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WO2010031089A1 - Method for producing a grinding tool - Google Patents

Method for producing a grinding tool Download PDF

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Publication number
WO2010031089A1
WO2010031089A1 PCT/AT2009/000199 AT2009000199W WO2010031089A1 WO 2010031089 A1 WO2010031089 A1 WO 2010031089A1 AT 2009000199 W AT2009000199 W AT 2009000199W WO 2010031089 A1 WO2010031089 A1 WO 2010031089A1
Authority
WO
WIPO (PCT)
Prior art keywords
matrix
diamond
recesses
producing
grinding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AT2009/000199
Other languages
German (de)
French (fr)
Inventor
Franz Egger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyrolit-Schleifmittelwerke Swarovski KG
Original Assignee
Tyrolit-Schleifmittelwerke Swarovski KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AT14642008A external-priority patent/AT506578B1/en
Application filed by Tyrolit-Schleifmittelwerke Swarovski KG filed Critical Tyrolit-Schleifmittelwerke Swarovski KG
Priority to KR1020157030731A priority Critical patent/KR101607447B1/en
Priority to EP09775537.5A priority patent/EP2331295B1/en
Publication of WO2010031089A1 publication Critical patent/WO2010031089A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

Definitions

  • the invention relates to a method for producing a grinding tool, which contains mutually distanced diamond particles, wherein recesses are provided on the surface of a powdered, sinterable matrix, in each of which a diamond particle is inserted before the matrix provided with the diamond pressed and finally sintered becomes.
  • the invention is based on the consideration that a lattice structure can be created on the surface of the powdery matrix from the material of the matrix itself. According to the invention it is thus provided that the recesses are formed by pressing a pattern into the powdery matrix.
  • the diamond particles are precisely fixed and thus remain in position both during the pressing of the powder and in particular during the application and pressing of another layer, so that an unambiguous assignment of the particles in different layers is ensured ,
  • Fig. 1 shows a schematic cross section of a device for separating
  • Fig. 2 is an enlarged detail of Fig. 1 represents.
  • Figs. 3 and 4 show the deposition of the Diamantgromer with the device of FIG. 1 and
  • An essential process step consists in the separation of the diamond grains, which are to be embedded in the segments of a grinding wheel.
  • the grains 4 are scattered on top of the perforated plate 1 shown in Fig. 1.
  • This perforated plate 1 is provided with holes 6 which are penetrated by pins 3, which are supported by a stamp plate 7.
  • a negative pressure is maintained, which propagates to the mouths of the holes 6, so that there is a grain 4 is held in each case.
  • the no hole 6 associated grains 4 are stripped or blown off.
  • the diamond grain is selected from the spectrum of 350 to 700 microns.
  • the holes 6 of the perforated plate 1 are larger in diameter (about 0.6 mm) than the average grain size, so that the grains 4 can settle therein.
  • a typical distance between the holes 6 is 1, 25 mm.
  • a first function of the pins 3 is that to prevent the laying of the holes 6 by smaller grains. Their main purpose, however, results from FIGS. 3 and 4.
  • the perforated plate 1 is pivoted through 180 ° and brought so close to the base 2 that no suction of powder from the base 2 occurs. If one simply dropped the bodies 4 out of the height thus caused, there would be no uniform arrangement of the bodies. This arrangement is facilitated when the bodies 4 are ejected by moving the die plate 7 in a suitable guide 8 by means of the pins 3.
  • metal powder is first poured or molded into a mold at a height of, for example, 2.5 mm to 3 mm. Subsequently, the powder layer is compacted by a waffle pattern of protruding truncated pyramid bearing stamp by 25% to a height of about 1, 8 to 2.2 mm.
  • the compacted powder Therefore, between webs 10, the distance of which, for example, 1, 25 mm, frustoconical depressions 5, whose bottom measures, for example, 0.3 mm square at a height of 0.4 mm of the truncated pyramid.
  • the material from which the pad 2 is formed corresponds to the prior art.
  • 56% of its alloy could be Cu-Co-Fe, 26% bronze (90% Cu, 10 Sn) and 18% copper.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The invention relates to a method for producing a grinding tool comprising diamond particles disposed at a distance from each other, wherein recesses are formed on the surface of a powdery sinterable matrix recess by pressing a pattern into the powdery matrix, a diamond particle being placed into each recess before the matrix containing the diamonds is pressed and finally sintered.

