WO2011021780A2 - Composition for anisotropic conductive film - Google Patents

Abstract

The present invention relates to a composition for an anisotropic conductive film, comprising: an epoxy resin containing polycyclic aromatic rings; an acrylic rubber-based resin; conductive particles; and a hardener. After hardening, the epoxy resin containing polycyclic aromatic rings has a glass transition temperature (Tg) of 165°C to 220°C, the acrylic rubber-based resin has a Tg of 0°C to 20°C, and the combined content of the epoxy resin containing polycyclic aromatic rings and the acrylic rubber-based resin is 45 to 65 wt % of the overall weight percentage of the composition (solid portion). The composition for an anisotropic conductive film not only has both flexibility and impact resistance to compensate for the brittle property of epoxy resin under high temperature and high moisture conditions to prevent a hardened anisotropic conductive film from cracking, but can also lower connection resistance and can supplement thermal stability so as to exhibit high reliability and high adhesiveness.

Description

 [Name of invention]

 Composition for anisotropic conductive film

[Technical Field]

 This invention relates to the composition for anisotropic conductive films which can be used as a connection material of a liquid crystal display device and a display apparatus panel, and the anisotropic conductive film by the composition.

Background 1

 In general, the 3-layer adhesive type FCCL (Flexible Copper Clad Laminate) manufacturing method used for conventional FOG (Film On Glass) bonding is performed by attaching copper foil and polyimide film with epoxy adhesive. The pattern was formed by the etching process. In this case, the thickness of the copper foil is about 18 / mi, and the pitch is about 60 degrees. In joining with existing Anisotropic Conductive Film, FCCL method has wide space and relatively thick copper foil, so the physical properties of anisotropic conductive film composed of epoxy resin and phenoxy resin are mainly used. The binding could be excellent. In addition, the epoxy-based adhesive is exposed in the FCCL space part, and thus the chemical usability is good, and it has excellent adhesion and connection reliability.

_. However, in recent years, FOG (Film On Glass) bonding has been increasingly applied to FPCB (Flexible Printed Circuit Board) of 2-layer adhesive-less type. This is because the two-layer non-adhesive type FPCB can be applied to a fine pitch of about 50 / m, is easy to manufacture, and has a light and thin sputtering method.

The cured products of conventional bisphenol-A type (BPA) type epoxy resins, bisphenol-F type (BPF) type epoxy resins, phenoxy resins and small amount of rubber resins are hard and strong, but hard Absorption capacity is weak and has brittleness. Regarding the reliability, there is a problem that bubbles are generated and a problem of deterioration of adhesion is more prominent in the two-layer non-adhesive FPCB than the three-layer adhesive FPCB. In particular, in the case of a two-layer non-adhesive type FPCB, the thickness of the copper foil is relatively thin, thereby causing a problem of physical adhesion deterioration, and the above-mentioned problem occurs because the FPCB space part is made of a polyimide film without epoxy adhesive. do. [Technical Challenges]

 The present invention appropriately controls the content of the polycyclic aromatic ring-containing epoxy resin and acrylic rubber resin, so as to compensate for brittle properties of the epoxy resin in a high temperature and high humidity state so that the anisotropic conductive film of the curing state is not broken. An object of the present invention is to provide a composition for anisotropic conductive films having both flexibility and layer resistance.

 In addition, an object of the present invention is to provide a composition for an anisotropic conductive film that can lower the connection resistance and supplement the heat stabilized partial.

 In addition, an object of the present invention is to provide an anisotropic conductive film having high reliability and high adhesion.

[Technical Solution]

The composition for anisotropic conductive films of the present invention comprises a polycyclic aromatic ring-containing epoxy resin, an acrylic rubber-based resin, conductive particles and a curing agent, and the polycyclic aromatic ring-containing epoxy resin has a glass transition temperature (Tg) after curing. It is about 165 ^° C ~ 220 ^° C, and the acrylic rubber resin has a glass transition temperature (Tg) of about 0 ^° C ~ 20 ^° C after curing, the content of the polycyclic aromatic ring-containing epoxy resin and acrylic rubber resin The sum is about 45 to 65% by weight of the total weight of the composition (solid content).

