WO2011115094A1 - ノイズ抑制構造 - Google Patents
ノイズ抑制構造 Download PDFInfo
- Publication number
- WO2011115094A1 WO2011115094A1 PCT/JP2011/056012 JP2011056012W WO2011115094A1 WO 2011115094 A1 WO2011115094 A1 WO 2011115094A1 JP 2011056012 W JP2011056012 W JP 2011056012W WO 2011115094 A1 WO2011115094 A1 WO 2011115094A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- current control
- noise suppression
- metal surface
- suppression structure
- ground layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/19—Arrangements of transmitters, receivers, or complete sets to prevent eavesdropping, to attenuate local noise or to prevent undesired transmission; Mouthpieces or receivers specially adapted therefor
Definitions
- the present invention is applied to electronic / electrical devices including wireless devices such as mobile phones, wireless-equipped personal computers, and portable information terminals, and in order to ensure better communication quality, the digital circuit portion and the wireless circuit portion It is related with the noise suppression structure which reduces the influence of the electromagnetic interference which arises between.
- Wireless devices such as mobile phones and wireless personal computers have become widespread because of their convenience. Recently, wireless devices are becoming thinner and smaller. Furthermore, mounting on a plurality of wireless systems in wireless devices is also progressing.
- FIG. 19 to 21 show a basic configuration of a general portable terminal in the conventional wireless device 30.
- FIG. FIG. 19 is a perspective view showing the entire portable terminal.
- FIG. 20 is a perspective view showing only the noise suppression structure 40.
- FIG. 21 is a side view of the noise suppression structure 40 shown in FIG.
- the antenna unit 21, the wireless circuit unit 22, and the digital circuit unit 23 are mounted on the printed circuit board 24.
- the antenna unit 21 transmits and receives radio waves in order to communicate with a base station or the like.
- the radio circuit unit 22 processes a signal transmitted from the antenna unit 21 or a signal received by the antenna unit 21.
- the digital circuit unit 23 processes a digital signal for data processing.
- a ground layer 43 is disposed on the inner layer of the printed circuit board 24.
- the ground layer 43 serves as a common ground for the digital circuit unit 23 and the wireless circuit unit 22.
- a noise control configuration 40 described later is mounted on the printed circuit board.
- the noise control configuration 40 suppresses electromagnetic interference that occurs between the digital circuit unit 23 and the radio circuit unit 22.
- a signal layer and a power supply layer are formed on the inner layer of the printed circuit board 24, but the illustration is omitted here. In the signal layer and the power supply layer, patterns for transmitting signals according to their respective purposes such as digital signals and analog signals are formed.
- the wireless circuit unit 22 and the digital circuit unit 23 are mixed on the same substrate.
- the wireless utilization device 30 has the wireless circuit portion 22 and the digital circuit portion 23 mounted at high density. For this reason, in such a board, electromagnetic noise generated from the digital circuit unit 23 is mixed into the antenna unit 21 and the radio circuit unit 22 to generate electromagnetic interference, which affects the reception characteristics of the antenna.
- the digital circuit unit 23 handles a clock signal having a fundamental wave of around several tens of MHz and several hundreds of MHz, a data bus signal, and the like.
- noises in the high frequency band of the signal if noise that matches the reception band of the antenna (800 MHz band, 2 GHz band, etc.) is mixed in the radio circuit unit 22 or the antenna unit 21, the radio characteristics such as the antenna reception sensitivity deteriorate. To do.
- the current from the antenna unit 21 is mixed into the digital circuit unit 23, mixing (mixing) of a transmission wave and a digital signal may occur, resulting in noise.
- the current generated from the digital circuit unit 23, the wireless circuit unit 22, or the antenna unit 21 may behave like noise. This current is mixed from one circuit portion to the other circuit portion through the common ground layer 43. That is, mixing of noise current from the digital circuit unit 23 to the radio circuit unit 22 (or the antenna unit 21) and mixing of current from the radio circuit unit 22 (or the antenna unit 21) to the digital circuit unit 23 occurred.
- Electromagnetic interference due to noise mixing generated between the digital circuit unit 23 and the radio circuit unit 22 as described above tends to become more prominent due to downsizing and thinning and mounting of a plurality of radio systems.
- the frequency band tends to expand due to the mounting of a plurality of wireless systems in the wireless device 30, it has been desired to increase the frequency band (including multiple frequencies) to suppress electromagnetic interference.
- Patent Document 1 Japanese Patent Laid-Open No. 2002-314491 proposes a noise control configuration that focuses on a current flowing on a metal surface.
- a current control mechanism portion that suppresses electromagnetic coupling is mounted between both circuit portions in the printed circuit board.
- a metal surface is arranged in parallel to the upper layer and the lower layer so as to sandwich the ground layer.
- a row of via holes is formed in a straight line at a desired interval from the positions of both sides of the metal surface and the end of the metal surface in the direction connecting the radio circuit portion and the digital circuit portion.
- the noise suppression structure is arrange
- the configuration and principle of the noise suppression structure of the upper layer and the lower layer are the same, only the case where the noise suppression structure is provided in the upper layer will be described.
- the noise suppression structure 40 includes a metal surface 41 formed in parallel to the ground layer 43 and a metal surface to suppress a current flowing through the ground layer of the substrate. And a short-circuit surface 42 formed at the end of 41.
- the resonator is configured such that the length of the metal surface 41 is set to ⁇ / 4, which is 1 ⁇ 4 of the wavelength ⁇ of the desired frequency f. For this reason, the open end at the right end behaves electrically as an open end, and the input impedance has a high value.
- the metal surface is configured to wrap the current flowing through the substrate ground layer, the termination side is a short-circuited surface, and the length of the metal surface serving as a transmission path is ⁇ / 4. It has a resonator configuration set to ( ⁇ : wavelength). With this configuration, the input impedance on the opening end side is set to a high value. Further, in such a configuration, the current from the line connected to the opening end side is less likely to flow toward the line connected to the termination side. That is, mixing of electromagnetic noise from one to the other is suppressed.
- the metal surface serving as the transmission path has a single length, so the frequency corresponding to ⁇ / 4 is single.
- the noise suppression structure 40 described above is effective for a single target frequency, but is not sufficiently compatible with a wide band or multiple frequencies. Improvement of the suppression structure has been desired.
- An example of an object of the present invention is to provide a noise suppression structure that can reduce the influence of electromagnetic interference generated between a digital circuit unit and a radio circuit unit, and can sufficiently cope with a wide band or multiple frequencies. It is.
- the noise suppression structure of the present invention has a current control unit that is provided on the ground layer and controls the current.
- the current control unit includes a metal surface provided on the ground layer at an interval, and a short-circuit plate disposed at one end of the metal surface to connect the metal surface and the ground layer. A part of the metal surface is provided with a notch.
- a notch is provided in a part of the metal surface of the current control unit.
- a transmission line corresponding to at least two frequencies can be formed on one metal surface.
- a suppression effect can be obtained in at least two frequency bands against a noise current that is generated from the digital circuit section that is one circuit section and that travels on the substrate and enters the wireless circuit section that is the other circuit section. Therefore, it is possible to effectively increase the noise suppression frequency.
- the notch part formed in the metal surface may be arranged on the outer side (both sides of the substrate) of the low-frequency side transmission line that tends to increase the noise level.
