WO2011043071A1 - ペリクルおよびそのマスク接着剤 - Google Patents
ペリクルおよびそのマスク接着剤 Download PDFInfo
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- WO2011043071A1 WO2011043071A1 PCT/JP2010/005996 JP2010005996W WO2011043071A1 WO 2011043071 A1 WO2011043071 A1 WO 2011043071A1 JP 2010005996 W JP2010005996 W JP 2010005996W WO 2011043071 A1 WO2011043071 A1 WO 2011043071A1
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- WIPO (PCT)
- Prior art keywords
- pellicle
- mask
- mask adhesive
- polypropylene
- propylene
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/10—Homopolymers or copolymers of propene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/14—Copolymers of propene
- C08L23/142—Copolymers of propene at least partially crystalline copolymers of propene with other olefins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/14—Copolymers of propene
- C08L23/145—Copolymers of propene with monomers having two or more carbon-to-carbon double bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
Definitions
- the present invention relates to a pellicle and its mask adhesive that are mounted on a lithography mask at the time of exposure in the manufacturing process of a semiconductor device such as LSI and VLSI, or a liquid crystal display panel, and in particular, by double patterning (double patterning).
- the present invention relates to a pellicle suitable for forming a fine pattern and a mask adhesive thereof.
- patterning is formed by irradiating light through a mask (also referred to as an exposure original plate or a reticle).
- a mask also referred to as an exposure original plate or a reticle.
- the patterning is deformed or the edges are roughened, and the dimension, quality and appearance of the patterning are impaired.
- a method is adopted in which a pellicle that transmits light well is attached to the mask surface to suppress adhesion of foreign matter to the mask surface.
- the pellicle usually has a metal pellicle frame and a pellicle film stuck to one end face thereof. On the other end face of the pellicle frame, a mask adhesive layer for fixing the pellicle to the mask is formed, and the mask adhesive layer is protected by a sheet-like material (separator) having releasability.
- the exposed mask adhesive layer is pressure-bonded to a predetermined position of the mask to fix the pellicle to the mask. In this manner, by attaching the pellicle to the mask, the exposure light can be transmitted without being affected by foreign matter or the like.
- a pellicle using an acrylic emulsion adhesive as a mask adhesive has been proposed (for example, see Patent Document 1). Further, a surface protective film for optical use or the like containing a polypropylene-based elastomer and / or a styrene-based elastomer as an adhesive layer has been proposed (see, for example, Patent Document 2).
- a dicing substrate film including a hydrogenated styrene-butadiene copolymer (SEBS), a polypropylene resin (PP), and an olefin thermoplastic elastomer (TPO) has been proposed as a substrate layer (for example, a patent) Reference 3).
- the resin composition having a phase separation structure has a continuous phase of a modified polyphenylene sulfide (PPS) resin and a dispersed phase of a polyester; the dispersed phase of the polyester is further a continuous phase of an epoxy group-containing polyolefin;
- PPS polyphenylene sulfide
- a resin composition having a salami-type dispersion structure having a polyolefin dispersed phase has been proposed (for example, Patent Document 4).
- Double patterning is a technique in which one circuit pattern is divided into two patterns with low density and exposed, and the two patterns are combined to finally obtain a fine pattern with high density (for example, , See Patent Documents 5 and 6). Double patterning is preferably applied to the production of next-generation semiconductors after the 22 nm generation (half pitch 32 nm).
- the inventors of the present invention have one of the factors causing pattern misalignment in double patterning; the distortion of the mask is caused by the distortion of the pellicle frame passing through the mask adhesive layer when the pellicle is pressed against the mask. I thought it would be caused by transmission.
- a mask adhesive layer that is too soft may easily deform or distort when touching an operator or machine when manufacturing the pellicle or attaching it to the mask; or touching the end surface of the storage case when storing or transporting the pellicle. To do. As a result, there is a possibility that the distortion of the mask adhesive is transmitted to the mask.
- the mask adhesive is too soft, adhesive residue tends to be formed on the mask surface when the pellicle is peeled off from the mask after the exposure process is completed. Furthermore, if the mask adhesive layer is too soft, the instantaneous adhesiveness is high, so that it is easily sticky when touched by the hand, and the handling is also low.
- the mask adhesive In order to increase patterning accuracy; especially in order to suppress pattern misalignment in double patterning, the mask adhesive has a moderate softness so as not to transmit the pellicle frame distortion to the mask, and is peeled off from the mask. It is desired that there is little adhesive residue afterward and that the handleability is good.
- INDUSTRIAL APPLICABILITY The present invention provides a pellicle having a mask adhesive layer that has moderate softness but has little adhesive residue after being peeled off from the mask and good handleability; in particular, it can suppress pattern misalignment in double patterning.
- An object is to provide a pellicle.
- the present invention relates to the following pellicle and a mask adhesive used therefor.
- a pellicle having a pellicle frame, a pellicle film disposed on one end surface of the pellicle frame, and a mask adhesive layer disposed on the other end surface of the pellicle frame, wherein the mask adhesive layer is , 100 parts by mass of a styrene resin (A), including a polypropylene (b1) and a propylene elastomer (b2), 35 parts by mass or more and 170 parts by mass or less of a hardness modifier (B),
- a styrene resin including a polypropylene (b1) and a propylene elastomer (b2)
- b1 polypropylene
- B2 propylene elastomer
- the pellicle in which the phase-separation structure of the continuous phase of a styrene resin (A) and the dispersed phase of a hardness modifier
- the styrene resin (A) is a styrene ethylene butylene styrene copolymer
- the polypropylene (b1) is homopolypropylene or random polypropylene containing 5 mol% or less of a comonomer component
- the propylene type The pellicle according to any one of [1] to [5], wherein the elastomer (b2) is a propylene butene ethylene copolymer.
- a mask adhesive for fixing the pellicle to the mask which contains polypropylene (b1) and propylene-based elastomer (b2) with respect to 100 parts by mass of the styrene resin (A).
- a mask including a hardness adjusting agent (B) of 170 parts by mass or less, and a phase separation structure of a continuous phase of the styrenic resin (A) and a dispersed phase of the hardness adjusting agent (B) observed in an electron micrograph adhesive.
- the styrene resin (A) is a styrene ethylene butylene styrene copolymer
- the polypropylene (b1) is a homopolypropylene or a random polypropylene containing 5% by mole or less of a comonomer component
- the propylene The mask adhesive according to any one of [7] to [11], wherein the elastomer (b2) is a propylene butene ethylene copolymer.
- the pellicle of the present invention has a mask adhesive layer that has softness that does not cause deformation or distortion, has little adhesive residue after peeling off from the mask, and has good handling properties. Thereby, the position shift of the pattern in double patterning can be suppressed.
- the mask adhesive of the present invention comprises a styrene resin (A), a hardness adjusting agent (B) containing polypropylene (b1) and a propylene elastomer (b2), and a softener (C) as necessary. And a tackifier (D).
- the styrene resin (A) is a polymer containing a structural unit derived from styrene; preferably a copolymer of styrene and an olefin other than styrene.
- the styrenic resin (A) is preferably a binary copolymer of styrene and one olefin; or a terpolymer of styrene and two olefins. Examples of olefins include ethylene, propylene, butene, octene, hexene and the like.
