WO2011163544A3 - Surface integrated circuit for power transmission and method of manufacture - Google Patents
Surface integrated circuit for power transmission and method of manufacture Download PDFInfo
- Publication number
- WO2011163544A3 WO2011163544A3 PCT/US2011/041738 US2011041738W WO2011163544A3 WO 2011163544 A3 WO2011163544 A3 WO 2011163544A3 US 2011041738 W US2011041738 W US 2011041738W WO 2011163544 A3 WO2011163544 A3 WO 2011163544A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- manufacture
- integrated circuit
- power transmission
- surface integrated
- electrical circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/005—Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A trim component comprising a decorative layer and an electrical circuit path positioned on the B (i.e., back or hidden) surface of the decorative layer, the electrical circuit path comprising conductive ink/paint in a geometric configuration suitable for transmitting wireless power. The trim component can further comprise a protective layer positioned such that the electrical circuit path is at least partially enclosed between the decorative layer and the protective layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35801610P | 2010-06-24 | 2010-06-24 | |
US61/358,016 | 2010-06-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011163544A2 WO2011163544A2 (en) | 2011-12-29 |
WO2011163544A3 true WO2011163544A3 (en) | 2012-02-23 |
Family
ID=44630362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2011/041738 WO2011163544A2 (en) | 2010-06-24 | 2011-06-24 | Surface integrated circuit for power transmission and method of manufacture |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2011163544A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10002709B2 (en) | 2014-05-30 | 2018-06-19 | Corning Incorporated | Wireless charging device for an electronic device |
NL2016241B1 (en) * | 2016-02-09 | 2017-08-15 | Trespa Int Bv | A decorative panel |
JP7499438B2 (en) * | 2020-01-20 | 2024-06-14 | パナソニックIpマネジメント株式会社 | Insert molding sheet, molded product, and method for manufacturing molded product |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001016995A1 (en) * | 1999-08-27 | 2001-03-08 | Illumagraphics, Llc | Induction electroluminescent lamp |
US20060202665A1 (en) * | 2005-03-10 | 2006-09-14 | Microsoft Corporation | Inductive powering surface for powering portable devices |
WO2007090168A2 (en) * | 2006-01-31 | 2007-08-09 | Afshin Partovi | Inductive power source and charging system |
US20080265835A1 (en) * | 2007-04-26 | 2008-10-30 | Visteon Global Technologies, Inc. | Wireless power transfer system |
WO2009047768A2 (en) * | 2007-10-09 | 2009-04-16 | Powermat Ltd. | Inductive power providing system |
-
2011
- 2011-06-24 WO PCT/US2011/041738 patent/WO2011163544A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001016995A1 (en) * | 1999-08-27 | 2001-03-08 | Illumagraphics, Llc | Induction electroluminescent lamp |
US20060202665A1 (en) * | 2005-03-10 | 2006-09-14 | Microsoft Corporation | Inductive powering surface for powering portable devices |
WO2007090168A2 (en) * | 2006-01-31 | 2007-08-09 | Afshin Partovi | Inductive power source and charging system |
US20080265835A1 (en) * | 2007-04-26 | 2008-10-30 | Visteon Global Technologies, Inc. | Wireless power transfer system |
WO2009047768A2 (en) * | 2007-10-09 | 2009-04-16 | Powermat Ltd. | Inductive power providing system |
Also Published As
Publication number | Publication date |
---|---|
WO2011163544A2 (en) | 2011-12-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3026145A4 (en) | Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method | |
WO2012012108A3 (en) | Galvanic isolation transformer | |
WO2012028686A3 (en) | Electrically conductive member having expandable wiring | |
WO2012051272A3 (en) | Method and apparatus for an integrated antenna | |
WO2009102629A3 (en) | Electrical apparatus with integral thin film solid state battery and methods of manufacture | |
EP3032550A4 (en) | Coil printed wiring board, power reception module, battery unit, and power reception communications module | |
PH12015500962B1 (en) | Portable electronic device body having laser perforation apertures and associated fabrication method | |
WO2013103948A3 (en) | Wireless power transfer through conductive materials | |
WO2013126308A8 (en) | High current, low equivalent series resistance printed circuit board coil for power transfer application | |
WO2013003638A3 (en) | Transparent conductors incorporating additives and related manufacturing methods | |
WO2013043924A3 (en) | Ablation antenna | |
WO2013033402A8 (en) | Method of manufacturing a high definition heater system | |
WO2012006063A3 (en) | Microelectronic package and method of manufacturing same | |
TW200802743A (en) | High frequency device module and method for manufacturing the same | |
WO2010079933A3 (en) | Method of cooperative transmission | |
WO2010038179A3 (en) | An oled device and an electronic circuit | |
WO2012094436A3 (en) | Electronic components on paper-based substrates | |
EP3026144A4 (en) | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board | |
WO2014009069A3 (en) | Printed circuit board equipped with a radio-frequency assembly emitting interference waves | |
WO2012091487A3 (en) | Electrode, and electronic device comprising same | |
EP2656703A4 (en) | Printed circuit board and method for manufacturing the same | |
TWD153072S (en) | Antenna for wireless communication | |
EP3767703A4 (en) | Battery and method for manufacturing same, circuit board, electronic device and electric vehicle | |
WO2013024390A3 (en) | Laminate surface for wireless capacitive power | |
EP2608260A3 (en) | Heterogeneous Chip Integration with Low Loss Interconnection Through Adaptive Patterning |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11744122 Country of ref document: EP Kind code of ref document: A2 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11744122 Country of ref document: EP Kind code of ref document: A2 |