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WO2011069842A1 - Module lumineux et chaîne lumineuse - Google Patents

Module lumineux et chaîne lumineuse Download PDF

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Publication number
WO2011069842A1
WO2011069842A1 PCT/EP2010/068304 EP2010068304W WO2011069842A1 WO 2011069842 A1 WO2011069842 A1 WO 2011069842A1 EP 2010068304 W EP2010068304 W EP 2010068304W WO 2011069842 A1 WO2011069842 A1 WO 2011069842A1
Authority
WO
WIPO (PCT)
Prior art keywords
potting compound
substrate
light
module
lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2010/068304
Other languages
German (de)
English (en)
Inventor
Steffen Strauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of WO2011069842A1 publication Critical patent/WO2011069842A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light emitting module comprising a sub strate ⁇ , which is on its front side, equipped with at least one light ⁇ source, in particular light emitting diode.
  • the invention further relates to a light-chain together with a plurality of quantitative ⁇ off luminous modules.
  • a light module comprising a substrate which is equipped on its front side with at least one light source, in particular light emitting diode, wherein the substrate is at least partially covered laterally and at the front by a first potting compound, and wherein a respective light exit surface of at least one light source ⁇ and at least partly a rear surface of the sub strats are free of the first potting compound. Due to the presence of the first potting compound, which acts as a protective sheath, the luminescent module can be protected from mechanical damage from the side and from the front.
  • the first potting compound may in particular be selected for mechanical stress and does not need to be translucent.
  • the protective jacket can also protect against moisture and / or chemical stress.
  • the so equipped lighting module is correspondingly robust.
  • the at least one light source may in particular comprise at least one light-emitting diode.
  • LEDs have a low profile and are mechanically relatively unempfind ⁇ Lich.
  • the light-emitting module is particularly preferred for luminescent ⁇ the with a power of more than 0.5 watts, since the heat loss, if not dissipated, the lifetime and reliability of the light-emitting diodes sensitive shortened.
  • the substrate may be equipped with electronic components on the front side, in addition to the at least one light source, as well as with at least one circuit, e.g. a driver module, capacitors, resistors, etc. Depending on the design, these electronic components may be covered by the first potting compound or may be free of it.
  • At least one electrical line eg connection cable
  • the substrate can be covered in particular by the first potting compound for a secure connection.
  • the first potting compound can best ⁇ hen, also known as hot-melt adhesives, hot adhesives or hot glue ⁇ known from hotmelt particular.
  • the first potting compound may be provided with colored fillers in order to be able to adjust the color of the light module.
  • the achromatic potting colors white, gray and black are preferred. But there are also colorful colors possible.
  • the substrate is substantially completely covered on the side and on the front side by a first potting compound, and the back side of the substrate is substantially free of the first potting compound. Characterized the sides and to the front or toward the front ge ⁇ taught protection of the luminous module is combined with a good thermal connection system optimized for magnifying the back. It is a particular embodiment that the back of the substrate is flush with the first potting compound or protrudes rearwardly over the first potting compound. Thus, a simple and thermally effective surface mounting of the light module is made possible at the back of the substrate, for example on a heat sink.
  • the substrate has at least one laterally protruding projection, which is surrounded by the first potting compound.
  • the substrate has at least one laterally introduced recess and / or at least one passage from the front to the rear ⁇ side, which are at least partially filled before the first potting compound. Even so, a form-fitting Connection of the first potting compound to the substrate can be achieved.
  • the substrate is designed as a circuit board, in particular as a metal core board or a ceramic board.
  • a circuit board in particular as a metal core board or a ceramic board.
