WO2010114260A3 - 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 - Google Patents
발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 Download PDFInfo
- Publication number
- WO2010114260A3 WO2010114260A3 PCT/KR2010/001893 KR2010001893W WO2010114260A3 WO 2010114260 A3 WO2010114260 A3 WO 2010114260A3 KR 2010001893 W KR2010001893 W KR 2010001893W WO 2010114260 A3 WO2010114260 A3 WO 2010114260A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- emitting devices
- photo
- coating layer
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
Landscapes
- Electroluminescent Light Sources (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Led Device Packages (AREA)
Abstract
발광소자를 코팅하는 방법으로, 먼저 복수의 발광소자들을 준비한다. 상기 복수의 발광소자들을 제1 광경화성 액체로 도포한다. 상기 제1 광경화성 액체에 제1 광을 선택적으로 노출함으로써, 상기 복수의 발광소자들 표면의 적어도 일부 영역에 제1 코팅층을 형성한다. 상기 제1 코팅층이 형성된 상기 복수의 발광소자들을 제2 광경화성 액체로 도포한다. 상기 제2 광경화성 액체에 제2 광을 선택적으로 노출함으로써, 상기 복수의 발광소자들 또는 상기 제1 코팅층 표면의 적어도 일부 영역에 제2 코팅층을 형성한다. 상기 제1 코팅층은 경화된 상기 제1 광경화성 액체에 해당하며, 상기 제2 코팅층은 경화된 상기 제2 광경화성 액체에 해당한다.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/262,342 US8455890B2 (en) | 2009-03-30 | 2010-03-29 | Method for coating light-emitting devices, light coupler, and method for manufacturing the light coupler |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2009-0026991 | 2009-03-30 | ||
| KR1020090026991A KR100984126B1 (ko) | 2009-03-30 | 2009-03-30 | 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2010114260A2 WO2010114260A2 (ko) | 2010-10-07 |
| WO2010114260A3 true WO2010114260A3 (ko) | 2010-12-09 |
Family
ID=42828820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2010/001893 Ceased WO2010114260A2 (ko) | 2009-03-30 | 2010-03-29 | 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8455890B2 (ko) |
| KR (1) | KR100984126B1 (ko) |
| WO (1) | WO2010114260A2 (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
| KR101167184B1 (ko) | 2011-05-25 | 2012-07-24 | 한국광기술원 | Led 패키지 봉지재의 경화 장치 |
| CA2905101C (en) | 2013-03-14 | 2022-08-16 | Laura Tyler PERRYMAN | Wireless implantable power receiver system and methods |
| US9341941B2 (en) | 2013-08-01 | 2016-05-17 | Samsung Electronics Co., Ltd. | Reflective photomask blank, reflective photomask, and integrated circuit device manufactured by using reflective photomask |
| DE102015103835A1 (de) * | 2015-03-16 | 2016-09-22 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements |
| KR102335106B1 (ko) * | 2015-06-19 | 2021-12-03 | 삼성전자 주식회사 | 발광 소자 패키지 및 그 제조 방법 |
| US10094530B2 (en) * | 2015-06-25 | 2018-10-09 | Texas Instruments Incorporated | Apparatus for spatially and spectrally adaptable dichromatic white light source using spatial light modulator |
| KR102831200B1 (ko) * | 2017-02-02 | 2025-07-10 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
| US10527854B1 (en) * | 2018-06-18 | 2020-01-07 | Facebook Technologies, Llc | Illumination source for a waveguide display |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05341155A (ja) * | 1992-04-07 | 1993-12-24 | Ricoh Co Ltd | 光カプラー及びその製造方法 |
| US6069440A (en) * | 1996-07-29 | 2000-05-30 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material |
| JP2001250255A (ja) * | 2000-03-02 | 2001-09-14 | Sony Corp | 光学装置及び光ディスク装置 |
| KR20050071780A (ko) * | 2004-01-02 | 2005-07-08 | 주식회사 메디아나전자 | 이중 몰드로 구성된 백색 발광다이오드 소자 및 그 제조방법 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0736450B2 (ja) | 1985-09-05 | 1995-04-19 | 株式会社コパル | Led光源 |
| JP2000269523A (ja) | 1999-03-16 | 2000-09-29 | Fuji Xerox Co Ltd | 光電変換装置 |
| JP3725413B2 (ja) | 2000-10-06 | 2005-12-14 | 松下電器産業株式会社 | 半導体発光装置 |
