WO2011032553A1 - Method and separating system having a device for separatively processing crystalline materials and use thereof - Google Patents

Abstract

The invention relates to a device and a method for separatively processing crystalline materials (W) such as silicon materials, in particular for machining silicon materials and the like, by means of at least one separating tool (2) designed as a circumferentially diamond-coated, endless saw wire, comprising the following steps: endlessly circulating the separating tool (2) in an endless loop and moving the circulating separating tool (2) in a separating motion relative to the material (W) in order to separatively process the material (W), wherein the endlessly circulating motion is performed at a circumferential speed in a range of greater than or equal to 500 meters per minute to less than or equal to 7,500 meters per minute, preferably in a range of greater than or equal to 750 meters per minute to less than or equal to 6,000 meters per minute, and further preferably in a range of greater than or equal to 1,000 meters per minute to less than or equal to 5,000 meters per minute.

Description

 Method and separation system with apparatus for separating processing of crystalline

 Materials and their use

The invention relates to a method for separating processing of crystalline materials, such as monocrystalline or polycrystalline materials, in particular for machining silicon materials and the like, according to the preamble of claim 1.

Furthermore, the invention relates to a device for separating processing of crystalline materials, such as monocrystalline or polycrystalline materials, in particular for machining silicon materials and the like, according to the preamble of claim 7.

In addition, the invention relates to a separation system for separating processing of crystalline materials, such as monocrystalline or polycrystalline materials, in particular for machining silicon materials and the like, according to the preamble of claim 15.

Furthermore, the invention relates to a use of a device for separating processing of crystalline materials, such as monocrystalline or polycrystalline materials, in particular for machining silicon materials and the like, and / or a separation system for separating processing of crystalline materials such as silicon materials, in particular for machining silicon materials , Ingots and the like, according to claim 17.

Methods and apparatus for separating silicon ingots or so-called ingots are well known. For example, wire sawing is known. Wire saws are used, for example, for producing wafers for the photovoltaic and semiconductor industries. This is a mechanical separation of materials, such as silicon, which also as Trennläppverfahren or lapping with unbound cutting grain and undirected Cutting edge is called. In this case, a finite wire is unwound via wire feed rollers and with a defined wire speed and wound on a take-up reel via a supply reel.

Other methods and / or devices use, for example, so-called wet cutting methods, in which an additive, such as a coolant or a lubricant, is used during cutting. The known solutions use diamond tools, ie diamond-coated tools, for example a finite diamond wire or a diamond saw band. In sawing ingots, for example, a diamond wire is unwound from a winding roll at a predetermined speed and wound up by another winding roll. During the winding process, the diamond wire passes through the silicon material to be processed in a cutting process and cuts it accordingly. To carry out the cutting treatment, a coolant is added at the contact point of the tool and material to reduce heat development and thus to maintain a required quality of a piece of silicon to be separated. After unwinding the tool another winding roll with diamond wire is provided, which is unwound or rewound for further separation. Depending on the size of the material to be processed, several winding rolls of diamond wire are required. Also known is the use of band saws with diamond-coated bands, in which case the separation takes place wet, that is, using coolants. Due to the associated with the band friction is a dry separation is not feasible.

From DE 197 29 578 B4 a wire saw for separating a plurality of slices of a workpiece, with rotatably mounted wire guide rollers around which a saw wire is wound known, wherein two adjacent wire guide rollers define a wire gate having a certain width, and the Wire saw has at least one drive, by means of which the wire guide rollers are set in rotation, and a wire guide roller limiting the wire gate is supported on an elongate support, which is connected at one end to a machine frame and has an opposite, free-floating end, wherein the carrier the wire guide roller is guided in the longitudinal direction thereof and forms a stationary unit with the machine frame, and a wire guide roller defining the wire gate is formed as a sleeve, and the sleeve is seated on a carrier roller, and the wire guide roller at least one Associated with thrust bearing, which causes an axial center of the wire guide roller is not or only slightly shifted in an axial extension of the wire guide roller due to heat. In such a wire saw, a finite wire is wound from a supply reel onto a take-up reel. Usually, the cutting grain, which according to the prior art is formed as silicon carbide, is present in the added additive, the so-called "slurry." According to DE 197 29 578 B4, a wire with bonded cutting grain can also be used in such methods are 10 meters per minute to a maximum of 30 meters per minute.

From DE 600 22 921 T2 a wire sawing device for cutting or cutting a hard, brittle material is known which comprises an abrasive wire comprising: a core wire; abrasive grains provided around the core wire; and a bonding layer formed on the core wire for bonding the abrasive grains to the core wire, the bonding layer being cured by a light-drying or curing process Light-curing resin or synthetic resin is formed. The wire sawing device also has a finite wire which is wound up or unwound. Even with this device only limited wire speeds are feasible. DE 600 22 921 T2 mentions a cutting speed of 300 meters per minute. Overlying cutting speeds are not performed.

