WO2011070951A1 - Organic electronics panel and method of manufacturing same - Google Patents

Abstract

Provided is a large-area organic electronics panel, wherein driving lifespan and durability thereof are excellent, and efficient power feeding or power generation can be conducted, while saving space. Also provided is a method of manufacturing the same. This organic electronics panel has an organic electronics element configured such that an organic chemical compound layer, which includes at least a functional layer comprised of an organic chemical compound, is sandwiched between a first electrode and a second electrode that are arranged on a support substrate at positions opposed to each other, and the organic electronics panel is configured so as to be tightly sealed by the support substrate and a sealing member that covers the organic electronics element. A wiring member is arranged in the tightly sealed interior, and the wiring member and the functional layer comprised of the organic chemical compound are arranged such that at least portions thereof overlap, when viewed from the light emitting face or the light receiving face.

Description

Organic electronics panel and manufacturing method thereof

The present invention relates to an organic electronics panel and a method for manufacturing the same, and more particularly, to a method for wiring an organic electronics element used in an organic electronics panel, and more particularly to an organic electroluminescence element and an electrode wiring of an organic photoelectric conversion element. It is.

Organic electronics elements are elements that perform electrical operations using organic substances. In recent years, organic electronics elements are expected to exhibit features such as energy saving, low cost, and flexibility, and technologies that replace conventional inorganic semiconductors based on silicone. It is attracting attention as.

These organic electronics elements emit light, control current and voltage, or generate electricity by charging light or charge by passing an electric current through an electrode through a very thin film of organic matter. It is an element to do.

In particular, organic electroluminescence (hereinafter, also referred to as organic EL) panels are attracting attention for applications such as display applications and illumination applications, in particular, because thin surface light sources can be obtained.

When an organic EL panel is used for illumination, if the light emitting area is increased, the influence of the resistance of the transparent electrode is increased, and the luminance uniformity in the surface is reduced. An organic EL panel with poor luminance uniformity not only looks bad, but also causes problems such as a decrease in light emission efficiency due to current loss and the accompanying heat generation. In addition, problems such as a reduction in device life occur due to the influence of heat generation. Thus, in the organic EL panel for illumination, development of a panel with good luminance uniformity and no current loss is demanded.

In addition, since the organic EL element generally has low resistance to moisture and oxygen, it is necessary to prevent the organic EL element from the influence of moisture and oxygen by using a sealing member such as a sealing can and a sealing plate.

The organic photoelectric conversion element is an organic electronic element having a structure similar to that of the organic electroluminescence element, but the light emitting layer of the organic electroluminescence element is a photoelectric conversion layer made of a thin film of an organic compound, and this is sandwiched between electrodes. This is an element that has such a configuration and generates electricity when irradiated with light. Therefore, when a thin-film organic photoelectric conversion element is used as a solar cell, it can be easily reduced in size and weight, and has a relatively stable output even in a low illuminance environment or a high temperature environment as compared with an existing inorganic semiconductor solar cell. The solar cell can be obtained.

In the organic photoelectric conversion element, similarly to the organic EL element, carrier traps are formed in the photoelectric conversion layer due to the influence of moisture, oxygen, and the like, thereby preventing the collection of carriers generated by charge separation. . As a result, this not only causes a decrease in power generation efficiency, but also affects the lifetime of the organic photoelectric conversion element. Therefore, in the organic photoelectric conversion element as well, it has been studied to secure the performance by using a sealing material having a barrier performance against gas components such as moisture and oxygen.

For example, Patent Document 1 describes a method of routing wiring outside the sealing structure, but there is a problem that efficient power supply is not always possible due to the space of the sealing member or the like. It was.

JP 2008-145840 A

It is an object of the present invention to provide a large-area organic material that can efficiently supply power or generate electric power while maintaining space saving and excellent in driving life and durability in sealing an organic electronics panel using a flexible substrate. An electronic panel and a method for manufacturing the same are provided.

The above object of the present invention is achieved by the following means.

1. An organic electronics element having a structure in which an organic compound layer including at least a functional layer made of an organic compound is sandwiched between a first electrode and a second electrode arranged at opposing positions on a support substrate; An organic electronics panel having a configuration in which a sealing member covering an element and the support substrate are closely sealed, and a wiring member is disposed in the tightly sealed interior, when viewed from a light emitting surface or a light receiving surface The organic electronics panel is characterized in that the functional layer made of the organic compound and the wiring member are arranged so that at least a part thereof overlaps.

2. 2. The organic electronics panel according to 1, wherein the organic electronics element is an organic electroluminescence element in which the functional layer is a light emitting layer.

3. 2. The organic electronics panel according to 1, wherein the organic electronics element is an organic photoelectric conversion element in which the functional layer is a photoelectric conversion layer.

4. 4. The organic electronics panel according to any one of 1 to 3, wherein a stress relaxation layer is provided between the second electrode and the wiring member.

5. 5. The organic electronics panel as described in 4 above, wherein the stress relaxation layer is composed of two or more layers.

6. 6. The organic electronics panel according to any one of 1 to 5, wherein an inorganic film is provided between the second electrode and the wiring member.

7. The organic electronics panel according to any one of 1 to 6, wherein the wiring member is formed of a metal foil.

8. Any one of 1 to 7 above, wherein when viewed from the light emitting surface or the light receiving surface, the distance (sealing margin) between the light emitting unit or the power generation unit and the end of the substrate is 2 mm or more and 10 mm or less. 2. The organic electronics panel according to item 1.

9. 9. The organic electronics panel according to any one of 1 to 8, wherein a light emitting area or a power generating area is 5 square cm or more.

10. 10. A method for manufacturing an organic electronics panel according to any one of 1 to 9, wherein at least a step of forming a first electrode on a support substrate, a functional layer made of an organic compound is provided. A step of forming an organic compound layer, a step of forming a second electrode, a step of installing at least one of wiring members, and a step of installing a sealing member, wherein the wiring member is connected to the support substrate and the Manufacturing of an organic electronics panel, wherein the functional layer portion and the wiring member are arranged so as to overlap each other when viewed from the front of the organic electronics panel with a sealing member Method.

According to the present invention, it is possible to obtain a large-area organic electronics panel that is excellent in driving life and durability, can efficiently perform power feeding or power generation, and a method for manufacturing the same while maintaining space.

