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WO2011070386A1 - Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation - Google Patents

Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation Download PDF

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Publication number
WO2011070386A1
WO2011070386A1 PCT/IB2009/007813 IB2009007813W WO2011070386A1 WO 2011070386 A1 WO2011070386 A1 WO 2011070386A1 IB 2009007813 W IB2009007813 W IB 2009007813W WO 2011070386 A1 WO2011070386 A1 WO 2011070386A1
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WO
WIPO (PCT)
Prior art keywords
wire
sensors
sensor
monitoring device
saw device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2009/007813
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English (en)
Inventor
Jean-Marc Rosset
Rémy SCHULER
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Applied Materials Inc
Original Assignee
Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to PCT/IB2009/007813 priority Critical patent/WO2011070386A1/fr
Priority to TW099143301A priority patent/TW201134629A/zh
Publication of WO2011070386A1 publication Critical patent/WO2011070386A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Embodiments of the present invention relate to a device for the monitoring of a wire of a wire saw device, a method for operating such a device, and a wire saw device including such a device. More particularly, the invention relates to a device for detecting defects or breakage of a wire of a wire saw device for cutting or sawing hard materials such as blocks of silicon or quartz, e.g., for cutting silicon wafers, for a squarer, for a cropper or the like.
  • Wire saw devices exist for cutting blocks or bricks, thin slices, e.g., semiconductor wafers, from a piece of hard material such as silicon.
  • a wire is fed from a spool and is both guided and tensioned by wire guide cylinders.
  • the wire that is used for sawing is generally provided with an abrasive material.
  • the abrasive material can be provided as slurry. This may be done shortly before the wire touches the material to be cut. Thereby, the abrasive is carried to the cutting position by the wire for cutting the material.
  • the abrasive can be provided on the wire with a coating, e.g., as a diamond wire.
  • diamond particles can be provided on a metal wire with a coating, wherein the diamond particles are imbedded in the coating of the wire. Thereby, the abrasive is firmly connected with the wire.
  • the wire is both guided and tensioned by wire guides. These wire guides are generally covered with a layer of synthetic resin and are scored with grooves having very precise geometry and size.
  • the wire wound around the wire guides forms a web or wire web.
  • the web generates a force perpendicular to the advance of a support beam or support holding the piece to be sawed.
  • the piece to be sawed is moved through the wire web wherein the speed of this movement determines the cutting speed and/or the effective cutting area that can be sawed within a given amount of time, e.g., within an hour.
  • the wire breaks during the sawing process, it is of utter importance to detect the breaking as soon as possible after it has occurred and to stop the wire movement immediately. At the same time, it is desirable to detect if the wire develops a tendency to break at one or more positions along its length during the sawing process. If a break occurs, unwanted consequences may arise. The loose ends of the wire may move around in the machine in an uncontrollable manner, which might harm the wire guide system or other parts of the machine. Further, if the wire breaks and moves on, it will be torn out of the object to be sawed.
  • a wire monitoring device for a wire saw device includes at least two sensors, adapted to provide a change of a sensor output signal in dependence of the presence of a wire adjacent to a sensor, wherein the sensors are adapted to be each provided adjacent to a wire of the wire saw device.
  • a wire saw device having a wire monitoring device includes at least two sensors, adapted to provide a change of a sensor output signal in dependence of the presence of a wire adjacent to a sensor, wherein the sensors are adapted to be each provided adjacent to a wire of the wire saw device.
  • a method for monitoring a wire saw device includes providing a wire monitoring device adapted to provide a change of a sensor output signal in dependence of the presence of a wire adjacent to a sensor and supervising via the monitoring unit if there is a change in the physical condition of a wire.
  • Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method step. These method steps may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the invention are also directed at methods by which the described apparatus operates. It includes method steps for carrying out every function of the apparatus. BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 shows a schematic perspective view of a wire saw device according to an embodiment
  • FIG. 2 shows a schematic perspective top view of a wire saw device according to an embodiment.
  • FIG. 3 shows a schematic perspective front view of a monitoring device according to an embodiment.
  • FIG. 4 shows a schematic side view of a monitoring device according to the embodiment of Fig. 3.
  • FIG. 5 shows a schematic side view of a monitoring device according to another embodiment.
  • FIG. 6 shows a schematic front view of a monitoring device according to a further embodiment.
  • FIG. 7 shows a schematic front view of a monitoring device according to another embodiment.
  • FIG. 8 shows a schematic front view of a monitoring device according to yet another embodiment.