From DE 199 58 414 AI a device for simultaneous separation of a plurality of slices of a brittle-hard workpiece is known, having a longitudinal axis with a wire gate of saw wire with a feed device having a translational, directed perpendicular to the longitudinal axis of the workpiece relative movement between the workpiece and the wire gate of the wire saw, in the course of which the workpiece is passed through the wire gate, wherein the wire gate is formed of a plurality of individual wires and that means for holding and rotating the workpiece is provided about the longitudinal axis. This device also has a finite wire which is wound up or unwound. A maximum achievable peripheral speed is given up to 30 meters per second, which is realized by rotation of the workpiece and wire speed. A pure maximum wire speed is not specified. From DE 197 34 243 AI a band saw for separating discs from a workpiece, known comprising a circulating over a roller system saw band, which has a band back and the band back opposite, provided with cutting edge cutting edge, and a feed system, the relative movement between the workpiece and cutting edge causes, wherein the saw blade penetrates into the workpiece to form a separating gap, wherein a support disc which supports the band back and is held by a holding device, is provided. Furthermore, a method for separating slices from a workpiece with this band saw is known, wherein a part of the support disk adjacent to the band back penetrates into the separating gap. As a parting tool here a band is used instead of a wire. A separation is possible only in one cutting direction.

It is an object of the present invention to provide a method, an apparatus, a separation system and a use of a device and / or a separation system in which an effective separation is realized also in several cutting directions, without reducing a separation quality.

These and other objects are achieved by a method according to claim 1, an apparatus according to claim 7, a separation system according to claim 15 and a use according to claim 17.

Advantageous developments of the invention are indicated in the dependent claims or are given below in connection with the description of the figures.

The invention includes the technical teaching that, in a method for separating processing of crystalline materials such as monocrystalline or polycrystalline materials, in particular for machining silicon materials and the like, with at least one cutting wire designed as a circumferentially diamond-coated endless saw wire, the steps are: endlessly circulating the parting tool in an endless loop and separating the circulating parting tool relative to the material for machining the material, the endless circulating moving at a peripheral speed ranging from greater than or equal to 500 meters per minute to less than or equal to 7,500 meters per minute, preferably in a range of greater than or equal to 750 meters per minute to less than or equal to 6,000 meters per minute and more preferably in a range of greater than or equal to 1,000 meters per minute to less than or equal to 5,000 meters per minute. With these high speeds, a self-cooling and self-cleaning of the endless rotating diamond wire is effected.

In one embodiment of the invention, the process is carried out dry, that is to say without the use and / or addition of additives, such as coolants and / or lubricants. In another embodiment, the method is wet, that is carried out with use and / or with the supply of additives such as coolants and / or lubricants. Sawing takes place at a constant rotational speed. The wire constantly rotates in a direction of rotation. In another embodiment, the direction of rotation is reversible. In a further embodiment, the sawing takes place with a changed circulation speed and / or a variable direction of rotation.

Silicon blocks and other crystalline materials, including monosilicon and polysilicon, are machined for industrial use to provide, for example, silicon wafers or the like as wafers or for solar modules. In other applications, silicon ingots or silicon rod materials are molded and / or their ends machined, for example, their tips are ground. This is done by means of rotating tools, especially at high speeds, for example in a range of about 100 to about 10,000 revolutions per minute, preferably in a range of about 500 to 8,000 revolutions per minute, and most preferably in a range of about 1,000 to 4,000 revolutions per minute. The agitation is performed in other embodiments at high speeds in a range of about 100 to about 10,000 meters per minute, preferably in a range of about 500 to 8,000 meters per minute, and most preferably in a range of about 1,000 to 5,000 meters per minute , Due to the high speeds, no cooling of the tool or of the material is required at the contact area, since a self-cooling is carried out by the high speeds. In addition, only low cutting forces act on the material, so that in the contact area of the cutting tool and material only a small friction occurs with correspondingly low frictional heat. In addition, for example, in the case of separation by means of an endless wire which rotates permanently, if there is sufficient length, there is sufficient time for one point of the wire to cool down to a next contact. Due to the high speed and the corresponding time duration, cooling of the contacting wire section takes place. Depending on the length of the wire and the endless wire loop formed therefrom, different maximum speeds can be achieved. In particular, let realize higher speeds with an endless wire loop than with a finite wire.

