WO2011148787A1 - Laminating type inductor and method of manufacturing thereof - Google Patents

Abstract

Provided is a laminating type inductor and a method of manufacturing thereof, wherein a proximity effect by coil conductors in the high frequency range can be alleviated, and the Q value thereof can also be improved. In a laminating type inductor (10) provided with a coil (4) that is formed within a laminate (5), which comprises a plurality of nonmagnetic material layers (1) and a plurality of coil conductors (2) laminated with the nonmagnetic material layers interposed therebetween, by having the coil conductors inter-layer connected, magnetic material layers (3) are arranged on faces (12) of the coil conductors that face each other with the nonmagnetic material layers interposed therebetween. Magnetic material layers are also arranged around the coil conductors so as to cover the whole outer circumference faces of the coil conductors. The magnetic material layers are to be comprised of a metal the main component of which is nickel. The magnetic material layers are formed by having a magnetic material paste, the main component of which is nickel, baked at the same time as when the nonmagnetic material layers and the coil conductor patterns are baked. The magnetic material layers are also formed by forming a plating film, the main component of which is nickel, around the coil conductors by plating.

Description

Multilayer inductor and manufacturing method thereof

The present invention is formed by interconnecting coil conductors in a laminate (chip element) having a plurality of nonmagnetic layers and a plurality of coil conductors laminated via the nonmagnetic layers. The present invention relates to a multilayer inductor having a coil and a method for manufacturing the same.

In recent years, there has been an increasing demand for downsizing electronic components, and multilayer inductors with excellent compatibility with downsizing have been widely used as inductors.

In one of such multilayer inductors, a coil is formed in a non-magnetic material such as glass, which is a low dielectric constant material, the stray capacitance is reduced, the self-resonance frequency is increased, and several hundred MHz There is a multilayer inductor that can be used even in a high frequency region.

Then, in one of the multilayer inductors using such a non-magnetic material, a = d / e (t + d) where e is the coil wire width, t is the wire thickness, and d is the distance between the wires. There has been proposed a multilayer inductor in which the value of a obtained by the equation is in the range of 5 to 20 (see Patent Document 1).

In the case of this multilayer inductor, the a value is a value corresponding to the ratio of the inductance L and the capacitance C. Therefore, by setting the a value within this range, the multilayer inductor having a required inductance and a high Q is obtained. It is said that an inductor can be obtained.
JP 2007-214341 A

However, in the case of the multilayer inductor of the prior art (Patent Document 1), it is necessary to manage the coil line width, line thickness, and inter-line distance with extremely high precision, which complicates the manufacturing process and reduces productivity. There is a problem of inviting.
In addition, due to the proximity effect that acts between adjacent conductors (coil conductors), a sufficiently high Q may not be obtained, and there is a problem that reliable effectiveness may not always be obtained.

The present invention solves the above-mentioned problem, and as in the case of the above prior art, it is possible to suppress the proximity effect in the high-frequency region without requiring higher management accuracy in the manufacturing process, and the Q value can be reduced. It is an object of the present invention to provide a multilayer inductor that can be improved and a method for manufacturing the same.

In order to solve the above problems, the multilayer inductor of the present invention is
A multilayer type comprising a coil formed by interlayer connection of the coil conductors in a multilayer body having a plurality of nonmagnetic layers and a plurality of coil conductors stacked via the nonmagnetic layers. An inductor,
A magnetic layer is disposed on surfaces of the coil conductors facing each other with the non-magnetic layer interposed therebetween.

In the multilayer inductor according to the present invention, a magnetic layer is disposed around the coil conductor so as to cover the entire outer peripheral surface of the coil conductor, including the surfaces of the coil conductor that face each other with the nonmagnetic layer interposed therebetween. More preferably, it is arranged.

In the multilayer inductor according to the present invention, the magnetic layer is preferably made of a metal containing Ni as a main component.

In the multilayer inductor of the present invention, the magnetic layer is formed by simultaneously firing a magnetic paste mainly composed of Ni together with the nonmagnetic layer and the coil conductor pattern. Is desirable.

The magnetic layer is preferably made of a plated metal formed by plating a metal containing Ni as a main component.

In the multilayer inductor of the present invention, it is preferable that the nonmagnetic layer is made of low dielectric constant glass.