- styrene resin (A) examples include styrene ethylene butylene styrene copolymer (also referred to as “SEBS”), styrene isoprene styrene copolymer, and the like, and preferably styrene ethylene butylene styrene copolymer.
- SEBS styrene ethylene butylene styrene copolymer
- the styrene resin (A) can mainly increase the elasticity of the mask adhesive.
- the maximum value of tan ⁇ in the dynamic viscoelasticity of the styrene resin (A) is large. Tan ⁇ is expressed by loss elastic modulus / storage elastic modulus. When the maximum value of tan ⁇ is large, it means that plastic deformation is likely to occur.
- the styrene resin (A) having a large maximum value of tan ⁇ facilitates plastic deformation of the mask adhesive containing the tan ⁇ , and can reduce distortion.
- the maximum value of tan ⁇ of the styrenic resin (A) is preferably 1 or more and 4 or less, more preferably 1.4 or more and 4 or less.
- the tan ⁇ and storage elastic modulus in dynamic viscoelasticity can be measured by a dynamic viscoelasticity measuring device RSA-II manufactured by TA Instruments.
- a dynamic viscoelasticity measuring device RSA-II manufactured by TA Instruments.
- the storage elastic modulus, loss elastic modulus and tan ⁇ of a sample piece (width 5 mm ⁇ thickness 1 mm) of the styrene resin (A) are measured under a nitrogen atmosphere, a tensile mode, 1 Hz, and a measurement temperature of ⁇ 80 to 120 ° C. Measured under the conditions of a temperature rising rate of 3 ° C./min and an initial gap of 20 mm.
- the content of the structural unit derived from styrene in the styrene-based resin (A) is preferably 35% by mass or less, and more preferably 20% by mass or less. This is because if the content of the structural unit derived from styrene is too large, tan ⁇ of the styrene resin (A) becomes too small.
- Solubility parameter of the styrene-based resin (A) is preferably 15.5 (J / cm 3) 1/2 ⁇ 17.5 (J / cm 3) 1/2, 16 (J / More preferably, it is cm 3 ) 1/2 to 17 (J / cm 3 ) 1/2 . It is for improving the compatibility with the curing regulator (B) described later.
- the solubility parameter (SP value) of the styrene resin (A) can be controlled by the composition. Specifically, it can be controlled by the content of structural units derived from styrene, and the content is preferably 35% by mass or less. This is because if the content of the structural unit derived from styrene is too large, the solubility parameter becomes too large.
- the solubility parameter (SP value) is a value defined by Hildebrand based on regular solution theory. It means that compatibility is so high that the difference of SP value of two components to mix is small.
- the SP value is determined by a known method (described in R. F. Fedors, polym. Eng. Sci., 14 (2), pages 147 to 154 (1974)).
- Hardness adjuster (B) contains polypropylene (b1) and propylene-based elastomer (b2).
- Polypropylene (b1) is homopolypropylene or random polypropylene containing a small amount of comonomer.
- the comonomer in the random polypropylene is preferably an olefin other than propylene.
- olefins other than propylene include ethylene, butene, pentene, hexene, octene and decene. These may be used alone or in combination.
- the content of the comonomer in the random polypropylene is preferably 10 mol% or less, more preferably 5 mol% or less.
- the total amount of comonomers is 10 mol% or less, preferably 5 mol% or less.
- polypropylene (b1) the content of the structural unit derived from propylene is 90 mol% or more and 100 mol% or less, and the content of the structural unit derived from ethylene is 0 mol% or more and 5 mol% or less. Yes; includes polypropylene or random polypropylene in which the content of structural units derived from butene is from 0 mol% to 5 mol%.
- polypropylene (b1) Since polypropylene (b1) has good compatibility with both the styrene resin (A) and the propylene elastomer (b2), the compatibility between the styrene resin (A) and the propylene elastomer (b2) is improved. Can form a sea-island structure. That is, since polypropylene (b1) is a resin having a high elastic modulus, it forms an island phase with respect to the sea phase of the styrene-based resin (A) and phase-separates into a sea-island structure.
- polypropylene (b1) maintains the high elasticity derived from the polypropylene (b1) even after mixing with the styrene resin (A). Therefore, polypropylene (b1) can increase the elasticity of the mask adhesive, eliminate adhesive residue, and improve handling.
- the storage elastic modulus of polypropylene (b1) at 25 ° C. is preferably 4.1 ⁇ 10 5 Pa ⁇ s or more and 1 ⁇ 10 10 Pa ⁇ s or less, more preferably 5 ⁇ 10 5 Pa ⁇ s or more and 1.5 or less. ⁇ 10 9 Pa ⁇ s or less. If the storage elastic modulus of polypropylene (b1) is too high, the maximum value of tan ⁇ of the mask adhesive may be small.
- the storage elastic modulus can be measured by the same method as described above.
- the tensile elastic modulus of polypropylene (b1) is preferably 1500 MPa to 1800 MPa, more preferably 1600 MPa to 1800 MPa.
- the tensile elastic modulus can be measured according to JIS K7161.
- the flexural modulus of polypropylene (b1) is preferably 1100 MPa to 2000 MPa, more preferably 1200 MPa to 2000 MPa.
- the flexural modulus can be measured according to JIS K7171.
- the density of the polypropylene (b1) is preferably 900 kg / m 3 or more 930 kg / m 3 or less, more preferably 903kg / m 3 or more 930 kg / m 3 or less.
- the density can be measured according to JIS K0061.
- Polypropylene (b1) may be obtained by manufacturing or may be a commercially available product.
- the propylene-based elastomer (b2) is an elastomer containing a structural unit derived from propylene, preferably a copolymer containing a structural unit derived from propylene and a structural unit derived from ene.
- a preferred example of ene is 1-butene. This is because 1-butene has an effect of increasing the maximum value of tan ⁇ among en.
- a preferred example of the propylene-based elastomer (b2) containing a structural unit derived from propylene and a structural unit derived from 1-butene is propylene butene ethylene copolymer (PBER).
- the content of the structural unit derived from ethylene is 5 mol% or more and 20 mol% or less, and the content of the structural unit derived from 1-butene is 5 mol% or more and 30 mol% or less.
- a propylene butene ethylene copolymer containing a large amount of structural units derived from 1-butene can increase the maximum value of tan ⁇ of the mask adhesive.
- the propylene-based elastomer (b2) has high compatibility with the polypropylene (b1), and can increase the maximum value of tan ⁇ of the mask adhesive.
- the propylene-based elastomer (b2) has an absorption peak in the region of 761 cm ⁇ 1 or more and 767 cm ⁇ 1 or less in the infrared absorption spectrum.
- the propylene-based elastomer (b2) having an absorption peak in this region is compatible with the polypropylene (b1) and can increase the maximum value of tan ⁇ of the hardness adjusting agent (B). This absorption peak is confirmed not only in the copolymer containing the structural unit derived from 1-butene but also in the infrared absorption spectrum of the mask adhesive containing the copolymer.
- the maximum value of tan ⁇ of the propylene-based elastomer (b2) is preferably 0.6 or more and 4 or less, more preferably 0.8 or more and 4 or less, and further preferably 1 or more and 4 or less.
- Storage modulus at 25 ° C. of the propylene-based elastomer (b2) are, 1 ⁇ 10 or less 2 Pa ⁇ s or more 1 ⁇ 10 7 Pa ⁇ s, preferably 1 ⁇ 10 6 Pa ⁇ 1 ⁇ 10 3 Pa ⁇ s or higher s or less.