 In an embodiment the polycyclic aromatic ring-containing epoxy resin is cured from an epoxy monomer having the structure of Formula 2:

[Formula 2]

(Ar) _n -E _{m In the} above, (Ar) _n is a polycyclic aromatic hydrocarbon, n is 2 to 4 as the number of benzene ring, E is selected from an epoxy group, glycidyl group or glycidyloxy group, m Is 1 to 3. In embodiments, the polycyclic aromatic _. Gora-containing epoxy resin

1,6-bis (2,3-epoxypropoxy) naphthalene, 1,5-bis (2,3-epoxypropoxy) naphthalene and 2,2'-bis (2,3-epoxypropoxy) binarphthalene Cured from an epoxy monomer selected from the group consisting of: In an embodiment, the acrylic rubber resin may be a copolymer of two or more kinds of Cl-20 alkyl acrylates and one or more comonomers selected from methyl methacrylate, acrylonitrile and styrene.

 In another embodiment, the acrylic rubber resin may contain at least one functional group selected from the group consisting of hydroxyl group, carboxyl group and epoxy group.

 In an embodiment, the content ratio of the polycyclic aromatic ring-containing epoxy resin and acrylic rubber resin is about 1: 1.

The composition in embodiments is a polycyclic aromatic ring-containing epoxy resin, about 15 to 30 weight _{^0/0, and} an acrylic rubber-based resin 30 to 45 parts by weight _{^0/0, and} a curing agent 10 to 45% by weight, and the conductive particles of about 0.1 to 15 wt. May contain%.

 In another embodiment the composition is a bisphenol epoxy, phenol novolac epoxy, s-cresol novolac epoxy, polyfunctional epoxy, amine epoxy, heterocyclic containing epoxy, substituted epoxy, It may further comprise one or more epoxy resins selected from naphtha-based epoxy and derivatives thereof.

 The curing agent may include at least one of imidazole-based, isocyanate-based, amine-based, amide-based and acid anhydride-based curing agents.

 The conductive particles are metal particles containing Au, Ag, Ni, Cu, Sn, Ti and Pb; Carbon particles; Particles coated with metal on the polymer resin; And the coated particle surface may include at least one of the insulated particles.

 In embodiments, the composition may further comprise a silane coupling agent.

 In addition, the composition may include at least one additive including organic particles, inorganic particles, polymerization inhibitors, antioxidants, thermal stabilizers and light stabilizers.

 The present invention provides an anisotropic conductive film formed by the composition. [Favorable effect]

 The anisotropic conductive film formed by the composition of the present invention, to complement the brittle properties of the epoxy resin in the high temperature and high humidity state to have the flexibility and layer resistance to prevent the anisotropic conductive film in the curing state to be broken. .

 In addition, the connection resistance can be lowered and the thermal stability part can be compensated for, and high reliability and high adhesion can be expressed.

Best Mode for Implementation of the Invention The contents mentioned below are all based on solids unless otherwise specified. Polycyclic Aromatic Ring-Containing Epoxy Resins

 The polycyclic aromatic ring-containing epoxy resin of the present invention is an epoxy resin in which two or more benzene rings are continuously bonded, and has a structure in which an epoxy group is substituted with a polycyclic benzenoid aromatic compound. The polycyclic aromatic ring-containing epoxy resin is cured from an epoxy monomer having a structure of Formula 2 below. [Formula 2]

(Ar) _n -E _m

In the above, (Ar) _n is a polycyclic aromatic hydrocarbon, n is 2-4 by the number of benzene rings, E is selected from an epoxy group, glycidyl group or glycidaloxy group, m is 1-3. Examples of (Ar) _n include naphthalene, anthracene and the like. Preferred examples of naphthalene include E, an epoxy group, a glycidyl group glycidyloxy group, and the like, preferably a glycidyloxy group.

In an embodiment, the epoxy monomer for preparing the polycyclic aromatic ring-containing epoxy resin may be 1,6-bis (2,3-epoxypropoxy) naphthalene or 1,5-bis (2,3-epoxypropoxy) Naphthalene, 2,2'-bis (2,3-epoxypropoxy) binaphthalene, and the like, and are not necessarily limited to this, as long as the glass transition temperature after curing is in the range of about 165 ^° C to 220 ^° C. Among these, 1,6-bis (2,3-epoxypropoxy) naphthalene is preferable. In the present invention, the glass transition temperature after curing of the polycyclic aromatic ring-containing epoxy resin has a range of about 165 ° C ~ 220 ^° C., preferably about 180 ^° C ~ 220 ^° C. By including a polycyclic aromatic ring-containing epoxy resin having a relatively high glass transition temperature as described above to compensate for the weak thermal stability portion has a super heat resistance.

