WO2010123059A1 - Method for manufacturing led light emitting device - Google Patents

Abstract

Provided is a method for manufacturing an LED light emitting device, wherein wavelength conversion members are easily sorted and managed, light emitting colors and luminance of the LED light emitting device are easily controlled and a high yield is achieved. The method is provided for manufacturing the LED light emitting device, which is provided with a base body having a recessed part opened on the upper end surface, and an LED element mounted on the bottom surface of the recessed part, and has a translucent sealing member sealing the LED element, and the wavelength conversion member containing a fluorescent material laminated in this order from the side of the bottom surface of the recessed part. The method is provided with: a laminating step of manufacturing a laminated body having the wavelength conversion member laminated on the translucent substrate; a mounting step of mounting the LED element on the bottom surface of the recessed part of the base body; a filling step of filling the recessed part, which is of the base body and has the LED element mounted thereon, with a translucent sealing resin; and a mounting step of, prior to curing the translucent sealing resin, covering the opening of the recessed part filled with the translucent sealing resin in the base body with the laminated body such that the wavelength conversion member faces the bottom surface of the recessed part.

Description

Manufacturing method of LED light emitting device

The present invention relates to a method of manufacturing an LED light emitting device with a high yield, in which the wavelength conversion member can be easily analyzed, classified, and managed, the light emitting color and illuminance of the LED light emitting device can be easily controlled.

Conventionally, LED light emission that emits light of a color different from the light emission color of LED elements including white by combining LED elements that emit blue light or ultraviolet rays with various phosphors using a gallium nitride compound semiconductor Devices have been developed (Patent Document 1). Such LED light emitting devices using LED elements have advantages such as small size, power saving, and long life, and are widely used as display light sources and illumination light sources.

As such an LED light emitting device, a device in which an LED element is mounted in the concave portion of a base in which a concave portion is formed, and a sealing layer covering the LED element and a phosphor layer are laminated in this order are known. (Patent Document 1). Since such a thing is equipped with the sealing layer, it is excellent in the extraction efficiency of the light from an LED element, and can prevent the thermal deterioration of fluorescent substance.

In order to manufacture such an LED light-emitting device, a wavelength conversion resin composition in which a transparent resin for sealing is filled in a concave portion of a substrate on which an LED element is mounted and cured, and then a phosphor is dispersed thereon. Inject things.

The wavelength-converting resin composition in which the phosphor is dispersed is prepared by adjusting a plurality of LED light emitting devices at a time and then injecting a predetermined amount, but the phosphor-dispersed state in the wavelength-converting resin composition Changes over time, so even with LED light-emitting devices with the same specifications, the color of the emitted color and the illuminance will vary slightly from lot to lot. Moreover, there are variations in the emission color and illuminance of the LED elements, which also causes variations in the emission color and illuminance of the LED light-emitting device that is the final product. When the obtained LED light-emitting device is used as a light source for an inspection apparatus, there is a problem because the reliability of the inspection result is impaired if there is even such a slight variation.

For this reason, the LED light emitting device, which is the final product in the past, is inspected for the color of the emitted color and the illuminance to eliminate those that deviate from the allowable range.

Also, recently, the output of the LED element has been increased, so that the amount of heat generated by the LED element is remarkably increased, and the LED element itself is deteriorated by the heat. Further, since the phosphor is also vulnerable to heat, it is generally said that the phosphor is thermally deteriorated by heat transfer from the LED element.

Therefore, conventionally, a heat sink is laid under the LED element to dissipate heat. However, in practice, when the phosphor is excited by, for example, near ultraviolet rays or ultraviolet rays, the phosphors are remarkably heated. The present inventor discovered for the first time through intensive studies the fact that it promotes its own deterioration. When the LED element is mounted on a heat dissipation substrate, and the LED element is covered with a sealing layer, and further covered with a phosphor layer, an experiment was performed under conditions of an applied voltage of 3.5 V and a current of 300 mA. The temperature of the upper surface of the phosphor layer is 65 ° C. despite the fact that the temperature is reduced to 85 ° C. and 55 ° C. on the upper surface of the sealing layer. It was confirmed that the exotherm of was remarkable.

JP 10-190065

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and it is easy to analyze, classify, and manage wavelength conversion members, easily control the light emission color and illuminance of the LED light emitting device, and produce a high yield LED light emitting device. The main intended task is to provide

That is, the manufacturing method of the LED light-emitting device according to the present invention includes a base having a recess opening in an upper end surface, and an LED element mounted on the bottom surface of the recess, and the light-transmitting property that seals the LED element A method of manufacturing an LED light emitting device in which a sealing member and a wavelength conversion member containing a phosphor are laminated in this order from the bottom surface side of the recess, wherein the wavelength conversion member is laminated on a translucent substrate Laminating process for producing the laminated body, mounting process for mounting the LED element on the bottom surface of the recess of the base, and filling of the concave part of the base with the LED element filled with translucent sealing resin Before curing the translucent sealing resin, the opening of the concave portion of the base filled with the translucent sealing resin so that the wavelength conversion member faces the bottom surface of the concave portion A mounting step of covering with the laminate. For example, characterized in that is.