In addition, the manufacturing method of the multilayer inductor according to the present invention includes:
A multilayer type comprising a coil formed by interlayer connection of the coil conductors in a multilayer body having a plurality of nonmagnetic layers and a plurality of coil conductors stacked via the nonmagnetic layers. An inductor manufacturing method comprising:
A first magnetic pattern made of a magnetic paste is formed on a non-magnetic green sheet, a coil conductor pattern made of a conductor paste is formed on the magnetic pattern, and a magnetic paste is formed on the coil conductor pattern. Forming a green laminate by laminating a patterned green sheet on which a second magnetic body pattern is formed;
And firing the green laminate.

In addition, the manufacturing method of the multilayer inductor according to the present invention includes:
A multilayer type comprising a coil formed by interlayer connection of the coil conductors in a multilayer body having a plurality of nonmagnetic layers and a plurality of coil conductors stacked via the nonmagnetic layers. An inductor manufacturing method comprising:
A plurality of non-magnetic layers and a plurality of coil conductors stacked via the non-magnetic layers are provided, and the coil conductors are connected to each other to form a fired stacked body in which coils are formed. And a process of
Forming a magnetic layer made of a magnetic metal plating film on the surface of the coil conductor by immersing the fired laminated body in a plating solution containing a magnetic metal material and performing plating. It is characterized by that.

In the multilayer inductor according to the present invention, the magnetic layers are arranged on the surfaces of the coil conductors facing each other with the nonmagnetic layer interposed therebetween, so that the magnetic shield effect of the magnetic layer causes proximity to the coil. The influence of the effect can be reduced, the current distribution can be made uniform, the effective resistance can be reduced, and a high Q can be obtained.

In addition, when a magnetic layer is disposed around the coil conductor so as to cover the entire outer peripheral surface of the coil conductor, including the surfaces facing each other through the nonmagnetic layer of the coil conductor, Due to the magnetic shielding effect of the body layer, the influence of the proximity effect generated in the coil can be further reliably reduced, and the present invention can be more effectively realized.

In the multilayer inductor according to the present invention, the magnetic layer is made of a metal containing Ni as a main component, thereby obtaining a sufficient magnetic shielding effect by the magnetic layer and the influence of the proximity effect generated in the coil. Can be reduced, the current distribution can be made uniform, and a high Q can be realized.

Even when the magnetic layer is formed by simultaneously firing a magnetic paste mainly composed of Ni together with the non-magnetic layer and the coil conductor pattern, a sufficient magnetic shielding effect is obtained. The influence of the proximity effect generated in the coil can be reduced, the current distribution can be made uniform, and a high Q can be obtained.

In addition, even when the magnetic layer is made of a plated metal formed by plating a metal containing Ni as a main component, it is possible to obtain a sufficient magnetic shield effect and to influence the proximity effect generated in the coil. And the current distribution can be made uniform, and a high Q can be obtained.

In addition, in the multilayer inductor of the present invention, it is possible to provide a multilayer inductor having a high Q suitable for use in a high frequency region by forming the nonmagnetic layer using low dielectric constant glass. It becomes possible.

In the method for manufacturing a multilayer inductor according to the present invention, a first magnetic pattern made of a magnetic paste is formed on a non-magnetic green sheet, and a coil conductor made of a conductive paste is formed on the first magnetic pattern. A green sheet is formed by laminating a patterned green sheet on which a pattern is formed and a second magnetic pattern made of a magnetic paste is formed on the coil conductor pattern, and the unfired laminate is fired. As a result, the magnetic conductor layer has a structure in which the coil conductors are opposed to each other via the nonmagnetic layer of the coil conductor, and the magnetic shield effect of the magnetic layer causes the proximity effect generated in the coil. The influence can be reduced and the current distribution can be made uniform, and a multilayer inductor having a low effective resistance and a high Q can be efficiently manufactured.