- FIG. 1 It is a perspective view which shows the noise suppression structure by Embodiment 1 of this invention. It is a disassembled perspective view of the noise suppression structure shown in FIG. It is a sectional side view along the length direction of the noise suppression structure shown in FIG. It is a top view of the metal surface of the noise suppression structure of FIG. It is a side view which shows the positional relationship with respect to the digital circuit part and radio
- FIG. It is a top view of the metal surface of the noise suppression structure shown in FIG. It is a top view which shows the noise suppression structure by the modification 2 of Embodiment 1 of this invention. It is a top view which shows the noise suppression structure by the modification 3 of Embodiment 1 of this invention. It is a top view which shows the other aspect of the noise suppression structure shown in FIG. It is a top view which shows the noise suppression structure by the modification 4 of Embodiment 1 of this invention. It is a top view which shows the other aspect of the noise suppression structure shown in FIG. It is a top view which shows the noise suppression structure by the modification 5 of Embodiment 1 of this invention. It is a perspective view which shows the noise suppression structure by Embodiment 2 of this invention.
- FIG. 17 is a side cross-sectional view along the length direction of the noise suppression structure shown in FIG. 16. It is a perspective view which shows the prior art example of a noise suppression structure. It is a perspective view of the noise suppression structure shown in FIG. FIG. 20 is a side sectional view taken along the length direction of the noise suppression structure shown in FIG. 19.
- FIG. 1 is a perspective view showing a noise suppression structure 1 according to Embodiment 1 of the present invention.
- FIG. 2 is an exploded view of the noise suppression structure 1 shown in FIG.
- FIG. 3 is a side view showing the noise suppression structure 1 of FIG.
- FIG. 4 is a plan view for explaining dimensions of the current control units 1A and 1B.
- FIG. 5 is a side view showing an example in which the noise suppression structure 1 is arranged in a substrate 10 of a wireless device.
- the noise suppression structure 1 is disposed between the digital circuit unit 23 and the radio circuit unit 22 as shown in FIG.
- the noise suppression structure 1 arranged in this way cuts off the electromagnetic coupling between the radio circuit unit 22 and the digital circuit unit 23, and in particular prevents noise from entering the radio circuit unit 22 and the antenna from the digital circuit unit 23.
- the current control units 1 ⁇ / b> A and 1 ⁇ / b> B are made of a metal having the same size as the width direction of the substrate 10.
- the noise suppression structure 1 includes a first current control unit 1A disposed on the upper layer side of the ground layer 11 and a second current control unit 1B disposed on the lower layer side with the ground layer 11 interposed therebetween. .
- These current control units 1 ⁇ / b> A and 1 ⁇ / b> B are arranged so as to be symmetric with respect to the ground layer 11.
- Each of these current control units 1A and 1B is provided with a notch 50 serving as a step at a part of the ends of the metal surfaces (metal plates) 2A and 2B (details will be described later).
- the noise suppression frequency is increased, and mixing of currents generated in the circuit units 22 and 23 on each side is suppressed.
- the noise suppression structure 1 uses a multilayer printed board composed of a plurality of layers.
- a dielectric material such as a glass epoxy material is embedded between the layers of the substrate, but the illustration is omitted.
- the noise suppression structure 1 includes first and second current control units 1A and 1B.
- the first current control unit 1 ⁇ / b> A includes a metal surface 2 ⁇ / b> A and a short-circuit plate 3 ⁇ / b> A and is connected to the ground layer 11.
- the second current control unit 1 ⁇ / b> B includes a metal surface 2 ⁇ / b> B and a short-circuit plate 3 ⁇ / b> B and is connected to the ground layer 11.
- the first metal surface 2A, the first short-circuit plate 3A, the ground layer 11, the second short-circuit plate 3B, and the second metal surface 2B are arranged in this order from the upper layer.
- a rectangular notch 50 is formed at a part of the end (second end) of the metal surface 2A, 2B facing the digital circuit portion 23 on the side Ds. Due to this shape, the lengths of the metal surfaces 2A and 2B when viewed from the digital circuit portion 23 side Ds are partially different. This is because the noise suppression frequency is set to multiple frequencies as will be described later.
- the notch 50 is formed in a concave shape near the center of the metal surface.
- the length of the metal surface when viewed from the digital circuit portion 23 side Ds is short in the central region (indicated by symbol S) as shown in FIG. 4 and in the region corresponding to both sides of the substrate 10 on the outside. Long (indicated by the symbol L).
- the short-circuit plates 3A and 3B are actually composed of a plurality of via holes arranged in a line in the region.
- the interval between adjacent via holes is set to a sufficiently small pitch with respect to the wavelength, it may be regarded as an electrically short-circuited state.
- such a row of a plurality of via holes arranged at a narrow pitch is called a “short-circuit plate”.
- the via hole used here has a configuration in which a conductive layer is formed around the air hole. The via hole penetrating the metal pattern is electrically connected to the metal pattern.
- the metal surface 2A configuring the first current control unit 1A and the metal surface 2B configuring the second current control unit 1B are configured by a metal pattern.
- the size of the metal surfaces 2A and 2B in the width direction is the same as the size of the substrate 10 in the width direction.
- a metal surface 2 ⁇ / b> A is formed on the ground layer 11.
- a metal surface 2 ⁇ / b> B is formed under the ground layer 11.
- the ground layer 11 is sandwiched between the metal surface 2A and the metal surface 2B.
- the short-circuit plates 3A and 3B are provided at the ends of the metal surfaces 2A and 2B opposite to the side where the notch 50 is present.
- the short-circuit plates 3A and 3B are connected to the metal surfaces 2A and 2B and the ground layer 11.
- 1 A of 1st electric current control parts comprise a pair of transmission line by 2 A of metal surfaces, and the ground layer 11.
- This short-circuit end is composed of a short-circuit plate 3A.
- An opening end 4A is formed at the other end (second end) of the metal surface 2A.
- the opening end 4 ⁇ / b> A is formed by an opening between the metal surface 2 ⁇ / b> A and the ground layer 11.
- the second current control unit 1B also forms a transmission line by the metal surface 2B and the ground layer 11.
- An opening end 4B is formed at one end of the metal surface 2B, and a short-circuit surface by the short-circuit plate 3B is formed at the other end.
- the current control units 1A and 1B have the open ends 4A and 4B facing the side Ds of the digital circuit unit 23 and the short-circuit plates 3A and 3B facing the sides As and Ws of the antenna unit 21 or the radio circuit unit 22, respectively.
- the short-circuit plates 3A and 3B of the first and second current control units 1A and 1B are formed by via holes with a narrow pitch as described above, but each via hole is a via hole that penetrates the metal surfaces 2A and 2B simultaneously. May be.
- the substrate 10 and the like are included in the case, but the illustration of the case is omitted here.
- a liquid crystal display, operation buttons, an operation keyboard, and the like are mounted on the device, but the illustration is omitted.
- the length along the longitudinal direction of the metal surfaces 2A and 2B is denoted as “L”.
- the length along the longitudinal direction of the metal surfaces 2A and 2B excluding the notch 50 located near the center is denoted as “S”.
- L ⁇ 1/4
- S is set to ⁇ 2/4 (wavelength lambda 1, lambda 2, respectively, a wavelength of a frequency f 1, f 2).
