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WO2011069321A1 - Dispositif dissipateur de chaleur pour rétro-éclairage latéral à del - Google Patents

Dispositif dissipateur de chaleur pour rétro-éclairage latéral à del Download PDF

Info

Publication number
WO2011069321A1
WO2011069321A1 PCT/CN2010/000771 CN2010000771W WO2011069321A1 WO 2011069321 A1 WO2011069321 A1 WO 2011069321A1 CN 2010000771 W CN2010000771 W CN 2010000771W WO 2011069321 A1 WO2011069321 A1 WO 2011069321A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
dissipating
led
plate
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2010/000771
Other languages
English (en)
Chinese (zh)
Inventor
梁静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANGDONG AEOPTO TECHNOLOGIES Co Ltd
Original Assignee
GUANGDONG AEOPTO TECHNOLOGIES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GUANGDONG AEOPTO TECHNOLOGIES Co Ltd filed Critical GUANGDONG AEOPTO TECHNOLOGIES Co Ltd
Publication of WO2011069321A1 publication Critical patent/WO2011069321A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the utility model relates to an LED backlight heat dissipation device, in particular to a side backlight heat dissipation device.
  • the traditional LCD-side backlight produces less heat because it uses a CCFL cold cathode fluorescent tube as its light source. Therefore, this LCD side backlight structure basically does not require an additional heat dissipation design. As a result, the traditional backplane has no heat dissipation and does not require additional design components specifically designed for heat dissipation.
  • the utility model provides an LED side backlight heat dissipation device with good heat dissipation effect.
  • the present invention provides an LED side backlight heat dissipation device, comprising a back plate formed by a bottom wall and a side wall extending perpendicularly from an edge of the bottom wall, and a heat dissipation extruded plate mounted on the bottom wall of the back plate
  • the heat dissipation extrusion plate has a base portion and a side portion extending perpendicularly from the base portion; a circuit board fixed on a side of the heat dissipation extrusion sheet on a side of the heat dissipation extrusion sheet near a surface of the base portion; A plurality of LED light sources mounted on the circuit board.
  • the heat sinking The base of the form has a plurality of fins integrally formed with the heat dissipating plate on one side, such as the heat sink and the base of the heat dissipating plate are cast together; or the heat sink and the heat sink The base of the form is combined and molded, such as the heat sink being welded to the base of the heat sinking plate.
  • the heat dissipation extrusion plate is an aluminum heat dissipation extrusion plate.
  • the insulating thermally conductive sheet is a thermally conductive silicone.
  • the utility model has the advantages that: the heat generated by the LED light source is quickly transmitted to the base portion with the plurality of heat sinks through the side portions of the insulating heat conductive sheet and the heat dissipating extruded sheet, because the heat dissipating plate base has a plurality of raised heat sinks at the base portion
  • the heat dissipation area of the base of the heat dissipation extrusion plate is greatly increased, and the heat generated by the LED light source is no longer needed to be transmitted to the back plate, and can be effectively and timely discharged.
  • the heat generated by the LED light source can be discharged in time and effectively, on the other hand, It will affect the temperature of the entire backplane, so that the optical components mounted on the backplane are less affected by the heat, which can greatly reduce the deformation and bending of the optical components caused by the thermal expansion and thermal stress of the backplane. Therefore, the utility model not only solves the waste heat problem generated by the LED, but also ensures the working life of the LED; and the service life of other devices on the side backlight such as the side backlight module is prolonged.
  • FIG. 1 is a fragmentary view of a circuit board, an insulating thermally conductive sheet, and a heat dissipating extruded sheet of the embodiment of the LED side backlight heat sink of the present invention.
  • 2 is a combination diagram of the LED side backlight heat sink shown in FIG. 1.
  • FIG. 3 is a schematic structural view of Embodiment 1 of the LED side backlight heat dissipation device of the present invention.
  • Figure 4 is an enlarged schematic view of B in Figure 3.
  • FIG. 5 is a schematic structural view showing the shape of a heat sink of a heat dissipation extruded plate of an LED side backlight heat sink according to the present invention.
