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WO2010018466A3 - Device, in particular for flow guidance, and a method for manufacturing a device, in particular for flow guidance - Google Patents

Device, in particular for flow guidance, and a method for manufacturing a device, in particular for flow guidance Download PDF

Info

Publication number
WO2010018466A3
WO2010018466A3 PCT/IB2009/007604 IB2009007604W WO2010018466A3 WO 2010018466 A3 WO2010018466 A3 WO 2010018466A3 IB 2009007604 W IB2009007604 W IB 2009007604W WO 2010018466 A3 WO2010018466 A3 WO 2010018466A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
flow
dissipating means
heat sink
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2009/007604
Other languages
German (de)
French (fr)
Other versions
WO2010018466A2 (en
Inventor
Stefan Zick
Harald Redelberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brose Fahrzeugteile SE and Co KG
Original Assignee
Brose Fahrzeugteile SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brose Fahrzeugteile SE and Co KG filed Critical Brose Fahrzeugteile SE and Co KG
Publication of WO2010018466A2 publication Critical patent/WO2010018466A2/en
Publication of WO2010018466A3 publication Critical patent/WO2010018466A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A device, in particular for flow guidance, comprising a heat-generating element, in particular a component (1) through which a current flows, in particular for high output, comprising a flow-guiding element, in particular a guide plate (2) and/or a guide grating, to which the heat-generating element is attached, comprising a heat-dissipating means, in particular a heat sink (3) that is thermally coupled to the flow-guiding element for the purpose of dissipating heat, in particular heat resulting from frictional losses, wherein the thermal coupling of the heat-dissipating means, in particular the heat sink (3), is accomplished by way of a medium (10) for smoothing out unevenness, in particular an elastic medium, wherein a depression (6) that has a predefined depth (7) is made in the heat-dissipating means, in particular the heat sink (3), in an area of a potential difference (23) between a position of the flow-guiding element proximate to the heat-dissipating means and the heat-dissipating means, in particular the heat sink (3), said depression being substantially filled with a thermally conducting medium (5) at least in an area of contact (8) with the area of the potential difference (23).
PCT/IB2009/007604 2008-06-23 2009-07-29 Device, in particular for flow guidance, and a method for manufacturing a device, in particular for flow guidance Ceased WO2010018466A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200810029410 DE102008029410A1 (en) 2008-06-23 2008-06-23 Transmission-line device, has heat sink thermally connected to printed circuit board, and recess filled with thermal conducting medium in contact region for region of potential difference between position of circuit board and heat sink
DE102008029410.1 2008-06-23

Publications (2)

Publication Number Publication Date
WO2010018466A2 WO2010018466A2 (en) 2010-02-18
WO2010018466A3 true WO2010018466A3 (en) 2010-07-15

Family

ID=41334952

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2009/007604 Ceased WO2010018466A2 (en) 2008-06-23 2009-07-29 Device, in particular for flow guidance, and a method for manufacturing a device, in particular for flow guidance

Country Status (2)

Country Link
DE (1) DE102008029410A1 (en)
WO (1) WO2010018466A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011077206B4 (en) 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board
JP2015018971A (en) * 2013-07-11 2015-01-29 富士通株式会社 Heat radiation plate, and submarine apparatus
DE102015204915B4 (en) * 2015-03-18 2017-11-16 Continental Automotive Gmbh Wärmeleitkörper with a coupling surface with recess and heat transfer device
DE202017106861U1 (en) 2017-11-10 2018-01-03 Valeo Thermal Commercial Vehicles Germany GmbH electronics package
EP3483930B1 (en) 2017-11-10 2023-08-09 Valeo Thermal Commercial Vehicles Germany GmbH Electronic unit
JP7226087B2 (en) * 2019-05-20 2023-02-21 三菱電機株式会社 Electrical characteristic evaluation jig
DE102021123731A1 (en) 2021-09-14 2023-03-16 TDK Europe GmbH Electrical component with improved cooling and corresponding module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20100984U1 (en) * 2001-01-19 2001-05-03 Siemens AG, 80333 München Arrangement for cooling a component
US6545873B1 (en) * 2000-09-29 2003-04-08 Samsung Electronics Co., Ltd. System and method for extracting heat from a printed circuit board assembly
JP2006100483A (en) * 2004-09-29 2006-04-13 Matsushita Electric Works Ltd Heat dissipation structure of printed wiring board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4107312A1 (en) * 1991-03-07 1992-09-10 Telefunken Electronic Gmbh ASSEMBLY OF SEMICONDUCTOR COMPONENTS ON A PCB
DE19506664A1 (en) * 1995-02-25 1996-02-29 Bosch Gmbh Robert Electric control apparatus for vehicle IC engine electromechanical mechanism
US5607538A (en) * 1995-09-07 1997-03-04 Ford Motor Company Method of manufacturing a circuit assembly
DE19909505C2 (en) * 1999-03-04 2001-11-15 Daimler Chrysler Ag Process for the production of circuit arrangements
FR2798814B1 (en) * 1999-09-22 2001-11-16 Valeo Vision IMPROVEMENTS IN ELECTRONIC THERMAL DRAIN ASSEMBLIES, IN PARTICULAR FOR A MOTOR VEHICLE PROJECTOR DISCHARGE LAMP CONTROL MODULE
JP2003046211A (en) * 2001-08-01 2003-02-14 Omron Corp Electronic component mounting structure
DE10249436A1 (en) * 2001-11-08 2003-05-22 Tyco Electronics Amp Gmbh Heat sink for cooling power component on circuit board, has recess which receives power component, while establishing thermal contact between planar surfaces of heat sink and circuit board
JP2004221256A (en) * 2003-01-14 2004-08-05 Auto Network Gijutsu Kenkyusho:Kk Circuit structure and method of manufacturing the same
JP2007019125A (en) * 2005-07-06 2007-01-25 Yaskawa Electric Corp Electric power conversion device
JP4353186B2 (en) * 2006-01-06 2009-10-28 株式会社デンソー Electronic equipment
JP4742893B2 (en) * 2006-02-03 2011-08-10 日本電気株式会社 Heating device mounting apparatus and heat dissipation device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6545873B1 (en) * 2000-09-29 2003-04-08 Samsung Electronics Co., Ltd. System and method for extracting heat from a printed circuit board assembly
DE20100984U1 (en) * 2001-01-19 2001-05-03 Siemens AG, 80333 München Arrangement for cooling a component
JP2006100483A (en) * 2004-09-29 2006-04-13 Matsushita Electric Works Ltd Heat dissipation structure of printed wiring board

Also Published As

Publication number Publication date
DE102008029410A1 (en) 2009-12-24
WO2010018466A2 (en) 2010-02-18

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