WO2011083052A1

WO2011083052A1 - Thermal plug for use with a heat sink and method of assembling same

Info

Publication number: WO2011083052A1
Application number: PCT/EP2010/070594
Authority: WO
Inventors: Graham Charles Kirk; Zeshan Jabar Hussain; Stuart Connolly; Kevin James Berry; Paul Vaughan Cooper; Roger Kenyon Tomkinson; John Albert Boocock
Original assignee: GE Intelligent Platforms Ltd
Current assignee: GE Digital UK Ltd
Priority date: 2010-01-06
Filing date: 2010-12-22
Publication date: 2011-07-14
Anticipated expiration: 2012-07-06
Also published as: JP2013516776A; EP2522029A1; US20110162828A1; TW201145472A; CN102812549A; KR20120117850A

Abstract

A plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.

Description

THERMAL PLUG FOR USE WITH A HEAT SINK AND METHOD OF ASSEMBLING SAME

BACKGROUND OF THE INVENTION

[0001] The subject matter described herein relates generally to cooling an object and, more specifically, to cooling an electronic component using a thermal plug and a heat sink.

[0002] At least some known heat sinks absorb and/or dissipate heat from an object. Moreover, at least some known heat sinks are used in a variety of applications including refrigeration, heat engines, and cooling electronic devices. With recent technological developments in electronic devices, considerable efforts have been made to develop heat sinks that are reliable and efficient.

[0003] Some known heat sinks include a thermal plug that facilitates transferring heat from an electronic device to the heat sink. To reduce a thermal resistance of some known plugs, a surface of the plug is positioned parallel to a surface of the electronic device. When a surface of at least some known plugs are positioned in a non-parallel arrangement to the surface of the electronic device, such known plugs contact only a highest point of the electronic device, which results in an increase in thermal resistance and, in at least some instances, an overheating of the electronic device.

BRIEF SUMMARY OF THE INVENTION

[0004] In one aspect, a method is provided for assembling a heat sink assembly. A heat sink body that defines a heat sink cavity therein is provided. At least a portion of a thermal plug is positioned within the heat sink cavity. The thermal plug includes a first plug member and a second plug member. The first plug member defines a socket therein, and the second plug member is movable within the socket. A printed circuit board is positioned with respect to the thermal plug. The printed circuit board includes an electronic device. The second plug member is movable such that a surface of the thermal plug is substantially parallel to a surface of the electronic device.

[0005] In another aspect, a plug is provided for use with a heat sink body and an electronic device. The plug includes a first plug member and a second plug member. The first plug member defines a socket therein. The second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.

[0006] In yet another aspect, a heat sink assembly is provided for use with a printed circuit board coupled to an electronic device. The heat sink assembly includes a heat sink body and a thermal plug. The heat sink body defines a heat sink cavity therein. The thermal plug is positioned within the heat sink cavity. The thermal plug includes a first plug member and a second plug member. The first plug member defines a socket therein, and the second plug member is movable within the socket such that a bottom surface of the second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG. 1 is a cross-sectional side view of an exemplary heat sink assembly including a thermal plug that includes a first plug member and a second plug member;

[0008] FIG. 2 is a schematic top view of the first plug member shown in FIG. 1 ;

[0009] FIG. 3 is a schematic cross-sectional side view of the first plug member shown in FIG. 1 ;

[0010] FIG. 4 is a schematic top view of the second plug member shown in FIG. 1 ; [0011] FIG. 5 is a schematic cross-sectional side view of the second plug member shown in FIG. 1 ;

[0012] FIG. 6 is a perspective view of an exemplary mask that may be used with the thermal plug shown in FIG. 1 ; and

[0013] FIG. 7 is a flow chart illustrating an exemplary method for assembling the heat sink assembly shown in FIG. 1.