In one embodiment of the present invention, the method is carried out several times in succession and / or in parallel. Thus, for example, an end machining is carried out with the method and parallel cutting. The separation movement of the rotating tool relative to the material is carried out in one embodiment by moving the tool relative to a solid material. In another embodiment, the tool is held stationary and the material is moved relative thereto. In yet another embodiment, the tool and material are moved. The movement is performed, for example, CNC-controlled and controlled by programmable logic controller. For carrying out the method, the material is clamped on a corresponding material holder. In one embodiment, multiple material holders are provided so that multiple materials are held simultaneously. In other embodiments, the materials are automatically fed and clamped. The tool is moved at such a high speed that a self-cleaning process and / or a self-cooling process due to the speed is effected. In addition, due to the high speed, heat generation at the contact point between tool and material is reduced. As a parting tool, a diamond wire is used in one embodiment. This has, for example, compared to a diamond strip, which differs significantly in geometry, in particular the width, less contact with the material to be processed, such as a blank, a workpiece, a material, a semi-finished product or an ingot on. The contact is kept as low as possible, in addition to a wet process to make a dry process possible, in particular to realize low cutting forces and / or low friction with correspondingly low frictional heat. The contact is in particular formed as a line contact, preferably as a point contact. This is realized in particular by an additional pivotal movement of the material and / or of the tool, for example in the manner of a tumbling or pendulum motion. The cutting tool is designed in particular as a cutting tool.

In one embodiment of the present invention it is provided that the circulating movement is carried out as an endless rotation about at least one axis. In order to realize a high intrinsic speed of the separating tool, the separating tool is rotated about at least one axis. In other embodiments, a movement is performed around several axes, so that a kind of wobbling motion is realized. In one embodiment, a endless diamond wire loop rotates around corresponding rollers. For this purpose, the diamond wire is guided by at least two rollers and tensioned accordingly. The two rollers are rotated, whereby the diamond wire is co-rotated and performs a continuous rotation. Several rollers can be provided so that a longer diamond wire loop can be used. In addition, the diamond wire can be deflected by means of deflection rollers, which also means an endless rotation within the meaning of the invention, since the wire runs endlessly along these guide rollers. In addition, in other embodiments of the present invention support and / or tension rollers are provided. The rollers are adjustable and / or elastically mounted in one embodiment. One or more rollers preferably have one or more guide groove (s) or guide groove (s). For an endless circulating or endless rotation, it is provided that a circumferential wire loop is stretched to perform a separating processing. In one embodiment, therefore, the step of clamping the tool is included. The rollers around which the wire loop revolves can be moved or moved accordingly, so that the tool, or more precisely the wire loop, is tensioned. In other embodiments, a plurality of separating tools are provided, which are moved accordingly. For controlled separating processing, the separating tools are guided in other embodiments, so that no separation or the like occurs during separation. For example, a wire loop - or a wire ring or wire endless belt - is guided in a guide groove or the like. Multiple wire loops are circumferentially moved or rotated parallel to one another in other embodiments.

Yet other embodiments contemplate an abrasive tool such as a grinding wheel or a grinding cylinder as an additional parting tool. In particular, a plurality of separating tools are provided, for example two grinding cylinders, which form a grinding gap at a distance from each other, in which, for example, an end machining is performed. The grinding wheels are also rotated at a correspondingly high speed. The rotation takes place about a rotation axis, which is preferably formed centrically to the grinding body. Further rotation is effected in advantageous embodiments about an axis of rotation arranged eccentrically to the grinding body. The axis of rotation is preferably arranged with the use of a plurality of abrasive bodies centric to the grinding wheels. Grinding body and diamond wire saw are integrated in one embodiment integrated in a system, so that both a separation and a cutting on a plant or machine is executable. A further embodiment of the present invention provides that the separating movement comprises at least one translational movement along at least one axis and / or at least one pivotal movement about at least one axis. The separation movement takes place by moving the material to the tool or the tool to the material or both material and tool relative to each other. This is preferably done CNC-controlled. The movement is preferably along and / or around several axes, so that any separating processing can be realized. In this way, instead of simply cutting slices, that is to say cutting in a cutting plane, it is also possible to make cuts along different planes so that contours can also be generated.

In one embodiment of the present invention, it is contemplated that a separation movement comprises a feed motion at a speed in a range of greater than or equal to 5 millimeters per minute to less than or equal to 100 millimeters per minute, preferably within a range greater than or equal to 10 millimeters per minute to less equal to 75 millimeters per minute and more preferably in a range greater than or equal to 15 millimeters per minute to less than or equal to 50 millimeters per minute. The feed movement takes place by means of translation and / or rotation of the tool and / or the material. A corresponding control for coordinating the movement is provided. In other embodiments, other speeds are feasible.

In another embodiment of the present invention, it is provided that the endlessly circulating movement comprises the revolving rotation of at least one endless diamond wire, in particular of a plurality of diamond wires. The diamond wire is designed as an endless loop and rotates a plurality of rollers, in particular a drive roller and a guide roller. In this way, the endless diamond wire is rotated around the rollers and their axes. In other embodiments, further rollers are provided around which the endless diamond wire is guided. These are for example designed for clamping or further deflection, so that the diamond wire correspondingly rotates about a plurality of axes and rotates about these axes in the sense of this invention. The axes of the individual deflection rollers are pivotable in an exemplary embodiment about a further common pivot axis. Preferably, the common pivot axis is formed parallel to the axes of the pulleys. In this way, in addition to the rotation about the axes of the rollers, the diamond wire is moved about the pivot axis so that the wire makes a pivotal movement in addition to the rotation. The axes can be arranged parallel and / or angled, wherein a parallel arrangement is preferred. In a further embodiment of the present invention, it is provided that during separation at least one additive, in particular a coolant and / or a lubricant, is supplied into the contact area of saw wire and material. The additive is liquid in one embodiment. In another embodiment, the additive is gaseous. In yet another embodiment, the additive is solid. In further embodiments, the additive has liquid and / or solid and / or gaseous constituents.

