Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14467—Joining articles or parts of a single article
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C45/14688—Coating articles provided with a decoration
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K5/00—Casings, cabinets or drawers for electric apparatus
  • H05K5/02—Details
  • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
  • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
  • B29C45/16—Making multilayered or multicoloured articles
  • B29C45/1671—Making multilayered or multicoloured articles with an insert
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
  • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
  • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
  • B29K2995/0005—Conductive
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04M—TELEPHONIC COMMUNICATION
  • H04M1/00—Substation equipment, e.g. for use by subscribers
  • H04M1/02—Constructional features of telephone sets
  • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
  • H04M1/026—Details of the structure or mounting of specific components
  • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
  • H05K1/028—Bending or folding regions of flexible printed circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
  • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10439—Position of a single component
  • H05K2201/105—Mechanically attached to another device
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Definitions

• the invention relates to a cover part of an electronic device, the cover part having a frame with a first surface and a second surface opposite to the first surface, the cover part further comprising a first component that is arranged to transmit and/or receive signals, and a connecting element having a signal-transmitting bus connected to said first component.
• the invention further relates to an electronic device.
• the cover structure of electronic devices typically comprises one or more cover parts joined either fixedly or openably together and/or to the frame of the device.
• a closed space formed by the cover structure houses the electric components required by the functions of the electronic device, and the components are protected by the cover structure from dust, dirt and mechanical stress, for instance.
• the cover parts are typically thin-walled products made usually of plastic, metal or plastic composite. The necessary openings and through-holes for a display, keyboard, switches, electric connectors and the like are formed in the cover parts.
• Electronic devices are known that have one or more electronic components fastened to the cover structure.
• An electronic component may be an antenna, for example.
• Such an electronic component arranged in the cover structure is as known connected to electric components arranged in the closed space inside the cover structure by using metal pins or plugs, such as "pogo pins" that are typically arranged in the cover part.
• inventive embodiments are also disclosed in the specification and drawings of this patent application.
• inventive content of the patent application may also be defined in other ways than defined in the following claims.
• inventive content may also be formed of several separate inventions, especially if the invention is examined in the light of expressed or implicit sub-tasks or in view of obtained benefits or benefit groups. In such a case, some of the definitions contained in the following claims may be unnecessary in view of the separate inventive ideas.
• Features of the different embodiments of the invention may within the scope of the basic inventive idea be applied to other embodiments. In the following, features of some embodiments of the invention are listed in a random order:
• the first component is a component transmitting and/or receiving electric signals
• the signal-transmitting bus is a bus transmitting electric signals
• the first component is a component transmitting and/or receiving optic signals
• the signal-transmitting bus is a bus transmitting optic signals
• the first component is arranged on the side of a first surface and the signal-transmitting bus is arranged to extend from the side of the first surface to the side of a second surface so that a flexible part is arranged to diverge to the side of the second surface,
• the signal-transmitting bus is arranged to extend past the edge of the frame so that it extends from the first surface side of the frame of said cover to the second surface side thereof, - the edge of the frame is in an opening piercing the frame,
• the opening is a camera opening
• the opening is an opening formed for the display of the device or its protective window
• the opening is an opening formed for the operating button of the device
• the edge of the frame is the edge forming the outer edge of the cover part
• the cover part comprises a film arranged on the first surface side of the frame and part of the electrically conductive bus is arranged between the frame and the outer surface of said film,
• the film is an insert film
• the film is a labelling film
• the film is a transfer film
• the film is a multilayer film
• the first component is arranged on the side of the second surface and the flexible part is arranged to diverge to the side of the second surface
• the first component is arranged between the first and second surfaces of the cover part and the signal-transmitting bus is arranged to extend to the side of a second surface so that the flexible part is arranged to diverge to the side of the second surface,
• the signal-transmitting bus is a separate component that comprises conductors and an insulation substrate separating them from each other,
• the signal-transmitting bus is a film-like element that comprises conductors arranged side by side in the insulation substrate,
• the signal-transmitting bus is a flexible circuit board
• the signal-transmitting bus is a film-like photoconductor
• the signal-transmitting bus is integrated to a second structural part of the cover part
• the signal-transmitting bus is integrated to the frame of the cover
• the first component comprises one component
• the first component is an assembly of several components
• the first component comprises an antenna
• the first component comprises a circuit board
• the first surface is on the outer surface side of the cover part
• the first surface is on the inner surface side of the cover part.