- a mask adhesive containing a propylene-based elastomer (b2) whose storage elastic modulus is too high is not preferable because it not only hardly adheres to the mask but also the maximum value of tan ⁇ becomes too small.
- the density of the propylene based elastomer (b2) is preferably not 800 kg / m 3 or more 900 kg / m 3 or less, more preferably 805kg / m 3 or more 900 kg / m 3 or less.
- the solubility parameter (SP value) of the propylene-based elastomer (b2) is preferably 14 (J / cm 3 ) 1/2 or more and 18.4 (J / cm 3 ) 1/2 or less, more preferably 15 (J / Cm 3 ) 1/2 or more and 17 (J / cm 3 ) 1/2 , more preferably 15.5 (J / cm 3 ) 1/2 or more and 16.8 (J / cm 3 ) 1/2 There, particularly preferably 16 (J / cm 3) 1/2 or more 16.4 (J / cm 3) 1/2. This is to increase the compatibility with the styrene resin (A) and the polypropylene (b1).
- the solubility parameter (SP value) can be measured in the same manner as described above.
- the solubility parameter (SP value) of the propylene-based elastomer (b2) can be controlled by the type and content of the comonomer. For example, increasing the content of ethylene and butylene in the comonomer decreases the solubility parameter, and conversely decreasing the content of ethylene and butylene increases the solubility parameter.
- the polypropylene (b1) and the propylene-based elastomer (b2) may be either manufactured or commercially available.
- Mask adhesives containing high elasticity polyethylene, polyethylene wax, polypropylene, polypropylene wax, etc., instead of these hardness modifiers (B) are highly elastic, but the maximum value of tan ⁇ decreases depending on the amount added. To do. For this reason, a mask adhesive that achieves both a high elastic modulus and a high maximum tan ⁇ cannot be obtained.
- a mask adhesive containing an elastomer having low elasticity for example, a copolymer made of ethylene / butene
- a copolymer made of ethylene / butene is low in elasticity, and therefore tends to cause adhesive residue and the like.
- the content ratio (mass ratio) of polypropylene (b1) and propylene-based elastomer (b2) in the hardness adjusting agent (B) is preferably 5:95 to 30:70, and 10:90 to 30:70. More preferably.
- the content ratio (mass ratio) of the polypropylene (b1) and the propylene-based elastomer (b2) is in the above range, the sea island in which the island phase of the propylene-based elastomer (b2) is dispersed in the sea phase of the polypropylene (b1) described later. Easy to obtain structure.
- the maximum value of tan ⁇ in the dynamic viscoelasticity of the hardness adjusting agent (B) is preferably 0.5 or more and 2 or less, more preferably 0.7 or more and 2 or less.
- the hardness adjusting agent (B) having the maximum value of tan ⁇ within the above range can moderately plastically deform the mask adhesive containing the tan ⁇ and make it difficult to be distorted.
- the storage elastic modulus at 25 ° C. of the hardness adjusting agent (B) is 0.9 ⁇ 10 5 Pa ⁇ s or more, preferably 1 ⁇ 10 5 Pa ⁇ s or more and 1 ⁇ 10 7 Pa ⁇ s or less.
- the hardness adjusting agent (B) having a storage elastic modulus in the above range can suppress the adhesive residue and handling deterioration of the mask adhesive containing it.
- the mask adhesive may contain a softening agent (C).
- a softener (C) will not be specifically limited if it is a material which can provide a styrenic resin (A) with a softness
- the softening agent (C) include polybutene, hydrogenated polybutene, unsaturated polybutene and the like.
- the mask adhesive may contain a tackifier (D).
- the tackifier (D) is not particularly limited as long as it is generally used.
- Examples of the tackifier (D) include Alcon manufactured by Arakawa Chemical Co., Ltd., Toho High Resin, Toho Chemical Industries Co., Ltd., Highlets (R) manufactured by Mitsui Chemicals, Inc., Quinton manufactured by Nippon Zeon Co., Ltd., Tonex Includes Escorez (R), etc.
- petroleum resins such as a fraction derived from pentene (C5 fraction) and a fraction derived from nonene (C9 fraction) are preferable.
- a fraction derived from nonene (C9 fraction, such as alkone) is preferable because it is compatible with styrene resin (A) such as SEBS.
- the mask adhesive is a hardness adjusting agent (B) of 35 parts by mass or more and 170 parts by mass or less with respect to 100 parts by mass of the styrene resin (A); B).
- the content of the hardness adjusting agent (B) is too large, the rigidity becomes too high and the maximum value of tan ⁇ of the mask adhesive becomes small. For this reason, it is difficult to obtain the effect of reducing the displacement of the pattern. If the content of the hardness adjusting agent (B) is too small, the mask adhesive becomes too soft, adhesive residue tends to be generated, and handling is lowered.
- the mask adhesive of the present invention is obtained by mixing or kneading the above components at 80 ° C. to 220 ° C.
- the mixing / kneading apparatus may be a general apparatus, for example, a twin screw extruder, a lab plast mill, a mixer, or the like.
- the maximum value of tan ⁇ in dynamic viscoelasticity of the mask adhesive thus obtained is preferably reasonably high, more preferably 1.5 or more and 5 or less, and 1.7 or more and 4 or less. More preferably.
- a mask adhesive having a high maximum value of tan ⁇ is likely to be plastically deformed (soft), and can eliminate the distortion energy of the pellicle frame and make it difficult to transmit to the mask.
- a mask adhesive having a maximum value of tan ⁇ that is too high is too low in elasticity, so that the strength of the resin itself is reduced, and adhesive remains easily.
- the hardness adjusting agent (B) whose maximum value of tan ⁇ is in the above range moderately plastically deforms the mask adhesive containing the tan ⁇ , so that the mask is less likely to be distorted (for example, the pattern displacement amount in double patterning is 3 nm). The following can be done), it is difficult to remain glue.
- the temperature at which tan ⁇ reaches the maximum value is preferably ⁇ 80 ° C. to 30 ° C. This is because plastic deformation below room temperature is important because operations such as mounting the pellicle on the mask are performed at room temperature.
- the measurement frequency is 1 hertz.
- the content ratio (mass ratio) of the propylene-based elastomer (b2) may be increased.
- the propylene-based elastomer What is necessary is just to reduce the content ratio (mass ratio) of b2).
- the maximum value of tan ⁇ of the mask adhesive may be lowered, so that it should be set to an appropriate content ratio.
- the storage elastic modulus at 25 ° C. of the mask adhesive is preferably 4.1 ⁇ 10 5 Pa ⁇ s or more and 1 ⁇ 10 9 Pa ⁇ s or less, and 4.2 ⁇ 10 5 Pa ⁇ s or more and 1 ⁇ 10 7. More preferably, it is Pa ⁇ s or less.
- a mask adhesive having a high storage elastic modulus has a high cohesive force, so that it is difficult for adhesive to remain and handling properties are also good.
- a mask adhesive having a low storage elastic modulus tends to leave glue and has poor handling properties.
- the content ratio (mass ratio) of polypropylene (b1) may be increased.
- the content ratio of polypropylene (b1) (Mass ratio) may be lowered.
- Tan ⁇ and storage elastic modulus of the mask adhesive can be measured in the same manner as described above.