As described above, the wavelength conversion resin composition in which the phosphor is dispersed is for adjusting a plurality of LED light emitting devices at once, but the dispersion state of the phosphor in the wavelength conversion resin composition changes with time. Therefore, even if the LED light emitting device has the same specifications, the color of the emitted color and the illuminance slightly vary from lot to lot. Moreover, there are variations in the emission color and illuminance of the LED elements, and this causes variations in the emission color and illuminance of the LED light emitting device as the final product.

On the other hand, in the present invention, the laminate of the wavelength conversion member and the translucent substrate is manufactured separately from the base on which the LED element is mounted, and then the LED element is mounted. Since the laminate is mounted on a substrate, the laminate and the laminate are measured by measuring the emission color, illuminance, and the like of the laminate using a reference light source having a predetermined wavelength and light intensity, for example, emitting near ultraviolet rays. Groups can be classified and managed according to emission color, illuminance, etc., and those having a desired emission color, illuminance, etc. can be selected and combined with suitable LEDs to produce LED light emitting devices having the desired performance. For this reason, it is possible to suppress variations in the emission color, illuminance, and the like of the LED light emitting device that is the final product as much as possible.

Moreover, since the translucent substrate also functions as a heat radiating member of the wavelength conversion member, it is possible to satisfactorily suppress a change in emission color caused by thermal degradation of the phosphor in the wavelength conversion member.

Furthermore, as a material for the translucent sealing member or the wavelength conversion member, a silicone resin having a high gas permeability may be used, but by covering the opening of the recess with the translucent substrate, Since gas can be prevented from entering the recess, even if a reflector is formed by covering the side and bottom surfaces of the recess with a silver thin film or the like, the metal thin film is corroded by oxidation, sulfidation, chlorination or the like. Etc. can be prevented. Further, the translucent substrate can also exhibit a waterproof function.

Moreover, the thickness of the wavelength conversion member can be increased from the pre-manufactured laminate by producing the laminate of the wavelength conversion member and the translucent substrate separately from the substrate on which the LED element is mounted. Since a desired one can be selected, the thickness of the wavelength conversion member can be easily controlled, and further, the distance between the LED element and the wavelength conversion member can be easily controlled. For this reason, for example, it becomes easy to cope with thermal deterioration of the phosphor.

Furthermore, since the LED element is a point light source, in order to increase the light extraction efficiency, the LED element and the phosphor are preferably close to each other, but the phosphor is deteriorated by heat from the LED element. Therefore, it is necessary to manage the distance between the phosphor and the LED element so that the balance is optimal. However, as in the past, after filling and curing the translucent sealing resin in the concave portion of the substrate on which the LED element is mounted, the wavelength conversion resin composition containing the phosphor is injected thereon. Then, depending on the state of the side surface of the recess, the viscosity of the translucent sealing resin, etc., the translucent sealing resin may rise on the side surface of the base recess and harden in a state where the interface is depressed. Even if the filling amount of the light sealing resin is strictly managed, it is difficult to manage the distance between the LED element and the phosphor (wavelength conversion member) with good reproducibility. On the other hand, as in the present invention, before the translucent sealing resin filled in the concave portion of the base body is cured, the wavelength conversion member and the translucent substrate are formed so as to cover the opening of the concave portion. By placing this laminate on the translucent resin, the distance between the LED element and the phosphor (wavelength conversion member) can be managed with good reproducibility.

In the laminating step, the wavelength conversion member may be laminated on a light-transmitting substrate so that the outer surface of the wavelength conversion member swells to produce a laminate. In the present invention, “the outer surface of the wavelength conversion member bulges” means that the wavelength conversion member and the translucent substrate are arranged such that one point on the outer surface of the wavelength conversion member is a vertex. It means that it is raised from the joint surface.

If it is such, when covering the opening of the concave portion with the laminate, first the apex on the outer surface of the wavelength conversion member is in contact with the translucent sealing resin, and the apex is the starting point. Since the contact area between the wavelength conversion member and the translucent sealing resin continuously increases, bubbles are not easily formed between the wavelength conversion member and the translucent sealing resin.

Specific examples of the laminating step include a step of applying a wavelength conversion resin composition containing a phosphor on the light-transmitting substrate and curing the wavelength conversion resin composition. When the wavelength conversion resin composition is applied by potting, management of the application amount of the wavelength conversion resin composition becomes easy. In addition, hardening the said wavelength conversion resin composition means making it a harder state than the said translucent sealing resin.

When the LED element emits ultraviolet rays, an ultraviolet cut layer may be previously laminated on the translucent substrate.

A plurality of the laminates may be manufactured in a lump. In this case, the laminating step includes a wavelength containing a phosphor on a large substrate in which a plurality of translucent substrates are integrated. The conversion resin composition is printed using, for example, an ink jet printer or the like so that a plurality of the wavelength conversion members are formed, and the wavelength conversion resin composition is cured to integrate the plurality of the laminates. And a step of cutting a large substrate on which the plurality of wavelength conversion members are formed to cut out a plurality of laminated bodies.

