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WO2011021780A3 - Composition pour film conducteur anisotrope - Google Patents

Composition pour film conducteur anisotrope Download PDF

Info

Publication number
WO2011021780A3
WO2011021780A3 PCT/KR2010/004720 KR2010004720W WO2011021780A3 WO 2011021780 A3 WO2011021780 A3 WO 2011021780A3 KR 2010004720 W KR2010004720 W KR 2010004720W WO 2011021780 A3 WO2011021780 A3 WO 2011021780A3
Authority
WO
WIPO (PCT)
Prior art keywords
composition
conductive film
anisotropic conductive
epoxy resin
aromatic rings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/004720
Other languages
English (en)
Korean (ko)
Other versions
WO2011021780A2 (fr
Inventor
박영우
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cheil Industries Inc
Original Assignee
Cheil Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheil Industries Inc filed Critical Cheil Industries Inc
Publication of WO2011021780A2 publication Critical patent/WO2011021780A2/fr
Publication of WO2011021780A3 publication Critical patent/WO2011021780A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne une composition pour film conducteur anisotrope, comprenant : une résine époxy contenant des noyaux aromatiques polycycliques ; une résine à base de caoutchouc acrylique ; des particules conductrices ; et un durcisseur. Après le durcissement, la résine époxy contenant des noyaux aromatiques polycycliques présente une température de transition vitreuse (Tg) de 165 °C à 220 °C, la résine à base de caoutchouc acrylique présente une Tg de 0 °C à 20 °C, et la teneur combinée de la résine époxy contenant des noyaux aromatiques polycycliques et de la résine à base de caoutchouc acrylique est de 45 à 65 % en poids du pourcentage pondéral total de la composition (partie solide). La composition pour un film conducteur anisotrope présente non seulement une flexibilité et une résistance aux impacts pour compenser la propriété cassante de la résine époxy dans des conditions de température et humidité élevées pour empêcher un film conducteur anisotrope durci de se fissurer, mais peut également diminuer la résistance au raccordement et augmenter la stabilité thermique de manière à présenter une fiabilité et une adhésivité de grande importance.
PCT/KR2010/004720 2009-08-20 2010-07-20 Composition pour film conducteur anisotrope Ceased WO2011021780A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0077079 2009-08-20
KR1020090077079A KR101138799B1 (ko) 2009-08-20 2009-08-20 이방 도전성 필름용 조성물

Publications (2)

Publication Number Publication Date
WO2011021780A2 WO2011021780A2 (fr) 2011-02-24
WO2011021780A3 true WO2011021780A3 (fr) 2011-05-19

Family

ID=43607426

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/004720 Ceased WO2011021780A2 (fr) 2009-08-20 2010-07-20 Composition pour film conducteur anisotrope

Country Status (4)

Country Link
KR (1) KR101138799B1 (fr)
CN (1) CN101993575B (fr)
TW (1) TWI423267B (fr)
WO (1) WO2011021780A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464353B1 (ko) 2011-12-28 2014-11-25 제일모직 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름, 및 이를 이용한 반도체 장치
KR101365107B1 (ko) * 2012-09-21 2014-02-20 제일모직주식회사 이방성 도전 필름 및 이를 포함하는 반도체 장치
JP6180159B2 (ja) * 2013-04-04 2017-08-16 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN104250525B (zh) * 2013-06-25 2016-04-20 第一毛织株式会社 各向异性导电膜、图像显示器及半导体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (fr) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Film adhesif conducteur anisotrope
JP2006008978A (ja) * 2004-06-23 2006-01-12 Lg Cable Ltd 異方導電性接着剤及びこれを用いた接着フィルム
KR100673773B1 (ko) * 2005-10-18 2007-01-24 제일모직주식회사 플루오렌계 (메타)아크릴레이트를 이용한 이방 전도성필름용 조성물
KR100722121B1 (ko) * 2006-07-21 2007-05-25 제일모직주식회사 고신뢰성 이방 전도성 필름용 조성물
KR100787728B1 (ko) * 2006-12-20 2007-12-24 제일모직주식회사 아크릴 고분자 중합체를 이용한 고신뢰성 이방 전도성필름용 조성물 및 이를 이용한 이방 전도성 필름
KR100891414B1 (ko) * 2007-11-20 2009-04-02 제일모직주식회사 저장안정성이 개선된 이방 도전성 필름용 조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101000798B1 (ko) * 2003-07-04 2010-12-13 회명산업 주식회사 이방성 도전성 필름 접착제 및 이를 이용하여 제조한 평판디스플레이
US7279268B2 (en) * 2004-09-09 2007-10-09 Intel Corporation Conductive lithographic polymer and method of making devices using same
US7326369B2 (en) * 2005-03-07 2008-02-05 National Starch And Chemical Investment Holding Corporation Low stress conductive adhesive
JP2007091959A (ja) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP2007112949A (ja) * 2005-10-24 2007-05-10 Sumitomo Electric Ind Ltd 異方導電性接着剤
CN1883938A (zh) * 2006-05-25 2006-12-27 刘萍 多层结构异方向导电膜及其制备方法
TW200815560A (en) * 2006-06-16 2008-04-01 Hitachi Chemical Co Ltd Film-shaped adhesive for circuit connection
CN101308711B (zh) * 2008-04-29 2010-11-10 深圳典邦科技有限公司 多层结构异方向导电膜及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001248A1 (fr) * 1991-07-12 1993-01-21 Minnesota Mining And Manufacturing Company Film adhesif conducteur anisotrope
JP2006008978A (ja) * 2004-06-23 2006-01-12 Lg Cable Ltd 異方導電性接着剤及びこれを用いた接着フィルム
KR100673773B1 (ko) * 2005-10-18 2007-01-24 제일모직주식회사 플루오렌계 (메타)아크릴레이트를 이용한 이방 전도성필름용 조성물
KR100722121B1 (ko) * 2006-07-21 2007-05-25 제일모직주식회사 고신뢰성 이방 전도성 필름용 조성물
KR100787728B1 (ko) * 2006-12-20 2007-12-24 제일모직주식회사 아크릴 고분자 중합체를 이용한 고신뢰성 이방 전도성필름용 조성물 및 이를 이용한 이방 전도성 필름
KR100891414B1 (ko) * 2007-11-20 2009-04-02 제일모직주식회사 저장안정성이 개선된 이방 도전성 필름용 조성물

Also Published As

Publication number Publication date
CN101993575A (zh) 2011-03-30
CN101993575B (zh) 2013-03-27
WO2011021780A2 (fr) 2011-02-24
TW201108253A (en) 2011-03-01
KR101138799B1 (ko) 2012-04-24
TWI423267B (zh) 2014-01-11
KR20110019519A (ko) 2011-02-28

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