- the mask adhesive of the present invention has a sea-island structure (phase separation structure) in which the island phase (dispersed phase) of the hardness adjusting agent (B) is dispersed in the sea phase (continuous phase) of the styrene resin (A).
- the island phase of the hardness adjusting agent (B) further has a sea-island structure (phase separation structure) in which the island phase (dispersed phase) of the propylene-based elastomer (b2) is dispersed in the sea phase (continuous phase) of the polypropylene (b1). .
- phase separation structures are observed with a transmission electron microscope.
- FIG. 1 is an example of a transmission electron micrograph of a mask adhesive.
- the island phase of the curing modifier (B) is dispersed in the sea phase of the styrenic resin (A); the island phase of the curing modifier (B) is further converted into polypropylene (b1). It has a three-phase structure having a sea phase (white portion) and an island phase (black portion) of the propylene-based elastomer (b2).
- the sea-island structure of the styrene resin (A) and the curing modifier (B) is obtained when the styrene resin (A) and the hardness modifier (B) are highly compatible and have an appropriate composition ratio.
- the sea-island structure of polypropylene (b1) and propylene-based elastomer (b2) in the island phase of the hardness adjusting agent (B) is highly compatible with polypropylene (b1) and propylene-based elastomer (b2). Obtained when the composition ratio.
- the composition ratio is appropriate. Is obtained. If the compatibility between the polypropylene (b1) and the propylene-based elastomer (b2) is low, they are difficult to mix with each other. For this reason, the island phase of polypropylene (b1) and the propylene elastomer (b2) island phase are dispersed independently in the sea phase of the styrene resin (A), and the three-phase structure as described above is not formed.
- a sea-island structure (phase-separated structure) is generally obtained by mixing two or more components having good compatibility; when the compatibility of the two components is particularly high, the diameter of the island phase is small (the island phase is very small). scatter).
- the compatibility of the two components is particularly high
- the diameter of the island phase is small (the island phase is very small). scatter).
- the sea-island structure is not formed. Even if the same substances are mixed together, they are completely compatible to form one phase, and no sea-island structure is formed.
- the sea-island structure can be observed by transmission micrographs.
- the ratio (area ratio) of the area occupied by the island phase of the hardness modifier (B) to the total area of the mask adhesive observed with a transmission microscope under the conditions of an observation area of 1350 ⁇ m 2 and a magnification of 5000 times is 10% or more and 40 % Is preferably less than 15%, more preferably 15% or more and less than 35%.
- a mask adhesive having such an area ratio has an appropriate maximum value of tan ⁇ and storage elastic modulus.
- the area ratio of the island phase of the hardness adjusting agent (B) can be adjusted by the content ratio of the styrenic resin (A) and the hardness adjusting agent (B).
- the content of the hardness adjusting agent (B) is large, the area occupied by the island of the hardness adjusting agent (B) with respect to the entire mask adhesive increases; when the content of the hardness adjusting agent (B) is small, the hardness adjustment The area occupied by the agent (B) is reduced. That is, the said area ratio is obtained by including 35 mass parts or more and 170 mass parts or less of a hardness regulator (B) with respect to 100 mass parts styrene resin (A).
- the area ratio occupied by the island phase of the hardness modifier (B) is calculated from a photograph of the sea-island structure taken with a transmission microscope or the like.
- the diameter of the island phase is, for example, about 1 to 14 ⁇ m. A smaller island phase diameter is preferable because the island phase is finely dispersed.
- the mask adhesive of the present invention Since the mask adhesive of the present invention has a moderately high maximum value of tan ⁇ and a high storage elastic modulus, it has moderate softness. For this reason, when applied as a mask adhesive layer of a pellicle, the mask adhesive layer absorbs (relaxes) the distortion of the pellicle so that the distortion of the pellicle or the mask adhesive layer is not transmitted to the mask. it can. Furthermore, the mask adhesive of the present invention hardly stretches and does not easily leave glue. For this reason, even if a mask adhesive touches an operator's hand etc., it is easy to leave
- the pellicle of the present invention is for bonding a pellicle film, a pellicle frame that supports the outer periphery of the pellicle film, a film adhesive that bonds the pellicle frame and the pellicle film, and the pellicle frame and the mask. And a mask adhesive.
- FIG. 2 shows an example of the pellicle of the present invention.
- the pellicle 10 includes a pellicle film 12 and a pellicle frame 14 that supports the outer periphery of the pellicle film 12.
- the pellicle film 12 is stretched through a film adhesive layer 13 on one end face of the pellicle frame 14.
- a mask adhesive layer 15 is provided on the other end surface of the pellicle frame 14.
- the mask adhesive layer 15 is obtained from the aforementioned mask adhesive.
- the pellicle film 12 is held by a pellicle frame 14 and covers an exposure area of a mask (not shown). Therefore, the pellicle film 12 has translucency so as not to cut off energy by exposure.
- Examples of the material of the pellicle film 12 include quartz glass, a transparent material such as a fluororesin and cellulose acetate.
- the pellicle frame 14 may be an anodized aluminum frame or the like.
- the pellicle frame 14 is preferably black. This is to prevent reflection of exposure light and to easily inspect the presence or absence of adhered foreign matter.
- the film adhesive layer 13 bonds the pellicle frame 14 and the pellicle film 12 together.
- the film adhesive layer 13 include fluoropolymers such as an acrylic resin adhesive, an epoxy resin adhesive, a silicon resin adhesive, and a fluorine-containing silicon adhesive.
- the mask adhesive layer 15 adheres the pellicle frame 14 to a mask (not shown).
- the mask adhesive layer 15 is obtained by applying and drying the aforementioned mask adhesive.
- the method for applying the mask adhesive may be a known method, for example, a method in which a spatula-shaped application nozzle is pressed against the end surface of the pellicle frame and the mask adhesive is discharged from the application nozzle.
- the thickness of the mask adhesive layer 15 is about 0.3 to 1.0 mm.
- a release sheet (separator) for protecting the mask adhesive layer 15 may be disposed on the surface of the mask adhesive layer 15.
- the release sheet include a polyethylene terephthalate film and a polypropylene film. The release sheet is peeled off when the pellicle is mounted on the mask.
- the pellicle 10 is mounted on a mask (not shown) through the mask adhesive layer 15 after the release sheet is peeled off.
- the foreign matter adhering to the mask causes poor resolution on the wafer when the exposure light is focused on it.
- the pellicle 10 is mounted so as to cover an exposure area of a mask (not shown). This prevents foreign matter from adhering to the mask (not shown).
- a pellicle mounter (Matsushita Seiki Co., Ltd.) is used. Place the pellicle and mask on the pellicle mounter at room temperature, and press the pellicle to the mask.
- the pressure-bonding condition depends on the type of the mask, but may be pressure-bonded for about 3 minutes at room temperature and a pressure of about 20 kgf / cm 2 .
- the mask (not shown) is a glass substrate such as synthetic quartz or quartz glass on which a patterned light shielding film is arranged.
- the light shielding film is a single layer or multiple layer film of a metal such as Cr or MoSi.
- the thickness of the mask is about 0.6 cm, for example.
- Exposure light used for lithography such as a process for forming a circuit pattern drawn on a semiconductor element is a short wavelength such as a mercury lamp i-line (wavelength 365 nm), KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm), etc.
- the exposure light is used.
