WO2011068259A1 - Heatsink - Google Patents
Heatsink Download PDFInfo
- Publication number
- WO2011068259A1 WO2011068259A1 PCT/KR2009/007159 KR2009007159W WO2011068259A1 WO 2011068259 A1 WO2011068259 A1 WO 2011068259A1 KR 2009007159 W KR2009007159 W KR 2009007159W WO 2011068259 A1 WO2011068259 A1 WO 2011068259A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- heat
- flange
- centrifugal fan
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/10—Centrifugal pumps for compressing or evacuating
- F04D17/12—Multi-stage pumps
- F04D17/127—Multi-stage pumps with radially spaced stages, e.g. for contrarotating type
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/26—Rotors specially for elastic fluids
- F04D29/28—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
- F04D29/281—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps for fans or blowers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/26—Rotors specially for elastic fluids
- F04D29/28—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
- F04D29/30—Vanes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
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- H10W40/43—
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
Definitions
- the present invention relates to a heat sink, more specifically, to arrange the heat dissipation fin and the blade in a multi-stage concentric circle, and then divide the area of the heat dissipation fin composed of the multi-stage concentric circles by mutual coupling to improve the flow of air to improve the cooling efficiency. It is about a heatsink which makes it possible.
- cooling means have been provided to stably provide the functions of electronic products.
- the electronic chip cooling apparatus disclosed in Korean Patent Laid-Open Publication No. 10-2004-52010 includes a terminal base which directly contacts a heating element such as a CPU and conducts heat, a heat pipe soldered on the upper end of the terminal base, A heat dissipation block soldered to the end of the heat pipe, a fan motor positioned at the center thereof to supply cooling fluid to the heat dissipation block, a base frame to which the fan motor and the terminal base are fixed, and a fan motor of the base frame.
- the electronic chip cooling device consisting of a fan cover for blocking the most of the installation unit except the top center so that the cooling fluid can be efficiently introduced and discharged, by soldering the fan cover formed under the installation line of the heat pipe to the heat pipe
- the heat pipe conducts heat to the room It is configured to be used as a heat sink to.
- the electronic chip cooling device conducts heat generated from a heating element such as a CPU to the heat pipes 120 and 130 through the terminal base 110 and is moved to the heat dissipation blocks 140 and 150 formed at each end of the heat pipes 120 and 130.
- the heat moved to the heat dissipation blocks 140 and 150 is cooled by causing forced convection by driving the fan motor 160.
- the cooling device for computer parts presented in the Republic of Korea Patent No. 10-600448 is a device for cooling the heat generating parts that generate heat during operation of the components built into the computer, can receive the heat generated from the heat generating parts.
- a heat transfer block which is tightly coupled to the heat generating parts;
- At least one heat pipe including a heat transfer block coupling portion coupled to the heat transfer block so as to receive heat from the heat transfer block, and a heat radiation fin coupling portion bent to form a curved shape;
- a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion of the heat pipe, and spaced apart from each other along the heat dissipation fin coupling portion.
- the cooling device for a computer component configured as described above serves to cool the heat by dissipating heat into the air from the part of the portion coupled to the heat block 10 through the heat pipe when heat is transferred from the heat-generating electronic component to the heat block.
- the plurality of heat dissipation fins are configured to cool the computer components by allowing the air flow generated by the cooling fan to pass through the heat dissipation fins to allow the air flow to be discharged to the outside in a spiral manner with respect to the rotation axis of the cooling fan.
- the cooling device of the prior art as described above is made by applying an axial fan to flow the outside air along the rotational axis of the fan to pass through the heat radiating fins and then flow out in the axial direction. There was a problem falling.
- the temperature of the heat dissipation fin is cooled through an axial fan installed on the upper part of the heat dissipation fin through which heat of a heat generating component such as a CPU is transferred.
- the upper part of the heat dissipation fin is first touched by the wind by the wind generated by the axial fan. As it cools, it is allowed to cool in turn through a plurality of lower heat radiation fins.
- the wind generated from the axial fan has a problem that the cooling intensity is lowered due to the low wind strength by the interference of the heat radiation fins.
- an object of the present invention is to form a heat sink by combining the heat sink with a centrifugal fan arranged in concentric circles of multiple stages, and then rotate the centrifugal fan so that each stage of the fin is repeatedly divided in and out of the air. To improve the flow.
- the heat sink of the present invention is provided with a plurality of heat dissipation fins spaced at equal intervals, and then arranged in concentric circles of multiple stages to form a channel between each single layer and a passage between the heat dissipation fins sequentially spaced at each end.
- a plurality of heat sinks and a plurality of blades arranged in concentric circles of the plurality of stages so as to be disposed between the channels, the channel and the passages of each stage are alternately blocked by rotation, so that the difference between the internal and external air pressures by coupling with the heat sinks It is composed of a centrifugal fan that generates and introduces external air to the inside to release it to the outside.
- the heat dissipation plate is provided with a second flange for mounting the heat dissipation fins vertically upwards, and is configured by mounting the motor vertically upwards on the second flanges upper surface.
