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WO2010082755A3 - Evaporation apparatus, thin film depositing apparatus and method for feeding source material of the same - Google Patents

Evaporation apparatus, thin film depositing apparatus and method for feeding source material of the same Download PDF

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Publication number
WO2010082755A3
WO2010082755A3 PCT/KR2010/000203 KR2010000203W WO2010082755A3 WO 2010082755 A3 WO2010082755 A3 WO 2010082755A3 KR 2010000203 W KR2010000203 W KR 2010000203W WO 2010082755 A3 WO2010082755 A3 WO 2010082755A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
source material
thin film
evaporation
film depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/000203
Other languages
French (fr)
Other versions
WO2010082755A2 (en
Inventor
Hyung Seok Yoon
Sung Kwan Son
Chang Ho Kang
Hyun Goo Kwon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SNU Precision Co Ltd
Original Assignee
SNU Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SNU Precision Co Ltd filed Critical SNU Precision Co Ltd
Priority to CN201080004944.6A priority Critical patent/CN102282648B/en
Publication of WO2010082755A2 publication Critical patent/WO2010082755A2/en
Publication of WO2010082755A3 publication Critical patent/WO2010082755A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Provided are an evaporation apparatus and a thin film depositing apparatus, and a source material filling method thereof. The thin film depositing apparatus includes a chamber having an inner space, a substrate transferring member to fix a substrate and move the substrate within the inner space, and a plurality of evaporation members to supply a deposition source material to the substrate, wherein each of the evaporation members is disposed to allow its central extension line to form an acute angle with a surface of the substrate that moves. Therefore, it is possible to form a thin film on the substrate by supplying the vaporized source material to the substrate in a sloped direction with respect to the substrate through the use of the plurality of evaporation members, and to fill the source material by selectively control only an evaporation member where the source material is exhausted without shutting down the whole apparatus.
PCT/KR2010/000203 2009-01-16 2010-01-13 Evaporation apparatus, thin film depositing apparatus and method for feeding source material of the same Ceased WO2010082755A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201080004944.6A CN102282648B (en) 2009-01-16 2010-01-13 Evaporation device, thin film deposition device and method for supplying raw materials to the device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0003569 2009-01-16
KR1020090003569A KR101068597B1 (en) 2009-01-16 2009-01-16 Evaporation apparatus and thin film deposition apparatus and its raw material providing method

Publications (2)

Publication Number Publication Date
WO2010082755A2 WO2010082755A2 (en) 2010-07-22
WO2010082755A3 true WO2010082755A3 (en) 2010-10-14

Family

ID=42340198

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000203 Ceased WO2010082755A2 (en) 2009-01-16 2010-01-13 Evaporation apparatus, thin film depositing apparatus and method for feeding source material of the same

Country Status (4)

Country Link
KR (1) KR101068597B1 (en)
CN (1) CN102282648B (en)
TW (1) TWI437111B (en)
WO (1) WO2010082755A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013042247A1 (en) * 2011-09-22 2013-03-28 株式会社シンクロン Thin film forming device
US9150954B2 (en) 2011-10-28 2015-10-06 Lg Display Co., Ltd. Light-emitting diode and deposition apparatus for fabricating the same
KR101938365B1 (en) 2012-07-31 2019-04-12 삼성디스플레이 주식회사 Depositing apparatus and method for measuring deposition quantity using the same
KR101469091B1 (en) * 2012-12-28 2014-12-04 엘아이지에이디피 주식회사 Equipment for depositing organic material
KR101479231B1 (en) * 2012-12-28 2015-01-05 엘아이지에이디피 주식회사 Tray assembly and equipment for depositing organic material
KR20150101897A (en) * 2014-02-27 2015-09-04 (주)브이앤아이솔루션 Linear source for OLED deposition apparatus
CN104073764B (en) * 2014-06-17 2016-05-18 京东方科技集团股份有限公司 A kind of rotary evaporation source apparatus for OLED evaporation
WO2017069369A1 (en) * 2015-10-23 2017-04-27 주식회사 파인에바 Linear evaporation deposition apparatus
CN111334756B (en) * 2020-04-09 2021-12-03 深圳市华星光电半导体显示技术有限公司 Metal evaporation equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050053448A (en) * 2003-12-02 2005-06-08 삼성에스디아이 주식회사 Equipments for forming layers in vacuum condition
KR100517141B1 (en) * 2003-11-27 2005-09-26 주식회사 야스 Inclined nozzle type evaporating source of evaporating direction -controllable and the method utilizing the source
KR20070097633A (en) * 2006-03-28 2007-10-05 문대규 Deposition equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4252317B2 (en) * 2003-01-10 2009-04-08 株式会社半導体エネルギー研究所 Vapor deposition apparatus and vapor deposition method
JP4789551B2 (en) * 2005-09-06 2011-10-12 株式会社半導体エネルギー研究所 Organic EL film forming equipment
KR100762683B1 (en) * 2006-05-11 2007-10-01 삼성에스디아이 주식회사 Organic vapor deposition source and organic vapor deposition apparatus including the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100517141B1 (en) * 2003-11-27 2005-09-26 주식회사 야스 Inclined nozzle type evaporating source of evaporating direction -controllable and the method utilizing the source
KR20050053448A (en) * 2003-12-02 2005-06-08 삼성에스디아이 주식회사 Equipments for forming layers in vacuum condition
KR20070097633A (en) * 2006-03-28 2007-10-05 문대규 Deposition equipment

Also Published As

Publication number Publication date
WO2010082755A2 (en) 2010-07-22
CN102282648A (en) 2011-12-14
CN102282648B (en) 2013-09-18
KR101068597B1 (en) 2011-09-30
TW201030164A (en) 2010-08-16
KR20100084217A (en) 2010-07-26
TWI437111B (en) 2014-05-11

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