It is a graph which shows an example of the relationship between the length of the margin for sealing, and the dark spot generation | occurrence | production area. It is sectional drawing which shows an example of a structure of the organic electronics panel of this invention. It is sectional drawing which shows an example of a structure of the organic electronics panel of a comparative example. It is a cross-sectional structure schematic diagram which shows an example of the manufacturing method of the organic electronics panel of this invention. It is sectional drawing which shows the structure of the organic electroluminescent panel 101 produced in the Example. It is sectional drawing which shows the structure of the organic electroluminescent panel 102 produced in the Example. It is sectional drawing which shows the structure of the organic electroluminescent panel 103 produced in the Example. It is sectional drawing which shows the structure of the organic electroluminescent panel 104 produced in the Example.

Hereinafter, embodiments for carrying out the present invention will be described in detail.

The inventor has intensively studied a method for performing highly efficient wiring while maintaining space saving. As a result, it is possible to manufacture a thin and flexible organic electronics panel by using a close sealing (solid sealing) type sealing method, but this close sealing type sealing method is In the case of using it, a sealing margin (sealing portion, sealing region) is required around the functional layer region for light emission or power generation. If a wiring member is further arranged around the sealing margin, both the sealing margin and the installation space for the wiring member are required, resulting in an increase in the size of the organic electronics panel.

In the organic electronics panel of the present invention, an organic compound layer including at least a functional layer made of an organic compound is sandwiched between a first electrode and a second electrode arranged at opposing positions on the support substrate. An organic electronics panel having a configuration in which the organic electronics element having the configuration described above is provided, and having a configuration in which the sealing member that covers the organic electronics element and the support substrate are tightly sealed, and the wiring member is disposed in the tightly sealed interior And when viewed from the light emitting surface or the light receiving surface, the functional layer made of the organic compound and the wiring member are arranged so that at least a part thereof overlaps, and the wiring is formed inside the adhesive seal. By arranging the members, it becomes possible to double the sealing space and the installation space for the wiring members, and as a result, space saving can be achieved. One in which it was possible.

In the case of a large area organic EL panel suitably used for lighting applications, it is necessary to pass a large current. In the case of a large area organic photoelectric conversion panel (organic thin film solar cell), the generated current is taken out. Is required. Here, by arranging the wiring so as to overlap the light emitting portion or the power generation portion, not only the degree of freedom of the wiring is increased, but also a thin wiring such as a metal foil can be used.

Also, by arranging the wiring during the close-sealing, the wiring was protected, physical problems such as disconnection were reduced, and improvement in reliability could be achieved. In addition, chemical defects such as corrosion have been reduced, and stable power supply has become possible even when stored for a long time under high temperature and high humidity.

Furthermore, by providing a stress relaxation layer or an inorganic film between the electrode on the organic compound layer and the wiring member, damage to the organic layer that occurs when the organic electronics panel is bent is reduced, resulting in higher durability. We were able to provide a panel.

Furthermore, it has also been found that the driving life of the organic electronics panel is increased by adopting such a configuration. The reason for this is not clear, but it is presumed that the wiring member disposed on the electrode also serves as a heat sink, preventing the organic compound layer from being heated and extending its driving life.

In the present invention, the distance from the light emitting end or the power generation end to the sealing end, so-called sealing margin, is preferably 2 mm or more and 10 mm or less. In order to reduce the size of the panel, it is preferable that the sealing margin is narrow. However, if it is too narrow, water or oxygen may enter from the surroundings, causing damage to the organic layer. Therefore, 2 mm or more and 10 mm or less are preferable, 2 mm or more and 7 mm or less are more preferable, and 2 mm or more and 5 mm or less are the most preferable.

The inventor has verified the characteristics of an organic electronics panel produced by changing the sealing margin distance when stored in a high-humidity environment, as shown in FIG.

FIG. 1 is a graph showing the relationship between the length of the sealing margin and the dark spot generation area. The organic EL panel produced by changing the width of the sealing margin was stored at 60 ° C. in an environment of 90% RH for 250 hours, and then a luminescence image was taken, and a constant non-luminous portion (dark spot ( DS)). As is clear from the results shown in FIG. 1, by setting the sealing margin to 2 mm or more, the dark spot generation area rapidly decreases, and when it is 10 mm or more, the area is almost constant. It can be seen that the effect of reducing the dark spot generation area is small even if the sealing margin is lengthened.

Next, preferred embodiments of the organic electronics panel of the present invention will be described with reference to the drawings.

FIG. 2 is a cross-sectional view showing an example of the configuration of the organic electronics panel of the present invention.

FIG. 2 shows an organic compound layer including a pair of electrode groups formed by the first electrode 3 and the second electrode 4 formed on the support substrate 2 and at least a light emitting layer or a photoelectric conversion layer (power generation layer) therebetween. 5 is a schematic cross-sectional view showing an organic electronic device 1 having a configuration in which 5 is sandwiched, and an organic electronic panel 1 that is tightly (solidly) sealed by a sealing member 9 and a sealing adhesive 11 covering the organic electronic device.

In FIG. 2, an organic compound layer 5 including, for example, an anode made of ITO and a light emitting layer or a photoelectric conversion layer is further formed thereon as a first electrode 3 on a flexible substrate that is a support substrate 2. For example, a cathode that is the second electrode 4 made of aluminum or the like is laminated to form an organic electronics element.

The support substrate 2 on which the organic electronics element is formed is tightly sealed by a sealing member 9. That is, the sealing member 9 is in close contact with the organic electronics element and the support substrate 2 that is a resin substrate by the sealing adhesive 11 and covers the entire surface, thereby sealing and isolating the organic electronics element from the external space. The organic electronics panel 1 is configured.

Here, the first electrode 3 and the second electrode 4 are adhered and joined (connected) by the wiring member 8 via the conductive adhesive 7. Further, the wiring member 8 is disposed so as to overlap the light emitting region or the power generation region.

In general, the close sealing is also referred to as solid sealing, and all the gaps are made of resin (sealing adhesive) so as not to leave a space between the support substrate 2 on which the organic electronics element is formed and the sealing member 9. The organic electronic element, that is, the organic compound layer 5 is sealed by covering with 11).

By adopting the configuration defined in the present invention, the wiring member 8 is usually provided so as to cover the transparent first electrode 3 having a high resistance, and power can be supplied efficiently. Further, the wiring member 8 is also provided so as to overlap with the light emitting region or the power generation region, so that it is possible to reduce the thickness and the resistance.

