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WO2010020438A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2010020438A1
WO2010020438A1 PCT/EP2009/055817 EP2009055817W WO2010020438A1 WO 2010020438 A1 WO2010020438 A1 WO 2010020438A1 EP 2009055817 W EP2009055817 W EP 2009055817W WO 2010020438 A1 WO2010020438 A1 WO 2010020438A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling device
cooling
base plate
plate
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2009/055817
Other languages
German (de)
English (en)
Inventor
Bernd Brendel
Martin Helsper
Stephan Martin
Harald Ponath
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2010020438A1 publication Critical patent/WO2010020438A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W40/47—

Definitions

  • the invention relates to a cooling device for at least two power semiconductor modules, in particular IGBT power modules.
  • IGBT power modules also referred to as HV-IGBT modules, are semiconductor modules that use their
  • HV-IGBT modules have the following dimensions: 140x190 mm.
  • Such a HV-IGBT module is releasably connected to a cooling device with a maximum of six screws. With these screws, the entire base plate of the module must be mounted on the cooling device such that the entire base plate is thermally conductively connected to the cooling device.
  • a heat sink module with two power semiconductor modules is shown in the liquid cooling embodiment in FIG. 4 of DE 298 13 254 U1.
  • This heat sink module has at least one cooling channel which is connected to an inlet and outlet.
  • This cooling channel or the cooling channels run in the immediate vicinity of a mounting side of the heat sink module.
  • the heat sink module consists of an aluminum extruded profile, in which the or the cooling channels are introduced.
  • this heat sink or cooling device in two parts. These two parts are a cooling plate and a cover, also referred to as a lid.
  • a cooling plate In this cooling plate several adjacent grooves are milled, which open into a milled recess in the end regions. These milled recesses are connected by a bore with a connection. After this the milling work is completed, the lid is connected to the cooling plate. In this case, the lid can be welded or screwed to the cooling plate. In this connection, the lid must be mounted on the cooling plate so that the grooves are sealed liquid-tight. That is, these grooves together with the lid form one or more cooling channels.
  • a disadvantage of this two-part embodiment of a cooling device is that these cooling channels formed are not 100% liquid-tight. Coolant can escape through gaps formed by a groove wall and the lid. This leads to so-called crevice corrosion. Another disadvantage is that such a cooling device is expensive because of the many processing steps in the production.
  • this cooling block is composed of several extruded profiles, which are not detachably connected to each other. As a non-detachable connection is welded or glued.
  • This cooling block consists of an aluminum extruded profile and two U-section profiles.
  • This aluminum extruded profile has a region in which a plurality of coolant channels are arranged next to one another. In addition, this area has in each case on the narrow side an area which is provided for receiving fastening means of the semiconductor module (s) to be cooled.
  • This Alumniumstrangprofils are each provided with a recess. All coolant channels begin or end in a recess of the aluminum extruded profile. As a result, these coolant channels are connected in parallel in terms of liquid.
  • a U-extruded profile is slipped over these end portions of the aluminum extruded profile and welded to the aluminum extruded profile.
  • These U-strand profiles each have a connection means.
  • this recess forms together with a U-shaped extruded profile a coolant distributor or a coolant collector.
  • the coolant In the simplest case, the channels in the aluminum extruded profile were created by means of bores.
  • a further cooling device which is used as a cooling box for a thyristor.
  • This cooling device has as a central component to an aluminum extruded profile, which is cuboidal.
  • This aluminum extruded profile is provided from end to end with several holes. In each case two holes on one end face a groove-shaped recess are arranged in each case. These groove-shaped recesses are sealed liquid-tight with steel flakes to complete flow paths. This means that these steel plates are glued, soldered or welded to the groove-shaped recesses.
  • two holes are connected together in terms of coolant.
  • the invention is based on the object of specifying a cooling device which has an arbitrary cooling channel geometry and can nevertheless be produced inexpensively.
