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WO2011030949A1 - Light-emitting diode lamp - Google Patents

Light-emitting diode lamp Download PDF

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Publication number
WO2011030949A1
WO2011030949A1 PCT/KR2009/005734 KR2009005734W WO2011030949A1 WO 2011030949 A1 WO2011030949 A1 WO 2011030949A1 KR 2009005734 W KR2009005734 W KR 2009005734W WO 2011030949 A1 WO2011030949 A1 WO 2011030949A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cover
dissipation fins
heat dissipation
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/005734
Other languages
French (fr)
Korean (ko)
Inventor
์ •๋ณ‘์ฒœ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2011030949A1 publication Critical patent/WO2011030949A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting diode lamp, and more particularly to a light emitting diode lamp using a light emitting diode (LED) as a light source.
  • LED light emitting diode
  • a light emitting diode lamp is a lamp using LED as a light source, and a light emitting diode lamp (hereinafter referred to as an "LED lampโ€) has a relatively low power consumption compared to conventional lamps such as incandescent lamps, mercury lamps, halogen lamps, and sodium lamps. It is known for its low life, long life and environmental protection.
  • the LED lamp generates high temperature heat when it emits light from the light emitting diode, and the heat energy of the heat generation adversely affects the LED semiconductor chip, and even shortens the life of the LED or causes the problem of the illumination intensity being significantly lowered.
  • the surface of the heat dissipation mechanism may be configured to increase the heat dissipation effect.
  • the size of the heat dissipation mechanism is large, the volume of the LED lamp is increased and the weight is increased, thereby making it unsuitable for use as a lamp.
  • the lamp is often installed on a ceiling or at a high position such as a street lamp, and when the LED lamp is installed at such a high position, the LED lamp may fall, for example, an earthquake, a strong wind, or an unexpected shock. It may fall by, thereby causing the risk of another safety accident, and if the weight of the LED lamp is heavy and bulky, the risk of safety accident may be more serious.
  • the conventionally installed luminaires or lamps and LED lamps are not compatible with each other, and for example, in order to install LED lamps in luminaires such as street lamps, the luminaire structure must be replaced so that the LED lamps can be mounted. There is this.
  • the cost incurred by replacing the conventional luminaire structure as described above may be more expensive than the benefit of reduced power consumption when using the LED lamp, and this cost problem is to replace the conventional lamp with the LED lamp. It is an obstacle to having.
  • an object of the present invention is to provide a light emitting diode lamp that can quickly dissipate thermal energy generated from an LED device, and the mechanical configuration for dissipating heat is small in size and light in weight.
  • a light emitting diode lamp comprising: a socket cover disposed to be spaced apart from a cover and having a socket at an outer side thereof; A plurality of frames installed between the cover and the socket cover to support the cover and the socket cover; A plurality of heat dissipation fins inserted into the frame and disposed between the cover and the socket cover; A heat pipe having a first linear portion positioned outside the plurality of heat dissipation fins and having a second linear portion penetrating and contacting the plurality of heat dissipation fins; A heat sink fitted to the first linear part and in contact with the plurality of heat dissipation fins; A metal PCB disposed outside the heat sink and having LED elements arranged in double rows on an outer surface thereof; And a floodlight cover disposed outside the metal PCB and bound to the heat sink to project light emitted from the LED device to the outside.
  • the plurality of frames are disposed at equal intervals in three or more places relative to the socket when the plurality of frames are in front of the socket, a pocket is formed to accommodate the plurality of frames on the outer periphery of the plurality of heat radiation fins, An individual frame and the pocket of the plurality of frames may be assembled so that the plurality of heat dissipation fins may be installed on the plurality of frames.
  • a spacer may be disposed on one side of the plate, and a space may be formed in the plurality of heat dissipation fins by the spacers, and air may be convection in the gap, thereby cooling the plurality of heat dissipation fins.
  • the heat pipe is provided to correspond to the number of columns of the LED element
  • the heat sink is formed with a heat pipe groove corresponding to the number of columns of the LED element, the plurality of heat radiation fins on one side of the heat pipe groove
  • a heat sink sheet corresponding to a shape is formed, a first linear portion of the heat pipe is inserted into the heat pipe groove, a part of the first linear portion and a rear surface of the metal PCB, and a rear surface of the heat pipe groove is The heat energy that is in contact with the heat sink sheet, the heat energy generated in the LED element is transferred to the plurality of heat dissipation fins through the metal PCB, the plurality of heat pipes and the heat sink, a portion of the heat energy through the plurality of heat pipes It may be to be heated to a plurality of heat pipes.
  • a plurality of angle parts may be formed at an outer edge of the heat sink, and the metal PCB and the light transmitting cover may be inserted into and bound to the plurality of angle parts.
  • a plurality of barrier ribs may be formed inside the floodlight cover, and the plurality of barrier ribs may press the surface of the metal PCB so that the heat pipe and the metal PCB closely contact each other with a stronger force.
  • the light emitting diode lamp according to the present invention made as described above can dissipate the heat generated from the LED quickly by placing the LED on the metal PCB and the heat dissipation mechanism on one side of the metal PCB so that the life of the LED is abnormal.
  • the problem of shortening or low illuminance can be solved.
  • the light emitting diode lamp according to the present invention can provide a small and light volume of the heat dissipation mechanism by disposing a heat sink, a heat pipe and a heat dissipation fin on one side of the metal PCB.
  • FIG. 1 is a view for explaining a light emitting diode lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded view illustrating the configuration of a light emitting diode lamp according to an embodiment of the present invention.
  • FIG 3 is a view for explaining an example of the heat radiation fin in the light emitting diode lamp according to an embodiment of the present invention.
  • FIG. 4 is a view for explaining heat radiation in the LED lamp according to an embodiment of the present invention.
  • socket cover 42 second fastening hole
  • 50a, 50b, 50c, 50d, 50e first, second, third, fourth and fifth heat pipes
  • 64a, 64b, 64c, 64d, 64e first, second, third, fourth, fifth heat sink sheet
  • the light emitting diode lamp includes a socket cover 40 disposed spaced apart from the cover 20 and provided with a socket 44 on the outside thereof; A plurality of frames (30) installed between the cover (20) and the socket cover (40) to support the cover (20) and the socket cover (40); A plurality of heat dissipation fins 60 inserted into the frame 30 and disposed between the cover 20 and the socket cover 40; A heat pipe 50 having a first linear portion 52 positioned outside the plurality of heat dissipation fins 50 and having a second linear portion 56 penetrating and contacting the plurality of heat dissipation fins 50; A heat sink 80 inserted into the first linear portion 52 and in contact with the plurality of heat dissipation fins 60; A metal PCB (90) disposed outside the heat sink (80) and having an LED element (98) arranged in a double row on an outer surface thereof; And a floodlight cover 100 disposed outside the metal PCB 90 and bound to the heat sink 80 to project the light
  • the light emitting diodes are abbreviated as LEDs, and the light emitting diode lamps are abbreviated as LED lamps.
  • FIGS. 1 and 2 a light emitting diode lamp according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 is an exemplary view for explaining a light emitting diode lamp according to an embodiment of the present invention
  • Figure 2 is an exploded view illustrating the configuration of a light emitting diode lamp according to an embodiment of the present invention Drawing.
  • the metal PCB 90 is disposed between the cover 20 and the socket cover 40, and the LED device 98 is disposed on the surface of the metal PCB 90.
  • the heat pipe 50 and the plurality of heat dissipation fins 60 are disposed on the rear surface of the metal PCB 90.
  • the heat energy generated by the above-described LED element 98 is heated through the plurality of heat pipes 50 described above and air-cooled by the above-described plurality of heat dissipation fins 60 to eventually generate heat energy generated by the LED element 98. It is cooled and extinguished.
  • the above-described cover 20 and the above-described socket cover 40 each have a first fastening hole 22 and a second fastening hole 42, and the above-mentioned socket cover 40
  • the socket 44 for receiving power is disposed outside.
  • the frame 30 may be disposed between the above-described cover 20 and the above-described socket cover 40, the both ends of the frame 30 may be formed with a hole or a female screw, the cover described above
  • the first fastening bolt 36 is inserted through the first fastening hole 22 from the outside of the 20, and the first fastening bolt 36 is the first fastening part 32 of one end of the frame 30 described above.
  • the second fastening bolt 38 is inserted through the second fastening hole 42 at the outside of the socket cover 40, and the second fastening bolt 38 of the frame 30 is described above. It is fastened to the 2nd fastening part 34 of the other end part.
  • first and second fastening portions 32 and 34 may be simple holes or female threads, and the above-mentioned first and second fastening bolts 36 and 38 may be described above.
  • first and second fastening bolts 36 and 38 may be described above.
  • the cover 20 and the socket cover 40 may be firmly fixed to each other through the frame 30.
  • the above-described frame 30 may be arranged in a plurality of three or more, in particular, may be arranged at equal intervals based on the above-described socket 44, as an example as shown in Figure 2 attached to the frame ( 30 may be arranged in four.
  • FIG. 3 is an exemplary view for explaining an example of the heat radiation fin 60 in the LED lamp according to an embodiment of the present invention.
  • a pocket 66 is formed on the outer circumference of the plurality of heat dissipation fins 60 so as to accommodate the plurality of frames 30, and the above-described frame 30 and the above-described pocket 66 are formed.
  • the plurality of heat dissipation fins 60 described above may be aligned and installed in the plurality of frames 30 as described above.
  • a spacer 72 is disposed on one side of the plate 62, and each of the heat dissipation fins 60 is formed at the plurality of heat dissipation fins 60 described above by the spacer 72.
  • a gap is formed between the heat sink and the other heat dissipation fin 60, and air is convection in the above-described gap so that the plurality of heat dissipation fins 60 are air-cooled.
  • the spacer 72 is formed in a substantially U-shape and a plurality of ribs 74 are formed at an edge portion.
  • the slit 70 is formed at the position corresponding to the plural lips 74 described above in the plate 62 described above, and the lip 74 is inserted after the lip 74 described above is inserted in the slit 70 described above. ) May be bent to assemble the spacer 72 and the plate 62.
  • the spacer 72 and the plate 62 described above may be combined by welding.
  • the gap may be formed by the thickness of the spacer 72.
  • the heat sink sheet 64 is formed on one side of the heat dissipation fin 60 and the heat pipe hole 68 is formed on the other side, and the heat sink 80 is in contact with the heat sink sheet 64 described above. Is placed.
  • a heat pipe 50 may be inserted into the heat sink 80 and the heat dissipation fin 60 described above, and the metal sink 90 may be installed in the heat sink 80.
  • the floodlight cover 100 may be disposed on the outside of the PCB 90.
  • the heat pipe 50 described above is formed by bending the first linear portion 52 and the second linear portion 56 to the bent portion 54, and the first linear portion 52 described above is formed of the metal PCB (described above). It is inserted into the inside of the 90, the above-described second linear portion 56 is disposed to penetrate the above-described heat radiation fin (60).
  • the LED elements 98 are arranged in double rows on the outer surface, and a circuit for turning on the LED elements 98 is disposed.
  • the floodlight cover 100 described above is disposed outside the metal PCB 90 and bound to the heat sink 80 to project the light emitted from the LED device 98 to the outside. .
  • the above-described LED elements 98 may be configured in a double row, and may be arranged in five rows as shown in FIGS. 1 to 4 as an example.
  • the above-described heat pipe 50 may be provided to correspond to the number of columns of the LED element 98, in the embodiment of the present invention, since the LED element 98 is configured in five rows of the heat pipe 50 The number may be provided with five.
  • the heat sink 80 may be formed with a heat pipe groove 82 to correspond to the number of columns of the LED element 98 described above, and in one embodiment of the present invention, the LED element 98 is divided into five rows. Since the heat pipe groove 82 can be formed into five because it is configured.
  • the plurality of heat dissipation fins 60 described above are provided with a heat sink sheet 64 corresponding to the shape of the heat pipe groove 82 described above on one side, and the heat pipe 50 described above.
  • the first linear portion 52 is inserted into the above-described heat pipe groove 82, and a part of the above-described first linear portion 52 and the back surface of the metal PCB 90, the heat pipe described above The back surface of the groove 82 touches the heat sink sheet 64 described above.
  • the heat sink sheet 64 may be bent in a semicircular arc shape by the number of the heat pipes 98 described above, and more specifically, the LED element 98 may be formed. 1 to 5 LED columns (98a to 98e), the heat sink 80, respectively, to correspond to the above-described first to fifth LED columns (98a to 98e) the first to fifth heat pipe groove ( 82a to 82e).
  • first to fifth heat pipes 50a to 50e may be inserted into the first to fifth heat pipe grooves 82a to 82e, respectively.
  • the back shape of the heat sink 80 mentioned above is that the shape of a part of circular arc is convex as many as the number of LED elements 98,
  • the heat sink sheet 64 mentioned above is as shown in the detailed drawing of FIG.
  • the first to fifth heat sink sheets 64a to 64e are formed in an arc shape so as to closely contact the heat sink 80 described above.
  • the heat energy generated by the above-described LED element 98 is transferred to the plurality of heat dissipation fins 60 described above through the above-described metal PCB 90, the plurality of heat pipes 50, and the heat sink 80. It will heat up quickly.
  • the heat dissipation fin 60 described above is formed with first to fifth heat pipe holes 68a to 68e, respectively, so that the second linear portion 56 of the heat pipe 50 penetrates.
  • the fifth heat pipe holes 68a to 68e are formed at positions evenly distributed in the area of the heat dissipation fin 60, thereby maximizing the effect of heat dissipation.
  • a plurality of angle parts 84 may be formed to face each other at the outer edge of the heat sink 80 described above, and the metal PCB 90 and the above-described metal parts 90 may be formed at the plurality of angle parts 84 described above.
  • One floodlight cover 100 may be inserted and bound.
  • the above-described angle part 84 has a protrusion line formed in an inward direction, and a cover edge (not shown) at an outer edge of the floodlight cover 100 described above. 106 is formed, it is possible to fit in the sliding form to the plurality of angle parts 84 in the longitudinal direction of the heat sink 80 described above in a state where the floodlight cover 100 and the metal PCB 90 is stacked, Assembly may be completed by fitting in this way.
  • thermally conductive silicon may be applied between the above-described metal PCB 90 and the heat sink 80 to further improve the effect of thermal conduction.
  • the floodlight cover 100 described above may be formed with a plurality of partition walls 102 on the inside, as shown in Figures 1 and 2, the plurality of partition walls 102 described above is a metal PCB ( Pressing the surface of the 90 may be such that the heat pipe 50 and the above-described metal PCB 90 is in contact with a stronger pressure.
  • the plurality of partitions 102 formed on the floodlight cover 100 may further contact the metal PCB 90 and the heat sink 80 at a higher pressure, thereby further improving the heat transfer effect. have.
  • the configuration of the heat pipe 50 described above is to form a fine groove in the form of a capillary tube in the inner diameter, and the heat transfer medium is embedded, and when heat is applied, the medium is vaporized and quickly moves to the other side to transfer heat.
  • the description of 500 uses known techniques and further description thereof will be omitted.
  • the main material of the cover 20 and the socket cover 40 described above may be a synthetic resin, the main frame of the frame 30, the heat dissipation fin 60, the heat sink 80 and the metal PCB 90 described above
  • the material may be a light metal, and may be, for example, aluminum, magnesium, or the like, whereby the LED lamp 10 according to an embodiment of the present invention may be provided with a light weight.
  • the above-mentioned socket 44 is provided in the same standard as the socket installed in the conventional luminaire, when replacing the LED lamp 10 according to an embodiment of the present invention in the luminaire, the conventional luminaire is not replaced
  • the LED lamp 10 can be installed directly in a conventional luminaire without having to.
  • bent portion 54 of the heat pipe 50 described above may be covered by the cover 20 described above, and each end of the heat pipe 50 described above may have the socket cover 40 described above.
  • the inner side of the LED lamp 10 can be obscured by being able to be hidden from the outside.
  • the label sheet 104 may be disposed on the outer side of the above-described floodlight cover 100, the label sheet 104 is that the power lead line or the like disposed on the metal PCB 90 is visible to the outside In addition, the trademark of the LED lamp 10 may be attached.
  • the above-described LED element 98 may be arranged to arrange the LED elements (1 โ‡ 3W) of low power consumption in a double row (5 rows X 10 lines), whereby the LED elements (with relatively high power consumption) Compared to arranging a small amount (more than 5W) in a small amount (3 to 5 thermal insulation), the illuminance of emitted light is the same / similar, and the heat generation can be uniformly distributed, thereby more quickly dissipating thermal energy generated by the LED element 98. It can be cooled.
  • the light emitting diode lamp according to the present invention may be installed in a luminaire and used as a lamp for emitting light.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to a light-emitting diode lamp. According to one embodiment of the present invention, a light-emitting diode lamp comprises: a socket cover (40) arranged spaced apart from a cover (20) and provided with a socket (44) on the outside thereof; a plurality of frames (30) installed between the cover (20) and the socket cover (40) to support the cover (20) and the socket cover (40); a plurality of heat-dissipating fins (60) inserted between the frames (30) and arranged between the cover (20) and the socket cover (40); a heat pipe (50) including first linear portions (52) arranged on the outside of the plurality of heat-dissipating fins (60), and second linear portions (56) passing through and contacting the plurality of heat-dissipating fins (60); a heat sink (80) inserted over the first linear portions (52) and having one side contacting the plurality of heat-dissipating fins (60); a metal PCB (90) arranged on the outside of the heat sink (80) and including a plurality of LED devices (98) arranged in multiple rows thereon; and a light-transmitting cover (100) arranged on the outside of the metal PCB (90) and combined with the heat sink (80) in order to transmit light emitted by the LED devices (98) to the outside.

