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WO2010093733A3 - Detecting defects on a wafer - Google Patents

Detecting defects on a wafer Download PDF

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Publication number
WO2010093733A3
WO2010093733A3 PCT/US2010/023802 US2010023802W WO2010093733A3 WO 2010093733 A3 WO2010093733 A3 WO 2010093733A3 US 2010023802 W US2010023802 W US 2010023802W WO 2010093733 A3 WO2010093733 A3 WO 2010093733A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
detecting defects
defects
detecting
systems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2010/023802
Other languages
French (fr)
Other versions
WO2010093733A2 (en
Inventor
Junqing Huang
Yong Zhang
Stephanie Chen
Tao Luo
Lisheng Gao
Richard Wallingford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Priority to CN201080016422.8A priority Critical patent/CN102396058B/en
Priority to KR1020117021145A priority patent/KR101674698B1/en
Priority to SG2011056926A priority patent/SG173586A1/en
Priority to EP10741683A priority patent/EP2396815A4/en
Priority to JP2011550208A priority patent/JP5570530B2/en
Publication of WO2010093733A2 publication Critical patent/WO2010093733A2/en
Publication of WO2010093733A3 publication Critical patent/WO2010093733A3/en
Priority to US13/196,758 priority patent/US8775101B2/en
Priority to IL214488A priority patent/IL214488A/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H10P74/203—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)

Abstract

Methods and systems for detecting defects on a wafer are provided.
PCT/US2010/023802 2009-02-13 2010-02-10 Detecting defects on a wafer Ceased WO2010093733A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201080016422.8A CN102396058B (en) 2009-02-13 2010-02-10 Detecting defects on a wafer
KR1020117021145A KR101674698B1 (en) 2009-02-13 2010-02-10 Detecting defects on a wafer
SG2011056926A SG173586A1 (en) 2009-02-13 2010-02-10 Detecting defects on a wafer
EP10741683A EP2396815A4 (en) 2009-02-13 2010-02-10 DETECTION OF DEFECTS ON A WAFER
JP2011550208A JP5570530B2 (en) 2009-02-13 2010-02-10 Defect detection on wafer
US13/196,758 US8775101B2 (en) 2009-02-13 2011-08-02 Detecting defects on a wafer
IL214488A IL214488A (en) 2009-02-13 2011-08-07 Detecting chip defects

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15247709P 2009-02-13 2009-02-13
US61/152,477 2009-02-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/196,758 Continuation US8775101B2 (en) 2009-02-13 2011-08-02 Detecting defects on a wafer

Publications (2)

Publication Number Publication Date
WO2010093733A2 WO2010093733A2 (en) 2010-08-19
WO2010093733A3 true WO2010093733A3 (en) 2010-10-28

Family

ID=42562263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/023802 Ceased WO2010093733A2 (en) 2009-02-13 2010-02-10 Detecting defects on a wafer

Country Status (7)

