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WO2010085949A3 - Substratträger zur halterung von substraten - Google Patents

Substratträger zur halterung von substraten Download PDF

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Publication number
WO2010085949A3
WO2010085949A3 PCT/DE2010/000138 DE2010000138W WO2010085949A3 WO 2010085949 A3 WO2010085949 A3 WO 2010085949A3 DE 2010000138 W DE2010000138 W DE 2010000138W WO 2010085949 A3 WO2010085949 A3 WO 2010085949A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrying frame
substrate receptacle
substrate
mounting substrates
receptacle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2010/000138
Other languages
English (en)
French (fr)
Other versions
WO2010085949A2 (de
Inventor
Mario Prüstel
Stefan Schubert
Hermann Schlemm
Matthias Uhlig
André LUX
Daniel Decker
Silvia Krautwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Roth and Rau AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth and Rau AG filed Critical Roth and Rau AG
Priority to CN201080006252.5A priority Critical patent/CN102859678A/zh
Publication of WO2010085949A2 publication Critical patent/WO2010085949A2/de
Anticipated expiration legal-status Critical
Publication of WO2010085949A3 publication Critical patent/WO2010085949A3/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H10P72/165—
    • H10P72/17—
    • H10P72/7611—
    • H10P72/7616—
    • H10P72/7622—
    • H10P72/1908—
    • H10P72/1921—

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

Die Erfindung betrifft einen Substratträger zur Halterung von Substraten, bestehend aus einem Tragrahmen (1) und mindestens einer Substrataufnahme (2). Der Tragrahmen (1) weist eine selbsttragende und biegesteife Rahmenstruktur aus winklig zueinander angeordneten Längsstegen (6) und Querstegen (7) aus einem bis 800 0C formstabilen Material auf. Die Substrataufnahme (2) liegt auf dem Tragrahmen (1) auf und ist plattenartig derart ausgebildet, dass die Solarzellenwafer (5) auf der Oberseite der Substrataufnahme (2) positioniert werden können. Zwischen dem Tragrahmen (1) und der Substrataufnahme (2) sind thermische Isolierelemente (9) vorhanden. Die Elemente des Tragrahmens (1) und die Substrataufnahme (2) bestehen aus Stahl, Titan, Aluminium, Keramik, CFC (CFC = Carbon Fiber reinforced Carbon) oder daraus hergestellten Verbundwerkstoffen.
PCT/DE2010/000138 2009-01-31 2010-01-31 Substratträger zur halterung von substraten Ceased WO2010085949A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201080006252.5A CN102859678A (zh) 2009-01-31 2010-01-31 用于保持基板的基板载体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009006779 2009-01-31
DE102009006779.5 2009-01-31

Publications (2)

Publication Number Publication Date
WO2010085949A2 WO2010085949A2 (de) 2010-08-05
WO2010085949A3 true WO2010085949A3 (de) 2013-03-21

Family

ID=40719730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2010/000138 Ceased WO2010085949A2 (de) 2009-01-31 2010-01-31 Substratträger zur halterung von substraten

Country Status (4)

Country Link
CN (1) CN102859678A (de)
DE (1) DE202009001817U1 (de)
TW (1) TW201036101A (de)
WO (1) WO2010085949A2 (de)