Description

๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„LED lamp

๋ณธ ๋ฐœ๋ช…์€ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„์— ๊ด€ํ•œ ๊ฒƒ์œผ๋กœ, ๋”์šฑ ์ƒ์„ธํ•˜๊ฒŒ๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ(Light Emitting Diode: LED)๋ฅผ ๊ด‘์›์œผ๋กœ ์ด์šฉํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„์— ๊ด€ํ•œ ๊ฒƒ์ด๋‹ค.The present invention relates to a light emitting diode lamp, and more particularly to a light emitting diode lamp using a light emitting diode (LED) as a light source.

์ผ๋ฐ˜์ ์œผ๋กœ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋Š” LED๋ฅผ ๊ด‘์›์œผ๋กœ ์ด์šฉํ•˜๋Š” ๋žจํ”„๋กœ์„œ, ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„(์ดํ•˜ "LED ๋žจํ”„"๋ผ ํ•จ)๋Š” ๋ฐฑ์—ด ๋žจํ”„, ์ˆ˜์€ ๋žจํ”„, ํ• ๋กœ๊ฒ ๋žจํ”„, ๋‚˜ํŠธ๋ฅจ๋žจํ”„ ๋“ฑ์˜ ์ข…๋ž˜์˜ ๋žจํ”„์— ๋น„๊ตํ•˜์—ฌ ์ƒ๋Œ€์ ์œผ๋กœ ์†Œ๋น„์ „๋ ฅ์ด ๋‚ฎ๊ณ  ์ˆ˜๋ช…์ด ๊ธธ๋ฉฐ ํ™˜๊ฒฝ์„ ๋ณดํ˜ธํ•  ์ˆ˜ ์žˆ๋Š” ๊ฒƒ์œผ๋กœ ์•Œ๋ ค์ ธ ์žˆ๋‹ค.Generally, a light emitting diode lamp is a lamp using LED as a light source, and a light emitting diode lamp (hereinafter referred to as an "LED lamp") has a relatively low power consumption compared to conventional lamps such as incandescent lamps, mercury lamps, halogen lamps, and sodium lamps. It is known for its low life, long life and environmental protection.

๊ทธ๋Ÿฌ๋‚˜ LED ๋žจํ”„๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ์—์„œ ๋ฐœ๊ด‘ํ•  ๋•Œ์— ๊ณ ์˜จ์˜ ๋ฐœ์—ด์ด ๋ฐœ์ƒํ•˜๊ณ , ์ด๋Ÿฌํ•œ ๋ฐœ์—ด์˜ ์—ด์—๋„ˆ์ง€๋Š” LED ๋ฐ˜๋„์ฒด ์นฉ์— ์•…์˜ํ–ฅ์„ ๋ผ์น˜๋ฉฐ, ์‹ฌ์ง€์–ด LED์˜ ์ˆ˜๋ช…์„ ๋‹จ์ถ•์‹œํ‚ค๊ฑฐ๋‚˜ ์กฐ๋„๊ฐ€ ํ˜„๊ฒฉํ•˜๊ฒŒ ๋‚ฎ์•„์ง€๋Š” ๋ฌธ์ œ์ ์„ ๋ฐœ์ƒ์‹œํ‚จ๋‹ค.However, the LED lamp generates high temperature heat when it emits light from the light emitting diode, and the heat energy of the heat generation adversely affects the LED semiconductor chip, and even shortens the life of the LED or causes the problem of the illumination intensity being significantly lowered.

๋”ฐ๋ผ์„œ ์ƒ์ˆ ํ•œ ๋ฐ”์™€ ๊ฐ™์€ ์—ด์—๋„ˆ์ง€๋ฅผ ์‹ ์†ํ•˜๊ฒŒ ์†Œ๋ฉธ์‹œ์ผœ์•ผ ํ•˜๊ณ , ์—ด์—๋„ˆ์ง€์˜ ์†Œ๋ฉธ์„ ์ด‰์ง„์‹œํ‚ค๋Š” ์˜ˆ๋กœ์„œ LED๊ฐ€ ๋ฐฐ์น˜๋œ ํšŒ๋กœ๊ธฐํŒ์˜ ํ•œ์ชฝ์— ๋ƒ‰๊ฐํŒ(cooling plate)์„ ๋ฐฐ์น˜ํ•˜์—ฌ ๋Œ€๋ฅ˜์— ์˜ํ•œ ๋ฐฉ์—ด์„ ํ•˜๊ฑฐ๋‚˜, ํŒฌ(fan)์„ ์ด์šฉํ•˜์—ฌ ๊ฐ•์ œ์ ์œผ๋กœ ๊ณต๋ƒ‰ ๋ƒ‰๊ฐ์‹œํ‚ค๋Š” ๊ตฌ์„ฑ์ด ์•Œ๋ ค์ ธ ์žˆ๋‹ค.Therefore, it is necessary to quickly dissipate the heat energy as described above, and to dissipate heat energy by arranging a cooling plate on one side of the circuit board on which the LED is disposed as an example of promoting the heat energy dissipation or by a fan. There is known a configuration of forcibly air-cooling cooling by using a.

์—ฌ๊ธฐ์„œ, ๋ฐฉ์—ด ํšจ๊ณผ๋ฅผ ๋†’์ด๊ธฐ ์œ„ํ•ด ๋ฐฉ์—ด๊ธฐ๊ตฌ์˜ ํ‘œ๋ฉด์„ ๋„“๊ฒŒ ๊ตฌ์„ฑํ•  ์ˆ˜ ์žˆ์ง€๋งŒ, ์ด์™€ ๊ฐ™์ด ๋ฐฉ์—ด๊ธฐ๊ตฌ์˜ ํฌ๊ธฐ๋ฅผ ํฌ๊ฒŒ ๊ตฌ์„ฑํ•  ๊ฒฝ์šฐ LED ๋žจํ”„์˜ ๋ถ€ํ”ผ๊ฐ€ ์ปค์ง€๊ณ  ๋ฌด๊ฒŒ๊ฐ€ ์ฆ๊ฐ€ํ•˜์—ฌ ๋žจํ”„๋กœ์„œ ์‚ฌ์šฉํ•˜๊ธฐ์— ๋ถ€์ ํ•ฉํ•œ ๋ฌธ์ œ์ ์ด ์žˆ๋‹ค.In this case, the surface of the heat dissipation mechanism may be configured to increase the heat dissipation effect. However, when the size of the heat dissipation mechanism is large, the volume of the LED lamp is increased and the weight is increased, thereby making it unsuitable for use as a lamp.

ํŠนํžˆ, ๋žจํ”„๋Š” ์ฒœ์žฅ์— ์„ค์น˜๋˜๊ฑฐ๋‚˜ ๊ฐ€๋กœ๋“ฑ์ฒ˜๋Ÿผ ๋†’์€ ์œ„์น˜์— ์„ค์น˜๋˜๋Š” ๊ฒฝ์šฐ๊ฐ€ ๋งŽ๊ณ , ์ด์™€ ๊ฐ™์ด ๋†’์€ ์œ„์น˜์— LED ๋žจํ”„๊ฐ€ ์„ค์น˜๋˜๋ฉด LED ๋žจํ”„๊ฐ€ ๋–จ์–ด์งˆ ์šฐ๋ ค๊ฐ€ ์žˆ๋Š”๋ฐ, ์˜ˆ๋กœ์„œ ์ง€์ง„, ๊ฐ•ํ’, ๊ทธ ์™ธ ์˜ˆ์ƒํ•˜์ง€ ๋ชปํ•œ ์ถฉ๊ฒฉ ๋“ฑ์— ์˜ํ•ด ๋‚™ํ•˜๋  ์ˆ˜ ์žˆ์œผ๋ฉฐ, ๊ทธ๋กœ ์ธํ•˜์—ฌ ๋˜ ๋‹ค๋ฅธ ์•ˆ์ „์‚ฌ๊ณ ์˜ ์œ„ํ—˜์ด ๋ฐœ์ƒํ•  ์šฐ๋ ค๊ฐ€ ์žˆ๊ณ , LED ๋žจํ”„์˜ ๋ฌด๊ฒŒ๊ฐ€ ๋ฌด๊ฒ๊ณ  ๋ถ€ํ”ผ๊ฐ€ ํด ๊ฒฝ์šฐ์—๋Š” ์•ˆ์ „์‚ฌ๊ณ ์˜ ์œ„ํ—˜์ด ๋”์šฑ ์‹ฌ๊ฐํ•ด์งˆ ์ˆ˜ ์žˆ๋‹ค.In particular, the lamp is often installed on a ceiling or at a high position such as a street lamp, and when the LED lamp is installed at such a high position, the LED lamp may fall, for example, an earthquake, a strong wind, or an unexpected shock. It may fall by, thereby causing the risk of another safety accident, and if the weight of the LED lamp is heavy and bulky, the risk of safety accident may be more serious.

๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ข…๋ž˜์— ์ด๋ฏธ ์„ค์น˜๋˜์–ด ์žˆ๋Š” ๋“ฑ๊ธฐ๊ตฌ ๋˜๋Š” ๋žจํ”„์™€ LED ๋žจํ”„๋Š” ์„œ๋กœ ํ˜ธํ™˜์ด ๋˜์ง€ ์•Š๊ณ , ์ผ๋ก€๋กœ์„œ ๊ฐ€๋กœ๋“ฑ๊ณผ ๊ฐ™์€ ๋“ฑ๊ธฐ๊ตฌ์— LED ๋žจํ”„๋ฅผ ์„ค์น˜ํ•˜๊ธฐ ์œ„ํ•ด์„œ๋Š” LED ๋žจํ”„๋ฅผ ์žฅ์ฐฉํ•  ์ˆ˜ ์žˆ๋„๋ก ๋“ฑ๊ธฐ๊ตฌ ๊ตฌ์กฐ๋ฌผ์„ ๊ต์ฒดํ•˜์—ฌ์•ผ ํ•˜๋Š” ๋ฌธ์ œ์ ์ด ์žˆ๋‹ค.On the other hand, the conventionally installed luminaires or lamps and LED lamps are not compatible with each other, and for example, in order to install LED lamps in luminaires such as street lamps, the luminaire structure must be replaced so that the LED lamps can be mounted. There is this.

์ƒ์ˆ ํ•œ ๋ฐ”์™€ ๊ฐ™์€ ์ข…๋ž˜์˜ ๋“ฑ๊ธฐ๊ตฌ ๊ตฌ์กฐ๋ฌผ์„ ๊ต์ฒดํ•จ์œผ๋กœ์จ ๋ฐœ์ƒํ•˜๋Š” ๋น„์šฉ์€ LED๋žจํ”„๋ฅผ ์ด์šฉํ•  ๋•Œ์— ์†Œ๋น„์ „๋ ฅ ๊ฐ์†Œ๋กœ ์–ป๋Š” ์ด๋“๋ณด๋‹ค ๋” ํฐ ๋น„์šฉ์ด ์ง€์ถœ๋  ์šฐ๋ ค๊ฐ€ ์žˆ๊ณ , ์ด๋Ÿฌํ•œ ๋น„์šฉ ๋ฌธ์ œ๋Š” ์ข…๋ž˜์˜ ๋žจํ”„๋ฅผ LED ๋žจํ”„๋กœ ๊ต์ฒดํ•˜๋Š” ๋ฐ์— ๊ฑธ๋ฆผ๋Œ์ด ๋œ๋‹ค.The cost incurred by replacing the conventional luminaire structure as described above may be more expensive than the benefit of reduced power consumption when using the LED lamp, and this cost problem is to replace the conventional lamp with the LED lamp. It is an obstacle to having.