The method for manufacturing a multilayer inductor according to the present invention includes a plurality of nonmagnetic layers and a plurality of coil conductors stacked via the nonmagnetic layers, and the coil conductors are connected by interlayer connection. After the fired laminate formed inside is formed, the fired laminate is immersed in a plating solution containing a magnetic metal material and plated to form a magnetic metal plating film on the surface of the coil conductor. Since the magnetic material layer is formed, the magnetic material layer is disposed around the coil conductor so as to cover the entire outer peripheral surface of the coil conductor including the surfaces facing each other through the nonmagnetic material layer. Multilayer inductor having a high Q with a low effective resistance and a uniform current distribution by reducing the influence of the proximity effect generated in the coil by the magnetic shielding effect of the magnetic layer. Efficiently manufacture It is possible.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front cross-sectional view illustrating a configuration of a multilayer inductor according to an embodiment (Example 1) of the present invention. It is a disassembled perspective view which shows the principal part structure of the multilayer inductor concerning Example 1 of this invention. (a), (b), (c) is a figure explaining the manufacturing method of the multilayer inductor concerning Example 1 of this invention. It is front sectional drawing which shows the structure of the multilayer inductor of the comparative example 1 produced in order to compare a characteristic with the multilayer inductor concerning Example 1 of this invention. It is front sectional drawing which shows the structure of the multilayer inductor concerning the other Example (Example 2) of this invention. It is a figure explaining the manufacturing method of the multilayer inductor concerning Example 2 of this invention.

Hereinafter, the features of the present invention will be described in more detail with reference to examples of the present invention.

[Multilayer Inductor According to Example 1]
FIG. 1 is a front sectional view showing a configuration of a multilayer inductor according to an embodiment (Example 1) of the present invention, and FIG. 2 is an exploded perspective view.

As shown in FIGS. 1 and 2, the multilayer inductor 10 of Example 1 is a multilayer body having a plurality of nonmagnetic layers 1 and a plurality of coil conductors 2 stacked via the nonmagnetic layers 1. Inside the (chip element) 5 is provided a coil 4 formed by inter-layer connection of the coil conductor 2 via a via hole 7 (see FIG. 2).
A pair of external electrodes 6 a and 6 b are disposed at both ends of the multilayer body (chip element) 5 so as to be electrically connected to both ends 4 a and 4 b of the coil 4.

And in this multilayer inductor 10, as shown in FIG. 1, the magnetic body layer 3 is arrange | positioned in the surface 12 which mutually opposes the non-magnetic body layer 1 of the coil conductor 2. As shown in FIG. That is, each coil conductor 2 has a structure in which the magnetic layer 3 is disposed on the upper surface side and the lower surface side.

In the multilayer inductor 10, a low dielectric constant glass (glass ceramic) is used as the nonmagnetic layer 1, and specifically, borosilicate glass is used as the low dielectric constant glass. .

Further, the coil conductor 2 is provided with an Ag conductor formed by baking Ag paste, and the magnetic layer 3 is provided with a Ni magnetic layer formed by baking Ni paste. ing.

In the multilayer inductor 10 of Example 1 configured as described above, the magnetic layer 3 is disposed on the surfaces 12 of the coil conductor 2 facing each other through the nonmagnetic layer 1 as described above. As a result, the magnetic shield effect of the magnetic layer 3 reduces the influence of the proximity effect generated in the coil 4 (coil conductor 2), makes it possible to equalize the current distribution, reduce the effective resistance, and increase A multilayer inductor having Q can be obtained.

[Production of Multilayer Inductor According to Example 1]
Next, a method for manufacturing the multilayer inductor 10 will be described.

(1) A borosilicate glass powder is prepared as a raw material for forming the nonmagnetic layer. In general, it is preferable to use a borosilicate glass having a composition of 65 to 85% by weight of SiO _{2 and} 15 to 35% by weight of B ₂ O ₃ .
Then, a binder (for example, polyvinyl butyral organic binder) and an organic solvent (for example, ethanol, toluene, etc.) are put into a pot mill together with grinding media (for example, PSZ balls) to this borosilicate glass powder and mixed thoroughly. The slurry is prepared by pulverization.
Next, this slurry is coated on a carrier film by a doctor blade method or the like and then dried to produce a glass ceramic green sheet.

(2) Also, a conductive paste for coil conductors mainly composed of an Ag-based material and a magnetic layer paste mainly composed of an Ni-based material are prepared.

