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WO2010092456A2 - Plant of cellular heating to floor - Google Patents

Plant of cellular heating to floor Download PDF

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Publication number
WO2010092456A2
WO2010092456A2 PCT/IB2010/000258 IB2010000258W WO2010092456A2 WO 2010092456 A2 WO2010092456 A2 WO 2010092456A2 IB 2010000258 W IB2010000258 W IB 2010000258W WO 2010092456 A2 WO2010092456 A2 WO 2010092456A2
Authority
WO
WIPO (PCT)
Prior art keywords
heating system
tile
featured
fact
underfloor heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2010/000258
Other languages
French (fr)
Other versions
WO2010092456A3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US13/145,947 priority Critical patent/US20110284647A1/en
Priority to CN2010800077446A priority patent/CN102317693A/en
Priority to EP10737628A priority patent/EP2396599A2/en
Priority to RU2011132404/12A priority patent/RU2011132404A/en
Publication of WO2010092456A2 publication Critical patent/WO2010092456A2/en
Publication of WO2010092456A3 publication Critical patent/WO2010092456A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C11/00—Details of pavings
    • E01C11/24—Methods or arrangements for preventing slipperiness or protecting against influences of the weather
    • E01C11/26—Permanently installed heating or blowing devices ; Mounting thereof
    • E01C11/265—Embedded electrical heating elements ; Mounting thereof
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/44—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose
    • E04C2/52—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits
    • E04C2/521—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling
    • E04C2/525—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling for heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00—Electric heating systems
    • F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
    • F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
    • F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/026—Heaters specially adapted for floor heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00—Integration of renewable energy sources in buildings
    • Y02B10/70—Hybrid systems, e.g. uninterruptible or back-up power supplies integrating renewable energies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the subject of this invention is an underfloor heating system for indoor use (room heating) as well as for outdoor use, with anti-icing and anti-snow functions.
  • the current technique status offers numberless types of heating systems. All the heating systems with their known qualities and faults will be listed below:
  • Diesel fuel systems high fuel cost, average installation costs, big space requirements (tank), polluting combustion, environmental risks for transport, high convenience.
  • -natural gas/LPG systems average fuel cost, average initial investment, limited space requirements (for natural gas only), big space requirements (for LPG only-tank-), low polluting fuel, environmental risks for transport, high convenience.
  • -Pellet systems low fuel cost, average installation costs, space requirements for storage, low emissions but only if in good clean conditions and if good quality pellets are used.
  • -Wood gasification systems low fuel cost, average installation costs, low emissions but only if in good clean conditions, manual feed.
  • Wood-chip systems as for wood gasification systems.
  • -Biomass systems average fuel cost, limited initial investment, no storage requirements, environment-friendly system when the biomass supply is close, average convenience.
  • -Heat pumps with geothermal probes low fuel cost, high initial investment, environment-friendly system for energy production.
  • -Air-to-air heat pumps (conditioners): low initial investment, medium-high electric energy consumption, possible creation of moulds and bacteria, low comfort level.
  • -Electric stoves as for air-to-air heat pumps, with the disadvantage of higher energy consumption.
  • the aim of the present invention is to offer a room heating system with a very low initial investment, zero emissions into the environment, zero ordinary maintenance, zero space for housing the above system, low electric energy consumption-high efficiency, therefore with the possibility of self-holding with the help of photovoltaic panels and, as a consequence, eliminate any expense due to private and non-private heating. Besides, differently from other electric systems, bacterial risks are eliminated as no air is moved. This type of system allows the replacement of an old traditional system with radiators without providing for masonry work for the installation of a new system but simply laying a new floor when laying the heating system.
  • Each thermal cell (IB) includes a resistance (2A) covered with plastic material layers (2B) which are water- and humidity resistant and low-wear.
  • the resistance is supplied by conductive elements (2C).
  • the upper part of the thermal cell (IB) is provided with strong-set adhesive to fully adhere to the rear part of a tile (IA), which becomes a radiator. In this way, the gluing of the cell (IB) to the tile (IA), which acts as a radiator, creates a module; (see figg. l and 3).
  • each thermal cell (IB) is located between the laying glue (4C) of the floor and the ceramic tile (IA). It is now evident that this invention eliminates the use of housings for thermal cells (I B) (big space requirements), frameworks to support the weight due to walking in the materials that physically protect the thermal cell (IB). Between the single cell (IB), containing the resistance (2A), and the room to be heated, only the tile ( IA) is interposed, thus giving a minimum charge loss of the produced heat. The thermal cell (IB), containing the resistance (2A), forms a unique body with the tile (IA) creating the so called module.
  • thermal cell (IB) is shown glued to the back of the tile (I A) in a central portion and in direct contact with the tile lower surface where the so called "mark", which includes the small protrusions on the back of the tiles, is not present. In this way the whole thermal cell
  • - figure 3 shows an upside-down perspective view of an assembled module
  • - figure 4 shows the cross-section of a floor
  • - figure 5 shows a schematic perspective view of the connection diagram of a plurality of modules.
  • the enclosed figures show an underfloor heating system which includes a plurality of modules (fig.5) which, in their turn, include a plurality of thermal cells (IB).
  • the invention concerns: the installation of a thermal cell or electric resistance on a ceramic tile or building element provided with supply cables which allow the modular connection of the same, thus creating a surface with the said cells homogeneously installed, so as to obtain a floor with even temperature.
  • the resistance element is installed between the laying glue and the ceramic tile (in contact with the tile).
  • the system must be for indoor use (room heating) as well as for outdoor use, with anti-icing and anti-snow functions or anything else, even supplied by small photovoltaic panels.
  • the resistance element has no other material to heat than the tile between itself and the room: no other building material of any kind is interposed between the two.

