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WO2010032910A1 - Dispositif de transfert de substrat, appareil de traitement de substrat comprenant ce dispositif, et procédé permettant de transférer un substrat en utilisant le dispositif de transfert de substrat - Google Patents

Dispositif de transfert de substrat, appareil de traitement de substrat comprenant ce dispositif, et procédé permettant de transférer un substrat en utilisant le dispositif de transfert de substrat Download PDF

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Publication number
WO2010032910A1
WO2010032910A1 PCT/KR2009/001752 KR2009001752W WO2010032910A1 WO 2010032910 A1 WO2010032910 A1 WO 2010032910A1 KR 2009001752 W KR2009001752 W KR 2009001752W WO 2010032910 A1 WO2010032910 A1 WO 2010032910A1
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WO
WIPO (PCT)
Prior art keywords
substrate
arms
arm
guides
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2009/001752
Other languages
English (en)
Inventor
Dae-Ho Kim
Sang-Seok Hong
Joo-Jib Park
Sun-Yong Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42039711&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2010032910(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Priority to CN2009801370272A priority Critical patent/CN102160168B/zh
Priority to JP2011527732A priority patent/JP5190661B2/ja
Publication of WO2010032910A1 publication Critical patent/WO2010032910A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • H10P72/12—
    • H10P72/3402—
    • H10P72/3412—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Definitions

  • the present invention disclosed herein relates to an apparatus manufacturing a semiconductor substrate, and more particularly, to a substrate-transferring device, a substrate-processing apparatus having the substrate-transferring device, and a method of transferring a substrate using the substrate- transferring device.
  • Substrate-cleaning apparatuses performing the cleaning process are classified into a batch substrate cleaning apparatus and a single substrate cleaning apparatus.
  • the batch substrate cleaning apparatus includes a chemical bath, a rinse bath, and a dry bath having sizes capable of processing 25 substrates or 50 substrates at once.
  • the batch substrate cleaning apparatus removes foreign substances by immersing substrates in the respective baths for predetermined times.
  • Such a batch substrate cleaning apparatus simultaneously cleans upper and lower portions of a substrate and processes a large amount of substrates simultaneously.
  • the sizes of baths are also increased, so as to increase the size of an apparatus and the amount of chemical.
  • foreign substances detached from adjacent substrates are attached to substrates being cleaned in a chemical bath.
  • the single substrate cleaning apparatus is widely used.
  • a substrate is fixed to a substrate chuck in a chamber having a small size adapted for processing a single substrate, then rotated by a motor, and then chemical or deionized water is provided to the substrate through a nozzle disposed over the substrate.
  • the spin of the substrate spreads the chemical or the deionized water on the upper portion of the substrate, so as to remove foreign substances from the substrate.
  • the single substrate cleaning apparatus has a smaller size than the batch substrate cleaning apparatus and achieves a uniform cleaning performance.
  • the single substrate cleaning apparatus includes, from a side thereof, a loading/unloading unit, an index robot, a buffer unit, process chambers, and a main transfer robot.
  • the index robot transfers substrates between the buffer unit and the loading/unloading unit
  • the main transfer robot transfers substrates between the buffer unit and the process chambers.
  • substrates to be cleaned wait to be inserted into the process chambers, or the substrates that have been cleaned wait to be transferred to the loading/unloading unit.
  • a transfer robot such as the index robot and the main transfer robot includes a plurality of arms, and a substrate is loaded on each of the arms.
  • the respective arms move horizontally to take out or load substrates from or to storage such as front open unified pods (FOUPs) or the buffer unit.
  • FOUPs front open unified pods
  • the respective arms are provided with chucking members for preventing wafers from being removed out of the corresponding robot while the wafers are transferred.
  • the chucking members provided to the index robot or the main transfer robot include a vacuum-type chucking member fixing a wafer to an arm using a vacuum pressure, and an edge-gripping-type chucking member pushing a side surface of a wafer at a front end of an arm.
  • these chucking members are required to be provided integrally to the respective arms in a single body, and thus installation thereof is limited mechanically.
  • the present invention provides a substrate-transferring device improving efficiency in transferring a substrate.
  • the present invention also provides a substrate-processing apparatus including the substrate-transferring device.
  • the present invention also provides a method of transferring a substrate using the substrate-transferring device.
  • Embodiments of the present invention provide substrate-transferring devices including a plurality of horizontally movable arms, a body, and a plurality of guides.
  • the plurality of horizontally movable arms each is adapted for loading a substrate.
  • the body is coupled to the arms and moving the respective arms horizontally.
  • the plurality of guides are fixed to the body, and disposed respectively behind the arms, and guide positions of substrates loaded on the respectively corresponding arms when the arms move rearward.
  • each of the arms may include: a support plate on which the substrate is placed, the support plate facing a ground; and a connection plate connected to a first end of the support plate and coupled to the body and moved horizontally by driving of the body, and the support plates of the arms are spaced apart from each other in a vertical direction to face each other, and the guides are in one-to-one correspondence to the arms and spaced apart from each other in the vertical direction to face each other.