- a position that is a quarter wavelength away is an open end, and the input impedance at that position has a high value (ideally infinite).
- the noise current flows through the ground layer 11 of the substrate 10.
- current control units 1A and 1B in which the terminal side is short-circuited are provided.
- the length of the metal surface corresponding to the transmission line is set to a quarter wavelength. For this reason, the impedance at the opening ends 4A and 4B is a high value.
- the noise suppression structure 1 of the current control units 1A and 1B forms a transmission path that resonates at two frequencies in one metal surface 2A and 2B. With this configuration, the noise suppression frequency is increased. That is, the notch 50 is provided near the center of the metal surfaces 2A and 2B.
- the transmission path corresponding to the length L of the original metal surfaces 2A and 2B is formed on the outside (both sides of the substrate), and the transmission path corresponding to the length S shortened by the notch 50 is provided. It is formed near the center.
- this structure acts effectively with respect to two frequency components. For this reason, by using this configuration, it is possible to obtain a broadband suppression effect by increasing the frequency for the current flowing through the ground layer 11 of the substrate 10.
- the transmission line having the longer length L is formed outside the metal surfaces 2A and 2B.
- the reason will be described below.
- most of the frequencies used in wireless devices are in the range of several MHz to several GHz, and cellular phones and the like use high frequency bands such as the 800 MHz band and the 2 GHz band.
- a standing wave is generated on the ground layer 11 of the substrate 10 and current tends to flow through the edge portions on both sides.
- the noise level tends to be higher on the low frequency side such as 800 MHz than on the high frequency side such as 2 GHz.
- FIG. 5 shows the action of the open ends 4A and 4B on the noise current when the above-described current control units 1A and 1B are configured in the board 10 of the wireless device.
- the ground layer 11 of the digital circuit unit 23 and the wireless circuit unit 22 is shared through the signal pattern 8.
- the open ends 4A and 4B directed toward the digital circuit portion 23 side Ds are mixed from the side Ds of the digital circuit portion 23 to the side Ws of the wireless circuit portion 22 via the ground layer 11.
- the impedance becomes high with respect to the noise current Id. Due to this influence, the noise current Id becomes difficult to flow. As a result, mixing of the noise current Id generated from the digital circuit unit 23 into the radio circuit unit 22 or the antenna 21 is suppressed.
- the notches 50 are provided in the metal surfaces 2A and 2B of the current control units 1A and 1B.
- transmission lines corresponding to at least two frequencies can be formed on one metal surface 2A, 2B.
- the noise current generated from the digital circuit unit 23 which is one circuit unit and transmitted to the radio circuit unit 22 which is the other circuit unit through the substrate is suppressed in at least two frequency bands. Is obtained. Therefore, according to the noise suppression structure 1 according to the present embodiment, it is possible to effectively increase the noise suppression frequency.
- the opening ends 4A and 4B of the current control units 1A and 1B are directed to the digital circuit unit 23 side Ds.
- the present invention is not limited to this.
- the open ends 4A and 4B may be arranged toward the radio circuit unit 22 side Ws. Thereby, it is possible to effectively suppress the noise current generated from the radio circuit unit 22 and transmitted on the substrate and mixed into the digital circuit unit 23 which is the other circuit unit.
- FIG. 6 to 9 show a noise suppression structure 1 according to Modification 1 of Embodiment 1 according to the present invention.
- FIG. 6 is a perspective view showing the entire noise suppression structure 1 according to the first modification of the first embodiment.
- FIG. 7 is an exploded view of the noise suppression structure 1 shown in FIG.
- FIG. 8 is a side view of the noise suppression structure 1 shown in FIG.
- FIG. 9 is a plan view for explaining the dimensions of the current control units 1A and 1B.
- Current control units 1A and 1B shown in the first modification are different from the above-described first embodiment in the position of the notch 51 provided in the metal surfaces 2A and 2B.
- the current control units 1A and 1B shown in the first modification have the above-described configuration (Embodiment 1), such as the layer configuration in the substrate 10 and the notch provided in part of the end portions of the metal surfaces 2A and 2B.
- the configuration is the same as above.
- FIG. 9 shows the metal surfaces 2A and 2B constituting the current control units 1A and 1B.
- the metal surfaces 2A and 2B are provided with a notch 51 as in the first embodiment.
- the short-circuit plates 3 ⁇ / b> A and 3 ⁇ / b> B are formed along the rectangular cutout portion 51.
- the transmission path length is set to a quarter wavelength. Therefore, high impedance is obtained in the two frequency bands on the open ends 4A and 4B side. As a result, the broadband current suppression effect by multi-frequency can be exhibited with respect to the noise current mixed from the open ends 4A and 4B.
- Such a configuration is suitable for mounting a component that is not affected by noise at the location of the notch 51, such as when a component is mounted immediately behind the short-circuit plate.
- FIG. 10 shows the metal surfaces 2A and 2B of the current controllers 1A and 1B according to the second modification of the first embodiment of the present invention.
- the two notches 52 and 53 are combined to realize further multi-frequency.
- rectangular notches 52 and 53 having different widths and lengths are overlapped. That is, a narrow notch 53 is provided in the wide notch 52.
- the line length when viewed from the open ends 4A and 4B can be set to three paths (L>S> T).
- the notches 52 and 53 of the second modification may be provided on the short-circuit plates 3A and 3B side and the open ends 4A and 4B side of the metal surfaces 2A and 2B. The same applies to the following modifications and embodiments.
- FIG. 11 shows the metal surfaces 2A and 2B of the current control units 1A and 1B according to the third modification of the first embodiment of the present invention. Characterized by the shape of the metal surfaces 2A and 2B.
- the notch part 54 which inclined was provided in the center part of the edge part of metal surface 2A, 2B.
- the notch 54 is formed in a V shape.
- the notches 50 to 53 have a rectangular shape, so the resonance length has two stages of length L and S.
- the cutout portion 54 is cut obliquely.
- the resonance length continuously changes between the lengths L and S, and the frequency at which the length from the short-circuit plate becomes a quarter wavelength becomes continuous. That is, the impedance in the case of variant 1 the length L and the second frequency f 1 and f 2 corresponding to the length of the S only a high impedance at the open end 4A, 4B.
- the length continuously changes in this configuration a high impedance can be obtained in the range of frequencies f 1 to f 2 accordingly. For this reason, this structure can fully exhibit an effect for the broadening of the noise suppression frequency.
- a notch 55 that is inclined obliquely so as to continuously change the length of the metal surfaces 2A and 2B may be formed at the end of the metal surfaces 2A and 2B. In this case, it is possible to widen noise suppression within a frequency range (f 1 to f 2 ) corresponding to the length L to S.
- FIG. 13 shows metal surfaces 2A and 2B of current control units 1A and 1B according to the fourth modification of the first embodiment of the present invention. It has a feature in the shape of the notch 56 of the metal surfaces 2A and 2B. In this modification, notches 56 are provided on both sides of the metal surfaces 2A and 2B. For this reason, in the present modification, contrary to the case of the first embodiment and the modifications 1 to 3, the transmission path having the shorter length S is provided on both sides of the metal surfaces 2A and 2B as shown in FIG. Forming. In this case, the effect is sufficiently exerted when a high-frequency noise current such as 2 GHz flows remarkably on both sides of the substrate 10.