Yet another embodiment of the present invention provides that the severed portions of the material are aspirated. The parts or shavings of the material resulting from the cutting process are sucked off as waste during dry processing. For this purpose, aerodynamically designed suction tubes are provided, which suck the chips adapted to their trajectory when separating. Preferably, the chips are sucked off at several points. In particular, the chips are sucked off in a running direction of the tool in the region of a contact with the material. The suction is in addition to a spreading of the chips due to the rotating cutting tool. With the movement of the cutting tool, chips of material are moved away from the material. These wegbewegten material chips are further removed by suction.

The technical teaching of the invention further provides that in a device for separating processing of crystalline materials such as monocrystalline or polycrystalline materials, in particular for machining silicon materials and the like, it is provided that means for carrying out the method according to the invention are provided.

In a device according to the invention for the separating processing of crystalline materials, such as monocrystalline or polycrystalline materials, in particular for the machining of silicon materials and the like, diamond-coated cutting tool is provided. The cutting tool comprises at least one circumferentially movable, circumferentially diamond-coated saw wire and at least one movement device for carrying out a separating movement of the rotating cutting tool relative to the material for the cutting treatment of the material. The saw wire has any cross section, in particular a circular, an oval, a square, a rectangular, a trapezoidal or a polygonal cross section. Peripheral, that is along a contour of the cross section, is the Saw wire diamond coated. In one embodiment, the diamond wire is formed bondierungsfrei. The cross section is preferably formed to be constant over the length of the saw wire, but in individual embodiments may also have different cross sections over the length. The diamond wire is designed as an endless loop.

In one embodiment of the present invention, it is provided that at least one saw wire, which is designed as an endless diamond-coated saw wire and is designed as an endless loop, is provided as a parting tool which is rotated in an endless loop by means of a drive device which has at least two deflection rollers. In other embodiments, a plurality of saw wires are provided. The multiple saw wires are preferably aligned parallel to each other and / or arranged. In other embodiments, angled arrangements are provided. Preferably, the multiple wires rotate in the same direction. In one embodiment, the plurality of wires rotate in different directions, for example oppositely. In another embodiment, the diamond wires are opposed so that they form a nip in which, for example, one material can be machined simultaneously from two or more sides. The diamond wire is coated circumferentially. This gives the possibility to saw contours.

Therefore, in one embodiment it is provided that at least one movement device is provided in order to effect a separation movement of the rotating separation tool relative to the material and / or conversely for the separating processing of the material. The movement device is multiaxial in one embodiment, so that a movement in more than one direction can be realized. In this case, in one embodiment, the movement device is designed such that a movement by means of translation and / or rotation is feasible. For this purpose, linear and / or swivel or pendulum drives are provided.

In a further embodiment of the present invention it is provided that the device is designed as a dry separation device additive Zuführungsvorrichtungsfrei in order to carry out the separating processing dry, that is without the supply of an additive such as coolant and / or lubricant.

In one embodiment, the device is correspondingly designed coolant-free, that is, there are no devices or devices for supplying and / or discharge of coolant, lubricant and the like, at least in the area of the separating engagement of the tool in the Material provided. Cooling takes place by means of the tool, which rotates permanently at high speeds, and / or the small contact surface between the material and the tool, which is determined by the geometry of the tool, preferably linear and more preferably punctiform. The diamond cutting tool is formed circumferentially movable, that is, a certain point of the cutting tool is in multiple circulation even in multiple disengaging engagement with the material, as the tool rotates several times past the tool. In another embodiment, cooling is provided.

Accordingly, an embodiment of the present invention provides that the device comprises a Zusatzzuführvorrichtung to perform the separating processing wet, that is, with the supply of an additive such as coolant and / or lubricant, perform. The Zusatzmittelzuführvorrichtung is formed material close in one embodiment. That is, a cooling or additive supply takes place directly on the material, more precisely in the contact area of cutting tool and material. In another embodiment, the Zusatzmittelzuführvorrichtung is formed remotely material. Here is an additive supply away from the material. For example, the rotating diamond wire is cooled and / or lubricated away from the material.

A further embodiment of the present invention provides that the movement device comprises a feed unit and / or a pivoting unit and is thus designed as a multiple movement device to perform at least one translational movement along at least one axis and / or at least one pivotal movement about at least one axis. The material and / or the cutting tool is thus translationally and / or rotationally movable in several directions.