  • each of the guides may be disposed on an upper portion of the connection plate of the corresponding arm when the corresponding arm is at a waiting position.
  • each of the guides may have an end, and the end supports a side surface of the substrate placed on the corresponding arm when the corresponding arm is at the waiting position.
  • substrate-processing apparatuses include a storage member, at least one process chamber, and a transfer member.
  • the storage member stores a plurality of substrates such that the substrates face a ground.
  • a process for the substrate is performed in the process chamber.
  • the transfer member takes out and loads the substrate from and to the storage member and transfers the substrate, wherein the transfer member includes: a plurality of horizontally movable arms, each adapted for loading the substrate; a body coupled to the arms and moving the respective arms horizontally; and a plurality of guides fixed to the body, and disposed respectively behind the arms, and guiding positions of the substrates loaded on the respectively corresponding arms when the arms move rearward.
  • substrate-processing apparatuses include a first storage member, a second storage member, at least one process chamber, a first transfer member, and a second transfer member.
  • the first storage member and the second storage member each stores a plurality of substrates such that the substrates face a ground.
  • a process for the substrate is performed in the process chamber.
  • the first transfer member transfers the process-waiting substrate loaded on the first storage member to the second storage member, and transfers the substrate processed in the process chamber and loaded on the second storage member, to the first storage member.
  • the second transfer member transfers the process-waiting substrate loaded on the second storage member to the process chamber, and takes out the processed substrate from the process chamber and transfers the processed substrate to the second storage member.
  • the first and second transfer members each includes: a plurality of horizontally movable arms, each adapted for loading the substrate; a body coupled to the arms and moving the respective arms horizontally; and a plurality of guides fixed to the body, and disposed respectively behind the arms, and guiding positions of the substrates loaded on the respectively corresponding arms when the arms move rearward.
  • methods of transferring a substrate include: horizontally moving an arm forward to place the substrate on the arm such that the substrate faces a ground; and horizontally moving the arm rearward to place the arm at a waiting position.
  • the placing of the arm includes: gradually sliding a portion of the arm below a guide fixed behind the arm during the moving of the arm rearward; and supporting, by the guide, a side surface of the substrate placed on the arm to guide a position of the substrate placed on the arm, while a position of the guide on the arm is moved to a front side of the arm through the moving of the arm rearward.
  • the substrate-transferring device is provided independently from the arm unit to guide the position of a substrate placed on the arm unit, using the guide unit fixed to the body. Accordingly, the substrate-transferring device prevents the substrate from being out of the position during the transfer process, thereby transferring the substrate stably and improving transfer efficiency of the wafer.
  • FIG. 1 is a schematic view illustrating a substrate-processing system according to an embodiment of the present invention
  • FIG. 2 is a perspective view illustrating an index robot illustrated in FIG. 1;
  • FIG. 3 is a cross-sectional view illustrating the index robot illustrated in FIG. 2;
  • FIG. 4 is a perspective view illustrating a body part illustrated in FIG. 3.
  • FIG. 5 is a perspective view illustrating a first arm of FIG. 1 and a first guide.
  • FIGS. 6 and 7 are side views illustrating a process where the first guide illustrated in FIG. 5 guides the position of a substrate placed on the first arm.
  • FIG. 8 is a perspective view of a buffer unit illustrated in FIG. 1;
  • FIG. 9 is a perspective view of a main transfer robot illustrated in FIG. 1.
  • FIG. 1 is a schematic view illustrating a substrate-processing system 1000 according to an embodiment of the present invention.
  • the substrate-processing system 1000 may include a loading/unloading unit 110, an index robot 200, a buffer unit 300, a main transfer robot 500, a plurality of process chambers 600, and first and second control units 710 and 720.
  • the loading/unloading unit 110 includes a plurality of load ports 110a, 110b, 110c, and 110d. Although the loading/unloading unit 110 includes the four load ports 110a, 110b, 110c, and 110d in this embodiment, the number of the load ports 110a, 110b, 110c, and 110d may be increased or decreased according to process efficiency and footprint conditions of the substrate-processing system 1000.
  • Front open unified pods (FOUPs) 120a, 120b, 120c, and 120d are placed on the load ports 110a, 110b, 110c, and 110d. Wafers are stored in the FOUPs 120a, 120b, 120c, and 120d.
  • the respective FOUPs 120a, 120b, 120c, and 120d are provided with a plurality of slots for storing wafers horizontally to a ground.
  • the FOUPs 120a, 120b, 120c, and 120d store wafers that was loaded and have been processed in the process chamber 600 or wafers that will be loaded and processed in the process chamber 600.
  • wafers that have been processed by the substrate-processing system 1000 are referred to as processed wafers, and wafers that are not processed yet are referred to as primitive wafers.
  • the index robot 200 is disposed between the loading/unloading unit 110 and the buffer unit 300, and a first transfer rail 20 is disposed below the index robot 200.