Description

Verfahren zur Herstellung eines Schleifwerkzeuges Method for producing a grinding tool

Die Erfindung bezieht sich auf ein Verfahren zur Herstellung eines Schleifwerkzeuges, welches voneinander distanzierte Diamantteilchen enthält, wobei an der Oberfläche einer pulverförmigen, sinterbaren Matrix Ausnehmungen vorgesehen werden, in welche je ein Diamantteilchen eingelegt wird, bevor die mit den Diamanten versehene Matrix gepresst und schließlich gesintert wird.The invention relates to a method for producing a grinding tool, which contains mutually distanced diamond particles, wherein recesses are provided on the surface of a powdered, sinterable matrix, in each of which a diamond particle is inserted before the matrix provided with the diamond pressed and finally sintered becomes.

Bei den Ausnehmungen, in welche die Diamantteilchen eingelegt werden, handelt es sich bei älteren Vorschlägen (vergleiche US 4,925,457) um die Öffnungen eines Gitters. Das Verbleiben dieses Hilfsgitters im Werkzeug beeinflusst jedoch die Qualität des Produktes. Es wurde daher auch schon vorgeschlagen (vergleiche US 6,286,498), das Gitter, welches zur Vereinzelung der Diamantteilchen dient, nach dem Einpressen dieser Teilchen wieder zu entfernen. Unterschiedliche Orientierung und Größe der Diamantteilchen kann dabei sowohl beim Vereinzeln der Teilchen als auch bei der Entfernung des Gitters zu Schwierigkeiten führen.In the recesses in which the diamond particles are inserted, are in older proposals (see US 4,925,457) to the openings of a grid. However, the retention of this auxiliary grid in the tool affects the quality of the product. It has therefore also been proposed (cf. US Pat. No. 6,286,498) to remove the grid, which serves to separate the diamond particles, after the injection of these particles. Different orientation and size of the diamond particles can lead to difficulties both when singulating the particles and when removing the grid.

Die Erfindung geht von der Überlegung aus, dass auf der Oberfläche der pulverförmigen Matrix aus dem Material der Matrix selbst eine Gitterstruktur geschaffen werden kann. Erfindungsgemäß ist somit vorgesehen, dass die Ausnehmungen durch Einpressen eines Musters in die pulverförmige Matrix gebildet werden.The invention is based on the consideration that a lattice structure can be created on the surface of the powdery matrix from the material of the matrix itself. According to the invention it is thus provided that the recesses are formed by pressing a pattern into the powdery matrix.

Weisen die Ausnehmungen die Form von Kegel- oder Pyramidenstümpfen auf, werden die Diamantteilchen präzise fixiert und bleiben so sowohl beim Verpressen des Pulvers und insbesondere beim Aufbringen und Verpressen einer weiteren Schicht in ihrer Lage, sodass auch eine eindeutige Zuordnung der Teilchen in verschiedenen Lagen gewährleistet ist.If the recesses are in the form of conical or truncated pyramids, the diamond particles are precisely fixed and thus remain in position both during the pressing of the powder and in particular during the application and pressing of another layer, so that an unambiguous assignment of the particles in different layers is ensured ,

Anschließend wird die Erfindung anhand der Zeichnung näher erörtert. In dieser stelltSubsequently, the invention will be discussed with reference to the drawing. In this poses

Fig. 1 einen schematischen Querschnitt einer Einrichtung zum Vereinzeln undFig. 1 shows a schematic cross section of a device for separating and

Ablegen von Diamantkörnern in der Vorbereitungsphase undDepositing diamond grains in the preparation phase and

Fig. 2 ein vergrößertes Detail von Fig. 1 dar.Fig. 2 is an enlarged detail of Fig. 1 represents.