Yet another embodiment provides that the pivoting device comprises a separating tool pendulum unit for oscillatingly moving the separating tool during the separating operation. In this way, a contact area between material and diamond wire can be minimized, whereby low cutting forces can be realized. By a swinging engagement of a diamond wire in the material, for example, a quasi punctiform contact area on the material can be realized. Combined with the high rotational speed of the diamond wire, high feed rates, for example from about 5 millimeters per minute to about 50 millimeters per minute, can be achieved at high quality. Depending on the cutting height of the workpiece to be cut, the feed rate is thus adjustable. Preference is given to a cutting height of about 20 Millimeters at a feed rate of about 50 millimeters per minute cut. In this way, a high throughput can be realized. In other embodiments, other feed rates and / or other cutting heights are provided.

The device is designed in particular for the separating processing of monocrystalline and / or polycrystalline materials or materials, in particular silicon and the like. The materials are workable in any form. It can be both round and square materials, such as cylindrical or cuboid materials edit. In addition to the endlessly movable, that is to say movable in at least one direction of rotation, diamond cutting tool, the device comprises at least one movement device with which a relative movement of the tool is performed to the material. The movement device is designed as a uniaxial movement device and / or as a multi-axis movement device. In one embodiment, the moving means moves the material relative to the tool. In another embodiment, the moving means moves the tool relative to the material. In yet another embodiment, the moving means moves the tool and the material simultaneously. Accordingly, the movement device has corresponding movement mechanisms such as linear motors, slides and the like. The movement device can be executed as a translatory and / or rotary movement device. That is, the movement device is designed for translational and / or rotational movements of the material and / or the tool, both along and / or about an axis or along and / or around several axes.

About the movement device any separating processing steps for a variety of forms executable. Preferably, the movement device is CNC-controlled, for example via a programmable logic controller or a PLC control. Suitable cutting tools are, for example, wire tools or the like, that is, cutting tools that realize the smallest possible contact area when separating with the material. Band tools such as band saws are unsuitable for this because they have too large a contact surface when separating with the material and cooling would be required. Other additionally suitable cutting tools are grinding wheels, for example grinding wheels or grinding cylinders. The grinding wheels are designed for the smallest possible, preferably linear, and particularly preferred for a point, contact. They can be arranged to adjust a grinding gap accordingly. In a further embodiment of the present invention it is provided that the separating tool comprises at least one endless diamond wire loop. By executing the diamond cutting tool as an endless loop, an endless circulating movement of the diamond cutting tool is easily possible. The diamond cutting tool in one embodiment comprises a single endless loop. In other embodiments, the diamond cutting tool comprises a plurality of endless loops, for example two, three, four, five or even more endless loops, which are preferably arranged in parallel. The endless loops are spaced apart via corresponding guide units, for example via grooves on drive and / or deflection rollers, preferably spaced one behind the other in an axial direction of the rollers. The distance is variable via corresponding components or arrangements of the rollers. Preferably, the diamond cutting tools are controllable via a common drive. In other embodiments, at least two drives are provided for driving. Preferably, a plurality of diamond wires are driven via a common shaft. The diamond wires are arranged in one embodiment on different sized rollers. The rollers in one embodiment have a groove for a diamond wire loop. In other embodiments, a roll has multiple grooves for multiple diamond wire loops. In addition to the deflection rollers supporting rollers, additional rollers and / or tension rollers are provided in one embodiment of the invention. These other roles such as support roller, additional role and / or tension roller have in one embodiment, at least one groove or groove. About the other roles of the rotating wire is corresponding support and / or tensioned, especially in the field of engagement in the material. In another embodiment of the present invention, it is provided that the device is formed without support rollers and / or without additional rollers, in particular in the engagement region of the wire with the workpiece.

In one embodiment, the endless diamond wire loop has a length in a range of about 1 to about 2,500 meters. Preferably, in one embodiment, the length is about 3 to 4 meters, for example 3.656 meters. Depending on the diameter and material of the wire any lengths can be realized. Preferably, a diameter of the wire is between about 0.1 millimeters and 0.9 millimeters. However, in other embodiments, smaller or larger diameters are realized.

In another preferred embodiment of the invention it is provided that the diamond cutting tool comprises at least one diamond-coated grinding wheel. The abrasive body is arbitrarily shaped, for example as a grinding wheel, as a grinding cylinder, as Abrasive truncated cone or the like. Preferably, a plurality of abrasive bodies are provided. The grinding wheels are of the same design in a preferred embodiment, in other embodiments also differently formed. Preferably, at least two spaced apart abrasive bodies are provided, which form a grinding gap for the separating processing of the material introduced into the grinding gap between them.