Moreover, since the wiring member 8 is fixed by the sealing adhesive 11 by adopting these sealing methods, the electrode lead is not only the joint with the electrode lead-out portion, but also the sealing adhesive 11. Can be firmly fixed without peeling or loosening. In addition, the electrode lead-out portion does not have to be formed outside the sealing member, and the electrode area can be designed in a compact manner. In particular, there is an advantage in the case of an electrode using a transparent conductive film such as ITO. .

Moreover, by taking such a form, it becomes possible to efficiently release the heat generated in the organic layer to the cathode, the wiring member, the sealing adhesive, and the sealing member, and the organic layer can be efficiently removed. It can also be cooled. In particular, heat conduction can be increased by using a metal wiring member, and thermal damage to the organic layer can be reduced.

Therefore, according to the present invention, the wiring member is provided in the region tightly sealed by the sealing member, and the electrode lead is taken out from the close (solid) sealing portion, so that the performance of the organic electronics element is reduced in a space-saving manner. In particular, when a flexible resin substrate is used for the sealing member, it is an excellent sealing method that is strong against bending and displacement.

FIG. 3 is a cross-sectional view showing an example of the structure of a comparative organic electronics panel.

In the organic electronics panel of the comparative example shown in FIG. 3, the first electrode 3 provided on the flexible substrate that is the support substrate 2, the organic compound layer 5 including the light emitting layer or the photoelectric conversion layer, the second electrode 4, and the like. The structure in which the organic electronics elements formed by being laminated are not sealed with a sealing member or the like is shown.

Next, an example of the method for manufacturing the organic electronics panel of the present invention will be described with reference to FIG.

FIG. 4 is a cross-sectional schematic diagram showing an example of a method for manufacturing an organic electronics panel according to the present invention, focusing on a connection portion between an electrode lead and an electrode lead portion of an organic electronics element.

As the first step, as shown in FIG. 4A, on the resin substrate as the support substrate 2, on the first electrode 3 (anode) made of ITO and the extraction electrode 6 of the organic electronics element, For example, an organic electronic device is formed by sequentially laminating an organic compound layer 5 constituting an organic electronic device composed of a hole transporting layer, a light emitting layer, an electron transporting layer (not shown above) and the like, and a second electrode 4 (cathode). Are formed on the support substrate 2. Here, the 2nd electrode 4 (cathode) is formed so that the extraction electrode 6 comprised from ITO for a drive may be connected. These can be formed by forming ITO on the entire surface of the flexible support substrate 2 by sputtering, vapor deposition, or the like, and then etching into a desired pattern to form the first electrode 3 and the extraction electrode 6. . Alternatively, it may be formed by a method in which a desired resist pattern is formed in advance and ITO is evaporated and the resist pattern is lifted off. Furthermore, ITO can be directly formed by sputtering, vapor deposition or the like using a metal mask or the like in which a desired pattern is opened.

Also, the organic compound layer 5 and the second electrode 4 (cathode) may be patterned so as to form pixels in a matrix, or may be uniformly formed on the entire surface for uses such as illumination. good.

Next, an anisotropic conductive film is used as the conductive adhesive 7 and temporarily adhered to the second electrode 4 on the ITO electrode lead-out portion which is the lead-out electrode 6 on the support substrate (resin substrate) 2. Then, the wiring member 8 (copper foil) and its junction are aligned and bonded together. This adhesion is preferably performed under the pressure bonding conditions of the anisotropic conductive film. For example, the anisotropic conductive film can be connected by thermocompression bonding at a pressure of 0.1 to 10 MPa and a temperature of about 80 to 180 ° C. for several seconds to several minutes. However, the temperature at the time of adhesion of the conductive adhesive 7 is preferably 140 ° C. or lower, and when the temperature is equal to or lower than this temperature, the conductivity is kept good and the drive voltage is not increased. The reason for this effect is not clear, but the members used for electrode leads, resin substrates, and transparent electrodes such as ITO have different linear expansion coefficients, so stress bonding occurs at each member when they are bonded from room temperature to extremely different temperatures. In addition, it is estimated that this leads to poor conduction immediately afterwards and an increase in resistance during long-term storage.

In addition, when the lead electrode 6 and the wiring member 8 are bonded using the conductive adhesive 7, it is preferable that heating from both sides of the support substrate 2 and the sealing member 9 is uniformly cured.

The heating means is not particularly limited, and may be a heat plate, an oven, a laminator using a pressure roll, etc., as long as it can apply temperature and pressure. Generally, an ACF crimping machine or a bonder is used.

For example, it is preferable to use a commercially available ACF crimping machine and heat the sample stage to cure by pressure. Although it is not necessary for both the electrode lead and the resin substrate side to be at the same temperature, it is preferable to be within the above temperature range. Heating from both sides is preferable from the viewpoint of uniform curing of the conductive adhesive, stronger bonding, and less peeling.

The anisotropic conductive film used as the conductive adhesive 7 has conductive particles, for example, metal nuclei themselves (for example, gold, nickel, or silver) or resin nuclei (for example, gold-plated ones) dispersed in a binder. As the binder, a thermoplastic resin or a thermosetting resin is used, and among them, a thermosetting resin, particularly an epoxy resin is preferable. Alternatively, a conductive paste having a similar structure may be used. An anisotropic conductive film in which nickel fibers (fibrous) are oriented can be used as a filler.

When the anisotropic conductive film is thermocompression bonded to the support substrate, electrical connection in the thickness direction is made by the conductive particles, and at the same time, mechanical bonding is made by the binder resin. Examples of the binder resin include thermosetting resins such as epoxy resins and phenol resins, and thermoplastic resins such as polyamideimide. From the viewpoint of resin fluidity, connection reliability, cost, pot life, and the like, a film-like resin is used. Epoxy resins are preferred. Examples of the conductive particles include metal particles such as nickel, copper and silver, and composite particles in which the surface of plastic particles such as acrylic resin and styrene resin is coated with a metal plating film such as nickel and gold. In particular, in terms of connection reliability, composite particles in which the particles themselves are flexible and have a restorable plastic particle coated with a metal plating film such as nickel or gold are suitable. The conductive particle diameter is usually 3.0 to 5.0 μm as an average particle diameter.

Further, as the conductive adhesive 7, in addition to the anisotropic conductive film described above, a fluid material such as a conductive paste, for example, a silver paste or the like may be used. It can also be formed by printing or the like using a conductive paste on the electrode lead portion.

In the present invention, the sealing region or close-contact sealing refers to a space sandwiched between the support substrate 2 and the sealing member 9. In the present invention, it is preferable that the sealing region or the inside of the tight seal is filled with an adhesive or the like.