  • a control unit may be understood as a device electronically controlling substantially all functions of a wire saw device, e.g., a cropper, a squarer, or a wafer cutting wire saw.
  • the control unit is connected to sensors in order to monitor parameters of the machine operation and the sawing process. It is also connected to actuators and devices to steer the electric motors which move the wire. It also includes devices for interaction with an individual in order to receive commands and to report the status of the sawing process.
  • a control unit may also be connected in some embodiments to a computer network to be controlled directly or remotely by an individual or an automated system such as a computer.
  • the methods of operating a wire saw device can be conducted by means of computer programs, software, computer software products and the interrelated controllers, which can typically have a CPU, a memory, a user interface, and input and output means being in communication with the corresponding components of the wire saw device.
  • These components can be one or more of the components: motors, wire break detection units, wire tracking devices, and the like, which will be described in more detail below.
  • a wire management unit will be understood as a device handling the supply of wire to a cutting area or working area of a wire saw device, such as a cropper, a squarer, or a wafer cutting wire saw.
  • the wire saw includes a wire guide for transporting and guiding the wire in a wire moving direction while the wire management unit provides control of the wire tension.
  • the wire provided by the wire management unit forms a wire web in the cutting area.
  • a wire web will be considered as the web formed by a single wire management unit. It should be understood that a wire web may contain more than one working area which is defined as an area in which a sawing process is performed.
  • a wire web can have multiple areas that are formed by a wire from different wire management units.
  • a wire monitoring device for a wire saw device includes at least two sensors, which are typically inductive sensors and are typically arranged in the form of an array on a support.
  • the sensors are provided adjacent to wire portions of the wire saw device.
  • the inductive sensors generate their own inductive field and detect any variation of the field induced by the presence/absence of a wire and the density of the wire in front of the sensor. If a wire breaks and the broken wire end passes the sensor, a change of the sensor output signal occurs.
  • the sensor signals are constantly monitored by a control unit, which is typically the control unit of the wire saw device, which stops the operation of the wire saw device if a break is detected.
  • wire saw devices like croppers, squarers, or wire saws
  • the wire speed that is the speed of the wire moving through the wire saw device, the wire management unit and the material to be sawed, respectively, can be, for example, 10 m/s or higher.
  • the wire speed can be in a range , of 15 to 20 m/s.
  • higher wire speeds of 25 m/s or 30 m/s can also be desirable and could be realized under certain conditions.
  • the spool For unwinding the wire at the desired wire speed, the spool rotates with a rotation speed of up to several thousands rotations per minute. For example, 1000 to 2000 rpm can be provided for unwinding the wire.
  • the wires may have different diameters depending on the type of device.
  • the wire diameter may be from about 300 ⁇ to about 400 ⁇ , e.g., 310 ⁇ to 340 ⁇ .
  • the wire diameter may be from 60 ⁇ to 180 ⁇ , more typically from 80 ⁇ to 160 ⁇ .
  • a twisting of the wire might increase the risk of breaking of the wire or of damaging the coating, so that a twist-free operation is advantageous.
  • the throughput may be increased by a factor of 2 or even more.
  • the speed with which the material to be sawed is moved relatively to the moving wire may be referred to as the material feed rate.
  • the material feed rate in the embodiments described herein may be in the range of 2 ⁇ /s to 12 ⁇ /s, typically about 6 ⁇ /s to 10 ⁇ /s for a wafer cutting wire saw, respectively from 20 ⁇ /s to 40 ⁇ /s, typically from 28 ⁇ /s to 36 ⁇ /s for embodiments pertaining to a squarer.
  • the respective data for other types of wire saw devices regarding wire speed, material feed rates, wire diameters and the like is well known to a skilled person and is not provided in greater detail. [0031] Fig.
  • Wire saw device 100 has a wire guide device 110 including four wire guide cylinders 112, 114, 116, 118.
  • a wire management unit 130 provides a wire to the wire guide cylinders 112, 114, 116, 118.
  • the wire management unit 130 includes a supply coil 134 on which a wire reservoir, typically holding several hundred kilometers of wire, is provided. Fresh wire 230 is fed to wire guide device 110 from supply coil 134. Furthermore, wire management unit 130 includes a take-up spool 138 on which the used wire 240 is recoiled. In the embodiment shown in Fig. 1, the rotational axis of supply coil 134 and take-up spool 138 are parallel to the rotational axes of the wire guide cylinders 112, 114, 116, 118. Accordingly, no deflection pulley or similar device is required for feeding the wire to the wire guide 110. Due to the zero degree angle on the wire, the risk of wire breakage can be reduced. Typically, wire management unit 130 includes further devices such as low inertia pulleys (not shown) and tension arms (not shown) for wire tension regulation. In some embodiments, digital coders are provided on the tension arms.