Fig. 3 und 4 zeigen das Ablegen der Diamantkömer mit der Einrichtung nach Fig. 1 undFigs. 3 and 4 show the deposition of the Diamantkömer with the device of FIG. 1 and

Fig. 5 und 6 zeigen Draufsicht bzw. Querschnitt zur pulverförmigen Unterlage 2 in Fig. 3 und 4. Ein wesentlicher Verfahrensschritt besteht in der Vereinzelung der Diamantkörner, welche in die Segmente einer Schleifscheibe eingebettet werden sollen. Zu diesem Zwecke werden die Körner 4 auf die Oberseite der in Fig. 1 dargestellten Lochplatte 1 aufgestreut. Diese Lochplatte 1 ist mit Bohrungen 6 versehen, welche von Stiften 3 durchsetzt sind, die von einer Stempelplatte 7 getragen werden. Im Innenraum 9 der Lochplatte 1 wird ein Unterdruck aufrechterhalten, welcher sich zu den Mündungen der Bohrungen 6 fortpflanzt, sodass dort jeweils ein Korn 4 festgehalten wird. Die keiner Bohrung 6 zugeordneten Körner 4 werden abgestreift oder abgeblasen.5 and 6 show top view and cross section to the powdery substrate 2 in Fig. 3 and 4. An essential process step consists in the separation of the diamond grains, which are to be embedded in the segments of a grinding wheel. For this purpose, the grains 4 are scattered on top of the perforated plate 1 shown in Fig. 1. This perforated plate 1 is provided with holes 6 which are penetrated by pins 3, which are supported by a stamp plate 7. In the interior 9 of the perforated plate 1, a negative pressure is maintained, which propagates to the mouths of the holes 6, so that there is a grain 4 is held in each case. The no hole 6 associated grains 4 are stripped or blown off.

Typischerweise wird das Diamantkorn aus dem Spektrum von 350 bis 700 μm gewählt. Die Bohrungen 6 der Lochplatte 1 sind im Durchmesser größer (ca. 0,6 mm) als die durchschnittliche Korngröße, damit sich die Körner 4 darin absetzen können. Ein typischer Abstand der Bohrungen 6 beträgt 1 ,25 mm.Typically, the diamond grain is selected from the spectrum of 350 to 700 microns. The holes 6 of the perforated plate 1 are larger in diameter (about 0.6 mm) than the average grain size, so that the grains 4 can settle therein. A typical distance between the holes 6 is 1, 25 mm.

Wie sich aus Fig. 1 und 2 ergibt, besteht eine erste Funktion der Stifte 3 darin, dass Verlegen der Bohrungen 6 durch kleinere Körner zu verhindern. Ihr Hauptzweck ergibt sich jedoch aus Fig. 3 und 4.As is apparent from Fig. 1 and 2, a first function of the pins 3 is that to prevent the laying of the holes 6 by smaller grains. Their main purpose, however, results from FIGS. 3 and 4.

Um die gemäß 1 angesaugten Körner 4 auf eine Unterlage 2 aus Metallpulver abzulegen, wird die Lochplatte 1 um 180° geschwenkt und so nahe an die Unterlage 2 herangefahren, dass es noch zu keiner Ansaugung von Pulver aus der Unterlage 2 kommt. Würde man die Kömer 4 aus der so bedingten Höhe einfach fallen lassen, ergäbe sich keine gleichmäßige Anordnung der Kömer. Diese Anordnung wird erleichtert, wenn die Kömer 4 durch Verschieben der Stempelplatte 7 in einer geeigneten Führung 8 mittels der Stifte 3 ausgestoßen werden.In order to deposit the grains 4 sucked in accordance with FIG. 1 onto a base 2 made of metal powder, the perforated plate 1 is pivoted through 180 ° and brought so close to the base 2 that no suction of powder from the base 2 occurs. If one simply dropped the bodies 4 out of the height thus caused, there would be no uniform arrangement of the bodies. This arrangement is facilitated when the bodies 4 are ejected by moving the die plate 7 in a suitable guide 8 by means of the pins 3.