- the pellicle of the present invention has a mask adhesive layer that is moderately soft and does not remain glued. For this reason, even when the pellicle is mounted on the mask, the mask adhesive layer absorbs and relaxes the distortion energy of the pellicle so that it is not transmitted to the mask, and the mask distortion can be suppressed. For this reason, the fall of the patterning precision resulting from distortion of a mask can be suppressed. In addition, when the pellicle is peeled from the mask, the mask adhesive layer does not remain and the handling property is excellent.
- double patterning two exposures are performed on one wafer using two masks. Then, by superimposing the two circuit patterns alternately, a circuit pattern having a pitch that is 1 ⁇ 2 of the pitch of the circuit pattern obtained with one mask is obtained.
- the pitch of the circuit pattern obtained by double patterning is about 1 to 5 nm.
- the double patterning method By using the double patterning method, it becomes possible to expose a fine circuit pattern required in the latest generation of 32 nm node or less, which is difficult to expose with a single mask. In this technique, it is important how the circuit patterns formed by the first and second exposures can be accurately superimposed according to the designed circuit diagram. As described above, in the double patterning, it is required to reduce the displacement amount of the relative positions of the two patterns (pattern displacement amount) as much as possible.
- the amount of pattern displacement required in the generation of 32 nm node or less is about 0 to 5 nm, preferably about 0 to 3 nm.
- the amount of positional deviation between the two patterns is the difference between the measured distance between the pattern formed by the first exposure / development and the pattern formed by the second exposure / development and the distance required from the circuit design. It is.
- the positional deviation amount between the two patterns can be measured by the following method. First, the first exposure is performed through a mask. Next, the second exposure is performed by shifting the mask by a predetermined amount from the position where the first exposure is performed. At this time, the distance between the pattern formed by the first exposure / development and the pattern formed by the second exposure / development is obtained by SEM observation, and the difference between this distance and the distance required from the circuit design is obtained. Is the amount of displacement of the pattern.
- the pellicle of the present invention is particularly suitable for double patterning because it prevents the distortion of the pellicle from being transmitted to the mask.
- Example 1 SEBS shown below as styrenic resin (A), a mixture of random polypropylene (b1) and propylene butene ethylene copolymer (b2) shown below as hardness modifier (B), polybutene (JP) as softener (C) Nissan Polybutene 30N) manufactured by Oil Co., Ltd., and Alcon P100 manufactured by Arakawa Chemical Industries, Ltd. as a tackifier (D) were weighed at a blending ratio (mass ratio) shown in Table 1 (FIG. 4), to a total of 48 g. It mixed so that it might become.
- A styrenic resin
- B a mixture of random polypropylene
- b2 propylene butene ethylene copolymer
- JP polybutene
- C Nissan Polybutene 30N
- Alcon P100 manufactured by Arakawa Chemical Industries, Ltd. Alcon P100 manufactured by Arakawa Chemical Industries, Ltd. as a tackifier (D) were weighed at
- the mixture of (A) to (D) was put into a 60 ml laboratory plast mill (manufactured by Toyo Seiki Seisakusho Co., Ltd.) and sealed. And it knead
- an anodized aluminum frame having an outer dimension of 149 mm ⁇ 122 mm ⁇ 5.8 mm and a frame thickness of 2 mm was prepared as a pellicle frame.
- the mask adhesive was applied to the end surface of the pellicle frame by extruding the molten mask adhesive from the needle tip communicating with the heating tank.
- the thickness of the obtained mask adhesive layer was 0.6 mm.
- a separator was provided on the surface of the mask adhesive layer.
- a pellicle film was attached to the end surface of the pellicle frame on the side where the mask adhesive layer was not disposed with a film adhesive separately to obtain a pellicle.
- Example 2 A mask adhesive was obtained in the same manner as in Example 1 except that the blending ratio shown in Table 1 was used. A pellicle was produced in the same manner as in Example 1 by using this mask adhesive.
- Example 5 Mask adhesive as in Example 1 except that polybutene (NISSO-PB hydrogenated PB resin GI2000) manufactured by Nippon Soda Co., Ltd. was used as the softening agent (C) and the blending ratio shown in Table 1 was used. Got. A pellicle was produced in the same manner as in Example 1 by using this mask adhesive.
- polybutene Nippon Soda Co., Ltd.
- Example 6 A mask adhesive was obtained in the same manner as in Example 1 except that the blending ratio shown in Table 1 was used. A pellicle was produced in the same manner as in Example 1 by using this mask adhesive.
- Example 1 Comparative Example 1 except that SEBS shown below as a styrenic resin (A) and polyethylene (High Wax NL100 manufactured by Mitsui Chemicals, Inc.) as a hardness adjusting agent (B) were used and the mixing ratios shown in Table 1 were used. Similarly, a mask adhesive was obtained. A pellicle was produced in the same manner as in Example 1 by using this mask adhesive.
- Styrene resin (A) SEBS (Tough Tech (R) H1062 manufactured by Asahi Kasei Chemicals Corporation) Content of structural unit derived from styrene 18% by mass Maximum value of tan ⁇ ( ⁇ 48 ° C.): 1.3 Solubility parameter (SP value): 16.8 (J / cm 3 ) 1/2
- Example 4 A mask adhesive was obtained in the same manner as in Example 1 except that SEBS (Tuftec (R) H1062 manufactured by Asahi Kasei Chemicals Corporation) was used as the styrene resin (A), and the hardness modifier (B) was not used. A pellicle was produced in the same manner as in Example 1 by using this mask adhesive.
- SEBS Teftec (R) H1062 manufactured by Asahi Kasei Chemicals Corporation
- Example 6 A mask adhesive was obtained in the same manner as in Example 1 except that the total content of the hardness adjusting agent (B) was 35.1 parts by mass. A pellicle was produced in the same manner as in Example 1 by using this mask adhesive.
- Example 7 The same as Example 1 except that SEBS (Tuftec (R) H1062 manufactured by Asahi Kasei Chemicals Corporation) was used as the styrene resin (A), and the total content of the hardness modifier (B) was 3.1 parts by mass. A mask adhesive was obtained. A pellicle was produced in the same manner as in Example 1 by using this mask adhesive.
- the island phase of the curing modifier (B) is dispersed in the sea phase of the styrenic resin (A); the island phase of the curing modifier (B) is further transformed into the sea phase of the polypropylene (b1) ( A white part) and an island phase (black part) of the propylene-based elastomer (b2) having a three-phase structure were confirmed as ⁇ , and those not confirmed as x.
- the area ratio (%) of an island phase composed of polypropylene (b1) and a propylene-based elastomer (b2) is within a range of 10 to 40% is not. The thing was made into x.
- Dynamic viscoelasticity measurement A film-like sample piece (width 5 mm ⁇ thickness 1 mm) of a mask adhesive was prepared. Then, the maximum value of tan ⁇ and the storage elastic modulus at 25 ° C. of the sample piece of the mask adhesive were measured using a dynamic viscoelasticity measuring device RSA-II manufactured by TA Instruments. The measurement conditions were tensile mode, 1 Hz, measurement temperature from ⁇ 80 ° C. to 120 ° C., temperature increase rate of 3 ° C./min, initial gap of 20 mm, and nitrogen atmosphere. In Table 1, with respect to the maximum value of tan ⁇ , a value of 1.5 or more and 5 or less was marked with ⁇ , and a value other than that was marked with ⁇ . Moreover, about the storage elastic modulus in 25 degreeC, what was 4.1 * 10 ⁇ 5 > Pa * s or more and 1.0 * 10 ⁇ 9 > Pa * s or less was set to (circle), and what was not so was set to x.