- the centrifugal fan provides a first flange for mounting the blade vertically downward on the bottom surface to form an inlet hole in the center of the first flange, the coupling block supported by the rib on the top surface is the center of the inlet hole It is positioned so as to be fixed to the rotating shaft of the motor by the coupling hole formed in the coupling block is configured to rotate the centrifugal fan.
- the passage has a space between the radiating fins sequentially spaced at equal intervals in a state in which the radiating fins are arranged in concentric circles in a plurality of stages, and the space is radially formed outwardly from the center of the second flange in a virtual arc shape.
- the blade is configured to be arranged to cross between the channel and the passage of each stage of the heat sink.
- the heat dissipation fin and the blade is formed so that one side has an inclined surface, the inclined surface is formed to have an angle from the outside to the inclined surface in the rotational direction of the centrifugal fan.
- a heat sink is formed by combining a heat sink with a centrifugal fan having concentric fins arranged in multiple stages, and then rotating the centrifugal fan so that each end of the fin is repeatedly divided.
- the heat sink of the present invention can minimize the volume by the overlapping combination of the centrifugal fan and the heat sink is effective in miniaturizing the product.
- FIG. 1 is an exploded perspective view showing a heat sink of the present invention.
- Figure 2 is a perspective view of the heat sink of the present invention.
- Figure 3 is a front sectional view showing a heat sink of the present invention.
- Figure 4 is a front view showing a heat sink of the heat sink of the present invention.
- Figure 5 is a front view showing a centrifugal fan of the heat sink of the present invention.
- Figure 6 is a plan sectional view showing a heat sink of the present invention.
- Figure 7 is a photograph showing the experimental state of the heat sink of the present invention.
- second flange 220 motor
- Figure 1 is an exploded perspective view showing a heat sink of the present invention
- Figure 2 is a perspective view showing a heat sink of the present invention
- Figure 3 is a front sectional view showing a heat sink of the present invention
- Figure 4 is a heat sink of the present invention
- Figure 5 is a front view showing a heat sink
- Figure 5 is a front view showing a centrifugal fan of the heat sink of the present invention
- Figure 6 is a cross-sectional view showing a heat sink of the present invention
- Figure 7 is a photograph showing an experimental state of the heat sink of the present invention to be.
- the heat sink 10 of the present invention is composed of a heat sink 200 and a centrifugal fan 100.
- the heat sink generates a difference in air pressure inside and outside the 10 so that the outside air is introduced into the heat sink 10 and then discharged to the outside so as to perform heat exchange.
- the heat sink 200 is provided with a plate-shaped second flange 210, the motor 220 is fixed vertically upward in the center of the upper surface of the second flange 210 to position the rotating shaft 221 of the motor 220 upward.
- the heat radiation fin 230 having a surface on the upper surface of the second flange 210 is installed upright.
- a plurality of heat dissipation fins 230 are provided so that the heat dissipation fins 230 are spaced at a predetermined interval and are arranged in a circular shape so that a passage 250 for inducing the flow of air in the space between the heat dissipation fins 230 is formed.
- the passage 250 allows the space between the heat dissipation fins 230 to be sequentially spaced at equal intervals in a state in which the heat dissipation fins 230 are arranged in the concentric circles of the plurality of stages so that the space between the heat dissipation fins 230 is substantially arc-shaped in a radial direction from the center of the second flange 210.
- a plurality of heat dissipation fins 230 having a circular structure are arranged in concentric circles in multiple stages to stagnate the flow of air between the stages, thereby forming a channel 240 for heat exchange to the heat dissipation fins 230.
- the channel 240 is formed of at least one, and in the present invention, four channels having four channels 240 are formed.
- centrifugal fan 100 is provided with a plate-shaped first flange 110, and installs a plurality of blades 140 having a surface in a vertical downward direction on the lower surface of the first flange 110.
- the blades 140 are arranged in concentric circles of multiple stages so as to be located between the channels 240, and the blades 140 alternately block the channels 240 and the passages 250 of each stage by intersecting the positions of the blades 140 of each stage.
- the heat dissipation fin 230 and the blade 140 to have one side has an inclined surface, the inclined surface is formed to have an angle from the outside of the inclined surface in the rotational direction of the centrifugal fan 100 so that the air can flow smoothly step by step of each channel 240. do.
- the centrifugal fan 100 forms an inlet hole 111 in the center of the first flange 110, and the coupling block 130 supported by the ribs 120 on the upper surface thereof is positioned in the center of the inlet hole 111 to form the coupling block 130.
- the rotation shaft 221 of the motor 220 is fixed to the ball 131 to rotate the centrifugal fan 100 on the heat sink 200.
- the heat sink 10 of the present invention configured as described above is mounted in close contact with the electronic product to be cooled.
- the blister and the heat dissipation fin 230 arranged in concentric circles of the multi-stage assume the first innermost channel 240, and the channels arranged outward will be referred to as second and third stages.