๋”ฐ๋ผ์„œ ๋ณธ ๋ฐœ๋ช…์ด ์ด๋ฃจ๊ณ ์ž ํ•˜๋Š” ๊ธฐ์ˆ ์  ๊ณผ์ œ๋Š” LED์†Œ์ž์—์„œ ๋ฐœ์ƒํ•˜๋Š” ์—ด์—๋„ˆ์ง€๋ฅผ ์‹ ์†ํ•˜๊ฒŒ ๋ฐฉ์—ดํ•˜๋„๋ก ํ•˜๊ณ , ๋ฐฉ์—ดํ•˜๊ธฐ ์œ„ํ•œ ๊ธฐ๊ตฌ์  ๊ตฌ์„ฑ์€ ๋ถ€ํ”ผ๊ฐ€ ์ž‘๊ณ  ๋ฌด๊ฒŒ๋ฅผ ๊ฐ€๋ณ๊ฒŒ ํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋ฅผ ์ œ๊ณตํ•˜๋Š”๋ฐ ๊ทธ ๋ชฉ์ ์ด ์žˆ๋‹ค.Accordingly, an object of the present invention is to provide a light emitting diode lamp that can quickly dissipate thermal energy generated from an LED device, and the mechanical configuration for dissipating heat is small in size and light in weight.

๋ณธ ๋ฐœ๋ช…์ด ์ด๋ฃจ๊ณ ์ž ํ•˜๋Š” ๊ธฐ์ˆ ์  ๊ณผ์ œ๋Š” ์ด์ƒ์—์„œ ์–ธ๊ธ‰ํ•œ ๊ธฐ์ˆ ์  ๊ณผ์ œ๋กœ ์ œํ•œ๋˜์ง€ ์•Š์œผ๋ฉฐ, ์–ธ๊ธ‰๋˜์ง€ ์•Š์€ ๋˜ ๋‹ค๋ฅธ ๊ธฐ์ˆ ์  ๊ณผ์ œ๋Š” ์•„๋ž˜์˜ ๊ธฐ์žฌ๋กœ๋ถ€ํ„ฐ ๋ณธ ๋ฐœ๋ช…์ด ์†ํ•˜๋Š” ๊ธฐ์ˆ ๋ถ„์•ผ์—์„œ ํ†ต์ƒ์˜ ์ง€์‹์„ ๊ฐ€์ง„ ์ž์—๊ฒŒ ๋ช…ํ™•ํ•˜๊ฒŒ ์ดํ•ด๋  ์ˆ˜ ์žˆ์„ ๊ฒƒ์ด๋‹ค.The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, another technical problem that is not mentioned can be clearly understood by those skilled in the art from the following description. There will be.

์ƒ๊ธฐ ๊ธฐ์ˆ ์  ๊ณผ์ œ๋ฅผ ๋‹ฌ์„ฑํ•˜๊ธฐ ์œ„ํ•œ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋Š”, ์ปค๋ฒ„์™€ ์ด๊ฒฉ๋˜๊ฒŒ ๋ฐฐ์น˜๋˜๊ณ  ์™ธ์ธก์— ์†Œ์ผ“์ด ๊ตฌ๋น„๋œ ์†Œ์ผ“ ์ปค๋ฒ„; ์ƒ๊ธฐ ์ปค๋ฒ„์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„์˜ ์‚ฌ์ด์— ์„ค์น˜๋˜์–ด ์ƒ๊ธฐ ์ปค๋ฒ„์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„๋ฅผ ์ง€์ง€ํ•˜๋Š” ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„; ์ƒ๊ธฐ ํ”„๋ ˆ์ž„์— ์‚ฝ์ž…๋˜๊ณ  ์ƒ๊ธฐ ์ปค๋ฒ„์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„์˜ ์‚ฌ์ด์— ๋ฐฐ์น˜๋˜๋Š” ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€; ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์˜ ์™ธ์ธก์— ์ œ1 ์„ ํ˜•๋ถ€๊ฐ€ ์œ„์น˜ํ•˜๋ฉฐ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์— ๊ด€ํ†ต๋˜์–ด ์ ‘ํ•˜๋„๋ก ์ œ2 ์„ ํ˜•๋ถ€๊ฐ€ ํ˜•์„ฑ๋œ ํžˆํŠธ ํŒŒ์ดํ”„; ์ƒ๊ธฐ ์ œ1 ์„ ํ˜•๋ถ€์— ๋ผ์›Œ์ง€๋ฉฐ ์ผ์ธก์€ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€๊ณผ ์ ‘ํ•˜๋Š” ํžˆํŠธ ์‹ฑํฌ; ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ์˜ ์™ธ์ธก์— ๋ฐฐ์น˜๋˜๊ณ  ๊ฒ‰ ํ‘œ๋ฉด์— LED์†Œ์ž๊ฐ€ ๋ณต์—ด๋กœ ๋ฐฐ์น˜๋˜๋Š” ๋ฉ”ํƒˆPCB; ๋ฐ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB์˜ ์™ธ์ธก์— ๋ฐฐ์น˜๋˜๊ณ  ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ์— ๊ฒฐ์†๋˜์–ด ์ƒ๊ธฐ LED์†Œ์ž์—์„œ ๋ฐœ๊ด‘ํ•˜๋Š” ๋น›์„ ์™ธ๋ถ€๋กœ ํˆฌ์˜๋˜๋„๋ก ํ•˜๋Š” ํˆฌ๊ด‘์ปค๋ฒ„;๋ฅผ ํฌํ•จํ•œ๋‹ค.According to an aspect of the present invention, there is provided a light emitting diode lamp comprising: a socket cover disposed to be spaced apart from a cover and having a socket at an outer side thereof; A plurality of frames installed between the cover and the socket cover to support the cover and the socket cover; A plurality of heat dissipation fins inserted into the frame and disposed between the cover and the socket cover; A heat pipe having a first linear portion positioned outside the plurality of heat dissipation fins and having a second linear portion penetrating and contacting the plurality of heat dissipation fins; A heat sink fitted to the first linear part and in contact with the plurality of heat dissipation fins; A metal PCB disposed outside the heat sink and having LED elements arranged in double rows on an outer surface thereof; And a floodlight cover disposed outside the metal PCB and bound to the heat sink to project light emitted from the LED device to the outside.

๋˜ํ•œ, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„์€ ์ƒ๊ธฐ ์†Œ์ผ“์— ๋Œ€ํ•˜์—ฌ ์ •๋ฉด์œผ๋กœ ํ•  ๋•Œ์— ์ƒ๊ธฐ ์†Œ์ผ“์„ ๊ธฐ์ค€์œผ๋กœ 3๊ฐœ์†Œ ์ด์ƒ์— ๋“ฑ๊ฐ„๊ฒฉ์œผ๋กœ ๋ฐฐ์น˜๋˜๊ณ , ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์˜ ์™ธ์ฃผ์— ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„์„ ์ˆ˜์šฉํ•˜๋„๋ก ํ•˜๋Š” ํฌ์ผ“์ด ํ˜•์„ฑ๋˜๋ฉฐ, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„ ์ค‘์— ๊ฐœ๋ณ„์˜ ํ”„๋ ˆ์ž„๊ณผ ์ƒ๊ธฐ ํฌ์ผ“์ด ์กฐ๋ฆฝ๋˜์–ด ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„์— ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์ด ์„ค์น˜๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.In addition, the plurality of frames are disposed at equal intervals in three or more places relative to the socket when the plurality of frames are in front of the socket, a pocket is formed to accommodate the plurality of frames on the outer periphery of the plurality of heat radiation fins, An individual frame and the pocket of the plurality of frames may be assembled so that the plurality of heat dissipation fins may be installed on the plurality of frames.

๋˜ํ•œ, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์€, ํ”Œ๋ ˆ์ดํŠธ์˜ ํ•œ์ชฝ์— ์ŠคํŽ˜์ด์„œ๊ฐ€ ๋ฐฐ์น˜๋˜๊ณ , ์ƒ๊ธฐ ์ŠคํŽ˜์ด์„œ์— ์˜ํ•ด ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์— ๊ฐ„๊ฒฉ์ด ํ˜•์„ฑ๋˜๋ฉฐ ์ƒ๊ธฐ ๊ฐ„๊ฒฉ์— ๊ณต๊ธฐ๊ฐ€ ๋Œ€๋ฅ˜ํ•˜์—ฌ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์ด ๊ณต๋žญ ๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.In addition, in the plurality of heat dissipation fins, a spacer may be disposed on one side of the plate, and a space may be formed in the plurality of heat dissipation fins by the spacers, and air may be convection in the gap, thereby cooling the plurality of heat dissipation fins.

๋˜ํ•œ, ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„๋Š” ์ƒ๊ธฐ LED ์†Œ์ž์˜ ์—ด ์ˆ˜์™€ ๋Œ€์‘ํ•˜๊ฒŒ ๊ตฌ๋น„๋˜๊ณ , ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ๋Š” ์ƒ๊ธฐ LED ์†Œ์ž์˜ ์—ด ์ˆ˜์™€ ๋Œ€์‘ํ•˜๊ฒŒ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ๊ฐ€ ํ˜•์„ฑ๋˜๋ฉฐ, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์€ ํ•œ์ชฝ์— ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ์˜ ํ˜•์ƒ๊ณผ ๋Œ€์‘ํ•˜๋Š” ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ๊ฐ€ ํ˜•์„ฑ๋˜๊ณ , ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„์˜ ์ œ1 ์„ ํ˜•๋ถ€๋Š” ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ์— ์‚ฝ์ž…๋˜๋ฉฐ, ์ƒ๊ธฐ ์ œ1 ์„ ํ˜•๋ถ€์˜ ์ผ๋ถ€์™€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB์˜ ๋ฐฐ๋ฉด์— ๋‹ฟ๊ณ , ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ์˜ ๋ฐฐ๋ฉด์€ ์ƒ๊ธฐ ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ์— ๋‹ฟ์•„, ์ƒ๊ธฐ LED ์†Œ์ž์—์„œ ๋ฐœ์—ด๋˜๋Š” ์—ด์—๋„ˆ์ง€๊ฐ€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB์™€ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„์™€ ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ๋ฅผ ํ†ตํ•˜์—ฌ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€์— ์ „์—ด๋˜๊ณ , ์ƒ๊ธฐ ์—ด์—๋„ˆ์ง€์˜ ์ผ๋ถ€๋Š” ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„๋ฅผ ํ†ตํ•ด ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„์— ์ „์—ด๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.In addition, the heat pipe is provided to correspond to the number of columns of the LED element, the heat sink is formed with a heat pipe groove corresponding to the number of columns of the LED element, the plurality of heat radiation fins on one side of the heat pipe groove A heat sink sheet corresponding to a shape is formed, a first linear portion of the heat pipe is inserted into the heat pipe groove, a part of the first linear portion and a rear surface of the metal PCB, and a rear surface of the heat pipe groove is The heat energy that is in contact with the heat sink sheet, the heat energy generated in the LED element is transferred to the plurality of heat dissipation fins through the metal PCB, the plurality of heat pipes and the heat sink, a portion of the heat energy through the plurality of heat pipes It may be to be heated to a plurality of heat pipes.

๋˜ํ•œ, ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ์˜ ์™ธ์ธก๋ชจ์„œ๋ฆฌ์— ๋ณต์ˆ˜ ๊ฐœ์˜ ์•ต๊ธ€ ํŒŒํŠธ๊ฐ€ ํ˜•์„ฑ๋˜๊ณ , ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ์•ต๊ธ€ ํŒŒํŠธ์— ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB์™€ ์ƒ๊ธฐ ํˆฌ๊ด‘ ์ปค๋ฒ„๊ฐ€ ์‚ฝ์ž…๋˜์–ด ๊ฒฐ์†๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.In addition, a plurality of angle parts may be formed at an outer edge of the heat sink, and the metal PCB and the light transmitting cover may be inserted into and bound to the plurality of angle parts.

๋˜ํ•œ, ์ƒ๊ธฐ ํˆฌ๊ด‘์ปค๋ฒ„์˜ ๋‚ด์ธก์— ๋ณต์ˆ˜ ๊ฐœ์˜ ๊ฒฉ๋ฒฝ์ด ํ˜•์„ฑ๋˜๊ณ , ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๊ฒฉ๋ฒฝ์€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB์˜ ํ‘œ๋ฉด์„ ๊ฐ€์••ํ•˜์—ฌ ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„์™€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB๊ฐ€ ๋”์šฑ ๊ฐ•ํ•œ ํž˜์œผ๋กœ ๋ฐ€์ฐฉ๋˜๊ฒŒ ํ•˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.In addition, a plurality of barrier ribs may be formed inside the floodlight cover, and the plurality of barrier ribs may press the surface of the metal PCB so that the heat pipe and the metal PCB closely contact each other with a stronger force.

์ƒ๊ธฐํ•œ ๋ฐ”์™€ ๊ฐ™์ด ์ด๋ฃจ์–ด์ง„ ๋ณธ ๋ฐœ๋ช…์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋Š” LED๋ฅผ ๋ฉ”ํƒˆPCB์— ๋ฐฐ์น˜ํ•˜๊ณ  ๋ฉ”ํƒˆPCB์˜ ํ•œ์ชฝ์— ๋ฐฉ์—ด๊ธฐ๊ตฌ๋ฅผ ๋ฐฐ์น˜ํ•จ์œผ๋กœ์จ LED์—์„œ ๋ฐœ์ƒํ•˜๋Š” ๋ฐœ์—ด์„ ์™ธ๋ถ€๋กœ ์‹ ์†ํ•˜๊ฒŒ ๋ฐฉ์—ดํ•  ์ˆ˜ ์žˆ์–ด LED์˜ ์ˆ˜๋ช…์ด ๋น„์ •์ƒ์ ์œผ๋กœ ๋‹จ์ถ•๋˜๊ฑฐ๋‚˜ ์กฐ๋„๊ฐ€ ๋‚ฎ์•„์ง€๋Š” ๋ฌธ์ œ์ ์„ ํ•ด์†Œํ•  ์ˆ˜ ์žˆ๋‹ค.The light emitting diode lamp according to the present invention made as described above can dissipate the heat generated from the LED quickly by placing the LED on the metal PCB and the heat dissipation mechanism on one side of the metal PCB so that the life of the LED is abnormal. The problem of shortening or low illuminance can be solved.

๋˜ํ•œ, ๋ณธ ๋ฐœ๋ช…์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋Š” ๋ฉ”ํƒˆPCB์˜ ํ•œ์ชฝ์— ํžˆํŠธ์‹ฑํฌ์™€ ํžˆํŠธํŒŒ์ดํ”„ ๋ฐ ๋ฐฉ์—ด ํ•€(Fin)์„ ๋ฐฐ์น˜ํ•จ์œผ๋กœ์จ ๋ฐฉ์—ด๊ธฐ๊ตฌ์˜ ๋ถ€ํ”ผ๋ฅผ ์ž‘๊ณ  ๊ฐ€๋ณ๊ฒŒ ์ œ๊ณตํ•  ์ˆ˜ ์žˆ๋‹ค.In addition, the light emitting diode lamp according to the present invention can provide a small and light volume of the heat dissipation mechanism by disposing a heat sink, a heat pipe and a heat dissipation fin on one side of the metal PCB.