(3) A non-magnetic green sheet is produced by punching the glass ceramic green sheet produced in the above (1) into a predetermined size.
Then, via holes (via hole through holes) 7 (see FIG. 2) for connecting the coil conductors between layers are formed in the nonmagnetic green sheet using a laser processing machine.

(4) Thereafter, as shown in FIG. 3 (a), a magnetic layer paste (Ni paste) is printed on the non-magnetic green sheet 1a to form the first magnetic pattern 3a. dry. The first magnetic pattern 3a is formed to have a shape corresponding to the coil conductor pattern 2a described below.

Next, as shown in FIG. 3B, the coil conductor conductive paste (Ag paste) is printed on the dried first magnetic pattern 3a to form the coil conductor pattern 2a, which is sufficiently dried. .

Then, as shown in FIG. 3C, the magnetic layer paste (Ni paste) is printed on the dried coil conductor pattern 2a to form the second magnetic pattern 3b and sufficiently dried. .

In Example 1, the line widths of the first and second magnetic patterns formed from the magnetic layer paste (Ni paste) are equal to the coil conductor pattern formed from the coil conductor conductive paste (Ag paste). The line width is approximately the same as the line width of.

Thereby, as shown in FIG.3 (c), the 1st and 2nd magnetic body pattern (unfired magnetic body layer) 3a is covered so that upper and lower surfaces of the coil conductor pattern (unfired coil conductor) 2a may be covered. , 3b is obtained as an unfired non-magnetic green sheet (pattern-arranged non-magnetic green sheet) 1b.
However, by increasing the line width of the magnetic material pattern 3a to be larger than the line width of the coil conductor pattern 2a, for example, as shown in FIG. It is also possible to adopt a structure in which the magnetic layer 3 is disposed around the periphery of the substrate.

(5) Then, the coil conductor pattern 2a, the non-magnetic green sheet (pattern-arranged non-magnetic green sheet) 1b on which the first and second magnetic patterns 3a and 3b are disposed, the coil conductor pattern, A plurality of non-magnetic green sheets 1a for outer layers not provided with a magnetic material pattern are stacked in a manner as shown in FIG. 2 and pressed to form a plurality of coil conductor patterns and magnetic material patterns. The laminated body of magnetic green sheets forms a pressure-bonding block sandwiched between outer layer non-magnetic green sheets not provided with coil conductor patterns or magnetic patterns. In addition, although the 1st and 2nd magnetic body patterns 3a and 3b are arrange | positioned at the upper and lower surfaces of the coil conductor pattern 2a in FIG. 2, the code | symbol is abbreviate | omitted in FIG.

Next, the pressure-bonding block is cut into a predetermined size (here, the length L: 1.0 mm, the width W: 0.5 mm, the thickness: T = 0.5 mm after firing), and the unfired A laminated body (chip element) is obtained.

(6) Thereafter, this unfired laminate (chip element) is fired at a temperature of 850 to 900 ° C. in a neutral or reducing atmosphere by flowing N ₂ gas to obtain a fired laminate. (Chip element) 5 (FIG. 1) is obtained.
Then, an Ag paste is applied to the end face of the laminate (chip element) 5 and then baked at a predetermined temperature to form a thick film base electrode. Then, Ni plating is applied on the thick film base electrode, and Sn plating is further performed. As a result, external electrodes 6a and 6b (FIG. 1) are formed.
Thereby, the multilayer inductor (Example 1) 10 having the structure shown in FIGS. 1 and 2 according to the example of the present invention is obtained.

In Example 1, a multilayer inductor having an inductance of 10 nH (100 MHz) was manufactured by adjusting the number of turns of the coil 4.

For comparison, as shown in FIG. 4, the multilayer inductor 10 of Example 1 includes the coil 4 made of only the coil conductor 2, which does not include the magnetic layer 3 (FIG. 1) provided. A multilayer inductor (Comparative Example 1) 10a was produced. The remaining configuration of the multilayer inductor of Comparative Example 1 is the same as that of the multilayer inductor of Example 1. Further, in FIG. 4, the parts denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding parts.

[Evaluation of Multilayer Inductor According to Example 1]
And about the multilayer inductor 10 of Example 1 produced as mentioned above and the multilayer inductor 10a of the comparative example 1, the impedance characteristic was measured using the impedance analyzer, and Q value was investigated. The results are shown in Table 1.