The wiring member 8 is formed of a conductor. The electrode lead that can be used in the present invention is not particularly limited as long as it is a member that has a low resistance value and can be made into a thin film, but the wiring member is preferably formed of a metal foil and is applicable to the present invention. Examples of the metal foil include aluminum foil, rolled copper foil, silver foil, and gold foil. Among these, aluminum foil and copper foil, which have a low resistance value, are easy to form a thin film, and are suitable for cost, can be used.

In the present invention, it is preferable to provide the stress relaxation layer 10 between the second electrode 4 and the wiring member 8. The stress relaxation layer 10 is not particularly limited as long as it can deform itself and prevent damage to the organic compound layer 5. For example, a resin or the like can be used. Specifically, polyethylene, polypropylene, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyvinyl chloride, polyvinylidene chloride, polyamide, polycarbonate, polyimide, polyurethane, polystyrene, ABS resin, acrylic resin, polyacetal resin, etc. These resins can be used.

In the present invention, it is preferable to provide the inorganic film 12 between the second electrode 4 and the wiring member 8. As the inorganic film 12, an insulating film is preferable. For example, silicon oxide, silicon nitride, aluminum oxide, or the like can be used.

Further, at the time of bonding, the water content of the conductive adhesive 7 or the wiring member 8 is preferably 100 ppm or less. It is preferable from the viewpoint that the water permeability of the cured film can be kept low by suppressing the mixing of water below this level, thereby strengthening the adhesion and at the same time curing it at a low water content.

The moisture content may be measured by any method. For example, a volumetric moisture meter (Karl Fischer), an infrared moisture meter, a microwave transmission moisture meter, a heat-dry weight method, GC / MS, IR, DSC (Differential scanning calorimeter) and TDS (temperature programmed desorption analysis). Further, using a precision moisture meter AVM-3000 (Omnitech) or the like, moisture can be measured from a pressure increase caused by evaporation of moisture, and moisture content of a film or a solid film can be measured.

After joining the wiring member 8 and the extraction electrode 6, next, as shown in FIG. 4B, close sealing (solid sealing) with a sealing member is performed.

As the sealing member 9 (sealing substrate), for example, a 50 μm thick PET (polyethylene terephthalate) laminated with an aluminum foil (30 μm thick) can be used. With this as a sealing member 9, a sealing adhesive 11 (for example, a thermosetting adhesive (epoxy adhesive)) is disposed in advance on the aluminum surface (or the resin substrate 1 or both surfaces facing the aluminum surface). After the resin substrate 2 and the sealing member 9 are aligned, the two are pressure-bonded / bonded (adhered) at a pressure of 0.1 to 3 MPa and a temperature of 80 to 180 ° C., and tightly sealed (solid sealing) )

For this bonding (adhesion), an ultraviolet curable resin can also be used. When using an ultraviolet curable resin, active energy ray irradiation is required. However, since the organic electronics element is damaged when irradiated with ultraviolet rays, it is necessary to reduce the amount of ultraviolet irradiation as much as possible when using an ultraviolet curable resin. As the sealing adhesive 11, it is preferable to use a thermosetting resin. Various known materials such as epoxy resins, acrylic resins, and silicone resins can be used.

In particular, it is preferable to use an epoxy thermosetting adhesive resin that is excellent in moisture resistance and water resistance and has little shrinkage upon curing.

The thermosetting resin (adhesive) is applied uniformly along the aluminum surface of the sealing member 9 (PET laminated with an aluminum foil) using a dispenser, for example, and then the sealing member 9 is electrically connected. Covering the joint portion between the lead portion and the electrode lead, for example, closely contacting and arranging on the support substrate 2 on which the organic electronics element is formed, press-bonding (for example, pressure 0.5 MPa), and temporarily bonding. At this time, it is temporarily bonded so that air (cavity) does not remain. A pressure roll or a press may be used. The temporarily bonded organic electronics panel is placed on, for example, a hot plate and heated (for example, at a temperature of 120 ° C. for 30 minutes) to thermally cure the thermosetting adhesive, thereby tightly sealing the organic electronics element (solid The organic electronics panel 1 is manufactured by sealing.

The lead electrode 6 and the wiring member 8 connected to the lead electrode 6 are fixed between the sealing member 9 and the support substrate 2 by the cured sealing adhesive 11, so that the electrode lead portion or the flexible member is sufficiently strong. The circuit board can be fixed.

The heating or pressure bonding time is appropriately selected depending on the type, amount, and area of the adhesive, but is temporarily bonded at a pressure of about 0.1 to 3 MPa, and the temperature is 80 to 180 ° C. and the heat curing time is 5 seconds to 10 minutes. Select within the range.

It is preferable to use a heated crimping roll because it can simultaneously perform crimping (temporary bonding) and heating, and can eliminate internal voids at the same time.

Also, as a method for forming the adhesive layer, a dispenser can be used, or a coating method such as roll coating, spin coating, screen printing, spray coating, or the like can be used depending on the material.

By the above operation, as shown in FIG. 4 (c), an organic electronics panel sealed and sealed can be obtained.

Solid sealing is a form in which there is no space between the sealing substrate and the organic electronics element substrate, as described above, and is covered with a cured resin, and has a sealing material-filled close-contact structure, and the electrode leads are also fixed in the sealing resin. Then, the electrode lead is taken out from the tightly sealed (solid) sealed portion.

An organic electronics panel that has a solid sealing structure that can maintain sufficient adhesion (bonding) strength in the connection between the electrode lead and the electrode, and that can take out the electrode lead without degrading the performance of the organic electronics element. It is a manufacturing method.

Next, details of each main component constituting the organic electronics panel of the present invention will be described.

In implementing the present invention, the material of each component is not particularly limited. That is, the first electrode (anode), organic compound layer, second electrode (cathode), conductive adhesive (anisotropic conductive film), adhesive, etc. constituting the support substrate, the sealing member, and the organic electronics element are Various known materials can be used.

In the organic electronics panel of the present invention, as the support substrate 2, a substrate made of a resin (plastic) in the form of a sheet or film can be used. In particular, transparent plastics such as polyester, polymethacrylate, and polycarbonate having high transparency to light emission are suitable.

Further, it is preferable to use a gas barrier film in which a gas barrier layer of aluminum oxide, silicon oxide, silicon nitride or the like is laminated on the resin substrate in a thickness range of 1 nm to several hundred nm. The gas barrier layer can also be formed on one surface or both surfaces of the resin substrate using thin film forming means such as plasma CVD, sputtering, or vapor deposition. As the resin substrate (film), the oxygen permeability measured by a method according to JIS K 7126-1987 is 1 × 10 ⁻³ ml / (m ² · 24 h · atm) or less, and it conforms to JIS K 7129-1992. The water vapor permeability (25 ± 0.5 ° C., relative humidity (90 ± 2)% RH) measured by the method is preferably 1 × 10 ⁻³ g / (m ² · 24 h) or less.