- Infrared absorption spectrum A mask adhesive in the form of a thin film was obtained by sandwiching a mask adhesive between Teflon (registered trademark) sheets manufactured by Toray and hot pressing with a 200 ° C. press. Peel off the film of the mask adhesive from Toray Teflon® sheet, the infrared absorption spectrum in the range of 400cm -1 ⁇ 4000cm -1 was measured on a Varian Co. FT-IR FTS-3100. In Table 1, those absorption peaks in the region of 761cm -1 ⁇ 767cm -1 derived from 1-butene was confirmed ⁇ , and as ⁇ not to have been confirmed.
- Mask distortion amount At normal temperature, a pellicle and a mask were placed on a pellicle mounter (manufactured by Matsushita Seiki Co., Ltd.), and the pellicle was pressure-bonded to the mask.
- the pressure bonding conditions were normal temperature, a pressure of 20 kgf / cm 2 , and a pressure bonding time of 3 minutes.
- the amount of distortion of the mask on which the pellicle was mounted was measured by a flatness measurement analyzer UltraFlat 200 Mask (Corning Tropel). The measurement area was 146 mm 2 .
- the mask used was made of quartz glass and had a thickness of 6.35 mm.
- the mask on which the pellicle is mounted is usually distorted like a bow according to the distortion of the aluminum frame of the pellicle.
- the distortion state of the mask is shown as a contour diagram, and the difference between the maximum value and the minimum value of the distortion amount is displayed as the distortion value of the mask.
- the difference between the distortion value (1) of the entire mask before mounting the pellicle obtained by this method and the distortion value (2) of the entire mask after mounting the pellicle was used as the distortion amount of the mask induced by the pellicle.
- Pattern misregistration amount Semiconductor exposure apparatus ArF immersion scanner NSR-S610C (manufactured by Nikon Corporation) was used to expose a wafer twice through a mask with a pellicle mounted thereon, and the pattern was printed on the wafer.
- a 6025 substrate having a thickness of 6.35 mm and a length of 151.95 mm was used as the wafer.
- the second exposure was performed by shifting the mask from the position where the first exposure was performed. At this time, it was observed by SEM whether or not the pattern formed by the second exposure was formed at a position corresponding to the position where the mask was shifted.
- the distance between the pattern formed by the first exposure and the pattern formed by the second exposure is obtained by SEM observation, and the difference between the distance and the amount by which the mask is shifted based on the design value is calculated.
- the amount of displacement was taken. The smaller the amount of pattern displacement, the better.
- Adhesive residue and handleability Whether the mask adhesive remains on the mask after the pellicle is peeled off is applied to the mask using an illumination device (illuminance: 300,000 lux) manufactured by Sener and Burns Co., Ltd. Visual observation was performed by reflecting the surface. Further, the handling property was visually observed as to whether or not it was easily removed from the hand when touched.
- an illumination device luminance: 300,000 lux
- the transmission electron micrograph of the mask adhesive of Example 1 is shown in FIG.
- the sea phase of the styrenic resin (A) and the island phase of the hardness adjusting agent (B) are observed; the island phase of the hardness adjusting agent (B) is dyed and non-dyed. It was confirmed that it has a three-phase structure.
- the measurement result of the dynamic viscoelasticity of the mask adhesive of Example 1 is shown in FIG. The temperature when the tan ⁇ of the mask adhesive of Example 1 was the maximum was about ⁇ 16 ° C.
- the amount of mask distortion was 105 nm or less. Further, the amount of pattern displacement was 2.0 nm or less, which was sufficient for performing double patterning. Even after the pellicle was peeled off from the mask, no mask adhesive remained on the mask and no glue remained. Further, the mask adhesive was peeled off without stretching even on the hand, and the handling was also good.
- the mask adhesive of Comparative Example 6 having a high content of the hardness adjusting agent (B) is a continuous phase, and the mask adhesive of Comparative Example 7 having a small content of the hardness adjusting agent (B) is almost one phase. In either case, no sea-island structure was observed.