๋„ 1์€ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋ฅผ ์„ค๋ช…ํ•˜๊ธฐ ์œ„ํ•œ ๋„๋ฉด์ด๋‹ค.1 is a view for explaining a light emitting diode lamp according to an embodiment of the present invention.

๋„ 2๋Š” ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„์˜ ๊ตฌ์„ฑ์„ ์„ค๋ช…ํ•˜๊ธฐ ์œ„ํ•ด ๋ถ„ํ•ดํ•˜์—ฌ ๋ณด์ธ ๋„๋ฉด์ด๋‹ค.2 is an exploded view illustrating the configuration of a light emitting diode lamp according to an embodiment of the present invention.

๋„ 3์€ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„์—์„œ ๋ฐฉ์—ดํ•€์˜ ์ผ๋ก€๋ฅผ ์„ค๋ช…ํ•˜๊ธฐ ์œ„ํ•œ ๋„๋ฉด์ด๋‹ค.3 is a view for explaining an example of the heat radiation fin in the light emitting diode lamp according to an embodiment of the present invention.

๋„ 4๋Š” ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„์—์„œ ๋ฐฉ์—ด์„ ์„ค๋ช…ํ•˜๊ธฐ ์œ„ํ•œ ๋„๋ฉด์ด๋‹ค.4 is a view for explaining heat radiation in the LED lamp according to an embodiment of the present invention.

(๋„๋ฉด์˜ ์ฃผ์š”๋ถ€๋ถ„์— ๋Œ€ํ•œ ๋ถ€ํ˜ธ์˜ ์„ค๋ช…)(Explanation of symbols for the main parts of the drawing)

10: LED ๋žจํ”„10: LED lamp

20: ์ปค๋ฒ„ 22: ์ œ1 ์ฒด๊ฒฐ ํ™€20: cover 22: first fastening hole

30: ํ”„๋ ˆ์ž„ 32, 34: ์ œ1, ์ œ2 ์ฒด๊ฒฐ๋ถ€30: frames 32, 34: first and second fastening portions

36, 38: ์ œ1, ์ œ2 ์ฒด๊ฒฐ ๋ณผํŠธ36, 38: 1st, 2nd fastening bolt

40: ์†Œ์ผ“ ์ปค๋ฒ„ 42: ์ œ2 ์ฒด๊ฒฐ ํ™€40: socket cover 42: second fastening hole

44: ์†Œ์ผ“ 50: ํžˆํŠธ ํŒŒ์ดํ”„(heat pipe)44: socket 50: heat pipe

50a, 50b, 50c, 50d, 50e: ์ œ1, ์ œ2, ์ œ3, ์ œ4, ์ œ5 ํžˆํŠธ ํŒŒ์ดํ”„50a, 50b, 50c, 50d, 50e: first, second, third, fourth and fifth heat pipes

52, 56: ์ œ1, ์ œ2 ์„ ํ˜•๋ถ€ 54: ์ ˆ๊ณก๋ถ€52, 56: first and second linear portion 54: bend portion

60: ๋ฐฉ์—ด ํ•€(Fin)60: heat dissipation fin

62: ํ”Œ๋ ˆ์ดํŠธ 64: ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ62: plate 64: heat sink sheet

64a, 64b, 64c, 64d, 64e: ์ œ1, ์ œ2, ์ œ3, ์ œ4, ์ œ5 ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ64a, 64b, 64c, 64d, 64e: first, second, third, fourth, fifth heat sink sheet

66: ํฌ์ผ“ 68: ํžˆํŠธํŒŒ์ดํ”„ ํ™€66: pocket 68: heat pipe hole

68a, 68b, 68c, 68d, 68e: ์ œ1, ์ œ2, ์ œ3, ์ œ4, ์ œ5 ํžˆํŠธํŒŒ์ดํ”„ ํ™€68a, 68b, 68c, 68d, and 68e: first, second, third, fourth, and fifth heat pipe holes

70: ์Šฌ๋ฆฟ 72: ์ŠคํŽ˜์ด์„œ70: slit 72: spacer

74: ๋ฆฝ74: lip

80: ํžˆํŠธ ์‹ฑํฌ(heat sink) 82: ํžˆํŠธํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ80: heat sink 82: heat pipe groove

82a, 82b, 82c, 82d, 82e: ์ œ1, ์ œ2, ์ œ3, ์ œ4, ์ œ5 ํžˆํŠธํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ82a, 82b, 82c, 82d, 82e: first, second, third, fourth, fifth heat pipe grooves

84: ์•ต๊ธ€ ํŒŒํŠธ84: angle parts

90: ๋ฉ”ํƒˆPCB 92: ๊ธฐํŒ90: metal PCB 92: substrate

94, 96: ์ œ1, ์ œ2 ํ†ต๊ธฐ ํ™€ 98: LED์†Œ์ž94, 96: 1st, 2nd ventilation hole 98: LED element

98a, 98b, 98c, 98d, 98e: ์ œ1, ์ œ2, ์ œ3, ์ œ4, ์ œ5 LED์—ด98a, 98b, 98c, 98d, 98e: first, second, third, fourth, and fifth LED strings

100: ํˆฌ๊ด‘ ์ปค๋ฒ„ 102: ๊ฒฉ๋ฒฝ100: floodlight 102: partition wall

104: ๋ผ๋ฒจ ์‹œํŠธ 106: ์ปค๋ฒ„ ์—์ง€104: label sheet 106: cover edge

๋ณธ ๋ฐœ๋ช…์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋Š”, ์ปค๋ฒ„(20)์™€ ์ด๊ฒฉ๋˜๊ฒŒ ๋ฐฐ์น˜๋˜๊ณ  ์™ธ์ธก์— ์†Œ์ผ“(44)์ด ๊ตฌ๋น„๋œ ์†Œ์ผ“ ์ปค๋ฒ„(40); ์ƒ๊ธฐ ์ปค๋ฒ„(20)์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์‚ฌ์ด์— ์„ค์น˜๋˜์–ด ์ƒ๊ธฐ ์ปค๋ฒ„(20)์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„(40)๋ฅผ ์ง€์ง€ํ•˜๋Š” ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30); ์ƒ๊ธฐ ํ”„๋ ˆ์ž„(30)์— ์‚ฝ์ž…๋˜๊ณ  ์ƒ๊ธฐ ์ปค๋ฒ„(20)์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์‚ฌ์ด์— ๋ฐฐ์น˜๋˜๋Š” ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60); ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(50)์˜ ์™ธ์ธก์— ์ œ1 ์„ ํ˜•๋ถ€(52)๊ฐ€ ์œ„์น˜ํ•˜๋ฉฐ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€(50)์— ๊ด€ํ†ต๋˜์–ด ์ ‘ํ•˜๋„๋ก ์ œ2 ์„ ํ˜•๋ถ€(56)๊ฐ€ ํ˜•์„ฑ๋œ ํžˆํŠธ ํŒŒ์ดํ”„(50); ์ƒ๊ธฐ ์ œ1 ์„ ํ˜•๋ถ€(52)์— ๋ผ์›Œ์ง€๋ฉฐ ์ผ์ธก์€ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)๊ณผ ์ ‘ํ•˜๋Š” ํžˆํŠธ ์‹ฑํฌ(80); ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80)์˜ ์™ธ์ธก์— ๋ฐฐ์น˜๋˜๊ณ  ๊ฒ‰ ํ‘œ๋ฉด์— LED์†Œ์ž(98)๊ฐ€ ๋ณต์—ด๋กœ ๋ฐฐ์น˜๋˜๋Š” ๋ฉ”ํƒˆPCB(90); ๋ฐ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)์˜ ์™ธ์ธก์— ๋ฐฐ์น˜๋˜๊ณ  ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80)์— ๊ฒฐ์†๋˜์–ด ์ƒ๊ธฐ LED์†Œ์ž(98)์—์„œ ๋ฐœ๊ด‘ํ•˜๋Š” ๋น›์„ ์™ธ๋ถ€๋กœ ํˆฌ์˜๋˜๋„๋ก ํ•˜๋Š” ํˆฌ๊ด‘์ปค๋ฒ„(100);๋ฅผ ํฌํ•จํ•˜์—ฌ ๊ตฌ์„ฑ๋œ๋‹ค.The light emitting diode lamp according to the present invention includes a socket cover 40 disposed spaced apart from the cover 20 and provided with a socket 44 on the outside thereof; A plurality of frames (30) installed between the cover (20) and the socket cover (40) to support the cover (20) and the socket cover (40); A plurality of heat dissipation fins 60 inserted into the frame 30 and disposed between the cover 20 and the socket cover 40; A heat pipe 50 having a first linear portion 52 positioned outside the plurality of heat dissipation fins 50 and having a second linear portion 56 penetrating and contacting the plurality of heat dissipation fins 50; A heat sink 80 inserted into the first linear portion 52 and in contact with the plurality of heat dissipation fins 60; A metal PCB (90) disposed outside the heat sink (80) and having an LED element (98) arranged in a double row on an outer surface thereof; And a floodlight cover 100 disposed outside the metal PCB 90 and bound to the heat sink 80 to project the light emitted from the LED device 98 to the outside.

๋ณธ ๋ฐœ๋ช…์˜ ์ด์  ๋ฐ ํŠน์ง•, ๊ทธ๋ฆฌ๊ณ  ๊ทธ๊ฒƒ๋“ค์„ ๋‹ฌ์„ฑํ•˜๋Š” ๋ฐฉ๋ฒ•์€ ์ฒจ๋ถ€๋˜๋Š” ๋„๋ฉด๊ณผ ํ•จ๊ป˜ ์ƒ์„ธํ•˜๊ฒŒ ํ›„์ˆ ๋˜์–ด ์žˆ๋Š” ์‹ค์‹œ์˜ˆ๋ฅผ ์ฐธ์กฐํ•˜๋ฉด ๋ช…ํ™•ํ•ด์งˆ ๊ฒƒ์ด๋‹ค.Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings.

๋ช…์„ธ์„œ ์ „์ฒด์— ๊ฑธ์ณ ๋™์ผ ์ฐธ์กฐ ๋ถ€ํ˜ธ๋Š” ๋™์ผ ๊ตฌ์„ฑ์š”์†Œ๋ฅผ ์ง€์นญํ•˜๊ณ , ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ๋Š” LED๋กœ ์•ฝ์นญํ•˜๋ฉฐ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋Š” LED ๋žจํ”„๋กœ ์•ฝ์นญํ•œ๋‹ค.Like reference numerals refer to like elements throughout, the light emitting diodes are abbreviated as LEDs, and the light emitting diode lamps are abbreviated as LED lamps.

์ดํ•˜, ๋„ 1 ๋ฐ ๋„ 2๋ฅผ ์ฐธ์กฐํ•˜์—ฌ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„์— ๋Œ€ํ•ด์„œ ์„ค๋ช…ํ•œ๋‹ค.Hereinafter, a light emitting diode lamp according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 and 2.

์ฒจ๋ถ€๋„๋ฉด ๋„ 1์€ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋ฅผ ์„ค๋ช…ํ•˜๊ธฐ ์œ„ํ•œ ์˜ˆ์‹œ๋„๋ฉด์ด๊ณ , ์ฒจ๋ถ€๋„๋ฉด ๋„ 2๋Š” ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„์˜ ๊ตฌ์„ฑ์„ ์„ค๋ช…ํ•˜๊ธฐ ์œ„ํ•ด ๋ถ„ํ•ดํ•˜์—ฌ ๋ณด์ธ ์˜ˆ์‹œ๋„๋ฉด์ด๋‹ค.1 is an exemplary view for explaining a light emitting diode lamp according to an embodiment of the present invention, Figure 2 is an exploded view illustrating the configuration of a light emitting diode lamp according to an embodiment of the present invention Drawing.

๋ณธ ๋ฐœ๋ช…์˜ ์ผ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ LED๋žจํ”„(10)๋Š” ์ปค๋ฒ„(20)์™€ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์‚ฌ์ด์— ๋ฉ”ํƒˆPCB(90)๋ฅผ ๋ฐฐ์น˜๋˜๊ณ , ๋ฉ”ํƒˆPCB(90)์˜ ํ‘œ๋ฉด์— LED์†Œ์ž(98)๊ฐ€ ๋ฐฐ์น˜๋˜๋ฉฐ, ๋ฉ”ํƒˆPCB(90)์˜ ๋ฐฐ๋ฉด์— ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„(50)์™€ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์ด ๋ฐฐ์น˜๋œ๋‹ค.In the LED lamp 10 according to the embodiment of the present invention, the metal PCB 90 is disposed between the cover 20 and the socket cover 40, and the LED device 98 is disposed on the surface of the metal PCB 90. The heat pipe 50 and the plurality of heat dissipation fins 60 are disposed on the rear surface of the metal PCB 90.

์ฆ‰, ์ƒ์ˆ ํ•œ LED ์†Œ์ž(98)์—์„œ ๋ฐœ์—ด๋˜๋Š” ์—ด์—๋„ˆ์ง€๋Š” ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„(50)๋ฅผ ํ†ตํ•ด ์ „์—ด๋˜๊ณ  ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์—์„œ ๊ณต๋žญ๋˜์–ด ๊ฒฐ๊ตญ LED ์†Œ์ž(98)์—์„œ ๋ฐœ์ƒํ•˜๋Š” ์—ด์—๋„ˆ์ง€๋ฅผ ๋ƒ‰๊ฐ์‹œ์ผœ ์†Œ๋ฉธ์‹œํ‚ค๋Š” ๊ฒƒ์ด๋‹ค.That is, the heat energy generated by the above-described LED element 98 is heated through the plurality of heat pipes 50 described above and air-cooled by the above-described plurality of heat dissipation fins 60 to eventually generate heat energy generated by the LED element 98. It is cooled and extinguished.

