[go: up one dir, main page]

WO2011118934A3 - Light emitting diode device and lighting device using the same - Google Patents

Light emitting diode device and lighting device using the same Download PDF

Info

Publication number
WO2011118934A3
WO2011118934A3 PCT/KR2011/001827 KR2011001827W WO2011118934A3 WO 2011118934 A3 WO2011118934 A3 WO 2011118934A3 KR 2011001827 W KR2011001827 W KR 2011001827W WO 2011118934 A3 WO2011118934 A3 WO 2011118934A3
Authority
WO
WIPO (PCT)
Prior art keywords
led
light emitting
emitting diode
same
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2011/001827
Other languages
French (fr)
Other versions
WO2011118934A2 (en
Inventor
Kang Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100025801A external-priority patent/KR101035335B1/en
Priority claimed from KR1020100067013A external-priority patent/KR101233731B1/en
Priority claimed from KR1020100067011A external-priority patent/KR101098509B1/en
Priority claimed from KR1020110016927A external-priority patent/KR101259019B1/en
Application filed by Individual filed Critical Individual
Publication of WO2011118934A2 publication Critical patent/WO2011118934A2/en
Publication of WO2011118934A3 publication Critical patent/WO2011118934A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0066—Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/026—Fastening of transformers or ballasts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/05—Optical design plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/09—Optical design with a combination of different curvatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

A light emitting diode (LED) device and a lighting device using the same are provided. An LED device includes a package body including an LED installed therein, a first electrode connected to an anode of the LED, a second electrode connected to a cathode of the LED, a first wiring connected to the first electrode, a second wiring connected to the second electrode, a bottom heat transfer metal layer formed on the bottom of the package body, and a metal plate bonded to the bottom heat transfer metal layer.
PCT/KR2011/001827 2010-03-23 2011-03-16 Light emitting diode device and lighting device using the same Ceased WO2011118934A2 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
KR10-2010-0025801 2010-03-23
KR1020100025801A KR101035335B1 (en) 2009-03-24 2010-03-23 Light Emitting Diode Package
KR10-2010-0067011 2010-07-12
KR1020100067013A KR101233731B1 (en) 2010-07-12 2010-07-12 Lighting device having light emitting diode
KR1020100067011A KR101098509B1 (en) 2010-07-12 2010-07-12 LED lighting device
KR10-2010-0067013 2010-07-12
KR1020110016927A KR101259019B1 (en) 2011-02-25 2011-02-25 Light emitting diode device and fabricating method thereof
KR10-2011-0016927 2011-02-25

Publications (2)

Publication Number Publication Date
WO2011118934A2 WO2011118934A2 (en) 2011-09-29
WO2011118934A3 true WO2011118934A3 (en) 2012-01-26

Family

ID=44673732

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001827 Ceased WO2011118934A2 (en) 2010-03-23 2011-03-16 Light emitting diode device and lighting device using the same

Country Status (2)

Country Link
TW (1) TW201203636A (en)
WO (1) WO2011118934A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI483434B (en) 2013-02-18 2015-05-01 隆達電子股份有限公司 Transposed substrate of light-emitting diode and method of manufacturing light-emitting device using the same
TW201433864A (en) * 2013-02-27 2014-09-01 緯創資通股份有限公司 Light-emitting diode backlight module
CN103759148A (en) * 2013-12-30 2014-04-30 深圳冠牌光电技术(大冶)有限公司 LED (light emitting diode) light source
TWI575785B (en) 2014-10-30 2017-03-21 新世紀光電股份有限公司 Illuminating device
CN109473423B (en) * 2016-07-17 2020-03-27 乐清市智格电子科技有限公司 Semiconductor lighting device with LED lamp string
JP2020534709A (en) 2017-09-22 2020-11-26 ローレンス リバモア ナショナル セキュリティ リミテッド ライアビリティ カンパニー Photoconductive charge trap device
CN110164857B (en) * 2018-02-14 2024-04-09 晶元光电股份有限公司 Light-emitting device
DE102018211571A1 (en) * 2018-07-12 2020-01-16 Osram Gmbh OPTOELECTRONIC ASSEMBLY AND METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
CN111446353A (en) * 2019-01-16 2020-07-24 株式会社辉元 Ceramic light-emitting diode package and method of making the same
US12166145B2 (en) 2020-08-10 2024-12-10 Lawrence Livermore National Security, Llc Diffuse discharge circuit breaker

