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WO2010011206A1 - Détecteur d'impact du type « à fente », et procédé associé - Google Patents

Détecteur d'impact du type « à fente », et procédé associé Download PDF

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Publication number
WO2010011206A1
WO2010011206A1 PCT/US2008/009036 US2008009036W WO2010011206A1 WO 2010011206 A1 WO2010011206 A1 WO 2010011206A1 US 2008009036 W US2008009036 W US 2008009036W WO 2010011206 A1 WO2010011206 A1 WO 2010011206A1
Authority
WO
WIPO (PCT)
Prior art keywords
fabrication method
connector body
forming
assembly
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2008/009036
Other languages
English (en)
Inventor
Chean Fay Cheng
Chin Wah Sung
Sze Lam Chua
Kai Chek Boh
Charles A. Cluff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Priority to PCT/US2008/009036 priority Critical patent/WO2010011206A1/fr
Publication of WO2010011206A1 publication Critical patent/WO2010011206A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values

Definitions

  • the present invention relates generally to the packaging and mounting of transducers within a host system such as a motor vehicle. More particularly, the present invention relates to a low cost crash sensor applicable for automotive passive restraint systems. Furthermore, the present invention relates to a process for building sensing circuits in a lead frame.
  • the present invention relates, in its preferred application, to crash sensor systems adapted for installation on an automotive vehicle equipped with a passive occupant restraint device such as an inflatable air bag or seat belt tensioner.
  • a passive occupant restraint device such as an inflatable air bag or seat belt tensioner.
  • the air bag is inflated to provide a protective cushion for the occupant or the seat belt is pulled back against the occupant holding him in a safe position.
  • Crash sensing switches traditionally employed in automotive applications traditionally include a ball or mass disposed within a sealed tube to bridge a pair of electrical contacts. During a crash event, the inertia of the ball causes it to move towards the contacts. For the ball to reach the contacts, air must flow between the ball and the tube.
  • Viscosity of the air in combination with inertia of the air causes a pressure differential that opposes ball movement through the tube. It is believed that in most vehicle crashes the viscous contribution to the pressure differential predominates over the inertial contribution. Viscous flow is proportional to the pressure differential which is proportional to the product of the mass of the ball and the deceleration of the crash sensing switch. The proportionality of viscous flow to deceleration and the requirement that the ball move a predetermined distance to bridge the contacts causes the current production crash sensing switch to be an acceleration integrator that completes the firing circuit upon a predetermined vehicular velocity change.
  • a permanent magnet in the commercial production crash sensing switch causes a bias force that urges the ball toward a normal resting position away from the electrical contacts. The bias force also causes the vehicular velocity change required for a switch closure to increase with the direction of the crash.
  • the present invention is an improved sensor packaging design which overcomes many of the shortcomings of prior art approaches. Specifically, the present invention provides what is needed in the industry, a robust, low cost packaging design which tolerates the use of non-traditional, low cost materials while maintaining precision of alignment and system integrity under a full range of harsh operating conditions.
  • An object of the present invention is to provide a slot card sensor assembly which includes a substantially planar substrate which has its surface bifurcated into a circuit component mounting surface portion and a contact pad surface portion.
  • a plurality of electrical circuit components including a sensing element digitizing integrated circuit, are mounted on the circuit component mounting surface portion, and a plurality of contact pads are mounted on the contact pad mounting surface portion.
  • a layer of electrically insulating over molding material is provided to conform with and cover the component mounting surface portion and simultaneously encase the circuit components, while exposing the contact pads.
  • various means are provided for fixedly mounting the slot card sensor assembly to an associated automobile. This has the advantage of providing a robust, flexible mounting system.
  • the mounting means comprises a female connector assembly which is adapted to be configured at a terminus of an associated automobile wiring harness.
  • the female connector assembly comprises a connector body which defines a cavity therein with an opening configured for aligned slip-fit engagement with the outer peripheral surface of the over molding material, and a plurality of electrical contacts which are insulatively carried within the connector body and arranged to electrically engage the contact pads upon insertion of the sensor subassembly within the sensor housing.
  • the connector body includes a mounting retention feature, such as a fastener receiving passageway, a spring retainer or an adhesive, integrally formed therein or carried thereon.