• the -receiving component arranged in the cover part is connected to a second component that does not belong to the cover part via a bus that transmits said signals and comprises a flexible part diverging from the cover part.
• the invention provides the advantage that, thanks to the flexible bus part diverging from the cover part, the component is easy to connect to a second component.
• the idea of a preferred embodiment of the invention is that the signal-transmitting bus is arranged between the outer surface of the frame of the cover part and the film fastened thereto.
• the advantage is that the bus is easy to fasten to the cover part, the number of buses may be high and the bus does not necessarily alter the appearance of the cover part.
• the signal-transmitting bus is arranged to extend past the edge of the frame so that it extends from the first surface side of the frame of said cover to the second surface side thereof.
• the advantage is that components arranged on different sides of the cover part can be connected to each other.
• Figure 1 a is a schematic, exploded side view of a cover part of the invention in partial cross-section
• Figure 1 b is a schematic top view of an electrically conductive bus of Figure 1 a
• Figure 1 c is a schematic, side view of an assembled electronic device of the invention in partial cross-section and comprising the cover part formed of the parts shown in Figure 1 a,
• Figure 2 is a schematic perspective view of a second cover part of the invention
• Figures 3a and 3b are schematic side and top views of a third cover part of the invention in partial cross-section
• Figure 4 is a schematic side view of a fourth cover part of the invention in partial cross-section
• Figure 5 is a schematic side view of a fifth cover part of the invention in partial cross-section
• Figure 6 is a schematic side view of a sixth cover part of the invention in partial cross-section
• Figure 7 is a schematic side view of a seventh cover part of the invention in partial cross-section
• Figures 8a to 8c are schematic, partially cross-sectional side views of a method for manufacturing the cover part of the invention.
• Figure 9 is a schematic side view of an eighth cover part of the invention in partial cross-section.
• Figure 10 is a schematic side view of a ninth cover part of the invention in partial cross-section.
• Figure 1 a is a schematic, exploded side view of a cover part of the invention in partial cross-section
• Figure 1 b is a schematic top view of the electrically conductive bus arranged in the cover part
• Figure 1 c is a schematic, side view of an assembled electronic device of the invention in partial cross-section and comprising the cover part formed of the parts shown in Figure 1 a.
• the cover part comprises an injection-moulded frame 1.
• the manufacturing material is a polymer material known per se that may comprise not only thermoplastic matrix material, but also reinforcement material, filling agents, and the like.
• the frame may be transparent, partly transparent, or non- transparent to visible light.
• a film 2 forming the outer surface of the cover part is fastened to the outer surface of the frame 1 during the injection-moulding stage.
• the film 2 is in this case an insert film, which herein refers to a film that prior to arranging it into the injection-moulding mould has been formed at least substantially into the shape of the mould and final product. This forming is done typically by thermoforming. This type of technique is referred to as "in-mould labelling" or "insert mould decoration".
• the manufacturing material and method of the film 2 are known per se, so they are not described in more detail in this specification.
• the film 2 may also be multi-layered and even as such an active component that contains electronic parts laminated to the surface of a layer or between several layers. This film may as such act as a surface film or be painted, coated, or surface-treated in some other manner.
• the film 2 may be a labelling film, that is, a partial "in-mould labelling" film. This is a planar label or a similar label that only covers a small part of the outer surface of the cover part.
• the film 2 may also be a transfer film, that is, "in-mould decoration” film, that when arranged in the mould is substantially planar and arranged in the injection-moulding mould by using a transfer or carrier film that is fed in a continuous band between the mould halves.