In an embodiment, the viscosity of the polycyclic aromatic ring-containing epoxy resin (25 ^° C.) may be about 10,000 to 50,000 cps, preferably about 12,000 to 35,000 cps, and more preferably about 15,000 to 30,000 cps.

In case of excessive application of acrylic rubber-based resin, spring back phenomenon occurs when thermal compression due to excessive elasticity, and thus a gap between electrodes may increase, resulting in an increase in connection resistance. To compensate for this, polycyclic aromatic rings containing low viscosity resins By blending the epoxy resin (Blending) to increase the overflow (overflow) during thermocompression bonding, the electrode resistance of the anisotropic conductive film resin can be improved to reduce the connection resistance. Acrylic rubber-based resin

 The acrylic rubber resin of the present invention has a repeating structure in which an acrylic ester is polymerized as shown in Chemical Formula 1, and the alkyl group of the side chain may be in a copolymer form of two or more kinds. In addition, methyl methacrylate (methyl metacrylate), acrylonitrile (acrylonitrile), styrene (styrene) can be included as a repeating unit.

 [Formula 1]

 COOR

 R is an alkyl group having 1-20 carbon atoms. In Chemical Formula 1, the longer the length of the side chain R, the lower the glass transition temperature (Tg) of the acrylic rubber, the higher the thermal fluidity, the lower the connection reliability and the lower the temperature resistance. Therefore, the characteristic of the desired circuit connection composition can be obtained by adjusting the length and structure of a side chain.

In specific embodiments, the acrylic rubber resin may include at least two d- ₂₀ alkyl acrylates; And copolymers of at least one comonomer selected from methyl methacrylate, acrylonitrile and styrene. When one or more comonomers selected from methyl methacrylate, acrylonitrile and styrene monomers are introduced, additional properties can be obtained while maintaining the basic adhesion and material miscibility of the acrylic rubber resin.

Between the two or more to ₂₀ alkyl acrylate and a comonomer ratio: §: is the glass jeonyieun degrees after curing of the final polymerized acrylic rubber-based resin it may be adjusted as needed, so that about 0 ^° C to 20 ^° C.

 In an embodiment, the acrylic rubber resin may have at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group and an epoxy group. Preferably it is an epoxy group containing acrylic copolymer.

The acrylic rubber resin of the present invention has a weight average molecular weight in the range of about 100,000 to about 1 million. Within the above range, the film may have excellent strength and adhesion. In addition, since it is excellent in compatibility with other resins, it is possible to have excellent connection reliability because a uniform crude liquid is possible. In the present invention, the glass transition temperature after curing of the acrylic rubber resin is about

It has a range of 0 ^° C ~ 20 ^° C. Anisotropic conductive film is applied to a bisphenol-A type (BPA) type epoxy resin or a bisphenol-F type (BPF) type epoxy resin by applying a predetermined amount as a binder to an acrylic rubber resin having a low glass transition temperature (Tg) as described above. Make the properties very flexible. In addition, by bridging the brittle property, which is an inherent property of the epoxy resin, at high temperature and high humidity, the cured anisotropic conductive film can be combined with flexibility and layer resistance. Anisotropic conductivity according to the present invention. In the composition for films, it is preferable that the acrylic rubber resin becomes a matrix, and the polycyclic aromatic ring-containing epoxy resin is distributed in the entire domain. Specific examples of the acryl rubber-based resin is a general composition (solid content) of about 30 to 45 weight _^0/0, preferably from about 30 to 40% by weight of the weight. In addition, the polycyclic aromatic ring-containing epoxy resin is an overall composition (solid content) of about 15 to 30 weight _^0/0, preferably from about 15 to 20% increase of weight.

Click between the polyester in the present invention, content of the sum of the aromatic ring-containing epoxy resin and the acrylic rubber-based resin is the total composition (solid content) of about 45 ~ 65 parts by weight _^0/0 by weight, preferably from about 45 to 60 weight _^0/0 Is preferably.

 In addition, the content ratio of the polycyclic aromatic ring-containing epoxy resin and the acrylic rubber resin is about 1: 1, preferably about 1: 2 to 3.