  • a method of fabricating an automotive crash sensor comprises the steps of forming a generally planer lead frame of electrically conductive material having a first portion which defines a dambar and a circuitry pattern including conductive traces and at least one circuit component die pad.
  • the lead frame also has a second portion which defines a plurality of conductive leads.
  • discrete circuit elements are affixed to the circuitry pattern by conductive adhesive and a sensing element digitizing integrated circuit is affixed to the die pad.
  • the integrated circuit is electrically interconnected to the circuitry pattern by wire bonding.
  • the lead frame, circuit elements and integrated circuit are thermoset over molded.
  • the dambar is trimmed to electrically segregate the disparate conductive leads.
  • FIG. 1 is a perspective view of the substrate portion of the preferred embodiment of the present invention, wherein the substrate is populated with surface mount technology circuit components including an accelerometer and an
  • ASIC as bare dies
  • FIG. 2 is a perspective view of the substrate of Figure 1, with a conforming layer of electrically insulating overmolding material covering the component mounting surface of the substrate to fully encase the circuit components and to support a resilient peripheral seal;
  • FIG. 3 is an exploded, peripheral view of the slot card sensor assembly of Figure 2, aligned for installation within a mating connector assembly;
  • FIG. 4 is a peripheral view of the slot card sensor assembly fully installed within the mating connector assembly of Figure 3;
  • FIG. 5 is a cross-sectional plan view of the assembled slot card sensor assembly and mating connector assembly of Figure 4;
  • FIG. 6 is a perspective view of a continuous roll of conductive material employed to sequentially form discrete lead frames and a single lead frame separated there from;
  • FIG. 7 is a perspective view of the lead frame of Figure 6, on a greatly expanded scale, populated with discrete circuit elements;
  • FIG. 8 is a perspective view of the lead frame of Figure 7, further populated with an accelerometer die and an ASIC die;
  • FIG. 9 is a broken, perspective view of the lead frame assembly of
  • FIG. 10 is a perspective view of the lead frame assembly of Figure 9, with the conductive traces of the lead frame, the discrete circuit elements, the accelerometer die and ASIC die insert molded within a block of non-conductive thermoset material, and with portions of the dambar and conductive leads exposed;
  • FIG. 11 is a perspective view of the over molded lead frame assembly of Figure 10, with the dambar trimmed to electrically segregate the conductive leads;
  • FIG. 12 is a perspective view, on a reduced scale, of the over molded, trimmed lead frame assembly of Figure 11, finally assembled within an alternative embodiment housing assembly illustrated in phantom;
  • FTG. 13 is a perspective view, on a reduced scale, of the over molded, trimmed lead frame assembly of figure 11, finally assembled within a second alternative embodiment housing assembly.
  • the manufacturing of crash sensors for automotive applications continues to becoming more and more competitive in terms of cost and technology.
  • the current predominant packaging technology used widely in the market consists of a packaged sensing element and an application specific integrated circuit (ASIC) in a semiconductor packaging form (for example, small outline integrated circuit or SOIC) mounted on a printed circuit board which has the supporting discrete components surface mounted.
  • ASIC application specific integrated circuit
  • SOIC small outline integrated circuit
  • the populated printed circuit board is then secured with adhesive in a housing to protect the circuit components with either a closure member or potting material.
  • the housing includes means for mounting such as a bushing.
  • An essential idea behind the present invention is to provide a packaging method that is skeletal (with minimal layers of material) and yet proven to be robust to ensure that it can meet the performance and endurance specifications of the mass market.
  • the associated assembly processes will also be reduced inasmuch as current housing and encapsulation methods are no longer required.
  • Products embodying the present invention significantly reduce both production and shipping costs and result in improved products of reduced weight and size as well as optimized dimensional proportions.
  • the present invention describes a design and manufacturing process that overcomes the inherent cost limitations (such as excessive housing material costs and complex manufacturing process costs) for previous sensor designs by using minimal packaging material and simplified processes.
  • the resulting end product will be small, light weight, cost competitive and significantly easy to assemble within a host vehicle.
  • a generally rectangular, planer substrate 10 is bifurcated into a first or circuit component mounting surface portion 12 and a second or contact pad mounting surface portion 14.