- the mask adhesive of Comparative Example 6 had no storage residue because the storage elastic modulus was relatively high, but the pattern misalignment amount was as large as 6 nm because the maximum value of tan ⁇ was low.
- the pellicle of the present invention has a mask adhesive layer that has moderate softness, little adhesive residue after peeling from the mask, and good handling properties. Therefore, the pellicle of the present invention is suitable for patterning that requires high patterning accuracy such as double patterning.
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Abstract
Description
[1] ペリクルフレームと、前記ペリクルフレームの一端面に配置されるペリクル膜と、前記ペリクルフレームの他端面に配置されるマスク接着剤層と、を有するペリクルであって、前記マスク接着剤層は、100質量部のスチレン系樹脂(A)に対して、ポリプロピレン(b1)およびプロピレン系エラストマー(b2)を含む、35質量部以上170質量部以下の硬度調整剤(B)を含み、前記マスク接着剤層の電子顕微鏡写真において、スチレン系樹脂(A)の連続相と、硬度調整剤(B)の分散相との相分離構造が観察される、ペリクル。
[2] 前記硬度調整剤(B)の分散相は、前記ポリプロピレン(b1)の連続相と、前記プロピレン系エラストマー(b2)の分散相とを有する、[1]記載のペリクル。
[3] 前記マスク接着剤層の、動的粘弾性におけるtanδの最大値が1.5以上5以下であり、かつ25℃における貯蔵弾性率が4.1×105Pa・s以上1×109Pa・s以下である、[1]または[2]に記載のペリクル。
[4] 前記ポリプロピレン(b1)と前記プロピレン系エラストマー(b2)の質量比は、10:90~30:70である、[1]~[3]のいずれかに記載のペリクル。
[5] 前記マスク接着剤層が、赤外吸収スペクトルにおいて、761cm-1以上767cm-1以下の領域に吸収ピークを有する、[1]~[4]のいずれかに記載のペリクル。
[6] 前記スチレン系樹脂(A)が、スチレンエチレンブチレンスチレン共重合体であり、前記ポリプロピレン(b1)が、ホモポリプロピレンまたは5モル%以下のコモノマー成分を含むランダムポリプロピレンであり、かつ前記プロピレン系エラストマー(b2)が、プロピレンブテンエチレン共重合体である、[1]~[5]のいずれかに記載のペリクル。
[8] 前記硬度調整剤(B)の分散相は、前記ポリプロピレン(b1)の連続相と、前記プロピレン系エラストマー(b2)の分散相とを有する、[7]に記載のマスク接着剤。
[9] 動的粘弾性におけるtanδの最大値が1.5以上5以下であり、かつ25℃における貯蔵弾性率が4.1×105Pa・s以上1×109Pa・s以下である、[7]または[8]に記載のマスク接着剤。
[10] 前記ポリプロピレン(b1)と前記プロピレン系エラストマー(b2)の質量比は、10:90~30:70である、[7]~[9]のいずれかに記載のマスク接着剤。
[11] 赤外吸収スペクトルにおいて、761cm-1以上767cm-1以下の領域に吸収ピークを有する、[7]~[10]のいずれかに記載のマスク接着剤。
[12] 前記スチレン系樹脂(A)が、スチレンエチレンブチレンスチレン共重合体であり、前記ポリプロピレン(b1)が、ホモポリプロピレンまたは5モル%以下のコモノマー成分を含むランダムポリプロピレンであり、かつ前記プロピレン系エラストマー(b2)が、プロピレンブテンエチレン共重合体である、[7]~[11]のいずれかに記載のマスク接着剤。
本発明のマスク接着剤は、スチレン系樹脂(A)と、ポリプロピレン(b1)およびプロピレン系エラストマー(b2)を含む硬度調整剤(B)と、必要に応じて柔軟剤(C)と、粘着付与剤(D)とを含む。
)1/2以上16.4(J/cm3)1/2である。スチレン系樹脂(A)および後述するプロピレン系エラストマー(b2)との相溶性を高めるためである。溶解度パラメーター(SP値)は、前述と同様に測定されうる。ポリプロピレン(b1)がランダムポリプロピレンである場合、ランダムポリプロピレンの溶解度パラメーター(SP値)は、コモノマーの種類や含有量により制御することができる。
本発明のペリクルは、ペリクル膜と、前記ペリクル膜の外周を支持するペリクルフレームと、前記ペリクルフレームと前記ペリクル膜とを接着させる膜接着剤と、前記ペリクルフレームと前記マスクとを接着するためのマスク接着剤とを有する。図2には、本発明のペリクルの一例が示される。ペリクル10は、ペリクル膜12と、ペリクル膜12の外周を支持するペリクルフレーム14とを有する。ペリクル膜12は、ペリクルフレーム14の一方の端面にある膜接着剤層13を介して張設されている。一方、ペリクルフレーム14をマスク(不図示)に接着させるために、ペリクルフレーム14のもう一方の端面には、マスク接着剤層15が設けられている。マスク接着剤層15は、前述のマスク接着剤から得られる。
スチレン系樹脂(A)として以下に示すSEBS、硬度調整剤(B)として以下に示すランダムポリプロピレン(b1)とプロピレンブテンエチレン共重合体(b2)との混合物、柔軟剤(C)としてポリブテン(日油株式会社製ニッサンポリブテン30N)、および粘着付与剤(D)として荒川化学工業株式会社製アルコンP100を、表1(図4)に示される配合比(質量比)で秤量し、全体で48gになるように混合した。
SEBS(旭化成ケミカルズ株式会社製タフテック(R)H1221)
スチレンに由来する構成単位の含有量12質量%
tanδの最大値(-30℃):2.0
溶解度パラメーター(SP値):16.7(J/cm3)1/2
ランダムポリプロピレン(b1)とプロピレンブテンエチレン共重合体(b2)とを15/85の質量比で混合した混合物
tanδの最大値(-20℃):1.0
25℃での貯蔵弾性率:1.1×107Pa・s
(b1)ランダムポリプロピレン(C2/C3モル%=1/99)
25℃での貯蔵弾性率:3×107Pa・s
引張弾性率:1600MPa
密度:910Kg/m3
溶解度パラメーター(SP値):16.2(J/cm3)1/2
(b2)プロピレンブテンエチレン共重合体(C2/C3/C4モル%=13/68/19)
25℃での貯蔵弾性率:8×106Pa・s
溶解度パラメーター(SP値):16.2(J/cm3)1/2
表1に示される配合比とした以外は、実施例1と同様にしてマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
柔軟剤(C)として、日本曹達株式会社製ポリブテン(NISSO-PB水素添加型PB樹脂GI2000)を用い、かつ表1に示される配合比とした以外は、実施例1と同様にしてマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
表1に示される配合比とした以外は、実施例1と同様にしてマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
スチレン系樹脂(A)として以下に示すSEBSを、硬度調整剤(B)としてポリエチレン(三井化学株式会社製ハイワックスNL100)を用いて、表1に示される配合比とした以外は、実施例1と同様にマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
スチレン系樹脂(A)
SEBS(旭化成ケミカルズ株式会社製タフテック(R)H1062)
スチレンに由来する構成単位の含有量18質量%
tanδの最大値(-48℃):1.3
溶解度パラメーター(SP値):16.8(J/cm3)1/2
スチレン系樹脂(A)としてSEBS(旭化成ケミカルズ株式会社製タフテック(R)H1062)を、硬度調整剤(B)としてポリプロピレン(三井化学株式会社製ハイワックスNP055)を用いて、表1に示される配合比とした以外は、実施例1と同様にマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
スチレン系樹脂(A)としてSEBS(旭化成ケミカルズ株式会社製タフテック(R)H1062)を用い、硬度調整剤(B)を用いなかった以外は実施例1と同様にマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
硬度調整剤(B)として、エチレン・ブテン共重合体(C2/C3モル%=89/11)を用いて、表1に示される配合比とした以外は、実施例1と同様にマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
硬度調整剤(B)の合計含有量を35.1質量部とした以外は、実施例1と同様に、マスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
スチレン系樹脂(A)としてSEBS(旭化成ケミカルズ株式会社製タフテック(R)H1062)を用い、かつ硬度調整剤(B)の合計含有量を3.1質量部とした以外は、実施例1と同様にマスク接着剤を得た。このマスク接着剤を用いて、実施例1と同様にペリクルを作製した。
凍結させたマスク接着剤をミクロトームで切り出した薄片(厚さ0.1μm)を、四酸化ルテニウム染色した。この薄片を日立製作所製透過型電子顕微鏡H-7650により観察した。TEM観察面積は1350μm2とし、倍率は5000倍とした。