• a transfer film that is, "in-mould decoration” film, that when arranged in the mould is substantially planar and arranged in the injection-moulding mould by using a transfer or carrier film that is fed in a continuous band between the mould halves.
• the film may be monochrome or multi-coloured, and it may have decorations, such as those whose appearance changes as the lighting conditions change, for example "hidden till lit” decorations.
• the film 2 may be transparent, partly transparent, or non-transparent to visible light. Either or both of its surfaces can be printed, pressed, or painted, or treated in some other manner known per se.
• the film may be a one-layer film or a multi-layer film with each layer having its own operational or decorative task.
• the film 2 is fastened to the frame 1 in an injection moulding process that is described in more detail in connection with Figures 8a to 8c.
• the frame 1 is formed into its shape shown in Figures 1 a and 1c at the same time as it is fastened to the rear surface 7 of the film 2.
• the film 2 may further be coated by arranging a second film on its outer surface 6 or by painting, printing or in some other corresponding manner. Further, we wish to remark that additional parts may be arranged in the cover part to modify its appearance, feel, functionality or some other property. Yet further, we wish to remark that the dimensions of the parts of the cover part - mainly the ratio of the thicknesses of the frame 1 and film 2 - is in the figure shown differing from reality so as to better present the features of the invention for understanding.
• the first surface 8 of the frame is on the side of the film 2 and the second surface 9 forms the inner surface of the cover part. It is possible to add elements to the second surface 9, for example films, conductors, electronic or optical components, or the like.
• a first component 4 is arranged on the side of the first surface 8, or in this case the outer surface, of the frame 1 , and it is thus outside the closed space formed by the cover part.
• the first component 4 is a component that transmits or receives or both transmits and receives electric signals.
• the first component 4 is arranged in an opening in the film 2.
• the first component 4 may also be arranged on the outer surface 6 of the film, or between the film 2 and frame 1 , or inside the film 2.
• the first component 4 requires several buses suited for transmitting electric signals, which connects it to a second component arranged inside the cover structure.
• the required buses are implemented using a flexible film-like connecting element 5.
• This may for instance be an electric conductor known as a flex.
• This is a flex circuit board that is flexible substantially along its entire length, or a rigid-flex circuit board having both rigid and flexible parts. It has electrically conductive buses 11 arranged side by side in an insulation substrate 12 made of electrically non-conductive plastic. In one or both ends of the flex, there may be adapters to connect the buses 11 to counter-pieces arranged in connectable components. The connection may naturally also be done by welding, gluing with an electrically conductive glue, or in some other manner known per se.
• the electrically conductive buses 11 are at the first end 13 of the connecting element 5 fastened either directly to the first component 4 or indirectly, that is, to connectors that are formed in the frame 1 or film 2 and connected to the first component 4.
• the connecting element 5 is arranged under cover between the frame 1 and film 2 and fastened in place to the cover part during the injection-moulding stage of the frame 1. This is described in more detail in connection with Figures 8a to 8c.
• the second end 14 of the connecting element 5 is arranged at an opening 3 formed in the cover part so that it extends past the film 2 formed in the opening 3 and the edges 15 of the frame 1. Because the connecting element 5 is flexible in its entirety, the part extending past the edges 15 forms a flexible or bendable part 27. This may freely be bent to the side of the second surface 9 of the frame; herein, to the inside of the cover part.
• Said opening 3 is a camera opening, which herein means that it is formed primarily for a protective window or lens of a camera of a mobile phone and extends through both the frame 1 and film 2.
• the opening 3 may naturally be some other opening required by the camera; it may be an opening formed for a display or its protective window, an opening formed for an operating button, an opening for a microphone, earphone or charging adapter, or for some other adapter, etc.