  • a plurality of circuit components 20, preferably surface mount technology (SMT) components, are first surface mounted on to the circuit component mounting surface portion 12 of the substrate 10.
  • SMT surface mount technology
  • a sensing element such as an accelerometer 16, a sensing element digitizing integrated circuit embodied as an ASIC 18 and a number of additional discrete components 20.
  • the accelerometer 16 and ASIC 18 are employed as bare dies and are interconnected to conductive traces (not illustrated) on the substrate 10 by wire bonding.
  • both the accelerometer 16 and ASIC 18 can be configured as packaged integrated circuits (ICs), thereby eliminating the need for wire bonding and wherein all circuit components are surface mounted. Such ICs would be reflow connected as with the other SMT components.
  • Components that can be over molded include ASICs of the digital and/or analog/digital mixed signal type devices. ASICs can be prepackaged (i.e. previously over molded) of used bare die in the over molding operation. Inertial sensors for sensing linear acceleration or rotational velocity would also be included in the over molding process.
  • MEMS Micro Electrical Mechanical Systems
  • Examples of the manufacturing processes for MEMS include but are not limited to bulk micromachining techniques and surface micromachining techniques.
  • the MEMS devices could be provided as bare silicon devices, or may be prepackaged like the ASICs in a previous over molding process.
  • discrete resistor and capacitor elements can also be included in the assembly that is over molded.
  • a plurality of contact pads 22 are first surface mounted to the contact pad mounting portion 14 of the substrate 10. Each contact pad 22 is electrically in-circuit with the circuit components via conductive traces (not illustrated) to form a crash sensor circuit.
  • the substrate 10 can be formed of ceramic, as a printed circuit board (PCB) or other suitable configuration.
  • a slot card subassembly 28 is illustrated. Following mounting of the circuit components to the substrate 10, as depicted in Figure 1, the circuit component mounting portion 12 of the substrate 10 is over- molded by a relatively thin layer 30 of electrically insulating material. The contact pad mounting portion 14 of the substrate 10, as well as the contact pads 22 remain uncovered. The layer 30 serves to provide a thin "skeletal" structural support of circuit subassembly 26, to isolate and seal the circuit components from atmosphere borne contaminates and to mitigate thermal stresses and solder joint fatigue caused in part by large differences in the differential coefficients of thermal expansion (CTE) that exist between the substrate 10 and the surface mount device materials.
  • CTE differential coefficients of thermal expansion
  • the thin rigid shell 30 formed by the overmolding material is laterally elongated along an axis parallel to the plane defined by the substrate 10 and defines an outer peripheral surface including flat, parallel upper and lower wall surfaces 32 and 34, respectively, and curved, opposed left and right side wall surfaces 36 and 38, respectively.
  • the shell 30 is insert injection molded from relatively inexpensive thermoplastic resin material such as polyvinyl chloride (PVC).
  • PVC polyvinyl chloride
  • a resilient polymer O-ring seal 40 is affixed to the peripheral outer circumferential surface of shell 30.
  • the inner end portion (i.e., the left portion intermediate the O-ring seal 40 and the contact pads 22) of the shell 30 forms parallel guide slots 42 in upper wall surface 32. Similar guide slots (not illustrated) can be formed in the lower wall surface 42.
  • the guide slots 42 open upwardly and are elongated along the axis of insertion of sensor subassembly 28 within the mating connector body (Refer Figure 3).
  • the inner end portion of the shell 30 also forms opposed ramped engagement surfaces 44 extending upwardly from the upper wall surface 32 and the lower wall surface 34.
  • the outer end portion of the shell 30 forms laterally opposed finger/tool engagement surfaces 46 to serve as an aide in installing and removing the sensor subassembly 28 from the mating connector body.
  • slot card sensor subassembly 28 After initial fabrication of the slot card sensor subassembly 28, it can be applied within virtually any automobile configuration. Groups of such subassemblies 28 are thereafter sent to trim (i.e., programming of register/memory with product/application specific information) and test via the exposed gold contact pads 22. These process steps complete the LCMM SC sensor module 28 assembly.
  • a connector assembly 48 configured to mate with slot card sensor subassembly 28 is illustrated prior to insertion ( Figure 3) and after insertion ( Figure 4).
