[go: up one dir, main page]

WO2010118183A3 - Puits de chaleur induisant une faible contrainte - Google Patents

Puits de chaleur induisant une faible contrainte Download PDF

Info

Publication number
WO2010118183A3
WO2010118183A3 PCT/US2010/030307 US2010030307W WO2010118183A3 WO 2010118183 A3 WO2010118183 A3 WO 2010118183A3 US 2010030307 W US2010030307 W US 2010030307W WO 2010118183 A3 WO2010118183 A3 WO 2010118183A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
low stress
inducing heat
stress
inducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/030307
Other languages
English (en)
Other versions
WO2010118183A2 (fr
Inventor
Mark Carbone
Eugenia Corrales
Anthony Moreland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunmodular Inc
Original Assignee
Sunmodular Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunmodular Inc filed Critical Sunmodular Inc
Priority to EP10762411A priority Critical patent/EP2417843A2/fr
Publication of WO2010118183A2 publication Critical patent/WO2010118183A2/fr
Publication of WO2010118183A3 publication Critical patent/WO2010118183A3/fr
Priority to US13/161,472 priority patent/US20110297361A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H02S40/42—Cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H10F77/63—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H10F77/63—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
    • H10F77/68—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling using gaseous or liquid coolants, e.g. air flow ventilation or water circulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un puits de chaleur induisant une faible contrainte, pouvant réduire les contraintes et déformations induites thermiquement dans la source de chaleur. Le puits de chaleur induisant une faible contrainte peut être fait de matériaux à faible conductivité thermique. Le puits de chaleur peut présenter de la souplesse dans le plan, et ainsi réduire les contraintes et déformations induites thermiquement, générées dans la source de chaleur et à l'interface du puits de chaleur et de la source de chaleur.
PCT/US2010/030307 2009-04-08 2010-04-07 Puits de chaleur induisant une faible contrainte Ceased WO2010118183A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP10762411A EP2417843A2 (fr) 2009-04-08 2010-04-07 Puits de chaleur induisant une faible contrainte
US13/161,472 US20110297361A1 (en) 2009-04-08 2011-06-15 Low Stress-Inducing Heat Sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16768509P 2009-04-08 2009-04-08
US61/167,685 2009-04-08

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/161,472 Continuation US20110297361A1 (en) 2009-04-08 2011-06-15 Low Stress-Inducing Heat Sink

Publications (2)

Publication Number Publication Date
WO2010118183A2 WO2010118183A2 (fr) 2010-10-14
WO2010118183A3 true WO2010118183A3 (fr) 2011-01-13

Family

ID=42936866

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/030307 Ceased WO2010118183A2 (fr) 2009-04-08 2010-04-07 Puits de chaleur induisant une faible contrainte

Country Status (3)

Country Link
US (1) US20110297361A1 (fr)
EP (1) EP2417843A2 (fr)
WO (1) WO2010118183A2 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8471141B2 (en) 2007-05-07 2013-06-25 Nanosolar, Inc Structures for low cost, reliable solar roofing
US9243758B2 (en) 2009-10-20 2016-01-26 Cree, Inc. Compact heat sinks and solid state lamp incorporating same
US9217542B2 (en) * 2009-10-20 2015-12-22 Cree, Inc. Heat sinks and lamp incorporating same
US9030120B2 (en) 2009-10-20 2015-05-12 Cree, Inc. Heat sinks and lamp incorporating same
US10030863B2 (en) 2011-04-19 2018-07-24 Cree, Inc. Heat sink structures, lighting elements and lamps incorporating same, and methods of making same
US20150000886A1 (en) * 2011-12-09 2015-01-01 Nanyang Technological University Apparatus for Heat Dissipation and a Method for Fabricating the Apparatus
US9425124B2 (en) * 2012-02-02 2016-08-23 International Business Machines Corporation Compliant pin fin heat sink and methods
CN102623540B (zh) * 2012-03-13 2014-12-10 友达光电股份有限公司 散热结构
EP2989659B1 (fr) * 2013-04-23 2019-06-12 Alexiou & Tryde Holding ApS Dissipateur thermique doté d'une structure de refroidissement avec une densité de structure décroissante
CN103712503A (zh) * 2013-12-27 2014-04-09 无锡佳龙换热器制造有限公司 一种高效率翅片
CN103697736A (zh) * 2013-12-27 2014-04-02 无锡佳龙换热器制造有限公司 一种高效率翅片
WO2015148778A1 (fr) 2014-03-28 2015-10-01 Sunpower Corporation Gestion thermique
US10302371B2 (en) 2014-10-20 2019-05-28 Signify Holding B.V. Low weight tube fin heat sink
US9800323B2 (en) * 2015-03-13 2017-10-24 Mission Microwave Technologies, Inc. Satellite transmitter system
CN107078115B (zh) * 2015-04-01 2019-11-08 富士电机株式会社 半导体模块
EP3526822B1 (fr) * 2016-10-14 2020-03-18 Magna Seating Inc. Dissipateur thermique en ruban de graphite flexible pour dispositif thermoélectrique
US10224268B1 (en) * 2016-11-28 2019-03-05 CoolStar Technology, Inc. Enhanced thermal transfer in a semiconductor structure
WO2018220417A1 (fr) * 2017-05-31 2018-12-06 Agile Power Switch 3D Integration Apsi3D Structure de dissipateur thermique
SE1730353A1 (sv) * 2017-12-28 2019-06-29 Andersson Inge Kylanordning
KR20230145208A (ko) * 2018-04-16 2023-10-17 로미 엠. 패인 수동 복사 냉각을 위한 제조 방법들, 구조체들, 및 용도들
CN108925119B (zh) * 2018-08-21 2023-12-19 苏州申川精密部件有限公司 一种新能源汽车控制器电路板用水冷板及其制造方法
US10907480B2 (en) * 2018-09-28 2021-02-02 Raytheon Technologies Corporation Ribbed pin fins
DE102018218831B4 (de) * 2018-11-05 2021-09-30 Robert Bosch Gmbh Kühlkörper sowie Kühlanordnung mit Kühlkörper
US10825750B2 (en) * 2018-11-13 2020-11-03 Ge Aviation Systems Llc Method and apparatus for heat-dissipation in electronics
TW202024553A (zh) * 2018-12-27 2020-07-01 圓剛科技股份有限公司 散熱裝置
US11406010B2 (en) * 2019-05-21 2022-08-02 Benchmark Electronics, Inc. Thermal management system and method therefor
EP3840216A1 (fr) * 2019-12-20 2021-06-23 Total Se Dissipateur de chaleur et panneau solaire associé
EP3840215A1 (fr) * 2019-12-20 2021-06-23 Total Se Dissipateur de chaleur et panneau solaire biface associé
WO2021186891A1 (fr) * 2020-03-18 2021-09-23 富士電機株式会社 Module semi-conducteur
TWI833063B (zh) * 2021-01-27 2024-02-21 大陸商河南烯力新材料科技有限公司 導熱結構與電子裝置
US11523547B2 (en) * 2021-05-04 2022-12-06 Vertiv Corporation Electrical devices with buoyancy-enhanced cooling
CN115064502A (zh) * 2022-05-18 2022-09-16 电子科技大学 热管控微流道ltcc-m封装基板及其制造方法
KR102615671B1 (ko) * 2022-10-12 2023-12-19 레몬메탈 주식회사 열전달 부재