At this time, a wavelength conversion resin composition containing a phosphor that emits blue light (hereinafter referred to as blue phosphor) and a phosphor that emits green light (hereinafter referred to as green phosphor). And a wavelength conversion resin composition containing a phosphor that emits red light (hereinafter referred to as a red phosphor) may be printed separately, and in particular, a wavelength conversion resin containing a blue phosphor. When the composition, the wavelength conversion resin composition containing the green phosphor, and the wavelength conversion resin composition containing the red phosphor are printed in this order, the blue light emitted from the blue phosphor or the green phosphor Since the green light emitted from is not absorbed by other phosphors, the energy conversion efficiency can be increased, which is preferable.

Further, a step of attaching a translucent sealing resin to the outer surface of the wavelength conversion member may be further provided. A translucent sealing resin is attached to the outer surface of the wavelength conversion member by potting or the like to form a bulging portion, and the bulging portion first comes into contact with the translucent sealing resin filled in the concave portion. Thus, since the contact area with the translucent sealing resin is continuously expanded from the bulging portion by allowing the laminate to enter the recess, the formation of bubbles can be suppressed.

An LED light-emitting device obtained by such a manufacturing method is also one aspect of the present invention. That is, the LED light-emitting device according to the present invention includes a base body having a recess opening in an upper end surface, an LED element mounted on the bottom surface of the recess, a translucent sealing member that seals the LED element, A wavelength conversion member that is provided on the light-transmitting sealing member and contains a phosphor, and a light-transmitting substrate that is provided on the wavelength conversion member and covers the opening of the recess. It is characterized by that.

Among them, the concave portion has a truncated conical shape that expands toward the opening, and the translucent substrate is provided with a chamfered portion at the periphery of the bottom, and the chamfered portion of the translucent substrate Is preferably in close contact with the side surface of the recess, and there is a gap between the side peripheral surface of the translucent substrate and the side surface of the recess. If it is such, it is possible to store the extruded extra light-transmitting sealing resin in the gap, and the extra translucent sealing resin extruded from the translucent substrate. The substrate can also be bonded.

Further, if a protrusion is provided on the bottom surface of the wavelength conversion member, or the bottom surface of the wavelength conversion member bulges, the wavelength conversion member and the light-transmitting seal are used in the manufacturing process. It is preferable that bubbles are not easily formed between the members.

Specifically, as the LED light emitting device according to the present invention, the LED element emits near-ultraviolet radiation, and the phosphor is a red phosphor, a green phosphor, and a blue phosphor. Is mentioned.

Further, a laminate obtained by the above-described manufacturing method is also one aspect of the present invention. That is, the laminate according to the present invention is characterized in that a wavelength conversion member containing a phosphor is laminated on a translucent substrate.

From the viewpoint of ease of classification and management of the wavelength conversion member, in the mounting step, when covering the opening of the concave portion of the base body filled with the light-transmitting sealing resin with the laminate, You may make it the said translucent board | substrate face the bottom face side of the said recessed part.

That is, the manufacturing method of the LED light emitting device according to the present invention having such an aspect includes a base body having a recess opening in an upper end surface, and an LED element mounted on the bottom surface of the recess, A method of manufacturing an LED light-emitting device in which a light-transmitting sealing member to be sealed and a wavelength conversion member containing a phosphor are laminated in this order from the bottom surface side of the recess, the wavelength conversion member being transparent A laminating process for producing a laminate laminated on a light-emitting substrate, a mounting process for mounting an LED element on the bottom surface of the recess of the base, and a translucent seal in the recess of the base on which the LED element is mounted. A filling step of filling a stop resin, and before the light-transmitting sealing resin is cured, the light-transmitting substrate is formed of the opening of the recess of the base body filled with the light-transmitting sealing resin. Cover with the laminate so that it faces the bottom side of Characterized in that it comprises a mounting step.

The LED light-emitting device obtained by the manufacturing method is also one aspect of the present invention. That is, such an LED light-emitting device includes a base having a recess opening in an upper end surface, an LED element mounted on the bottom surface of the recess, a translucent sealing member that seals the LED element, A translucent substrate provided on the translucent sealing member; and a wavelength conversion member containing a phosphor provided on the translucent substrate and covering the opening of the recess. It is characterized by that.

According to the present invention having such a configuration, the wavelength conversion member can be easily classified and managed, the light emission color and illuminance of the LED light emitting device can be easily controlled, and the LED light emitting device can be manufactured with a high yield.