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Engineering & Computer Science (AREA)
  • Floor Finish (AREA)
  • Central Heating Systems (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

An underfloor heating system including some thermal cells provided with an ultrathin heating element located just beneath the floor. The thermal cells are connected as modules when laying the floor. Then they are supplied and handled by a common thermostat (manual or programmable). A floor with even temperature is then obtained, able to transmit radiation heat indoor or outdoor, where installed.

Description

DESCRIPTION
PLANT OF CELLULAR HEATIMG TO FLOOR
******* The subject of this invention is an underfloor heating system for indoor use (room heating) as well as for outdoor use, with anti-icing and anti-snow functions. The current technique status offers numberless types of heating systems. All the heating systems with their known qualities and faults will be listed below:
- Diesel fuel systems: high fuel cost, average installation costs, big space requirements (tank), polluting combustion, environmental risks for transport, high convenience.
-natural gas/LPG systems: average fuel cost, average initial investment, limited space requirements (for natural gas only), big space requirements (for LPG only-tank-), low polluting fuel, environmental risks for transport, high convenience. -Pellet systems: low fuel cost, average installation costs, space requirements for storage, low emissions but only if in good clean conditions and if good quality pellets are used. -Wood gasification systems: low fuel cost, average installation costs, low emissions but only if in good clean conditions, manual feed. - Wood-chip systems: as for wood gasification systems.
-Biomass systems: average fuel cost, limited initial investment, no storage requirements, environment-friendly system when the biomass supply is close, average convenience. -Heat pumps with geothermal probes: low fuel cost, high initial investment, environment-friendly system for energy production.
-Heat pumps with horizontal surface manifolds: low fuel cost, high initial investment, great space requirement, environment-friendly system.
-Air-to-air heat pumps (conditioners): low initial investment, medium-high electric energy consumption, possible creation of moulds and bacteria, low comfort level. -Electric stoves: as for air-to-air heat pumps, with the disadvantage of higher energy consumption.
- Radiant plates: low initial investment, average consumption, excellent comfort.
These are generically the types of systems for room heating. It is only necessary to specify that, among the systems using water to circulate heat, there are basically 2 types of solutions: the low efficient central heating system (with radiators) and the much more efficient underfloor system.
The aim of the present invention is to offer a room heating system with a very low initial investment, zero emissions into the environment, zero ordinary maintenance, zero space for housing the above system, low electric energy consumption-high efficiency, therefore with the possibility of self-holding with the help of photovoltaic panels and, as a consequence, eliminate any expense due to private and non-private heating. Besides, differently from other electric systems, bacterial risks are eliminated as no air is moved. This type of system allows the replacement of an old traditional system with radiators without providing for masonry work for the installation of a new system but simply laying a new floor when laying the heating system.
A key solution of this invention is the use of electrical energy for heating even though consumptions are definitely kept low, as this invention does not heat water (very low thermal conductivity coeff.=0.55) but heats directly the rear side of a tile (fig.l ) with the thermal cell (IB)
(therm.cond.coef. of porcelain stoneware=6) , and at a limited distance from the room to be heated (few millimeters only), that is the tile thickness only, thus obtaining high efficiency and low Kw waste.