DETAILED DESCRIPTION OF THE INVENTION

[0014] The methods and apparatus described herein relate to cooling an electronic component using a thermal plug having a bottom surface that is substantially flat. The thermal plug is positioned on the electronic component such that a surface of the electronic component is in contact with the bottom surface of the thermal plug. The thermal plug is configured to facilitate positioning the bottom surface of the thermal plug to be substantially parallel to the surface of the electronic component.

[0015] FIG. 1 is a cross-sectional side view of an exemplary heat sink assembly 100 including a ball grid array (BGA) package 102, a printed circuit board (PCB) 104, a heat sink body 106, and a thermal plug 108.

[0016] In the exemplary embodiment, BGA package 102 includes at least one substrate 1 10 having a top surface 1 12 and a bottom surface 114. In the exemplary embodiment, an electronic device 1 16 is attached to substrate top surface 112, and a plurality of solder balls 1 18 are disposed on substrate bottom surface 114. As used herein, the term "electronic device" refers to an object to be cooled using a thermal plug such as described herein. Examples of electronic devices include, without limitation, a semiconductor chip, a microprocessor, a digital signal processor, a graphics processing unit, an integrated circuit, and/or any other suitable heat- generating device. In the exemplary embodiment, electronic device 1 16 has a top surface 120 that is substantially flat. [0017] In the exemplary embodiment, PCB 104 includes a layer 122 having a top surface 124 and a bottom surface 126. In the exemplary embodiment, layer 122 is fabricated from a dielectric material. More specifically, in the exemplary embodiment, layer 122 is fabricated from polyimide. It should be appreciated that layer 122 may be fabricated from any suitable material including, without limitation, a thermally conductive plastic material. In one embodiment, a copper plate is coupled to, and is coincident with, layer bottom surface 126.

[0018] Additionally, in the exemplary embodiment, PCB 104 includes a plurality of contact pads 130 coupled to layer top surface 124. In the exemplary embodiment, the number of contact pads 130 corresponds to the number of solder balls 118. In the exemplary embodiment, solder balls 1 18 are attached to contact pads 130. More specifically, each solder ball 118 attaches to a corresponding contact pad 130, thereby coupling BGA package 102 to PCB 104.

[0019] In the exemplary embodiment, heat sink body 106 has a first surface 132 and a side wall 134 that at least partially defines a cavity 136. In the exemplary embodiment, heat sink body 106 is fabricated from a material having a high electrical conductivity and/or a high thermal conductivity. More specifically, in the exemplary embodiment, heat sink body 106 is fabricated from aluminum, copper, aluminum alloy, aluminum composite, copper alloy, copper composite, and/or graphite.

[0020] In the exemplary embodiment, thermal plug 108 facilitates transferring heat from electronic device 116 to heat sink body 106. In the exemplary embodiment, thermal plug 108 includes a female body or, more broadly, a first plug member 138 and a male heat spreader or, more broadly, a second plug member 140. In the exemplary embodiment, first plug member 138 and second plug member 140 are fabricated from a material having a high electrical conductivity and/or a high thermal conductivity. More specifically, in the exemplary embodiment, first plug member 138 and second plug member 140 is fabricated from aluminum, copper, and/or silver. [0021 ] In the exemplary embodiment, at least a portion of first plug member 138 and/or at least a portion of second plug member 140 is plated using an electroless process for environmental protection of the base metal. More specifically, in the exemplary embodiment, at least a portion of first plug member and/or at least a portion of second plug member 140 has an electroless nickel plate finish. In an alternate embodiment, at least a portion of first plug member 138 and/or at least a portion of second plug member 140 is plated with Indium to reduce a contact resistance of first plug member 138 and second plug member 140.

[0022] FIG. 2 is a schematic top view of first plug member 138, and FIG. 3 is a schematic cross-sectional side view of first plug member 138. In the exemplary embodiment, first plug member 138 is substantially cylindrical and has a top surface 142, a bottom surface 144, and a sidewall 146.