  • Fig. 2 shows a schematic top view of wire saw device 100 including wire monitoring device 1 with support 30 and sensors 20.
  • the device is connected via wires 15 to control unit 25, which is typically the control unit of the wire saw device 100.
  • the wire 210 is spirally wound about the wire guide cylinders 112, 114 and forms between the two wire guide cylinders a layer 200 of parallel wires. This layer is typically referred to as a wire web 200.
  • the different parallel wire portions (forming the wire web) of the wire 210 and the wire itself will in the following be both referred to under the numeral 210.
  • wire guide cylinders 112, 114, 116, 118 are covered with a layer of synthetic resin and are scored with grooves having very precise geometry and size.
  • the distance between the grooves, or the pitch of the grooves determines the spacing Dl between two adjacent strings or lines of wire 210. This distance Dl also determines the maximum thickness of the slices cut by the wire saw device. However, for example, in the event a third media such as slurry is used, the slices may be about 10 ⁇ to 40 ⁇ thinner than the distance Dl.
  • the wire thickness is between 120 ⁇ and 140 ⁇ , while distance Dl is from 120 ⁇ to 300 ⁇ , typically in the range of 200 ⁇ to 250 ⁇ .
  • the grooves may have a pitch or distance of below 300 ⁇ . Accordingly, the thickness of the wire is of the same order as the distance Dl .
  • the pitch or distance of the groove results in spacing between adjacent wires of about from 120 ⁇ to 200, typically of 160 ⁇ or smaller.
  • embodiments described herein may provide a very large cutting area and a very high cutting rate
  • the pitch i.e., the distance between grooves
  • the distance between adjacent wires 210 can be in a range of 120 ⁇ to 300 ⁇ , for example, 200 ⁇ to 250 ⁇ or even 220 ⁇ or less
  • the resulting wafer thickness can be in a range of 100 ⁇ to 250 ⁇ , for example, 180 ⁇ to 220 ⁇ or even 200 ⁇ or below.
  • the groove pitch and the groove geometry is typically adapted to a wire thickness and wire type and is adapted to the wafer thickness.
  • a wire saw device having wire guiding cylinders with grooves is generally adapted for specific wafer thicknesses and wire diameters by the groove pitch and the groove geometry.
  • the values for the groove pitch, the wire thicknesses and/or the wafer thicknesses can be insofar predetermined by the configuration of the wire saw device.
  • each wire guide cylinder 112, 114, 116, 118 is connected to a motor 122, 124, 126, 128 (shown in broken lines in Fig. 1).
  • wire guide cylinders 112, 114, 116, 118 are directly driven by motors 122, 124, 126, 128.
  • each wire guide cylinder 1 12, 114 may be directly mounted to the motor shaft 123, 125 of the corresponding motor 122, 124.
  • one or more of the motors are water-cooled.
  • the motors 122, 124, 126, 128 drive the wire guide cylinders 112, 114, 116, 118 so that the wire guide cylinders rotate about their longitudinal axis.
  • the wire in wire web 200 is transported into a wire transport direction 215, 225.
  • the transport speed of the wire is relatively high for example as much as 20 m/s.
  • one of the motors, e.g., motor 122, serves as a master motor whereas the remaining motors 124, 126, 128 serve as slave motors.
  • two or more spools are provided for forming at least one wire web.
  • two, three or even four spools can be used to provide the wire.
  • a method of sawing thinner wafers e.g., in a range of 100 ⁇ to 170 ⁇ can be provided.
  • the thinner wafers can also be sawed at higher speed, such as having a material feed rate is in the range of 2 ⁇ /s to 12 ⁇ /s, typically about 5 ⁇ /s to 7 ⁇ /s.
  • the load on each wire can be reduced by having two or more spools and, thus, two or more wires.
  • the load is increased as compared to a dual wire web due to the increase of the wafer surface are to wire surface area.
  • the increased load can result in lower cutting speeds.
  • using two or more wires can increase the cutting speed, e.g., such that an effective cutting area or a cutting area rate of 12 m 2 /h or more can be provided.
  • thinner wires can be used, for example, wires having a thickness of 80 ⁇ to 120 ⁇ , while the cutting area is increased.
  • the wire thickness reduces during usage of the wire.
  • the wire may be thinned until breakage of the wire results.