๋„ 2์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด, ์ƒ์ˆ ํ•œ ์ปค๋ฒ„(20)์™€ ์ƒ์ˆ ํ•œ ์†Œ์ผ“ ์ปค๋ฒ„(40)๋Š” ๊ฐ๊ฐ ์ œ1 ์ฒด๊ฒฐ ํ™€(22)๊ณผ ์ œ2 ์ฒด๊ฒฐ ํ™€(42)์ด ํ˜•์„ฑ๋˜๊ณ , ์ƒ์ˆ ํ•œ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์™ธ์ธก์—๋Š” ์ „์›์„ ์ธ๊ฐ€๋ฐ›๊ธฐ ์œ„ํ•œ ์†Œ์ผ“(44)์ด ๋ฐฐ์น˜๋œ๋‹ค.As shown in FIG. 2, the above-described cover 20 and the above-described socket cover 40 each have a first fastening hole 22 and a second fastening hole 42, and the above-mentioned socket cover 40 The socket 44 for receiving power is disposed outside.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ์ปค๋ฒ„(20)์™€ ์ƒ์ˆ ํ•œ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์‚ฌ์ด์—๋Š” ํ”„๋ ˆ์ž„(30)์ด ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๊ณ , ํ”„๋ ˆ์ž„(30)์˜ ์–‘๋‹จ๋ถ€๋Š” ํ™€์ด ํ˜•์„ฑ๋˜๊ฑฐ๋‚˜ ์•”๋‚˜์‚ฌ๊ฐ€ ํ˜•์„ฑ๋  ์ˆ˜ ์žˆ์œผ๋ฉฐ, ์ƒ์ˆ ํ•œ ์ปค๋ฒ„(20)์˜ ์™ธ์ธก์—์„œ ์ œ1 ์ฒด๊ฒฐ ํ™€(22)์„ ํ†ตํ•ด ์ œ1 ์ฒด๊ฒฐ๋ณผํŠธ(36)๋ฅผ ๋ผ์šฐ๊ณ  ์ œ1 ์ฒด๊ฒฐ ๋ณผํŠธ(36)๋Š” ์ƒ์ˆ ํ•œ ํ”„๋ ˆ์ž„(30)์˜ ํ•œ์ชฝ ๋ ๋ถ€๋ถ„์˜ ์ œ1 ์ฒด๊ฒฐ๋ถ€(32)์— ์ฒด๊ฒฐํ•˜๋ฉฐ, ์ƒ์ˆ ํ•œ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์™ธ์ธก์—์„œ ์ œ2 ์ฒด๊ฒฐ ํ™€(42)์„ ํ†ตํ•ด ์ œ2 ์ฒด๊ฒฐ๋ณผํŠธ(38)๋ฅผ ๋ผ์šฐ๊ณ , ์ œ2 ์ฒด๊ฒฐ๋ณผํŠธ(38)๋Š” ์ƒ์ˆ ํ•œ ํ”„๋ ˆ์ž„(30)์˜ ๋‹ค๋ฅธ ํ•œ์ชฝ ๋ ๋ถ€๋ถ„์˜ ์ œ2 ์ฒด๊ฒฐ๋ถ€(34)์— ์ฒด๊ฒฐํ•œ๋‹ค.In addition, the frame 30 may be disposed between the above-described cover 20 and the above-described socket cover 40, the both ends of the frame 30 may be formed with a hole or a female screw, the cover described above The first fastening bolt 36 is inserted through the first fastening hole 22 from the outside of the 20, and the first fastening bolt 36 is the first fastening part 32 of one end of the frame 30 described above. ), The second fastening bolt 38 is inserted through the second fastening hole 42 at the outside of the socket cover 40, and the second fastening bolt 38 of the frame 30 is described above. It is fastened to the 2nd fastening part 34 of the other end part.

์—ฌ๊ธฐ์„œ, ์ƒ์ˆ ํ•œ ์ œ1, ์ œ2 ์ฒด๊ฒฐ๋ถ€(32)(34)๋Š” ๋‹จ์ˆœํ•œ ํ™€(hole) ๋˜๋Š” ์•”๋‚˜์‚ฌ์ผ ์ˆ˜ ์žˆ์œผ๋ฉฐ, ์ƒ์ˆ ํ•œ ์ œ1, ์ œ2 ์ฒด๊ฒฐ ๋ณผํŠธ(36)(38)๋Š” ์ƒ์ˆ ํ•œ ์ œ1, ์ œ2 ์ฒด๊ฒฐ๋ถ€(32)(34)์— ์ฒด๊ฒฐ๋  ๋•Œ์— ์•”๋‚˜์‚ฌ๋ฅผ ํ˜•์„ฑํ•˜๋ฉด์„œ ์ฒด๊ฒฐ๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๊ณ , ๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ ์•”๋‚˜์‚ฌ๊ฐ€ ์ด๋ฏธ ํ˜•์„ฑ๋œ ๊ฒฝ์šฐ ๋‚˜์‚ฌ ๊ฒฐํ•ฉ๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.Here, the above-described first and second fastening portions 32 and 34 may be simple holes or female threads, and the above-mentioned first and second fastening bolts 36 and 38 may be described above. When fastened to the second fastening portion 32, 34 may be fastened while forming a female screw, on the other hand, if the female screw is already formed may be screwed.

์ฆ‰, ์ƒ์ˆ ํ•œ ์ปค๋ฒ„(20)์™€ ์†Œ์ผ“ ์ปค๋ฒ„(40)๋Š” ํ”„๋ ˆ์ž„(30)์„ ๋งค๊ฐœ๋กœ ์„œ๋กœ ๊ฒฌ๊ณ ํ•˜๊ฒŒ ๊ณ ์ •๋˜๋Š” ๊ฒƒ์ด ์ˆ˜ ์žˆ๋‹ค.That is, the cover 20 and the socket cover 40 may be firmly fixed to each other through the frame 30.

๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ ์ƒ์ˆ ํ•œ ํ”„๋ ˆ์ž„(30)์€ 3๊ฐœ ์ด์ƒ์˜ ๋ณต์ˆ˜ ๊ฐœ๋กœ ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๊ณ , ํŠนํžˆ ์ƒ์ˆ ํ•œ ์†Œ์ผ“(44)์„ ๊ธฐ์ค€์œผ๋กœ ๋“ฑ๊ฐ„๊ฒฉ์œผ๋กœ ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ์œผ๋ฉฐ, ์ผ๋ก€๋กœ ์ฒจ๋ถ€๋„๋ฉด ๋„ 2์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด ํ”„๋ ˆ์ž„(30)์€ 4๊ฐœ๋กœ ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๋‹ค.On the other hand, the above-described frame 30 may be arranged in a plurality of three or more, in particular, may be arranged at equal intervals based on the above-described socket 44, as an example as shown in Figure 2 attached to the frame ( 30 may be arranged in four.

์ƒ์ˆ ํ•œ ๋ณต์ˆ˜๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์€ ๋„ 3์„ ์ฐธ์กฐํ•˜์—ฌ ์ข€ ๋” ์ƒ์„ธํ•˜๊ฒŒ ์„ค๋ช…ํ•œ๋‹ค.The plurality of heat dissipation fins 60 described above will be described in more detail with reference to FIG. 3.

์ฒจ๋ถ€๋„๋ฉด ๋„ 3์€ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ LED ๋žจํ”„์—์„œ ๋ฐฉ์—ด ํ•€(60)์˜ ์ผ๋ก€๋ฅผ ์„ค๋ช…ํ•˜๊ธฐ ์œ„ํ•œ ์˜ˆ์‹œ๋„๋ฉด์ด๋‹ค.Accompanying drawings Figure 3 is an exemplary view for explaining an example of the heat radiation fin 60 in the LED lamp according to an embodiment of the present invention.

๋„ 3์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด, ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์˜ ์™ธ์ฃผ์— ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30)์„ ์ˆ˜์šฉํ•˜๋„๋ก ํ•˜๋Š” ํฌ์ผ“(66)์ด ํ˜•์„ฑ๋˜๊ณ , ์ƒ์ˆ ํ•œ ํ”„๋ ˆ์ž„(30)๊ณผ ์ƒ์ˆ ํ•œ ํฌ์ผ“(66)์ด ์กฐ๋ฆฝ๋˜์–ด ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30)์— ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์ด ์ •๋ ฌ๋˜์–ด ์„ค์น˜๋  ์ˆ˜ ์žˆ๋‹ค.As shown in FIG. 3, a pocket 66 is formed on the outer circumference of the plurality of heat dissipation fins 60 so as to accommodate the plurality of frames 30, and the above-described frame 30 and the above-described pocket 66 are formed. The plurality of heat dissipation fins 60 described above may be aligned and installed in the plurality of frames 30 as described above.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์€ ํ”Œ๋ ˆ์ดํŠธ(62)์˜ ํ•œ์ชฝ์— ์ŠคํŽ˜์ด์„œ(72)๊ฐ€ ๋ฐฐ์น˜๋˜๊ณ , ์ƒ์ˆ ํ•œ ์ŠคํŽ˜์ด์„œ(72)์— ์˜ํ•ด ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์—์„œ ๊ฐ๊ฐ์˜ ๋ฐฉ์—ดํ•€(60)๊ณผ ๋‹ค๋ฅธ ๋ฐฉ์—ดํ•€(60)๊ฐ„์— ๊ฐ„๊ฒฉ์ด ํ˜•์„ฑ๋˜๋ฉฐ ์ƒ์ˆ ํ•œ ๊ฐ„๊ฒฉ์— ๊ณต๊ธฐ๊ฐ€ ๋Œ€๋ฅ˜ ํ•˜์—ฌ ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์ด ๊ณต๋žญ๋˜๋Š” ๊ฒƒ์ด๋‹ค.In addition, in the plurality of heat dissipation fins 60 described above, a spacer 72 is disposed on one side of the plate 62, and each of the heat dissipation fins 60 is formed at the plurality of heat dissipation fins 60 described above by the spacer 72. A gap is formed between the heat sink and the other heat dissipation fin 60, and air is convection in the above-described gap so that the plurality of heat dissipation fins 60 are air-cooled.

์ŠคํŽ˜์ด์„œ(72)์˜ ๊ตฌ์„ฑ์— ๋Œ€ํ•˜์—ฌ ์ข€ ๋” ์ƒ์„ธํ•˜๋ฉด, ์ŠคํŽ˜์ด์„œ(72)๋Š” ๋Œ€๋žต U์ž ํ˜•์ƒ์œผ๋กœ ํ˜•์„ฑ๋˜๊ณ  ์—์ง€(edge)๋ถ€๋ถ„์— ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฆฝ(74)์ด ํ˜•์„ฑ๋œ๋‹ค.In more detail with respect to the configuration of the spacer 72, the spacer 72 is formed in a substantially U-shape and a plurality of ribs 74 are formed at an edge portion.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ํ”Œ๋ ˆ์ดํŠธ(62)์—๋Š” ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฆฝ(74)๊ณผ ๋Œ€์‘ํ•˜๋Š” ์œ„์น˜์— ์Šฌ๋ฆฟ(70)์ด ํ˜•์„ฑ๋˜๊ณ , ์ƒ์ˆ ํ•œ ์Šฌ๋ฆฟ(70)์— ์ƒ์ˆ ํ•œ ๋ฆฝ(74)์ด ์‚ฝ์ž…๋œ ํ›„์— ๋ฆฝ(74)์ด ๊ตฌ๋ถ€๋ ค์ ธ ์ŠคํŽ˜์ด์„œ(72)์™€ ํ”Œ๋ ˆ์ดํŠธ(62)๊ฐ€ ์กฐ๋ฆฝ๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.Further, the slit 70 is formed at the position corresponding to the plural lips 74 described above in the plate 62 described above, and the lip 74 is inserted after the lip 74 described above is inserted in the slit 70 described above. ) May be bent to assemble the spacer 72 and the plate 62.

๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ ์ŠคํŽ˜์ด์„œ(72)์™€ ํ”Œ๋ ˆ์ดํŠธ(62)๊ฐ€ ์šฉ์ ‘์— ์˜ํ•ด ์กฐํ•ฉ๋  ์ˆ˜๋„ ์žˆ๋‹ค.On the other hand, the spacer 72 and the plate 62 described above may be combined by welding.

์ฆ‰, ์ƒ์ˆ ํ•œ ๋ฐ”์™€ ๊ฐ™์ด ์ŠคํŽ˜์ด์„œ(72)์˜ ๋‘๊ป˜๋งŒํผ ๊ฐ„๊ฒฉ์ด ํ˜•์„ฑ๋  ์ˆ˜ ์žˆ๋Š” ๊ฒƒ์ด๋‹ค.That is, as described above, the gap may be formed by the thickness of the spacer 72.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ๋ฐฉ์—ดํ•€(60)์˜ ํ•œ์ชฝ์—๋Š” ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64)๊ฐ€ ํ˜•์„ฑ๋˜๊ณ  ๋‹ค๋ฅธ ํ•œ์ชฝ์—๋Š” ํžˆํŠธํŒŒ์ดํ”„ ํ™€(68)์ด ํ˜•์„ฑ๋˜๋ฉฐ, ์ƒ์ˆ ํ•œ ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64)์—๋Š” ํžˆํŠธ์‹ฑํฌ(80)๊ฐ€ ์ ‘ํ•˜๋„๋ก ๋ฐฐ์น˜๋œ๋‹ค.In addition, the heat sink sheet 64 is formed on one side of the heat dissipation fin 60 and the heat pipe hole 68 is formed on the other side, and the heat sink 80 is in contact with the heat sink sheet 64 described above. Is placed.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)์™€ ์ƒ์ˆ ํ•œ ๋ฐฉ์—ดํ•€(60)์—๋Š” ํžˆํŠธ ํŒŒ์ดํ”„(50)๊ฐ€ ์‚ฝ์ž…๋˜์–ด ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๊ณ , ํžˆํŠธ ์‹ฑํฌ(80)์—๋Š” ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)๊ฐ€ ์„ค์น˜๋˜๋ฉฐ, ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์˜ ๊ฒ‰์—๋Š” ํˆฌ๊ด‘์ปค๋ฒ„(100)๊ฐ€ ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๋‹ค.In addition, a heat pipe 50 may be inserted into the heat sink 80 and the heat dissipation fin 60 described above, and the metal sink 90 may be installed in the heat sink 80. The floodlight cover 100 may be disposed on the outside of the PCB 90.

์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(50)๋Š” ์ œ1 ์„ ํ˜•๋ถ€(52)์™€ ์ œ2 ์„ ํ˜•๋ถ€(56)๊ฐ€ ์ ˆ๊ณก๋ถ€(54)๋กœ ๊ตฌ๋ถ€๋ ค์ ธ ํ˜•์„ฑ๋˜๊ณ , ์ƒ์ˆ ํ•œ ์ œ1 ์„ ํ˜•๋ถ€(52)๋Š” ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์˜ ๋‚ด๋ถ€์— ์‚ฝ์ž…๋˜๋ฉฐ, ์ƒ์ˆ ํ•œ ์ œ2 ์„ ํ˜•๋ถ€(56)๋Š” ์ƒ์ˆ ํ•œ ๋ฐฉ์—ดํ•€(60)์„ ๊ด€ํ†ตํ•˜๊ฒŒ ๋ฐฐ์น˜๋œ๋‹ค.The heat pipe 50 described above is formed by bending the first linear portion 52 and the second linear portion 56 to the bent portion 54, and the first linear portion 52 described above is formed of the metal PCB (described above). It is inserted into the inside of the 90, the above-described second linear portion 56 is disposed to penetrate the above-described heat radiation fin (60).