  • the connector assembly 48 serves to electrically interconnect the sensor subassembly 28 with a host vehicle electrical system, including power source, control logic and safety devices.
  • the connector assembly 48 is a terminus of a vehicle wiring harness 50, wherein at least a pair of insulated wires 52 and associated strain relief devices 54 extend within a female connector body 56.
  • the connector body 56 also defines a mounting retention feature for affixing the fully assembled sensor subassembly 28 and connector assembly 48 depicted in Figure 4.
  • the mounting can be accomplished by threaded fasteners, clips or adhesive.
  • Dressing of the harness 50 is first affected on the host vehicle.
  • the connector body 56 is then secured to the desired location of the vehicle via screw mounting, adhesive mounting or clip mounting.
  • the LCMM SC is then slotted into the connector assembly 48.
  • electrical contacts such as tulip connections, arranged in-circuit with harness wires 52 are used to engage the gold contact pads 22 on the LCMM SC to complete the circuit.
  • ramped engagement surfaces interlock the LCMM SC substantially entirely within the connector body 56 and the O-ring will provide a seal between the LCMM SC and the connector body 56.
  • FIG. 3 - 5 a typical installation of a slot card crash sensor assembly 58 upon a designated mounting surface 60 location of a host automobile 62 is depicted.
  • the female connector body 56 includes a passage 64 extending entirely there through.
  • a bushing 66 constructed of electrically conductive material is insert molded or press fit within through passage and preferably extends entirely there through whereby its end surfaces are substantially flush with adjacent surface portions of the outer surfaces of the female connector body.
  • the bushing has a connector lead 68 extending within the connector body 56 from the bushing 66 to an associated connector (not illustrated) to establish a ground path from one of the contact pads 22 to the automobile 62 body.
  • the connector assembly 48 is affixed to the automobile 62 by a bolt 70 extending through the bushing 66 and a registering hole 72 in the automobile 62 secured by a nut 74. Upon assembly, the bolt 70 compressively loads the bushing 66 against the surface location 60.
  • the bushing is formed of material having substantially a higher modulus of elasticity than the material forming the connector body 56, thus preventing creep or distortion over time, to ensure precise positioning of sensor subassembly 28.
  • the connector body 56 has a locating tab 76 integrally formed and extending from the lower wall thereof into a registering hole 78 in the vehicle 62 to ensure precisely fixed positioning of the sensor assembly 58 with respect to the vehicle 62.
  • Strain relief devices 54 are provided at the lead-in of each wire 52 to also prevent wire chaffing and enhance sealing. Strain relief devices 54 can be formed of resilient material such as plastic, rubber, or the like and can be pressed in place or insert molded within the connector body 56. [0045]
  • the connector body 56 defines a substantially closed cavity 80 therein emerging through a shaped opening 82 in the leading edge 84.
  • An opposed pair of blind recesses 86 opening within the cavity 80 are configured to snap-engage the cooperating ramped engagement surfaces 44 of slot card sensor subassembly 28 to hold the sensor assembly together.
  • the opening 82 is horizontally elongated and has a vertical centerline which intersects the vertical axis of the through passage 64.
  • each wire 52 terminates within the connector body 56 in a resilient connector 88.
  • the connectors 88 are laterally arranged to individually register with an associated contact pad 22 on the substrate 10 to ensure reliable electrical interconnection there between.
  • Guide slots 42 register with cooperating guide surfaces (not illustrated) integrally formed on interior walls of connector body 56 forming cavity 80.
  • the guide slots 42 and cooperating guide surfaces ensure that the sensor subassembly 28 remains in register with the connector body 56 during the entire insertion process.
  • the over molding material 30 includes outwardly directed integral walls 90 forming an inwardly directed abutment surface 92 which provides a sealing surface acting in cooperation with the O-ring seal 40 and also abuts the leading edge 84 of the connector body 56 to define an insertion stop for the sensor subassembly 28.
  • the over molding material 30 is formed having a nominal thickness (designated "T-om") and the walls of the connector body 56 have a nominal thickness (designated "T-cb”). Because the sensor subassembly 28 is precisely nestingly received within the connector body 56, the thickness T-om is minimalized and most of the structural support of the crash circuit subassembly 26 is provided by the connector body, T-cb » T-om. Furthermore, the over molding material 30 can be formed from material having a higher modulus of elasticity, which better accommodates the thermal expansion properties of the substrate 10 and the components 16, 18 and 20 mounted thereon.