[0023] In the exemplary embodiment, top surface 142 and sidewall 146 are configured to substantially align with heat sink body 106 (shown in FIG. 1). More specifically, top surface 140 and sidewall 146 substantially align with surface 132 and sidewall 134 (both shown in FIG. 1), respectively, to facilitate maintaining robust thermal contact between first plug member 138 and heat sink body 106. In the exemplary embodiment, at least a portion of top surface 142 and sidewall 146 is substantially complementary to surface 132 and sidewall 134, respectively. Moreover, in the exemplary embodiment, first plug member 138 is configured to have a tolerance for a manufacturing inconsistency of heat sink body 106.

[0024] In the exemplary embodiment, top surface 142 defines a cavity 148 configured to receive a biasing member therein (not shown in FIGS. 2 and 3), described in further detail below. In the exemplary embodiment, cavity 148 is substantially centered on top surface 142, and has a diameter of approximately 15.0 millimeters (mm) and a depth of approximately 0.50 mm. Moreover, in the exemplary embodiment, bottom surface 144 defines a socket 150 configured to receive second plug member 140 therein (shown in FIG. 1 ). In the exemplary embodiment, socket 150 extends across at least a portion of bottom surface 144. [0025] FIG. 4 is a schematic top view of second plug member 140, and FIG. 5 is a schematic cross-sectional side view of second plug member 140. In the exemplary embodiment, second plug member 140 is substantially cylindrical and has a top surface 152 and a bottom surface 154.

[0026] In the exemplary embodiment, second plug member top surface 152 is configured to substantially align with first plug member 138 (shown in FIG. 1). More specifically, top surface 152 substantially aligns with bottom surface 144 (shown in FIG. 1) to facilitate maintaining robust thermal contact between second plug member 140 and first plug member 138. In the exemplary embodiment, at least a portion of bottom surface 144 is substantially complementary to top surface 152. More specifically, in the exemplary embodiment, bottom surface 144 is a substantially concave surface and top surface 152 is a substantially convex surface. Alternatively, bottom surface 144 may be a substantially convex surface and top surface 152 may be a substantially concave surface.

[0027] In the exemplary embodiment, the concave shape of bottom surface 144 and the convex shape of top surface 152 each has a diameter of less than approximately 50.0 mm. More particularly, in the exemplary embodiment, the concave shape of bottom surface 144 and the convex shape of top surface 152 each has a diameter between approximately 10.0 mm and approximately 35.0 mm. Even more particularly, in the exemplary embodiment, the concave shape of bottom surface 144 and the convex shape of top surface 152 each has a diameter of approximately 20.0 mm to 25.0 mm.

[0028] As shown in FIGS. 2-5, first plug member 138 has a first diameter 156, and second plug member 158 has a second diameter 158. Particularly, in the exemplary embodiment, first and second diameters 156 and 158 are each between approximately 15.0 mm and approximately 50.0 mm. More particularly, in the exemplary embodiment, first and second diameters 156 and 158 are each between approximately 20.0 mm and 30.0 mm. Even more particularly, in the exemplary embodiment, first and second diameters 156 and 158 are each approximately 25.0 mm. Alternatively, second diameter 158 may be greater than first diameter 156 to increase a relative heat spreading ability of second plug member 140.

[0029] Referring back to FIG. 1, electronic device top surface 120 is configured to substantially align with second plug member 140. More specifically, top surface 120 is substantially aligned with bottom surface 154 to facilitate maintaining robust thermal contact between electronic device 116 and second plug member 140. In the exemplary embodiment, at least a portion of top surface 120 is substantially complementary to bottom surface 154. More specifically, in the exemplary embodiment, top surface 120 and bottom surface 154 are substantially flat. Moreover, in the exemplary embodiment, second plug member 140 is configured to tolerate any manufacturing imperfection of electronic device 116.

[0030] Referring to FIGS. 1-5, and in the exemplary embodiment, second plug member 140 is movable within socket 150. More specifically, in the exemplary embodiment, second plug member top surface 152 is rotatable within socket 150 in a plurality of directions along first plug member bottom surface 144, thereby enabling second plug member bottom surface 154 to substantially align with electronic device top surface 120.