1 is a schematic longitudinal sectional view of an LED light emitting device according to a first embodiment of the present invention. It is a typical perspective view of the LED light-emitting device concerning the embodiment. It is a figure which shows the manufacturing process (the first half) of the LED light-emitting device which concerns on the embodiment. It is a figure which shows the manufacturing process (latter half) of the LED light-emitting device which concerns on the embodiment. It is a figure which shows the manufacturing process (option) of the LED light-emitting device which concerns on the embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on 2nd Embodiment of this invention. It is a typical perspective view of the LED light-emitting device concerning the embodiment. It is a figure which shows the manufacturing process (the first half) of the LED light-emitting device which concerns on the embodiment. It is a figure which shows the manufacturing process (latter half) of the LED light-emitting device which concerns on the embodiment. It is a figure which shows the laminated body before the cutting | disconnection of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a typical longitudinal cross-sectional view of the LED light-emitting device which concerns on other embodiment. It is a figure which shows the manufacturing process of the LED light-emitting device which concerns on other embodiment. It is a figure which shows the manufacturing process of the LED light-emitting device which concerns on other embodiment.

<First Embodiment>
Below, the manufacturing method of the LED light-emitting device which concerns on 1st Embodiment of this invention is demonstrated with reference to drawings.

First, the LED light emitting device 1 manufactured according to this embodiment will be described. As shown in FIGS. 1 and 2, the LED light-emitting device 1 seals the base 2 having a recess 22 that opens to the upper end surface 21, the LED element 3 mounted on the bottom surface 221 of the recess 22, and the LED element 3. The translucent sealing member 4 to be stopped, the wavelength conversion member 5 provided on the translucent sealing member 4, and the translucency provided on the wavelength conversion member 5 to cover the opening of the recess 22. And a substrate 6.

Each part will be described in detail.
The base 2 has a recess 22 having a truncated conical shape that opens to the upper end surface 21 and expands from the bottom surface 221 toward the opening. For example, an insulating material having high thermal conductivity such as alumina or aluminum nitride. It is made by molding a material.

The base body 2 mounts an LED element 3 to be described later on the bottom surface 221 of the recess 22, and a wiring conductor (not shown) for electrically connecting the LED element 3 to the bottom surface 221. Is formed. This wiring conductor is led to the outer surface of the LED light emitting device 1 through a wiring layer (not shown) formed inside the base 2 and connected to the external electric circuit board, whereby the LED element 3 and the external electric circuit are connected. The substrate is electrically connected.

The metal thin film 23 with high reflectivity is formed on the inner surface including the side surface 222 and the bottom surface 221 of the concave portion 22 of the base 2 by applying metal plating such as silver, and functions as a reflector.

The LED element 3 is formed, for example, by laminating a gallium nitride compound semiconductor in the order of an n-type layer, a light emitting layer, and a p-type layer on a sapphire substrate or a gallium nitride substrate. Emits ultraviolet radiation.

The LED element 3 is flip-chip mounted on the bottom surface 221 of the recess 22 using solder bumps, gold bumps, etc. with the gallium nitride compound semiconductor facing down (the bottom surface 221 side of the recess 22).

The translucent sealing member 4 is filled in the concave portion 22 and seals the LED element 3. For example, the translucent sealing member 4 is made of a silicone resin having excellent translucency and heat resistance and having a small refractive index difference from the LED element 3. It will be.

The wavelength conversion member 5 contains a phosphor inside and is provided on the translucent sealing member 4. As such a wavelength conversion member 5, for example, a phosphor is dispersed in a translucent resin such as a silicone resin that is excellent in translucency and heat resistance and has a small refractive index difference from the translucent sealing member 4. Are listed.

The phosphor contained in the wavelength conversion member 5 is not particularly limited, and examples thereof include a red phosphor, a green phosphor, a blue phosphor, and a yellow phosphor.

The translucent substrate 6 functions as a coated substrate for the wavelength conversion member 5 in the manufacturing process, and is provided on the wavelength conversion member 5 to cover the opening of the recess 22. The periphery of the bottom part and the upper end part of the translucent substrate 6 is chamfered, the chamfered part 61 formed in the bottom part is in close contact with the side surface 222 of the concave part 22, and the side peripheral surface 62 of the translucent substrate 6 and the concave part 22 are There is a gap between the side surface 222. Such a translucent substrate 6 is not particularly limited as long as it has translucency, and examples thereof include those made of diamond, sapphire, crystal, glass, plastic, and the like.

As described above, the translucent substrate 6 is used as a coated substrate for the wavelength conversion member 5, but the silicone resin constituting the translucent sealing member 4 or the wavelength conversion member 5 has a high gas permeability. By covering the opening 22 with the translucent substrate 6, it is possible to suppress gas intrusion into the recess 22, so that the metal thin film 23 formed on the inner surface of the recess 22 is oxidized, sulfided, chlorinated, etc. Corrosion and the like can be prevented. Moreover, the translucent board | substrate 6 can also express a waterproof function.

Furthermore, when the translucent substrate 6 is made of a material having a higher thermal conductivity than that of quartz, such as diamond, sapphire, or quartz, the heat of the wavelength conversion member 5 can be efficiently released through the translucent substrate 6. Therefore, thermal denaturation and thermal deterioration of the phosphor contained in the wavelength conversion member 5 can be effectively prevented.