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์—๋Š” ๊ฒ‰ ํ‘œ๋ฉด์— LED์†Œ์ž(98)๊ฐ€ ๋ณต์—ด๋กœ ๋ฐฐ์น˜๋˜๊ณ , LED์†Œ์ž(98)๋ฅผ ์ ๋“ฑํ•˜๊ธฐ ์œ„ํ•œ ํšŒ๋กœ๊ฐ€ ๋ฐฐ์น˜๋œ๋‹ค.In the above-described metal PCB 90, the LED elements 98 are arranged in double rows on the outer surface, and a circuit for turning on the LED elements 98 is disposed.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ํˆฌ๊ด‘์ปค๋ฒ„(100)๋Š” ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์˜ ์™ธ์ธก์— ๋ฐฐ์น˜๋˜๊ณ  ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)์— ๊ฒฐ์†๋˜์–ด ์ƒ์ˆ ํ•œ LED์†Œ์ž(98)์—์„œ ๋ฐœ๊ด‘ํ•˜๋Š” ๋น›์„ ์™ธ๋ถ€๋กœ ํˆฌ์˜๋˜๋„๋ก ํ•˜๋Š” ๊ฒƒ์ด๋‹ค.In addition, the floodlight cover 100 described above is disposed outside the metal PCB 90 and bound to the heat sink 80 to project the light emitted from the LED device 98 to the outside. .

์ƒ์ˆ ํ•œ LED์†Œ์ž(98)๋Š” ๋ณต์—ด๋กœ ๊ตฌ์„ฑ๋  ์ˆ˜ ์žˆ๊ณ , ์ผ๋ก€๋กœ์„œ ๋„ 1 ๋‚ด์ง€ ๋„ 4์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด 5์—ด๋กœ ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๋‹ค.The above-described LED elements 98 may be configured in a double row, and may be arranged in five rows as shown in FIGS. 1 to 4 as an example.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(50)๋Š” ์ƒ๊ธฐ LED ์†Œ์ž(98)์˜ ์—ด ์ˆ˜์™€ ๋Œ€์‘ํ•˜๊ฒŒ ๊ตฌ๋น„๋  ์ˆ˜ ์žˆ๊ณ , ๋ณธ ๋ฐœ๋ช…์˜ ์ผ์‹ค์‹œ์˜ˆ์—์„œ๋Š” LED ์†Œ์ž(98)๋ฅผ 5์—ด๋กœ ๊ตฌ์„ฑํ•˜์˜€์œผ๋ฏ€๋กœ ํžˆํŠธ ํŒŒ์ดํ”„(50)์˜ ๊ฐœ์ˆ˜๋Š” 5๊ฐœ๊ฐ€ ๊ตฌ๋น„๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.In addition, the above-described heat pipe 50 may be provided to correspond to the number of columns of the LED element 98, in the embodiment of the present invention, since the LED element 98 is configured in five rows of the heat pipe 50 The number may be provided with five.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)๋Š” ์ƒ์ˆ ํ•œ LED ์†Œ์ž(98)์˜ ์—ด ์ˆ˜์™€ ๋Œ€์‘ํ•˜๊ฒŒ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)๊ฐ€ ํ˜•์„ฑ๋  ์ˆ˜ ์žˆ๊ณ , ๋ณธ ๋ฐœ๋ช…์˜ ์ผ์‹ค์‹œ์˜ˆ์—์„œ๋Š” LED์†Œ์ž(98)๋ฅผ 5์—ด๋กœ ๊ตฌ์„ฑํ•˜์˜€์œผ๋ฏ€๋กœ ํžˆํŠธํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)๋Š” 5๊ฐœ๋กœ ํ˜•์„ฑ๋  ์ˆ˜ ์žˆ๋‹ค.In addition, the heat sink 80 may be formed with a heat pipe groove 82 to correspond to the number of columns of the LED element 98 described above, and in one embodiment of the present invention, the LED element 98 is divided into five rows. Since the heat pipe groove 82 can be formed into five because it is configured.

๋˜ํ•œ, ๋„ 4์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด, ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์€ ํ•œ์ชฝ์— ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)์˜ ํ˜•์ƒ๊ณผ ๋Œ€์‘ํ•˜๋Š” ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64)๊ฐ€ ํ˜•์„ฑ๋˜๊ณ , ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(50)์˜ ์ œ1 ์„ ํ˜•๋ถ€(52)๋Š” ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)์— ์‚ฝ์ž…๋˜๋ฉฐ, ์ƒ์ˆ ํ•œ ์ œ1 ์„ ํ˜•๋ถ€(52)์˜ ์ผ๋ถ€์™€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)์˜ ๋ฐฐ๋ฉด์— ๋‹ฟ๊ฒŒ ๋˜๊ณ , ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)์˜ ๋ฐฐ๋ฉด์€ ์ƒ์ˆ ํ•œ ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64)์— ๋‹ฟ๋Š”๋‹ค.In addition, as shown in FIG. 4, the plurality of heat dissipation fins 60 described above are provided with a heat sink sheet 64 corresponding to the shape of the heat pipe groove 82 described above on one side, and the heat pipe 50 described above. The first linear portion 52 is inserted into the above-described heat pipe groove 82, and a part of the above-described first linear portion 52 and the back surface of the metal PCB 90, the heat pipe described above The back surface of the groove 82 touches the heat sink sheet 64 described above.

์ƒ์ˆ ํ•œ ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64)๋Š” ๋„ 2 ๋ฐ ๋„ 4์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด, ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(98)์˜ ๊ฐœ์ˆ˜๋งŒํผ ๋ฐ˜์› ์›ํ˜ธํ˜•์ƒ์œผ๋กœ ์ ˆ๊ณก๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๊ณ , ๋”์šฑ ์ƒ์„ธํ•˜๊ฒŒ๋Š” LED์†Œ์ž(98)๊ฐ€ ์ œ1 ๋‚ด์ง€ ์ œ5 LED ์—ด(98a ~ 98e)๋กœ ๊ตฌ์„ฑ๋  ์ˆ˜ ์žˆ๊ณ , ํžˆํŠธ ์‹ฑํฌ(80)์—๋Š” ์ƒ์ˆ ํ•œ ์ œ1 ๋‚ด์ง€ ์ œ5 LED ์—ด(98a ~ 98e)์— ๋Œ€์‘ํ•˜๋„๋ก ๊ฐ๊ฐ ์ œ1 ~ ์ œ5 ํžˆํŠธํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82a ~ 82e)๋กœ ๊ตฌ์„ฑ๋  ์ˆ˜ ์žˆ๋‹ค.2 and 4, the heat sink sheet 64 may be bent in a semicircular arc shape by the number of the heat pipes 98 described above, and more specifically, the LED element 98 may be formed. 1 to 5 LED columns (98a to 98e), the heat sink 80, respectively, to correspond to the above-described first to fifth LED columns (98a to 98e) the first to fifth heat pipe groove ( 82a to 82e).

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ์ œ1 ~ ์ œ5 ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82a ~ 82e)์—๋Š” ๊ฐ๊ฐ ์ œ1 ~ ์ œ5 ํžˆํŠธํŒŒ์ดํ”„(50a ~ 50e)๊ฐ€ ์‚ฝ์ž…๋˜์–ด ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๋‹ค.Further, the first to fifth heat pipes 50a to 50e may be inserted into the first to fifth heat pipe grooves 82a to 82e, respectively.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)์˜ ๋ฐฐ๋ฉดํ˜•์ƒ์€ ์›ํ˜ธ์˜ ์ผ๋ถ€์˜ ํ˜•์ƒ์ด LED์†Œ์ž(98)์˜ ๊ฐœ์ˆ˜๋งŒํผ ๋ณผ๋กํ•˜๊ฒŒ ํ˜•์„ฑ๋˜๋Š” ๊ฒƒ์ด๊ณ , ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ ์‹œํŠธ(64)๋Š” ๋„ 4์˜ ์ƒ์„ธ๋„๋ฉด์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด, ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)์™€ ๊ธด๋ฐ€ํ•˜๊ฒŒ ๋ฐ€์ฐฉ๋˜๋„๋ก ์›ํ˜ธ ํ˜•์ƒ์œผ๋กœ ๊ฐ๊ฐ ์ œ1 ~ ์ œ5 ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64a ~ 64e)๊ฐ€ ํ˜•์„ฑ๋œ๋‹ค.In addition, the back shape of the heat sink 80 mentioned above is that the shape of a part of circular arc is convex as many as the number of LED elements 98, The heat sink sheet 64 mentioned above is as shown in the detailed drawing of FIG. Likewise, the first to fifth heat sink sheets 64a to 64e are formed in an arc shape so as to closely contact the heat sink 80 described above.

๋”ฐ๋ผ์„œ ์ƒ์ˆ ํ•œ LED ์†Œ์ž(98)์—์„œ ๋ฐœ์—ด๋˜๋Š” ์—ด์—๋„ˆ์ง€๊ฐ€ ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์™€ ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„(50)์™€ ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)๋ฅผ ํ†ตํ•˜์—ฌ ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์— ์‹ ์†ํ•˜๊ฒŒ ์ „์—ด๋˜๋Š” ๊ฒƒ์ด๋‹ค.Therefore, the heat energy generated by the above-described LED element 98 is transferred to the plurality of heat dissipation fins 60 described above through the above-described metal PCB 90, the plurality of heat pipes 50, and the heat sink 80. It will heat up quickly.

๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ ์ƒ์ˆ ํ•œ ์—ด์—๋„ˆ์ง€์˜ ์ผ๋ถ€๋Š” ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„(50)๋ฅผ ํ†ตํ•˜์—ฌ ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์— ์‹ ์†ํ•˜๊ฒŒ ์ „์—ด๋œ๋‹ค.On the other hand, a part of the above-mentioned thermal energy is rapidly transferred to the plurality of heat dissipation fins 60 described above through the plurality of heat pipes 50 described above.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ๋ฐฉ์—ด ํ•€(60)์€ ํžˆํŠธ ํŒŒ์ดํ”„(50)์˜ ์ œ2 ์„ ํ˜•๋ถ€(56)๊ฐ€ ๊ด€ํ†ต๋˜๋„๋ก ๊ฐ๊ฐ ์ œ1 ~ ์ œ5 ํžˆํŠธ ํŒŒ์ดํ”„ ํ™€(68a ~ 68e)์ด ํ˜•์„ฑ๋˜๊ณ , ํŠนํžˆ ์ƒ์ˆ ํ•œ ์ œ1 ~ ์ œ5 ํžˆํŠธ ํŒŒ์ดํ”„ ํ™€(68a ~ 68e)์€ ์ƒ์ˆ ํ•œ ๋ฐฉ์—ด ํ•€(60)์˜ ๋ฉด์ ์— ๊ณ ๋ฅด๊ฒŒ ๋ถ„์‚ฐ๋œ ์œ„์น˜์— ํ˜•์„ฑ๋˜๋ฏ€๋กœ ๋ฐฉ์—ด์˜ ํšจ๊ณผ๋ฅผ ๊ทน๋Œ€ํ™”ํ•  ์ˆ˜ ์žˆ๋‹ค.In addition, the heat dissipation fin 60 described above is formed with first to fifth heat pipe holes 68a to 68e, respectively, so that the second linear portion 56 of the heat pipe 50 penetrates. The fifth heat pipe holes 68a to 68e are formed at positions evenly distributed in the area of the heat dissipation fin 60, thereby maximizing the effect of heat dissipation.

๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)์˜ ์™ธ์ธก๋ชจ์„œ๋ฆฌ์—๋Š” ๋ณต์ˆ˜ ๊ฐœ์˜ ์•ต๊ธ€ ํŒŒํŠธ(84)๊ฐ€ ์„œ๋กœ ๋Œ€ํ–ฅ๋˜๊ฒŒ ํ˜•์„ฑ๋  ์ˆ˜ ์žˆ๊ณ , ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ์•ต๊ธ€ ํŒŒํŠธ(84)์—๋Š” ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์™€ ์ƒ์ˆ ํ•œ ํˆฌ๊ด‘์ปค๋ฒ„(100)๊ฐ€ ์‚ฝ์ž…๋˜์–ด ๊ฒฐ์†๋  ์ˆ˜ ์žˆ๋‹ค.On the other hand, a plurality of angle parts 84 may be formed to face each other at the outer edge of the heat sink 80 described above, and the metal PCB 90 and the above-described metal parts 90 may be formed at the plurality of angle parts 84 described above. One floodlight cover 100 may be inserted and bound.

์ข€ ๋” ์ƒ์„ธํ•˜๊ฒŒ ์„ค๋ช…ํ•˜๋ฉด, ์ฒจ๋ถ€๋„๋ฉด ๋„ 4์˜ ์ƒ์„ธ๋„์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด, ์ƒ์ˆ ํ•œ ์•ต๊ธ€ ํŒŒํŠธ(84)๋Š” ๋‚ด์ธก ๋ฐฉํ–ฅ์œผ๋กœ ๋Œ์ถœ์„ ์ด ํ˜•์„ฑ๋œ ๊ฒƒ์ด๊ณ , ์ƒ์ˆ ํ•œ ํˆฌ๊ด‘์ปค๋ฒ„(100)์˜ ์™ธ์ธก ๋ชจ์„œ๋ฆฌ์—๋Š” ์ปค๋ฒ„ ์—์ง€(106)๊ฐ€ ํ˜•์„ฑ๋œ ๊ฒƒ์œผ๋กœ์จ, ํˆฌ๊ด‘์ปค๋ฒ„(100)์™€ ๋ฉ”ํƒˆPCB(90)๋ฅผ ํฌ๊ฐœ์–ด์ง„ ์ƒํƒœ์—์„œ ์ƒ์ˆ ํ•œ ํžˆํŠธ ์‹ฑํฌ(80)์˜ ๊ธธ์ด๋ฐฉํ–ฅ์œผ๋กœ ๋ณต์ˆ˜ ๊ฐœ์˜ ์•ต๊ธ€ ํŒŒํŠธ(84)์— ์Šฌ๋ผ์ด๋”ฉ ํ˜•ํƒœ๋กœ ๋ผ์›Œ ๋„ฃ์„ ์ˆ˜ ์žˆ๊ณ , ์ด์™€ ๊ฐ™์ด ๋ผ์›Œ ๋„ฃ๋Š” ๊ฒƒ์— ์˜ํ•ด ์กฐ๋ฆฝ์ด ์™„๋ฃŒ๋˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.In more detail, as shown in the detailed view of FIG. 4, the above-described angle part 84 has a protrusion line formed in an inward direction, and a cover edge (not shown) at an outer edge of the floodlight cover 100 described above. 106 is formed, it is possible to fit in the sliding form to the plurality of angle parts 84 in the longitudinal direction of the heat sink 80 described above in a state where the floodlight cover 100 and the metal PCB 90 is stacked, Assembly may be completed by fitting in this way.

๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์™€ ํžˆํŠธ ์‹ฑํฌ(80)์˜ ์‚ฌ์ด์— ์—ด์ „๋„ ์‹ค๋ฆฌ์ฝ˜์ด ๋„ํฌ๋˜์–ด ์—ด์ „๋„์˜ ํšจ๊ณผ๋ฅผ ๋”์šฑ ํ–ฅ์ƒ์‹œํ‚ฌ ์ˆ˜๋„ ์žˆ๋‹ค.On the other hand, thermally conductive silicon may be applied between the above-described metal PCB 90 and the heat sink 80 to further improve the effect of thermal conduction.