  • the cooling device is constructed in two parts, it is possible to provide the base plate with anydekanalgeometrie.
  • this cooling plate is designed as a casting, in particular as an aluminum casting.
  • a mold is needed, with which a plurality of base plates can be produced. Since a cooling channel geometry is no longer generated by means of milling and drilling, it can assume any shape that can be realized by casting.
  • this inventively cast base plate of the two-piece cooling device with respect to a base plate made of a machined aluminum extruded profile on a lower weight, since only there material is placed on the casting side, where cooling channels, one-day screwing points and stiffening make it necessary.
  • This cast base plate is closed by means of a cover plate, whereby the cooling channels arise.
  • These two parts of the two-part cooling device are not detachably connected to each other.
  • these two parts are brazed hard, wherein between the base plate and cover plate, a brazing sheet made of aluminum is arranged, which corresponds to the receiving side of the
  • Base plate is designed. That is, at locations where a cooling channel geometry is to be created by applying the cover plate, this solder sheet has recesses. By this brazing these two parts are baked together by means of the solder sheet.
  • 2 denotes a base plate, 4 a cover plate and 6 an insert.
  • the cover plate 4 consists of aluminum, in particular of rolled aluminum. This cover plate 4 is dimensioned such that it completely covers the base plate 2.
  • the base plate 2 is formed according to the invention as a casting.
  • the base plate 2 has a large-area recess 8 and a groove-shaped recess 10. Between this large-area recess 8 and the groove-shaped recess 10, a material surface 12 is provided, which is provided as an assembly area for the components to be cooled. In addition, this material surface 12 serves as a support of the cover plate 4.
  • This groove-shaped recess 10 and the large-scale recess 8 are each connected by a further groove-shaped recess 14 and 16 with an end face 18 of the base plate 2 of the two-piece cooling device.
  • An outer cooling circuit is connected to these connecting means.
  • a material surface 20 is likewise provided, which is provided as a mounting region and as a support of the cover plate 4.
  • These material regions 12 and 20 must be designed so that they each form a side wall for the groove-shaped recesses 10, 14 and 16 and the large-area recess 8. This means that these material areas 12 and 20 can be materially reduced in such a way that requirements imposed on these material areas 12 and 20 are met.
  • an insert 6 is provided which is arranged in the large-area recess 8.
  • This insert 6 serves to intensively swirl the cooling fluid flowing through the large-area recess 8. The resulting turbulences prevent laminar flows and thus ensure efficient heat transfer from the Cover plate 4 made of aluminum on the coolant.
  • this insert 6 can be configured and how this insert 6 is to be arranged in the large-area recess can be found in DE 41 31 739 A1. In Figures 5 to 7 of this DE 41 31 739 Al several embodiments of the insert 6 can be seen, in Figure 2 of this disclosure, the exact placement of the insert 6 is indicated in a large-scale recess 8.
  • a casting mold is produced. In this mold liquid aluminum is then poured. After cooling this mold, which is made in two parts (reuse), the cast base plate 2 is taken from this mold. Before this base plate 2 is soldered to a cover plate 4, if necessary, the surface which receives the solder sheet processed, for example, ground, be. Thereafter, the parts base plate 2, solder plate and cover plate 4 can be stacked and spatially fixed to each other and clamped. This tense
  • Cooling device is then housed in a furnace at a predetermined temperature and for a predetermined period of time. Due to the influence of temperature cover plate 4 and base plate 2 to a cooling device.
  • this base plate of this two-part cooling device according to the invention Due to the design of the base plate of this two-part cooling device according to the invention as a casting any cooling channel geometry can be realized, which could be realized with a processing machine in a base plate of extruded aluminum profile only with a lot of time.
  • this base plate of the two-part cooling device according to the invention is particularly inexpensive, so that the cooling device according to the invention has a significant cost saving compared with the cooling devices commercially available.
  • this cooling device according to the invention is weight-reduced, since only a material is provided there when a casting mold is produced, where it is molded in accordance with the invention. required requirements. This not only saves weight, but also saves resources.