Examples of the sealing member 9 include metals such as stainless steel, aluminum, and magnesium alloys, polyethylene terephthalate, polycarbonate, polystyrene, nylon, plastics such as polyvinyl chloride, and composites thereof, glass, and the like. In particular, in the case of a resin film, a layer in which a gas barrier layer such as aluminum, aluminum oxide, silicon oxide, or silicon nitride is laminated can be used in the same manner as the resin substrate. The gas barrier layer can be formed by sputtering, vapor deposition or the like on both surfaces or one surface of the sealing member before molding the sealing member, or may be formed on both surfaces or one surface of the sealing member after sealing by a similar method. . Also in this case, the oxygen permeability is 1 × 10 ⁻³ ml / (m ² · 24 h · atm) or less, the water vapor permeability (25 ± 0.5 ° C., relative humidity (90 ± 2)% RH) is 1 × It is preferably 10 ⁻³ g / (m ² · 24 h) or less.

The sealing member may be a film laminated with a metal foil such as aluminum. As a method for laminating the polymer film on one side of the metal foil, a generally used laminating machine can be used. As the adhesive, polyurethane-based, polyester-based, epoxy-based, acrylic-based adhesives and the like can be used. You may use a hardening | curing agent together as needed. A hot melt lamination method, an extrusion lamination method and a coextrusion lamination method can also be used, but a dry lamination method is preferred.

In addition, when forming a metal foil by sputtering or vapor deposition, or when forming from a fluid electrode material such as a conductive paste, it is created by using a polymer film as a base material and forming a metal foil on this. May be.

Next, the organic EL element will be described.

<< Organic EL element >>
An organic EL element has a structure in which one or a plurality of organic compound layers are laminated between electrodes. For example, various organic compounds such as an anode layer / hole injection / transport layer / light emitting layer / electron injection / transport layer / cathode layer, etc. A functional layer made of a compound has a structure in which it is laminated as necessary. The simplest structure is an anode layer / light emitting layer / cathode layer.

[Hole injection / transport layer]
Examples of organic compound materials used for the hole injection / transport layer include phthalocyanine derivatives, heterocyclic azoles, aromatic tertiary amines, polyvinyl carbazole, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT: PSS), and the like. A polymer material such as a representative conductive polymer is used.

[Light emitting layer]
Examples of the organic compound material used for the light emitting layer include carbazole-based light emitting materials such as 4,4′-dicarbazolylbiphenyl and 1,3-dicarbazolylbenzene, (di) azacarbazoles, 1,3 , 5-tripyrenylbenzene and the like, low molecular light emitting materials typified by pyrene light emitting materials, polyphenylene vinylenes, polyfluorenes, polyvinyl carbazoles and the like polymer light emitting materials. Of these, a low molecular weight light emitting material having a molecular weight of 10,000 or less is preferably used as the light emitting material.

The light emitting material applied to the light emitting layer may preferably contain about 0.1 to 20% by mass of a dopant. Examples of the dopant include known fluorescent dyes such as perylene derivatives and pyrene derivatives, and phosphorescent dyes. For example, ortho represented by tris (2-phenylpyridine) iridium, bis (2-phenylpyridine) (acetylacetonato) iridium, bis (2,4-difluorophenylpyridine) (picolinato) iridium, etc. There are complex compounds such as metalated iridium complexes.

[Electron injection / transport layer]
Examples of the constituent material of the electron injection / transport layer include metal complex compounds such as 8-hydroxyquinolinate lithium and bis (8-hydroxyquinolinate) zinc, and the following nitrogen-containing five-membered ring derivatives. That is, oxazole, thiazole, oxadiazole, thiadiazole or triazole derivatives are preferred. Specifically, 2,5-bis (1-phenyl) -1,3,4-oxazole, 2,5-bis (1-phenyl) -1,3,4-thiazole, 2,5-bis (1 -Phenyl) -1,3,4-oxadiazole, 2- (4′-tert-butylphenyl) -5- (4 ″ -biphenyl) 1,3,4-oxadiazole, 2,5-bis ( 1-naphthyl) -1,3,4-oxadiazole, 1,4-bis [2- (5-phenyloxadiazolyl)] benzene, 1,4-bis [2- (5-phenyloxadiazolyl) -4-tert-butylbenzene], 2- (4′-tert-butylphenyl) -5- (4 ″ -biphenyl) -1,3,4-thiadiazole, 2,5-bis (1-naphthyl) -1 , 3,4-thiadiazole, 1,4-bis [2- (5-phenyl) Asiazolyl)] benzene, 2- (4′-tert-butylphenyl) -5- (4 ″ -biphenyl) -1,3,4-triazole, 2,5-bis (1-naphthyl) -1,3,4 -Triazole, 1,4-bis [2- (5-phenyltriazolyl)] benzene and the like.

As the organic compound material used for these light emitting layers and each functional layer, a material having a polymerization reactive group such as a vinyl group in the molecule is used, and a cross-linked / polymerized film is formed after film formation to form each functional layer. May be.

[Anode layer]
As the conductive material used for the anode layer, a material having a work function larger than 4 eV is suitable, and silver, gold, platinum, palladium and the like and alloys thereof, metal oxides such as tin oxide, indium oxide and ITO, Furthermore, organic conductive resins such as polythiophene and polypyrrole are used.

(Cathode layer)
As the conductive material used for the cathode layer, those having a work function smaller than 4 eV are suitable, such as magnesium and aluminum. Typical examples of the alloy include magnesium / silver and lithium / aluminum.

Each functional layer described above is formed on a support substrate and sealed with a sealing member to constitute an organic EL panel.

<< Organic photoelectric conversion element >>
Next, although an organic photoelectric conversion element is demonstrated, it is not limited to the following forms.

There is no restriction | limiting in particular as an organic photoelectric conversion element which can be used by this invention, If it is an element which has an anode and a cathode and at least 1 or more photoelectric conversion layer pinched | interposed between both and generates an electric current when irradiated with light Good.