๋˜ ๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ ํˆฌ๊ด‘์ปค๋ฒ„(100)๋Š” ๋„ 1 ๋ฐ ๋„ 2์— ๋‚˜ํƒ€๋‚ธ ๋ฐ”์™€ ๊ฐ™์ด ๋‚ด์ธก์— ๋ณต์ˆ˜ ๊ฐœ์˜ ๊ฒฉ๋ฒฝ(102)์ด ํ˜•์„ฑ๋  ์ˆ˜ ์žˆ๊ณ , ์ƒ์ˆ ํ•œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๊ฒฉ๋ฒฝ(102)์€ ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์˜ ํ‘œ๋ฉด์„ ๊ฐ€์••ํ•˜์—ฌ ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(50)์™€ ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)๊ฐ€ ๋”์šฑ ๊ฐ•ํ•œ ์••๋ ฅ์œผ๋กœ ์ ‘์ด‰๋˜๊ฒŒ ํ•˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๋‹ค.On the other hand, the floodlight cover 100 described above may be formed with a plurality of partition walls 102 on the inside, as shown in Figures 1 and 2, the plurality of partition walls 102 described above is a metal PCB ( Pressing the surface of the 90 may be such that the heat pipe 50 and the above-described metal PCB 90 is in contact with a stronger pressure.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ํˆฌ๊ด‘์ปค๋ฒ„(100)์— ํ˜•์„ฑ๋œ ๋ณต์ˆ˜ ๊ฐœ์˜ ๊ฒฉ๋ฒฝ(102)์€ ์ƒ์ˆ ํ•œ ๋ฉ”ํƒˆPCB(90)์™€ ์ƒ์ˆ ํ•œ ํžˆํŠธ์‹ฑํฌ(80)๋ฅผ ๋”์šฑ ๊ฐ•ํ•œ ์••๋ ฅ์œผ๋กœ ์ ‘์ด‰ํ•  ์ˆ˜ ์žˆ๊ฒŒ ํ•จ์œผ๋กœ์จ ์—ด์ „๋‹ฌ ํšจ๊ณผ๋ฅผ ๋”์šฑ ํ–ฅ์ƒ์‹œํ‚ฌ ์ˆ˜ ์žˆ๋‹ค.In addition, the plurality of partitions 102 formed on the floodlight cover 100 may further contact the metal PCB 90 and the heat sink 80 at a higher pressure, thereby further improving the heat transfer effect. have.

์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(50)์˜ ๊ตฌ์„ฑ์€ ๋‚ด๊ฒฝ์— ๋ชจ์„ธ๊ด€์ด ํ˜•ํƒœ์˜ ๋ฏธ์„ธํ•œ ํ™ˆ์ด ํ˜•์„ฑ๋˜๋Š” ๊ฒƒ์ด๊ณ  ์—ด์ „๋‹ฌ ๋งค์งˆ์ด ๋‚ด์žฌ๋˜๋ฉฐ ์—ด์ด ๊ฐ€ํ•ด์ง€๋ฉด ๋งค์งˆ์ด ๊ธฐํ™”๋˜์–ด ํƒ€์ธก์œผ๋กœ ์‹ ์†ํ•˜๊ฒŒ ์ด๋™๋˜๋ฉด์„œ ์—ด์„ ์ „๋‹ฌํ•˜๋Š” ๊ฒƒ์œผ๋กœ์จ ์ด๋Ÿฌํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(500)์˜ ๊ธฐ์ˆ ์€ ์•Œ๋ ค์ง„ ๊ธฐ์ˆ ์„ ์ด์šฉํ•˜๋Š” ๊ฒƒ์œผ๋กœ ๋”์šฑ ์ƒ์„ธํ•œ ์„ค๋ช…์€ ์ƒ๋žตํ•œ๋‹ค.The configuration of the heat pipe 50 described above is to form a fine groove in the form of a capillary tube in the inner diameter, and the heat transfer medium is embedded, and when heat is applied, the medium is vaporized and quickly moves to the other side to transfer heat. The description of 500 uses known techniques and further description thereof will be omitted.

๋˜ํ•œ, ์ƒ์ˆ ํ•œ ์ปค๋ฒ„(20)์™€ ์ƒ์ˆ ํ•œ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์ฃผ์žฌ๋ฃŒ๋Š” ํ•ฉ์„ฑ์ˆ˜์ง€์ผ ์ˆ˜ ์žˆ์œผ๋ฉฐ, ์ƒ์ˆ ํ•œ ํ”„๋ ˆ์ž„(30), ๋ฐฉ์—ด ํ•€(60), ํžˆํŠธ ์‹ฑํฌ(80) ๋ฐ ๋ฉ”ํƒˆPCB(90)์˜ ์ฃผ ์žฌ์งˆ์€ ๊ฒฝ๊ธˆ์†์ผ ์ˆ˜ ์žˆ๊ณ , ์ผ๋ก€๋กœ์„œ ์•Œ๋ฃจ๋ฏธ๋Š„, ๋งˆ๊ทธ๋„ค์Š˜ ๋“ฑ์ผ ์ˆ˜ ์žˆ์œผ๋ฉฐ, ์ด๋กœ์จ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ LED๋žจํ”„(10)๋Š” ๊ทธ ๋ฌด๊ฒŒ๊ฐ€ ๊ฐ€๋ณ๊ฒŒ ์ œ๊ณต๋  ์ˆ˜ ์žˆ๋Š” ๊ฒƒ์ด๋‹ค.In addition, the main material of the cover 20 and the socket cover 40 described above may be a synthetic resin, the main frame of the frame 30, the heat dissipation fin 60, the heat sink 80 and the metal PCB 90 described above The material may be a light metal, and may be, for example, aluminum, magnesium, or the like, whereby the LED lamp 10 according to an embodiment of the present invention may be provided with a light weight.

๋˜ํ•œ, ํžˆํŠธํŒŒ์ดํ”„(50)์— ์˜ํ•œ ์‹ ์†ํ•œ ์—ด์ „๋‹ฌ๊ณผ ๋ฐฉ์—ดํ•€(60)์— ์˜ํ•œ ๊ณต๋žญ์— ์˜ํ•ด ์‹ ์†ํ•œ ๋ฐฉ์—ด์ด ๊ฐ€๋Šฅํ•˜์—ฌ LED์†Œ์ž(98)์—์„œ ๋ฐœ์ƒํ•˜๋Š” ์—ด์—๋„ˆ์ง€๋ฅผ ์‹ ์†ํ•˜๊ฒŒ ๋ƒ‰๊ฐ์‹œํ‚ฌ ์ˆ˜ ์žˆ๊ฒŒ ๋œ๋‹ค.In addition, rapid heat transfer by the heat pipe 50 and air cooling by the heat dissipation fins 60 enables rapid heat dissipation, thereby rapidly cooling the thermal energy generated by the LED device 98.

๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ ์†Œ์ผ“(44)์€ ์ข…๋ž˜์˜ ๋“ฑ๊ธฐ๊ตฌ์— ์„ค์น˜๋˜๋Š” ์†Œ์ผ“๊ณผ ๋™์ผํ•œ ๊ทœ๊ฒฉ์œผ๋กœ ์ œ๊ณต๋˜๋Š” ๊ฒƒ์œผ๋กœ์„œ ๋ณธ ๋ฐœ๋ช…์˜ ์ผ์‹ค์‹œ์˜ˆ์— ๋”ฐ๋ฅธ LED๋žจํ”„(10)๋ฅผ ๋“ฑ๊ธฐ๊ตฌ์— ์žฅ์ฐฉํ•  ๋•Œ์—๋Š” ์ข…๋ž˜์˜ ๋“ฑ๊ธฐ๊ตฌ๋ฅผ ๊ต์ฒดํ•˜์ง€ ์•Š๊ณ ๋„ ์ข…๋ž˜์˜ ๋“ฑ๊ธฐ๊ตฌ์— ๊ณง๋ฐ”๋กœ LED๋žจํ”„(10)๋ฅผ ์„ค์น˜ํ•  ์ˆ˜ ์žˆ๋Š” ๊ฒƒ์ด๋‹ค.On the other hand, the above-mentioned socket 44 is provided in the same standard as the socket installed in the conventional luminaire, when replacing the LED lamp 10 according to an embodiment of the present invention in the luminaire, the conventional luminaire is not replaced The LED lamp 10 can be installed directly in a conventional luminaire without having to.

๋˜ ๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(50)์˜ ์ ˆ๊ณก๋ถ€(54)๋Š” ์ƒ์ˆ ํ•œ ์ปค๋ฒ„(20)์— ์˜ํ•ด ๊ฐ€๋ ค์งˆ ์ˆ˜ ์žˆ๊ณ , ์ƒ์ˆ ํ•œ ํžˆํŠธ ํŒŒ์ดํ”„(50)์˜ ๊ฐ ๋‹จ๋ถ€๋Š” ์ƒ์ˆ ํ•œ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ๋‚ด์ธก์— ๋ฐฐ์น˜๋˜์–ด ์™ธ๋ถ€๋กœ๋ถ€ํ„ฐ ๊ฐ€๋ ค์งˆ ์ˆ˜ ์žˆ๋Š” ๊ฒƒ์œผ๋กœ LED๋žจํ”„(10)์˜ ์™ธ๊ด€์ด ๋ฏธ๋ คํ•ด์งˆ ์ˆ˜ ์žˆ๋‹ค.On the other hand, the bent portion 54 of the heat pipe 50 described above may be covered by the cover 20 described above, and each end of the heat pipe 50 described above may have the socket cover 40 described above. The inner side of the LED lamp 10 can be obscured by being able to be hidden from the outside.

๋˜ ๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ ํˆฌ๊ด‘ ์ปค๋ฒ„(100)์˜ ์™ธ์ธก ํ•œ์ชฝ์—๋Š” ๋ผ๋ฒจ ์‹œํŠธ(104)๊ฐ€ ๋ฐฐ์น˜๋  ์ˆ˜ ์žˆ๊ณ , ๊ทธ ๋ผ๋ฒจ์‹œํŠธ(104)๋Š” ๋ฉ”ํƒˆPCB(90)์— ๋ฐฐ์น˜๋˜๋Š” ์ „์›๋ฆฌ๋“œ์„  ๋“ฑ์ด ์™ธ๋ถ€๋กœ ๋ณด์ด๋Š” ๊ฒƒ์„ ๋ฐฉ์ง€ํ•  ์ˆ˜ ์žˆ๊ณ , ์•„์šธ๋Ÿฌ LED ๋žจํ”„(10)์˜ ์ƒํ‘œ๊ฐ€ ๋ถ€์ฐฉ๋  ์ˆ˜๋„ ์žˆ๋‹ค.On the other hand, the label sheet 104 may be disposed on the outer side of the above-described floodlight cover 100, the label sheet 104 is that the power lead line or the like disposed on the metal PCB 90 is visible to the outside In addition, the trademark of the LED lamp 10 may be attached.

๋˜ ๋‹ค๋ฅธ ํ•œํŽธ์œผ๋กœ, ์ƒ์ˆ ํ•œ LED์†Œ์ž(98)๋Š” ์†Œ๋น„์ „๋ ฅ์ด ๋‚ฎ์€ LED ์†Œ์ž(1~3W)๋ฅผ ๋ณต์—ด(5์—ด X 10์ค„)๋กœ ๋ฐฐ์น˜ํ•˜๋Š” ๊ฒƒ์ผ ์ˆ˜ ์žˆ๊ณ , ์ด๋กœ์จ ์†Œ๋น„์ „๋ ฅ์ด ์ƒ๋Œ€์ ์œผ๋กœ ๋†’์€ LED ์†Œ์ž(5W ์ด์ƒ)๋ฅผ ์†Œ๋Ÿ‰(3 ~ 5๊ฐœ์˜ ๋‹จ์—ด)์œผ๋กœ ๋ฐฐ์น˜ํ•˜๋Š” ๊ฒƒ์— ๋น„๊ตํ•˜์—ฌ ๋ฐœ๊ด‘๋˜๋Š” ๋น›์˜ ์กฐ๋„๋Š” ๋™์ผ/์œ ์‚ฌํ•˜๋ฉด์„œ๋„ ๋ฐœ์—ด์„ ๊ท ์ผํ•˜๊ฒŒ ๋ถ„์‚ฐ์‹œํ‚ฌ ์ˆ˜ ์žˆ์œผ๋ฉฐ ์ด๋กœ์จ LED ์†Œ์ž(98)์—์„œ ๋ฐœ์ƒํ•˜๋Š” ์—ด์—๋„ˆ์ง€๋ฅผ ๋”์šฑ ์‹ ์†ํ•˜๊ฒŒ ๋ƒ‰๊ฐ์‹œํ‚ฌ ์ˆ˜ ์žˆ๋Š” ๊ฒƒ์ด๋‹ค.On the other hand, the above-described LED element 98 may be arranged to arrange the LED elements (1 ~ 3W) of low power consumption in a double row (5 rows X 10 lines), whereby the LED elements (with relatively high power consumption) Compared to arranging a small amount (more than 5W) in a small amount (3 to 5 thermal insulation), the illuminance of emitted light is the same / similar, and the heat generation can be uniformly distributed, thereby more quickly dissipating thermal energy generated by the LED element 98. It can be cooled.

์ด์ƒ ์ฒจ๋ถ€๋œ ๋„๋ฉด์„ ์ฐธ์กฐํ•˜์—ฌ ๋ณธ ๋ฐœ๋ช…์˜ ์‹ค์‹œ์˜ˆ๋ฅผ ์„ค๋ช…ํ•˜์˜€์ง€๋งŒ, ๋ณธ ๋ฐœ๋ช…์ด ์†ํ•˜๋Š” ๊ธฐ์ˆ ๋ถ„์•ผ์˜ ๋‹น์—…์ž๋Š” ๋ณธ ๋ฐœ๋ช…์ด ๊ทธ ๊ธฐ์ˆ ์  ์‚ฌ์ƒ์ด๋‚˜ ํ•„์ˆ˜์  ํŠน์ง•์„ ๋ณ€๊ฒฝํ•˜์ง€ ์•Š๊ณ  ๋‹ค๋ฅธ ๊ตฌ์ฒด์ ์ธ ํ˜•ํƒœ๋กœ ์‹ค์‹œ๋  ์ˆ˜ ์žˆ๋‹ค๋Š” ๊ฒƒ์„ ์ดํ•ดํ•  ์ˆ˜ ์žˆ์„ ๊ฒƒ์ด๋‹ค.Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains can understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. will be.