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252066A (ja) * 1996-03-15 1997-09-22 Mitsubishi Electric Corp ヒートシンク
KR20020013982A (ko) * 2000-08-10 2002-02-25 이종구 핀형상 휜을 가진 히트싱크
US20030131973A1 (en) * 2000-09-20 2003-07-17 Rajesh Nair Uniform heat dissipating and cooling heat sink
US20030221814A1 (en) * 2002-06-03 2003-12-04 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09252066A (ja) * 1996-03-15 1997-09-22 Mitsubishi Electric Corp ヒートシンク
KR20020013982A (ko) * 2000-08-10 2002-02-25 이종구 핀형상 휜을 가진 히트싱크
US20030131973A1 (en) * 2000-09-20 2003-07-17 Rajesh Nair Uniform heat dissipating and cooling heat sink
US20030221814A1 (en) * 2002-06-03 2003-12-04 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink

Also Published As

Publication number Publication date
EP2417843A2 (fr) 2012-02-15
US20110297361A1 (en) 2011-12-08
WO2010118183A2 (fr) 2010-10-14

Similar Documents

Publication Publication Date Title
WO2010118183A3 (fr) Puits de chaleur induisant une faible contrainte
IL200542A0 (en) Apparel with heating and cooling capabilities
EP3035778A4 (fr) Substrat de circuit composite nitrure de bore - résine, et substrat de circuit à dissipateur thermique composite nitrure de bore - résine intégré
EP2307828A4 (fr) Coupleur thermique casse-vide cryogénique avec actionnement transversal-axial
ZA201106939B (en) Maintaining undo and redo capability across metadata merges
GB2453435B (en) Diamond-bonded constructions with improved thermal and mechanical properties
MY166331A (en) Thermally conductive composite element based on expanded graphite
TWI369009B (en) Light-emitting chip device with high thermal conductivity
EP2686163A4 (fr) Composites à conductivité thermique élevée/faible coefficient d'expansion thermique
GB0707538D0 (en) Superconducting magnet with reduced heat input in the low temperature regions
EP2145972A4 (fr) Matériau composite doté d'une conductivité thermique élevée
DK2630381T3 (da) Arrangement med indretninger til integreret afkøling og/eller opvarmning samt en fremgangsmåde til integreret opvarmning eller afkøling
PL2129976T3 (pl) Sposób i urządzenie do zwiększenia gradientu temperatury w generatorze cieplnym magnetokalorycznym
JP2013501343A5 (fr)
PL2225501T3 (pl) Urządzenie i sposób chłodzenia kriogenicznego
IL205628A0 (en) Composite material compositions, arrangements and methods having enhanced thermal conductivity behavior
WO2010129923A3 (fr) Matériau de gestion de chaleur à motif
WO2014143364A3 (fr) Elément formé conjointement avec couche à faible conductivité
EP2371789A4 (fr) Céramique semi-conductrice et thermistor à coefficient thermique positif
WO2011110957A3 (fr) Système et méthodologie de diagraphie
WO2010088068A3 (fr) Structures aéronautiques équilibrées thermiquement
MY165808A (en) Injection mold
BRPI0812201A2 (pt) Laminador com dispositivo de refrigeração e processo de laminação
EP2738000A4 (fr) Stratifié et matière d'isolation thermique l'utilisant
EP2304506A4 (fr) Toner possédant de multiples points d inflexion sur la courbe du module de conservation par rapport à la température et procédé de préparation associé

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10762411

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 8035/CHENP/2011

Country of ref document: IN

WWE Wipo information: entry into national phase

Ref document number: 2010762411

Country of ref document: EP