- a high-frequency noise current such as 2 GHz flows remarkably on both sides of the substrate 10.
- the present invention is not limited to forming the two notches 56 on both sides of the metal surfaces 2 ⁇ / b> A and 2 ⁇ / b> B.
- the notch 56 may be formed close to the end of the metal surfaces 2 ⁇ / b> A and 2 ⁇ / b> B instead of the center.
- the metal surfaces 2A and 2B have a length L on one side and a length S on the other side.
- the impedances of the opening ends 4A and 4B are increased at the frequencies (f 1 and f 2 ) corresponding to the resonance lengths L and S, and noise suppression can be performed at multiple frequencies.
- the notches 56 are provided on both sides of the metal surfaces 2A and 2B.
- transmission lines corresponding to two frequencies are formed on one metal surface 2A, 2B.
- a low-frequency transmission line that tends to increase the noise level is arranged outside (both sides of the board). For this reason, it is possible to obtain a suppression effect in two frequency bands with respect to the noise current generated from the digital circuit unit 23 and transmitted on the substrate 10 and mixed into the radio circuit unit 22, and the noise suppression frequency is effectively increased in frequency.
- FIG. 15 shows the metal surfaces 2A and 2B of the current control units 1A and 1B according to the fifth modification of the first embodiment of the present invention.
- notch portions 57 are provided on both sides of the metal surfaces 2A and 2B as well as the central portions of the metal surfaces 1A and 2B facing the radio circuit unit 22 or the digital circuit unit 23.
- the notches 57 provided on both side portions of the metal surfaces 2A and 2B may bypass the length by the notches 57, and the original length (L) may be set slightly longer.
- FIG. 16 to 18 show the noise suppression structure 1 according to Embodiment 2 of the present invention.
- the current control units 1A and 1B constituting the noise suppression structure 1 suppress noise in the substrate 10 constituting the wireless utilization device.
- FIG. 16 is a perspective view showing the entire noise suppression structure 1 according to Embodiment 2 of the present invention.
- FIG. 17 is an exploded view of the noise suppression structure 1 shown in FIG.
- FIG. 18 is a side view of the noise suppression structure 1 shown in FIG.
- the opening ends 4A and 4B of the current control units 1A and 1B are directed to either the digital circuit unit 23 or the radio circuit unit 22.
- the open ends 4A, 4A ′, 4B and 4B ′ of the current control units 1A and 1B are connected to the digital circuit unit 23 and the wireless circuit in order to suppress the current mixed from both circuit units.
- the circuit portion 22 is directed to both.
- a configuration for suppressing current is doubled in the layer direction of the substrate 10.
- the opening ends 4A and 4B are directed to the digital circuit unit 23 side and the wireless circuit unit 22 side, and mixing of currents generated in both the digital circuit unit 23 and the wireless circuit unit 22 is suppressed.
- the current control units 1 ⁇ / b> A and 1 ⁇ / b> B are disposed between the digital circuit unit 23 and the wireless circuit unit 22. As a result, the electromagnetic coupling between the digital circuit unit 23 and the radio circuit unit 22 is cut off, and mixing of currents behaving like noise flowing between the digital circuit unit 23 and the radio circuit unit 22 is prevented.
- the noise suppression structure 1 sandwiches the ground layer 11 as in the first embodiment in order to effectively control the current flowing through the ground layer 11 of the substrate 10.
- the first current control unit 1A disposed on the upper layer side of the ground layer 11 and the second current control unit 1B disposed on the lower layer side are configured as described above.
- the configurations and dimensions of the current control units 1A and 1B are exactly the same.
- the current control units 1 ⁇ / b> A and 1 ⁇ / b> B are arranged vertically symmetrically with respect to the ground layer 11.
- the first current control unit 1A includes two metal surfaces 2A and 2A ′ and short-circuit plates 3A and 3A ′. From the ground layer 11, the first short-circuit plate 3A, the first metal surface 2A, the second short-circuit plate 3A ', and the second metal surface 2A' are arranged in this order, and they are continuously connected.
- the size of the metal surfaces 2A and 2A ′ constituting the first current control unit 1A is the same as the size of the substrate 10 in the width direction.
- a first-layer metal surface 2A and a second-layer metal surface 2A ′, counting from the ground layer 11 side, are arranged at an interval in the vertical direction.
- a rectangular notch 58 is provided at a part of the ends of the metal surfaces 2A and 2A ′.
- the notch 58 is located on the digital circuit 23 side Ds. Similar to the first embodiment, the notch 58 causes the length of the metal surface 2 ⁇ / b> A to change when the side Ws of the radio circuit unit 22 is viewed from the side Ds of the digital circuit unit 23.
- the length of the metal surface 2A ′ changes when the side Ds of the digital circuit unit 23 is viewed from the side Ws of the radio circuit unit 22.
- the notch 58 is provided near the center of the metal surfaces 2A and 2A ′. For this reason, the length of the metal surface is short in the central region and long in the regions corresponding to both sides of the substrate 10 located on the outside.
- the short-circuit plate 3A located between the ground layer 11 and the first-layer metal surface 2A is located on the radio circuit unit 22 side.
- the short-circuit plate 3A ′ positioned between the first-layer metal surface 2A and the second-layer metal surface 2A ′ is positioned on the digital circuit portion 23 side.
- the notch portion 58 is formed in the metal surfaces 2A, 2A ′ and the short-circuit plate 3A ′ on the digital circuit portion 23 side.
- the metal surface 2A forms a transmission line between the metal layer 2A and the ground layer 11.
- One end is an open end 4A, and the other is a short-circuited end (short-circuited surface) by the short-circuit plate 3A.
- the short circuit plate 3A ′ on the digital circuit portion 23 side is disposed along the end portions of the metal surfaces 2A and 2A ′ on the cutout portion 58 side. Since the short-circuit plate 3A ′ is connected to the metal surface 2A ′, the two metal surfaces 2A and 2A ′ constitute a pair of transmission lines, and the open end 4A ′ faces the radio circuit section 22 side.
- the short circuit board 3B located between the ground layer 11 and the metal surface 2B of the 1st layer is located in the radio
- the short-circuit plate 3B ′ positioned between the first-layer metal surface 2B and the second-layer metal surface 2B ′ is positioned on the digital circuit portion 23 side Ds.
- the notch 58 is formed in the metal surfaces 2B, 2B ′ and the short-circuit plate 3B ′ on the digital circuit 23 side Ds.
- the metal surface 2B constitutes a transmission line between the ground layer 11 and an open end 4B is formed at one end, and a short-circuit end (short-circuit surface) by the short-circuit plate 3B is formed at the other end.
- the short circuit plate 3B ′ on the digital circuit portion 23 side Ds is disposed along the end portions of the metal surfaces 2B and 2B ′ on the cutout portion 58 side.
- the short-circuit plate 3B ′ is connected to the metal surface 2B ′. For this reason, two layers of metal surfaces 2B and 2B ′ constitute a pair of transmission lines, and the open end 4B ′ faces the radio circuit portion 22 side.
- the dimensions of the metal surfaces 2A, 2A ′, 2B, 2B ′ when the notch portion 58 is formed in the second embodiment are the same as those in FIGS. 4 and 9 described above.