The configuration of the photoelectric conversion layer is not particularly limited as long as it is a configuration in which an organic semiconductor material is stacked. For example, a heterojunction type in which a p-type semiconductor material and an n-type semiconductor material are stacked, or both a p-type and an n-type semiconductor. A so-called bulk heterojunction type in which materials are mixed and have a microphase separation structure can be given. From the viewpoint of improving internal quantum efficiency, a configuration excellent in charge separation efficiency is preferable, and a bulk heterojunction structure is more preferable in the present application.

Moreover, when using the organic photoelectric conversion element which concerns on this invention as a solar cell, it is preferable to use the organic-semiconductor material which has the absorption characteristic optimal for a sunlight spectrum, and it is a blacker external appearance from a viewpoint of efficiency and design property. An organic photoelectric conversion element is preferable.

[Configuration of organic photoelectric conversion element]
In the organic photoelectric conversion element to which the present invention is applied, a transparent electrode, a photoelectric conversion layer, and a counter electrode are sequentially laminated on one surface of a support.

Moreover, it is not restricted to this, For example, a hole transport layer, an electron transport layer, a hole block layer, an electron block layer, an electrode buffer layer, or a smoothing layer between a transparent electrode or a counter electrode and a photoelectric conversion layer An organic photoelectric conversion element may be configured with other layers. Further, it may be an electron transport layer having a hole blocking ability or a hole transport layer having an electron blocking ability. Among these, in an organic photoelectric conversion element having a bulk heterojunction type photoelectric conversion layer, a hole transport layer or an electron block layer is provided between the photoelectric conversion layer and the anode (usually the transparent electrode side), and the photoelectric conversion layer. By forming an electron transport layer or a hole blocking layer between the cathode and the cathode (usually the counter electrode side), it becomes possible to more efficiently extract charges generated in the bulk heterojunction type photoelectric conversion layer. Therefore, it is preferable to have these layers.

(I) Anode / hole transport layer / electron block layer / photoelectric conversion layer / hole block layer / electron transport layer / cathode (ii) Anode / hole transport layer having electron blocking ability / photoelectric conversion layer / hole block Electron transport layer / cathode buffer layer / cathode (iii) anode / anode buffer layer / hole transport layer / electron block layer / photoelectric conversion layer / hole block layer / electron transport layer / cathode (iv) anode / anode Buffer layer / hole transport layer / electron block layer / photoelectric conversion layer / hole block layer / electron transport layer / cathode buffer layer / cathode As described above, the organic photoelectric conversion element is laminated by stacking the layers. . The thin film forming method can be applied to form each of the above-described structures, but can be preferably applied particularly to the formation of each layer excluding the anode and the cathode.

In the organic electronics panel of the present invention, each functional layer may be formed by a vacuum method, a dry method such as a sputtering method, or may be formed by a wet method such as coating or printing.

Hereinafter, the present invention will be described by way of examples, but the present invention is not limited thereto.

Example 1
<< Production of Organic EL Panel: Present Invention >>
[Production of Organic EL Panel 101]
(Production of gas barrier flexible film (support substrate))
As a flexible film, a 100 μm thick polyethylene naphthalate film (a film made by Teijin DuPont, hereinafter abbreviated as PEN) is formed on the entire surface by an atmospheric pressure plasma discharge treatment having the structure described in JP-A-2004-68143. Using an apparatus, a gas barrier film (thickness 500 nm) composed of SiO ₂ is continuously formed on a flexible film, and has an oxygen permeability of 0.001 cm ³ / (m ² · 24 h · atm) or less, water vapor A gas barrier flexible film having a permeability of 0.001 g / (m ² · 24 h) or less was produced.

(Formation of first electrode and lead electrode)
An ITO film (indium tin oxide) having a thickness of 120 nm is formed by sputtering on the gas barrier flexible film prepared above, and patterned by photolithography, and the first electrode 3 as shown in FIG. And the extraction electrode 6 was formed. The pattern was such that the light emission area was 50 mm square.

(Formation of hole transport layer)
On the first electrode of the gas barrier flexible film formed above, the following hole transport layer forming coating solution was applied by an extrusion coater and then dried to form a hole transport layer as an organic compound layer. Formed. The hole transport layer forming coating solution was applied so that the thickness after drying was 50 nm.

Before applying the coating solution for forming the hole transport layer, a low pressure mercury lamp with a wavelength of 184.9 nm is used as a cleaning surface modification treatment for the gas barrier flexible film, the irradiation intensity is 15 mW / cm ² , The distance was 10 mm. The charge removal treatment was performed using a static eliminator with weak X-rays.

<Application conditions of coating solution for forming hole transport layer>
The coating process was performed in the atmosphere at 25 ° C. and a relative humidity of 50%.

<Preparation of coating solution for hole transport layer formation>
A solution obtained by diluting Baytron P AI 4083 (manufactured by Starck Vitec Co., Ltd.), which is a conductive polymer, under a condition of 65% pure water and 5% methanol was prepared as a coating solution for forming a hole transport layer.

<Application conditions of coating solution for forming hole transport layer>
The coating process using the coating liquid for forming a hole transport layer was performed in the atmosphere at 25 ° C. and a relative humidity of 50%.

<Drying and heat treatment conditions>
After applying the hole transport layer forming coating solution, the solvent is removed at a height of 100 mm toward the film forming surface, a discharge air velocity of 1 m / s, a wide air velocity distribution of 5%, and a temperature of 100 ° C., followed by heat treatment. The back surface heat transfer type heat treatment was performed at a temperature of 150 ° C. using an apparatus to form a hole transport layer.

(Formation of light emitting layer)
Subsequently, the white light emitting layer forming coating liquid shown below is applied on the hole transporting layer of the gas barrier flexible film having the hole transporting layer formed thereon by an extrusion coating machine, and then dried to form a light emitting layer. did. The white light emitting layer forming coating solution was applied so that the thickness after drying was 40 nm.

<Preparation of white light emitting layer forming coating solution>
1.0 g of HA as a host material, 100 mg of DA as a dopant material, 0.2 mg of DB as a dopant material, 0.2 mg of DC as a dopant material, A white light emitting layer forming coating solution was prepared by dissolving in a toluene solution.

<Application conditions>
The coating process was performed in an atmosphere having a nitrogen gas concentration of 99% or more, a coating temperature of 25 ° C., and a coating speed of 1 m / min.

<Drying and heat treatment conditions>
After applying the white light emitting layer forming coating solution, the solvent was removed at a height of 100 mm toward the film forming surface, a discharge wind speed of 1 m / s, a wide wind speed distribution of 5%, and a temperature of 60 ° C., followed by a temperature of 130 ° C. A heat treatment was performed to form a light emitting layer.