[0031] In the exemplary embodiment, a biasing member 160 is positioned between thermal plug 150 and heat sink body 106. More specifically, in the exemplary embodiment, biasing member 160 is positioned within cavity 148 defined by first plug member top surface 142.

[0032] Biasing member 160 facilitates reducing a thermal resistance between electronic device 1 16, thermal plug 150, and/or heat sink body 106. In the exemplary embodiment, biasing member 160 facilitates positioning thermal plug 108 in robust thermal contact with electronic device 1 16 and/or heat sink body 106. More specifically, biasing member 160 applies a force on thermal plug 108 to facilitate reducing a gap between thermal plug 108 and electronic device 1 16 to reduce a thermal resistance between electronic device 1 16, thermal plug 150, and/or heat sink body 106. Moreover, in the exemplary embodiment, biasing member 160 enables thermal plug 108 to apply a substantially even pressure across top surface 120 of electronic device 116. In the exemplary embodiment, biasing member 160 maintains a constant force on thermal plug 108 through normal use, under vibration and shock, and during thermal cycling. In the exemplary embodiment, biasing member 160 is a spring. Alternatively, biasing member 160 may be an elastomeric rubber material and/or a silicone material.

[0033] In the exemplary embodiment, biasing member 160 facilitates supporting pressures of up to approximately 50.0 pounds per square inch (psi). More particularly, in the exemplary embodiment, biasing member 160 facilitates supporting pressures of up to approximately 40.0 psi. Even more particularly, in the exemplary embodiment, biasing member 160 facilitates supporting pressures of up to approximately 30.0 psi. In the exemplary embodiment, biasing member 160 enables heat sink assembly 100 to tolerate various pressures exerted between heat sink body 106, biasing member 160, first plug member 138, second plug member 140, and/or electronic device 1 16, thereby reducing a probability of exerting an uneven force across surface 120 of electronic device 116.

[0034] In an alternate embodiment, first plug member sidewall 146 has a screw thread (not shown) that extends around a periphery of first plug member 138. Moreover, in the alternate embodiment, heat sink body sidewall 134 has a corresponding screw thread (not shown) that is configured to engage the screw thread of first plug member 138. In the alternate embodiment, a thermal interface material (TIM) may be applied to the screw threads to increase a contact area and, thus, reduce a thermal resistance. In the alternate embodiment, first plug member 138 is screwed into heat sink body 106 using a torque driver (not shown).

[0035] In the exemplary embodiment, a thermal interface material (TIM) 162 is provided between two material surfaces to facilitate reducing a thermal resistance between the two material surfaces. More specifically, in the exemplary embodiment, TIM 162 is applied between two material surfaces to decrease a gap between the two material surfaces and reduce a thermal resistance between the two material surfaces. In the exemplary embodiment, the material surfaces include any combination of heat sink body 106, biasing member 160, first plug member 138, second plug member 140, and electronic device 1 16. More specifically, in the exemplary embodiment, the material surfaces include any combination of heat sink body first surface 132, heat sink body sidewall 134, first plug member top surface 142, first plug member bottom surface 144, first plug member sidewall 146, second plug member top surface 152, second plug member bottom surface 154, and electronic device top surface 120.

[0036] In the exemplary embodiment, TIM 162 is in a film, sheet, and/or foil form or a grease form that is spreadable. In the exemplary embodiment, TIM 162 includes a filler material such as Boron Nitride and/or Aluminum Nitride. One known embodiment of a TIM is the HeatSpring™ material developed by Indium Corporation.

[0037] In the exemplary embodiment, a layer (not shown) of an adhesive material is provided to facilitate positioning TIM 162 between the two material surfaces. More specifically, in the exemplary embodiment, a thin layer of the adhesive material is applied on at least one of heat sink body 106, biasing member 160, first plug member 138, second plug member 140, and electronic device 1 16. Even more specifically, in the exemplary embodiment, a thin layer of the adhesive material is applied on any combination of heat sink body first surface 132, heat sink body sidewall 134, first plug member top surface 142, first plug member bottom surface 144, first plug member sidewall 146, second plug member top surface 152, second plug member bottom surface 154, and electronic device top surface 120. In the exemplary embodiment, the adhesive material is applied using an aerosol adhesive spray. One known embodiment of the aerosol adhesive spray is the Scotch- Weld™ product developed by 3M Corporation.