  • the use of two wires to build a wire web, for example, a continuous wire web reduces the load on the wire and thereby allows for higher cutting speeds and, on the other hand, allows for thinner wires, which allows for smaller wire distance and thereby increased cutting area.
  • Fig. 3 shows a front view of an embodiment of a wire monitoring device 1 for a wire saw device.
  • the device includes at least two sensors 20, which are typically connected to a control unit 25, which may be the control unit of the wire saw device.
  • the sensors 20 are adapted to be provided adjacent to portions of a wire 210 of the wire saw device.
  • wire portions in front of the device are shown (as dotted lines).
  • the monitoring unit 25 is adapted to detect a change in the physical condition of a wire by analyzing the sensor signals. If a break of a wire 210 occurs and the broken end passes a sensor, the control unit detects the change of the sensor signal and typically stops the operation of the wire saw device.
  • Physical condition pertains in this respect primarily to the question if the wire is intact, i.e., not broken. Further, also a change in the structure of the wire is regarded to be a change in the physical structure, e.g., if the wire has any type of defects, small cracks, ruptures, changes in its molecular structure, or the like.
  • the sensors are typically connected via wires 15 to a control unit 25, which is typically the control unit of the wire saw device and which is adapted to be able to analyze the sensor signals, which will be further described below.
  • the sensors are typically inductive sensors, but embodiments also include optical sensors or any type of sensor suitable to be employed for the above purpose.
  • Inductive sensors are typically used, as they are relatively inexpensive and as they provide their own field. Some types of defects are not necessarily visible, in contradiction to a break of the wire or a major rupture. It is thus desirable, but not necessary, to employ a sensor type which can also detect small or invisible defects, such as an inductive sensor principally can. In this manner, also small defects or changes of the wire condition may be detected via analysis of the sensor signal.
  • capacitive sensors are used. In some embodiments, it may be required to provide an external source for the electromagnetic or other fields which are to be detected by the sensors after being modified by wire portions 210.
  • radiation as non-limiting examples: X-rays, alpha particle radiation, electron particle radiation, gamma rays, neutrons
  • a suitable sensor In this particular example, special security measures would be necessary to avoid harmful effects of the radiation on individuals.
  • ultrasonic sound is applied to the wire portions, and the reflection or absorption in the wire material is measured via the sensors.
  • the sound generating mechanism may also be integrated into the sensors.
  • optical sensors are used. These may be applied in the form of photo sensors or CCD-sensors (charged coupled devices), which may be adapted to provide an image of the wire portions to the monitoring unit.
  • the sensors are typically provided adjacent to a portion of the wire which shall be monitored or supervised.
  • the sensors are typically provided adjacent to portions of the wire which protrude parallel to each other as is depicted in Fig. 2.
  • the sensors 20 are mounted to a support 30, typically the surface of a board, solid body, or housing, which may be of plastic, metal, or any other suitable material. As metal might have an effect on the sensor characteristics of an inductive sensor, which would have to be taken into account, plastic is typically, but not necessarily chosen as a material.
  • four sensors 20 are substantially arranged in a row.
  • the physical dimensions of the sensors do not allow to arrange the sensors in a row having the same distances from each other as the parallel wire portions.
  • the distance between the wires is from 120 ⁇ to 300 ⁇ .
  • a typical inductive sensor for example, has a diameter of 4 mm to 15 mm, e.g., 8 mm.
  • several of these sensors cannot be placed in a row such that each sensor is adjacent to only one of the wires, because the distance of the wires from each other is much smaller than the diameter of one sensor.
  • each sensor is provided to monitor a plurality of adjacent wire portions 210, typically from 4 to 100 parallel wire portions, more typically from 20 to 50 wire portions.
  • each sensor is provided to supervise about 40 parallel wire portions.
  • each sensor 20 covers four wire portions 210. This relatively low number, compared to the 40 wires in the example above, is chosen to allow for better illustration.
  • the distance between the centers of the sensors in one row may be, depending amongst other factors on the sensor diameter, from 2 mm to 30 mm, more typically from 5 mm to 20 mm.
  • Fig. 4 shows a perspective side view of the embodiment of Fig. 3.
  • the sensing distance D2 between the sensors and the wire portions 210 is dependent on a plurality of factors, e.g., of the employed type of sensors, their technical specifications, the type and thickness of wire, etc.
  • D2 is typically from 0.2 mm to 5 mm, more typically from 0.5 mm to 3 mm. Yet, depending especially on the type of sensor, significantly greater values may also be suitable.
  • Fig. 5 shows a further embodiment, in which a further distance sensor 35 is provided on support 30 in order to supervise the distance D2 between the sensors 20 and the wire portions 210.