- the shapes and dimensions of the first-layer metal surfaces 2A and 2B constituting the current control units 1A and 1B are the same as those of the metal surfaces 2A and 2B of the first embodiment shown in FIG. Further, the shapes and dimensions of the second-layer metal surfaces 2A ′ and 2B ′ constituting the current control units 1A and 1B are the same as those of the metal surfaces 2A and 2B of the first embodiment shown in FIG. However, in the metal surfaces 2A, 2A ', 2B, 2B', the first metal surfaces 2A, 2B and the second metal surfaces 2A ', 2B' are short-circuit plates 3A, 3A ', 3B.
- the edge part which connects 3B ' is different.
- the lengths of these metal surfaces 2A ⁇ 2A ′, 2B ⁇ 2B ′ (in this case, the length in the longitudinal direction of the substrate) are expressed as “L”.
- the length of the portion excluding the notch 58 near the center of the metal surfaces 2A ⁇ 2A ′, 2B ⁇ 2B ′ is expressed as “S”.
- L ⁇ 1/4
- S is set to ⁇ 2/4 (wavelength lambda 1, lambda 2, respectively, a wavelength of a frequency f 1, f 2).
- a transmission line having a shorted end is formed.
- the length of the metal surfaces 2A ⁇ 2A ′, 2B ⁇ 2B ′ corresponding to the transmission line corresponds to 1 ⁇ 4 wavelength.
- the impedances at the open ends 4A, 4A ′, 4B, 4B ′ facing both circuit portions are very high.
- a transmission path that resonates at two frequencies is formed in one metal surface 2A ⁇ 2A ′, 2B ⁇ 2B ′. Yes.
- the notch 58 is provided in the vicinity of the center of the metal surfaces 2A ⁇ 2A ′, 2B ⁇ 2B ′.
- a transmission path corresponding to the original length L of the metal surfaces 2A, 2A ′, 2B and 2B ′ is formed on the outer side (both sides of the substrate), and the length S is shortened by the notch 58.
- a transmission line corresponding to is formed near the center.
- the metal surfaces 2A and 2A ′ and the metal surfaces 2B and 2B ′ used in the second embodiment have the same shape and dimensions, and a notch 58 is provided in part.
- the metal surfaces 2A ′ and 2B ′ are different from the metal surfaces 2A and 2B in that the positions of the short-circuit plates 3A ′ and 3B ′ are moved to the notch portion 58 side. That is, on the metal surfaces 2A and 2B, the short-circuit plates 3A and 3B are disposed on the opposite side of the notch 58.
- the short-circuit plates 3A ′ and 3B ′ are arranged along the rectangular cutout portions 58.
- the position of the short-circuit plate is different, but the transmission path length is set to a length of 1 ⁇ 4 wavelength.
- ⁇ High impedance is obtained in two frequency bands on the 4A ′, 4B and 4B ′ sides.
- a broadband suppression effect can be obtained with respect to the noise current mixed from the opening ends 4A, 4A ′, 4B and 4B ′.
- the notches 58 are provided in the metal surfaces 2A, 2A ′, 2B, 2B ′ of the current control units 1A, 1B.
- transmission paths corresponding to at least two frequencies can be formed on one metal surface 2A ⁇ 2A ′, 2B ⁇ 2B ′.
- noise current generated from the digital circuit unit 23 and transmitted to the wireless circuit unit 22 through the substrate or noise generated from the wireless circuit unit 22 and transmitted to the digital circuit unit 23 through the substrate.
- a suppression effect is obtained in at least two frequency bands. As a result, it is possible to effectively increase the noise suppression frequency and increase the bandwidth (application to signal patterns and power supply layers).
- a signal pattern and a power supply layer may be arranged on the upper layer of the current control units 1A and 1B as in an actual printed board.
- the current control units 1A and 1B on the side where the signal pattern or the power supply layer is arranged. Only one of these may be used.
- the signal pattern, the first current suppressing mechanism, and the ground layer may be arranged in this order from the upper layer of the substrate 10.
- a linear shape such as a rectangular shape or a V-shape has been shown as the shape of the notch portion 58, but is not limited thereto.
- the notch 58 may have a curvilinear shape as long as high frequency or high frequency is obtained.
- the digital circuit unit 23, the radio circuit unit 22, and the antenna unit are taken as examples of the circuit unit, but the present invention is not limited to this. Since this configuration suppresses current, it is not limited to such a circuit unit as long as it generates current.
