[go: up one dir, main page]

WO2010013496A1 - 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置 - Google Patents

構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置 Download PDF

Info

Publication number
WO2010013496A1
WO2010013496A1 PCT/JP2009/003665 JP2009003665W WO2010013496A1 WO 2010013496 A1 WO2010013496 A1 WO 2010013496A1 JP 2009003665 W JP2009003665 W JP 2009003665W WO 2010013496 A1 WO2010013496 A1 WO 2010013496A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
conductor
transmission line
electronic device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/003665
Other languages
English (en)
French (fr)
Inventor
鳥屋尾博
安道徳昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP2010522633A priority Critical patent/JP5522042B2/ja
Priority to US13/057,032 priority patent/US8890761B2/en
Publication of WO2010013496A1 publication Critical patent/WO2010013496A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/30Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/2005Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/02Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/06Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0236Electromagnetic band-gap structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09309Core having two or more power planes; Capacitive laminate of two power planes

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguide Aerials (AREA)
  • Aerials With Secondary Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

本発明の構造体は、第1導体プレーンと、第1導体プレーンに少なくとも一部が対向して設けられた複数の第2導体プレーンと、第1導体プレーンと第2導体プレーンの一方の導体プレーンに少なくとも一部が対向して設けられ、一方の導体プレーンに対して他方の導体プレーンと反対側に配置された伝送線路と、伝送線路を他方の導体プレーンと電気的に接続する第1導体接続部と、を備える。第2導体プレーンと伝送線路と第1導体接続部とを少なくとも含んだ単位構造が繰り返し配置されている。
PCT/JP2009/003665 2008-08-01 2009-07-31 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置 Ceased WO2010013496A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010522633A JP5522042B2 (ja) 2008-08-01 2009-07-31 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置
US13/057,032 US8890761B2 (en) 2008-08-01 2009-07-31 Structure, printed circuit board, antenna, transmission line to waveguide converter, array antenna, and electronic device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008-199624 2008-08-01
JP2008199624 2008-08-01
JP2009-111439 2009-04-30
JP2009111439 2009-04-30

Publications (1)

Publication Number Publication Date
WO2010013496A1 true WO2010013496A1 (ja) 2010-02-04

Family

ID=41610206

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/003665 Ceased WO2010013496A1 (ja) 2008-08-01 2009-07-31 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置

Country Status (3)

Country Link
US (1) US8890761B2 (ja)
JP (1) JP5522042B2 (ja)
WO (1) WO2010013496A1 (ja)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011068238A1 (ja) * 2009-12-04 2011-06-09 日本電気株式会社 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、および電子装置
WO2011114746A1 (ja) * 2010-03-19 2011-09-22 日本電気株式会社 構造体
WO2011114944A1 (ja) * 2010-03-15 2011-09-22 日本電気株式会社 ノイズ抑制構造
WO2011152055A1 (ja) * 2010-06-02 2011-12-08 日本電気株式会社 構造体
WO2012008123A1 (ja) * 2010-07-12 2012-01-19 日本電気株式会社 電子機器
US20120299787A1 (en) * 2010-03-31 2012-11-29 Nec Corporation Radio communication apparatus
EP2555326A4 (en) * 2010-04-02 2014-07-02 Furukawa Electric Co Ltd BUILT-IN TRANSMIT AND RECEIVING RADAR ANTENNA
EP2784875A1 (en) 2013-03-29 2014-10-01 Fujitsu Limited Antenna and wireless communication apparatus
WO2014192784A1 (ja) * 2013-05-30 2014-12-04 日東電工株式会社 Ebg構造
JP2015142223A (ja) * 2014-01-28 2015-08-03 キヤノン株式会社 セル及び電磁バンドギャップ構造体
WO2015122204A1 (ja) * 2014-02-12 2015-08-20 株式会社村田製作所 ノイズ低減用電子部品
WO2015122203A1 (ja) * 2014-02-12 2015-08-20 株式会社村田製作所 プリント基板
JP2016178684A (ja) * 2010-03-31 2016-10-06 レノボ・イノベーションズ・リミテッド(香港) 無線通信装置
KR20180051180A (ko) * 2016-11-08 2018-05-16 삼성전자주식회사 무선 전력 전송 장치
CN115000694A (zh) * 2022-06-27 2022-09-02 天津津航计算技术研究所 一种小型全向辐射印刷天线
JP2023526456A (ja) * 2020-05-19 2023-06-21 カイメタ コーポレイション 単層広角インピーダンス整合(waim)
US20230402741A1 (en) * 2022-06-14 2023-12-14 Quanta Computer Inc. Wearable device