• the opening 3 may also be specifically formed for an electrically conductive bus 11. It should be noted that the film 2 does not necessarily have to have an opening 3; in other words, to implement the embodiment shown in Figures 1 a to 1 c, it is enough that the frame 1 has an opening though it. The part of the film that extends across the opening 3 may be transparent or non-transparent depending on the purpose of the opening.
• the first component 4 may also be a component transmitting or receiving or both transmitting and receiving optical signals and, correspondingly, the connecting element 5 may be a bus transmitting optical signals, such as a film-like or sheet-like photoconductor or optical fibre. Further, the first component 4 may be a component transmitting or receiving or both transmitting and receiving electrical and optical signals, such as a LED, laser, photo diode, detector, photocell, optical sensor, motion detector, display element, or some other surface or component that reacts to light.
• the first component may be a sensor, antenna, switch, means belonging to the user interface of the device, such as a key, display, microphone, loudspeaker, touch sensitive element or the like.
• the component may be a separate component or one integrated to the film 2 or frame 1 , such as a printed or pressed component.
• Figure 1 c shows an assembled electronic device, in which the flexible part 27 of the connecting element 5 is bent and pushed through the opening 3 to the inside of the cover part, where its second end 14 is connected to a second component.
• the second cover part that closes the device is shown with a dotted line.
• the second component is the main board 10 of the device. Because the free second end 14 of the connecting element 5 diverges substantially from the edge 15, it can be quickly and reliably connected to the second component, when the device is being assembled. It is naturally possible that the end of the connecting element 5 that is left free is connected to some other component inside the cover part, such as an auxiliary circuit board, user interface (Ul) board arranged for a keyboard, battery, or some other power source, control module, or the like.
• the connecting element 5 may also be connected to a component belonging to another cover part or to a component in the cover part 1 itself.
• connection element 5 is so thin that it does not visibly change the appearance of the cover part 25. Naturally, it may be left visible if so required. If necessary, it is possible to arrange two or even more connecting elements 5 on top of each other in such a manner that no shapes disadvantageously affecting the aesthetic impression of the cover part 25 are formed.
• the cover part 25 may also be made by first shaping both the frame 1 and the film 2 at least essentially to their final form and fastening them to each other after this.
• the frame 1 may then be made by injection- moulding without adding the film 2 as an insert into the mould.
• the frame 1 may be made not only of plastic or plastic composite, but also of other materials, such as metal, or it may be a combination of parts made of materials belonging to several different material groups, such as plastic and metal parts.
• One advantage of metal is that it allows the manufacture of a thinner frame 1 and thus also a thinner cover part 25.
• the frame 1 may be fastened to the film 2 using an adhesive, heat, welding, and mechanical fastening means, for instance.
• the fastening may be fixed, in other words, the frame 1 cannot be detached from the film 2 without breaking them.
• the fastening may also be detachable, in other words, the frame 1 may be detached from the film 2 without breaking them.
• the configuration of the cover part 25 may then contain the step described in Figure 1 a, and the connecting element 5 may be a separate component or integrated to the film 2 so that the film 2 forms at least part of the insulation substrate insulating the buses from each other.
• Buses transmitting optical signals and/or electrically conductive buses may be laminated to the film 2 before it is fastened to the frame 1.
• the film 2 is preferably an insert film, to which said buses are fastened preferably even before the film is formed into its three-dimensional form.
• the buses may be fastened directly to the film, or they may be first fastened to an auxiliary film that is laminated on the film 2.
• the flexible part 27 of the connecting element may be made to diverge from the extreme edge of the film 2, or it may be part of the bus or the auxiliary film comprising the bus, which is left detached from the film 2 or which is detached from the film before the laminate structure formed by the film and photoconductor is fastened to the frame 1.
• the flexible part 27 of the connecting element may be formed of one or more layers of this kind or parts thereof.
• the flexible part 27 may comprise parts of all layers of said film 2.
• Electronic components may be arranged in the layers of a multi-layered film 2 and/or between them.
• Figure 2 is a schematic perspective view of a part of a second cover part of the invention.