Gegenüber der Verwendung einer ebenen Unterlage 2 lassen sich durch die Anordnung von Vertiefungen 5 im Metallpulver der Unterlage 2 wesentliche Verbesserungen erzielen. Es ist dadurch nicht mehr notwendig, die Körner 4 mittels der Stifte 3 so tief einzudrücken, wie dies bei einer ebenen Unterlage der Fall wäre und ein entsprechendes Lockern und Verdrängen des die Körner umgebenden Metallbettes wird daher vermieden.Compared with the use of a flat base 2 can be achieved by the arrangement of wells 5 in the metal powder of the pad 2 significant improvements. It is therefore no longer necessary to depress the grains 4 by means of the pins 3 as deep as would be the case with a flat surface and a corresponding loosening and displacement of the metal bed surrounding the grains is therefore avoided.

Bei der Herstellung der Unterlage 2 wird zunächst in eine Form Metallpulver in einer Höhe von beispielsweise 2,5 mm bis 3 mm eingeschüttet oder eingeformt. Anschließend wird die Pulverlage durch einen ein Waffelmuster aus vorstehenden Pyramidenstümpfen tragenden Stempel um 25 % auf eine Höhe von ca. 1 ,8 bis 2,2 mm verdichtet. Das verdichtete Pulver weist daher zwischen Stegen 10, deren Abstand beispielsweise 1 ,25 mm beträgt, kegelstumpfförmige Vertiefungen 5 auf, deren Boden beispielsweise 0,3 mm im Quadrat bei einer Höhe von 0,4 mm des Pyramidenstumpfes misst.In the production of the base 2, metal powder is first poured or molded into a mold at a height of, for example, 2.5 mm to 3 mm. Subsequently, the powder layer is compacted by a waffle pattern of protruding truncated pyramid bearing stamp by 25% to a height of about 1, 8 to 2.2 mm. The compacted powder Therefore, between webs 10, the distance of which, for example, 1, 25 mm, frustoconical depressions 5, whose bottom measures, for example, 0.3 mm square at a height of 0.4 mm of the truncated pyramid.

Vorversuche, bei denen die Vertiefungen in Zylinderform hergestellt wurden, haben zu störenden Verschiebungen des Metallpulvers zwischen den Zylindern geführt. Zudem kam es beim Entfernen der zylinderförmigen Stempel zu Abrissen an den Oberkanten der obersten Pulverschicht. Diese Probleme werden durch die Verwendung von Kegel- bzw. Pyramidenstümpfen vermieden.Preliminary tests in which the depressions were produced in cylindrical form, have led to disturbing shifts of the metal powder between the cylinders. In addition, when removing the cylindrical stamps, there were breaks at the upper edges of the uppermost powder layer. These problems are avoided by the use of truncated cones or truncated pyramids.

Das Material, aus dem die Unterlage 2 gebildet wird, entspricht dem Stand der Technik. Beispielsweise könnte es zu 56 % auf seiner Legierung Cu-Co-Fe, zu 26 % aus Bronze (90 % Cu, 10 Sn) und zu 18 % aus Kupfer bestehen.The material from which the pad 2 is formed corresponds to the prior art. For example, 56% of its alloy could be Cu-Co-Fe, 26% bronze (90% Cu, 10 Sn) and 18% copper.