In addition, when the inventor investigated, when the translucent substrate 6 made of quartz was used, the surface temperature of the wavelength conversion member 5 which was 65 ° C. when the translucent substrate 6 was not present was the translucent substrate 6. It was confirmed that the temperature dropped to 55 ° C.

Among the LED light-emitting devices 1, those that emit near-ultraviolet radiation are used as the LED elements 3, and those that use red phosphors, green phosphors, and blue phosphors as phosphors are near-ultraviolet radiation emitted by the LED elements 3. Red light, green light, and blue light emitted by the red phosphor, green phosphor, and blue phosphor excited by the mixture of white light and white light are emitted. And the near-ultraviolet radiation which LED element 3 emits does not affect the white which is the luminescent color of LED light-emitting device 1 substantially. For this reason, for example, when the LED element 3 emits blue light, and the blue light is configured to be mixed with light emitted from the phosphor included in the wavelength conversion member 5, the LED light emitting device Although the color unevenness due to the difference in the optical path length is likely to occur on the light emitting surface 1, the LED element 3 emits near-ultraviolet radiation, and the phosphors are a red phosphor, a green phosphor and a blue phosphor. The LED light-emitting device 1 is unlikely to cause such color unevenness.

Then, the LED element 3 that emits near-ultraviolet radiation is used, and the mixed light emitted by the LED light-emitting device 1 using a red phosphor, a green phosphor, and a blue phosphor as the phosphor is on the Planck locus. It becomes a natural white color very close to sunlight.

Next, a method for manufacturing the LED light emitting device 1 according to this embodiment will be described with reference to FIGS.

First, a predetermined amount of the wavelength conversion resin composition 5 containing a phosphor is applied onto the light-transmitting substrate 6 by potting (FIG. 3A). Thereafter, the wavelength conversion resin composition 5 applied on the translucent substrate 6 is cured by heating or irradiation with light (including ultraviolet radiation), and the wavelength conversion member 5 and the translucent substrate 6 are laminated. The laminated body 7 is produced (FIG. 3B). At this time, if the thickness of the central portion and the peripheral portion of the wavelength conversion member 5 are significantly different, uneven color tone may occur in the central portion and the peripheral portion, so the center of the semi-cured wavelength conversion member 5 The difference in thickness between the central part and the peripheral part may be corrected by flattening the part.

Subsequently, the LED element 3 is mounted on the bottom surface 221 of the concave portion 22 of the base 2, and the translucent sealing resin 4 is filled in a larger amount than necessary. By the way, when the electrical pattern is formed on the side surface of the recess 22, if the viscosity of the translucent sealing resin 4 is low, the filled translucent sealing resin 4 tends to creep up the side surface of the recess 22, The amount of climbing increases compared to the case without an electrical pattern. Then, even if the filling amount of the translucent sealing resin 4 is strictly controlled, the substantial filling amount of the translucent sealing resin 4 depends on the rising amount, and the rising amount is made constant. Since this is extremely difficult, the height of the surface of the central portion of the translucent sealing resin 4 is likely to vary. In order to suppress this phenomenon and manage the height to a certain level, in this embodiment, the amount of translucent sealing resin is increased, and when it is covered with a laminate, it is overflowing. If a resin having a high viscosity of, for example, 100 mm ² / s or more is used for the translucent sealing resin 4, the amount of scooping is reduced in the first place. This is particularly preferable for the case where an electric pattern is formed on the side surface of the recess 22. And before hardening the translucent sealing resin 4, a laminated body is set so that the opening part of the recessed part 22 filled with the translucent sealing resin 4 may face the wavelength conversion member 5 toward the bottom face 221 side of the recessed part 22. 7 (FIG. 4C).

As described above, depending on the state of the side surface of the recess 22 and the viscosity of the translucent sealing resin 4, the translucent sealing resin 4 filled in the recess 22 may rise up the side surface of the recess 22. Even if the filling amount of the translucent sealing resin 4 into the recess 22 is strictly managed, it is difficult to manage the height of the interface. On the other hand, in this embodiment, the concave portion 22 is filled with a large amount of the translucent sealing resin 4, and then the opening of the concave portion 22 filled with the translucent sealing resin 4 is formed in the laminate 7. Therefore, the distance between the wavelength conversion member 5 (phosphor) and the LED element 3 can be easily managed.

At this time, as shown in FIG. 5, a small amount of the wavelength conversion resin composition 5 is attached to the central portion of the wavelength conversion member 5 to form the protrusion 52, and the protrusion 52 is in the recess 22. The wavelength conversion member 5 and the light-transmitting sealing resin 4 are continuously formed starting from the protrusions 52 by causing the laminated body 7 to enter the recess 22 so as to first contact the light-transmitting sealing resin 4 filled. Formation of bubbles can be suppressed.

When the opening of the recess 22 is completely covered with the laminate 7, the translucent sealing resin 4 slightly protrudes into the gap between the side peripheral surface 62 of the translucent substrate 6 and the side surface 222 of the recess 22. Since the translucent sealing resin 4 such as silicone resin is transparent, there is almost no influence on the appearance and function (FIG. 4D).