As shown in Table 1, the multilayer inductor 10 of Example 1 (the multilayer inductor 10 in which the magnetic layer 3 is disposed on the surfaces 12 of the coil conductor 2 facing each other with the nonmagnetic layer 1 interposed therebetween (see FIG. 1). In the case of 1)), it was confirmed that the Q value was higher than that of the multilayer inductor 10a of Comparative Example 1 that does not include the magnetic layer 3 (FIG. 4). This is because the influence of the proximity effect generated in the coil due to the magnetic shield effect of the magnetic layer is reduced, and the current distribution is made uniform, so that the effective resistance is reduced and a high Q can be obtained. is there.

[Multilayer Inductor According to Example 2]
FIG. 5 is a front sectional view showing the structure of a multilayer inductor according to another embodiment (embodiment 2) of the present invention, and FIG. 6 is a diagram for explaining a method of manufacturing the multilayer inductor according to embodiment 2 of the present invention. is there.

Similar to the multilayer inductor 10 of the first embodiment described above, the multilayer inductor 20 of the second embodiment includes a plurality of nonmagnetic layers 1 and a plurality of coil conductors 2 stacked via the nonmagnetic layers 1. Is provided with a coil 4 formed by inter-layer connection of a coil conductor 2 via a via hole 7 (see FIG. 6). A pair of external electrodes 6 a and 6 b are disposed at both ends of the multilayer body (chip element) 5 so as to be electrically connected to both ends 4 a and 4 b of the coil 4.

In the multilayer inductor 20 of the second embodiment, as shown in FIG. 5, not only the surface 12 of the coil conductor 2 facing each other through the nonmagnetic layer 1, but the entire outer peripheral surface is a magnetic layer. 3 is covered.
The configuration of other parts in the multilayer inductor 20 of the second embodiment is the same as that of the multilayer inductor 10 of the first embodiment. 5 and 6, the same reference numerals as those in FIGS. 1 and 2 indicate the same or corresponding parts.

In the multilayer inductor 20 according to the second embodiment, the entire outer peripheral surface of the coil conductor 2 is covered with the magnetic layer 3 as described above. The effect of the proximity effect that occurs in the first embodiment can be reduced more efficiently than in the case of the multilayer inductor 10 of the first embodiment, and a multilayer inductor having a high Q can be reliably manufactured.

[Production of Multilayer Inductor According to Example 2]
Next, a method for manufacturing the multilayer inductor 20 of the second embodiment will be described.

(1) A borosilicate glass powder is prepared as a raw material for forming the nonmagnetic layer. Then, into this borosilicate glass powder, an organic binder such as polyvinyl butyral and an organic solvent such as ethanol and toluene are put into a pot mill together with a grinding medium such as PSZ balls, and sufficiently mixed and pulverized. Make a slurry.
Next, this slurry is coated on a carrier film by a doctor blade method or the like and then dried to form a green sheet.
Then, the non-magnetic green sheet is produced by punching the green sheet into a predetermined size.
Then, a via hole (via hole for via hole) 7 (see FIG. 6) for forming a coil by connecting coil conductors between layers is formed on the nonmagnetic green sheet using a laser processing machine.
The steps so far are the same as those in the first embodiment.

(2) As the conductive paste for the coil conductor, a conductive paste containing Ag particles and a vehicle and further containing thermally decomposable resin particles (for example, polyacrylate resin) is prepared.
As described above, the conductive paste containing the resin particles that are thermally decomposed is used as the conductive paste for the coil conductor because the amount of shrinkage of the conductive paste (coil conductor) in the firing process is non- This is because a gap is formed between the nonmagnetic layer and the coil conductor so as to be larger than the magnetic green sheet (nonmagnetic layer).
There are no particular restrictions on the blending ratio of the above resin particles or the type of resin contained in the conductive paste for the coil conductor, and the coil conductor shrinkage amount is made larger than that of the non-magnetic layer, and the coil Various applications can be added as long as a necessary gap can be formed between the conductor and the nonmagnetic layer.

Then, this conductive paste for coil conductor is printed on the non-magnetic green sheet produced in the above (1) to form a coil conductor pattern and sufficiently dried.