  • the signal of the distance sensor 35 is typically also monitored by the control unit 25. If the control unit is detecting a change of the distance D2, an actuator 45 mounted to a fixed part of the wire saw device and adapted to move the support 30 is activated in order to readjust the distance between the sensors 20 and the wire portions 210.
  • the distance sensor 35 is typically also an inductive sensor, and the actuator 45 may be an electrical motor, e.g., a stepper motor, which is adapted to vary the distance D2 between sensors 20 and wires 210. In this manner, an optimized sensing distance D2 of the sensors 20. may be provided and controlled.
  • the skilled person knows about the methods and suitable devices for implementing such a distance regulation mechanism.
  • the sensors 20 are provided in at least two substantially parallel rows. These rows are displaced with respect to each other, so that one sensor 20 of a first row is provided for first wire portions 210, and a second sensor of a second row is provided for wire portions 210 adjacent to the first wire portions.
  • the distance between the parallel rows, measured between the centers of the sensors, may be from 3 mm to 40 mm, more typically from 6 mm to 20 mm.
  • the displacement or offset between neighbored parallel rows may be from 2 mm to 15 mm, more typically from 3 to 8 mm.
  • connection wires 15 to connect the sensors with the control unit are typically combined to a cable harness leading to the control unit, but also other variations are possible, i.e., by using a bus-type connection using industry standard equipment.
  • one wire portion is monitored by two or more sensors, due to the overlap of the areas (indicated as D3) covered by the sensors of the different rows in a horizontal direction.
  • this is, e.g., the case for the third and fourth wire portion (dotted lines) from the left, which are both adjacent to the left-most sensors 20 in the upper row and in the lower row of sensors.
  • a defect in one of these wire portions will thus cause a change of the sensor signal in both of the sensors.
  • the control unit is enabled to locate the defect wire portion by taking into account and/or compare the changes of the signals in both sensors.
  • Fig. 7 shows a further exemplary embodiment, in which the overlap region D3 is smaller than in Fig. 6.
  • the fourth wire is both in the range of a sensor of the upper row and the lower row.
  • the connection wires 15 and the control unit 25 are not shown for reasons of clearness.
  • the signals of the sensors 20 are lead via the connecting wires 15 to a control unit.
  • this is typically the control unit of the wire saw device, but may also be a separate device.
  • the control unit is adapted to monitor and analyze the signals of the plurality of sensors during operation of the wire saw device. Suitable algorithms for this purpose and how to implement them are well known to a skilled person. If a wire breaks and thus causes a change in the signal of one or more of the sensors, the control unit detects the change and triggers a reaction.
  • the control unit immediately stops the operation of the wire saw device in case of a detected wire defect in order to prevent undesirable consequences which may result from a further operation with a wire defect, which were described above.
  • the control unit may additionally signal an alarm in case of a detected change of a sensor signal during the monitoring process.
  • the alarm signal is typically signaled acoustically, e.g., by means of a beeper, a horn, or a loudspeaker, and may also be signaled optically by means of a light emitting device.
  • the unit may also send a signal to an external device via a computer network or the like.
  • wire saw devices selected from the group consisting of a wire saw, a multiple wire saw, a squarer, and a cropper.
  • the control unit may be adapted in an embodiment to display on a display device the location of the break.
  • the display device may be a control screen of the wire saw device, but also any other screen or display, e.g., on a remote computer. Also arrangements of light emitting diodes or the like are possible as display devices.
  • the location of the break as calculated by the control unit from the sensor data, is displayed graphically via a graphical representation of the wire web including the plurality of wire portions. As the location of the break is, in many cases, not exactly identified, but limited to a certain number of wire portions which may be affected; in an embodiment, the respective number of wire portions are highlighted or marked on the screen.
  • the described method employing sensors is combined with another break detection method.
  • This other method may include applying a voltage to a first part of the wire and monitoring via a sensor connected to a control unit whether this voltage is present at another part of the wire. If the wire is broken somewhere between the first part and the second part, the voltage will not be measurable at the second part and the control unit may stop the operation of the wire saw device. It may also, or alternatively be monitored if the voltage applied to the wire is present at a part of the machine other than the wire. In this case, it may be assumed that the wire is broken and is in contact with a part of the machine, and the control unit will also stop the operation.
  • control unit is switchable to a teach-in mode, either manually via a switch, or automatically via the control unit of the wire saw device or remotely via a computer network.