Finally, the LED light emitting device 1 can be obtained by curing the translucent sealing resin 4 by heating or the like.

If it is the manufacturing method which concerns on such embodiment, after manufacturing the laminated body 7 of the wavelength conversion member 5 and the translucent board | substrate 6 as a different body from the base | substrate 2 with which the LED element 3 was mounted, LED By mounting the laminate 7 on the substrate 2 on which the element 3 is mounted, the emission color, illuminance, and the like of the laminate 7 are analyzed using a reference light source, and the group of the laminates 7 with variations in emission color and illuminance is analyzed. The LED light emitting device 1 having the desired performance can be manufactured by classifying and managing according to the above, selecting a device having a desired light emission color, illuminance, and the like and combining it with a suitable LED.

Moreover, in this embodiment, before the translucent sealing resin 4 with which the recessed part 22 was filled hardens | cures, the laminated body 7 is mounted on the translucent resin 4 so that the opening part of the recessed part 22 may be covered. Thus, the distance between the LED element 3 and the phosphor (wavelength conversion member 5) can be managed with good reproducibility. For this reason, the distance between the LED element 3 and the phosphor (wavelength conversion member 5) can be controlled so that the light extraction efficiency from the LED element and the influence of heat received by the phosphor are in an optimal balance. .

Furthermore, since the wavelength conversion resin composition 5 is applied onto the translucent substrate 6 by potting, the application amount of the wavelength conversion resin composition 5 can be easily managed.

Moreover, since the LED light-emitting device 1 obtained in this embodiment includes the translucent substrate 6 that covers the opening of the recess 22, the reflector 23, the LED element 3, and the translucent sealing in the recess 2. The member 4 and the wavelength conversion member 5 can be protected from the influence of external environmental factors such as moisture and gas, and have excellent corrosion resistance. Moreover, since the translucent board | substrate 6 functions also as a heat radiating member of the wavelength conversion member 5, the color tone change of the irradiation light resulting from the thermal deterioration of a fluorescent substance, an output fall, etc. can be suppressed favorably.

Second Embodiment
Below, 2nd Embodiment of this invention is described with reference to drawings. In the following description, differences from the first embodiment will be mainly described, and description of the same points as in the first embodiment will be omitted.

As shown in FIGS. 6 and 7, the LED light emitting device 1 manufactured according to the present embodiment has the wavelength conversion member 5 swelled on the translucent sealing member 4 toward the translucent sealing member 4. The light-transmitting substrate 6 has a truncated conical shape that expands toward the upper end so as to fit into the opening of the recess 22.

Next, a method for manufacturing the LED light emitting device 1 according to this embodiment will be described with reference to FIGS.

First, a predetermined amount of the wavelength conversion resin composition 5 containing a phosphor is applied on the upper end surface of the translucent substrate 6 installed so as to spread toward the lower end surface by potting (FIG. 8). (A)) A laminate 7 in which the outer surface of the wavelength conversion member 5 bulges is produced (FIG. 8B).

Subsequently, the concave portion 22 opening portion of the base 2 filled with the translucent sealing resin 4 is covered with the laminate 7 so that the wavelength conversion member 5 faces the bottom surface 221 side of the concave portion 22 (FIG. 9C). First, the apex P of the wavelength conversion member 5 swelled first comes into contact with the translucent sealing resin 4 (FIG. 9D). When the laminated body 7 is continuously moved into the concave portion 22, the contact area between the wavelength conversion member 5 and the translucent sealing resin 4 is continuously expanded starting from the apex P.

When the opening of the recess 22 is completely covered with the laminate 7, the translucent sealing resin 4 slightly protrudes from the periphery of the opening of the recess 22, but the translucent sealing resin 4 such as silicone resin is transparent. Therefore, there is almost no influence on the appearance and function (FIG. 9 (e)).

If it is the manufacturing method which concerns on such embodiment, the vertex P on the outer surface of the wavelength conversion member 5 will contact | connect the translucent sealing resin 4 first, and the wavelength conversion member 5 will be continuously made from the vertex P as a starting point. Since the contact area with the translucent sealing resin 4 increases, bubbles are not easily formed between the wavelength conversion member 5 and the translucent sealing resin 4.

The present invention is not limited to the above embodiment.

For example, the method of applying the wavelength conversion resin composition 5 containing a phosphor is not limited to potting, and may be dipping, for example.

In order to fabricate the laminate 7, as shown in FIG. 10, a plurality of wavelength conversion members 5 are formed on a substrate B having a size corresponding to the plurality of translucent substrates 6. The wavelength conversion resin composition 5 is printed using an ink jet printer or the like, the wavelength conversion resin composition 5 is cured, and a plurality of laminates 7 are integrally formed. The substrate B on which the conversion member 5 is formed may be cut to cut out a plurality of stacked bodies 7.