(3) Then, in a manner as shown in FIG. 6, the non-magnetic green sheet (pattern-arranged non-magnetic green sheet) 1b provided with the coil conductor pattern 2a and the coil conductor pattern are not provided. A non-magnetic green sheet 1a for the outer layer is laminated and pressure-bonded to form a pressure-bonding block.

Next, the pressure-bonding block is cut into a predetermined size (here, the length L: 1.0 mm, the width W: 0.5 mm, the thickness: T = 0.5 mm after firing), and the unfired A laminated body (chip element) is obtained.

(4) Thereafter, this unfired laminated body (chip element) is fired in the atmosphere at a temperature of 850 to 900 ° C., thereby laminating the plurality of nonmagnetic material layers 1 and nonmagnetic material layers 1 therebetween. The fired laminated body (chip element 5) in which the coil 4 is formed is obtained by connecting the coil conductors 2 with each other.

At this time, since the conductive paste containing the resin particles to be thermally decomposed is used as the conductive paste for the coil conductor for forming the coil conductor pattern, the shrinkage amount of the coil conductor in the firing process is non-magnetic around it. The amount of shrinkage of the body layer (glass ceramic layer) is larger, and a gap is formed between the nonmagnetic body layer (glass ceramic layer) and the coil conductor layer.

(5) Then, the fired laminate (chip element) 5 is immersed in a Ni plating solution, and electrolytic plating is performed. At this time, the Ni plating solution penetrates from the lead portion of the coil conductor 2 through the gap between the nonmagnetic material layer (glass ceramic layer) 1 and the coil conductor 2 and into the laminated body (chip element) 5, An Ni plating film (magnetic layer) 3 is formed around the coil conductor 2 so as to cover the entire outer peripheral surface of the coil conductor 2.

(6) Then, an Ag paste for forming an external electrode is applied to the end face of the laminate (chip element), and then baked at a predetermined temperature in a reducing atmosphere to form a thick film base electrode. On top, Ni plating and Sn plating are sequentially performed to form external electrodes 6a and 6b (FIG. 5).
Thereby, the multilayer inductor 20 according to the second embodiment of the present invention having the structure as shown in FIGS. 5 and 6 is obtained.

In addition, as a method of forming a plating film (magnetic layer) on the surface of the coil conductor, the density at which the nonmagnetic layer (glass ceramic layer) constituting the laminate (chip element) in the firing step includes a predetermined pore is used. After firing under such conditions, an Ag paste is applied to the end face of the laminate (chip element) and baked to form an external electrode (thick film base electrode), and then the external electrode (thick film base electrode) ) Is plated in a Ni plating solution, and the Ni plating solution is permeated into the inside of the laminate (chip element) through the pores of the non-magnetic material layer to perform electroplating. It is also possible to deposit a Ni plating film on the surface of the coil conductor at the same time as depositing the Ni plating film on the surface of the (thick film base electrode).
In the case of this method, it is not necessary to add a new process for forming a magnetic layer (Ni plating film) on the surface of the coil conductor, and the manufacturing process can be simplified.

[Evaluation of Multilayer Inductor According to Example 2]
The multilayer inductor 20 of Example 2 manufactured as described above and the coil 4 made of only the coil conductor 2 without the magnetic layer prepared for comparison in Example 1 described above were provided. For the multilayer inductor (Comparative Example 1) 10a (FIG. 4), an impedance characteristic was measured using an impedance analyzer, and a Q value was examined. The results are shown in Table 2.

As shown in Table 2, in the case of the multilayer inductor 20 (FIG. 5) of Example 2 in which the entire outer peripheral surface of the coil conductor 2 is covered with the magnetic layer 3, Comparative Example 1 that does not include the magnetic layer 2. It was confirmed that the Q value was higher than that of the multilayer inductor 10a (FIG. 4).

Further, in the case of the multilayer inductor of Example 2 in which the entire outer peripheral surface of the coil conductor is covered with the magnetic material layer, the magnetic material layer is disposed only on the surfaces of the coil conductor that face each other with the nonmagnetic material layer interposed therebetween. It was confirmed that a higher Q can be obtained than the provided multilayer inductor.