• the cover part 1 comprises a film 2 that forms at least a major part of its outer surface, and on the rear surface 7 of the film the frame 3 is injection-moulded.
• the first component 4 is arranged on the outer surface side of the cover part 1. To work, this requires electrical conductors that are located in the connecting element 5. This is arranged into the cover part so that one end thereof extends past the film 2 and the edge 15 of the frame - now the edge 15 is the edge forming the outer edge of the cover part and it is fastened to the second cover part or the frame of the device during the assembly.
• This type of embodiment provides the additional advantage that it does not require the opening 3.
• Figures 3a and 3b are schematic side views of a third cover part of the invention in partial cross-section.
• the figure only shows the film 2 that is an insert film.
• electric conductors 11 and contact surfaces 16 required for connecting the conductors 11 and the first component 4 arranged on the outer surface of the cover part are integrated to the film 2.
• a protruding part or projection 17, to which the conductors 11 are arranged, is also formed on the film 2.
• the projection 17 is made of the same material as the rest of the film 2.
• the film 2 forms an insulation substrate separating the conductors from each other and a casing protecting the conductors 11 on all sides. It should be noted that the projection 17 is not an absolutely necessary feature of the embodiment.
• the projection 17 shown in the figure is thinner than other parts of the film 2, though this is not absolutely necessary.
• the essential thing is that the projection 17 with its conductors 11 is flexible so that it and its conductors 11 can be bent inside the cover structure.
• electrically conductive conductors or in addition to them, it is naturally possible to use optically conductive buses.
• the embodiment also provides the additional advantage that handling of a separate connecting element 5 is avoided in the assembly of the cover part, for example during the injection-moulding stage of the frame 1.
• the electrically conductive conductors 11 integrated to the film 2 may naturally also be arranged past the edge forming the outer edge of the cover part in imitation of the embodiment shown in Figure 2.
• Figure 4 is a schematic side view of a fourth cover part of the invention in partial cross-section. It shows a frame 1 made of plastic and a film 2, such as insert film, arranged on the first surface 8 thereof and made of transparent or at least partly transparent material. A film-like photoconductor 28 is arranged on the rear surface of the film 2.
• the film 2 comprises a mask 29 that is at least essentially non-transparent to light and formed by pressing or printing, for example.
• the mask 29 defines in the film an active area 30, through which the light from the photoconductor passes to the film 2 and on out of the cover part.
• the cover part 25 further has a light source, in this case a LED 31 , and a coupler 34 with an connecting element 5 connected to it.
• the LED 31 and coupler 34 are fastened on a circuit board 32 that comprises conductors and electrically conductive buses connecting them to each other.
• the LED is enveloped in a protective tape 33 that prevents the light from the LED from propagating elsewhere than to the photoconductor 28.
• the circuit board 32 may be a flexible flex circuit board or a partly flexible rigid-flex circuit board, whereby the circuit board 32 can be bent away from the cover part 25 in such a manner that it forms an connecting element 5 and its flexible part 27.
• the components and parts 28 to 34 listed above form the first component 4.
• the first component is connected to the connecting element 5, whose one end comprises the flexible part 27 that may be connected to the second component.
• the frame 1 forms part of the insulation substrate insulating the buses in the connecting element 5 from each other. It should be noted that the second component is not shown in the figure.
• the second component may be positioned either inside the cover part 25 or outside the cover part 25.
• the first component 4 is typically arranged on the inner surface side of the frame 1 , but in an embodiment of the invention, it is arranged on the outer surface side of the frame 1.
• the first component 4 is arranged in a game console and the second component in a game controller, or vice versa.
• the connecting element diverges from the cover part 25 to the outer surface side thereof and acts as a bus connecting the game console and controller or as a part thereof.
• the frame 1 is made by injection-moulding, for instance, on the rear surface of the film 2, whereby the first component 4 is well protected from stress caused by the environment.
• the LED 31 may be arranged on the second surface 9 side of the frame 1 , whereby the photoconductor 28 is extended through the frame 1 to the first surface 8 side.