๊ทธ๋Ÿฌ๋ฏ€๋กœ ์ด์ƒ์—์„œ ๊ธฐ์ˆ ํ•œ ์‹ค์‹œ์˜ˆ๋Š” ๋ชจ๋“  ๋ฉด์—์„œ ์˜ˆ์‹œ์ ์ธ ๊ฒƒ์ด๋ฉฐ ํ•œ์ •์ ์ธ ๊ฒƒ์ด ์•„๋‹Œ ๊ฒƒ์œผ๋กœ์„œ ์ดํ•ด๋˜์–ด์•ผ ํ•˜๊ณ , ๋ณธ ๋ฐœ๋ช…์˜ ๋ฒ”์œ„๋Š” ์ƒ๊ธฐ ์ƒ์„ธํ•œ ์„ค๋ช…์€ ํ›„์ˆ ํ•˜๋Š” ํŠนํ—ˆ์ฒญ๊ตฌ๋ฒ”์œ„์— ์˜ํ•˜์—ฌ ๋‚˜ํƒ€๋‚ด์–ด์ง€๋ฉฐ, ํŠนํ—ˆ์ฒญ๊ตฌ๋ฒ”์œ„์˜ ์˜๋ฏธ ๋ฐ ๋ฒ”์œ„ ๊ทธ๋ฆฌ๊ณ  ๊ทธ ๋“ฑ๊ฐ€๊ฐœ๋…์œผ๋กœ๋ถ€ํ„ฐ ๋„์ถœ๋˜๋Š” ๋ชจ๋“  ๋ณ€๊ฒฝ ๋˜๋Š” ๋ณ€ํ˜•๋œ ํ˜•ํƒœ๊ฐ€ ๋ณธ ๋ฐœ๋ช…์˜ ๋ฒ”์œ„์— ํฌํ•จ๋˜๋Š” ๊ฒƒ์œผ๋กœ ํ•ด์„๋˜์–ด์•ผ ํ•œ๋‹ค.Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is represented by the following detailed description, and the meaning and scope of the claims and All changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

๋ณธ ๋ฐœ๋ช…์— ๋”ฐ๋ฅธ ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„๋Š” ๋“ฑ๊ธฐ๊ตฌ์— ์„ค์น˜๋˜์–ด ๋น›์„ ๋ฐœ๊ด‘ํ•˜๋Š” ๋žจํ”„๋กœ ์ด์šฉ๋  ์ˆ˜ ์žˆ๋‹ค.The light emitting diode lamp according to the present invention may be installed in a luminaire and used as a lamp for emitting light.

Claims (6)

์ปค๋ฒ„(20)์™€ ์ด๊ฒฉ๋˜๊ฒŒ ๋ฐฐ์น˜๋˜๊ณ  ์™ธ์ธก์— ์†Œ์ผ“(44)์ด ๊ตฌ๋น„๋œ ์†Œ์ผ“ ์ปค๋ฒ„(40);A socket cover 40 disposed spaced apart from the cover 20 and provided with a socket 44 on an outer side thereof; ์ƒ๊ธฐ ์ปค๋ฒ„(20)์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์‚ฌ์ด์— ์„ค์น˜๋˜์–ด ์ƒ๊ธฐ ์ปค๋ฒ„(20)์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„(40)๋ฅผ ์ง€์ง€ํ•˜๋Š” ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30);A plurality of frames (30) installed between the cover (20) and the socket cover (40) to support the cover (20) and the socket cover (40); ์ƒ๊ธฐ ํ”„๋ ˆ์ž„(30)์— ์‚ฝ์ž…๋˜๊ณ  ์ƒ๊ธฐ ์ปค๋ฒ„(20)์™€ ์ƒ๊ธฐ ์†Œ์ผ“ ์ปค๋ฒ„(40)์˜ ์‚ฌ์ด์— ๋ฐฐ์น˜๋˜๋Š” ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60);A plurality of heat dissipation fins 60 inserted into the frame 30 and disposed between the cover 20 and the socket cover 40; ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(50)์˜ ์™ธ์ธก์— ์ œ1 ์„ ํ˜•๋ถ€(52)๊ฐ€ ์œ„์น˜ํ•˜๋ฉฐ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ดํ•€(50)์— ๊ด€ํ†ต๋˜์–ด ์ ‘ํ•˜๋„๋ก ์ œ2 ์„ ํ˜•๋ถ€(56)๊ฐ€ ํ˜•์„ฑ๋œ ํžˆํŠธ ํŒŒ์ดํ”„(50);A heat pipe 50 having a first linear portion 52 positioned outside the plurality of heat dissipation fins 50 and having a second linear portion 56 penetrating and contacting the plurality of heat dissipation fins 50; ์ƒ๊ธฐ ์ œ1 ์„ ํ˜•๋ถ€(52)์— ๋ผ์›Œ์ง€๋ฉฐ ์ผ์ธก์€ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)๊ณผ ์ ‘ํ•˜๋Š” ํžˆํŠธ ์‹ฑํฌ(80);A heat sink 80 inserted into the first linear portion 52 and in contact with the plurality of heat dissipation fins 60; ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80)์˜ ์™ธ์ธก์— ๋ฐฐ์น˜๋˜๊ณ  ๊ฒ‰ ํ‘œ๋ฉด์— LED์†Œ์ž(98)๊ฐ€ ๋ณต์—ด๋กœ ๋ฐฐ์น˜๋˜๋Š” ๋ฉ”ํƒˆPCB(90); ๋ฐA metal PCB (90) disposed outside the heat sink (80) and having an LED element (98) arranged in a double row on an outer surface thereof; And ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)์˜ ์™ธ์ธก์— ๋ฐฐ์น˜๋˜๊ณ  ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80)์— ๊ฒฐ์†๋˜์–ด ์ƒ๊ธฐ LED์†Œ์ž(98)์—์„œ ๋ฐœ๊ด‘ํ•˜๋Š” ๋น›์„ ์™ธ๋ถ€๋กœ ํˆฌ์˜๋˜๋„๋ก ํ•˜๋Š” ํˆฌ๊ด‘์ปค๋ฒ„(100);A floodlight cover 100 disposed outside the metal PCB 90 and bound to the heat sink 80 to project light emitted from the LED device 98 to the outside; ๋ฅผ ํฌํ•จํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„. Light emitting diode lamp comprising a. ์ œ 1ํ•ญ์— ์žˆ์–ด์„œ,The method of claim 1, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30)์€ ์ƒ๊ธฐ ์†Œ์ผ“(44)์— ๋Œ€ํ•˜์—ฌ ์ •๋ฉด์œผ๋กœ ํ•  ๋•Œ์— ์ƒ๊ธฐ ์†Œ์ผ“(44)์„ ๊ธฐ์ค€์œผ๋กœ 3๊ฐœ์†Œ ์ด์ƒ์— ๋ฐฐ์น˜๋˜๊ณ ,The plurality of frames 30 are disposed at three or more places with respect to the socket 44 when the front of the socket 44 is in front, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์˜ ์™ธ์ฃผ์— ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30)์„ ์ˆ˜์šฉํ•˜๋„๋ก ํ•˜๋Š” ํฌ์ผ“(66)์ด ํ˜•์„ฑ๋˜๋ฉฐ,A pocket 66 is formed on the outer circumference of the plurality of heat dissipation fins 60 to accommodate the plurality of frames 30. ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30) ์ค‘์— ๊ฐœ๋ณ„์˜ ํ”„๋ ˆ์ž„๊ณผ ์ƒ๊ธฐ ํฌ์ผ“(66)์ด ์กฐ๋ฆฝ๋˜์–ด ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํ”„๋ ˆ์ž„(30)์— ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์ด ์„ค์น˜๋˜๋Š” ๊ฒƒ;A plurality of heat dissipation fins 60 are installed in the plurality of frames 30 by assembling individual frames and the pockets 66 among the plurality of frames 30; ์„ ํŠน์ง•์œผ๋กœ ํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„.Light emitting diode lamp, characterized in that. ์ œ 1ํ•ญ ๋˜๋Š” ์ œ 2ํ•ญ์— ์žˆ์–ด์„œ,The method according to claim 1 or 2, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์€,The plurality of heat dissipation fins 60, ํ”Œ๋ ˆ์ดํŠธ(62)์˜ ํ•œ์ชฝ์— ์ŠคํŽ˜์ด์„œ(72)๊ฐ€ ๋ฐฐ์น˜๋˜๊ณ ,The spacer 72 is disposed on one side of the plate 62, ์ƒ๊ธฐ ์ŠคํŽ˜์ด์„œ(72)์— ์˜ํ•ด ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์— ๊ฐ„๊ฒฉ์ด ํ˜•์„ฑ๋˜๋ฉฐ ์ƒ๊ธฐ ๊ฐ„๊ฒฉ์— ๊ณต๊ธฐ๊ฐ€ ๋Œ€๋ฅ˜ ํ•˜์—ฌ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์ด ๊ณต๋žญ๋˜๋Š” ๊ฒƒ;Spaces are formed in the plurality of heat dissipation fins 60 by the spacers 72 and air is convection in the spaces so that the plurality of heat dissipation fins 60 are air-cooled; ์„ ํŠน์ง•์œผ๋กœ ํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„.Light emitting diode lamp, characterized in that. ์ œ 1ํ•ญ์— ์žˆ์–ด์„œ,The method of claim 1, ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„(50)๋Š” ์ƒ๊ธฐ LED ์†Œ์ž(98)์˜ ์—ด ์ˆ˜์™€ ๋Œ€์‘ํ•˜๊ฒŒ ๊ตฌ๋น„๋˜๊ณ ,The heat pipe 50 is provided to correspond to the number of columns of the LED element 98, ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80)๋Š” ์ƒ๊ธฐ LED ์†Œ์ž(98)์˜ ์—ด ์ˆ˜์™€ ๋Œ€์‘ํ•˜๊ฒŒ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)๊ฐ€ ํ˜•์„ฑ๋˜๋ฉฐ,The heat sink 80 is formed with a heat pipe groove 82 to correspond to the number of columns of the LED element 98, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์€ ํ•œ์ชฝ์— ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)์˜ ํ˜•์ƒ๊ณผ ๋Œ€์‘ํ•˜๋Š” ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64)๊ฐ€ ํ˜•์„ฑ๋˜๊ณ , ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„(50)์˜ ์ œ1 ์„ ํ˜•๋ถ€(52)๋Š” ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)์— ์‚ฝ์ž…๋˜๋ฉฐ, ์ƒ๊ธฐ ์ œ1 ์„ ํ˜•๋ถ€(52)์˜ ์ผ๋ถ€์™€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)์˜ ๋ฐฐ๋ฉด์— ๋‹ฟ๊ณ , ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„ ๊ทธ๋ฃจ๋ธŒ(82)์˜ ๋ฐฐ๋ฉด์€ ์ƒ๊ธฐ ํžˆํŠธ์‹ฑํฌ ์‹œํŠธ(64)์— ๋‹ฟ์•„, ์ƒ๊ธฐ LED ์†Œ์ž(98)์—์„œ ๋ฐœ์—ด๋˜๋Š” ์—ด์—๋„ˆ์ง€๊ฐ€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)์™€ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„(50)์™€ ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80)๋ฅผ ํ†ตํ•˜์—ฌ ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๋ฐฉ์—ด ํ•€(60)์— ์ „์—ด๋˜๊ณ ,The plurality of heat dissipation fins 60 has a heat sink sheet 64 corresponding to the shape of the heat pipe groove 82 on one side thereof, and the first linear portion 52 of the heat pipe 50 has the heat. Is inserted into the pipe groove 82, a part of the first linear portion 52 and the back of the metal PCB 90, the back of the heat pipe groove 82 is in contact with the heat sink sheet 64 Thermal energy generated by the LED element 98 is transferred to the plurality of heat dissipation fins 60 through the metal PCB 90, the plurality of heat pipes 50, and the heat sink 80. ์ƒ๊ธฐ ์—ด์—๋„ˆ์ง€์˜ ์ผ๋ถ€๋Š” ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„(50)๋ฅผ ํ†ตํ•ด ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ํžˆํŠธ ํŒŒ์ดํ”„(50)์— ์ „์—ด๋˜๋Š” ๊ฒƒ;Part of the thermal energy is transferred to the plurality of heat pipes (50) through the plurality of heat pipes (50); ์„ ํŠน์ง•์œผ๋กœ ํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„.Light emitting diode lamp, characterized in that. ์ œ 1ํ•ญ์— ์žˆ์–ด์„œ,The method of claim 1, ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80)์˜ ์™ธ์ธก๋ชจ์„œ๋ฆฌ์— ๋ณต์ˆ˜ ๊ฐœ์˜ ์•ต๊ธ€ ํŒŒํŠธ(84)๊ฐ€ ํ˜•์„ฑ๋˜๊ณ ,A plurality of angle parts 84 are formed at the outer edge of the heat sink 80, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ์•ต๊ธ€ ํŒŒํŠธ(84)์— ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)์™€ ์ƒ๊ธฐ ํˆฌ๊ด‘ ์ปค๋ฒ„(100)๊ฐ€ ์‚ฝ์ž…๋˜์–ด ๊ฒฐ์†๋˜๋Š” ๊ฒƒ;The metal PCB 90 and the floodlight cover 100 are inserted into and bound to the plurality of angle parts 84; ์„ ํŠน์ง•์œผ๋กœ ํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„.Light emitting diode lamp, characterized in that. ์ œ 1ํ•ญ ๋˜๋Š” ์ œ 5ํ•ญ์— ์žˆ์–ด์„œ,The method according to claim 1 or 5, ์ƒ๊ธฐ ํˆฌ๊ด‘์ปค๋ฒ„(100)์˜ ๋‚ด์ธก์— ๋ณต์ˆ˜ ๊ฐœ์˜ ๊ฒฉ๋ฒฝ(102)์ด ํ˜•์„ฑ๋˜๊ณ ,A plurality of partitions 102 are formed inside the floodlight cover 100, ์ƒ๊ธฐ ๋ณต์ˆ˜ ๊ฐœ์˜ ๊ฒฉ๋ฒฝ(102)์€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)์˜ ํ‘œ๋ฉด์„ ๊ฐ€์••ํ•˜์—ฌ ์ƒ๊ธฐ ํžˆํŠธ ์‹ฑํฌ(80) ๋˜๋Š” ์ƒ๊ธฐ ํžˆํŠธ ํŒŒ์ดํ”„(50)์™€ ์ƒ๊ธฐ ๋ฉ”ํƒˆPCB(90)๊ฐ€ ๋”์šฑ ๊ฐ•ํ•œ ํž˜์œผ๋กœ ๋ฐ€์ฐฉ๋˜๊ฒŒ ํ•˜๋Š” ๊ฒƒ;The plurality of partition walls 102 pressurize a surface of the metal PCB 90 such that the heat sink 80 or the heat pipe 50 and the metal PCB 90 are in close contact with a stronger force; ์„ ํŠน์ง•์œผ๋กœ ํ•˜๋Š” ๋ฐœ๊ด‘๋‹ค์ด์˜ค๋“œ ๋žจํ”„.Light emitting diode lamp, characterized in that.
PCT/KR2009/005734 2009-09-08 2009-10-08 Light-emitting diode lamp Ceased WO2011030949A1 (en)

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