When the wavelength conversion resin composition 5 is printed on the substrate B, the wavelength conversion resin composition 5B containing the blue phosphor, the wavelength conversion resin composition 5G containing the green phosphor, and the red phosphor are contained. The wavelength conversion resin composition 5R to be printed may be printed separately in this order. By printing in this way, as shown in FIG. 11, the LED light emitting device 1 including the wavelength conversion member 5 having a three-layer structure can be obtained.

In addition, as shown in FIG. 12, the upper end portion side of the recess 22 may be cylindrical so as to be more suitable for the shape of the wavelength conversion member 5, and further, a translucent seal is formed on the outer surface of the wavelength conversion member 5. Resin 41 may be attached. Thus, the translucent sealing resin 41 is adhered to the outer surface of the wavelength conversion member 5 by potting or the like to form the bulging portion 41, and the bulging portion 41 fills the concave portion 22. By causing the laminate 7 to enter the recess 22 so as to be in contact with the stop resin 4 first, the contact area with the translucent sealing resin 4 continuously increases from the bulging portion 41. Formation can be suppressed.

Further, as shown in FIG. 13, a step portion 24 may be provided on the side surface of the concave portion 22, and the bottom surface of the red phosphor layer 5 </ b> R may be in contact with the upper end surface of the step portion 24.

Furthermore, as shown in FIG. 14, the blue phosphor layer 5B, the green phosphor layer 5G, and the red phosphor layer 5R may be reduced in this order, and the wavelength conversion member 5 may be substantially tapered.

The translucent substrate 6 in the first embodiment may be integrated with a lens as shown in FIG. Further, a lens provided as a separate body may be installed on the translucent substrate 6.

The shape of the translucent substrate 6 is not limited to the truncated cone shape, and the upper end portion of the translucent substrate 6 protrudes in the lateral direction as shown in FIG. It may be configured to be placed on the upper end surface 21, or may have a flat plate shape as shown in FIG. 16 (b). A recess may be formed on the end face. In the case shown in FIGS. 16 (a) and 16 (c), it is possible to use the base body 2 in which the concave portion 22 having a truncated conical shape similar to the above-described embodiment is formed, but FIG. 16 (b). In this case, it is necessary to use the base body 2 in which the upper end portion of the concave portion 22 has a cylindrical shape. For example, as shown in FIG. 16B, when the translucent substrate 6 has a vertically symmetrical shape, it is not necessary to pay attention to the top and bottom when the stacked body 7 is manufactured.

When the LED element 3 emits ultraviolet rays, an ultraviolet cut layer may be laminated on the translucent substrate 6 in advance. The ultraviolet cut layer may be provided on either the upper or lower surface of the translucent substrate 6.

In order to improve the light extraction efficiency, the surface exposed from the LED light emitting device 1 of the translucent substrate 6 may be subjected to an antireflection treatment such as an antireflection coating or roughening to form fine irregularities. When the wavelength conversion member formed by curing the resin composition as in the conventional LED light emitting device is located in the outermost layer, it is difficult to apply such an antireflection treatment later. Since the anti-reflection treatment may be applied to the light-transmitting substrate 6, it can be easily processed at a low cost.

The LED element 3 may not be flip-chip mounted, and may be connected to a wiring conductor provided on the base 2 using wire bonding.

From the viewpoint of the ease of classification and management of the wavelength conversion member 5, in the mounting step, when the opening of the recess 22 of the base 2 filled with the translucent sealing resin 4 is covered with the laminate 7, As shown in FIG. 17, the translucent substrate 6 may face the bottom surface 221 side of the recess 22. By doing in this way, the process of reversing up and down of the produced laminated body 7 can be omitted.

Further, when the opening of the recess 22 of the base 2 filled with the translucent sealing resin 4 is covered with the laminate 7 so that the translucent substrate 6 faces the bottom surface 221 of the recess 22, FIG. As shown in the figure, a large amount of translucent sealing resin 4 is filled in the concave portion 22 of the base 2 so as to bulge from the upper end face (FIG. 18A). Alternatively, the laminated body 7 may be placed to overflow the translucent sealing resin 4 (FIG. 18B). By doing in this way, while becoming difficult to produce a bubble between the translucent sealing member 4 and the translucent board | substrate 6, management of the height of the translucent sealing member 4 can be made easy. . In this embodiment, it is not necessary to form the wavelength conversion member 5 over the entire top surface of the translucent substrate 6, and from the viewpoint of cost and heat conduction efficiency from the wavelength conversion member 5 to the translucent substrate 6 As shown in FIG. 18, it is preferable to make the formation area of the wavelength conversion member 5 smaller than the area of the upper surface of the translucent substrate 6.

In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.

As described above, according to the present invention, the wavelength conversion member can be easily classified and managed, the light emission color and illuminance of the LED light emitting device can be easily controlled, and the LED light emitting device can be manufactured with a high yield.