 By the appropriate content ratio of the polycyclic aromatic ring-containing epoxy resin and the acrylic rubber-based resin as described above, it is possible to produce a composition for anisotropic conductive films having high reliability and high adhesion characteristics. Hardener

 The composition for anisotropic conductive films which concerns on this invention may further contain a hardening | curing agent. As the curing agent, any epoxy curing type thermosetting agent known in the art may be used without limitation.

 In embodiments, at least one selected from imidazole-based, isocyanate-based, amine-based, amide-based and acid anhydride-based may be used as the curing agent, but is not limited thereto. The curing agent is about 10 to about 45% by weight, preferably about 15 to about

40 weight%, more preferably about 20 to about 35 weight%. Conductive particles The anisotropic conductive film composition of this invention contains electroconductive particle in order to improve the electroconductive performance at the time of a circuit connection.

 Such conductive particles may include metal particles including Au, Ag, Ni, Cu, Sn, Ti, and Pb; Carbon particles; Particles coated with a metal on the polymer resin; And the coated particle surface is at least one selected from insulated particles.

 The carbon particles include carbon black, abyss, activated carbon, carbon whiskers, fullerenes, carbon nanotubes, and the like.

 The polymer resin includes benzoguanamine, polyethylene, polypropylene, polyester, polystyrene, polyvinyl alcohol, and the like, but is not necessarily limited thereto. It may also include their modified resin.

 Examples of the metal coating the polymer resin include Au, Ag, and Ni, but are not necessarily limited thereto.

 The coated particles surface-insulated particles may include particles coated with the coated particles insulated particles.

 The size of the said electroconductive particle can be selected and used according to a use in the range of about 0.1 to about 30 by the pitch of the circuit applied. Preferably from about 0.5 to about 15 / in. .

In the present invention, the conductive particles are used in the range of about 0.1 to 15% by weight based on the total composition (solid content). When the content of the conductive particles is less than about 0.1% increase does not appear to improve the conductivity, it can lead to insulation failure and if it exceeds about 15 wt. _^0/0. Preferably from about 0.5 to 10% by weight, more preferably from about 1 to 5% by weight can be used. The composition for anisotropic conductive films according to the present invention may further include an epoxy resin. The epoxy resins include bisphenol epoxy, phenol novolac epoxy, s-cresol novolac epoxy, polyfunctional epoxy, amine epoxy, heterocyclic containing epoxy, substituted epoxy, naph based It is preferably at least one selected from epoxy and derivatives thereof. The epoxy resin is from about 30 parts by weight _^0/0, preferably up to about 25% by weight of the total composition, more preferably it may be used up to about 20% by weight. In embodiments, the epoxy resin may be used at about 0 to about 15% by weight. In other embodiments, the epoxy resin may be used at about 1 to about 10 weight percent. The anisotropic conductive film composition of the present invention without impairing the basic physical properties Additionally, in order to achieve 7fl properties, other additives such as organic particles, inorganic particles, silane coupling agents, polymerization inhibitors, antioxidants, heat stabilizers, and light stabilizers may further include about 0.01% to about 10% by weight. have.

 The above—silane coupling agent is 2- (3,4 epoxy cyclonuclear) -ethyltrimethoxysilane, 3-glycidoxytrimethyloxysilane containing epoxy,

3-glycidoxypropyltriethoxysilane, containing amine groups

N-2 (aminoethyl) 3-amitopropylmethyldimethoxysilane,

N-2 (aminoethyl) 3-aminopropyltrimethoxysilane,

 N-2 (aminoethyl) 3-aminopropyltri ethoxysilane, 3-aminopropyltri methoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (l, 3-dimethylview Thiylene den) propylamine, N-phenyl-3-aminopropyltrimethoxysilane,

It is preferable that it is at least one selected from 3-mergatopropylmethyldimethoxysilane, 3-mergatopropyltriethoxysilane, and 3-isocyanatepropyltriethoxysilane containing isocyanate. Preferably the silane coupling agent may comprise about 0.1 to about 1 weight percent, more preferably about 1 to about 5 weight percent.