  • Figure 6 is a cross-sectional view of Figure 4A-A.
  • Fig. 7 is a structural schematic view showing the shape of the heat sink of the heat-dissipating extruded plate of the LED side backlight heat sink of the present invention.
  • Fig. 8 is a structural schematic view showing the shape of the heat sink of the heat-dissipating plate of the LED side backlight heat sink of the present invention.
  • FIG. 9 is a schematic structural view showing the shape of the heat sink of the LED side backlight heat dissipation device of the present invention.
  • FIG. 10 is a partial diagram of a circuit board, an insulating and heat conducting sheet, and a heat dissipating slab of the second embodiment of the LED side backlight heat sink according to the present invention.
  • FIG. 11 is a schematic front view showing the second embodiment of the LED side backlight heat dissipation device of the present invention.
  • FIG. 12 is a schematic diagram showing the reverse structure of the second embodiment of the LED side backlight heat dissipation device of the present invention. detailed description
  • the LED side backlight heat sink 100 provided by the present invention includes a back plate 10 of a suitable shape such as a rectangle.
  • the back sheet 10 is preferably made of a metal material having a high strength and light weight such as aluminum, or Made of low cost plastic.
  • the LED side backlight heat sink 100 further includes a heat dissipation extrusion plate 20 mounted on a sidewall of the back plate 10, and the heat dissipation extrusion plate 20 is inserted into the back plate 10 through a hole in the middle of the metal back plate 10,
  • the heat sinking squeegee 20 is preferably made of a metal material such as aluminum which has good heat dissipation properties.
  • the heat dissipation extrusion plate 20 is composed of a base portion 22 having a plurality of fins 23 integrally formed with the heat dissipation extrusion plate and a side portion 24 extending perpendicularly from the base portion 22.
  • the heat dissipation fins 23 can also be extruded by heat welding or the like.
  • the stencil 20 is formed in combination, and the fins 23 are shaped as shown in one of the following figures 5, 7 and 8.
  • the LED side backlight heat sink 100 further includes a circuit board such as an aluminum substrate circuit board 40 having a good heat dissipation effect.
  • a circuit board such as an aluminum substrate circuit board 40 having a good heat dissipation effect.
  • the aluminum substrate circuit board 40 is attached to a side portion 24 of the heat dissipation extrusion sheet 20 on one side of the base portion 22 via an insulating thermally conductive sheet 30.
  • the circuit board can also be a FR4 fiber circuit board
  • the LED side backlight heat sink 100 further includes a plurality of LED light sources 50 electrically mounted on the aluminum substrate circuit board 40 for cooperation with the aluminum substrate circuit board 40 and in the case of power supply Under the light.
  • the heat radiating strip base 22 Since the heat emitted by the LED light source 50 is quickly transmitted to the heat sinking strip base 22 through the insulating heat conductive sheet 30 and the side portion 24 of the heat sinking strip, the heat radiating strip base 22 has a plurality of heat sinking sheets 20 The formed fins 23 are formed, so that the heat dissipating area of the base portion 22 of the heat dissipating plate 20 is greatly increased, so that the heat is efficiently transferred, thereby solving the waste heat problem generated by the LED 40 and ensuring the working life of the LED 40.
  • the waste heat generated by the LED 40 is quickly transmitted to the base portion 24 of the heat dissipation extrusion plate 20 through the insulating heat conductive sheet 30 and the side portion 24 of the heat dissipation extrusion plate 20, and is directly discharged.
  • the heat is not dissipated through the backplane 10, so the temperature of the entire backplane 10 is not affected, so that the optical components (not shown) mounted on the backplane 10 are less affected by the heat, thereby greatly reducing Due to the occurrence of deformation and bending of an optical component (not shown) caused by thermal expansion and thermal stress of the backing plate 10, the present invention not only solves the problem of waste heat generated by the LED, but also ensures the working life of the LED; The life of other devices such as the side backlight module (not shown) is extended.
  • the LED side backlight heat sink 100 further includes a heat sinking squeegee 20 mounted on the side wall of the backing plate 10, the backing plate 10 being cut away for mounting the heat sinking squeegee 20.
  • the rest is the same as in the first embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