- the first flange 110 is interlocked by the coupling block 130 fixedly integrated with the rotation shaft 221 to rotate the blade 140.
- the blade 140 rotates in each channel 240 of the heat sink 200.
- Outside air flows into the inlet hole 111 of the centrifugal fan 100 and air flows into the channel side of the second stage through the passage 250 of the first stage, and the introduced air is introduced into the second stage channel 240 by the blade 140 of the second stage. It flows into the channel between the front and rear surfaces of the two heat sink fins 230.
- the heat conduction to the heat dissipation fin 230 and then flows through the passage 250 to the third stage channel 240 is repeatedly performed to discharge the air to the outside through the passage 250 located on the outermost side.
- the heat dissipation plate 200 when the air flows through the heat dissipation fin 230, the heat dissipation plate 200, which is transferred through the second flange 210 of the heat dissipation plate 200 in close contact with the cooling target electronic product, may be cooled by inflow of external air.
- the thermal resistance is measured by dividing the difference between the temperature of the highest point and the external fluid by the amount of heat applied to the heat sink 10.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
본 발명은 히트싱크에 관한 것으로써, 더욱 상게하게는 다단의 동심원으로 방열핀과 블레이드를 배치한 다음 상호 결합에 의해 다단의 동심원으로 이루어진 방열핀의 구역을 분할하여 공기의 흐름을 향상시켜 냉각효율을 향상시킬 수 있도록 하는 히트싱크에 관한 것이다.The present invention relates to a heat sink, more specifically, to arrange the heat dissipation fin and the blade in a multi-stage concentric circle, and then divide the area of the heat dissipation fin composed of the multi-stage concentric circles by mutual coupling to improve the flow of air to improve the cooling efficiency. It is about a heatsink which makes it possible.
최근, 반도체 칩과 이를 포함하는 패키지 등의 고집적화, 고성능화 및 소형화 추세에 따라 전자제품도 급격히 고성능화되고 있으며, 이에 따라 전자제품 작동시 그 내부에서 발생되는 열을 효율적으로 신속히 방출시킴으로써 전자제품의 성능을 원활히 유지하기 위한 다양한 시도가 활발히 진행되고 있으며, 이러한 열방출 문제는 전자제품의 발전에 있어 중요한 요소가 되고 있다.Recently, according to the trend of high integration, high performance, and miniaturization of semiconductor chips and packages including the same, electronic products are rapidly becoming high performance. Accordingly, the performance of electronic products can be improved by quickly and efficiently dissipating heat generated therein during operation of electronic products. Various attempts have been actively made to keep it smooth, and this heat emission problem has become an important factor in the development of electronic products.
특히, 전자장비의 내부에 사용되는 CPU 및 주변 전자부품들의 용량이 상대적으로 대용량화 되어짐에 따라 발열량은 극도로 증가하게 된다.In particular, as the capacity of the CPU and the peripheral electronic components used in the electronic equipment becomes relatively large, the heat generation amount is extremely increased.
이렇게 전자제품의 기능을 안정적으로 제공하기 위하여 냉각수단이 마련되어 왔다.Thus, cooling means have been provided to stably provide the functions of electronic products.
먼저, 대한민국 공개특허공보 10-2004-52010호에서 제시된 전자칩 냉각장치는 CPU 등과 같은 발열체에 직접 접촉되어 열을 전도시키는 역할을 하는 터미널 베이스와, 상기 터미널 베이스 상단에 솔더링되는 히트파이프와, 상기 히트파이프 끝단에 솔더링되는 방열 블록과, 상기 방열 블록에 냉각유체를 공급하기 위해 그 중심부에 위치하도록 된 팬 모터와, 상기 팬 모터 및 터미널 베이스가 고정되도록 하는 베이스 프레임과, 상기 베이스 프레임의 팬 모터 설치부 상단 중심을 제외한 대부분을 차단시켜 냉각유체가 효율적으로 유입 및 배출될 수 있도록 하는 팬 커버로 이루어지는 전자칩 냉각장치에 있어서, 상기 히트파이프의 설치라인 하측에 형성된 팬 커버를 히트파이프에 솔더링 시켜 일체화시킴으로서, 히트파이프의 열을 전도 받아서 대기 중에 방열하는 방열판으로서 사용되도록 구성된다.First, the electronic chip cooling apparatus disclosed in Korean Patent Laid-Open Publication No. 10-2004-52010 includes a terminal base which directly contacts a heating element such as a CPU and conducts heat, a heat pipe soldered on the upper end of the terminal base, A heat dissipation block soldered to the end of the heat pipe, a fan motor positioned at the center thereof to supply cooling fluid to the heat dissipation block, a base frame to which the fan motor and the terminal base are fixed, and a fan motor of the base frame. In the electronic chip cooling device consisting of a fan cover for blocking the most of the installation unit except the top center so that the cooling fluid can be efficiently introduced and discharged, by soldering the fan cover formed under the installation line of the heat pipe to the heat pipe By integrating, the heat pipe conducts heat to the room It is configured to be used as a heat sink to.