| JP4122737B2 (ja) | 2001-07-26 | 2008-07-23 | 松下電工株式会社 | 発光装置の製造方法 |
| US20060097385A1 (en) * | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| US7494246B2 (en) * | 2007-06-06 | 2009-02-24 | Philips Lumileds Lighting Company, Llc | Thin luminaire for general lighting applications |
-
2009
- 2009-03-30 KR KR1020090026991A patent/KR100984126B1/ko active Active
-
2010
- 2010-03-29 US US13/262,342 patent/US8455890B2/en active Active
- 2010-03-29 WO PCT/KR2010/001893 patent/WO2010114260A2/ko not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05341155A (ja) * | 1992-04-07 | 1993-12-24 | Ricoh Co Ltd | 光カプラー及びその製造方法 |
| US6069440A (en) * | 1996-07-29 | 2000-05-30 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material |
| JP2001250255A (ja) * | 2000-03-02 | 2001-09-14 | Sony Corp | 光学装置及び光ディスク装置 |
| KR20050071780A (ko) * | 2004-01-02 | 2005-07-08 | 주식회사 메디아나전자 | 이중 몰드로 구성된 백색 발광다이오드 소자 및 그 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100984126B1 (ko) | 2010-09-28 |
| WO2010114260A2 (ko) | 2010-10-07 |
| US20120032200A1 (en) | 2012-02-09 |
| US8455890B2 (en) | 2013-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2010114260A3 (ko) | 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 | |
| WO2011087591A3 (en) | Multiple surface finishes for microelectronic package substrates | |
| WO2010011842A3 (en) | Bonded intermediate substrate and method of making same | |
| WO2011066590A3 (en) | Thermochromic coating and method of manufacturing thereof | |
| WO2011063089A3 (en) | Surface-modified adhesives | |
| WO2008009575A3 (en) | Method of bonding | |
| WO2012047042A3 (ko) | 미세 패턴 형성 방법 및 이를 이용한 미세 채널 트랜지스터 및 미세 채널 발광트랜지스터의 형성방법 | |
| WO2009130229A3 (en) | An article and a method of making an article | |
| WO2014102222A9 (fr) | Procédé microélectronique de gravure d'une couche | |
| WO2009117232A3 (en) | Methods allowing for visual inspection of coated components for erosion damage | |
| WO2008033680A3 (en) | Method and apparatus for creating rfid devices using masking techniques | |
| WO2011011140A3 (en) | Method and materials for double patterning | |
| DE602007013280D1 (de) | Zwischentransferglied und herstellungsverfahren dafür | |
| WO2012001478A3 (zh) | 具有精密涂布之波长转换层之晶圆式发光装置 | |
| BRPI0923092A2 (pt) | dispositivo e método para tratamento e/ou revestimento de superfícies de componentes de substrato por deposição a partir da fase gasosa. | |
| DE602007004459D1 (de) | Herstellungsverfahren für polymer-filmgraphiken | |
| WO2009002644A3 (en) | Methods of making hierarchical articles | |
| WO2010138500A3 (en) | Method for coating honeycomb bodies | |
| WO2012095812A3 (en) | Method for embedding a led network | |
| WO2009104910A3 (ko) | 접합용 구조물 및 이를 이용한 기판 접합 방법 | |
| WO2013048064A3 (ko) | 온도에 따라 변색하며 발향기능을 갖는 인몰드용 전사필름 및 그 제조방법 | |
| WO2012047069A3 (ko) | 발광소자 및 그 제조방법 | |
| WO2012018234A3 (ko) | 패턴화된 광위상 변조판 및 이의 제조방법 | |
| CL2009001262A1 (es) | Un metodo para fabricar lenguetas sujetadoras que consiste en: proporcionar una longitud de sustrato de lengueta, aplicar un primer adhesivo a una primera region adhesiva, aplicar adhesivo a una segunda region adhesiva, en donde la primera y segunda region adhesiva tienen diferentes caracteristicas de adhesion. | |
| WO2013012195A3 (ko) | 기판의 제조방법 및 이를 이용한 전자소자의 제조방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10758985 Country of ref document: EP Kind code of ref document: A2 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 13262342 Country of ref document: US |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 10758985 Country of ref document: EP Kind code of ref document: A2 |