  • the control unit detects the sensor signals and if, for example, due to a specifically prepared sawing operation with a smaller wire web, i.e. having a smaller number of parallel wire portions, at one or more of the sensors no wire is present, the control unit automatically adjusts its operation such that sensors without a wire present are internally marked to be in extra state, meaning that there is no wire present adjacent to the respective sensor.
  • the control unit stores the information about the presence of a wire adjacent to each of the sensors until it is switched off, reset, or until the teach-in mode is activated again.
  • the control unit has a reset switch or function which, when activated, puts the unit into a predefined state.
  • the electronic control unit constantly analyzes the signals of each of the plurality of sensors. Ways to implement such a control unit for the intended purpose are well known to a skilled person.
  • the wire is moving with considerable speed adjacent to the sensors.
  • the sensors are inductive sensors
  • an electrical field induced in the wire portion adjacent to the sensor is modified by the metallic material of the wire.
  • this modification of the electric field is constant over time, and hence the output signal of the sensor is also constant.
  • the modification of the electrical field changes.
  • the amount of the change is dependent on the size of the defect, i.e., the larger the defect, the larger the change of the sensor signal is.
  • the biggest change of the sensor signal results from the fact that the wire is suddenly not present any more, i.e. if the wire has just broken and the loose end has passed a sensor.
  • the control unit can detect a change of a sensor signal and can thus analyze that the respective wire portion which just passes the respective sensor must exhibit some kind of defect.
  • this defect is in most cases a complete break of the wire, leaving two loose ends.
  • typically one sensor is supervising a plurality of wire portions, as is depicted, e.g., in Figs.
  • a defect or break of one of the wire portions 210 leads to a modification of the signal of the sensor.
  • a defect of any one of the plurality of wire portions adjacent to one sensor e.g., four wire portions for each sensor in Fig. 3 will lead to a change in the signal of the respective sensor, the control unit cannot detect which of the wire portions has caused the change of the signal, and thus it is not possible to exactly identify the defect wire.
  • this is typically not a problem, as the exact location of a defect may also be investigated optically by an individual after a subsequent stop of the machine.
  • control unit is designed to be able to distinguish between different grades of defects. This means a slight change of a sensor signal, which is not caused by a break, but a minor damage of the wire, e.g., a small crack, is analyzed by the control unit and identified as such. It may then be signaled to the control unit as an anomaly.
  • the control unit of the device is, in this embodiment, adapted to decide if the change of the sensor signal is severe enough to halt the operation, or if it suffices to just signal an alarm to an individual controlling the operation or to perform similar actions.
  • the ability of the system to detect small defects in the wire is strongly dependent from the type of the supervised machine, the wire employed and particularly the type of sensor.
  • a wire monitoring device for a wire saw device includes at least two sensors, adapted to provide a change of a sensor output signal in dependence of the presence of a wire adjacent to a sensor, wherein the T IB2009/007813 sensors are adapted to be each provided adjacent to a wire of the wire saw device.
  • the sensors can be selected from the group consisting of: inductive sensors and capacitive sensors.
  • the sensors are provided in a manner such that each sensor is adjacent to a plurality of different portions of the wire, whereby the portions protrude substantially parallel to each other.
  • the sensors can be mounted to a support in one row or in at least two rows.
  • the distance between the centre of neighbored sensors in a row can be from 2 mm to 30 mm; the rows can be substantially parallel; and/or the parallel rows can be displaced with respect to each other and the distance between the rows can be from 3 mm to 40 mm.
  • the wire monitoring device can further include: a distance sensor provided on support, and an actuator mounted to a fixed part of the wire saw device and adapted to change a distance between sensors and wire; and/or a control unit (25), which is adapted to perform a teach-in modus, comprising a check to examine if a wire is present adjacent to each sensor.
  • the control unit can be adapted to store inforaiation about the presence of a wire adjacent to each sensor and /or to signal an alarm in case of a detected change of a sensor signal during monitoring.
  • a wire saw device having a wire monitoring device having a wire monitoring device according to any of the embodiments described herein.
  • the wire saw device can be an element selected from the group consisting of: a wire saw, a multiple wire saw, a squarer, and a cropper.
  • a distance between a sensor and a wire portion can be from 0.2 mm to 5 mm; and/or the sensors can be connected to the control unit of the wire saw device.
  • a method for monitoring a wire saw device includes monitoring a change of a sensor output signal in dependence of the presence of a wire adjacent or the structure of the wire; and supervising via the monitoring unit if there is a change in the physical condition of a wire.
  • this can include: supervising a change in the physical condition comprises a change of the density of the wire adjacent to a sensor, e.g., wherein supervising comprises analyzing a sensor signal.