  • the metal core board has a non-rusting metal on ⁇ , especially aluminum.
  • a wall thickness of the ers ⁇ th potting compound is at least 1 mm. This wall thickness si ⁇ chert high impact and abrasion resistance. It is further an embodiment that the respective light exit surface of the at least one light source is surmounted by the first potting compound surrounding it. Thus, the at least one light source is also largely protected from mechanical loading , in particular abrasion.
  • the respective light exit surface which is covering at least a light source of egg ⁇ ner light-transmissive second potting compound.
  • the at least one light source is also largely protected directly from mechanical stress, in particular abrasion.
  • the translucent second potting compound may be transparent or translucent (opaque).
  • the lichttschläs ⁇ sige second potting compound for example, from a low-pressure injection molding material, eg silicone or hotmelt exist.
  • the first molding compound and the second Ver ⁇ casting compound also be identical, and so the light module to be able to at least a part of the back of the substrate to be surrounded by a uniform, translucent potting compound or shed it.
  • the non-cast surface of the rear side of the substrate can then be connected to a heat sink, for example, or be.
  • the heat sink may be at least partially surrounded with.
  • the first potting compound is bevelled to the respective light exit surface. This allows a wide light beam angle can be maintained.
  • the back of the sub ⁇ strats and / or the lighting module is at least partially coated with egg nem protective lacquer, for example to protect against corrosion, or a slight mechanical stress.
  • the lighting module in particular ⁇ sondere the substrate, at least one bore for receiving a screw has to the light module threadedly buildin ⁇ term to.
  • the back of the light module at least partially has at least one adhesive element, for example, a double-sided adhesive tape.
  • the backside of the substrate comprising a cooling body structure, including at least one cooling fin, the cooling pin and / or blade. Since ⁇ by a cooling body is integrated in other words, in the substrate.
  • the heat sink may be cast at least partially, in particular at the edge, together with the substrate.
  • the cooling structure (s) of the heat sink (ribs, fins, pins) te, etc.) can protrude ⁇ in particular about the potting ago.
  • a luminous chain aufwei ⁇ send a plurality of lighting modules according to one of the preceding claims, wherein adjacent lighting modules are connected to each other by means of at least one electrical connection line, wherein sealed at the adjacent light emitting ends of the electrical connection line by means of the respective first potting compound are.
  • An intermediate section between the potted ends may in particular be free of the first potting compound or may not be potted.
  • the encapsulation of the ends of the at least one electrical connecting line protects against damage to the contact between the at least one electrical connecting line and the substrate and also fixes the two elements against each other.
  • the at least one electrical ⁇ specific connection line is flexible.
  • the light module and / or the light chain may e.g. produced with the following steps:
  • the at least one electrical line eg cable connection; for a light chain in particular for connecting individual lighting modules to the light chain;
  • Ele ⁇ elements may be provided with the same reference numerals for clarity.
  • Fig.l shows a sectional view in side view of a potted LED module according to a first Ausry ⁇ tion example
  • FIG. 2 shows a section of a potted LED module according to a second embodiment
  • Fig.l shows a sectional view in side view of an LED module 1 according to a first embodiment.
  • the LED module has a substrate in the form of a metal core board 2, on the front side of which 3 light sources in the form of light-emitting diodes 4 are mounted.
  • the side or side wall 5 and the Vordersei ⁇ te 3 of the metal core board 2 are covered with a first Verguss ⁇ mass 6 or shed, wherein both upper-side light exit surfaces 7 of the LEDs 4 and a rear side 8 of the metal core board 2 is not shed or from the first potting compound 6 are covered.
  • the page 5 shows a NEN projection in the form of a circumferential chamfer 9 or a circumferential recess in the form of a corresponding recess 10.
  • the LED module 1 shown is protected by the first potting compound 6 laterally and from the front especially against mechanical, but also chemical stress.
