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WO2010128001A1 - Actionneur piézoélectrique comportant des broches de contact électriques - Google Patents

Actionneur piézoélectrique comportant des broches de contact électriques Download PDF

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Publication number
WO2010128001A1
WO2010128001A1 PCT/EP2010/055929 EP2010055929W WO2010128001A1 WO 2010128001 A1 WO2010128001 A1 WO 2010128001A1 EP 2010055929 W EP2010055929 W EP 2010055929W WO 2010128001 A1 WO2010128001 A1 WO 2010128001A1
Authority
WO
WIPO (PCT)
Prior art keywords
intermediate element
piezoelectric actuator
stack
contact pin
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2010/055929
Other languages
German (de)
English (en)
Inventor
Herbert J. Thanner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of WO2010128001A1 publication Critical patent/WO2010128001A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins

Definitions

  • a piezoelectric actuator in multilayer construction in which piezoelectric layers and electrode layers are arranged alternately one above the other to form a stack, the electrode layers leading out of the stack on opposite sides of the stack and electrically connected to a contact pin via an outer electrode.
  • the stack expands perpendicular to the electric field resulting from the applied voltage.
  • a valve piston of a control valve is actuated, which serves as an injection valve in a motor vehicle.
  • a piezoelectric actuator is described, for example, in WO 2005/035971 A1, DE 196 48 545 A1 and DE 199 45 933 C1.
  • piezoelectric actuator in multilayer construction specified, in which piezoelectric layers and electrode layers are arranged alternately stacked, the electrode layers on opposite sides of the stack lead out of this and electrically connected via an outer electrode to a contact pin, wherein an electrical connection between a the outer electrodes and a contact pin is made via a conductive intermediate element.
  • the second outer electrode can be connected to a contact pin in the same way.
  • piezoelectric actuator which has a plurality of thin films of piezoceramic, which are arranged to form a stack. These films are made, for example, from lead zirconate titanate. Between the layers of piezoceramic lie electrode layers. However, it is not absolutely necessary to apply an electrode layer to each film of piezoceramic. Depending on the desired voltage-dependent behavior of the piezo stack, for example, only every second layer of piezoceramic can be provided with an electrode layer. In order to form these electrode layers, a metal paste, for example, a silver palladium paste or a copper-containing paste may be applied to the films by a screen printing method.
  • a metal paste for example, a silver palladium paste or a copper-containing paste may be applied to the films by a screen printing method.
  • the electrode layers do not extend over the entire surface of a film of piezoceramic in a piezo stack in which the electrode layers alternately lead out of the piezo stack.
  • the respective free surfaces on a film of piezoceramics, in which adjacent electrode layers do not overlap in the stacking direction, are called inactive zones. Those with an electrode Layered surfaces which have an overlap with electrode layers adjacent in the stacking direction are referred to as the active zone.
  • a construction of a piezo stack, in which active and inactive zones are formed, allows, for example, a common connection of all electrode layers with the same polarity.
  • a disadvantage of a piezo stack construction, in which active and inactive zones are formed, is that tensions and breakages often occur at the transitional areas between active and inactive zones.
  • the outer electrodes are applied to two opposite outer surfaces of the piezo stack.
  • An outer electrode is made, for example, by means of a stoving paste applied to the outside of the stack by a screen printing process. Then it is sintered with the piezo stack.
  • a wire harp In order to conductively connect these external electrodes to a contact pin and via this to an external voltage source, it is possible, for example, to use what is known as a wire harp.
  • Such a wire harp connects the electrode layers via the outer electrode to the contact pin by means of a thin wire.
  • This electrically conductive wire is wound in a plurality of turns around the piezo stack and the terminal pins. Subsequently, this is soldered to the outer electrode and the contact pins.
  • the existing wire connections between the two outer electrodes cut and completely removed the connection to completely isolate the two outer electrodes from each other.
  • a passivation can be applied to protect against external influences.
  • a film may be applied to the edges of the piezo stack as edge protection. Subsequently, this body can be put in sleeves and shed with plastic such as silicone.
  • a conductive intermediate element which consists of as few individual parts as possible, preferably of a single part, and at the same time is stable against stresses such as occur in a piezo stack described above.
  • the intermediate element extends over the entire length of the outer electrode.