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Publication number Priority date Publication date Assignee Title
MY160057A (en) 2009-12-11 2017-02-15 Kgt Graphit Tech Gmbh Substrate support
DE102011017566A1 (de) 2010-04-22 2011-12-01 Von Ardenne Anlagentechnik Gmbh Substratbehandlungsanlage und Substrathalter dafür
US9214576B2 (en) 2010-06-09 2015-12-15 Solarcity Corporation Transparent conducting oxide for photovoltaic devices
JP5901110B2 (ja) * 2010-10-06 2016-04-06 三木ポリマー株式会社 面実装電子部品の搬送用トレー
US9800053B2 (en) 2010-10-08 2017-10-24 Tesla, Inc. Solar panels with integrated cell-level MPPT devices
DE102010052689A1 (de) * 2010-11-26 2012-05-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Substrathalter für die Oberflächenbehandlung von Substraten und Verwendung des Substrathalters
DE102011006833A1 (de) 2011-04-06 2012-10-11 Roth & Rau Ag Substratträger
US9054256B2 (en) 2011-06-02 2015-06-09 Solarcity Corporation Tunneling-junction solar cell with copper grid for concentrated photovoltaic application
CN102412108B (zh) * 2011-10-31 2013-11-27 无锡绿波新能源设备有限公司 高吸附拼接式碳纤维u型槽
CN104781936A (zh) 2012-10-04 2015-07-15 喜瑞能源公司 具有电镀的金属格栅的光伏器件
US9865754B2 (en) 2012-10-10 2018-01-09 Tesla, Inc. Hole collectors for silicon photovoltaic cells
US9281436B2 (en) 2012-12-28 2016-03-08 Solarcity Corporation Radio-frequency sputtering system with rotary target for fabricating solar cells
WO2014110520A1 (en) 2013-01-11 2014-07-17 Silevo, Inc. Module fabrication of solar cells with low resistivity electrodes
US10074755B2 (en) 2013-01-11 2018-09-11 Tesla, Inc. High efficiency solar panel
US9624595B2 (en) 2013-05-24 2017-04-18 Solarcity Corporation Electroplating apparatus with improved throughput
DE102013217441B4 (de) 2013-09-02 2019-11-28 Singulus Technologies Ag Substratträger
US10309012B2 (en) 2014-07-03 2019-06-04 Tesla, Inc. Wafer carrier for reducing contamination from carbon particles and outgassing
CN107210252B (zh) * 2014-11-26 2021-05-25 冯·阿登纳资产股份有限公司 基板保持装置、基板运送装置、处理布置和用于处理基板的方法
DE102015110854A1 (de) * 2015-07-06 2017-01-12 Von Ardenne Gmbh Verfahren, Substrathaltevorrichtung und Prozessieranordnung
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
CN104726839B (zh) 2015-03-27 2017-06-16 京东方科技集团股份有限公司 基板固定装置
WO2016162071A1 (en) * 2015-04-09 2016-10-13 Applied Materials, Inc. Carrier system for substrates to be processed
CN108138314A (zh) * 2015-09-21 2018-06-08 应用材料公司 基板载体、以及溅射沉积设备和其使用方法
US9761744B2 (en) 2015-10-22 2017-09-12 Tesla, Inc. System and method for manufacturing photovoltaic structures with a metal seed layer
US9842956B2 (en) 2015-12-21 2017-12-12 Tesla, Inc. System and method for mass-production of high-efficiency photovoltaic structures
DE102016111234B4 (de) * 2016-06-20 2018-01-25 Heraeus Noblelight Gmbh Vorrichtung für die thermische Behandlung eines Substrats sowie Trägerhorde und Substrat-Trägerelement dafür
DE102018101439B4 (de) * 2018-01-23 2020-01-09 RF360 Europe GmbH Substratträger für einen Reflow-Ofen und Verwendung eines Substratträgers
US11190128B2 (en) 2018-02-27 2021-11-30 Tesla, Inc. Parallel-connected solar roof tile modules
CN112368412A (zh) * 2018-06-25 2021-02-12 应用材料公司 用于基板的载体及用于承载基板的方法
CN110190018B (zh) * 2019-07-01 2024-08-20 南通玖方新材料股份有限公司 一种拼接式的硅片承载框
CN111739971B (zh) * 2020-08-03 2021-02-19 苏州迈正科技有限公司 镀膜设备、方法、系统及太阳能电池、组件、发电系统
CN112224641B (zh) * 2020-09-18 2025-06-13 上海宏端精密机械有限公司 一种用于太阳能板加工的载板
CN113328010A (zh) * 2021-05-28 2021-08-31 安徽华晟新能源科技有限公司 一种太阳能电池的制备方法
DE102021003330B3 (de) 2021-06-28 2022-09-01 Singulus Technologies Aktiengesellschaft Substratträger
CN114774888B (zh) * 2021-09-30 2024-02-23 苏州迈为科技股份有限公司 Pecvd镀膜载板及镀膜设备
CN118028755A (zh) * 2024-02-07 2024-05-14 苏州迈为科技股份有限公司 一种载板装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012924A (en) * 1990-03-19 1991-05-07 R. H. Murphy Company, Inc. Carriers for integrated circuits and the like
EP0673193A1 (de) * 1994-03-14 1995-09-20 Minnesota Mining And Manufacturing Company Lagerungsvorrichtung für komponente mit abnehmbaren Einsatzteilen
WO1999003130A1 (en) * 1997-07-10 1999-01-21 Kinetrix, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
US5927503A (en) * 1995-03-28 1999-07-27 Micron Technology, Inc. Tray for processing and/or shipping integrated circuit device
US20020066694A1 (en) * 2000-12-01 2002-06-06 Soh Swee Chuan Tray for storing semiconductor chips
WO2004033103A2 (en) * 2002-10-09 2004-04-22 Entegris, Inc. High temperature, high strength, colorable materials for device processing systems
JP2007042908A (ja) * 2005-08-04 2007-02-15 Sumitomo Electric Ind Ltd ウェハ保持体およびそれを搭載したウェハプローバ

Family Cites Families (2)

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Publication number Priority date Publication date Assignee Title
US6227372B1 (en) 1998-04-30 2001-05-08 Peak International, Inc. Component carrier tray for high-temperature applications
US20060006095A1 (en) 2004-07-08 2006-01-12 White Robert J Jr Universal storage tray for electronic components

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012924A (en) * 1990-03-19 1991-05-07 R. H. Murphy Company, Inc. Carriers for integrated circuits and the like
EP0673193A1 (de) * 1994-03-14 1995-09-20 Minnesota Mining And Manufacturing Company Lagerungsvorrichtung für komponente mit abnehmbaren Einsatzteilen
US5927503A (en) * 1995-03-28 1999-07-27 Micron Technology, Inc. Tray for processing and/or shipping integrated circuit device
WO1999003130A1 (en) * 1997-07-10 1999-01-21 Kinetrix, Inc. Heat-transfer enhancing features for semiconductor carriers and devices
US20020066694A1 (en) * 2000-12-01 2002-06-06 Soh Swee Chuan Tray for storing semiconductor chips
WO2004033103A2 (en) * 2002-10-09 2004-04-22 Entegris, Inc. High temperature, high strength, colorable materials for device processing systems
JP2007042908A (ja) * 2005-08-04 2007-02-15 Sumitomo Electric Ind Ltd ウェハ保持体およびそれを搭載したウェハプローバ

Also Published As

Publication number Publication date
WO2010085949A2 (de) 2010-08-05
DE202009001817U1 (de) 2009-06-04
TW201036101A (en) 2010-10-01
CN102859678A (zh) 2013-01-02

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