In jede Vertiefung 5, welche zwischen den Stegen 10 gebildet wird, wird ein einzelnes Diamantkorn 4 eingelegt, wobei die Vereinzelung und Ablage wie oben beschrieben erfolgen kann. Anschließend werden die Diamanten mit einem Metallstempel (ohne Waffelmuster) in die Pulverlage eingepresst. Durch diesen Pressvorgang erfolgt eine weitere Verdichtung der Pulverlage um 10 %. Ausgehend von der ursprünglichen Schüttung erfolgt so eine Verdichtung um 35 %. Die Pulverlage hat dann eine Höhe von ca. 1 ,6 mm bis 1 ,9 mm.In each recess 5, which is formed between the webs 10, a single diamond grain 4 is inserted, the separation and storage can be carried out as described above. Then the diamonds are pressed into the powder layer with a metal stamp (without waffle pattern). By this pressing process, a further compression of the powder layer by 10%. Starting from the original bed, a compression of 35% occurs. The powder layer then has a height of about 1, 6 mm to 1, 9 mm.

Nach diesem Vorgang werden die vorgenannten Schritte wiederholt, bis das Segment auf die gewünschte Stärke aufgebaut ist.After this process, the above steps are repeated until the segment is built up to the desired thickness.

Am Schluss werden alle Pulverlagen noch einmal gemeinsam gepresst. Durch diesen Pressvorgang erfolgt eine Verdichtung der ursprünglichen Schütthöhe (Summe aller Schüttungen) um 47 %. Der so erzeugte Rohling wird gesintert, um das fertige Segment zu erhalten. At the end all powder layers are pressed together again. By this pressing process, a compression of the original bed height (sum of all beds) by 47%. The blank thus produced is sintered to obtain the finished segment.

Claims

Patentansprüche: claims: 1. Verfahren zur Herstellung eines Schleifwerkzeuges, welches voneinander distanzierte Diamantteilchen enthält, wobei an der Oberfläche einer pulverförmigen, sinterbaren Matrix Ausnehmungen vorgesehen werden, in welche je ein Diamantteilchen eingelegt wird, bevor die mit den Diamanten versehene Matrix gepresst und schließlich gesintert wird, dadurch gekennzeichnet, dass die Ausnehmungen durch Einpressen eines Musters in die pulverförmige Matrix gebildet werden.1. A method for producing a grinding tool, which contains spaced apart diamond particles, wherein recesses are provided on the surface of a powdered, sinterable matrix, in each of which a diamond particle is inserted before the matrix provided with the diamond is pressed and finally sintered, characterized in that the recesses are formed by injecting a pattern into the powdery matrix. 2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass die Ausnehmungen die Form von Kegel- oder Pyramidenstümpfen aufweisen.2. The method according to claim 1, characterized in that the recesses have the shape of conical or truncated pyramids. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Diamantteilchen durch je einen Stift aus einer Lochplatte ausgestoßen und in die Ausnehmung eingedrückt werden. 3. The method according to claim 1 or 2, characterized in that the diamond particles are ejected by a respective pin from a perforated plate and pressed into the recess.
PCT/AT2009/000199 2008-09-19 2009-05-15 Method for producing a grinding tool Ceased WO2010031089A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020157030731A KR101607447B1 (en) 2008-09-19 2009-05-15 Method for producing a grinding tool
EP09775537.5A EP2331295B1 (en) 2008-09-19 2009-05-15 Method for producing a grinding tool

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
AT14652008 2008-09-19
ATA1464/2008 2008-09-19
AT14642008A AT506578B1 (en) 2008-09-19 2008-09-19 METHOD FOR PRODUCING A GRINDING TOOL
ATA1465/2008 2008-09-19

Publications (1)

Publication Number Publication Date
WO2010031089A1 true WO2010031089A1 (en) 2010-03-25

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Country Status (3)

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EP (1) EP2331295B1 (en)
KR (2) KR20110084397A (en)
WO (1) WO2010031089A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010038324A1 (en) * 2010-07-23 2012-01-26 Hilti Aktiengesellschaft Device for positioning cutting particles
AT511967B1 (en) * 2011-12-01 2013-04-15 Swarovski Tyrolit Schleif GRINDING TOOL AND METHOD FOR THE PRODUCTION THEREOF
CN106002654A (en) * 2015-07-10 2016-10-12 杭州日铭科技有限公司 Grinding wheel with magnetic-field-assisted orderly-distributed nickel-plated diamonds and manufacturing method thereof
WO2025105903A1 (en) * 2023-11-15 2025-05-22 주식회사 디엑스 Diamond array segment manufacturing apparatus and diamond array segment manufacturing method using same