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5550100B2 (ja) * 2007-12-26 2014-07-16 日本電気株式会社 電磁バンドギャップ素子及びそれを用いたアンテナ並びにフィルタ
US8975978B2 (en) * 2010-08-30 2015-03-10 Nec Corporation Interconnect substrate and electronic device
GB201122324D0 (en) * 2011-12-23 2012-02-01 Univ Edinburgh Antenna element & antenna device comprising such elements
JP5964583B2 (ja) * 2011-12-28 2016-08-03 太陽誘電株式会社 積層コイル及びそれを利用した電子部品
US9515387B2 (en) * 2012-08-17 2016-12-06 Mediatek Inc. Multi-input multi-output antenna with electromagnetic band-gap structure
US20150204969A1 (en) * 2014-01-17 2015-07-23 SpotterRF LLC Target spotting and tracking apparatus and method
US10270180B2 (en) * 2014-02-04 2019-04-23 Nec Corporation Antenna apparatus
US10403973B2 (en) * 2014-04-22 2019-09-03 Intel Corporation EBG designs for mitigating radio frequency interference
JP6273182B2 (ja) * 2014-08-25 2018-01-31 株式会社東芝 電子機器
KR102139217B1 (ko) * 2014-09-25 2020-07-29 삼성전자주식회사 안테나 장치
TWI626793B (zh) * 2016-07-01 2018-06-11 和碩聯合科技股份有限公司 抗電磁干擾單元
WO2018021148A1 (ja) * 2016-07-27 2018-02-01 国立大学法人 岡山大学 印刷配線板
JP6809600B2 (ja) * 2017-04-03 2021-01-06 株式会社村田製作所 高周波モジュール
CN107611595B (zh) * 2017-07-18 2023-06-16 华南理工大学 一种应用于生物医学遥测的植入式mimo天线
WO2020262384A1 (ja) * 2019-06-25 2020-12-30 京セラ株式会社 アンテナ、無線通信モジュール及び無線通信機器
US12160216B2 (en) * 2020-12-15 2024-12-03 Intel Corporation Heatpipe to help reduce radio frequency interference
US12308517B2 (en) * 2022-02-10 2025-05-20 Swiftlink Technologies Inc. Periodic mode-selective structure for surface wave scattering mitigation in millimeter wave antenna arrays

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002510886A (ja) * 1998-03-30 2002-04-09 ザ リージェンツ オブ ザ ユニバーシテイ オブ カリフォルニア 金属の表面電流を除去する回路および方法
US20040160367A1 (en) * 2003-02-14 2004-08-19 Mendolia Greg S. Narrow reactive edge treatments and method for fabrication
JP2006253929A (ja) * 2005-03-09 2006-09-21 Mitsubishi Electric Corp Ebgマテリアル
WO2007127955A2 (en) * 2006-04-27 2007-11-08 Rayspan Corporation Antennas, devices and systems based on metamaterial structures
JP2008042233A (ja) * 2006-08-01 2008-02-21 Denso Corp 線路導波管変換器および無線通信装置
WO2009082003A1 (ja) * 2007-12-26 2009-07-02 Nec Corporation 電磁バンドギャップ素子及びそれを用いたアンテナ並びにフィルタ