 The polymerization inhibitor may be selected from the group consisting of hydroquinone monomethyl ether, P-benzoquinone, phenothiazine and mixtures thereof. In addition, antioxidants such as branched phenolic or hydroxy cinnamate-based substances may be added for the purpose of preventing oxidation reaction and imparting thermal stability to the composition induced by heat. For example, tetrakis- (methylene -(3,5-di-t-butyl-4-hydrocinnamate) methane,

3.5-bis (1,1-dimethylethyl) -4-hydroxy benzene propanoic acid thiol di-2,1-ethanediyl ester, octadecyl 3,5-di-t-butyl-4-hydroxy hydrocinna Mate (more than Ciba company),

2.6-di-tertiary-P-methylphenol and the like. These other additives may be used alone or in combination of two or more thereof. The anisotropic conductive film of this invention can be manufactured easily using the composition for anisotropic conductive films of this invention, without a special apparatus or installation. For example, after dissolving the composition of the present invention in an organic solvent such as toluene and liquefying, the composition is stirred for a predetermined time within a speed range in which the conductive particles are not pulverized, and the coating is applied to the release film at a thickness of about 10 to about 50. After drying for a predetermined time, a solvent such as toluene may be volatilized to obtain an anisotropic conductive film.

The anisotropic conductive film of the present invention after 500 hours at 85 ^° C, 85 RH conditions The resistance measured by ASTM F 3-64T may be about 2 to about 8 Ω. Hereinafter, the present invention will be described in more detail with reference to examples, but these examples are for illustrative purposes only and should not be construed as limiting the present invention. Examples 1-4 and Comparative Examples 1-

The composition obtained by mixing each component as shown in Table 1 below was applied on a release film, and dried for 5 minutes ^at a temperature of 80 ^° C. using an oven to obtain an anisotropic conductive film of thickness 35, width 1.5mm.

Table 1

(A)폴리사이클릭 방향족 함유 에폭시 수지: 경화후 유리전이 온도가 220 ^°C 인 대일본 잉크화학에서 제조된 Naphthalene 계 에폭시 수지 (제품명: HP4032D)를 사용하였다.

(A) Polycyclic aromatic-containing epoxy resin: Naphthalene epoxy resin (product name: HP4032D) manufactured by Japan Ink Chemical Co., Ltd. having a glass transition temperature of 220 ^° C. after curing was used.

(B) Acrylic rubber resin: An acrylate copolymer (product name: SG-P3-TEA) manufactured by Nagase Camtex having a glass transition temperature of 15 ^° C. was used. (c) Curing agent: A microcapsule-type imidazole (product name: HX3941HP) manufactured by Asahi Kasei was used.

 (D) Conductive particle: AUL704 manufactured by Sekisui Corporation was used.

 (E) Epoxy Resin: A BPA epoxy resin (product name: EXA850CRP) manufactured by Nippon Ink Chemical Co., Ltd. was used.

 (F) Silane coupling agent: The epoxy silane (product name: KBM403) manufactured by Shin-Yetsu was used. Property and Reliability Evaluation

In order to measure the connection reliability between the ITO glass panel and the FPCB, the temperature is measured using four types of FPCB (Adhesive type 1, Adhesive type 2, Adhesive-less type 1, Adhesive-less type 2) as shown in the following <Table 2>. After 250 hours at 85 ^° C, 85% relative humidity, the occurrence of bubbles was measured by an optical microscope. If the electrode length is a Bubble length is within X "measured in the 800 ^ reference ©, 20 (> is within m O, it is within 30O ^m Δ, 40 (> ^m or more was evaluated as X. The measurement results are shown in Table 2 It was.

In addition, the anisotropic conductive films prepared in Examples and Comparative Examples were connected using a panel with a ΠΌ pattern and FPCB at 190 ^° C., 10 seconds, and 3 MPadml main compression conditions, and 90 ^° adhesive force was measured (ASTM D3330 / D3330M). In the four-terminal (Probe) measuring method, the connection resistance (ASTM F43-64T) was measured after 250 hours and after 500 hours, respectively, and the results are shown in Table 3.

[Table 2]

상기 표 2 및 표 3의 결과에서와 같이, 실시예 1~4와 같은 함량비를 가진 이방 도전성 필름을 이용하여 Adhesive-less type의 FPCB에 적용할 경우 Bubble이 거의 발생하지 않아 높은 신뢰성을 보이는 것을 확인할 수 있다. 또한 Adhesive-less type의 FPCB에 적용할 경우 실시예들은 비교예들과 비교했을 때 낮은 저항값과 높은 접착력을 보이는 것을 확인할 수 있어, 비교예에 비해 신뢰성， 접착성 등이 모두 개선되었음을 알수 있다. 본 발명의 단순한 변형 내지 변경은 이 분야의 통상의 지식을 가진 자에 의하여 용이하게 실시될 수 있으며， 이러한 변형이나 변경은 모두 본 발명의 영역에 포함되는 것으로 볼 수 있다. Table 3

