication number Publication date
JP5580163B2 (ja) 2014-08-27
JP2012084740A (ja) 2012-04-26
KR20130129359A (ko) 2013-11-28

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