[0038] FIG. 6 is a perspective view of an exemplary mask 164 that may be used with heat sink assembly 100. In the exemplary embodiment, mask 164 facilitates applying the adhesive material in a pattern 166. More specifically, in the exemplary embodiment, mask 164 includes a plurality of openings 168 defined therethrough in an array pattern or a grid pattern 166. In the exemplary embodiment, each opening 168 has a diameter of approximately 1.0 mm.

[0039] In the exemplary embodiment, mask 164 shields at least a portion of the material surface to facilitate maintaining contact, and thus thermal conductivity, between two material surfaces. More specifically, in the exemplary embodiment, mask 164 is positioned such that the adhesive material is selectively applied through at least one opening 168 onto at least one of heat sink body first surface 132, heat sink body sidewall 134, first plug member top surface 142, first plug member bottom surface 144, first plug member sidewall 146, second plug member top surface 152, second plug member bottom surface 154, and electronic device top surface 120.

[0040] During operation, electronic device 116 generates heat, and thermal plug 108 and/or heat sink body 106 dissipates the heat generated by electronic device 1 16. More specifically, electronic device 116 generates thermal energy, and thermal plug 108 transfers the thermal energy to heat sink body 106. TIM 162 may be provided between any combination of electronic device 1 16, first plug member 138, second plug member 140, biasing member 160, and/or heat sink body 106 to further reduce a thermal resistance of heat sink assembly 100.

[0041] FIG. 7 is a flowchart 200 that illustrates an exemplary method for assembling heat sink assembly 100 (shown in FIG. 1). Referring to FIGS. 1-6, and in the exemplary embodiment, biasing member 160 and at least a portion of thermal plug 108 are positioned within cavity 136. More specifically, in the exemplary embodiment, biasing member 160 is positioned 202 with respect to heat sink surface 132, and TIM 162 is applied to heat sink body first surface 132 and/or sidewall 134. In the exemplary embodiment, first plug member 138 is positioned 204 in direct contact with, such as coupled to, biasing member 160 such that first plug member 138 receives a portion of biasing member 160 within first plug member cavity 148. In the exemplary embodiment, first plug member 138 is oriented such that first plug member top surface 142 faces heat sink body surface 132. In the exemplary embodiment, TIM 162 is applied to first plug member bottom surface 144. More specifically, in the exemplary embodiment, TIM 162 is provided in a ball shape (not shown) having a diameter of approximately 6.0 mm and placed at approximately the center of bottom surface 144.

[0042] In the exemplary embodiment, second plug member 140 is positioned 206 with respect to first plug member 138. More specifically, in the exemplary embodiment, a portion of second plug member 140 is positioned in direct contact with first plug member 138 such that first plug member 138 receives a portion of second plug member 140 within socket 150. In the exemplary embodiment, second plug member 140 is oriented such that second plug member top surface 152 faces first plug member bottom surface 144. In the exemplary embodiment, second plug member 140 is placed on the ball of TIM 162 and applies pressure to the ball of TIM 162 such that TIM 162 suitably expands about at least a portion of first plug member bottom surface 144.

[0043] In the exemplary embodiment, TIM 162 is applied to BGA package 102 and, more specifically, applied to electronic device top surface 120. In the exemplary embodiment, BGA package 102 is positioned 208 with respect to second plug member 140. More specifically, in the exemplary embodiment, electronic device 120 is positioned in direct contact with second plug member 140 such that electronic device top surface 120 faces second plug member bottom surface 154.