이러한 전자칩 냉각장치는 CPU 등과 같은 발열체에서 발생된 열을 터미널 베이스(110)를 통해 히트파이프(120,130)로 전도되고 다시 히트파이프(120,130) 각 끝단에 형성된 방열블럭(140,150)으로 이동되어지며, 상기 방열블록(140,150)으로 이동된 열은 팬모터(160)를 구동시킴으로서 강제대류를 일으켜 냉각된다.The electronic chip cooling device conducts heat generated from a heating element such as a CPU to the
또한, 대한민국 등록특허 제10-600448호에서 제시된 컴퓨터 부품용 냉각장치 는 컴퓨터에 내장된 부품 중 작동시 열을 발생시키는 발열부품을 냉각시키기 위한 장치로서, 상기 발열부품에서 발생하는 열을 전달받을 수 있도록 상기 발열부품에 밀착결합되는 전열블록; 상기 전열블록으로부터 열을 전달받을 수 있도록 상기 전열블록에 결합되어 있는 전열블록 결합부와, 곡선형태를 이루도록 구부러진 방열핀 결합부를 포함하여 형성된 적어도 하나의 히트파이프; 및 상기 히트파이프의 방열핀 결합부에 결합되되, 상기 방열핀 결합부를 따라 상호 이격되어 배치된 다수의 방열핀;을 포함하여 구성된다.In addition, the cooling device for computer parts presented in the Republic of Korea Patent No. 10-600448 is a device for cooling the heat generating parts that generate heat during operation of the components built into the computer, can receive the heat generated from the heat generating parts. A heat transfer block which is tightly coupled to the heat generating parts; At least one heat pipe including a heat transfer block coupling portion coupled to the heat transfer block so as to receive heat from the heat transfer block, and a heat radiation fin coupling portion bent to form a curved shape; And a plurality of heat dissipation fins coupled to the heat dissipation fin coupling portion of the heat pipe, and spaced apart from each other along the heat dissipation fin coupling portion.
이렇게 구성되는 컴퓨터 부품용 냉각장치는 발열하는 전자부품에서 전열블록으로 발열이 전달되면 히트파이프를 통하여 전열블럭(10)에 결합된 부분의 이와의 부분에서 열이 공기중으로 발산되어 열을 냉각시키는 역할을 하게 되며, 다수의 방열핀들은, 냉각팬에 의해 생성되는 공기흐름이 상기 방열핀들을 통과하여 냉각팬의 회전축에 대해 공기흐름이 나선형태로 외부로 배출되도록 하여 컴퓨터 부품을 냉각시킬 수 있도록 되어 있다.The cooling device for a computer component configured as described above serves to cool the heat by dissipating heat into the air from the part of the portion coupled to the
그러나, 상기와 같은 종래기술의 냉각장치는 액시얼 팬(axial fan)을 적용하여 외부의 공기를 팬의 회전축에 따라 유입시켜 방열핀들을 통과한 후 축방향으로 유출시키는 형태로 이루어져 있기 때문에 냉각 효율이 떨어지는 문제점이 있었다.However, the cooling device of the prior art as described above is made by applying an axial fan to flow the outside air along the rotational axis of the fan to pass through the heat radiating fins and then flow out in the axial direction. There was a problem falling.
즉, CPU 등의 발열부품의 열이 전달되는 방열핀의 상부에 설치되는 액시얼 팬을 통하여 방열핀의 온도를 냉각시키게 되는데, 상기 액시얼팬에 의해 발생한 바람에 의해 방열핀의 상부가 바람에 최초로 맞닿게 되면서 냉각되면서 다수 적층된 하부의 방열핀을 거쳐 차례로 냉각되게 시키게 된다.That is, the temperature of the heat dissipation fin is cooled through an axial fan installed on the upper part of the heat dissipation fin through which heat of a heat generating component such as a CPU is transferred. The upper part of the heat dissipation fin is first touched by the wind by the wind generated by the axial fan. As it cools, it is allowed to cool in turn through a plurality of lower heat radiation fins.
이때 엑시얼 팬에서 발생하는 바람은 방열핀의 간섭에 의해 바람의 세기가 낮아져 냉각효율이 떨어지는 문제점이 있었다.At this time, the wind generated from the axial fan has a problem that the cooling intensity is lowered due to the low wind strength by the interference of the heat radiation fins.
상기와 같이 방열핀의 간섭에 의해 CPU에서 근접한 위치의 방열핀의 하부 부분의 냉각력이 떨어뜨리게 됨에 따라 CPU에 가까운 부분의 방열핀 하부는 온도가 높고 반대로 CPU와 거리가 먼 방열핀의 상부는 온도가 상대적으로 낮게 되는 현상이 발생하게 되어 열 방출효율이 떨어지는 문제점이 있었다.As described above, as the cooling power of the lower portion of the heat sink fin close to the CPU drops due to the interference of the heat sink fins, the lower part of the heat sink fin near the CPU has a higher temperature, whereas the upper part of the heat sink fin far from the CPU has a relatively high temperature. There was a problem that the phenomenon that the lower the heat emission efficiency is lowered.