表1において、スチレン系樹脂(A)の海相の中に、硬化調整剤(B)の島相が分散し;硬化調整剤(B)の島相が、さらにポリプロピレン(b1)の海相(白い部分)と、プロピレン系エラストマー(b2)の島相(黒い部分)とを有する、3相構造が確認されたものを○、確認されなかったものを×とした。また、3相構造が確認された場合において、ポリプロピレン(b1)とプロピレン系エラストマー(b2)とからなる島相の面積比(%)が10~40%の範囲内にあるものを○、そうでないものを×とした。
マスク接着剤のフィルム状試料片(幅5mm×厚さ1mm)を用意した。そして、マスク接着剤の試料片のtanδの最大値および25℃での貯蔵弾性率を、TAインスツルメンツ社製 動的粘弾性測定装置RSA-IIを用いて測定した。測定条件は、引張モード、1Hz、測定温度-80℃~120℃、昇温速度3℃/分、初期Gap20mm、窒素雰囲気下とした。
表1において、tanδの最大値について、1.5以上5以下であるものを○、そうでないものを×とした。また、25℃での貯蔵弾性率について、4.1×105Pa・s以上1.0×109Pa・s以下であるものを○、そうでないものを×とした。
マスク接着剤を東レ製テフロン(登録商標)シートに挟んで、200℃のプレス機で熱プレスすることで、薄いフィルム状のマスク接着剤を得た。マスク接着剤のフィルムを東レ製テフロン(登録商標)シートから剥がして、Varian社製FT-IR FTS-3100で400cm-1~4000cm-1の範囲の赤外線吸収スペクトルを測定した。
表1において、1-ブテンに由来する761cm-1~767cm-1の領域の吸収ピークが確認されたものを○、確認されなかったものを×とした。
常温下において、ペリクルマウンター(松下精機株式会社製)にペリクルとマスクを設置して、ペリクルをマスクに圧着させた。圧着条件は、常温にて、圧力を20kgf/cm2とし、圧着時間を3分間とした。このときの、ペリクルが装着されたマスクの歪み量を、平面度測定解析装置UltraFlat200Mask(Corning Tropel社製)により測定した。測定面積は146mm2とした。マスクは、材質が石英ガラスで、厚みが6.35mmであるものを用いた。
マスクの歪み量は、小さいほど好ましく、0(歪みがない)が最も好ましい。
半導体露光装置 ArF液浸スキャナー NSR-S610C(株式会社ニコン製)を用いて、ペリクルが装着されたマスクを介してウエハを2回露光して、ウエハにパターンを焼き付けた。ウエハは、厚さ6.35mm、長さ151.95mmの6025基板を用いた。具体的には、1回目の露光を行った位置から、マスクをずらして2回目の露光を行った。このときの、2回目の露光により形成されるパターンが、マスクをずらした位置に対応した位置に形成されたかどうかを、SEMにより観察した。1回目の露光で形成されたパターンと、2回目の露光で形成されたパターンとの距離をSEM観察により求めて、その距離と、設計値に基づいてマスクをずらした量との差をパターンの位置ずれ量とした。
パターンの位置ずれ量は、小さいほど好ましい。
ペリクルを剥がした後の、マスク上にマスク接着剤が残るか否かを、セナーアンドバーンズ(株)製照明装置(照度 30万ルクス)を用いて照明をマスクに当て、マスク表面を反射させることにより目視観察した。また、ハンドリング性は、手に触れたときに、手から離れやすいか否かを目視観察した。
12 ペリクル膜
13 膜接着剤層
14 ペリクルフレーム
15 マスク接着剤層
Claims (12)
- ペリクルフレームと、
前記ペリクルフレームの一端面に配置されるペリクル膜と、
前記ペリクルフレームの他端面に配置されるマスク接着剤層と、を有するペリクルであって、
前記マスク接着剤層は、100質量部のスチレン系樹脂(A)に対して、ポリプロピレン(b1)およびプロピレン系エラストマー(b2)を含む、35質量部以上170質量部以下の硬度調整剤(B)を含み、
前記マスク接着剤層の電子顕微鏡写真において、スチレン系樹脂(A)の連続相と、硬度調整剤(B)の分散相との相分離構造が観察される、ペリクル。 - 前記硬度調整剤(B)の分散相は、
前記ポリプロピレン(b1)の連続相と、前記プロピレン系エラストマー(b2)の分散相とを有する、請求項1に記載のペリクル。 - 前記マスク接着剤層の、動的粘弾性におけるtanδの最大値が1.5以上5以下であり、かつ25℃における貯蔵弾性率が4.1×105Pa・s以上1×109Pa・s以下である、請求項1に記載のペリクル。
- 前記ポリプロピレン(b1)と前記プロピレン系エラストマー(b2)の質量比は、10:90~30:70である、請求項1に記載のペリクル。
- 前記マスク接着剤層が、赤外吸収スペクトルにおいて、761cm-1以上767cm-1以下の領域に吸収ピークを有する、請求項1に記載のペリクル。
- 前記スチレン系樹脂(A)が、スチレンエチレンブチレンスチレン共重合体であり、
前記ポリプロピレン(b1)が、ホモポリプロピレンまたは5モル%以下のコモノマー成分を含むランダムポリプロピレンであり、かつ
前記プロピレン系エラストマー(b2)が、プロピレンブテンエチレン共重合体である、請求項1に記載のペリクル。 - ペリクルをマスクに固定するためのマスク接着剤であって、
100質量部のスチレン系樹脂(A)に対して、ポリプロピレン(b1)およびプロピレン系エラストマー(b2)を含む、35質量部以上170質量部以下の硬度調整剤(B)を含み、
電子顕微鏡写真において、スチレン系樹脂(A)の連続相と、硬度調整剤(B)の分散相との相分離構造が観察される、マスク接着剤。 - 前記硬度調整剤(B)の分散相は、
前記ポリプロピレン(b1)の連続相と、前記プロピレン系エラストマー(b2)の分散相とを有する、請求項7に記載のマスク接着剤。 - 動的粘弾性におけるtanδの最大値が1.5以上5以下であり、かつ25℃における貯蔵弾性率が4.1×105Pa・s以上1×109Pa・s以下である、請求項7に記載のマスク接着剤。
- 前記ポリプロピレン(b1)と前記プロピレン系エラストマー(b2)の質量比は、10:90~30:70である、請求項7に記載のマスク接着剤。
- 赤外吸収スペクトルにおいて、761cm-1以上767cm-1以下の領域に吸収ピークを有する、請求項7に記載のマスク接着剤。
- 前記スチレン系樹脂(A)が、スチレンエチレンブチレンスチレン共重合体であり、
前記ポリプロピレン(b1)が、ホモポリプロピレンまたは5モル%以下のコモノマー成分を含むランダムポリプロピレンであり、かつ
前記プロピレン系エラストマー(b2)が、プロピレンブテンエチレン共重合体である、請求項7に記載のマスク接着剤。
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| CN201080041077.3A CN102511019B (zh) | 2009-10-07 | 2010-10-06 | 薄膜及其掩模粘接剂 |
| US13/500,513 US8685598B2 (en) | 2009-10-07 | 2010-10-06 | Pellicle and mask adhesive therefor |
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| CN103443706A (zh) * | 2011-05-18 | 2013-12-11 | 旭化成电子材料株式会社 | 表膜、表膜用粘合剂、带表膜的光掩膜及半导体元件的制造方法 |
| US20140170535A1 (en) * | 2011-05-18 | 2014-06-19 | Asahi Kasei E-Materials Corporation | Pellicle, pressure-sensitive adhesive for pellicle, photomask with pellicle, and method for manufacturing semiconductor device |
| US9310673B2 (en) * | 2011-05-18 | 2016-04-12 | Asahi Kasei E-Materials Corporation | Pellicle, pressure-sensitive adhesive for pellicle, photomask with pellicle, and method for manufacturing semiconductor device |
| CN103443706B (zh) * | 2011-05-18 | 2016-08-17 | 旭化成株式会社 | 表膜、表膜用粘合剂、带表膜的光掩膜及半导体元件的制造方法 |
| JP2023515844A (ja) * | 2020-03-09 | 2023-04-14 | ザ プロクター アンド ギャンブル カンパニー | 制御層を有するエラストマー積層体及びその方法 |
| JP2024059801A (ja) * | 2020-03-09 | 2024-05-01 | ザ プロクター アンド ギャンブル カンパニー | 制御層を有するエラストマー積層体及びその方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120202144A1 (en) | 2012-08-09 |
| TWI490295B (zh) | 2015-07-01 |
| CN102511019B (zh) | 2014-08-13 |
| JPWO2011043071A1 (ja) | 2013-03-04 |
| TW201118140A (en) | 2011-06-01 |
| CN102511019A (zh) | 2012-06-20 |
| JP5586618B2 (ja) | 2014-09-10 |
| US8685598B2 (en) | 2014-04-01 |
| KR20120046791A (ko) | 2012-05-10 |
| KR101306352B1 (ko) | 2013-09-09 |
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