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835540A (en) 1985-09-18 1989-05-30 Mitsubishi Denki Kabushiki Kaisha Microstrip antenna
US5598168A (en) 1994-12-08 1997-01-28 Lucent Technologies Inc. High efficiency microstrip antennas
JP3821039B2 (ja) 2002-04-09 2006-09-13 株式会社デンソー アンテナ装置
JP2003323092A (ja) 2002-04-30 2003-11-14 Toshiba Tec Corp 画像形成装置およびその制御方法
JP4260456B2 (ja) 2002-10-18 2009-04-30 株式会社ルネサステクノロジ システム
US8068743B2 (en) * 2002-12-18 2011-11-29 Lighttime, Llc System and method for precise, accurate and stable optical timing information definition
US7215007B2 (en) 2003-06-09 2007-05-08 Wemtec, Inc. Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
CN100477375C (zh) 2003-10-15 2009-04-08 松下电器产业株式会社 共振器
JP4550837B2 (ja) 2004-02-10 2010-09-22 テレフオンアクチーボラゲット エル エム エリクソン(パブル) 調整可能な装置
US7157992B2 (en) 2004-03-08 2007-01-02 Wemtec, Inc. Systems and methods for blocking microwave propagation in parallel plate structures
US20050205292A1 (en) 2004-03-18 2005-09-22 Etenna Corporation. Circuit and method for broadband switching noise suppression in multilayer printed circuit boards using localized lattice structures
US7136028B2 (en) 2004-08-27 2006-11-14 Freescale Semiconductor, Inc. Applications of a high impedance surface
US7136029B2 (en) 2004-08-27 2006-11-14 Freescale Semiconductor, Inc. Frequency selective high impedance surface
US7327208B2 (en) 2005-02-24 2008-02-05 Spreadtrum Communications Corporation Printed circuit board including a notch filter for attenuating radio frequency interference
US7446712B2 (en) 2005-12-21 2008-11-04 The Regents Of The University Of California Composite right/left-handed transmission line based compact resonant antenna for RF module integration
US7760140B2 (en) 2006-06-09 2010-07-20 Intel Corporation Multiband antenna array using electromagnetic bandgap structures
KR100723531B1 (ko) 2006-06-13 2007-05-30 삼성전자주식회사 반도체 패키지 기판
US7592957B2 (en) * 2006-08-25 2009-09-22 Rayspan Corporation Antennas based on metamaterial structures
KR101265245B1 (ko) 2006-11-01 2013-05-16 에이전시 포 사이언스, 테크놀로지 앤드 리서치 이중적층형 ebg 구조체
JP5271714B2 (ja) 2006-11-22 2013-08-21 Necトーキン株式会社 Ebg構造体、アンテナ装置、rfidタグ、ノイズフィルタ、ノイズ吸収シート及びノイズ吸収機能付き配線基板
KR100842071B1 (ko) * 2006-12-18 2008-06-30 삼성전자주식회사 컨커런트 모드 안테나 시스템
JP5019033B2 (ja) 2007-03-16 2012-09-05 日本電気株式会社 コモンモード電流抑制ebgフィルタ
KR100851065B1 (ko) 2007-04-30 2008-08-12 삼성전기주식회사 전자기 밴드갭 구조물 및 인쇄회로기판
KR100848848B1 (ko) 2007-07-12 2008-07-28 삼성전기주식회사 전자기 밴드갭 구조물, 이를 포함하는 인쇄회로기판과 그제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002510886A (ja) * 1998-03-30 2002-04-09 ザ リージェンツ オブ ザ ユニバーシテイ オブ カリフォルニア 金属の表面電流を除去する回路および方法
US20040160367A1 (en) * 2003-02-14 2004-08-19 Mendolia Greg S. Narrow reactive edge treatments and method for fabrication
JP2006253929A (ja) * 2005-03-09 2006-09-21 Mitsubishi Electric Corp Ebgマテリアル
WO2007127955A2 (en) * 2006-04-27 2007-11-08 Rayspan Corporation Antennas, devices and systems based on metamaterial structures
JP2008042233A (ja) * 2006-08-01 2008-02-21 Denso Corp 線路導波管変換器および無線通信装置
WO2009082003A1 (ja) * 2007-12-26 2009-07-02 Nec Corporation 電磁バンドギャップ素子及びそれを用いたアンテナ並びにフィルタ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANDO ET AL.: "Denshi Kiki no Dengen Noise Yokusei ni Muketa EBG Kozo no Kento -Inductance Zokagata EBG Kozo no Teian", IEICE TECHNICAL REPORT, vol. 107, no. 456, 18 January 2008 (2008-01-18), pages 25 - 30 *