따라서, 본 발명의 목적은 핀을 다단의 동심원으로 배치한 원심팬과 방열판을 상호 결합하여 히트싱크를 구성한 후 원심팬을 회전시켜 핀의 각 단이 분할을 반복적으로 행하도록 하여 공기의 유입과 방출에 대한 흐름을 향상시킬 수 있도록 하는 데 있다.Therefore, an object of the present invention is to form a heat sink by combining the heat sink with a centrifugal fan arranged in concentric circles of multiple stages, and then rotate the centrifugal fan so that each stage of the fin is repeatedly divided in and out of the air. To improve the flow.
이러한 목적을 달성하기 위하여 본 발명의 히트싱크는 복수개로 마련된 방열핀을 상호 등간격으로 이격시킨 다음 다단의 동심원으로 배치하여 각 단층 사이에 채널을 형성하고 각 단에 순차적으로 이격된 방열핀 사이에 통로를 형성시킨 방열판과, 상기 채널 사이에 배치되도록 다단의 동심원으로 배치된 복수개의 블레이드를 형성시켜 회전에 의해 각 단의 채널과 통로를 번갈아 차단시켜 방열판과의 결합에 의해 내.외부의 공기 압력 차이를 발생시켜 외부 공기를 내부로 유입시켜 다시 외부로 방출할 수 있도록 하는 원심팬으로 구성한다.In order to achieve this object, the heat sink of the present invention is provided with a plurality of heat dissipation fins spaced at equal intervals, and then arranged in concentric circles of multiple stages to form a channel between each single layer and a passage between the heat dissipation fins sequentially spaced at each end. By forming a plurality of heat sinks and a plurality of blades arranged in concentric circles of the plurality of stages so as to be disposed between the channels, the channel and the passages of each stage are alternately blocked by rotation, so that the difference between the internal and external air pressures by coupling with the heat sinks It is composed of a centrifugal fan that generates and introduces external air to the inside to release it to the outside.
본 발명에 따르면, 상기 방열판은 방열핀을 상면에 수직 상향으로 장착하는 제2플랜지를 마련되고, 상기 제2플랜지 상면에는 모터를 수직 상향으로 안착시켜 구성한다.According to the present invention, the heat dissipation plate is provided with a second flange for mounting the heat dissipation fins vertically upwards, and is configured by mounting the motor vertically upwards on the second flanges upper surface.
본 발명에 따르면, 상기 원심팬은 블레이드를 저면에 수직하향으로 장착하는 제1플랜지를 마련하여 상기 제1플랜지 중앙에 유입공을 형성시키고, 상단면에 리브에 의해 지지되는 결합블럭이 유입공 중앙에 위치시키도록 하여 상기 결합블럭에 형성시킨 결합공으로 모터의 회전축을 고정시켜 원심팬을 회전시킬 수 있도록 구성한다.According to the present invention, the centrifugal fan provides a first flange for mounting the blade vertically downward on the bottom surface to form an inlet hole in the center of the first flange, the coupling block supported by the rib on the top surface is the center of the inlet hole It is positioned so as to be fixed to the rotating shaft of the motor by the coupling hole formed in the coupling block is configured to rotate the centrifugal fan.
본 발명에 따르면, 상기 통로는 방열핀이 다단의 동심원으로 배치시킨 상태에서 등간격으로 방열핀을 순차적으로 이격시킨 사이 공간이 제2플랜지의 중심에서 외부방향으로 방사 형태로 가상의 호 형상으로 구성한다.According to the present invention, the passage has a space between the radiating fins sequentially spaced at equal intervals in a state in which the radiating fins are arranged in concentric circles in a plurality of stages, and the space is radially formed outwardly from the center of the second flange in a virtual arc shape.
본 발명에 따르면, 상기 블레이드는 방열판의 각 단의 채널과 통로 사이에 교차되게 배치될 수 있도록 구성한다.According to the present invention, the blade is configured to be arranged to cross between the channel and the passage of each stage of the heat sink.
본 발명에 따르면, 상기 방열핀과 블레이드는 일측면이 경사면을 갖도록 하되, 상기 경사면은 원심팬의 회전방향으로 경사면 외측에서 내측으로 각도를 갖도록 형성한다.According to the present invention, the heat dissipation fin and the blade is formed so that one side has an inclined surface, the inclined surface is formed to have an angle from the outside to the inclined surface in the rotational direction of the centrifugal fan.
상술한 바와 같이, 본 발명의 히트싱크는 핀을 다단의 동심원으로 배치한 원심팬과 방열판을 상호 결합하여 히트싱크를 구성한 후 원심팬을 회전시켜 핀의 각 단이 분할을 반복적으로 행하도록 함으로써 히트싱크의 내부와 외부의 압력에 차이를 발생시켜 외부의 공기 유입량을 증가시켜 냉각효율을 향상시킬 수 있도록 하는 효과가 있다.As described above, in the heat sink of the present invention, a heat sink is formed by combining a heat sink with a centrifugal fan having concentric fins arranged in multiple stages, and then rotating the centrifugal fan so that each end of the fin is repeatedly divided. There is an effect of improving the cooling efficiency by increasing the outside air inflow by making a difference in the pressure inside and outside the sink.