Each thermal cell (IB) includes a resistance (2A) covered with plastic material layers (2B) which are water- and humidity resistant and low-wear. The resistance is supplied by conductive elements (2C). The upper part of the thermal cell (IB) is provided with strong-set adhesive to fully adhere to the rear part of a tile (IA), which becomes a radiator. In this way, the gluing of the cell (IB) to the tile (IA), which acts as a radiator, creates a module; (see figg. l and 3).
Connecting the modules during laying by means of supply cables (2C), we obtain an underfloor heating system with cells. Each thermal cell (IB) is located between the laying glue (4C) of the floor and the ceramic tile (IA). It is now evident that this invention eliminates the use of housings for thermal cells (I B) (big space requirements), frameworks to support the weight due to walking in the materials that physically protect the thermal cell (IB). Between the single cell (IB), containing the resistance (2A), and the room to be heated, only the tile ( IA) is interposed, thus giving a minimum charge loss of the produced heat. The thermal cell (IB), containing the resistance (2A), forms a unique body with the tile (IA) creating the so called module.
In fig. 4, the thermal cell (IB) is shown glued to the back of the tile (I A) in a central portion and in direct contact with the tile lower surface where the so called "mark", which includes the small protrusions on the back of the tiles, is not present. In this way the whole thermal cell
(IB), for which the thickness of 0.3 mm (fig.4) is indicated, results in practice "built-in" because it does not protrude beyond the mark height. More features of the invention will be pointed out in the following description in the preferred form, but not the only one to be carried out, shown in the enclosed drawings in which : - figure 1 shows a perspective exploded view of a module; - figure 2 shows a component (thermal cell I B) of the module in figure 1 ;
- figure 3 shows an upside-down perspective view of an assembled module;
- figure 4 shows the cross-section of a floor; - figure 5 shows a schematic perspective view of the connection diagram of a plurality of modules. The enclosed figures show an underfloor heating system which includes a plurality of modules (fig.5) which, in their turn, include a plurality of thermal cells (IB). To summarize, the invention concerns: the installation of a thermal cell or electric resistance on a ceramic tile or building element provided with supply cables which allow the modular connection of the same, thus creating a surface with the said cells homogeneously installed, so as to obtain a floor with even temperature. The resistance element is installed between the laying glue and the ceramic tile (in contact with the tile). The system must be for indoor use (room heating) as well as for outdoor use, with anti-icing and anti-snow functions or anything else, even supplied by small photovoltaic panels.
It is also possible to replace only one single element of the system, in case of failure of a thermal cell, without big restoration work, masonry expenses, etc... It is also possible to alternate the operation in predefined areas, thus saving energy.
The resistance element has no other material to heat than the tile between itself and the room: no other building material of any kind is interposed between the two.
To conclude we wish to point out the remarkable saving: consumed energy costs, installation times, labour costs, masonry costs, costs of materials when using this invention, as the tile is produced with said cell built-in and then already has the cell installed during laying. Said cell is a unique body with the same. As a consequence, when laying the floor, also directly onto an existing floor, without the need for the building operator (layer) to take longer to do his job (connections of the quick connection cell), also the heating system is being installed, thus eliminating the long masonry work and not, as already said, for the installation of a traditional system.