  • the back 8 of the metal core board 2 is not protected, the rear ⁇ side 8 is typically used for attachment of the LED module 1 and is thus exposed to only low mechanical loads.
  • the surface of the first potting compound 6 at the front side of the LED module 1 falls obliquely down to the light exit surfaces 7 in the shape of a truncated cone or truncated pyramid.
  • the maximum height of the first potting compound 6 is thus higher on the front side 3 of the metal core board 2 than the height of the light emitting diodes 4, whereby the light emitting diodes 4 are protected, in particular, against a laterally directed or extensively applied mechanical stress.
  • the metal core board 2 allows a particularly good heat spreading.
  • the LED module 1 can be attached to a heat sink for a particularly effective dissipation of heat loss with its back 8, for example on a heat sink or a metallic support.
  • FIG. 2 shows a sectional side view of a section of a potted LED module 11 according to a second embodiment.
  • the metal core board 12 has a vertical passage 13 from the front side 3 to the rear side 8, which is widened in the region of the rear side and the is filled with the first potting compound 6. Also as can be achieved fes ⁇ te, form-fitting connection of the first sealing compound 6 to the metal core board 2 or amplified.
  • FIG. 3 shows a sectional side view of a potted LED module 21 according to a thirdmittedsbei ⁇ game.
  • the metal-core circuit board 22 is now back via the first potting compound 6 forth ⁇ from.
  • the metal core plate 22 is configured as an integrated heat sink structure with a plurality of cooling pins 24. This improves a réelleablei ⁇ tion.
  • the rear side 8 of the metal core board 2, which is formed in particular by the ends of the cooling pins 24, can furthermore be used for fastening the LED module 21.
  • the light exit surfaces 7 of the light-emitting diodes 4 are now covered by a light-transmitting (transparent or translucent) second potting compound 35, which results in direct protection of the light exit surfaces 7.
  • FIG. 4 shows a sectional side view of a section of a luminous chain in the form of an LED chain 31 with, by way of example, two LED modules 1 according to the first exemplary embodiment.
  • the electrical kauslei ⁇ lines 32 between the adjacent LED modules 1 are located.
  • the ends 33 of the connection line 32 contact the respective metal core board 2 and are cast in the first potting compound 6, whereby they are mechanically securely fastened to the LED module 1.
  • a middle section 34 between the LED modules 1 is free of the first potting compound and thereby flexible, whereby the LED modules 1 of the LED chain 31 are flexibly positionable.
  • the first potting compound can stand ⁇ using the controller board.
  • the back of the board can then for example on an upstanding base of a heat sink or support are ⁇ be strengthened, or a heat sink can be attached plunging into the recess of the first molding compound on the board.
  • a metal core board instead of a metal core board, in particular another good heat-conducting substrate can be used, for example a ceramic substrate.
  • the type of board is not limited and may, for example, also include other board types, eg of the type FR4.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention concerne un module lumineux qui présente un substrat (2) équipé sur sa face avant (3) d'au moins une source lumineuse (4), en particulier d'une diode électroluminescente. Le substrat (2) est recouvert au moins partiellement sur le côté (5) et sur la face avant (3) d'une première matière d'enrobage (6) tandis qu'une surface de sortie de lumière respective (7) de la ou des sources lumineuses (4) et également au moins en partie une face arrière (8) du substrat (2) ne sont pas recouvertes de la première matière d'enrobage (6). La chaîne lumineuse (31) présente plusieurs modules lumineux (1). Des modules lumineux adjacents (1) sont reliés entre eux au moyen d'au moins une ligne de connexion électrique (32). Des extrémités (33) de la ligne de connexion électrique (32) fixées aux modules lumineux adjacents (1) sont enrobées au moyen de la première matière d'enrobage respective (6).
PCT/EP2010/068304 2009-12-10 2010-11-26 Module lumineux et chaîne lumineuse Ceased WO2011069842A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009054474A DE102009054474A1 (de) 2009-12-10 2009-12-10 Leuchtmodul und Leuchtkette
DE102009054474.7 2009-12-10