The grinding wheels are particularly suitable for finishing a material. For a cutting treatment of the material, the grinding wheels are rotatable about corresponding axes, so that the grinding wheels perform an endless rotating rotating movement. The axes of the grinding bodies are preferably formed parallel to one another. In other embodiments, angular arrangements are provided. About the shape of the abrasive article and / or the arrangement of the axes of a shape of the grinding gap is definable, which in turn specifies a separating processing of the material. For example, a cone-shaped material can be produced via a cone-shaped gap. In other embodiments, other gap shapes are provided. The grinding wheels are rotatable about a preferably central axis of the grinding body. In addition, in one embodiment, a plurality of grinding wheels are rotatable about a common, centrally arranged axis of rotation. In this way, each grinding wheel performs a rotation about its own centric axis. In addition, all the abrasive bodies perform a common rotation about a central, but eccentric to the individual grinding bodies arranged common axis of rotation. In particular, it is provided in one embodiment that the movement device is designed in the manner of a planetary gear. The abrasive bodies are arranged in one embodiment with their end faces in a plane. Both the end faces and the circumferential or circumferential surfaces of the grinding wheels are diamond coated. In other embodiments, a plurality of abrasive bodies are executed in succession, wherein at least two abrasive bodies are arranged in pairs forming a grinding gap in a plane. In one embodiment, diamond wire severing tool and abrasive grinder cutting tool are integrally disposed on a plant to realize multiple machining of material.

In a further embodiment of the present invention it is thus provided that a drive device for driving, in particular for rotating, the diamond cutting tool is provided. In order to move the diamond cutting tool circumferentially, a corresponding drive means is provided. In one embodiment, this comprises at least one drive roller and at least one deflection roller in order to circulate an endless wire loop in a corresponding manner. About the drive roller, the wire loop is driven. About one or several pulleys, the wire loop is deflected. In addition, in one embodiment tensioning rollers are provided for tensioning the wire loop. For several wire loops a plurality of drive, deflection and / or tension rollers are provided accordingly. The rollers have corresponding grooves or grooves for guiding the wire loop. In addition, further guides can be provided on the drive device. By increasing the number of pulleys a longer wire loop can be used.

For driving the deflection or drive rollers corresponding drive units are provided. These cooperate with the pulleys such that speeds of revolution or wire speeds in a range of greater than or equal to 500 meters per minute to less than or equal to 7,500 meters per minute, preferably in a range of greater than or equal to 750 meters per minute to less than or equal to 6,000 meters per minute preferably in a range of greater than or equal to 1,000 meters per minute to less than or equal to 5,000 meters per minute are feasible. The drive unit in particular comprises a motor such as an electric motor. This is coupled via a clutch and / or a gear with the pulleys or directly with these. In one embodiment, several motors are provided. The motors are designed for appropriate speeds.

In yet another embodiment of the present invention, it is provided that the movement device is designed as a multiple movement device in order to perform at least one translational movement along at least one axis and / or at least one pivotal movement about at least one axis. For this purpose, the movement device has a plurality of axes of movement, via which at least one translatory and / or at least one rotary movement can be realized. The movement device preferably allows a movement about and / or along several axes. Thus, for example, during the separation an additional pivotal movement of the cutting tool relative to the material to be machined executed, so that a quasi-point contact point between the tool and material is realized. The tool executes a pendulum or wobble motion.

In another embodiment of the present invention, it is provided that a plurality of separating tools are provided. The diamond cutting tools are designed differently in one embodiment and / or provided on different areas. So points in one Embodiment, an apparatus comprises a diamond wire tool and a diamond abrasive tool. The two different tools are arranged at a distance from each other, so that a parallel processing takes place at two or, depending on the number of tools in several places. The tools can be controlled individually or jointly.

Yet another embodiment of the present invention provides that a suction device is provided to suck off parts of the separated material. In dry processing, a suction device is preferably provided, since no cooling or binding agent is provided for the separated chips. The suction device is aerodynamically adapted to a trajectory of the separated chips. Preferably, a diamond wire extends at least partially through a suction channel of the suction device.

Furthermore, the technical teaching of the present invention includes that in a separation system for separating processing of crystalline materials, such as monocrystalline or polycrystalline materials, in particular for machining silicon materials and the like, with a diamond-coated cutting tool, at least one device according to the invention is provided. The separation system is formed in one embodiment as a CNC machine. At different points are preferably different devices that can be designed differently to realize a multiple processing. A device is preferably designed as a diamond wire cutting tool with an endless rotating diamond wire. Another device is preferably formed as a diamond grinding tool having two grinding bodies forming a grinding gap which rotate about themselves and a common axis of rotation.

Accordingly, it is provided in a further embodiment of the present invention that the separation system is designed for a simultaneous processing of a plurality of materials and / or a material at a plurality of sections. This can be done via a common drive, multiple drives, a common control and / or multiple controls.

Accordingly, the technical teaching of the present invention further includes that a

Use of a device according to the invention and / or a device according to the invention

Separating system for separating processing of crystalline materials such as silicon materials, in particular for machining silicon materials, ingots and the like Production of silicon wafers or silicon parts is provided for solar modules. The use goes beyond the mere cutting of slices. Rather, also end machining, contours sawing and the like.

Further, measures improving the invention are specified in the subclaims or will become apparent from the following description of at least one embodiment of the invention, which is shown schematically in the figures. All of the claims, the description or the drawings resulting features and / or advantages, including design details, spatial arrangement and method steps may be essential to the invention both in itself and in various combinations.