(Formation of electron transport layer)
Subsequently, after forming the light emitting layer by the above procedure, the following electron transport layer forming coating solution was applied by an extrusion coater and dried to form an electron transport layer. The coating solution for forming an electron transport layer was applied so that the thickness after drying was 30 nm.

<Preparation of electron transport layer forming coating solution>
The following compound EA was dissolved in 2,2,3,3-tetrafluoro-1-propanol to obtain a 0.5 mass% solution, which was used as a coating solution for forming an electron transport layer.

<Application conditions>
The coating process was performed in an atmosphere having a nitrogen gas concentration of 99% or more, the coating temperature of the electron transport layer forming coating solution was 25 ° C., and the coating speed was 1 m / min.

<Drying and heat treatment conditions>
After applying the coating solution for forming the electron transport layer, the solvent is removed at a height of 100 mm toward the film forming surface, a discharge air velocity of 1 m / s, a wide air velocity distribution of 5%, and a temperature of 60 ° C. Then, heat treatment was performed at a temperature of 200 ° C. to form an electron transport layer.

(Formation of electron injection layer)
Subsequently, an electron injection layer was formed on the formed electron transport layer. First, the substrate was put into a vacuum chamber and the pressure was reduced to 5 × 10 ⁻⁴ Pa. In advance, cesium fluoride prepared in a tantalum vapor deposition boat was heated in a vacuum chamber to form an electron injection layer having a thickness of 3 nm.

(Formation of second electrode)
Next, a second electrode was formed on the formed electron injection layer and extraction electrode. Subsequently, aluminum prepared in a tungsten vapor deposition boat was heated under a vacuum of 5 × 10 ⁻⁴ Pa. A mask pattern was formed so that the emission area was 50 mm square, and a second electrode having a thickness of 100 nm was laminated.

(Cutting)
The gas barrier flexible film formed up to the second electrode was moved again to the nitrogen atmosphere.

A gas barrier flexible film was cut into a prescribed size to produce an organic EL device.

(Wiring member)
A wiring member was connected to the produced organic EL element using an anisotropic conductive film DP3232S9 manufactured by Sony Chemical & Information Device Corporation. As the wiring member, a 30 μm thick aluminum foil (manufactured by Toyo Aluminum Co., Ltd.) was used.

Next, pressure bonding is performed using a commercially available ACF pressure bonding apparatus so as to have the shape shown in FIG. 5: temperature 170 ° C. (ACF temperature 140 ° C. measured using a separate thermocouple), pressure 2 MPa, and 10 seconds. went.

(Sealing)
A sealing member was bonded to the organic EL element to which the wiring member (aluminum foil) was connected using a commercially available roll laminating apparatus, and the organic EL panel 101 was manufactured.

In addition, as a sealing member, a 30 μm thick aluminum foil (manufactured by Toyo Aluminum Co., Ltd.), a polyethylene terephthalate (PET) film (12 μm thick) with an adhesive for dry lamination (two-component reaction type urethane adhesive). The laminate used (adhesive layer thickness 1.5 μm) was used.

The thermosetting adhesive was uniformly applied to the aluminum surface with a thickness of 20 μm along the adhesive surface (glossy surface) of the aluminum foil using a dispenser.

As the thermosetting adhesive, bisphenol A diglycidyl ether (DGEBA), dicyandiamide (DICY), and an epoxy adduct curing accelerator were used as an epoxy adhesive.

Next, the sealing substrate is closely attached and arranged so as to cover the wiring member, and is tightly sealed using a pressure-bonding roll under a thickening condition, a pressure-rolling temperature of 120 ° C., a pressure of 0.5 MPa, and an apparatus speed of 0.3 m / min. Thus, an organic EL panel 101 was produced.

FIG. 5 shows a cross-sectional view of the organic EL panel 101 produced as described above. In FIG. 5, E represents a light emitting area, L represents a sealing margin, and L is 4 mm.

<< Production of Organic EL Panel 102: Present Invention >>
A gas barrier flexible film formed up to the second electrode was cut out in the same manner as in the production of the organic EL panel 101 to produce an organic EL element.

Next, a polyethylene resin was disposed as the stress relaxation layer 10 so as to have the shape shown in FIG. As the polyethylene resin, PRIMACOR 3460 manufactured by Dow Chemical Japan Co., Ltd. was used.

Note that PRIMACOR 3460 was used as a 50 μm sheet by the inflation method.

On top of this, a wiring member was arranged in the same manner as the production of the organic EL panel 101, and the organic EL panel 102 was produced by tightly sealing.

FIG. 6 shows a cross-sectional view of the organic EL panel 102 produced as described above.

<< Preparation of Organic EL Panel 103: Present Invention >>
In the production of the organic EL panel 102, as the first stress relaxation layer 10A, a PRIMACOR 3460 of a polyethylene resin was disposed instead of the polyethylene resin.

Next, as the wiring member 8, a flexible printed circuit board (FPC) formed by bonding polyimide resin on both sides of the rolled copper foil and using it was used. The FPC polyimide resin acts as the stress relaxation layer 10B.

The FPC was pressure-bonded with ACF in the same manner as the production of the organic EL panel 102.

Thereafter, solid adhesion sealing was performed in the same manner as the production of the organic EL panel 102 to produce the organic EL panel 103. FIG. 7 shows a cross-sectional view of the organic EL panel 103.

<< Preparation of Organic EL Panel 104: Present Invention >>
In the same manner as in the production of the organic EL panel 101, the second electrode was formed and then cut.

Next, the cut substrate was transferred to a commercially available sputtering apparatus on which a SiO ₂ target was placed, and the inside of the apparatus was evacuated.

A 50 nm SiO ₂ film was provided as the inorganic film 12 on the second electrode using a sputtering apparatus.

The substrate provided with the SiO ₂ film was moved again to the nitrogen atmosphere, and the stress relaxation layers 10A and 10B and the wiring member 8 were installed in the same manner as the organic EL panel 103. Furthermore, close sealing was performed, and the organic EL panel 104 was produced. FIG. 8 shows a cross-sectional view of the organic EL panel 104.

<< Production of Organic EL Panel 105: Comparative Example >>
A comparative organic EL panel 105 having the configuration shown in FIG. 3 was produced according to the following method.

In the same manner as in the production of the organic EL panel 101, the second electrode was formed and was cut. Next, the cut substrate was transferred to a commercially available sputtering apparatus in which a SiN target was placed, and the inside of the apparatus was evacuated. A 200 nm SiN film was provided on the second electrode using a sputtering apparatus.