  • the index robot 200 moves along the first transfer rail 20 and transfers wafers between the buffer unit 300 and the FOUPs 120a, 120b, 120c, and 120d.
  • FIG. 2 is a perspective view of the index robot 200 illustrated in FIG. 1.
  • FIG. 3 is a cross-sectional view of the index robot 200 illustrated in FIG. 2.
  • FIG. 4 is a perspective view of a body part illustrated in FIG. 3.
  • the index robot 200 may include an index body 210, an arm unit 220, a guide unit 230, a rotation part 240, a vertical movement part 250, and a horizontal movement part 260.
  • the index body 210 moves respective arms 221, 222, 223, and 224 horizontally.
  • the arms 221, 222, 223, and 224 are separately driven by the index body 210.
  • the index body 210 includes a case 211, a frame 212, a plurality of driving parts 213, a plurality of linear motion guides 214a, 214b, 214c, and 214d, a plurality of inner rotation transmission parts 215, and a plurality of outer rotation transmission parts 216.
  • the frame 212, the driving parts 213, the linear motion guides 214a, 214b, 214c, and 214d, the inner rotation transmission parts 215, and the outer rotation transmission parts 216 are protected in the case 211.
  • the case 211 provides space for storing the driving parts 213 that are in one-to-one correspondence to the arms 221, 222, 223, and 224.
  • the index body 210 includes the four driving parts 213 in this embodiment, the number of the driving parts 213 is increased or decreased according to the number of the arms 221, 222, 223, and 224.
  • the driving parts 213 are classified into two-driving-part groups to be disposed in a multi-layer structure and move horizontally the corresponding arms 221, 222, 223, and 224.
  • the linear motion guides 214a, 214b, 214c, and 214d may be referred to as first through fourth linear motion guides, respectively, which are disposed on an outside wall of the case 211.
  • the index body 210 includes the four linear motion guides 214a, 214b, 214c, and 214d in this embodiment, the number of the linear motion guides 214a, 214b, 214c, and 214d may be increased or decreased according to the number of the arms 221, 222, 223, and 224.
  • the linear motion guides 214a, 214b, 214c, and 214d are classified into two-motion-guide groups that are disposed on both side walls of the frame 212 facing each other, respectively.
  • the two of the linear motion guides 214a, 214b, 214c, and 214d, disposed on one sidewall of the frame 212, are spaced vertically from each other and parallel with each other. That is, the group including the first and second linear motion guides 214a and 214b, and the group including the third and fourth linear motion guides 214c and 214d are disposed on the sidewalls of the frame 212, respectively.
  • the second linear motion guide 214b is disposed under the first linear motion guide 214a
  • the fourth linear motion guide 214d is disposed under the third linear motion guide 214c. Since the first through fourth linear motion guides 214a, 214b, 214c, and 214d are disposed on the sidewalls of the frame 212, the index robot 200 can minimize the width of the index body 210.
  • the first through fourth linear motion guides 214a, 214b, 214c, and 214d are in one-to-one correspondence to the arms 221, 222, 223, and 224 and to the driving parts 213, respectively.
  • the first through fourth linear motion guides 214a, 214b, 214c, and 214d are connected to the corresponding arms 221, 222, 223, and 224 and the corresponding driving parts 213.
  • the respective linear motion guides 214a, 214b, 214c, and 214d receive torque from the connected driving parts 213 to reciprocate in their longitudinal direction, so that the connected arms 221, 222, 223, and 224 move horizontally.
  • the torque of the driving parts 213 is transmitted through the inner rotation transmission parts 215 and the outer rotation transmission parts 216, to the linear motion guides 214a, 214b, 214c, and 214d.
  • the inner rotation transmission parts 215 are in one-to-one correspondence to the outer rotation transmission parts 216, and disposed on an inside wall of the frame 212.
  • the inner rotation transmission parts 215 and the outer rotation transmission parts 216 are in one-to-one correspondence to the linear motion guides 214a, 214b, 214c, and 214d, respectively. Also, the inner rotation transmission parts 215 and the outer rotation transmission parts 216 are in one-to-one correspondence to the driving parts 213, respectively.
  • Each of the inner rotation transmission parts 215 includes a first pulley connected to the corresponding one of the driving parts 213, a second pulley connected to the corresponding one of the outer rotation transmission parts 216, and an inner belt connecting the first pulley to the second pulley.
  • the inner belt is disposed in the longitudinal direction of the first through fourth linear motion guides 214a, 214b, 214c, and 214d, and applies the torque, transmitted from the corresponding driving part 213 to the first pulley, to the second pulley.
  • Each of the outer rotation transmission parts 216 includes a third pulley connected to the second pulley of the corresponding one of the inner rotation transmission parts 215, a fourth pulley facing the third pulley, and an outer belt connecting the third pulley to the fourth pulley.