DESCRIPTION OF SYMBOLS 1 ... LED light emitting device 2 ... Base | substrate 3 ... LED element 4 ... Translucent sealing member (translucent sealing resin)
5 ... wavelength conversion member (wavelength conversion resin composition containing phosphor)
6 ... Translucent substrate

Claims (17)

A translucent sealing member for sealing the LED element, and a wavelength conversion member containing a phosphor, the substrate having a recess opening on the upper end surface, and an LED element mounted on the bottom surface of the recess Is a method of manufacturing the LED light emitting device laminated in this order from the bottom side of the recess,
A laminating step for producing a laminate in which the wavelength conversion member is laminated on a light-transmitting substrate;
A mounting step of mounting the LED element on the bottom surface of the concave portion of the substrate;
A filling step of filling the concave portion of the base body on which the LED element is mounted with a translucent sealing resin;
Prior to curing the translucent sealing resin, the laminate is configured so that the opening of the concave portion of the base filled with the translucent sealing resin faces the bottom surface side of the concave portion. A method of manufacturing an LED light-emitting device. The LED light-emitting device manufacturing method according to claim 1, wherein the laminating step is a step of laminating the wavelength conversion member on a translucent substrate so that an outer surface of the wavelength conversion member swells to produce a laminate. Method. The method for producing an LED light-emitting device according to claim 1, wherein the laminating step is a step of applying a wavelength conversion resin composition containing a phosphor on the light-transmitting substrate and curing the wavelength conversion resin composition. The method for manufacturing an LED light-emitting device according to claim 1, wherein an ultraviolet cut layer is previously laminated on the translucent substrate. The manufacturing method of the LED light-emitting device of Claim 3 which apply | coats the said wavelength conversion resin composition by potting. In the laminating step, the wavelength conversion resin composition containing phosphors is formed on a large substrate in which a plurality of the translucent substrates are integrated, so that the wavelength conversion members for a plurality of wavelength conversion members are formed. Printing, curing the wavelength conversion resin composition, and producing a plurality of the laminates as a unit;
The method for manufacturing an LED light-emitting device according to claim 1, further comprising: cutting a large substrate on which the plurality of wavelength conversion members are formed, and cutting out the plurality of stacked bodies. Wavelength conversion resin composition containing phosphor that emits blue light, wavelength conversion resin composition containing phosphor that emits green light, and wavelength conversion resin composition containing phosphor that emits red light The method of manufacturing an LED light-emitting device according to claim 6, wherein the two are separately printed. Wavelength conversion resin composition containing phosphor that emits blue light, wavelength conversion resin composition containing phosphor that emits green light, and wavelength conversion resin composition containing phosphor that emits red light And the LED light-emitting device manufacturing method according to claim 7. The manufacturing method of the LED light-emitting device of Claim 1 further provided with the process of making translucent sealing resin adhere to the outer surface of the said wavelength conversion member. A base body having a recess opening in the upper end surface;
LED elements mounted on the bottom surface of the recess,
A translucent sealing member for sealing the LED element;
A wavelength conversion member provided on the translucent sealing member and containing a phosphor;
An LED light-emitting device, comprising: a translucent substrate provided on the wavelength conversion member and covering the opening of the recess. The concave portion has a truncated cone shape that expands toward the opening,
The translucent substrate has a chamfered portion formed at the periphery of the bottom,
The LED light emitting device according to claim 10, wherein the chamfered portion of the translucent substrate is in close contact with the side surface of the recess, and there is a gap between the side peripheral surface of the translucent substrate and the side surface of the recess. The LED light-emitting device according to claim 10, wherein the wavelength conversion member has a protrusion on the bottom surface. The LED light-emitting device according to claim 10, wherein the wavelength conversion member has a bulged bottom surface. The LED element emits near-ultraviolet radiation;
The LED light-emitting device according to claim 10, wherein the phosphor is a phosphor that emits red light, a phosphor that emits green light, and a phosphor that emits blue light. A laminate comprising a wavelength conversion member containing a phosphor laminated on a light-transmitting substrate. A translucent sealing member for sealing the LED element, and a wavelength conversion member containing a phosphor, the substrate having a recess opening on the upper end surface, and an LED element mounted on the bottom surface of the recess Is a method of manufacturing the LED light emitting device laminated in this order from the bottom side of the recess,
A laminating step for producing a laminate in which the wavelength conversion member is laminated on a light-transmitting substrate;
A mounting step of mounting the LED element on the bottom surface of the concave portion of the substrate;
A filling step of filling the concave portion of the base body on which the LED element is mounted with a translucent sealing resin;
Prior to curing the translucent sealing resin, the laminated portion is arranged so that the translucent substrate faces the bottom surface side of the concave portion with the translucent substrate filled with the translucent encapsulating resin. A method for manufacturing an LED light-emitting device, comprising: a mounting step of covering with a body. A base body having a recess opening in the upper end surface;
LED elements mounted on the bottom surface of the recess,
A translucent sealing member for sealing the LED element;
A translucent substrate provided on the translucent sealing member;
An LED light emitting device comprising: a wavelength conversion member including a phosphor provided on the light-transmitting substrate and covering the opening of the concave portion.

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