- the configuration according to the embodiment of the present invention may be applied to a general circuit unit or device such as an analog circuit unit or an LSI.
- the noise suppression structure of the present invention can be applied to electronic and electrical devices including wireless devices such as mobile phones, wireless personal computers, and portable information terminals.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Details Of Aerials (AREA)
- Telephone Set Structure (AREA)
- Noise Elimination (AREA)
Abstract
Description
プリント基板には、後述するノイズ制御構成40が搭載されている。ノイズ制御構成40は、ディジタル回路部23と無線回路部22との間で生じる電磁干渉を抑えている。
プリント基板24の内層には、他に信号層、電源層が形成されているが、ここでは図示を省略している。信号層および電源層には、ディジタル信号、アナログ信号などのそれぞれの目的に応じた信号を伝送するためのパターンなどが形成されている。
ディジタル回路部23では、基本波が数10MHz、数100MHz前後のクロック信号や、データバス信号などを扱っている。このような信号の高周波帯におけるノイズのうち、アンテナの受信帯域(800MHz帯や2GHz帯など)に一致したノイズが無線回路部22又はアンテナ部21に混入すると、アンテナ受信感度などの無線特性が低下する。
また、アンテナ部21からの電流がディジタル回路部23へ混入すると、送信波とディジタル信号の混合(ミキシング)が生じノイズとなることがある。
特許文献1に記載の携帯型無線利用機器では、無線回路部とディジタル回路部とを分離するため、プリント基板内の両回路部の間に電磁結合を抑制する電流制御機構部が搭載されている。この電流制御機構部は、グランド層を挟み込むようにその上層と下層に平行に金属面を配している。金属面の両サイドの位置及び無線回路部とディジタル回路部を結ぶ方向における金属面の端部から所望の間隔でビアホールの列が直線状に形成されている。
特許文献1では、金属の表面(グランド)の上下層に対してノイズ抑制構造を配設している。ここでは、上層と下層のノイズ抑制構造の構成及び原理は同じであるため、上層にそのノイズ抑制構造を配設した場合のみ説明する。
すなわち、前述のノイズ抑制構造40では、対象とした単一周波数に対しては有効であるものの、広帯域化又は多周波化に対しては十分に対応しているとは言えず、この点においてノイズ抑制構造の改良が望まれていた。
このとき、金属面に形成された切欠き部を、ノイズレベルが高くなる傾向にある低域側の伝送路を外側(基板両サイド)に配置してもよい。このように配置することにより、ディジタル回路部から発生し、基板上を伝わって無線回路部へ混入するノイズ電流に対して、少なくとも2つの周波数帯においてより高い抑制効果が得られ、ノイズ抑制周波数の多周波化が可能となる。
図1~図5は、本発明による実施形態1によるノイズ抑制構造1を示す。図1は本発明の実施形態1によるノイズ抑制構造1を示す斜視図である。図2は、図1に示すノイズ抑制構造1の分解図である。図3は、図1のノイズ抑制構造1を示す側面図である。図4は電流制御部1A、1Bの寸法を説明するための平面図である。図5はるノイズ抑制構造1を、無線利用機器の基板10内に配置した例を示す側面図である。
具体的には、電流制御部1A、1Bは基板10の幅方向と同じサイズの金属で構成されている。ノイズ抑制構造1は、グランド層11を挟んで、グランド層11の上層側に配置された第1の電流制御部1Aと、下層側に配置された第2の電流制御部1Bとから構成される。この構成により、基板10のグランド層11を伝わるノイズ電流を効果的に抑制する。これら電流制御部1A、1Bはグランド層11に対して互いに対称となるように配置されている。これら電流制御部1A、1Bは、その金属面(金属板)2A、2Bの端部の一部に段差となる切欠部50を設けている(詳細は後述する)。この構成により、ノイズ抑制周波数の多周波化をはかるとともに、各側の回路部22、23で生じる電流の混入を抑制している。
ノイズ抑制構造1は、第1及び第2の電流制御部1A、1Bから構成される。第1の電流制御部1Aは、金属面2Aと短絡板3Aとから構成され、かつグランド層11に接続される。第2の電流制御部1Bは、金属面2Bと短絡板3Bとから構成され、かつグランド層11に接続される。上層から第1の金属面2A、第1の短絡板3A、グランド層11、第2の短絡板3B、第2の金属面2Bの順番に配置される。
これは後ほど説明するように、ノイズ抑制周波数を多周波とするためである。また、この切欠き部50は金属面の中央付近に凹状に設けられている。ディジタル回路部23側Dsから見たときの金属面の長さは、図4に示すように中央部の領域で短く(符号Sで示す)、外側である基板10の両サイドに相当する領域で長い(符号Lで示す)。
短絡板3A、3Bは、切欠き部50がある側の反対側の金属面2A、2Bの端部に設けられている。短絡板3A、3Bは、金属面2A、2Bとグランド層11に接続される。このため、第1の電流制御部1Aは、金属面2Aとグランド層11とにより一対の伝送線路を構成する。
すなわち、金属面2Aの一方の端部(第1の端部)には、短絡端(短絡面)が形成される。この短絡端は、短絡板3Aで構成される。金属面2Aの他方の端部(第2の端部)には、開口端4Aが形成されている。この開口端4Aは、金属面2Aとグランド層11との間の開口で構成される。
同様に、第2の電流制御部1Bも金属面2B及びグランド層11により伝送線路を構成する。金属面2Bの一方の端部には開口端4Bが形成され、他方の端部には短絡板3Bによる短絡面が形成される。
この構成により、電流制御部1A、1Bは、開口端4A、4Bをディジタル回路部23の側Dsに、短絡板3A、3Bをアンテナ部21又は無線回路部22の側As、Wsに向けている。
第1及び第2の電流制御部1A、1Bの短絡板3A及び3Bは、上述のように狭ピッチのビアホールで形成しているが、各ビアホールは金属面2A及び2Bを同時に貫通するビアホールであっても良い。
金属面2A、2Bの長手方向に沿う長さを「L」と表記する。中央付近に位置する切欠き部50を除いた金属面2A、2Bの長手方向に沿う長さを「S」と表記する。本構成の場合、「L>S」の関係がある。しかも「L」と「S」はそれぞれ所望の異なる周波数f1、f2に対して、1/4波長の共振長に設定している。すなわち、L=λ1/4に、S=λ2/4に設定している(波長λ1、λ2はそれぞれ、周波数f1、f2の波長である)。
このため、ディジタル回路部23側Dsから無線回路部22側Wsへ流れるノイズ電流は、開口端4A、4Bにおける高インピーダンスの効果により流れにくくなり、結果としてノイズ混入が抑制される。
さらに、本実施形態による電流制御部1A、1Bのノイズ抑制構造1は、一枚の金属面2A、2Bの中に2つの周波数で共振する伝送路を形成している。この構成によりノイズ抑制周波数の多周波化をはかっている。すなわち、金属面2A、2Bの中央部付近に切欠き部50を設けている。この構成により、もともとの金属面2A、2Bの長さLに相当する伝送路を外側(基板両サイド)に形成し、切欠き部50の分だけ短くなった長さSに相当する伝送路を中央部付近に形成してある。
長さL(=λ1/4)の伝送路に相当する外側の金属面2A、2Bは周波数f1で共振する。長さS(=λ2/4)の伝送路に相当する中央部の金属面2A、2Bは周波数f2で共振する。このため、本構成は、2つの周波数成分に対して効果的に作用する。このため、本構成を用いることにより、基板10のグランド層11を流れる電流に対し、多周波化による広帯域な抑制効果を得ることができる。
一般に、無線利用機器で使用される周波数の多くは数MHz~数GHz帯であり、携帯電話などでは800MHz帯や2GHz帯といった高周波帯が利用される。このような周波数帯では、基板10のグランド層11上では定在波が発生し、電流は両サイドのエッジ部分を流れる傾向にある。また、ノイズの高調波成分の減衰を考えた場合、800MHzといった低域側の方が2GHzのような高域側よりもノイズレベルは高くなる傾向にある。
図5は上述した電流制御部1A、1Bを、無線利用機器の基板10内に構成したときのノイズ電流に対する開口端4A、4Bの作用を示す。
図6~図9は、本発明による実施形態1の変形例1に係るノイズ抑制構造1を示す。図6は、実施形態1の変形例1に係るノイズ抑制構造1全体を示す斜視図である。図7は、図6に示すノイズ抑制構造1の分解図である。図8は、図6に示すノイズ抑制構造1の側面図である。図9は電流制御部1A、1Bの寸法を説明するための平面図である。
この変形例1に示される電流制御部1A、1Bは、前述の実施形態1と、金属面2A、2Bに設けられた切欠き部51の位置において相違する。変形例1に示される電流制御部1A、1Bは、基板10内における層構成や、金属面2A、2Bの端部の一部に切欠きを設けた点などは、前述の構成(実施形態1の構成)と同様である。
このような構成は、短絡板のすぐ背後の部分に部品実装する場合など、切欠き部51の箇所にノイズの影響を受けない部品を実装する際などに適している。
図10は、本発明による実施形態1の変形例2に係る電流制御部1A、1Bの金属面2A、2Bを示す。金属面2A、2Bの形状を工夫することにより、多周波化及び広帯域化によるノイズ抑制が可能となる。