• Figure 5 is a schematic side view of a fifth cover part of the invention in partial cross-section. It should be noted that the frame 1 is not shown in Figure 5 to simplify the presentation of the matter. This is one alternative for the embodiment shown in Figure 4.
• the first component comprises two LEDs 31 as light sources. We wish to remark in this context that the number of light sources may also be higher than two.
• the first component 4 comprising the LED 31 , electrically conductive buses and coupler 34 is formed directly into the film 2, to which the required electric circuits are printed or pressed or made in some other manner known per se from circuit board technology or electronics industry, for example.
• One advantage of the embodiment is that the separate circuit board 32 becomes unnecessary, whereby a simpler and thinner structure may be achieved.
• the connecting element 5 is connected to the first component 4 in such a manner that it is at right angles to the surface of the film 2; however, this type of arrangement is not absolutely necessary, and the position of the connecting element in relation to the film 2 and its route to the opposite side of the frame is selected appropriately in each case.
• FIG. 6 is a schematic side view of a sixth cover part of the invention in partial cross-section. For the most part, this is like the cover part 25 shown in Figure 5, but now the LEDs 31 , photoconductor 28, electrically conductive buses, coupler 34, etc., that is, the first component 4, is formed or fastened to a separate auxiliary film 35.
• auxiliary film 35 is drawn separated from the film 2 to simplify the presentation of the matter.
• the auxiliary film 35 may be laminated to the film 2, after which the cover part 25 is formed in such a manner that the auxiliary film 35 remains between the frame and film 2.
• the auxiliary film 35 and its components thus form an installation module that may be installed as an entity into the cover part 25 or its semi-finished product.
• Figure 7 is a schematic side view of a seventh cover part of the invention in partial cross-section.
• the first element 4 is arranged in its entirety on the second surface 9 forming the inner surface of the frame 1 and at the same time the entire cover part.
• a film 2 for instance an insert film, is arranged on the inner surface of the cover part 25, and with it also the first element 4; in other words, the embodiment resembles that shown in Figure 5.
• the auxiliary film 35 according to Figure 6 with its first element 4 may also be fastened to the inner surface of the cover part 25.
• the frame 1 and film 2 are made of at least partly transparent material, whereby the light emitted by the LED 31 and led to the photoconductor 28 passes through them.
• the film 2 may also be left out.
• the frame 1 may be treated by painting, printing, pressing, coating, using a second plastic layer, or in some other corresponding manner known per se.
• the first element 4 comprises a reflector element 36 arranged between the photoconductor 28 and circuit board 32, which reflects light directed thereto away toward the outer surface of the cover part.
• the circuit board 32 may be a flex, for instance, from which a part remains unfastened to the frame 1 in such a manner that the unfastened part forms the connecting element 5 and, what is the most essential thing, its flexible part, through which the first element 4 is connected to the second element. It should be repeated herein that the connecting element 5 comprises at least one signal-transmitting bus.
• Figures 8a to 8c are schematic, partially cross-sectional side views of a method for manufacturing the cover part of the invention. The method can be used to make a cover part according to Figure 1 c, for instance.
• Figure 8a shows how the connecting element 5 is first fastened to the rear surface 7 of the film 2.
• the fastening may take place for example by welding, by using a mechanical joint, such as sticker tape "Velcro", by gluing, such as laminating or taping.
• the connecting element 5 is integrated to the film 2.
• the connecting element 5 naturally need not be fastened separately to the film 2.
• Figure 8a also shows the following step, wherein the installation module 21 formed by the film 2 and connecting element 5 is taken to the opened mould, or to be more precise, to a receiving member 20 made into the first mould half 18.
• the mould also comprises a second mould half 19.
• Said receiving member 20 may comprise active auxiliary arrangements to ensure that the installation module 21 remains in place, such as vacuum suction or some other corresponding arrangement known per se.