  • the present invention describes a design and manufacturing process that overcomes the inherent cost limitations (such as rise in substrate cost and housing cost) for sensors using the least packaging material as possible.
  • the circuitry will be half of the current size of 13.3mm x 25.4mm with the added advantage of lead-free construction with the discrete components mounted using conductive polymer instead of leaded solder.
  • the cost advantage is in metal stamping the electrical circuitry onto the lead frame hence omitting the role of the traditional substrate (FR4, BT or ceramic) as circuitry.
  • one aspect of the present invention is to produce a packaging method that is as skeletal (with minimal layers of material) and yet robust to target for mass markets such as automotive.
  • the assembly processes are reduced from 28 process steps to 17 process steps.
  • the complexity of the circuit housing is eliminated hence cheaper tooling cost and unit cost.
  • Current encapsulation methods are no longer needed.
  • the wiring harness can be molded together with the module, eliminating the connector, thereby adding to the value stream.
  • the end product will be cost effective and have tremendous ease in assembly with the host vehicle.
  • Figures 6 - 11 serially depict fabrication and assembly steps of a crash sensor circuit subassembly.
  • a continuous roll 94 of sheet-like electrically conductive material such as copper alloy is employed to blank and form a stream of lead frames 96 at the beginning of the manufacturing process.
  • the roll 94 of source material is bifurcated into two distinct thicknesses, a relatively thin portion 98 having a nominal thickness of 0.30mm for forming a pattern of conductive traces in the lead frame 96, and a relatively thick portion 100 having a nominal thickness of 0.64mm for forming a plurality of conductive leads in the lead frame 96.
  • the thin portion 98 will ultimately have the circuitry pattern stamped/etched therein while the thick portion 100 will have the connecting leads stamped/etched therein.
  • the lead frame 96 has a first portion 102 which is stamped or etched to define a circuitry pattern including conductive traces 104 and, in the present embodiment, two die pads 106 and 108.
  • Discrete circuit components 110 are mounted to bridge adjacent traces 104 and are preferably affixed thereto by a conductive epoxy adhesive, such as that described in U.S. Patent No.: 5,891,367, which is hereby incorporated herein by reference.
  • the lead frame 96 has a second portion 112 which is stamped or etched to define conductive leads 114 and 116. Both portions 102 and 112 of the lead frame 96 define dambars 118 and 120, respectively.
  • the conductive leads 114 and 116 are gold plated to enhance electrical conductivity.
  • a sensing circuit element digitizing integrated circuit such as an accelerometer 122 is bonded to die pad 106 of lead frame 96, and a control circuit ASIC 124 is bonded to die pad 108 of lead frame 96.
  • the accelerometer 122 and the ASIC can also be affixed to the lead frame 96 by conductive epoxy adhesive.
  • leads 126 are wirebonded between terminal ports of accelerometer 122, ASIC 124 and associated adjacent conductive traces 104.
  • the lead frame based circuit assembly depicted in Figure 9 is then insert molded within electrically insulating thermoset material 128 to fully encapsulate the discrete circuit components 110, the accelerometer 122 and the ASIC 124, as well as substantially encasing the circuitry pattern of the lead frame 96. Thereafter, only the conductive leads 114 and 116, and the dambars 118 and 120 are exposed.
  • FIG. 11 a completed slot card crash sensor subassembly 130 is illustrated wherein the dambars 118 and 120 are then trimmed, removed, disconnected, etc. to electrically segregate each of the conductive leads 114 and 116. Furthermore, small segments of certain conductive traces 104 may remain extending externally of the thermoset material 128 to provide external access to predetermined portions of the crash sensor circuit to "burn in" programming code, validate proper operation and the like.
  • the conductive leads 114 and 116 are comparable to and operatively equivalent to the contact pads 22 as described in the embodiment of drawing figures 1 - 5.
  • the slot card sensor subassembly 130 or LCMM- CS can be installed and supported within a connector assembly 48 (as described in connection with Figures 1 - 5) wherein the connector assembly 48 is an integral part of the host vehicle wiring harness 50 and is rigidly affixed to the vehicle by fasteners, clips and or adhesives.