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
KR102102797B1 (en) * 2019-11-29 2020-04-22 동신다이아몬드공업 주식회사 Apparatus for manufacturing a segment for diamond tool and method for manufacturing thereof

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JPH04336967A (en) * 1991-05-13 1992-11-25 Toyoda Mach Works Ltd Manufacture of carbide abrasive grain edger
US20030009949A1 (en) * 2001-02-21 2003-01-16 3M Innovative Properties Company Abrasive article with optimally oriented abrasive particles and method of making the same
KR20040080706A (en) * 2003-03-13 2004-09-20 이화다이아몬드공업 주식회사 Method for Manufacturing Segment for Diamond Tool

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Publication number Priority date Publication date Assignee Title
US4925457A (en) * 1989-01-30 1990-05-15 Dekok Peter T Abrasive tool and method for making
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
JPH04336967A (en) * 1991-05-13 1992-11-25 Toyoda Mach Works Ltd Manufacture of carbide abrasive grain edger
US20030009949A1 (en) * 2001-02-21 2003-01-16 3M Innovative Properties Company Abrasive article with optimally oriented abrasive particles and method of making the same
KR20040080706A (en) * 2003-03-13 2004-09-20 이화다이아몬드공업 주식회사 Method for Manufacturing Segment for Diamond Tool

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2409813A3 (en) * 2010-07-23 2014-06-25 HILTI Aktiengesellschaft Device for positioning cutting particles
CN102343564A (en) * 2010-07-23 2012-02-08 喜利得股份公司 Device for positioning cutting particles
DE102010038324B4 (en) * 2010-07-23 2012-03-22 Hilti Aktiengesellschaft Device for positioning cutting particles
DE102010038324A1 (en) * 2010-07-23 2012-01-26 Hilti Aktiengesellschaft Device for positioning cutting particles
US9126310B2 (en) 2010-07-23 2015-09-08 Hilti Aktiengesellschaft Device for positioning cutting particles
CN102343564B (en) * 2010-07-23 2015-08-05 喜利得股份公司 For the equipment of cutting particles location
AT511967B1 (en) * 2011-12-01 2013-04-15 Swarovski Tyrolit Schleif GRINDING TOOL AND METHOD FOR THE PRODUCTION THEREOF
WO2013078487A1 (en) * 2011-12-01 2013-06-06 Tyrolit - Schleifmittelwerke Swarovski K.G. Grinding tool and method for producing same
AT511967A4 (en) * 2011-12-01 2013-04-15 Swarovski Tyrolit Schleif GRINDING TOOL AND METHOD FOR THE PRODUCTION THEREOF
AU2012344710B2 (en) * 2011-12-01 2016-02-25 Tyrolit - Schleifmittelwerke Swarovski K.G. Grinding tool and method for producing same
US9579774B2 (en) 2011-12-01 2017-02-28 Tyrolit—Schleifmittelwerke Swarovski K.G. Grinding tool and method for producing same
US9751191B2 (en) 2011-12-01 2017-09-05 Tyrolit-Schleifmittelwerke Swarovski K.G. Grinding tool including a matrix and at least one wear-promoting particle embedded in the matrix
CN106002654A (en) * 2015-07-10 2016-10-12 杭州日铭科技有限公司 Grinding wheel with magnetic-field-assisted orderly-distributed nickel-plated diamonds and manufacturing method thereof
WO2025105903A1 (en) * 2023-11-15 2025-05-22 주식회사 디엑스 Diamond array segment manufacturing apparatus and diamond array segment manufacturing method using same

Also Published As

Publication number Publication date
KR20110084397A (en) 2011-07-22
EP2331295A1 (en) 2011-06-15
KR101607447B1 (en) 2016-03-29
KR20150126719A (en) 2015-11-12
EP2331295B1 (en) 2014-07-02

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