  • the third pulley faces the connected second pulley, and the outer belt is elongated in the longitudinal direction of the first through fourth linear motion guides 214a, 214b, 214c, and 214d.
  • the outer belt that is longer than the inner belt is connected to and vertically parallel with the corresponding one of the linear motion guides 214a, 214b, 214c, and 214d.
  • the outer belt is rotated through the connected third pulley by the torque of the corresponding inner rotation transmission part 215, so as to horizontally reciprocate one of the linear motion guides 214a, 214b, 214c, and 214d connected to the outer belt.
  • the first through fourth linear motion guides 214a, 214b, 214c, and 214d are coupled to the arms 221, 222, 223, and 224 in one-to-one correspondence.
  • the arm unit 220 includes the first through fourth arms 221, 222, 223, and 224 that couple to the corresponding linear motion guides 214a, 214b, 214c, and 214d through respective ends thereof.
  • the index robot 200 includes the four arms 221, 222, 223, and 224 in this embodiment, the number of the arms 221, 222, 223, and 224 may be increased or decreased according to the process efficiency of the substrate-processing system 1000.
  • the first through fourth arms 221, 222, 223, and 224 have the same configuration.
  • the first arm 221 is exemplified, and detailed description of the second through fourth arms 222, 223, and 224 will be omitted.
  • FIG. 5 is a perspective view illustrating the first arm 221 of FIG. 1 and a first guide 231. To particularly illustrate a coupling relationship between the first guide 231 of the guide unit 230 and the first arm 221, the rest of the guide unit 230 except for the first guide 231, and the second through fourth arms 222, 223, and 224 are removed.
  • the first arm 221 includes a support plate 221a on which a wafer 10 is placed and a connection plate 221b coupled to the index body 210.
  • the support plate 221a has a bar shape, and disposed in an upper portion of the index body 210, and faces a ground.
  • the connection plate 221b has a first end connected to the support plate 221a, and a second end facing the first end and coupled to the corresponding one of the linear motion guides 214a, 214b, 214c, and 214d.
  • the connection plate 221b of the first arm 221 may be coupled to the first linear motion guides 214a, and be moved according to the horizontal reciprocating movement of the first linear motion guides 214a. Accordingly, the first arm 221 reciprocates horizontally in the longitudinal direction of the first linear motion guide 214a.
  • the first arm 221 may further include a support protrusion 221c guiding the position of the wafer 10 placed on the support plate 221a.
  • the support protrusion 221c protrudes from an upper surface of the support plate 221a, and is provided to a second end facing a first end of the support plate 221a coupled to the connection plate 221b.
  • the support protrusion 221c supports a side surface of the wafer 10 placed on the support plate 221a.
  • connection plate 222b of the second arm 222 is coupled to the second linear motion guide 214b
  • a connection plate 223b of the third arm 223 is coupled to the third linear motion guide 214c
  • a connection plate 224b of the fourth arm 224 is coupled to the fourth linear motion guide 214d. Since the first through fourth linear motion guides 214a, 214b, 214c, and 214d are disposed on the both sidewalls of the frame 212 by two in this embodiment, the connection plates 221b, 222b, 223b, and 224b of the arm unit 220 are also classified into two-connection-plate groups according to the positions of the connected linear motion guides 214a, 214b, 214c, and 214d, and the groups face each other.
  • connection plates 221b and 222b of the first and second arms 221 and 222 are disposed on the left side of the index body 210, and the connection plates 223b and 224b of the third and fourth arms 223 and 224 are disposed on the right side of the index body 210.
  • Support plates of the first through fourth arms 221, 222, 223, and 224 are spaced apart vertically from each other and disposed sequentially and parallel with each other, in which the support plate 221a of the first arm 221 is disposed at the lowest position.
  • connection plate 222b of the second arm 222 is disposed on the outside of the connection plate 221b of the first arm 221, and the connection plate 224b of the fourth arm 224 is disposed on the outside of the connection plate 223b of the third arm 223.
  • a sidewall of the case 211 is provided with a plurality of holes 211a for connecting the support plates of the arm unit 220 to the linear motion guides 214a, 214b, 214c, and 214d.
  • the holes 211a correspond to the linear motion guides 214a, 214b, 214c, and 214d, and the connection plates 221b, 222b, 223b, and 224b of the arm unit 220 passes through the holes 211a and are partially inserted into the case 211.
  • the first and second arms 221 and 222 which transfer primitive wafers
  • the third and fourth arms 223 and 224 which transfer processed wafers
  • the load arms 221 and 222 and the unload arms 223 and 224 are disposed separately, not alternately. That is, the unload arms 223 and 224 may be disposed over the load arms 221 and 222. Accordingly, the index robot 200 prevents processed wafers from being contaminated by primitive wafers while transferring the primitive wafers and the processed wafers, thereby improving the yield of products.
  • the load arms 221 and 222 placed on the loading/unloading unit 110 take out primitive wafers from any one of the waiting FOUPs 120a, 120b, 120c, and 120d and then load the primitive wafers to the buffer unit 300.