• active auxiliary arrangements are not absolutely necessary, since in most cases just an interference fit between the mould and the installation module 21 is enough to ensure that the installation module remains in place in the mould.
• the mould When the installation module 21 is in place in the first mould half 18, the mould may be closed by joining the mould halves 18, 19. A closed mould cavity 22, shown in Figure 4b, thus forms into the mould.
• the mould cavity 22 is shaped in the manner required by the shape of the cover part to be manufactured.
• the first component 4 to be fastened to the cover part 25 may also be arranged into the mould and connected to the film 2 before the mould is closed. Most preferably, this is done before the film 2 is added into the mould.
• the second mould half 19 shown in Figures 8a to 8c comprises an insert 23 that presses against the first mould half 18 and prevents the plastic material injected into the mould from entering the opening 3 in the film 2 and spreading around the second end 14 of the connecting element 5 extending into the opening 3.
• the partial enlargement of Figure 8b shows how the insert 23 has forced the connecting element 5 away from its path by bending it into folds.
• the connecting element 5 is not damaged by this thanks to its flexible structure.
• the insert 23 may comprise shapes - recesses or grooves - into which the connecting element 5 settles at the latest when the mould is closed.
• plastic material 26 has been injected into the mould through a feed channel 24.
• the melt plastic material 26 has entered the mould and filled the free space of the mould cavity 22 and come into contact with the rear surface 7 of the film 2.
• the plastic material 26 and film material 2 have been selected to be compatible so that the plastic material adheres by chemical bonds to the film 2.
• the adherence may also be based on merely physical fastening, such as form locking, or a combination of chemical and physical fastening. If necessary, it is possible to add to the inner surface of the film 2 an auxiliary material layer improving adherence by brushing, spraying or arranging an auxiliary material film on it.
• the plastic material 26 injected into the mould cavity 22 cools down in the mould in a manner known per se cooled by the cooling means of the mould, hardens into a non-flow form and forms the frame 1 of the cover part.
• the mould is opened and the cover part 25 is removed from the mould. This step is shown in Figure 8c.
• the cover part 25 comprises an injection-moulded frame 1 , a film 2 and a connecting element 5 fastened between them.
• the cover part 25 may be further treated and finished, for instance, by removing possible burrs, painting, arranging additional parts thereto, and so on, after which the cover part 25 is ready for installation into an electronic device.
• the installation module 21 also comprises the first component 4 that, in turn, as earlier stated, comprises one or more components.
• the first component 4 may be fastened to the film 2 by using the fastening methods described above.
• the installation module 21 comprising the first component 4 does not necessarily include the film 2.
• the first component 4 and connecting element 5 may be fastened to a plastic substrate that thus forms a body or base holding the installation module 21 together.
• This type of installation module 21 may be arranged as part of the cover part 25 for instance by arranging it into the injection-moulding mould or compression mould in the same manner as the installation mould 21 shown in Figure 8a, or it may be glued or welded or fastened in some other manner known per se to a preformed frame 1.
• the cover part 25 or at least its frame 1 is made using a multi-component injection-moulding method.
• the first component 4 and connecting element 5 are then arranged in a first mould, where they are fastened to a first plastic material part by injecting the first plastic material into the mould.
• the first mould is made in such a manner that selected parts of the first component 4 and/or connecting element 5 remain uncovered by the first plastic material.
• the first mould is opened, whereby the first plastic material part and the first component 4 and connecting element 5 fastened thereto remain in the first mould half.
• a third mould half is arranged to close the mould.
• the mould then has empty space in it, into which a second plastic material is injected.
• the second plastic material forms a second plastic material part that encapsulates the first component 4 and/or connecting element 5 between itself and the first plastic material part - in such a manner, however, that the flexible part 27 of the connecting element remains as a diverging and bendable part from the cover part.
• Figure 9 is a schematic side view of a part of an eighth cover part of the invention in partial cross-section.
• the cover part 25 comprises a film 2 that is arranged on the inner surface side of the cover part in relation to the frame 1 , preferably in the injection-moulding mould.