Publications (1)

Publication Number Publication Date
WO2011069842A1 true WO2011069842A1 (fr) 2011-06-16

Family

ID=43447369

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/068304 Ceased WO2011069842A1 (fr) 2009-12-10 2010-11-26 Module lumineux et chaîne lumineuse

Country Status (2)

Country Link
DE (1) DE102009054474A1 (fr)
WO (1) WO2011069842A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104964179A (zh) * 2015-02-13 2015-10-07 立达信绿色照明股份有限公司 日光灯
US10018343B2 (en) 2012-06-26 2018-07-10 Num Lighting Ltd. Modular light system

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LT3361150T (lt) 2013-11-15 2019-08-26 Josef Barthelme GmbH & Co. KG Horizontaliai arba vertikalai lanksčios šviesos diodų juostelės su homogeniška šviesos galia ir gamybos būdas
DE102013019039B3 (de) * 2013-11-15 2015-01-15 Josef Barthelme GmbH & Co. KG Horizontal oder vertikal biegeelastisches Leuchtdiodenband mit homogenem Lichtaustritt bis 180° und Verfahren zu dessen Herstellung
DE102013019037B3 (de) * 2013-11-15 2015-01-15 Josef Barthelme GmbH & Co. KG Vertikal biegeelastisches Leuchtdiodenband mit homogenen Lichtaustritt über 180° und Verfahren zu dessen Herstellung
AT14221U1 (de) * 2014-05-19 2015-06-15 Tridonic Gmbh & Co Kg Leuchtmittel mit LED und Verfahren zur Montage

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20214392U1 (de) * 2002-01-25 2002-11-21 Lin, Hsi-Huang, Taipeh/T'ai-pei Lichterkette
WO2004023033A1 (fr) * 2002-09-06 2004-03-18 Koninklijke Philips Electronics N.V. Ensemble de diodes electroluminescentes
WO2005083804A1 (fr) * 2004-01-29 2005-09-09 Acol Technologies S.A. Diode electroluminescente comportant des moyens integraux de dissipation de chaleur
EP1898473A1 (fr) * 2005-05-31 2008-03-12 Jen-Shyan Chen Structure de conditionnement d'un composant electroluminescent a semiconducteur
WO2008039010A1 (fr) * 2006-09-29 2008-04-03 Seoul Semiconductor Co., Ltd. Boîtier de del
US20080246045A1 (en) * 2007-04-06 2008-10-09 Kingbright Electronic Co., Ltd. Light-emitting diode packaging structure
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
US20100230693A1 (en) * 2009-03-10 2010-09-16 Nepes Led, Inc. White light emitting diode package and method of making the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10117889A1 (de) * 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20214392U1 (de) * 2002-01-25 2002-11-21 Lin, Hsi-Huang, Taipeh/T'ai-pei Lichterkette
WO2004023033A1 (fr) * 2002-09-06 2004-03-18 Koninklijke Philips Electronics N.V. Ensemble de diodes electroluminescentes
WO2005083804A1 (fr) * 2004-01-29 2005-09-09 Acol Technologies S.A. Diode electroluminescente comportant des moyens integraux de dissipation de chaleur
EP1898473A1 (fr) * 2005-05-31 2008-03-12 Jen-Shyan Chen Structure de conditionnement d'un composant electroluminescent a semiconducteur
WO2008039010A1 (fr) * 2006-09-29 2008-04-03 Seoul Semiconductor Co., Ltd. Boîtier de del
US20080246045A1 (en) * 2007-04-06 2008-10-09 Kingbright Electronic Co., Ltd. Light-emitting diode packaging structure
US20090091934A1 (en) * 2007-10-05 2009-04-09 Cosmo Electronics Corporation High power LED module
US20100230693A1 (en) * 2009-03-10 2010-09-16 Nepes Led, Inc. White light emitting diode package and method of making the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10018343B2 (en) 2012-06-26 2018-07-10 Num Lighting Ltd. Modular light system
CN104964179A (zh) * 2015-02-13 2015-10-07 立达信绿色照明股份有限公司 日光灯

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