  • the index robot 200 takes out at least one primitive wafer at once from the waiting FOUPs 120a, 120b, 120c, and 120d. That is, the load arms 221 and 222 may simultaneously insert primitive wafers to the process-waiting FOUPs 120a, 120b, 120c, and 120d and then simultaneously take out the primitive wafers. Thus, two primitive wafers may be simultaneously taken out from the process-waiting FOUPs 120a, 120b, 120c, and 120d.
  • the index robot 200 loads at least one primitive wafer to the buffer unit 300. That is, the load arms 221 and 222 may be simultaneously inserted to the buffer unit 300 and then simultaneously load primitive wafers thereon to the buffer unit 300. Thus, two primitive wafers may be simultaneously loaded on the buffer unit 300.
  • the maximum number of wafers taken out by the index robot 200 at once from the process-waiting FOUPs 120a, 120b, 120c, and 120d and the maximum number of wafers loaded at once to the buffer unit 300 are equal to the number of the load arms 221 and 222.
  • the unload arms 223 and 224 unload processed wafers from the buffer unit 300 and load the processed wafers to the index robot 200.
  • the index robot 200 unloads at least one processed wafer at once from the buffer unit 300. That is, the unload arms 223 and 224 may be simultaneously inserted to the buffer unit 300 and then simultaneously unload primitive wafers from the buffer unit 300. Thus, two primitive wafers may be simultaneously taken out from the buffer unit 300.
  • the index robot 200 loads at least one processed wafer at once to the process-waiting FOUPs 120a, 120b, 120c, and 120d again. That is, the unload arms 223 and 224 are simultaneously inserted into the process-waiting FOUPs 120a, 120b, 120c, and 120d, and then simultaneously load processed wafers placed thereon to the process-waiting FOUPs 120a, 120b, 120c, and 120d. Thus, two processed wafers are simultaneously loaded to the process-waiting FOUPs 120a, 120b, 120c, and 120d.
  • the maximum number of wafers taken out by the index robot 200 at once from the buffer unit 300 and the maximum number of wafers loaded at once to the FOUPs 120a, 120b, 120c, and 120d are equal to the number of the unload arms 223 and 224.
  • the index robot 200 takes out and loads a plurality of wafers at once from and to the FOUPs 120a, 120b, 120c, and 120d and the buffer unit 300, thereby reducing time for transferring wafers and improving productivity.
  • the guide unit 230 is disposed on the index body 210.
  • the guide unit 230 includes the first guide 231, a second guide 232, a third guide 233, and a fourth guide 234 that are in one-to-one correspondence to the arms 221, 222, 223, and 224.
  • the first through fourth guides 231, 232, 233, and 234 are spaced apart vertically from each other and disposed sequentially and parallel with each other, and respectively guide the positions of wafers placed on the corresponding arms 221, 222, 223, and 224.
  • the first guide 231 guides the position of a wafer placed on the first arm 221
  • the second guide 232 guides the position of a wafer placed on the second arm 222
  • the third guide 233 guides the position of a wafer placed on the third arm 223
  • the fourth guide 234 guides the position of a wafer placed on the fourth arm 224.
  • the first guide 231 is exemplified to describe the coupling relationship between the arm unit 220 and the guide unit 230.
  • the first guide 231 having a bar shape, and the support plate 221a of the first arm 221 extend in the same direction.
  • a first end of the first guide 231 is fixed to the index body 210.
  • the first guide 231 is disposed behind the first arm 221, and faces the support protrusion 221c of the first arm 221.
  • the first guide 231 supports the side surface of the wafer 10 through a second end facing the first end fixed to the index body 210.
  • the first through fourth guides 231, 232, 233, and 234 are formed of synthetic resin, e.g., polyetheretherketone (PEEK).
  • PEEK polyetheretherketone
  • FIGS. 6 and 7 are side views illustrating a process where the first guide 231 illustrated in FIG. 5 guides the position of a substrate placed on the first arm 221.
  • the second through fourth arms 222, 223, and 224, and the second through fourth guides 232, 233, and 234 are removed to more clearly illustrate a process where the first guide 231 adjusts the position of the wafer 10.
  • the first arm 221 horizontally moves forward to pick up the wafer 10 from the buffer unit 300 (refer to FIG. 1) or the FOUPs 120a, 120b, 120c, and 120d (refer to FIG. 1). Accordingly, the wafer 10 is placed on the support plate 221a of the first arm 221.
  • the wafer 10 may be a primitive wafer or processed wafer.
  • the first arm 221 moves rearward, i.e., toward the first guide 231, and the connection plate 221b of the first arm 221 slides into a space below the first guide 231, and the first guide 231 is disposed over the connection plate 221b.
  • the respective guides 231, 232, 233, and 234 are disposed over the connection plates 221b, 222b, 223b, and 224b of the corresponding arms 221, 222, 223, and 224.