또한, 본 발명의 히트싱크는 원심팬과 방열판의 중첩된 결합으로 부피를 최소화시킬 수 있어 제품의 소형화를 꾀할 수 있는 효과가 있다.In addition, the heat sink of the present invention can minimize the volume by the overlapping combination of the centrifugal fan and the heat sink is effective in miniaturizing the product.
도 1은 본 발명의 히트싱크를 나타낸 분해사시도.1 is an exploded perspective view showing a heat sink of the present invention.
도 2는 본 발명의 히트싱크를 나타낸 사시도.Figure 2 is a perspective view of the heat sink of the present invention.
도 3은 본 발명의 히트싱크를 나타낸 정단면도.Figure 3 is a front sectional view showing a heat sink of the present invention.
도 4는 본 발명의 히트싱크 중 방열판을 나타낸 정면도.Figure 4 is a front view showing a heat sink of the heat sink of the present invention.
도 5는 본 발명의 히트싱크 중 원심팬을 나타낸 정면도.Figure 5 is a front view showing a centrifugal fan of the heat sink of the present invention.
도 6은 본 발명의 히트싱크를 나타낸 평단면도.Figure 6 is a plan sectional view showing a heat sink of the present invention.
도 7은 본 발명의 히트싱크의 실험상태를 나타낸 사진.Figure 7 is a photograph showing the experimental state of the heat sink of the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
100 : 히트싱크 100 : 원심팬 100: heat sink 100: centrifugal fan
110 : 제1플랜지 111 : 유입공 110: first flange 111: inlet hole
120 : 리브 130 : 결합블럭 120: rib 130: coupling block
131 : 결합공 140 : 블레이드131: hole 140: blade
150 : 경사면 200 : 방열판 150: slope 200: heat sink
210 : 제2플랜지 220 : 모터 210: second flange 220: motor
221 : 회전축 230 : 방열핀 221: rotating shaft 230: heat dissipation fin
240 : 채널240: channel
이하, 본 발명에 첨부된 도면을 참조하여 본 발명의 바람직한 실시 예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
우선, 도면들 중, 동일한 구성요소 또는 부품들은 가능한 동일한 참조부호로 나타내고 있음에 유의하여야 한다. 본 발명을 설명함에 있어, 관련된 공지기능 혹은 구성에 대한 구체적인 설명은 본 발명의 요지를 모호하지 않기 위하여 생략한다.First, in the drawings, the same components or parts are to be noted that the same reference numerals as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.
도 1은 본 발명의 히트싱크를 나타낸 분해사시도이고, 도 2는 본 발명의 히트싱크를 나타낸 사시도이며, 도 3은 본 발명의 히트싱크를 나타낸 정단면도이고, 도 4는 본 발명의 히트싱크 중 방열판을 나타낸 정면도이며, 도 5는 본 발명의 히트싱크 중 원심팬을 나타낸 정면도이고, 도 6은 본 발명의 히트싱크를 나타낸 평단면도이며, 도 7은 본 발명의 히트싱크의 실험상태를 나타낸 사진이다.Figure 1 is an exploded perspective view showing a heat sink of the present invention, Figure 2 is a perspective view showing a heat sink of the present invention, Figure 3 is a front sectional view showing a heat sink of the present invention, Figure 4 is a heat sink of the present invention Figure 5 is a front view showing a heat sink, Figure 5 is a front view showing a centrifugal fan of the heat sink of the present invention, Figure 6 is a cross-sectional view showing a heat sink of the present invention, Figure 7 is a photograph showing an experimental state of the heat sink of the present invention to be.