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011068238A1 (ja) * 2009-12-04 2011-06-09 日本電気株式会社 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、および電子装置
US9350078B2 (en) 2009-12-04 2016-05-24 Nec Corporation Structural body, printed substrate, antenna, transmission line waveguide converter, array antenna, and electronic device
WO2011114944A1 (ja) * 2010-03-15 2011-09-22 日本電気株式会社 ノイズ抑制構造
WO2011114746A1 (ja) * 2010-03-19 2011-09-22 日本電気株式会社 構造体
US9385428B2 (en) 2010-03-19 2016-07-05 Nec Corporation Metamaterial structure
JP2016178684A (ja) * 2010-03-31 2016-10-06 レノボ・イノベーションズ・リミテッド(香港) 無線通信装置
EP2555317A4 (en) * 2010-03-31 2017-12-20 Nec Corporation Wireless communication device
EP2555323A4 (en) * 2010-03-31 2016-11-30 Nec Corp WIRELESS COMMUNICATION DEVICE AND POWER REDUCTION PROCESS
US9105980B2 (en) * 2010-03-31 2015-08-11 Lenovo Innovations Limited (Hong Kong) Radio communication apparatus
US20120299787A1 (en) * 2010-03-31 2012-11-29 Nec Corporation Radio communication apparatus
US8981998B2 (en) 2010-04-02 2015-03-17 Furukawa Electric Co., Ltd. Built-in transmitting and receiving integrated radar antenna
EP2555326A4 (en) * 2010-04-02 2014-07-02 Furukawa Electric Co Ltd BUILT-IN TRANSMIT AND RECEIVING RADAR ANTENNA
US8922455B2 (en) 2010-06-02 2014-12-30 Nec Corporation Structure
JP5790648B2 (ja) * 2010-06-02 2015-10-07 日本電気株式会社 構造体
WO2011152055A1 (ja) * 2010-06-02 2011-12-08 日本電気株式会社 構造体
CN102960083A (zh) * 2010-07-12 2013-03-06 日本电气株式会社 电子设备
WO2012008123A1 (ja) * 2010-07-12 2012-01-19 日本電気株式会社 電子機器
CN102960083B (zh) * 2010-07-12 2015-09-02 日本电气株式会社 电子设备
JP5831450B2 (ja) * 2010-07-12 2015-12-09 日本電気株式会社 電子機器
EP2784875A1 (en) 2013-03-29 2014-10-01 Fujitsu Limited Antenna and wireless communication apparatus
WO2014192784A1 (ja) * 2013-05-30 2014-12-04 日東電工株式会社 Ebg構造
JP2015142223A (ja) * 2014-01-28 2015-08-03 キヤノン株式会社 セル及び電磁バンドギャップ構造体
US9865932B2 (en) 2014-01-28 2018-01-09 Canon Kabushiki Kaisha Cell and electromagnetic band-gap structure
US10206274B2 (en) 2014-02-12 2019-02-12 Murata Manufacturing Co., Ltd. Printed circuit board
WO2015122204A1 (ja) * 2014-02-12 2015-08-20 株式会社村田製作所 ノイズ低減用電子部品
JPWO2015122204A1 (ja) * 2014-02-12 2017-03-30 株式会社村田製作所 ノイズ低減用電子部品
JPWO2015122203A1 (ja) * 2014-02-12 2017-03-30 株式会社村田製作所 プリント基板
WO2015122203A1 (ja) * 2014-02-12 2015-08-20 株式会社村田製作所 プリント基板
US10076022B2 (en) 2014-02-12 2018-09-11 Murata Manufacturing Co., Ltd. Noise reducing electronic component
KR20180051180A (ko) * 2016-11-08 2018-05-16 삼성전자주식회사 무선 전력 전송 장치
KR102607544B1 (ko) 2016-11-08 2023-11-30 삼성전자주식회사 무선 전력 전송 장치
JP2023526456A (ja) * 2020-05-19 2023-06-21 カイメタ コーポレイション 単層広角インピーダンス整合(waim)
US20230402741A1 (en) * 2022-06-14 2023-12-14 Quanta Computer Inc. Wearable device
US12088003B2 (en) * 2022-06-14 2024-09-10 Quanta Computer Inc. Wearable device
CN115000694A (zh) * 2022-06-27 2022-09-02 天津津航计算技术研究所 一种小型全向辐射印刷天线
CN115000694B (zh) * 2022-06-27 2024-04-26 天津津航计算技术研究所 一种小型全向辐射印刷天线

Also Published As

Publication number Publication date
JP5522042B2 (ja) 2014-06-18
JPWO2010013496A1 (ja) 2012-01-05
US20110134010A1 (en) 2011-06-09
US8890761B2 (en) 2014-11-18

Similar Documents

Publication Publication Date Title
WO2010013496A1 (ja) 構造体、プリント基板、アンテナ、伝送線路導波管変換器、アレイアンテナ、電子装置
WO2009143293A3 (en) Transceiver module with dual printed circuit boards
EP2388867A3 (en) Electrical connector having thick film layers
EP1909543A3 (en) Wired circuit board and electronic device
WO2005086978A3 (en) Embedded power management control circuit
WO2008129923A1 (ja) 高周波回路基板、高周波回路モジュールおよびレーダ装置
WO2008073372A3 (en) Multiple-antenna device having an isolation element
WO2008105478A1 (ja) 配線基板、電気信号伝送システムおよび電子機器
WO2011084235A3 (en) Glass core substrate for integrated circuit devices and methods of making the same
WO2009037796A1 (ja) フレキシブル配線基板の固定構造
ATE443932T1 (de) Elektrischer verbinder mit passiven schaltungselementen
EP1970722A3 (en) Protection Circuit Board for Secondary Battery
GB2465128A (en) Board edge termination back-end connection assemblies and communications connectors including such assemblies
EP1811823A4 (en) MULTILAYER CONDUCTOR PLATE
WO2008111578A1 (ja) 平面アンテナ及びこれを用いた通信装置並びにカード型端末
WO2009057691A1 (ja) 接続端子及びこれを用いたパッケージ並びに電子装置
JP4839362B2 (ja) 高周波回路モジュール
TW200728723A (en) Anisotropic conductive connector device and circuit device inspection device
WO2006138301A3 (en) Electronic signal splitters
WO2007127467A3 (en) Insulation displacement terminal
TW200731882A (en) Display module and electronic device using the same
WO2011163333A3 (en) Sandwich structure for directional coupler
WO2018004819A3 (en) Connector with structures for bi-lateral decoupling of a hardware interface
WO2007050429A3 (en) Array interconnect for improved directivity
TW200633322A (en) Connector

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09802741

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2010522633

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 13057032

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09802741

Country of ref document: EP

Kind code of ref document: A1