The substrate provided with the SiN film was taken out into the atmosphere, the wiring member 8 was installed, and the organic EL panel 105 was produced.

<< Evaluation of organic EL panel >>
About each produced said organic electroluminescent panel, durability and a drive life were evaluated in accordance with the following method, and the obtained result is shown in Table 1.

[Evaluation of durability]
The change in voltage before and after storage of each of the produced organic EL panels was measured, and durability was evaluated.

About the produced organic electroluminescent panel, 2.5 mA / cm < ² > current was applied using DC voltage / current source / monitor R6243 by ADC Corporation, and the voltage at that time was measured. Next, each panel was stored in a high-temperature and high-humidity tank at 60 ° C. and 90% RH for 300 hours. After storage, the voltage was measured in the same manner as before storage, and the voltage before and after storage was compared. Durability was evaluated according to standards.

○: Voltage change before and after storage is less than 0.5V Δ: Voltage change before and after storage is 0.5V or more and less than 1.0V ×: Voltage change before and after storage is 1.0V [Evaluation of drive life]
Using the drive life evaluation device prepared for each organic EL panel manufactured in combination with a commercially available constant current power supply and a spectral radiance meter (CS-2000 manufactured by Konica Minolta), the drive life was evaluated according to the following method. It was.

A current of 10 mA / cm ² was applied to each organic EL element, and the change in luminance over time was measured with a spectral radiance meter. Next, the relative lifetime of each organic EL panel when the luminance of each organic EL panel is half the lifetime immediately after driving is defined as the half-life and the half-life of the organic EL panel 101 is defined as 100. This was taken as a measure of the driving life.

As is clear from the results shown in Table 1, it can be seen that the organic EL panel having the configuration defined in the present invention is superior in durability and driving life to the comparative example.

Example 2
<< Production of Organic Photoelectric Conversion Panel (Organic Thin Film Solar Cell) 201 >>
In the production of the organic EL panel 104 described in Example 1, an organic photoelectric conversion panel 201 was produced in the same manner except that the formation of the organic compound layer was changed as described below.

(Formation of hole transport layer)
On the first electrode layer of the prepared gas barrier flexible film, Baytron P4083 (manufactured by Starck Vitec), which is a conductive polymer, is applied and dried so as to have a film thickness of 30 nm. A hole transport layer was formed by heat treatment for minutes.

[Formation of photoelectric conversion layer]
Subsequently, P3HT (manufactured by Prectronics: regioregular poly-3-hexylthiophene) and PCBM (manufactured by Frontier Carbon) are formed on the hole transport layer of the gas barrier flexible film formed up to the hole transport layer. : 6,6-phenyl-C ₆₁ -butyric acid methyl ester) was mixed at 1: 0.8 so as to be 3.0% by mass, while filtering the coating solution for photoelectric conversion layer with a filter Coating was performed so that the film thickness was 100 nm, and the film was left to dry at room temperature. Subsequently, a heat treatment was performed at 150 ° C. for 15 minutes to form a photoelectric conversion layer.

(Formation of electron transport layer)
Weigh 10 mg of Compound EB, prepare a solution in 0.5 ml of a mixed solvent of tetrafluoropropyl alcohol (TFPO): butanol = 1: 1, apply to a film thickness of 20 nm, and dry. An electron transport layer was formed.

[Formation of second electrode]
Subsequently, aluminum is used as the second electrode forming material under a vacuum of 5 × 10 ⁻⁴ Pa in the region excluding the formation portion of the extraction electrode on the first electrode on the formed electron injection layer, and the extraction electrode The organic photoelectric conversion panel (organic thin-film solar cell) was produced by depositing a mask pattern by a vapor deposition method so that the light receiving area was 50 mm square and laminating a second electrode having a thickness of 100 nm.

<< Evaluation of organic photoelectric conversion panel (organic thin film solar cell) >>
About the produced organic photoelectric conversion panel (organic thin film solar cell) 201, as a result of evaluating power generation according to a conventional method, a favorable result was shown.

DESCRIPTION OF SYMBOLS 1 Organic electronics panel 2 Support substrate 3 1st electrode 4 2nd electrode 5 Organic compound layer 6 Lead electrode 7 Conductive adhesive 8 Wiring member 9 Sealing member 10, 10A, 10B Stress relaxation layer 11 Sealing adhesive E Light emitting area L Sealing margin

Claims (10)

An organic electronics element having a structure in which an organic compound layer including at least a functional layer made of an organic compound is sandwiched between a first electrode and a second electrode arranged at opposing positions on a support substrate; An organic electronics panel having a configuration in which a sealing member covering an element and the support substrate are closely sealed, and a wiring member is disposed in the tightly sealed interior, when viewed from a light emitting surface or a light receiving surface The organic electronics panel is characterized in that the functional layer made of the organic compound and the wiring member are arranged so that at least a part thereof overlaps. The organic electronics panel according to claim 1, wherein the organic electronics element is an organic electroluminescence element in which the functional layer is a light emitting layer. The organic electronics panel according to claim 1, wherein the organic electronics element is an organic photoelectric conversion element in which the functional layer is a photoelectric conversion layer. The organic electronics panel according to any one of claims 1 to 3, further comprising a stress relaxation layer between the second electrode and the wiring member. The organic electronics panel according to claim 4, wherein the stress relaxation layer is composed of two or more layers. 6. The organic electronics panel according to claim 1, further comprising an inorganic film between the second electrode and the wiring member. The organic electronics panel according to any one of claims 1 to 6, wherein the wiring member is formed of a metal foil. The distance (sealing margin) between the light emitting portion or the power generation portion and the substrate end when viewed from the light emitting surface or the light receiving surface is 2 mm or more and 10 mm or less, wherein any one of claims 1 to 7 2. The organic electronics panel according to item 1. The organic electronics panel according to any one of claims 1 to 8, wherein a light emitting area or a power generating area is 5 square centimeters or more. It is a manufacturing method of the organic electronics panel which manufactures the organic electronics panel of any one of Claim 1 to 9, Comprising: The process of forming a 1st electrode on a support substrate at least, The functional layer which consists of organic compounds A step of forming an organic compound layer, a step of forming a second electrode, a step of installing at least one wiring member, and a step of installing a sealing member, and the wiring member and the support substrate An organic electronics panel, wherein the functional layer portion and the wiring member are disposed so as to overlap each other when viewed from the front of the organic electronics panel and between the sealing members. Production method.

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