  • the method can be combined with another break detection method, wherein a voltage is applied to a first part of the wire and it is monitored whether the voltage is present at another part of the wire, and/or it is monitored whether the voltage is present at a part of the wire saw device other than the wire.
  • Typical further alternative or additional implementations can further include performing a teach-in, wherein the control unit checks for each connected sensor whether a wire is present adjacent to the sensor.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal, un appareil de sciage au fil hélicoïdal et un procédé de contrôle d'un appareil de sciage au fil hélicoïdal. Le dispositif de contrôle du fil comporte au moins deux capteurs conçus pour fournir une variation d'un signal de sortie de capteur en fonction de la présence d'un fil en position adjacente à un capteur, les capteurs étant conçus pour être chacun placés en position adjacente au fil de l'appareil de sciage au fil hélicoïdal.
PCT/IB2009/007813 2009-12-11 2009-12-11 Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation Ceased WO2011070386A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/IB2009/007813 WO2011070386A1 (fr) 2009-12-11 2009-12-11 Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation
TW099143301A TW201134629A (en) 2009-12-11 2010-12-10 Monitoring device for the wire of a wire saw device and method for operating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2009/007813 WO2011070386A1 (fr) 2009-12-11 2009-12-11 Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation

Publications (1)

Publication Number Publication Date
WO2011070386A1 true WO2011070386A1 (fr) 2011-06-16

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TW (1) TW201134629A (fr)
WO (1) WO2011070386A1 (fr)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056449A (zh) * 2011-10-20 2013-04-24 应用材料瑞士有限责任公司 用于测量线锯中的线网弯曲的方法和装置
EP2586582A1 (fr) * 2011-10-28 2013-05-01 Applied Materials Switzerland Sàrl Système de commande de scie à fil et scie à fil
JP2013166241A (ja) * 2012-02-15 2013-08-29 Applied Materials Switzerland Sarl ダイヤモンドワイヤソーデバイスおよび方法
EP2708342A1 (fr) * 2012-09-14 2014-03-19 Applied Materials Switzerland Sàrl Système de surveillance de cintrage de fils pour une scie à fil
EP2777903A1 (fr) * 2013-03-15 2014-09-17 Applied Materials Switzerland Sàrl Système d'alimentation de lingot
CN104085720A (zh) * 2014-06-24 2014-10-08 吴中区甪直渡岘工艺品厂 分条机刀组
WO2014167392A1 (fr) * 2013-04-09 2014-10-16 Meyer Burger Ag Dispositif de contrôle et procédé de contrôle de lame à fil et scie à fil
EP2933049A1 (fr) * 2014-04-17 2015-10-21 Applied Materials Switzerland Sàrl Dispositif de surveillance de guide de fil et procédé de surveillance d'un guide de fil
FR3026035A1 (fr) * 2014-09-23 2016-03-25 Commissariat Energie Atomique Dispositif de decoupe par fil comportant un systeme de detection et de mesure d'une fleche du fil
EP3015237A1 (fr) * 2014-10-29 2016-05-04 Applied Materials Switzerland Sàrl Système de surveillance de fil
CN106891451A (zh) * 2017-02-22 2017-06-27 平凉中电科新能源技术有限公司 一种金刚线多线切割机断线检测方法
WO2018055273A1 (fr) 2016-09-26 2018-03-29 Thermocompact Procede de decoupe de tranches dans un lingot en materiau dur et fil abrasif
CN108407116A (zh) * 2018-03-30 2018-08-17 青岛高测科技股份有限公司 并线检测装置、方法及包括该并线检测装置的金刚线切片机
JP2019198947A (ja) * 2018-05-18 2019-11-21 株式会社小松製作所 ワイヤソーの運転パラメータの設定方法及びワイヤソー
CN116373141A (zh) * 2023-03-09 2023-07-04 江苏晶品新能源股份有限公司 一种光伏发电硅片自动化切片装置
US20250025974A1 (en) * 2022-08-31 2025-01-23 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Monitoring mechanism, application thereof, and slicing machine with the monitoring mechanism