  • the first guide 231 supports the side surface of the wafer 10 placed on the first arm 221 to fix the wafer 10 to the first arm 221, together with the support protrusion 221c of the first arm 221.
  • the first guide 231 guides the wafer 10 to be in the regular position. That is, referring to FIG. 6, the wafer 10 may mount the connection plate 221b of the first arm 221 without being placed on the regular position of the support plate 221a. In this case, the first guide 231 pushes the side surface of the wafer 10 to the support protrusion 221c of the first arm 221, so that the wafer 10 is placed in the regular position.
  • the connection plate 221b of the first arm 221 gradually slides below the first guide 231.
  • the first guide 231 gradually moves from the upper side of the connection plate 221b to the support protrusion 221c, and thus one side surface of the first guide 231 contacts one side surface of the wafer 10 disposed on the upper surface of the connection plate 221b.
  • the first arm 221 further horizontally moves rearward with the first guide 231 contacting the side surface of the wafer 10, and thus the first guide 231 pushes the wafer 10 in the opposite direction thereto, i.e., to the support protrusion 221c, so as to guide the position of the wafer 10. Accordingly, when the first arm 221 finishes moving to the waiting position, the wafer 10 is in the regular position, and the first guide 231 supports the side surface of the wafer 10.
  • the first guide 231 guides the position of the wafer 10 placed on the first arm 221 to place the wafer 10 at the regular position, and to fix the wafer 10 to the first arm 221, together with the support protrusion 221c of the first arm 221. Accordingly, when the index robot 200 transfers the wafer 10, the wafer 10 is prevented from being misaligned with the support plate 221a on which the wafer 10 is placed, the wafer 10 is prevented from being out of the index robot 200 and broken, and the transferring efficiency is improved.
  • the rotation part 240 is disposed below the index body 210.
  • the rotation part 240 is coupled to the index body 210 and rotates to rotate the index body 210. Accordingly, the arm unit 220 is also rotated.
  • the vertical movement part 250 is disposed under the rotation part 240, and the horizontal movement part 260 is disposed under the vertical movement part 250.
  • the vertical movement part 250 is coupled to the rotation part 240 to move the rotation part 240 upward and downward, and thus, vertical positions of the index body 210 and the arm unit 220 are adjusted.
  • the horizontal movement part 260 is coupled to the first transfer rail 20 and moves horizontally along the first transfer rail 20. Accordingly, the index robot 200 moves along an arrangement direction of the load ports 110a, 110b, 110c, and 110d.
  • the buffer unit 300 is disposed between a region where the index robot 200 is disposed, and a region where the process chambers 600 and the main transfer robot 500 are disposed.
  • the buffer unit 300 receives primitive wafers transferred by the index robot 200, and wafers processed at the process chambers 600.
  • FIG. 8 is a perspective view of the buffer unit 300 illustrated in FIG. 1.
  • the buffer unit 300 includes a main body 310 and first and second support parts 320 and 330.
  • the main body 310 may include a bottom surface 311, first and second sidewalls 312 and 313 extending vertically from the bottom surface 311, and an upper surface 314 coupled to upper ends of the first and second sidewalls 312 and 313.
  • the main body 310 has an open front wall facing the index robot 200 and an open rear wall facing the main transfer robot 500. Accordingly, it is convenient for the index robot 200 and the main transfer robot 500 to insert and take out wafers into and from the buffer unit 300.
  • the first and second sidewalls 312 and 313 face each other, and the upper surface 314 is partially removed to have an opening 314a.
  • the first and second support parts 320 and 330 are disposed in the main body 310.
  • the first support part 320 is coupled to the first sidewall 312, and the second support part 330 is coupled to the second sidewall 313.
  • Each of the first and second support parts 320 and 330 includes a plurality of supports.
  • the supports of the first support part 320 are in one-to-one correspondence to the supports of the second support part 330. Wafers are received by the buffer unit 300 with ends of the wafers supported by the supports of the first support part 320 and the supports of the second support part 330, in which the wafers face the bottom surface 311.
  • the supports of the first and second support parts 320 and 330 are spaced a first gap from each other in the vertical direction with the number of the load arms 221 and 222 (refer to FIG. 2) and the number of the unload arms 223 and 224 (refer to FIG. 2).
  • the load arms 221 and 222 and the unload arms 223 and 224 are also spaced the first gap, respectively. Accordingly, the index robot 200 takes out and loads a plurality of wafers at once from and into the buffer unit 300.
  • the first gap is equal to a slot gap of the FOUPs 120a, 120b, 120c, and 120d.
  • the respective supports of the first and second support parts 320 and 330 may be provided with guide protrusions 31 guiding the positions of wafers.
  • the guide protrusions 31 protrude from top surfaces of the supports and support side surfaces of wafers.
  • the gaps between the supports of the buffer unit 300, disposed sequentially are the same as those between the arms 221, 222, 223, and 224 that simultaneously pick up or load wafers. Accordingly, the index robot 200 takes out and loads a plurality of wafers at once from and to the buffer unit 300, thereby improving workability and productivity and reducing process time.