Claims

1. Underfloor heating system featured by the fact of including a plurality of modules which, in their turn, include a plurality of thermal cells (IB), each one provided with a resistance (2A) covered with plastic material layers (2B) which are water- and humidity resistant and low-wear. Said resistance is supplied by conductive elements (2C); the upper part of the cell (IB) is provided with strong-set adhesive to fully adhere to the rear part of a tile (IA), which becomes a radiator. In this way, the gluing of the cell (IB) to the tile (IA), which acts as a radiator, creates a module.
Connection of the modules during laying by means of supply cables, so as to obtain an underfloor heating system with cells.
2. Underfloor heating system as per claim 1 , featured by the fact that each thermal cell (IB) installed between the floor laying glue (4C) and the ceramic tile.
3. Underfloor heating system as per claim 1 , featured by the fact that it is possible to alternate the operation in predefined areas, thus saving energy.
4. Underfloor heating system as per claim 2, featured by the fact that, between the single cell (IB), containing the resistance (2A), and the room to be heated, only the tile (IA) is interposed.
5. Underfloor heating system as per claim 1 , featured by the fact that the thermal cell
(IB), containing the resistance (2A), forms a unique body with the tile (IA) creating the so called module.
6. Underfloor heating system according to claim 1 , featured by the fact that the module thickness (fig.3) does not substantially exceed the tile thickness. 7 Underfloor heating system according to claim 1 , featured by the fact the the object tile and a group of more tiles become a heating system.
PCT/IB2010/000258 2009-02-13 2010-02-11 Plant of cellular heating to floor Ceased WO2010092456A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US13/145,947 US20110284647A1 (en) 2009-02-13 2010-02-11 Plant of cellular heating to floor
CN2010800077446A CN102317693A (en) 2009-02-13 2010-02-11 Floor heating units
EP10737628A EP2396599A2 (en) 2009-02-13 2010-02-11 Plant of cellular heating to floor
RU2011132404/12A RU2011132404A (en) 2009-02-13 2010-02-11 COMPONENT OF ELEMENTS HEATING SYSTEM FOR FLOOR

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMO2009A000034A IT1396655B1 (en) 2009-02-13 2009-02-13 FLOOR CELL HEATING SYSTEM.
ITMO2009A000034 2009-02-13

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/499,061 A-371-Of-International US9598682B2 (en) 2009-09-29 2010-09-29 Hydrolysis of mannose-1-phospho-6-mannose linkage to phospho-6-mannose
US15/350,648 Continuation US10392609B2 (en) 2009-09-29 2016-11-14 Hydrolysis of mannose-1-phospho-6-mannose linkage to phospho-6-mannose

Publications (2)

Publication Number Publication Date
WO2010092456A2 true WO2010092456A2 (en) 2010-08-19
WO2010092456A3 WO2010092456A3 (en) 2011-03-17

Family

ID=41120017

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/000258 Ceased WO2010092456A2 (en) 2009-02-13 2010-02-11 Plant of cellular heating to floor

Country Status (6)

Country Link
US (1) US20110284647A1 (en)
EP (1) EP2396599A2 (en)
CN (1) CN102317693A (en)
IT (1) IT1396655B1 (en)
RU (1) RU2011132404A (en)
WO (1) WO2010092456A2 (en)

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WO2015177390A1 (en) * 2014-05-19 2015-11-26 Martí Fibla Lluc Dynamic heating system

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USD806911S1 (en) * 2015-03-17 2018-01-02 Silcart S.P.A. Floor underlayment
KR101588665B1 (en) * 2015-04-28 2016-01-28 안승한 Concrete structure device having fire fighting function for constructing floor of building and floor construction structure of building comprising the same
CA166722S (en) * 2015-08-04 2017-08-30 Progress Profiles Spa Thermal insulating panel for underfloor heating
CN106125520B (en) * 2016-08-12 2020-04-28 京东方科技集团股份有限公司 Method for pre-baking photoresist using photoresist pre-baking device
CN114857637B (en) * 2022-04-27 2024-02-09 金螳螂精装科技（苏州）有限公司 Floor heating module, floor heating device and transportation method thereof
WO2025227365A1 (en) * 2024-04-30 2025-11-06 杜军 Lightning-protection heating ceramic tile

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Also Published As

Publication number Publication date
WO2010092456A3 (en) 2011-03-17
US20110284647A1 (en) 2011-11-24
IT1396655B1 (en) 2012-12-14
ITMO20090034A1 (en) 2010-08-14
CN102317693A (en) 2012-01-11
RU2011132404A (en) 2013-03-20
EP2396599A2 (en) 2011-12-21

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