Un dispositif dissipateur de chaleur pour un rétro-éclairage latéral à DEL (100) comprend une plaque arrière (10), une plaque extrudée dissipatrice de chaleur (20) montée sur la paroi de fond de la plaque arrière (10), une feuille thermoconductrice isolée (30), une carte de circuit imprimé (40), et une pluralité de DEL (50) montées électriquement sur la carte de circuit imprimé (40). La plaque extrudée dissipatrice de chaleur (20) comprend une partie latérale (24) et une partie de base (22) comprenant une pluralité d'ailettes dissipatrices de chaleur (23). La chaleur produite par les DEL est transférée à la partie de base (22) de la plaque extrudée dissipatrice de chaleur (20) par le biais de la feuille thermoconductrice isolée (30) et de la partie latérale (22) de la plaque extrudée dissipatrice de chaleur (20).
PCT/CN2010/000771 2009-12-11 2010-06-01 Dispositif dissipateur de chaleur pour rétro-éclairage latéral à del Ceased WO2011069321A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2009202650672U CN201606844U (zh) 2009-12-11 2009-12-11 Led侧背光散热装置
CN200920265067.2 2009-12-11

Publications (1)

Publication Number Publication Date
WO2011069321A1 true WO2011069321A1 (fr) 2011-06-16

Family

ID=42951550

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2010/000771 Ceased WO2011069321A1 (fr) 2009-12-11 2010-06-01 Dispositif dissipateur de chaleur pour rétro-éclairage latéral à del

Country Status (2)

Country Link
CN (1) CN201606844U (fr)
WO (1) WO2011069321A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102374509A (zh) * 2011-12-02 2012-03-14 深圳市华星光电技术有限公司 液晶显示装置、背光模块及其散热方法
US10477735B2 (en) 2017-04-28 2019-11-12 Shenzhen China Star Optoelectronics Technology Co., Ltd. Heat dissipation system for use with liquid crystal television and liquid crystal television
CN107027271B (zh) * 2017-04-28 2019-04-30 深圳市华星光电技术有限公司 液晶电视用散热系统及液晶电视

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2505908Y (zh) * 2001-08-14 2002-08-14 施文章 中央微处理器散热结构
US20050157500A1 (en) * 2004-01-21 2005-07-21 Wen-Ho Chen Illumination apparatus with laser emitting diode
CN101004515A (zh) * 2006-01-21 2007-07-25 鸿富锦精密工业（深圳）有限公司 直下式背光模组
CN101017278A (zh) * 2007-03-09 2007-08-15 友达光电股份有限公司 一种侧光式背光模块
CN101131500A (zh) * 2006-08-23 2008-02-27 中华映管股份有限公司 背光组件的光源固定结构
CN101153993A (zh) * 2006-09-29 2008-04-02 鸿富锦精密工业（深圳）有限公司 直下式背光模组
US20090096957A1 (en) * 2007-10-15 2009-04-16 Ikuo Hiyama Liquid Crystal Display Device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2505908Y (zh) * 2001-08-14 2002-08-14 施文章 中央微处理器散热结构
US20050157500A1 (en) * 2004-01-21 2005-07-21 Wen-Ho Chen Illumination apparatus with laser emitting diode
CN101004515A (zh) * 2006-01-21 2007-07-25 鸿富锦精密工业（深圳）有限公司 直下式背光模组
CN101131500A (zh) * 2006-08-23 2008-02-27 中华映管股份有限公司 背光组件的光源固定结构
CN101153993A (zh) * 2006-09-29 2008-04-02 鸿富锦精密工业（深圳）有限公司 直下式背光模组
CN101017278A (zh) * 2007-03-09 2007-08-15 友达光电股份有限公司 一种侧光式背光模块
US20090096957A1 (en) * 2007-10-15 2009-04-16 Ikuo Hiyama Liquid Crystal Display Device

Also Published As

Publication number Publication date
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