  • Sensor subassembly 130 is thus the functional equivalent to sensor subassembly 28, but is illustrated in a somewhat schematic form for the sake of simplicity.
  • Figure 12 represents a first alternative embodiment wherein the sensor subassembly 130 is mounted within a discrete housing assembly 132 constructed of molded thermoplastic material.
  • the housing assembly 132 includes an integral female connector body 134 adopted to receive a male wiring harness borne connector (not illustrated) for electrically engaging conductive leads 114 and 116, which is guided along an insertion axis by guide ribs 136 and locked in place by a ramped, snap action engagement feature 138.
  • a flat outer surface 140 of connector body 134 oriented normally to an accelerometer sensing axis (designated by an arrow 142) carries an integral locating pin 144 and is configured to abut a mounting surface of the host vehicle via an intermediate adhesive pad 146. Locating pin 144 could extend through a hole formed in the vehicle mounting surface and be positively locked in place by, for example, a Tinnerman® type clip (not illustrated).
  • Figure 13 represents a second alternative embodiment wherein the sensor assembly 130 (Figure 12) is insert mounted within a hermetically sealed housing assembly 148 as an integral part or terminus of a host vehicle wiring harness 150.
  • a hermetically sealed housing assembly 148 as an integral part or terminus of a host vehicle wiring harness 150.
  • two or more wires 152 are crimped together and would pass into housing assembly 148 as a pigtail for interconnection directly with conductive leads 114 and 116 ( Figure 12) through a resilient grommet 154 providing strain relief, chafing resistance and sealing of the housing assembly 148.
  • the housing assembly 148 has an integral locating pin 154 for precisely orienting and retaining the housing assembly 148 to its host vehicle.

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Abstract

Le boîtier d'un détecteur, peu onéreux et pourtant extrêmement solide, destiné à des applications automobiles, emploie une construction de en squelette (avec un minimum de couches de matériaux). En conséquence, des matériaux moins onéreux et non classiques sont employés, et les étapes du processus d'assemblage sont simplifiées ou éliminées, ce qui permet de réduire les coûts et d'augmenter la souplesse de conception. Un modèle de détecteur du type « à fente » peut employer un corps de connecteur de faisceau de câblage classique comme point de montage afin d'améliorer la fiabilité et les performances. Une structure de châssis plan en plomb supprime la nécessité d'utiliser un substrat ou une carte de circuit imprimé. Des composants de circuit discrets, un accéléromètre, et un circuit ASIC, sont collés au châssis en plomb au moyen d'un adhésif conducteur, ce qui permet d’éliminer le soudage à base de plomb.
PCT/US2008/009036 2008-07-25 2008-07-25 Détecteur d'impact du type « à fente », et procédé associé Ceased WO2010011206A1 (fr)

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PCT/US2008/009036 WO2010011206A1 (fr) 2008-07-25 2008-07-25 Détecteur d'impact du type « à fente », et procédé associé

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Application Number Priority Date Filing Date Title
PCT/US2008/009036 WO2010011206A1 (fr) 2008-07-25 2008-07-25 Détecteur d'impact du type « à fente », et procédé associé

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WO2010011206A1 true WO2010011206A1 (fr) 2010-01-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011121412A1 (de) * 2011-12-17 2013-06-20 Continental Automotive Gmbh Verfahren zur Herstellung eines Sensors und Sensor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6339252B1 (en) * 1999-08-09 2002-01-15 Amkor Technology, Inc. Electronic device package and leadframe
US20070040663A1 (en) * 2005-08-19 2007-02-22 Automotive Systems Laboratory, Inc. Fastener integrated sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6339252B1 (en) * 1999-08-09 2002-01-15 Amkor Technology, Inc. Electronic device package and leadframe
US20070040663A1 (en) * 2005-08-19 2007-02-22 Automotive Systems Laboratory, Inc. Fastener integrated sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011121412A1 (de) * 2011-12-17 2013-06-20 Continental Automotive Gmbh Verfahren zur Herstellung eines Sensors und Sensor
US9649796B2 (en) 2011-12-17 2017-05-16 Continental Teves Ag & Co. Ohg Method for producing a sensor, and sensor

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