The figures show the following:

1 shows a schematic side view of an embodiment of a device,

Fig. 2 shows a schematic side view of a further embodiment of the device and

Fig. 3 shows in a perspective view schematically a separation system with two devices.

Fig. 1 shows a schematic side view of an embodiment of a device 1. The device 1 is designed to carry out the method according to the invention and comprises a circumferentially diamond-coated wire, also called diamond wire, trained tool 2. More specifically, the diamond wire as endlessly rotating diamond wire or as Wire loop or wire ring formed. The tool 2, more precisely the diamond wire, runs around several rollers 3. The diamond wire is driven by a drive roller 3a. The drive roller 3a is disposed in an upper part of the device 1. About a corresponding guide the diamond wire is guided on the drive roller 3a. In the present embodiment, the guide comprises a groove in which the diamond wire runs around the circumference of the drive roller 3a. For a drive, the groove is formed of a suitable material, which forms a suitable friction pair with the diamond wire, so that an optimized drive of the diamond wire by the drive roller 3a he follows. The drive roller 3a rotates about an axis of rotation A, as shown by the arrow at A on the drive roller 3a.

At the lower part of the device 1, a deflection roller 3b is provided, around which the diamond wire rotates. The guide roller 3b is formed similarly to the drive roller 3a, that is, it has a similar diameter, a similar guide and a similar material as the drive roller 3a. The deflection roller 3b also rotates about a rotation axis A, as indicated by the corresponding arrow at A, so that the diamond wire rotates circumferentially about the two rollers 3a, 3b. The diamond wire itself is formed as an endless belt and thus suitable for endless circulation around the rollers 3. For different purposes, embodiments of the diamond wire and the like, further rollers 3c-3f are provided. The further rollers 3c-3f are arranged between the other two rollers 3a, 3b and are designed as deflection rollers and / or tension rollers, which all rotate about their own axis of rotation. For special applications, the diamond wire also rotates around these rollers 3c-3f.

The diamond wire preferably rotates the rollers 3 at a wire speed of about 3,000 to 4,000 meters per minute. A preferred perimeter of the endless wire loop is in a range of about 1 to 2,500 meters, more preferably about 3 to 4 meters, for example, 3,656 meters. A preferred diameter of the diamond wire is about 0.1 to 0.9 millimeters, preferably 0.4 to 0.6 millimeters. The diamond coating can be realized with any grain size that is tailored to the respective application. The diameter of the diamond wire is made as small as possible, so that a small cutting width is realized. A small cutting width results in fewer chips and thus less waste. In addition, this results in a lower heat generation and consequently a lower energy consumption. In the material, a line contact or better a point contact of material and material, depending on the mode of operation takes place during the separating processing. The line contact is realized without pendulum movement of the cutting tool. If an additional pendulum motion is realized with the tool, for example, by pivoting the rollers together with drive and wire pendulum-like, a point contact is realized. The line or point contact makes it possible to cut sensitive materials such as monosilicon or polysilicon.

Due to the high cutting speeds and the low feed forces only minimal clamping forces for holding the material or material are required. Due to the bending operations on the rollers 3 and the centrifugal forces due to the high rotational speeds is at the Diamond wire realized a self-cleaning process that allows long service life without cooling. The rollers 3 can be pivoted in the illustrated embodiment about a common pivot axis R for the realization of a wobble or pendulum motion.

2 shows a schematic side view of a further embodiment of the device 1. The device 1 here comprises a grinding tool 20 with two grinding bodies 21. The grinding bodies 21 are presently cylindrical. Both the lateral surface of the grinding wheel 21 as well as the front side are diamond-coated. The grinding wheels 21 are rotatable about respective axes of rotation A. The axes of rotation A are arranged so that between the grinding bodies 21, a grinding gap S is realized, in which the material W is processed by cutting. For this purpose, the grinding wheels 21 rotate at correspondingly high speeds in the range of about 1,000 to 4,000 revolutions per minute. The grinding wheels 21 are mounted in a rotary unit 22, which is rotatable about a rotation axis D and rotates the grinding wheels 21 as a whole in addition. The rotary unit 22 and the grinding wheels 21 are thus formed in the manner of a planetary gear. The rotary unit 22 preferably rotates at 500 to 2,000 revolutions per minute. The rotational speeds are freely adjustable, for example via a controller. The material W to be processed is arranged approximately concentric with the axis of rotation D. In the embodiment of FIG. 2, the axis of rotation D and the pivot axis R are arranged concentrically.