  • the outer electrode is extended over the entire length of the piezo stack, all electrode layers of the same polarity are contacted together.
  • the conductive intermediate element is attached to the outer electrode.
  • the intermediate element has the task of ensuring a stable connection between the outer electrode and a contact pin.
  • each turn of the wire spiral can be soldered to the outer electrode.
  • the piezoelectric actuator a contact point between the intermediate element and the Tear off the outer electrode, so the piezoelectric actuator remains operational, because the power supply can be maintained over the other turns.
  • the conductive intermediate element has a cylindrical shape.
  • the intermediate element for example, a cylindrical intermediate element, arranged laterally from the piezo stack.
  • the piezoelectric actuator is free of intermediate elements which enclose the piezoelectric stack.
  • the intermediate element can be arranged and fixed in a particularly simple manner on the piezo stack.
  • the intermediate element is in front of the attachment to the piezo stack in its final outer shape, is introduced in this form to the piezo stack and attached to an outside of the piezo stack.
  • the piezo stack is in a cylindrical intermediate element outside the interior of the cylindrical shape.
  • the conductive intermediate element is a wire spiral.
  • cylindrical wire spiral as an intermediate element, it is possible to produce an electrical connection at a plurality of locations on the outer electrode.
  • the wire spiral used is elastic. This contributes to a transmission of vibrations is reduced to the contact pin, because the wire spiral due to their elastic properties can dampen the strains and vibrations of the piezo stack.
  • the contact pin For example, it can be soldered to this wire spiral and thus remains firmly connected to the outer electrode, and thus the stack, and is thus held in its position.
  • An elastic intermediate element which can expand and contract together with the piezo stack, is particularly advantageous if, for example, an AC voltage is applied to the piezo stack and the stack then expands or contracts with each change of voltage.
  • an AC voltage is applied to the piezo stack and the stack then expands or contracts with each change of voltage.
  • cracks may form on the outside of the piezo stack, which, if an inelastic intermediate element is used, may in places tear off individual contact points or damage the outer electrode. In the worst case, this would lead to a complete failure of the piezoelectric actuator.
  • the piezoactuator actuates a valve piston of a control valve which serves as an injection valve in a motor vehicle, then the piezoactuator must be exchanged immediately in order to ensure further operation of the injection valve and thus of the engine.
  • the number of turns per unit length of the spiral and the number of electrode layers per unit length of the piezo stack should not differ from each other by more than 20%.
  • a spiral has a certain number of turns. These turns of the spiral are connected to the electrode layers via the outer electrode. So that the wire spiral can optimally adapt to the length of the stack, it must be stretchable between the contact points and have a spring constant adapted to the required load capacity. Since the expansion of the stack when applying a voltage is proportional to the number of layers of piezoceramic, it is necessary to adapt the spring constant of the wire spiral to this situation. This can be achieved, for example, by adjusting the turns per unit length, by using another material for the spiral, or by changing the shape of the spiral.
  • a pin receptacle for receiving the contact pin is provided on the intermediate element.
  • the pin receptacle can form an integral part of the intermediate element.
  • the contact pin can be firmly connected to the intermediate element, and thus to the piezo stack.
  • the contact pin is always conductively connected to the piezo stack and is located at the same distance from the stack.
  • the pin receptacle comprises a plurality of elements.
  • the advantage is that the arrangement of the contact pins with respect to the piezo stack is more stable and the Contact pins in the course can not move.
  • the more points the contact pin is connected to the intermediate element the less likely it is that the electrical contact between the contact pin and the intermediate element is interrupted by the stresses occurring in the piezoelectric stack.
  • the piezo stack with the attached intermediate element and contact pin is preferably potted in the course of production, it is important that the contact pins are located at a fixed distance from the piezo stack and that they have a fixed alignment with respect to the piezo stack.
  • This alignment with respect to the piezo stack can be achieved by using an intermediate element which has the necessary rigidity and strength to prevent a rotation or displacement of the contact pins with respect to the piezo stack.
  • the pin holder has at least one ring. It is preferably provided that the pin receptacle comprises a plurality of rings. The at least one ring of the pin receptacle can be formed by a wire section.