먼저, 도 1 내지 도 6에서 도시한 바와 같이, 본 발명의 히트싱크 10는 방열판 200과 원심팬 100으로 구성된다.First, as shown in Figures 1 to 6, the
상기 히트싱크는 10 내.외부의 공기 압력 차이를 발생시켜 외부 공기를 히트싱크 10 내부로 유입시킨 후 다시 외부로 방출시켜 열교환을 이룰 수 있도록 한다.The heat sink generates a difference in air pressure inside and outside the 10 so that the outside air is introduced into the
상기 방열판 200은 판형의 제2플랜지 210가 마련되고, 상기 제2플랜지 210의 상부면 중앙에 모터 220를 수직 상향으로 고정시켜 상기 모터 220의 회전축 221을 상부로 위치시킨다.The
그리고, 제2플랜지 210의 상면에 면을 갖는 방열핀 230을 상부로 직립되게 설치한다.Then, the
여기서, 방열핀 230은 복수개로 구비되어 상기 방열핀 230이 일정간격으로 이격되도록 하는 동시에 원형으로 배치시켜 방열핀 230의 이격된 사이 공간에 공기의 흐름을 유도하는 통로 250가 형성되도록 한다.Here, a plurality of heat dissipation fins 230 are provided so that the heat dissipation fins 230 are spaced at a predetermined interval and are arranged in a circular shape so that a
상기 통로 250는 방열핀 230이 다단의 동심원으로 배치시킨 상태에서 등간격으로 방열핀 230을 순차적으로 이격시킨 사이 공간이 제2플랜지 210의 중심에서 외부방향으로 방사 형태로 가상의 호 형상으로 이루어지도록 한다.The
상기와 같이 원형의 구조를 갖는 복수의 방열핀 230을 다단의 동심원으로 배치시켜 각 단 사이에 공기의 흐름을 정체시킴으로써, 방열핀 230에 열교환을 이루도록 하는 채널 240을 형성한다.As described above, a plurality of heat dissipation fins 230 having a circular structure are arranged in concentric circles in multiple stages to stagnate the flow of air between the stages, thereby forming a
상기 채널 240은 적어도 하나 이상으로 형성되며, 본 발명에서는 채널 240의 수를 4개로 한 4단으로 형성시킨다.The
그리고, 원심팬 100은 판형의 제1플랜지 110가 마련되고, 상기 제1플랜지 110의 하부면에 수직하향으로 면을 갖는 복수개의 블레이드 140를 설치한다.In addition, the
상기 블레이드 140는 상기 채널 240 사이에 위치되도록 다단의 동심원으로 배치시키되, 각 단의 블레이드 140의 위치를 교차되게 배치시켜 상기 블레이드 140가 각 단의 채널 240과 통로 250를 번갈아 차단하도록 한다.The
상기 방열핀 230과 블레이드 140는 일측면이 경사면을 갖도록 하되, 상기 경사면은 원심팬 100의 회전방향으로 경사면 외측에서 내측으로 각도를 갖도록 형성하여 채널 240의 각 단별로 공기가 계단식으로 원활히 흐름될 수 있도록 한다.The
아울러, 원심팬 100은 상기 제1플랜지 110 중앙에 유입공 111을 형성시키고, 상단면에 리브 120에 의해 지지되는 결합블럭 130이 유입공 111 중앙에 위치시키도록 하여 상기 결합블럭 130에 형성시킨 결합공 131으로 모터 220의 회전축 221을 고정시켜 방열판 200에서 원심팬 100을 회전시킬 수 있도록 한다.In addition, the
상기와 같이 구성된 본원발명의 히트싱크 10는 냉각대상의 전자제품에 밀착되도록 장착한다.The
이러한 본 발명의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention as follows.
먼저, 다단의 동심원으로 배치된 블레이트 및 방열핀 230은 제일 안쪽에 위치한 채널 240을 제1단으로 가정하고, 그 외측으로 배치된 체널을 제2단, 제3단으로 칭하여 설명하기로 한다.First, the blister and the
상기 모터 220에 구동신호를 인가시켜 회전축 221을 회전시키면, 상기 회전축 221과 일체로 고정된 결합블럭 130에 의해 제1플랜지 110가 연동하여 블레이드 140를 회전시킨다.When the
여기서, 블레이드 140는 방열판 200의 각 채널 240에서 회전하게 된다.Here, the
상기 원심팬 100의 유입공 111으로 외부 공기가 유입되어 제1단의 통로 250를 통해 공기가 제2단의 체널측으로 유입되고, 유입된 공기는 제2단의 블레이드 140에 의해 제2단 채널 240에 위치한 2개의 방열핀 230 전후면 사이의 체널로 흐름된다.Outside air flows into the
이때, 방열핀 230으로 열전도시킨 다음 통로 250를 통해 제3단 채널 240로 흐름되는 순서가 반복적으로 진행되어 제일 바깥측에 위치한 통로 250를 통해 외부로 공기를 방출하게 된다.At this time, the heat conduction to the
이와 같이, 공기의 흐름이 방열핀 230 내부에서 진행되면 냉각대상 전자제품과 밀착된 방열판 200의 제2플랜지 210를 통해 열전달되는 방열판 200은 외부의 공기유입으로 냉각시킬 수 있게 된다.As such, when the air flows through the
본 발명의 히트싱크 10를 이용하여 아래와 같은 실험 조건으로 히트싱크 10의 열성능력 실험 실시예를 살펴보면 다음과 같다.Looking at the thermal capacity experiment example of the
상기 히트싱크 10의 바닥면에 히터를 연결 후 열을 제공하여 전자제품에서 발현되는 열제공 환경을 조성하고, 이러한 히트싱크 100에서 원심팬의 회전수에 따라 변화하는 열 온도를 측정하기 위한 열측정장치가 마련된다.After connecting a heater to the bottom surface of the
아래의 [표 1]은 열측정장치를 통해 측정된 값이다.[Table 1] below is the value measured by the thermometer.