  • the main transfer robot 500 transfers primitive wafers disposed in the buffer unit 300 to the respective process chambers 600.
  • the main transfer robot 500 is disposed at a transfer passage 400, and moves along a second transfer rail 30 disposed at the transfer passage 400.
  • the transfer passage 400 is connected to the process chambers 600.
  • the main transfer robot 500 picks up primitive wafers from the buffer unit 300, and then moves along the second transfer rail 30 and provides the primitive wafers to the relevant one of the process chambers 600. Also, the main transfer robot 500 loads wafers processed in the process chambers 600 on the buffer unit 300.
  • FIG. 9 is a perspective view of the main transfer robot 500 illustrated in FIG. 1.
  • the main transfer robot 500 may include a hand body 510, a pick-up hand unit 520, a plurality of guides 530, a rotation part 540, a vertical movement part 550, and a horizontal movement part 560.
  • the hand body 510, the guides 530, the rotation part 540, the vertical movement part 550, and the horizontal movement part 560 are respectively the same in configuration as the index body 210, the guide unit 230, the rotation part 240, the vertical movement part 250, and the horizontal movement part 260 of the index robot 200 illustrated in FIGS. 2 through 5, detailed description thereof will be omitted.
  • the hand body 510 moves respective pick-up hands 521, 522, 523, and 524 horizontally.
  • the respective pick-up hands 521, 522, 523, and 524 are independently driven by the hand body 510.
  • An upper portion of the hand body 510 is provided with the pick-up hand unit 520.
  • a wafer is loaded on each of the pick-up hands 521, 522, 523, and 524.
  • the respective pick-up hands 521, 522, 523, and 524 are the same in configuration as the respective arms 221, 222, 223, and 224 of the index robot 200, except for the shape of support plates on which wafers are placed, detailed description of the configuration of the pick-up hands 521, 522, 523, and 524 will be omitted.
  • the main transfer robot 500 is provided with the four pick-up hands 521, 522, 523, and 524, but the number of the pick-up hands 521, 522, 523, and 524 may be increased according to the process efficiency of the substrate-processing system 1000.
  • the pick-up hands 521 and 522 transferring primitive wafers may be referred to as load pick-up hands, and the pick-up hands 523 and 524 transferring processed wafers may be referred to as unload pick-up hands.
  • the load pick-up hands 521 and 522 and the unload pick-up hands 523 and 524 are disposed separately, not alternately.
  • the unload pick-up hands 523 and 524 may be disposed over the load pick-up hands 521 and 522. Accordingly, the main transfer robot 500 prevents processed wafers from being contaminated by primitive wafers while transferring the primitive wafers and the processed wafers, thereby improving the yield of products.
  • the respective load pick-up hands 521 and 522 take out the primitive wafers from the buffer unit 300 and provide the processed wafers to the unemployed one of the process chambers 600.
  • the load pick-up hands 521 and 522 are spaced the first gap of the respective supports of the buffer unit 300. Thus, the load pick-up hands 521 and 522 can take out simultaneously the primitive wafers from the buffer unit 300.
  • the respective unload pick-up hands 523 and 524 take out processed wafers from the process chamber 600 that have completed a process and then load the processed wafers to the buffer unit 300.
  • the unload pick-up hands 523 and 524 are spaced the first gap.
  • the unload pick-up hands 523 and 524 can simultaneously load the processed wafers taken out from the process chambers 600, to the buffer unit 300.
  • the number of the load pick-up hands 521 and 522 and the number of the unload pick-up hands 523 and 524 are two, respectively, but the numbers may be increased according to the process efficiency of the substrate-processing system 1000.
  • the number of the supports in the buffer unit 300, spaced the first gap and disposed sequentially, and the maximum number of the arms 221, 222, 223, and 224 in the index robot 200, taking out or loading wafers from or to the buffer unit 300 at once, and the maximum number of the pick-up hands 521, 522, 523, and 524 in the main transfer robot 500, taking out or loading wafers from or to the buffer unit 300 at once are the same.
  • the main transfer robot 500 takes out a plurality of primitive wafers or one primitive wafer at once from the buffer unit 300. Also, the main transfer robot 500 loads a plurality of processed wafers or one processed wafer at once to the buffer unit 300. Accordingly, since a transfer time of wafers is reduced, the substrate-processing system 1000 can reduce the process time and improve the productivity.
  • the guides 530 are fixed to the hand body 510.
  • the respective guides 530 guide and fix the positions of wafers placed on the corresponding pick-up hands 521, 522, 523, and 524.
  • the respective guides 530 of the main transfer robot 500 place wafers disposed on the corresponding pick-up hands 521, 522, 523, and 524 at regular positions. Accordingly, while the main transfer robot 500 transfers wafers, the wafers are prevented from being removed out of the pick-up hands 521, 522, 523, and 524, thereby preventing damage of the wafers and improving transfer efficiency of the wafers.