In the above embodiment, the case where the material constituting the coil conductor is Ag has been described as an example. However, the material constituting the coil conductor is not limited to Ag, for example, Pd, Cu, Al, These alloys can be used.

In the above embodiment, the case where the material constituting the magnetic layer is Ni has been described as an example. However, the material constituting the magnetic layer is not limited to Ni, for example, Fe, Co, Gd, and the like. Alternatively, an alloy thereof, an oxide magnetic material represented by Ni—Zn based ferrite, Ni—Cu—Zn based ferrite, or the like can be used.

In the above embodiment, a borosilicate glass-based glass ceramic is used as a material constituting the nonmagnetic layer, but the material constituting the nonmagnetic layer is limited to a borosilicate glass-based glass ceramic. Instead, it is possible to use non-magnetic materials such as Al ₂ O ₃ and Cu—Zn ferrite.

The present invention is not limited to the above-described embodiments in other respects as well. Specific patterns of the coil conductor, the arrangement of the coil conductor and the nonmagnetic material layer, the number of laminated nonmagnetic materials, the product Various applications and modifications can be made within the scope of the invention with respect to the dimensions and the firing conditions of the laminated body (chip element).

DESCRIPTION OF SYMBOLS 1 Nonmagnetic body layer 1a Nonmagnetic body green sheet 1b Pattern arrangement | positioning nonmagnetic body green sheet 2 Coil conductor 2a Coil conductor pattern 3 Magnetic body layer 3a 1st magnetic body pattern 3b 2nd magnetic body pattern 4 Coil 4a, 4b Coil both ends 5 Laminated body (chip element)
6a, 6b External electrodes 10, 20 Multilayer inductor 12 Faces facing each other through a non-magnetic layer of the coil conductor

Claims (8)

A multilayer type comprising a coil formed by interlayer connection of the coil conductors in a multilayer body having a plurality of nonmagnetic layers and a plurality of coil conductors stacked via the nonmagnetic layers. An inductor,
A multilayer inductor, wherein a magnetic layer is disposed on surfaces of the coil conductors facing each other with the nonmagnetic layer interposed therebetween. A magnetic layer is disposed around the coil conductor so as to cover the entire outer peripheral surface of the coil conductor, including the surfaces of the coil conductor that are opposed to each other through the nonmagnetic layer. The multilayer inductor according to claim 1, wherein: 3. The multilayer inductor according to claim 1, wherein the magnetic layer is made of a metal mainly composed of Ni. 4. The magnetic material layer according to claim 1, wherein the magnetic material layer is formed by simultaneously firing a magnetic material paste containing Ni as a main component together with the non-magnetic material layer and the coil conductor pattern. The multilayer inductor according to any one of the above. 4. The multilayer inductor according to claim 1, wherein the magnetic layer is made of a plated metal formed by plating a metal containing Ni as a main component. 6. The multilayer inductor according to claim 1, wherein the non-magnetic layer is made of a low dielectric constant glass. A multilayer type comprising a coil formed by interlayer connection of the coil conductors in a multilayer body having a plurality of nonmagnetic layers and a plurality of coil conductors stacked via the nonmagnetic layers. An inductor manufacturing method comprising:
A first magnetic pattern made of a magnetic paste is formed on a non-magnetic green sheet, a coil conductor pattern made of a conductor paste is formed on the first magnetic pattern, and a magnetic pattern is formed on the coil conductor pattern. Forming a green laminate by laminating a patterned green sheet on which a second magnetic material pattern made of a body paste is formed;
And a step of firing the green laminate. A method of manufacturing a multilayer inductor, comprising: A multilayer type comprising a coil formed by interlayer connection of the coil conductors in a multilayer body having a plurality of nonmagnetic layers and a plurality of coil conductors stacked via the nonmagnetic layers. An inductor manufacturing method comprising:
A plurality of non-magnetic layers and a plurality of coil conductors stacked via the non-magnetic layers are provided, and the coil conductors are connected to each other to form a fired stacked body in which coils are formed. And a process of
Forming a magnetic layer made of a magnetic metal plating film on the surface of the coil conductor by immersing the fired laminated body in a plating solution containing a magnetic metal material and performing plating. A method for manufacturing a multilayer inductor, comprising:

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