• the frame 1 is made of an at least partly transparent plastic.
• the film 2 may also be arranged on the outer surface side of the cover part 25.
• the film 2 is an insert film, for instance, and a solar cell 37 is integrated thereto.
• the solar cell 37 is what is known as a thin-film solar cell that is made by printing, such as ink-jet printing or stencil printing, painting or using some other coating method into the film 2.
• the operation of the thin-film solar cell is known per se and is based on organic materials that are arranged between the electrodes of the cell.
• An example of the advantages of a thin-film solar cell is the possibility to arrange it on both straight and curved surfaces. Thanks to this, the shape of the cover part does not limit the surface area of the solar cell 37.
• the solar cell 37 may naturally also be of another type, such as a silicon-based solar cell.
• a protective layer 38 is arranged on the film 2 on the front side of the solar cell 37.
• the protective layer 38 refers to a layer that at least partly obscures visibility to the solar cell 37.
• the protective layer 38 is now a light-diffusing layer. It allows most of the light to the solar cell 37 which it, however, obscures at least substantially so that the solar cell cannot easily be seen when examining the device.
• the light-diffusing layer may have patterns or other aesthetic features.
• the light-diffusing layer may also be arranged on the frame 1 , whereby it may be equal in thickness to the frame 1 on the front side of the solar cell 37 or form only part of the thickness of the frame.
• Some other embodiments of the protective layer 38 are a frame 1 that is coloured, coated, or patterned with a translucent paint, varnish or the like.
• the protective layer 38 comprises one or more layers that change their colour or some other property of their appearance.
• This type of protective layer 38 may for instance be implemented as an electrochromic layer known per se.
• An electrochromic layer changes its colour reversibly when an electric charge it supplied to it. The necessary electric charge may be activated by the user of the device or automatically without user intervention.
• the operation of the layer changing its colour or other property of its appearance may also be based on temperature change or the like.
• the protective layer 38 is arranged to serve as a display device, preferably a touch screen, to which a keyboard, for instance, may be applied.
• the conductors required by the touch screen may be implemented using transparent or very thin conductors.
• Contacts to the electric circuit of the device required by the operation of the protective layer 38 may be implemented through the flexible part 27, for instance.
• Figure 10 is a schematic side view of a part of an ninth cover part of the invention in partial cross-section.
• This embodiment differs from that shown in Figure 9 mainly in that the film 2 is arranged between two plastic layers 1a, 1 b. These plastic layers 1 a, 1 b form the frame 1 of the cover part 25.
• This type of structure may be formed by using two-stage injection moulding or multi-component injection moulding, for instance.
• the film 2 with any operational layers attached thereto is extremely well protected from external loads or the like.
• FIG. 9 Another difference between the embodiments shown in Figures 9 and 10 is that the latter does not have a protective layer 38.
• the protective layer 38 may naturally be added to the cover part 25 of Figure 10, and it may be left out of the cover part of Figure 9.
• the cover part of an electronic device according to the invention is characterised in that the signal- transmitting bus comprises a flexible part that is arranged to diverge from the cover part. Further, it may be stated that the electronic device of the invention is characterised in that it has a cover part as claimed in any one of claims 1 to 37.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Signal Processing (AREA)
• Casings For Electric Apparatus (AREA)
• Telephone Set Structure (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (2)

Family

ID=41050686

Family Applications (1)

Country Status (4)

Cited By (7)

Families Citing this family (3)

Family Cites Families (11)

• 2009
  • 2009-08-20 FI FI20095860A patent/FI122621B/fi not_active IP Right Cessation
• 2010
  • 2010-08-16 CN CN201080036722.2A patent/CN102484662B/zh not_active Expired - Fee Related
  • 2010-08-16 EP EP10765466A patent/EP2467996A2/en not_active Ceased
  • 2010-08-16 WO PCT/FI2010/050633 patent/WO2011020946A2/en not_active Ceased

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events