  • the rotation part 540 is disposed under the hand body 510.
  • the rotation part 540 is coupled to the hand body 510 and rotates to rotate the hand body 510. Accordingly, the pick-up hands 521, 522, 523, and 524 rotate together.
  • the vertical movement part 550 is disposed under the rotation part 540, and the horizontal movement part 560 is disposed under the vertical movement part 550.
  • the vertical movement part 550 is coupled to the rotation part 540 and moves the rotation part 540 upward and downward, so as to adjust vertical positions of the hand body 510 and the pick-up hand unit 520.
  • the horizontal movement part 560 is coupled to the second transfer rail 30 and moves along the second transfer rail 30. Accordingly, the main transfer robot 500 moves between the buffer unit 300 and the process chambers 600.
  • Both sides of the transfer passage 400 where the main transfer robot 500 is disposed are provided with the respective process chambers 600 processing primitive wafers and forming processed wafers.
  • Processes performed in the process chambers 600 include a cleaning process for cleaning primitive wafers.
  • Each two of the process chambers 600 face each other and the transfer passage 400 is disposed between the two process chambers 600.
  • the three process chambers 600 are disposed on each of the both sides of the transfer passage 400.
  • the substrate-processing system 1000 includes the six process chambers 600 in this embodiment, the number of the process chambers 600 may be increased or decreased according to the process efficiency and the footprint conditions of the substrate-processing system 1000. Also, although the process chambers 600 are disposed in a single layer structure in this embodiment, twelve process chambers may be classified into two six-process-chamber groups in a multi-layer structure.

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un dispositif de transfert de substrat comprenant une pluralité de bras déplaçables horizontalement, ainsi qu'un corps et une pluralité de guides. Dans la pluralité de bras déplaçables horizontalement, chaque bras est adapté pour charger un substrat. Le corps est couplé aux bras et il déplace les bras respectifs horizontalement. La pluralité de guides est fixée au corps, les guides étant placés respectivement derrière les bras et guidant les positions des substrats chargés sur les bras correspondants respectivement lorsque les bras se déplacent vers l'arrière. En conséquence, le dispositif de transfert de substrat empêche qu'un substrat ne se détache pendant son transfert. Le transfert d'un substrat se faisant de façon stable, l'efficacité du transfert est ainsi améliorée.
PCT/KR2009/001752 2008-09-19 2009-04-06 Dispositif de transfert de substrat, appareil de traitement de substrat comprenant ce dispositif, et procédé permettant de transférer un substrat en utilisant le dispositif de transfert de substrat Ceased WO2010032910A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801370272A CN102160168B (zh) 2008-09-19 2009-04-06 衬底传输装置、具有其的衬底处理设备及使用该衬底传输装置的传输衬底的方法
JP2011527732A JP5190661B2 (ja) 2008-09-19 2009-04-06 基板移送装置、これを有する基板処理装置及びこれの基板移送方法

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KR10-2008-0092113 2008-09-19
KR1020080092113A KR100980706B1 (ko) 2008-09-19 2008-09-19 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법

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JP2012138404A (ja) * 2010-12-24 2012-07-19 Kawasaki Heavy Ind Ltd 基板搬送中継装置
JP2012138403A (ja) * 2010-12-24 2012-07-19 Kawasaki Heavy Ind Ltd 搬送ロボット及びその基板搬送方法
JP2013104131A (ja) * 2011-11-11 2013-05-30 Snu Precision Co Ltd 平板パネル製造装置
JP2016139828A (ja) * 2016-04-20 2016-08-04 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
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KR101681191B1 (ko) 2015-09-30 2016-12-12 세메스 주식회사 반송 유닛, 기판 처리 장치, 기판 처리 방법
KR102041314B1 (ko) * 2017-05-26 2019-11-06 세메스 주식회사 이송 유닛
KR102280034B1 (ko) * 2019-07-22 2021-07-21 세메스 주식회사 반송 유닛 및 이를 가지는 기판 처리 장치
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WO2023127553A1 (fr) * 2021-12-28 2023-07-06 芝浦メカトロニクス株式会社 Dispositif de transfert de substrat et procédé de transfert de substrat
KR102679253B1 (ko) * 2021-12-30 2024-06-26 세메스 주식회사 본딩 장치 및 본딩 방법
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WO2012086164A1 (fr) * 2010-12-24 2012-06-28 川崎重工業株式会社 Robot de transport, son procédé de transport de substrat, et appareil de relais de transport de substrat
JP2012138404A (ja) * 2010-12-24 2012-07-19 Kawasaki Heavy Ind Ltd 基板搬送中継装置
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JP5190661B2 (ja) 2013-04-24
TWI387042B (zh) 2013-02-21
TW201013821A (en) 2010-04-01
CN102160168B (zh) 2013-11-13
JP2012503326A (ja) 2012-02-02
CN102160168A (zh) 2011-08-17
KR20100033115A (ko) 2010-03-29

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