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EP1166984A1 (fr) * 2000-06-23 2002-01-02 Shingo Ogyu Procédé et appareil pour des opérations de scie à fil et dispositif de traçage de contours à utiliser dans ces opérations

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EP0745447A1 (fr) * 1995-05-31 1996-12-04 Shin-Etsu Handotai Co., Ltd Appareil de sciage par fil
EP0745464A2 (fr) * 1995-06-01 1996-12-04 Shin-Etsu Handotai Co., Ltd Scie à fil et procédé de découpage utilisant celle-ci
EP1110652A1 (fr) * 1998-08-20 2001-06-27 Super Silicon Crystal Research Institute Corp. Scie à fil à contrôle de la tension du fil de sciage
EP1166984A1 (fr) * 2000-06-23 2002-01-02 Shingo Ogyu Procédé et appareil pour des opérations de scie à fil et dispositif de traçage de contours à utiliser dans ces opérations

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056449A (zh) * 2011-10-20 2013-04-24 应用材料瑞士有限责任公司 用于测量线锯中的线网弯曲的方法和装置
EP2583778A1 (fr) * 2011-10-20 2013-04-24 Applied Materials Switzerland Sàrl Procédé et appareil pour mesurer le cintrage de la grille de fils d'une scie à fil
EP2586582A1 (fr) * 2011-10-28 2013-05-01 Applied Materials Switzerland Sàrl Système de commande de scie à fil et scie à fil
CN103085185A (zh) * 2011-10-28 2013-05-08 应用材料瑞士有限责任公司 线锯控制系统和线锯
JP2013166241A (ja) * 2012-02-15 2013-08-29 Applied Materials Switzerland Sarl ダイヤモンドワイヤソーデバイスおよび方法
EP2708342A1 (fr) * 2012-09-14 2014-03-19 Applied Materials Switzerland Sàrl Système de surveillance de cintrage de fils pour une scie à fil
CN103676770A (zh) * 2012-09-14 2014-03-26 应用材料瑞士有限责任公司 专用于线锯的线弯曲监控系统
JP2014060397A (ja) * 2012-09-14 2014-04-03 Applied Materials Switzerland Sa ワイヤソー専用のワイヤ湾曲監視システム
EP2777903A1 (fr) * 2013-03-15 2014-09-17 Applied Materials Switzerland Sàrl Système d'alimentation de lingot
CN105050759A (zh) * 2013-04-09 2015-11-11 梅耶博格公司 用于线网监测的监测装置和方法及和线锯
WO2014167392A1 (fr) * 2013-04-09 2014-10-16 Meyer Burger Ag Dispositif de contrôle et procédé de contrôle de lame à fil et scie à fil
EP2933049A1 (fr) * 2014-04-17 2015-10-21 Applied Materials Switzerland Sàrl Dispositif de surveillance de guide de fil et procédé de surveillance d'un guide de fil
CN104085720A (zh) * 2014-06-24 2014-10-08 吴中区甪直渡岘工艺品厂 分条机刀组
FR3026035A1 (fr) * 2014-09-23 2016-03-25 Commissariat Energie Atomique Dispositif de decoupe par fil comportant un systeme de detection et de mesure d'une fleche du fil
WO2016046107A1 (fr) * 2014-09-23 2016-03-31 Commissariat à l'énergie atomique et aux énergies alternatives Dispositif de decoupe par fil comportant un systeme de detection et de mesure d'une fleche du fil et procédé de mise en oeuvre d'un tel dispositif
EP3015237A1 (fr) * 2014-10-29 2016-05-04 Applied Materials Switzerland Sàrl Système de surveillance de fil
FR3056428A1 (fr) * 2016-09-26 2018-03-30 Thermocompact Procede de decoupe de tranches dans un lingot en materiau dur
WO2018055273A1 (fr) 2016-09-26 2018-03-29 Thermocompact Procede de decoupe de tranches dans un lingot en materiau dur et fil abrasif
CN106891451A (zh) * 2017-02-22 2017-06-27 平凉中电科新能源技术有限公司 一种金刚线多线切割机断线检测方法
CN108407116A (zh) * 2018-03-30 2018-08-17 青岛高测科技股份有限公司 并线检测装置、方法及包括该并线检测装置的金刚线切片机
JP2019198947A (ja) * 2018-05-18 2019-11-21 株式会社小松製作所 ワイヤソーの運転パラメータの設定方法及びワイヤソー
JP7267684B2 (ja) 2018-05-18 2023-05-02 株式会社小松製作所 ワイヤソーの運転パラメータの設定方法及びワイヤソー
US20250025974A1 (en) * 2022-08-31 2025-01-23 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Monitoring mechanism, application thereof, and slicing machine with the monitoring mechanism
US12521832B2 (en) * 2022-08-31 2026-01-13 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Monitoring mechanism, application thereof, and slicing machine with the monitoring mechanism
CN116373141A (zh) * 2023-03-09 2023-07-04 江苏晶品新能源股份有限公司 一种光伏发电硅片自动化切片装置

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