  • the rings of the pin receptacle can tightly enclose the contact pin, or they can also be firmly soldered to the contact pin. It is also possible that the contact pin closely enclosing rings are soldered to this. Thus, the contact pin is mechanically held in the immediate vicinity of the intermediate element.
  • the rings of the pin holder can be attached to both the intermediate element, as well as to the contact pins.
  • the pin receptacle comprises a plurality of elements, and these are arranged at a distance from each other.
  • the piezo stack, the intermediate element and the contact pin are arranged parallel to each other.
  • a contact pin is held by means of an intermediate element at a constant distance from the piezo stack.
  • the pins fit into predetermined connections. This can be achieved by the contact pins are arranged at a fixed distance from each other and have a fixed orientation to each other and to the piezo stack. This can be achieved for example by means of a cylindrical wire spiral.
  • a contact pin is attached to an intermediate element in a first step. This intermediate element is then brought, with the contact pin attached thereto, to the piezo stack and soldered there to the outer electrode of the piezo stack.
  • the contact pins and the intermediate elements can be produced in advance and then only have to be attached to the outer electrode of the piezo stack.
  • FIG. 1 a shows a piezoelectric actuator with contact pins connected to the electrode layers via an intermediate element
  • FIG. 1 b shows a top view of a piezoactuator with a contact pins connected to the electrode layers via an intermediate element
  • FIG. 2b shows a wire spiral with attached pin holder and a contact pin mounted in the pin holder
  • Figure 2c as two wire spirals are connected with mounted in the pin holder contact pin with a piezo stack.
  • FIG. 1a schematically shows a side view of a piezoelectric actuator 10.
  • the electrode layers 20 can be seen clearly, which lead out of the piezoelectric stack 12 alternately.
  • the outer electrode 18 is applied, wherein in the representation used here, only the right outer electrode 18 is visible.
  • a cylindrical wire spiral 16 is conductively connected to the outer electrode 18 via a plurality of contact points, so that the electrode layers 20 leading out of the piezoelectric stack 12 on the respective side can be electrically conductively connected to the outside via this connection. Such a connection is made via the attached to the cylindrical wire spiral 16 pins 14.
  • contact pins 14 are each surrounded by two spaced-mounted rings which serve as a pin recording. By means of these contact pins 14, a voltage can be applied to the piezoelectric stack 12. The fact that the rings are not soldered to the contact pins 14, but only close tightly with them, the entire construction is stable but still flexible.
  • FIG. 1 b shows a plan view of the piezo stack 12 described in FIG. 1 a. However, this is additionally enveloped by a potting compound 26 which serves for stability, as well as protection against contamination. In the middle of the drawing, the piezo stack 12 can be seen. On the side surfaces of the stack, the outer electrode 18, from a Baking paste, which was applied by screen printing on the piezo stack 12, shown.
  • cylindrical wire spirals 16 which are connected to the contact pins 14.
  • the diametrically opposite the contact pins part of the cylindrical wire spiral 16 is connected to the outer electrode 18 via different contact points 24.
  • the whole structure is surrounded by a potting compound 26, such as silicone.
  • the cylindrical wire spirals 16 are arranged laterally from the piezo stack 12. The piezo stack 12 is not enclosed by turns of the wire spirals 16.
  • Figure 2a shows a first step to establish a connection between an outer electrode 18 and an external applied electrical voltage source.
  • a cylindrical wire spiral 16 which has a pin receptacle 22, connected to a contact pin 14.
  • Figure 2b shows a cylindrical wire spiral 16 which is connected to a spring pin.
  • the pin receptacle is designed in the illustrated case of two spaced-apart rings, which firmly surround the contact pin and hold it so stable.
  • This cylindrical wire spiral 16 with the attached contact pin 14 is very easy to produce, inexpensive to manufacture and can be prefabricated to be attached to the piezo stack in a single step.
  • FIG. 2c shows a piezo stack with electrode layers leading out of the piezoelectric stack and external electrodes 18 applied on opposite sides.
  • An already prefabricated cylindrical wire spiral 16, which is connected to a contact pin 14, is now brought to each of these external electrodes 18.
  • the contact pins 14 diametrically opposite part of the cylindrical wire spiral 16 over the entire length of the piezo stack 12 and thus the outer electrode 18 by means of vapor phase soldering to the outer electrode 18 is attached.
  • This piezo stack 12 with the two attached cylindrical wire spirals 16 and the contact pins 14, can then be potted with a potting compound 26, such as silicone.