As shown in the results of Table 2 and Table 3, when applied to the adhesive-less type FPCB using an anisotropic conductive film having the same content ratios as Examples 1 to 4, almost no bubbles were generated, showing high reliability. You can check it. In addition, when applied to the FPCB of the adhesive-less type, the examples show a low resistance value and a high adhesive strength when compared to the comparative examples, it can be seen that the reliability, adhesion, etc. all improved compared to the comparative example. Simple modifications and variations of the present invention can be easily made by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

Claims

[Claims] 1. A polycyclic aromatic ring-containing sepoxy resin, an acrylic rubber-based resin, conductive particles and a curing agent are included, and the polycyclic aromatic ring-containing epoxy resin has a glass transition temperature (Tg) of about 165 ^° C. after curing. 220 ^° C., the acrylic rubber-based resin has a glass transition temperature (Tg) of about 0 ^° C ~ 20 ^° C after curing,  The sum of the content of the polycyclic aromatic ring-containing epoxy resin and the acrylic rubber resin is about 45 to 65% by weight of the total composition (solid content). . 2. The composition for an anisotropic conductive film according to claim 1, wherein the polycyclic aromatic ring-containing epoxy resin is cured from an epoxy monomer having a structure of the following formula (2): [Formula 2] (Ar) _n -E, „In the above, (Ar) _n is a polycyclic aromatic hydrocarbon, n is 2 to 4 by the number of benzene ring, E is selected from an epoxy group, glycidyl group or glycidyloxy group, m is 1-3. 3. The polycyclic aromatic ring-containing epoxy resin according to claim 2, which comprises 1,6-bis (2,3-epoxypropoxy) naphthalene, 1,5-bis (2,3-epoxypropoxy) naphthalene and A composition for an anisotropic conductive film, which is cured from at least one epoxy monomer selected from the group consisting of 2,2'-bis (2,3-epoxypropoxy) binarphthalene. 4. The method according to claim 1, wherein the acrylic rubber resin comprises a copolymer of two or more C o alkyl acrylates and a comonomer selected from methyl methacrylate, acrylonitrile and styrene. Composition for anisotropic conductive films 5. The composition for an anisotropic conductive film according to claim 1, wherein the acrylic rubber resin contains at least one functional group selected from the group consisting of a hydroxyl group, a carboxyl group and an epoxy group. 6. The composition of claim 1, wherein the content ratio of the polycyclic aromatic ring-containing epoxy resin and the acrylic rubber-based resin is about 1: 1 to 3. 7. The method of claim 1, wherein the composition comprises polycyclic aromatic ring-containing epoxy resin, about 15 to 30 weight _{^0/0, and} an acrylic rubber resin of about 30 to 45 weight _^0/0, a curing agent, and about 10 45% by weight of conductive particles of about It contains 0.1 to 15% by weight of the composition for a avant-garde conductive film. 8. The composition according to claim 1, wherein the composition is bisphenol epoxy, phenol novolac epoxy, s-cresol novolac epoxy, polyfunctional epoxy, amine epoxy, heterocyclic containing epoxy, A composition for anisotropic conductive films, further comprising at least one epoxy resin selected from substituted epoxy, naphtha-based epoxy and derivatives thereof. 9. The composition for anisotropic conductive films according to item 1, wherein the curing agent is selected from at least one of imidazole, isocyanate, amine, amide and acid anhydride curing agents. 10. The method of paragraph 1, wherein the conductive particles  Metal particles including Au, Ag, Ni, Cu, Sn, Ti, and Pb;  Carbon particles;  . Particles coated with a metal on the polymer resin; And  Particles in which the coated particle surface is insulated;  At least one selected from the composition for anisotropic conductive film. 11. The composition for anisotropic conductive films according to claim 1, wherein the composition further comprises a silane coupling agent. 12. The method of claim 1, wherein the composition further comprises at least one additive selected from the group consisting of organic particles, inorganic particles, polymerization inhibitors, antioxidants, heat stabilizers, and light stabilizers. water. 13. An anisotropic conductive film formed by the composition of any one of claims 1 to 12. 14. The anisotropic conductive film of claim 13, wherein the anisotropic conductive film has a resistance measured by ASTM F43-64T after a lapse of time at 85 ^° C. and 85% RH.