표 1
상기 측정값을 아래의 저항 [수학식1]에 대입하여 최고점의 온도와 외부 유체와의차를 히트싱크 10에 가해준 열량으로 나누어준 값으로 열저항을 측정한다.Substituting the measured value into the following Equation 1, the thermal resistance is measured by dividing the difference between the temperature of the highest point and the external fluid by the amount of heat applied to the
수학식 1
이와 같이, 도출된 결과값을 그래프로 나타내면 아래와 같다.In this way, the resulting results are shown in a graph as follows.
상기에서 보는 바와 같이, 본 발명의 히트싱크 10 RPM의 값이 올라갈수록 급격히 온도가 내려가는 것을 확인할 수 있으며, 이는 본 발명의 히트싱크 10의 뛰어난 냉각효율을 입증할 수 있다.As seen above, it can be seen that the temperature is rapidly lowered as the value of the
이상에서 설명한 본 발명은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능함은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 있어서 명백할 것이다.The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have the knowledge of.
Claims (6)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009801627544A CN102713486A (en) | 2009-12-02 | 2009-12-02 | heat sink |
| US13/513,507 US20120305224A1 (en) | 2009-12-02 | 2009-12-02 | Heat sink |
| PCT/KR2009/007159 WO2011068259A1 (en) | 2009-12-02 | 2009-12-02 | Heatsink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/KR2009/007159 WO2011068259A1 (en) | 2009-12-02 | 2009-12-02 | Heatsink |
Publications (1)
| Publication Number | Publication Date |
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| WO2011068259A1 true WO2011068259A1 (en) | 2011-06-09 |
Family
ID=44115090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2009/007159 Ceased WO2011068259A1 (en) | 2009-12-02 | 2009-12-02 | Heatsink |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120305224A1 (en) |
| CN (1) | CN102713486A (en) |
| WO (1) | WO2011068259A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106574625A (en) * | 2014-09-16 | 2017-04-19 | 飞利浦照明控股有限公司 | Cooling fan |
| CN112503993A (en) * | 2020-11-27 | 2021-03-16 | 岳绍斌 | Energy-saving and environment-friendly heat exchanger for production and manufacturing of chemical products |
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| JP2016528743A (en) * | 2013-08-21 | 2016-09-15 | クールチップ テクノロジーズ, インコーポレイテッド | Motion heat sink with integrated heat transfer fins |
| WO2015129034A1 (en) * | 2014-02-28 | 2015-09-03 | 富士機械製造株式会社 | Viscous fluid coating device |
| US9326424B2 (en) * | 2014-09-10 | 2016-04-26 | Opentv, Inc. | Heat sink assembly and method of utilizing a heat sink assembly |
| US10371161B2 (en) * | 2016-04-15 | 2019-08-06 | Delta Electronics, Inc | Impeller and centrifugal fan with same |
| US10749308B2 (en) | 2016-10-17 | 2020-08-18 | Waymo Llc | Thermal rotary link |
| CN109863450B (en) * | 2016-10-19 | 2022-04-29 | 索尼公司 | Light source unit and projection display device |
| CN108401402B (en) * | 2018-03-30 | 2020-02-21 | 上海斐讯数据通信技术有限公司 | A multi-stage air-cooled heat sink |
| CN109505803B (en) * | 2018-11-30 | 2023-10-27 | 江苏维尔特泵业有限公司 | A hot water pump bearing body air cooling device |
| CN211176459U (en) * | 2019-10-23 | 2020-08-04 | 众普森科技(株洲)有限公司 | Lamp set |
| EP4115718A4 (en) * | 2020-03-06 | 2024-04-03 | Netcomm Wireless Pty Ltd | TELECOMMUNICATIONS BOX WITH IMPROVED THERMAL CHARGE MANAGEMENT |
| CN114543056B (en) * | 2022-01-24 | 2023-12-08 | 桂林智神信息技术股份有限公司 | Heat abstractor and heat dissipation lamps and lanterns |
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- 2009-12-02 CN CN2009801627544A patent/CN102713486A/en active Pending
- 2009-12-02 US US13/513,507 patent/US20120305224A1/en not_active Abandoned
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| JPH07254670A (en) * | 1994-03-16 | 1995-10-03 | Nec Corp | Heat sink for semiconductor device |
| KR19980028595A (en) * | 1996-10-23 | 1998-07-15 | 김광호 | Microprocessor heat sink |
| KR20010066771A (en) * | 1999-12-06 | 2001-07-11 | 이형도 | Cooling apparatus for electron-parts |
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| CN106574625A (en) * | 2014-09-16 | 2017-04-19 | 飞利浦照明控股有限公司 | Cooling fan |
| CN106574625B (en) * | 2014-09-16 | 2018-06-15 | 飞利浦照明控股有限公司 | Cooling fan |
| CN112503993A (en) * | 2020-11-27 | 2021-03-16 | 岳绍斌 | Energy-saving and environment-friendly heat exchanger for production and manufacturing of chemical products |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120305224A1 (en) | 2012-12-06 |
| CN102713486A (en) | 2012-10-03 |
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