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060112836A (en) * 2005-04-28 2006-11-02 (주) 아모센스 Electronic component package
KR20070042710A (en) * 2005-10-19 2007-04-24 엘지이노텍 주식회사 LED package
JP2007180318A (en) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd Light emitting module and manufacturing method thereof
KR20080005904A (en) * 2005-09-01 2008-01-15 이 아이 듀폰 디 네모아 앤드 캄파니 Low temperature cofired ceramic (LTC) tape compositions, light emitting diode (LED) modules, lighting devices and methods of forming them
KR100927114B1 (en) * 2009-05-20 2009-11-18 주식회사 파인테크닉스 LED lamp for halogen lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060112836A (en) * 2005-04-28 2006-11-02 (주) 아모센스 Electronic component package
KR20080005904A (en) * 2005-09-01 2008-01-15 이 아이 듀폰 디 네모아 앤드 캄파니 Low temperature cofired ceramic (LTC) tape compositions, light emitting diode (LED) modules, lighting devices and methods of forming them
KR20070042710A (en) * 2005-10-19 2007-04-24 엘지이노텍 주식회사 LED package
JP2007180318A (en) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd Light emitting module and manufacturing method thereof
KR100927114B1 (en) * 2009-05-20 2009-11-18 주식회사 파인테크닉스 LED lamp for halogen lamp

Also Published As

Publication number Publication date
WO2011118934A2 (en) 2011-09-29
TW201203636A (en) 2012-01-16

Similar Documents

Publication Publication Date Title
WO2011118934A3 (en) Light emitting diode device and lighting device using the same
EP2515353A3 (en) Light emitting diode package and lighting device with the same
TW201130176A (en) Package system
CL2010000706U1 (en) Luminescent device based on a luminescent diode (LED), which includes a base with a stop, a LED module mounted in the base connection section, and at least one control circuit coupled within the base and to an electrical connection with the led module
EP2833407A3 (en) White organic light emitting diode device
EP2413363A3 (en) Display device and organic light emitting diode display device
WO2011116241A3 (en) Light emitting diodes with enhanced thermal sinking and associated methods of operation
EP2848857A3 (en) Lighting device
WO2012061183A3 (en) Flexible led device for thermal management and method of making
WO2014151689A3 (en) Ultra-thin printed led layer removed from substrate
WO2010022101A3 (en) Organic light emitting diode lighting devices
EP2410583A3 (en) Reflective electrode configuration for a light emitting diode
WO2012106110A3 (en) Reflective mounting substrates for flip-chip mounted horizontal leds
WO2009005311A3 (en) Light emitting device and method of fabricating the same
TW200742135A (en) Light emitting diode package
EP2372796A3 (en) Light emitting diode package and light unit having the same
EP2341560A3 (en) Light emitting device and method of manufacturing the same
EP2337099A3 (en) Light emitting device and light unit using the same
EP2357681A3 (en) Light emitting device and light unit
EP2515622A3 (en) Light emitting device array
EP2515035A3 (en) Light emitting diode lamp and assembling method thereof
WO2013083528A3 (en) Semiconductor luminaire
TW201240146A (en) Light-emitting semiconductor chip
TW200739935A (en) Semiconductor light emitting device and method of fabricating the same
FI20125932A7 (en) A method for manufacturing LED lighting devices and LED lighting devices

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11759683

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11759683

Country of ref document: EP

Kind code of ref document: A2