図10に示す構成においては、2つの切欠き部52、53を組み合わせて、さらなる多周波化を実現している。本変形例では、幅および長さの異なる矩形状の切欠き部52、53を重ねている。すなわち、幅広の切欠き部52の中に、幅狭の切欠き部53を設けている。この構成により、図10に示すように、開口端4A、4B側から見たときの線路長を3経路(L>S>T)にすることができる。この場合、長さL、S、Tはそれぞれ所望の周波数のλ/4に相当しているため、3周波数に対してノイズ抑制が可能となる。
このような変形例2の切欠き部52、53は、変形例1と同様に、金属面2A、2Bの短絡板3A、3B側、開口端4A、4B側のいずれに設けても良い。このことは、以下の変形例、実施形態についても同様である。
図11は、本発明による実施形態1の変形例3に係る電流制御部1A、1Bの金属面2A、2Bを示す。金属面2A、2Bの形状に特徴を有する。この変形例3では、図11に示すように、金属面2A、2Bの端部中央部に傾斜した切欠き部54を設けている。図11に示す例では、切欠き部54をV字状に形成している。前述の実施形態1及びその変形例1、2では、切欠き部50~53は、矩形状であったため、共振長は長さLとSの2段階であった。一方で、本構成では切欠き部54を斜めにカットした形状としている。このため、共振長は長さLとSの間で連続的に変化し、短絡板からの長さが1/4波長となる周波数は連続的となる。すなわち、開口端4A、4Bにおけるインピーダンスは、変形例1では長さLとSの長さに応じた2周波数f1及びf2の場合のみ高インピーダンスになる。一方で、本構成では長さが連続的に変わるため、それに応じて、周波数f1~f2の範囲で高インピーダンスが得られる。このため、本構成はノイズ抑制周波数の広帯域化に十分に効果を発揮することができる。
図13は、本発明による実施形態1の変形例4に係る電流制御部1A、1Bの金属面2A、2Bを示す。金属面2A、2Bの切欠き部56の形状に特徴を有する。この変形例では、金属面2A、2Bの両側に切欠き部56を設けている。このため、本変形例では、実施形態1及びその変形例1~3の場合とは逆に、図12に示すように長さSの短い方の伝送路を、金属面2A、2Bの両側に形成している。この場合は、基板10の両側に2GHzのような高域側のノイズ電流が顕著に流れる場合などに十分に効果を発揮する。
図15は、本発明による実施形態1の変形例5に係る電流制御部1A、1Bの金属面2A、2Bを示す。本変形例では、無線回路部22又はディジタル回路部23に面する金属面1A、2Bの中央部だけでなく、金属面2A、2Bの両側に切欠き部57を設けている。このような金属面2A、2Bの両側部分に設けた切欠き部57によって、切欠き部57の分だけ長さを迂回させ、本来の長さ(L)を若干長めに設定しても良い。
[実施形態2]
本実施形態2のノイズ抑制構造1は、電流制御部1A、1Bをディジタル回路部23と無線回路部22の間に配置される。これにより、ディジタル回路部23と無線回路部22との電磁気的な結合を遮断し、ディジタル回路部23と無線回路部22の間の相互に流れ込むノイズ的に振舞う電流の混入を防ぐ。
この切欠き部58は、ディジタル回路部23側Dsに位置する。実施形態1と同様、この切欠き部58により、金属面2Aの長さは、ディジタル回路部23の側Dsから無線回路部22の側Wsを見たときに変化が生じる。また、金属面2A´の長さは、逆に、無線回路部22の側Wsからディジタル回路部23の側Dsを見たときに変化が生じる。
切欠き部58は金属面2A、2A´の中央付近に設けてある。このため、金属面の長さは、中央部の領域で短く、外側に位置する基板10の両サイドに相当する領域で長い。
ディジタル回路部23側の短絡板3A´は、切欠き部58部の側の金属面2A、2A´の端部に沿って配設される。この短絡板3A´は金属面2A´に接続されているため、二層の金属面2A、2A´で一対の伝送線路を構成し、開口端4A´は無線回路部22の側に向く。
ディジタル回路部23側Dsの短絡板3B´は、切欠き部58部の側の金属面2B、2B´の端部に沿って配設される。この短絡板3B´は金属面2B´に接続されている。このため、二層の金属面2B、2B´で一対の伝送線路を構成し、開口端4B´は無線回路部22の側に向いている。
電流制御部1A、1Bを構成する第1層目の金属面2A、2Bの形状および寸法は、図4に示す第1実施形態の金属面2A、2Bと同じである。また、電流制御部1A、1Bを構成する第2層目の金属面2A´、2B´の形状および寸法は、図9に示す第1実施形態の金属面2A、2Bと同じである。しかしながら、金属面2A・2A´、2B・2B´おいて、第1層目の金属面2A、2Bと、2層目の金属面2A´、2B´とでは、短絡板3A・3A´、3B・3B´を接続する端部が異なる。
これらの金属面2A・2A´、2B・2B´の長さ(この場合は基板の長手方向の長さ)を「L」と表記する。金属面2A・2A´、2B・2B´の中央部付近の切欠き部58を除いた部分の長さを「S」と表記する。本構成の場合、実施形態1の場合と同様に、「L>S」の関係がある。しかも「L」と「S」はそれぞれ所望の異なる周波数f1、f2に対して、1/4波長の共振長に設定している。すなわち、L=λ1/4に、S=λ2/4に設定している(波長λ1、λ2はそれぞれ、周波数f1、f2の波長である)。
さらに、実施形態2に係るノイズ抑制構造1では、実施形態1の場合と同様、一枚の金属面2A・2A´、2B・2B´の中に2つの周波数で共振する伝送路を形成している。すなわち、金属面2A・2A´、2B・2B´の中央部付近に切欠き部58を設けている。この構成により、もともとの金属面2A・2A´、2B・2B´の長さLに相当する伝送路を外側(基板両サイド)に形成し、切欠き部58の分だけ短くなった長さSに相当する伝送路を、中央部付近に形成してある。
長さL(=λ1/4)の伝送路に相当する外側の金属面2A・2A´、2B・2B´は周波数f1で共振する。一方、長さS(=λ2/4)の伝送路に相当する中央部の金属面2A・2A´、2B・2B´は周波数f2で共振する。このため、2つの周波数成分に対して効果的に作用する。このため、本構成を用いることにより、基板10のグランド層を流れる電流に対し、多周波における抑制効果を得ることができる。
このような構成とした場合、図4及び図9を参照してわかるように、共振周波数f1に相当する伝送路は長さL(=λ1/4)を有する外側の領域と、共振周波数f2に相当する伝送路は長さS(=λ2/4)を有する中央部の領域とが存在する。
このため、実施形態2の金属面2A・2A´、2B・2B´では、短絡板の位置は相違するが、伝送路長は1/4波長の長さに設定されているので、開口端4A・4A´、4B・4B´側では2つの周波数帯で高インピーダンスが得られる。その結果、開口端4A・4A´、4B・4B´側から混入してくるノイズ電流に対して、広帯域な抑制効果を得ることができる。
本発明の実施形態では回路部として、ディジタル回路部23、無線回路部22、さらにはアンテナ部を例にとったがこれに限られない。本構成は電流を抑制するので、電流を発生するものならば、このような回路部だけに限定されない。例えば、アナログ回路部やLSIなど、一般的な回路部又はデバイスに対して本発明の実施形態による構成を適用しても良い。
1A 第1の電流制御部
1B 第2の電流制御部
2A、2A´、2B、2B´ 金属面
3A、3A´、3B、3B´ 短絡板
4A、4A´、4B、4B´ 開口端
10 基板
11 グランド層
21 アンテナ部
22 無線回路部
23 ディジタル回路部
24 プリント基板
30 無線利用機器
50~58 切欠き部
Claims (9)
- グランド層上に設けられて電流を制御する電流制御部を有するノイズ抑制構造であって、前記電流制御部は、
前記グランド層上に間隔をおいて設けられた金属面と、前記金属面の一端部に配置されて前記金属面と前記グランド層とを接続する短絡板とを有し、
前記金属面の一部には、切欠き部が設けられているノイズ抑制構造。 - グランド層上に設けられて電流を制御する電流制御部を有するノイズ抑制構造であって、前記電流制御部は、前記グランド層の上側に設けられた第1の電流制御部と、前記グランド層の下側に設けられた第2の電流制御部とを有し、前記第1の電流制御部と前記第2の電流制御部とは、その間に前記グラウンド層を挟み、前記第1および第2の電流制御部はそれぞれ、
前記グランド層上に間隔をおいて設けられた金属面と、前記金属面の一端部に配置されて、前記金属面及び前記グランド層を接続する短絡板とを有し、
前記金属面の一部には、切欠き部が設けられているノイズ抑制構造。 - 前記第1及び第2の電流制御部は、前記グランド層を共通に用いており、前記第1及び第2の電流制御部は、上下対称に配置されている請求項2に記載のノイズ抑制構造。
- 前記短絡板が設けられていない前記金属面の他端部において開口端が形成されている請求項1から3のいずれか1項に記載のノイズ抑制構造。
- 前記第1及び第2の電流制御部は、ノイズ発生源となる回路の間に搭載される請求項2から4のいずれか1項に記載のノイズ抑制構造。
- 前記第1及び第2の電流制御部はそれぞれ、一方の端部にディジタル回路が配置され、他方の端部に無線回路が配置されている請求項2から4のいずれか1項に記載のノイズ抑制構造。
- 前記切欠き部は、矩形状である請求項1から6のいずれか1項に記載のノイズ抑制構造。
- 前記切欠き部は、傾斜状の端部を有している請求項1から6のいずれか1項に記載のノイズ抑制構造。
- 前記切欠き部は、V字形状を有している請求項8項に記載のノイズ抑制構造。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/634,782 US20130192865A1 (en) | 2010-03-15 | 2011-03-15 | Noise suppression structure |
