WO2011039009A3 - Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre - Google Patents
Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre Download PDFInfo
- Publication number
- WO2011039009A3 WO2011039009A3 PCT/EP2010/062501 EP2010062501W WO2011039009A3 WO 2011039009 A3 WO2011039009 A3 WO 2011039009A3 EP 2010062501 W EP2010062501 W EP 2010062501W WO 2011039009 A3 WO2011039009 A3 WO 2011039009A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrochemical coating
- substrate
- particles
- brush plating
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/499,398 US20120247966A1 (en) | 2009-09-30 | 2010-08-26 | Method for electrochemical coating of a substrate by means of brush plating and device for carrying out said method |
| EP10754293A EP2483455A2 (fr) | 2009-09-30 | 2010-08-26 | Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre |
| CN201080054284.2A CN102639757B (zh) | 2009-09-30 | 2010-08-26 | 通过刷镀以电化学方式涂覆衬底的方法以及实施该方法的装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009048669A DE102009048669A1 (de) | 2009-09-30 | 2009-09-30 | Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens |
| DE102009048669.0 | 2009-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2011039009A2 WO2011039009A2 (fr) | 2011-04-07 |
| WO2011039009A3 true WO2011039009A3 (fr) | 2011-06-16 |
Family
ID=43662054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2010/062501 Ceased WO2011039009A2 (fr) | 2009-09-30 | 2010-08-26 | Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20120247966A1 (fr) |
| EP (1) | EP2483455A2 (fr) |
| CN (1) | CN102639757B (fr) |
| DE (1) | DE102009048669A1 (fr) |
| WO (1) | WO2011039009A2 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015006414A1 (fr) | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Géométrie de test de traction |
| TWM522954U (zh) * | 2015-12-03 | 2016-06-01 | 財團法人工業技術研究院 | 電沉積設備 |
| DE102017201020A1 (de) | 2017-01-23 | 2018-07-26 | Siemens Aktiengesellschaft | Verfahren zum Beschichten eines Kontaktbauteils und Kontaktbauteil, Vakuumschaltröhre und Schaltanlage |
| DE102017214334A1 (de) | 2017-08-17 | 2019-02-21 | Technische Universität Dresden | Multi-Material-Verbund und Verfahren zu dessen Herstellung |
| CN108103560A (zh) * | 2018-02-05 | 2018-06-01 | 深圳市瑞世兴科技有限公司 | 一种金属电镀细化器 |
| CN109402689B (zh) * | 2018-12-25 | 2020-12-01 | 广东电网有限责任公司 | 一种电刷镀笔和电刷镀层的制备方法 |
| CN113913885B (zh) * | 2021-11-09 | 2023-07-11 | 中冶赛迪技术研究中心有限公司 | 圆柱面的纳米复合电刷镀工艺 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5225059A (en) * | 1992-08-03 | 1993-07-06 | W. R. Associates | Apparatus for single anode brush electroplating |
| US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
| US20030234181A1 (en) * | 2002-06-25 | 2003-12-25 | Gino Palumbo | Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| WO2007073339A1 (fr) * | 2005-12-22 | 2007-06-28 | Abb Technology Ltd. | Dispositif et procede de placage metallique |
| DE102008019864B3 (de) * | 2008-04-16 | 2009-09-24 | Siemens Aktiengesellschaft | Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE7701371L (sv) * | 1977-02-08 | 1978-08-09 | Loqvist Kaj Ragnar | Pletering av hal |
| US4304654A (en) * | 1980-10-24 | 1981-12-08 | Sifco Industries, Inc. | Apparatus for electroplating |
| CN87100440B (zh) * | 1987-01-27 | 1988-05-11 | 中国人民解放军装甲兵工程学院 | 在不导电材料上刷镀铜的方法 |
| JPH01301897A (ja) | 1988-05-31 | 1989-12-06 | Sumitomo Metal Ind Ltd | 複合めっき方法 |
| US6328872B1 (en) * | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
| DE10125290B4 (de) | 2001-05-15 | 2005-04-14 | Siemens Ag | Verfahren zum Aufbereiten von Nano-Dispersanten |
| DE10125289B4 (de) | 2001-05-15 | 2005-04-07 | Siemens Ag | Verfahren zum Herstellen einer abriebfesten, galvanischen Schicht auf Teilen |
| DE102004030523A1 (de) | 2004-06-18 | 2006-01-12 | Siemens Ag | Transportsystem für Nanopartikel und Verfahren zu dessen Betrieb |
| US7651766B2 (en) | 2005-05-20 | 2010-01-26 | University Of Central Florida Research Foundation, Inc. | Carbon nanotube reinforced metal composites |
| WO2008101550A1 (fr) * | 2007-02-20 | 2008-08-28 | Siemens Aktiengesellschaft | Cylindre et/ou rouleau et procédé de production d'un cylindre et/ou d'un rouleau |
| US9005420B2 (en) * | 2007-12-20 | 2015-04-14 | Integran Technologies Inc. | Variable property electrodepositing of metallic structures |
-
2009
- 2009-09-30 DE DE102009048669A patent/DE102009048669A1/de not_active Withdrawn
-
2010
- 2010-08-26 EP EP10754293A patent/EP2483455A2/fr not_active Withdrawn
- 2010-08-26 US US13/499,398 patent/US20120247966A1/en not_active Abandoned
- 2010-08-26 CN CN201080054284.2A patent/CN102639757B/zh not_active Expired - Fee Related
- 2010-08-26 WO PCT/EP2010/062501 patent/WO2011039009A2/fr not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5225059A (en) * | 1992-08-03 | 1993-07-06 | W. R. Associates | Apparatus for single anode brush electroplating |
| US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
| US20030234181A1 (en) * | 2002-06-25 | 2003-12-25 | Gino Palumbo | Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube |
| WO2007073339A1 (fr) * | 2005-12-22 | 2007-06-28 | Abb Technology Ltd. | Dispositif et procede de placage metallique |
| DE102008019864B3 (de) * | 2008-04-16 | 2009-09-24 | Siemens Aktiengesellschaft | Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens |
Non-Patent Citations (1)
| Title |
|---|
| PREPARING STABLE AND DISPERSED COMPOSITE PLATING SOLUTION USED FOR CARBON NANOTUBE ELECTRO BRUSH PLATING: "Preparing stable and dispersed composite plating solution used for carbon nanotube electro brush plating", WPI / THOMSON,, vol. 2006, no. 39, 18 January 2006 (2006-01-18), XP002550716 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102639757A (zh) | 2012-08-15 |
| CN102639757B (zh) | 2014-11-26 |
| EP2483455A2 (fr) | 2012-08-08 |
| WO2011039009A2 (fr) | 2011-04-07 |
| US20120247966A1 (en) | 2012-10-04 |
| DE102009048669A1 (de) | 2011-03-31 |
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