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif de refroidissement pour au moins deux modules semi-conducteurs de puissance, en particulier des modules de puissance IGBT. Selon l'invention, ce dispositif de refroidissement possède une plaque de base (2) et une plaque de couverture (4). La plaque de base (2) est réalisée sous la forme d'une pièce moulée et possède une géométrie quelconque des canaux de refroidissement. Cette plaque de base (2) et la plaque de couverture (4) sont reliées ensemble de manière indissociable. On obtient ainsi un dispositif de refroidissement permettant de réaliser de manière économique une géométrie quelconque des canaux de refroidissement.
PCT/EP2009/055817 2008-08-22 2009-05-14 Dispositif de refroidissement Ceased WO2010020438A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008039335.5 2008-08-22
DE102008039335 2008-08-22

Publications (1)

Publication Number Publication Date
WO2010020438A1 true WO2010020438A1 (fr) 2010-02-25

Family

ID=41258258

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/055817 Ceased WO2010020438A1 (fr) 2008-08-22 2009-05-14 Dispositif de refroidissement

Country Status (1)

Country Link
WO (1) WO2010020438A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8938880B2 (en) 2012-02-20 2015-01-27 Wolverine Tube, Inc. Method of manufacturing an integrated cold plate for electronics
US9655294B2 (en) 2010-07-28 2017-05-16 Wolverine Tube, Inc. Method of producing electronics substrate with enhanced direct bonded metal
US9681580B2 (en) 2010-07-28 2017-06-13 Wolverine Tube, Inc. Method of producing an enhanced base plate
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
DE4131739A1 (de) * 1991-09-24 1993-04-01 Behr Industrietech Gmbh & Co Kuehleinrichtung fuer elektrische bauelemente
EP0661917A1 (fr) * 1994-01-03 1995-07-05 Motorola, Inc. Appareil pour dissipation de poissance et sa méthode de fabrication
US6166937A (en) * 1998-06-02 2000-12-26 Hitachi Ltd. Inverter device with cooling arrangement therefor
US20010017763A1 (en) * 2000-02-11 2001-08-30 Stefan Kaufmann Cooling device for a high-power semiconductor module
EP1175135A1 (fr) * 2000-07-21 2002-01-23 Mitsubishi Materials Corporation Dissipateur de chaleur à refroidissement par liquide et sa méthode de fabrication
DE10203238A1 (de) * 2002-01-28 2003-06-05 Siemens Ag Kühlbaustein
US20040190251A1 (en) * 2003-03-31 2004-09-30 Ravi Prasher Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US20070227697A1 (en) * 2006-03-30 2007-10-04 Dowa Metaltech Co., Ltd. Heat radiator

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
DE4131739A1 (de) * 1991-09-24 1993-04-01 Behr Industrietech Gmbh & Co Kuehleinrichtung fuer elektrische bauelemente
EP0661917A1 (fr) * 1994-01-03 1995-07-05 Motorola, Inc. Appareil pour dissipation de poissance et sa méthode de fabrication
US6166937A (en) * 1998-06-02 2000-12-26 Hitachi Ltd. Inverter device with cooling arrangement therefor
US20010017763A1 (en) * 2000-02-11 2001-08-30 Stefan Kaufmann Cooling device for a high-power semiconductor module
EP1175135A1 (fr) * 2000-07-21 2002-01-23 Mitsubishi Materials Corporation Dissipateur de chaleur à refroidissement par liquide et sa méthode de fabrication
DE10203238A1 (de) * 2002-01-28 2003-06-05 Siemens Ag Kühlbaustein
US20040190251A1 (en) * 2003-03-31 2004-09-30 Ravi Prasher Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US20070227697A1 (en) * 2006-03-30 2007-10-04 Dowa Metaltech Co., Ltd. Heat radiator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9655294B2 (en) 2010-07-28 2017-05-16 Wolverine Tube, Inc. Method of producing electronics substrate with enhanced direct bonded metal
US9681580B2 (en) 2010-07-28 2017-06-13 Wolverine Tube, Inc. Method of producing an enhanced base plate
US9795057B2 (en) 2010-07-28 2017-10-17 Wolverine Tube, Inc. Method of producing a liquid cooled coldplate
US10531594B2 (en) 2010-07-28 2020-01-07 Wieland Microcool, Llc Method of producing a liquid cooled coldplate
US8938880B2 (en) 2012-02-20 2015-01-27 Wolverine Tube, Inc. Method of manufacturing an integrated cold plate for electronics

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