3 shows a perspective view of a separation system 100 with two devices 1. The separation system 100 is preferably designed as a CNC separation system. The devices 1 are arranged at different locations of the separation system 100, so that a parallel processing of a material W can take place. The separation system 100 has a holder 110 for the simultaneous recording of multiple materials W. Both the material W and the tools are designed to be movable, so that a material W or several materials can be processed in any desired manner. In particular, the device 1 (right) designed as a wire cutter can additionally be pivoted about a pivot axis with the diamond wire, so that a higher flexibility during cutting is ensured. The pivot axis is preferably formed eccentrically to the rollers. The entire separation system 100 is designed as a CNC machine with corresponding control units. Via the control units and a suction device 120 is controllable, which sucks the separated chips. LIST OF REFERENCE NUMBERS

1 device

 2 tools

 3 rolls

 3a drive roller

 3b pulley

 3c-3f deflection and / or tension rollers

20 grinding tool

 21 grinding wheels

 22 turntable

100 separation system

 110 bracket

 120 suction device

A axis

 D rotation axis

 R pivot axis

 S grinding gap

 W material

Claims

claims 1. A method for the separation of crystalline materials (W) such as monocrystalline or polycrystalline materials (W), in particular for machining of Silicon materials and the like, comprising at least one cutting tool (2) designed as a peripherally diamond-coated, endless saw wire, comprising the steps: endlessly circulating movement of the separating tool (2) in an endless loop and Separating the circulating cutting tool (2) relative to the material (W) for cutting the material (W), characterized in that endlessly circulating in a range of greater than or equal to 500 meters per minute to less than or equal to 7,500 meters per minute, preferably within a range of greater than or equal to 750 meters per minute to less than or equal to 6,000 meters per minute and more preferably within a range of greater than or equal to 1,000 meters per minute to less than or equal to 5,000 meters per minute. 2. The method according to claim 1, characterized in that separating movement comprises advancing movement at a speed in a range greater than or equal to 5 millimeters per minute to less than or equal to 100 millimeters per minute, preferably within a range greater than or equal to 10 millimeters per minute to less than or equal to 75 millimeters per minute, and more preferably in one Range greater than or equal to 15 millimeters per minute to less than or equal to 50 millimeters per minute. 3. The method according to claim 1 or 2, characterized in that the separating movement comprises at least one translational movement along at least one axis and / or at least one pivotal movement about at least one axis. 4. The method according to any one of the preceding claims 1 to 3, characterized in that the endless circulating movement comprises rotating the at least one saw wire around at least two circulating rollers (3). 5. The method according to any one of the preceding claims 1 to 4, characterized in that during separation at least one additive, in particular a coolant and / or a lubricant, in the contact region of the saw wire and material (W) is supplied. 6. The method according to any one of the preceding claims 1 to 5, characterized in that the separated parts of the material (W) are sucked off. 7. Device (1) for separating processing of crystalline materials (W) such as monocrystalline or polycrystalline materials (W), in particular for machining silicon materials and the like, characterized in that  Means for carrying out the method according to one of the preceding claims 1 to 6 are provided. 8. Apparatus according to claim 7, characterized in that at least one saw wire designed as an endless diamond-coated saw wire designed as an endless loop is provided as a separating tool (2) which is rotated in an endless loop by means of a drive device which has at least two deflection rollers (3). 9. Apparatus according to claim 7 or 8, characterized in that at least one movement device is provided in order to effect a separation movement of the circulating separating tool (2) relative to the material (W) and / or conversely for the separating processing of the material (W). 10. Device (l) according to any one of claims 7 to 9, characterized in that the device is formed as a dry separation additive Zuführmittelzuführvorrichtungsfrei to perform the separating processing dry, that is without supply of an additive such as coolant and / or lubricant. 11. Device (1) according to one of claims 7 to 9, characterized in that the device comprises a Zusatzmittelzuführvorrichtung to wet the separating processing, that is, with supply of an additive such as coolant and / or lubricant to perform. 12. Device (1) according to one of claims 7 to 11, characterized in that the movement device comprises a feed unit and / or a pivoting unit and is thus designed as a multiple movement device to at least one translational movement along at least one axis and / or at least one Swivel movement to perform at least one axis. 13. Device (1) according to one of the preceding claims 7 to 12, characterized in that the pivoting means comprises a separating tool pendulum unit for reciprocally moving the separating tool (2) during the separating operation. 14. Device (1) according to one of the preceding claims 7 to 13, characterized in that a suction device is provided to suck off parts of the separated material (W). 15. Separating system (100) for separating processing of crystalline materials (W), such as monocrystalline or polycrystalline materials (W), in particular for machining silicon materials and the like, with a diamond-coated separating tool (2), characterized in that at least one device (1) according to one of the preceding claims 7 to 14 is provided. 16. separation system (100) according to claim 14, characterized in that the separation system (100) is designed for simultaneous processing of a plurality of materials (W) and / or a material (W) at a plurality of sections and / or in a plurality of feed directions. 17. Use of a device (1) according to one of the preceding claims 7 to 14 and / or a separation system (100) according to any one of claims 15 or 16 for the separating processing of crystalline materials (W), such as silicon materials, in particular for machining of silicon materials , Ingots and the like for the production of silicon wafers or silicon parts for solar modules.