Country Link
EP (1) EP2396815A4 (en)
JP (1) JP5570530B2 (en)
KR (1) KR101674698B1 (en)
CN (1) CN102396058B (en)
IL (1) IL214488A (en)
SG (1) SG173586A1 (en)
WO (1) WO2010093733A2 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7570796B2 (en) 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8194968B2 (en) 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US8213704B2 (en) 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en) 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8139844B2 (en) 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
WO2010014609A2 (en) 2008-07-28 2010-02-04 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
JP2012119512A (en) * 2010-12-01 2012-06-21 Hitachi High-Technologies Corp Substrate quality evaluation method and apparatus therefor
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) * 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) * 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects
US9355208B2 (en) 2013-07-08 2016-05-31 Kla-Tencor Corp. Detecting defects on a wafer
US10338004B2 (en) * 2014-03-27 2019-07-02 KLA—Tencor Corp. Production sample shaping that preserves re-normalizability
US9535010B2 (en) * 2014-05-15 2017-01-03 Kla-Tencor Corp. Defect sampling for electron beam review based on defect attributes from optical inspection and optical review
US10127653B2 (en) * 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US10267746B2 (en) * 2014-10-22 2019-04-23 Kla-Tencor Corp. Automated pattern fidelity measurement plan generation
US9518934B2 (en) * 2014-11-04 2016-12-13 Kla-Tencor Corp. Wafer defect discovery
US9830421B2 (en) * 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10062543B2 (en) * 2015-06-23 2018-08-28 Kla-Tencor Corp. Determining multi-patterning step overlay error
CN108475422B (en) * 2015-08-12 2019-09-06 科磊股份有限公司 Locating defects in electron beam images
US10535131B2 (en) * 2015-11-18 2020-01-14 Kla-Tencor Corporation Systems and methods for region-adaptive defect detection
CN105699396A (en) * 2016-03-29 2016-06-22 同高先进制造科技（太仓）有限公司 Pollution detection device and method of welding laser head protective glasses based on light scanning
US10699926B2 (en) * 2017-08-30 2020-06-30 Kla-Tencor Corp. Identifying nuisances and defects of interest in defects detected on a wafer
US11114324B2 (en) * 2019-04-10 2021-09-07 KLA Corp. Defect candidate generation for inspection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010037026A (en) * 1999-10-13 2001-05-07 윤종용 Wafer inspection system having recipe parameter library and method of setting recipe prameters for wafer inspection
KR20010101697A (en) * 1999-11-29 2001-11-14 기시모토 마사도시 Defect inspecting system
KR20060075691A (en) * 2004-12-29 2006-07-04 삼성전자주식회사 Fault inspection method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07159337A (en) * 1993-12-07 1995-06-23 Sony Corp Defect inspection method for semiconductor device
JP3524853B2 (en) * 1999-08-26 2004-05-10 株式会社ナノジオメトリ研究所 Pattern inspection apparatus, pattern inspection method, and recording medium
KR20020063582A (en) * 2000-10-02 2002-08-03 어플라이드 머티어리얼스, 인코포레이티드 Defect source identifier
US7693323B2 (en) * 2002-03-12 2010-04-06 Applied Materials, Inc. Multi-detector defect detection system and a method for detecting defects
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
JP2007147376A (en) * 2005-11-25 2007-06-14 Nikon Corp Inspection device
JP4851960B2 (en) * 2006-02-24 2012-01-11 株式会社日立ハイテクノロジーズ Foreign matter inspection method and foreign matter inspection device
JP2007298284A (en) 2006-04-27 2007-11-15 Mitsui Mining & Smelting Co Ltd Determination of hexavalent chromium
JP4641278B2 (en) 2006-05-02 2011-03-02 リンナイ株式会社 Gas burner
US8611639B2 (en) * 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
JP5022191B2 (en) * 2007-11-16 2012-09-12 株式会社日立ハイテクノロジーズ Defect inspection method and defect inspection apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010037026A (en) * 1999-10-13 2001-05-07 윤종용 Wafer inspection system having recipe parameter library and method of setting recipe prameters for wafer inspection
KR20010101697A (en) * 1999-11-29 2001-11-14 기시모토 마사도시 Defect inspecting system
KR20060075691A (en) * 2004-12-29 2006-07-04 삼성전자주식회사 Fault inspection method

Also Published As

Publication number Publication date
EP2396815A2 (en) 2011-12-21
JP2012518278A (en) 2012-08-09
JP5570530B2 (en) 2014-08-13
IL214488A0 (en) 2011-09-27
EP2396815A4 (en) 2012-11-28
KR20110124303A (en) 2011-11-16
CN102396058A (en) 2012-03-28
SG173586A1 (en) 2011-09-29
KR101674698B1 (en) 2016-11-09
WO2010093733A2 (en) 2010-08-19
IL214488A (en) 2016-04-21
CN102396058B (en) 2014-08-20

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