[0044] Moreover, in the exemplary embodiment, TIM 162 is provided 210 between any combination of heat sink body 106, biasing member 160, first plug member 138, second plug member 140, and electronic device 1 16 to reduce a thermal resistance of heat sink assembly 100. In the exemplary embodiment, a thin layer of the adhesive material is applied on at least one surface in a predetermined pattern to selectively position TIM 162 between any combination of heat sink body 106, biasing member 160, first plug member 138, second plug member 140, and electronic device 116. Additionally, to facilitate positioning TIM 162 in the exemplary embodiment, mask 164 is used to apply the adhesive material in pattern 166 on at least one of heat sink body 106, biasing member 160, first plug member 138, second plug member 140, and electronic device 116. Particularly, in the exemplary embodiment, the adhesive material is applied in pattern 166 on at least second plug member bottom surface 154 and electronic device top surface 120. Upon application of the adhesive material, mask 164 is removed from heat sink assembly 100.

[0045] In the exemplary embodiment, heat sink body 106 is securely coupled 212 to PCB 104 to increase a thermal conductivity between heat sink body 106, thermal plug 108, and electronic device 116. In one embodiment, a securing mechanism (not shown) is used to enable heat sink body 106 to apply 214 a constant pressure onto PCB 104 suitable to increase a thermal conductivity between thermal plug 108 and electronic device 116 without crushing electronic device 116. For example, the securing mechanism may include, without limitation, at least one clip, screw, spring, and/or clamp.

[0046] In the exemplary embodiment, thermal plug 108 is configured to substantially align second plug member bottom surface 154 with electronic device top surface 120. In the exemplary embodiment, as a pressure between thermal plug 108 and electronic device 116 increases, second plug member 140 moves 216, such as rotates, such that the pressure extends across electronic device top surface 120 substantially evenly. In the exemplary embodiment, second plug member bottom surface 154 is forcibly aligned to be substantially parallel with electronic device top surface 120, thereby maintaining robust thermal contact between thermal plug 108 and electronic device 1 16.

[0047] The methods and systems described herein relate to cooling an electronic component using a thermal plug and a heat sink that has a surface that at least partially defines a cavity. The thermal plug includes a first plug member having a bottom surface and a second plug member having a top surface that is substantially complementary to the bottom surface of the top plug member. The first plug member is positioned within the cavity, and the second plug member is positioned with respect to the first plug member such that the bottom surface of the first plug member is in contact with the top surface of the second plug member. The electronic component is positioned with respect to the second plug member such that a surface of the electronic component is in contact with a bottom surface of the second plug member. The thermal plug is configured to facilitate positioning the bottom surface of the second plug member to be substantially parallel to the surface of the electronic component. The exemplary embodiments described herein reduce a thermal resistance between the electronic component, the thermal plug, and/or the heat sink. Moreover, the exemplary embodiments described herein accommodate a manufacturing variability of at least one component. Further, the exemplary embodiments described herein apply an even pressure across a surface of the electronic component.

[0048] Exemplary embodiments of cooling an electronic component are described above in detail. The methods and systems are not limited to the specific embodiments described herein, but rather, operations of the methods and components of the systems may be utilized independently and separately from other operations and/or components described herein. For example, the methods and apparatus described herein may have other industrial and/or consumer applications and are not limited to practice with electronic components as described herein. Rather, one or more embodiments may be implemented and utilized in connection with other industries.

[0049] As used herein, an element or step recited in the singular and proceeded with the word "a" or "an" should be understood as not excluding plural said elements or steps, unless such exclusion is explicitly stated. Further, references to "one embodiment" are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments "comprising," "including," or "having" an element or a plurality of elements having a particular property may include additional such elements not having that property.

[0050] This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

CLAIMS:

1. A method for assembling a heat sink assembly, said method comprising: providing a heat sink body that defines a heat sink cavity therein; positioning at least a portion of a thermal plug within the heat sink cavity, the thermal plug including a first plug member and a second plug member, wherein the first plug member defines a socket therein, the second plug member being movable within the socket; positioning a printed circuit board with respect to the thermal plug, the printed circuit board including an electronic device, wherein the second plug member is movable such that a surface of the thermal plug is substantially parallel to a surface of the electronic device.