| JP2012505691A JPWO2011115094A1 (ja) | 2010-03-15 | 2011-03-15 | ノイズ抑制構造 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-058238 | 2010-03-15 | ||
| JP2010058238 | 2010-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2011115094A1 true WO2011115094A1 (ja) | 2011-09-22 |
Family
ID=44649179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2011/056012 Ceased WO2011115094A1 (ja) | 2010-03-15 | 2011-03-15 | ノイズ抑制構造 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130192865A1 (ja) |
| JP (1) | JPWO2011115094A1 (ja) |
| WO (1) | WO2011115094A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014027457A1 (ja) * | 2012-08-15 | 2014-02-20 | 日本電気株式会社 | 電流抑制素子及び電流抑制方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130003321A1 (en) * | 2010-03-15 | 2013-01-03 | Nec Corporation | Noise suppression structure |
| USD997944S1 (en) * | 2021-08-05 | 2023-09-05 | Cor Sanctum, LLC | Anti-eavesdropping device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002314491A (ja) * | 2001-04-12 | 2002-10-25 | Nec Corp | 携帯型無線利用機器 |
| JP2004328686A (ja) * | 2003-04-30 | 2004-11-18 | Taiyo Yuden Co Ltd | アンテナ装置 |
| JP2006311152A (ja) * | 2005-04-27 | 2006-11-09 | Nissei Electric Co Ltd | 広帯域アンテナ |
| WO2008018230A1 (fr) * | 2006-08-11 | 2008-02-14 | Konica Minolta Holdings, Inc. | Dispositif d'antenne |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998000882A1 (en) * | 1996-07-02 | 1998-01-08 | Omnipoint Corporation | Folded mono-bow antennas and antenna systems for use in cellular and other wireless communications systems |
| US5977916A (en) * | 1997-05-09 | 1999-11-02 | Motorola, Inc. | Difference drive diversity antenna structure and method |
| US6150895A (en) * | 1999-01-25 | 2000-11-21 | Dell Usa, L.P. | Circuit board voltage plane impedance matching |
| US20030025637A1 (en) * | 2001-08-06 | 2003-02-06 | E-Tenna Corporation | Miniaturized reverse-fed planar inverted F antenna |
| DE10204877A1 (de) * | 2002-02-06 | 2003-08-14 | Siemens Ag | Funkkommunikationsgerät sowie Leiterplatine mit mindestens einem stromleitfähigen Korrekturelement |
-
2011
- 2011-03-15 US US13/634,782 patent/US20130192865A1/en not_active Abandoned
- 2011-03-15 JP JP2012505691A patent/JPWO2011115094A1/ja not_active Ceased
- 2011-03-15 WO PCT/JP2011/056012 patent/WO2011115094A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002314491A (ja) * | 2001-04-12 | 2002-10-25 | Nec Corp | 携帯型無線利用機器 |
| JP2004328686A (ja) * | 2003-04-30 | 2004-11-18 | Taiyo Yuden Co Ltd | アンテナ装置 |
| JP2006311152A (ja) * | 2005-04-27 | 2006-11-09 | Nissei Electric Co Ltd | 広帯域アンテナ |
| WO2008018230A1 (fr) * | 2006-08-11 | 2008-02-14 | Konica Minolta Holdings, Inc. | Dispositif d'antenne |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014027457A1 (ja) * | 2012-08-15 | 2014-02-20 | 日本電気株式会社 | 電流抑制素子及び電流抑制方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2011115094A1 (ja) | 2013-06-27 |
| US20130192865A1 (en) | 2013-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8994470B2 (en) | Circuit substrate having noise suppression structure | |
| CN110380197A (zh) | 一种天线模组及电子设备 | |
| KR101311024B1 (ko) | 안테나, 무선 통신 장치 및 안테나 구성 방법 | |
| US11063330B2 (en) | Filter | |
| JP2016007059A (ja) | 無線通信装置 | |
| JP5726856B2 (ja) | 電子機器 | |
| JP2006024618A (ja) | 配線基板 | |
| US20100102898A1 (en) | Coupler | |
| JPWO2010106708A1 (ja) | アンテナ装置及び無線通信機 | |
| WO2014121568A1 (zh) | 一种低损耗扁平传输线 | |
| JP3930477B2 (ja) | 誘電体アンテナ | |
| CN101821901A (zh) | 短边方向滑动式无线装置 | |
| JP2012129271A (ja) | ノイズ抑制構造 | |
| CN113647202B (zh) | 高频电路和通信模块 | |
| WO2011115094A1 (ja) | ノイズ抑制構造 | |
| US7579929B2 (en) | Transmission circuit, antenna duplexer, and radio-frequency switch circuit | |
| JP2014175438A (ja) | 配線基板、及び電子装置 | |
| US12155107B2 (en) | Filter, antenna module, and communication device | |
| CN113366700B (zh) | 天线模块和搭载有天线模块的通信装置 | |
| WO2011122502A1 (ja) | ノイズ抑制構造 | |
| WO2011114944A1 (ja) | ノイズ抑制構造 | |
| US20240154316A1 (en) | Antenna | |
| JPWO2014027457A1 (ja) | 電流抑制素子及び電流抑制方法 | |
| JP5391715B2 (ja) | 携帯端末およびその基板構造 | |
| JP2015146482A (ja) | マルチバンドアンテナ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11756279 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2012505691 Country of ref document: JP |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 13634782 Country of ref document: US |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 11756279 Country of ref document: EP Kind code of ref document: A1 |