Landscapes

  • Fuel-Injection Apparatus (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

Abstract

L'invention concerne un actionneur piézoélectrique (10) multicouche, dans lequel des couches piézoélectriques et des couches d'électrodes (20) sont superposées en alternance pour former un empilement, lesdites couches d'électrodes (20) sortant de l'empilement sur des côtés opposés de ce dernier et étant connectées électriquement à une broche de contact (14) par l'intermédiaire d'une électrode extérieure (18), un contact électrique entre l'électrode extérieure (18) et la broche de contact (14) étant établi au moyen d'un élément intermédiaire conducteur. L'invention concerne également un procédé pour monter un élément intermédiaire sur un empilement piézoélectrique afin de créer une connexion simple et stable entre l'électrode extérieure (18) et une source de tension extérieure.
PCT/EP2010/055929 2009-05-07 2010-04-30 Actionneur piézoélectrique comportant des broches de contact électriques Ceased WO2010128001A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009020238.2 2009-05-07
DE102009020238.2A DE102009020238B4 (de) 2009-05-07 2009-05-07 Piezoaktor mit elektrischen Kontaktierungsstiften und Verfahren zum Kontaktieren eines Piezoaktors

Publications (1)

Publication Number Publication Date
WO2010128001A1 true WO2010128001A1 (fr) 2010-11-11

Family

ID=42666435

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2010/055929 Ceased WO2010128001A1 (fr) 2009-05-07 2010-04-30 Actionneur piézoélectrique comportant des broches de contact électriques

Country Status (2)

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DE (1) DE102009020238B4 (fr)
WO (1) WO2010128001A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011114194A1 (de) * 2011-09-22 2013-03-28 Epcos Ag Piezoelektrisches Aktorbauelement

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004019423A2 (fr) * 2002-08-13 2004-03-04 Robert Bosch Gmbh Actionneur piezoelectrique
DE102006006077A1 (de) * 2006-02-09 2007-08-16 Siemens Ag Piezokeramischer Vielschicht-Aktor, Verfahren zum Herstellen eines piezokeramischen Vielschicht-Aktors und Einspritzsystem
DE102006032743A1 (de) * 2006-07-14 2008-01-17 Robert Bosch Gmbh Aktor zum Hubantrieb eines Stellglieds

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19648545B4 (de) 1996-11-25 2009-05-07 Ceramtec Ag Monolithischer Vielschichtaktor mit Außenelektroden
DE19715488C1 (de) * 1997-04-14 1998-06-25 Siemens Ag Piezoaktor mit neuer Kontaktierung und Herstellverfahren
DE19945933C1 (de) 1999-09-24 2001-05-17 Epcos Ag Piezoaktor mit isolationszonenfreier elektrischer Kontaktierung und Verfahren zu dessen Herstellung
WO2005035971A1 (fr) 2003-10-14 2005-04-21 Siemens Aktiengesellschaft Actionneur piezoelectrique et procede de production associe
CN1878948B (zh) * 2003-11-12 2010-05-12 西门子公司 执行机构的接触垫和相应的制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004019423A2 (fr) * 2002-08-13 2004-03-04 Robert Bosch Gmbh Actionneur piezoelectrique
DE102006006077A1 (de) * 2006-02-09 2007-08-16 Siemens Ag Piezokeramischer Vielschicht-Aktor, Verfahren zum Herstellen eines piezokeramischen Vielschicht-Aktors und Einspritzsystem
DE102006032743A1 (de) * 2006-07-14 2008-01-17 Robert Bosch Gmbh Aktor zum Hubantrieb eines Stellglieds

Also Published As

Publication number Publication date
DE102009020238A1 (de) 2010-11-11
DE102009020238B4 (de) 2017-10-19

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