2. A method in accordance with claim 1, wherein positioning at least a portion of a thermal plug further comprises orienting the first and second plug members such that a surface of the first plug member is adjacent to a surface of the second plug member, wherein the surface of the first plug member is substantially concave, and the surface of the second plug member is substantially convex.

3. A method in accordance with claim 1 or claim 2, further comprising providing a biasing member between the thermal plug and the heat sink body.

4. A method in accordance with any preceding claim, further comprising providing a thermal interface material between at least two of the heat sink body, the first plug member, the second plug member, and the electronic device.

5. A method in accordance with claim 4, further comprising coupling an adhesive material to at least one of the heat sink body, the first plug member, the second plug member, and the electronic device, wherein the adhesive material facilitates positioning the thermal interface material.

6. A method in accordance with claim 5, wherein coupling an adhesive material further comprises applying the adhesive material in a grid pattern.

7. A plug for use with a heat sink body and an electronic device, said plug comprising: a first plug member defining a socket therein; and a second plug member movable within the socket such that a bottom surface of said second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.

8. A plug in accordance with claim 7, wherein said first plug member includes a bottom surface, and said second plug member includes a top surface that is substantially complementary to the bottom surface of said first plug member, and wherein said first plug member and said second plug member are oriented such that the bottom surface of said first plug member is adjacent to the top surface of said plug member.

9. A plug in accordance with claim 8, wherein the bottom surface of said first plug member is substantially concave, and the top surface of said second plug member is substantially convex.

10. A plug in accordance with any of claims 7 to 9, wherein said first plug member includes a first diameter, and said second plug member includes a second diameter that is substantially equal to the first diameter.

11. A plug in accordance with any of claims 7 to 10, further comprising a biasing member provided between the heat sink body and said first plug member, wherein said first plug member defines a cavity that is sized to receive said biasing member.

12. A plug in accordance with any of claims 7 to 1 1, further comprising an adhesive material coupled to at least one of said first plug member and said second plug member, wherein said adhesive material is applied in a grid pattern.

13. A heat sink assembly for use with a printed circuit board coupled to an electronic device, said heat sink assembly comprising: a heat sink body that defines a heat sink cavity therein; and a thermal plug positioned within the heat sink cavity, said thermal plug comprising a first plug member and a second plug member, wherein said first plug member defines a socket therein and said second plug member is movable within the socket such that a bottom surface of said second plug member is maintained in a substantially parallel position with respect to a top surface of the electronic device.

14. A heat sink assembly in accordance with claim 13, wherein said first plug member includes a bottom surface, and said second plug member includes a top surface that is substantially complementary to the bottom surface of said first plug member, and wherein said first plug member and said second plug member are oriented such that the bottom surface of said first plug member is adjacent to the top surface of said second plug member.

15. A heat sink assembly in accordance with claim 14, wherein the bottom surface of said first plug member is substantially concave, and the top surface of said second plug member is substantially convex.

16. A heat sink assembly in accordance with any of claims 13 to 15, wherein said first plug member includes a first diameter, and said second plug member includes a second diameter that is substantially equal to the first diameter.

17. A heat sink assembly in accordance with any of claims 13 to 16, further comprising a biasing member provided between said heat sink body and said first plug member, wherein said first plug member defines a cavity that is sized to receive said biasing member.

18. A heat sink assembly in accordance with any of claims 13 to 17, further comprising a thermal interface material provided between at least two of said heat sink body, said first plug member, said second plug member, and the electronic device.

19. A heat sink assembly in accordance with claim 18, further comprising an adhesive material coupled to at least one of said heat sink body, said first plug member, said second plug member, and the electronic device, wherein said adhesive material facilitates positioning said thermal interface material.

20. A heat sink assembly in accordance with claim 19, wherein said adhesive material is applied in a grid pattern.